Imaging systems and electronic equipment

Abstract

The present application discloses an imaging system and an electronic device. The imaging system includes an imaging module, a fill light component, a phase mask plate and a driver. The fill light component is provided with a through hole and is arranged on the object side of the imaging module. The through hole corresponds to the light inlet of the imaging module. The phase mask plate is arranged on the side of the fill light component away from the imaging module. The driver is installed on the fill light component and connected to the phase mask plate, and the driver is used to drive the phase mask plate to move so that the phase mask plate selectively blocks or opens the through hole. The imaging system and electronic device of the present application are provided with a phase mask plate, and the phase mask plate is driven to move by the driver so that the phase mask plate selectively blocks or opens the through hole, so that the light entering the imaging module can be phase-encoded by the phase mask plate, thereby enabling the imaging module to perform depth of field extension wavefront coded imaging on the object being photographed, which can greatly increase the depth of field of the imaging system.

Description

Technical Field

[0001] The present application relates to optical imaging technology, and in particular to an imaging system and electronic equipment. Background Art

[0002] In recent years, with the continuous development of mobile phone lenses, users want their phones to have more and more functions. For example, users want their phones to have a microscopic function, that is, they want their phone lenses to be able to take ultra-macro shots. However, since the focusing lens of the lens is relatively short, usually a few millimeters, the depth of field will be very shallow, and the hands must not shake when taking pictures, which is not conducive to daily use. Summary of the invention

[0003] Embodiments of the present application provide an imaging system and an electronic device.

[0004] The imaging system of the embodiment of the present application includes an imaging module, a fill light component, a phase mask plate and a driving member. The fill light component is provided with a through hole and is arranged on the object side of the imaging module. The through hole corresponds to the light inlet of the imaging module. The phase mask plate is arranged on the side of the fill light component away from the imaging module. The driving member is installed on the fill light component and connected to the phase mask plate, and the driving member is used to drive the phase mask plate to move so that the phase mask plate selectively blocks or opens the through hole.

[0005] The electronic device implemented in the embodiment of the present application includes a housing and an imaging system. The imaging system includes an imaging module, a fill light component, a phase mask plate and a driver. The fill light component is provided with a through hole and is arranged on the object side of the imaging module. The through hole corresponds to the light entrance of the imaging module. The phase mask plate is arranged on the side of the fill light component away from the imaging module. The driver is installed on the fill light component and connected to the phase mask plate, and the driver is used to drive the phase mask plate to move so that the phase mask plate selectively blocks or opens the through hole. The imaging system is combined with the housing.

[0006] The imaging system and electronic device of the present application are provided with a phase mask plate, and a driving member is used to drive the phase mask plate to move, so that the phase mask plate selectively blocks or opens a through hole, so that the light entering the imaging module can be phase-encoded by the phase mask plate, so that the imaging module can perform depth-of-field extension wavefront coding imaging on the object being photographed, which can greatly increase the depth of field of the imaging system.

[0007] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0009] Figure 1 is a three-dimensional assembly schematic diagram of an imaging system according to an embodiment of the present application;

[0010] Figure 2 yes Figure 1 A three-dimensional exploded schematic diagram of the imaging system shown;

[0011] Figure 3 yes Figure 2 A schematic diagram of the structure of a phase mask in an imaging system shown;

[0012] Figure 4 is a schematic diagram of a phase plane of a phase mask plate according to some embodiments of the present application from one viewing angle;

[0013] Figure 5 is a schematic diagram of another viewing angle of a phase plane of certain embodiments of the present application;

[0014] Figure 6 is a schematic diagram of phase distribution of a cross section of a phase mask in certain embodiments of the present application;

[0015] Figures 7 to 9 is a schematic diagram of another viewing angle of a phase plane of certain embodiments of the present application;

[0016] Fig.10 yes Figure 1 A schematic diagram of a usage state of the imaging system shown;

[0017] Fig.11 It is a traditional lens and adopts Fig.10 A schematic diagram of an image obtained by the imaging system shown;

[0018] Fig.12 yes Figure 1 A schematic diagram of another usage state of the imaging system shown;

[0019] Fig.13 It is a schematic diagram of the structure of an electronic device of certain embodiments of the present application.

[0020] Description of main component symbols:

[0021] Electronic equipment 1000;

[0022] Imaging system 100, imaging module 10, light entrance 11, fill light assembly 30, light source 31, light guide element 33, through hole 330, light entrance surface 331, light exit surface 333, phase mask 50, lens 51, microstructure layer 53, phase surface 55, first area 551, first sub-area 5511, second sub-area 5512, driving member 70, magnet 71, coil 73, connecting rod 80, cover glass 90;

[0023] Shell 200. DETAILED DESCRIPTION

[0024] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of the present application, and cannot be understood as limiting the embodiments of the present application.

[0025] In recent years, with the continuous development of mobile phone lenses, users want their mobile phones to have more and more functions. For example, users want their mobile phones to have a microscopic function, that is, they want their mobile phone lenses to be able to shoot images at ultra-macro distances. However, due to the short focusing distance of current mobile phone lenses, which is usually a few millimeters, the depth of field is very shallow, and the hand must not shake when taking pictures, which is not conducive to daily use. In order to solve the above technical problems, the present application provides an imaging system 100 ( Figure 1 ) and an electronic device 1000 ( Fig.13 shown).

[0026] See also Figure 1 and Figure 2 The imaging system 100 includes an imaging module 10, a fill light component 30, a phase mask plate 50 and a driving member 70. The fill light component 30 is provided with a through hole 330 and is arranged on the object side of the imaging module 10. The through hole 330 corresponds to the light inlet 11 of the imaging module 10. The phase mask plate 50 is arranged on the side of the fill light component 30 away from the imaging module 10. The driving member 70 is installed on the fill light component 30 and connected to the phase mask plate 50. The driving member 70 is used to drive the phase mask plate 50 to move so that the phase mask plate 50 selectively blocks or opens the through hole 330.

[0027] The imaging system 100 of the present application sets a phase mask plate 50 and uses a driving member 70 to drive the phase mask plate 50 to move, so that the phase mask plate 50 selectively blocks or opens the through hole 330, so that the light entering the imaging module 10 can be phase-encoded by the phase mask plate 50, and then the imaging module 10 can perform depth-of-field extension wavefront coding imaging on the object, which can not only greatly increase the depth of field of the imaging system 100, but also correct the defocus aberration caused by installation errors and temperature changes, so as to improve the imaging performance.

[0028] See also Figure 2 , wherein the imaging module 10 can be any lens, especially a lens with a small depth of field, such as a wide-angle lens, a microscope lens, etc., and the present application does not make any limitation thereto.

[0029] Please continue reading Figure 2 The fill light component 30 is arranged on the object side of the imaging module 10. In other words, when the imaging system 100 captures an image of a scene, the light reflected by the scene first passes through the fill light component 30, and then enters the imaging module 10 to form an image. Specifically, the fill light component 30 includes a light source 31 and a light guide element 33. The light source 31 is used to emit light. The light guide element 33 includes a light incident surface 331 and a light emitting surface 333. The light emitted from the light source 31 enters the interior of the light guide element 33 through the light incident surface 331, and is emitted from the light emitting surface 333. The light incident surface 331 and the light emitting surface 333 have different directions.

[0030] More specifically, see also Figure 2 The specific structure of the light guide element 33 is not limited. In the present embodiment, the light guide element 33 is an annular structure. The light guide element 33 may include a light guide portion 335 and a light input portion 337. The light guide portion 335 is arranged on the outer peripheral side of the object side end of the imaging module 10, and the light input portion 337 is arranged on the outer peripheral side of the light guide portion 335. The light guide portion 335 and the light input portion 337 may be integrally formed, or they may be separately formed and then combined together. A through hole 330 is provided in the middle of the light guide element 33, and the through hole 330 passes through the light guide element 33 along the optical axis OO1 direction. That is, a through hole 330 is provided in the middle of the light guide portion 335.

[0031] The light incident surface 331 is provided at the light incident portion 337, and the light exit surface 333 is provided at the light guiding portion 335. The angle between the light incident surface 331 and the axial direction of the light guiding element 33 is between 0 degrees and 90 degrees, that is, the light incident surface 331 is parallel to or intersects with the axial direction of the light guiding element 33. Optionally, the light incident surface 331 is parallel to the axial direction or has a small angle with the axial direction, and the angle is less than 90 degrees, that is, the light incident surface 331 is not perpendicular to the direction of the optical axis OO1.

[0032] The light emitting direction of the light emitting surface 333 intersects the light incident direction of the light incident surface 331. In this embodiment, the light emitting direction of the light emitting surface 333 is consistent with the optical axis OO1 of the imaging module 10; or, the light emitting direction of the light emitting surface 333 is perpendicular to the light incident direction of the light incident surface 331.

[0033] It should be noted that the peripheral side of the imaging module 10 refers to the side of the imaging module 10 around the optical axis OO1 direction, and the light guide element 33 surrounds the side of the imaging module 10 around the optical axis OO1 direction. The object side end of the imaging module 10 can be set in the through hole 330. Among them, the end of the imaging module 10 facing the target object to be photographed is the object side end, and the direction of the optical axis toward the object side end is the positive direction of the optical axis. The light guide element 33 is arranged around the object side end of the imaging module 10 so that the light transmitted by the light guide element 33 is irradiated on the camera area of ​​the imaging module 10.

[0034] The light emitted by the light source 31 enters the light entrance portion 337 from the light entrance surface 331, is then conducted through the inside of the light guide portion 335, and is emitted through the light exit surface 333, and the light exit surface 333 faces the object side of the imaging module 10. Optionally, the light exit surface 333 can be, but is not limited to, a ring shape, etc. It should be noted that the object side of the present application is the side where the target object is photographed by the imaging system 100 when in use, and the image side of the present application is the side where the imaging is imaged when the imaging system 100 is photographing. The light source 31 is located on the peripheral side of the light guide element 33. In one embodiment, the axial direction of the light guide element 33 is collinear with the optical axis direction of the imaging module 10, and the peripheral side of the light guide element 33 is the outer side of the light guide element 33 around the optical axis OO1 direction.

[0035] The number of light sources 31 is at least one. When the number of light sources 31 is multiple, the multiple light sources 31 are arranged at intervals around the optical axis OO1 on the outer peripheral side of the light guide element 33. Preferably, the multiple light sources 31 are evenly spaced around the optical axis OO1 on the outer peripheral side of the light guide element 33.

[0036] Generally, the light source is directed toward the bottom surface of the light guide element (the surface away from the light emitting surface), and the fill light beam enters the light guide element from the bottom surface and is emitted from the top surface of the light guide element. The light guide element usually has a certain light transmittance. After the light source is turned on, the top surface of the light guide element is very bright at the location of the light source, and the brightness of the top surface of the light guide element far from the light source drops sharply. Therefore, the appearance brightness uniformity of the top surface of the light guide element is poor, and the fill light uniformity of the camera area is also poor. Since the light guide element has a certain degree of transparency, the user can also see the light-emitting lamp located on the bottom side of the light guide element through the light guide element, resulting in a problem of light explosion.

[0037] The imaging system 100 in the embodiment of the present application sets the light incident direction of the light guide element 33 to intersect with the light emitting direction of the light guide element 33. Therefore, the light emitted by the light source 31 enters the light guide element 33 from the light incident surface 331 of the light guide element 33, and is not emitted directly toward the light emitting surface 333. Instead, the light is scattered and / or reflected and diffused multiple times in the light guide element 33 to form a uniform and soft surface light, and then emitted from the light emitting surface 333 to the camera area of ​​the imaging module 10. The light can illuminate the object in the camera area, thereby increasing the brightness of the object and achieving fill light; it can also avoid the light from being emitted from a local concentrated area of ​​the light emitting surface 333, further making the appearance of the light emitting surface 333 after being lit have better uniformity, avoiding the problem of uneven light and dark distribution and bursting of the light after the light emitting surface 333 is lit, and achieving sufficient and uniform illumination of the camera module 100 when taking colors.

[0038] See also Figure 3 The phase mask 50 includes a lens 51 and a microstructure layer 53, wherein the microstructure layer 53 is located on one side of the lens 51 to form a phase plane 55. The lens 51 may be in the form of a plane, a spherical surface, an aspherical surface, or a free-form surface, which is determined according to the actual design requirements of the imaging system 100. Specifically, the side of the lens 51 close to the phase plane 55 may be a plane or a gentle arc surface, which is more conducive to manufacturing and production, and the side away from the phase plane 55 may be a plane, a spherical surface, or an aspherical surface.

[0039] The thickness of the lens 51 is in the millimeter level, and the value range is 0.15mm-1.50mm. For example, the thickness of the lens 51 is 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.20mm, 0.22mm, 0.25mm, 0.30mm, 0.35mm, 0.40mm, 0.50mm, 0.60mm, 0.70mm, 0.80mm, 0.90mm, 1.15mm, 1.21mm, 1.30mm, 1.40mm, or 1.50mm. The thickness of the microstructure layer 53 is in the micrometer level, and the value range is 2um-20um. For example, the thickness of the microstructure layer 53 is 2um, 3um, 4um, 5um, 6um, 7um, 8um, 9um, 10um, 11um, 12um, 13um, 14um, 15um, 16um, 17um, 18um, 19um, or 20um, etc. The lens 51 may be made of glass or resin.

[0040] More specifically, see Figure 4 and Figure 5, the phase plane 55 includes a first region 551. The first region 551 is circular and located at the center O of the phase plane 55. The first region 551 includes adjacent first sub-region 5511 and second sub-region 5512. Among them, in the direction from the center of the first region 551 to the edge of the first region 551, the phase of each point on the first sub-region 5511 gradually increases, and the phase of each point on the second sub-region 5512 gradually decreases. For example, assume that point A and point B are located on the first sub-region 5511, point C and point D are located on the second sub-region 5512, and point A is closer to the center of the first region 551 than point B, and point C is closer to the center of the first region 551 than point D. Then, the phase at point A is less than the phase at point B, and the phase at point C is greater than the phase at point D.

[0041] The phase mask 50 of the present application designs the phase distribution of each point on the phase plane 55 so that in the direction from the center of the first region 551 of the phase plane 55 to the edge of the first region 551, the phase of each point on the first sub-region 5511 of the first region 551 gradually increases, and the phase of each point on the second sub-region 5512 of the first region 551 gradually decreases. In this way, the depth of field of the imaging system 100 (such as Figure 1 shown) using this design can be improved, thereby reducing the difficulty of the electronic device 1000 (such as Fig.13 shown) to achieve the microscopic function.

[0042] It should be noted that the phase mask 50 can be disposed between the object to be photographed and the imaging surface. When the object passes through the optical system 100 with the phase mask 50, an intermediate blurred image can be formed on the image surface, and it is ensured that the blurred degree of the images formed within the large depth of field range is consistent. Then, using the characteristic of the consistent intermediate blurred degree, various algorithms such as the frequency domain or the spatial domain are used to perform image restoration on them, so as to obtain the final clear image.

[0043] Please refer to Figures 3 to 5 , in some embodiments, the phase distribution of the phase plane 55 satisfies z = a * x 3 + b * x 2 y + c * xy 2 + d * y 3 , where a, b, c, and d represent preset parameters, x represents the coordinate on the X-axis of the phase plane 55, y represents the coordinate on the Y-axis of the phase plane 55, z represents the phase of the point with coordinates (x, y), and 0.01 < a < 0.15, 0.01 < b < 0.15, 0.01 < c < 0.15, 0.01 < d < 0.15. In this way, the depth of field of the imaging system 100 (such as Figure 1 shown) using this design can be improved.

[0044] It should be noted that in some embodiments, the center of the phase surface 55 is taken as the coordinate origin, the first direction is taken as the X-axis, the second direction is taken as the Y-axis, and the third direction is taken as the Z-axis, and the first direction, the second direction, and the third direction are all perpendicular to each other. z represents the phase of the point with coordinates (x, y), that is, the sag of the surface parallel to the z-axis direction at that place. In the following text, the X-axis and the Y-axis are also interpreted in this way and will not be elaborated further.

[0045] In addition, in some embodiments, the values of the preset parameters a, b, c, and d can be exactly the same. For example, a = b = c = d = 0.02; or, in some embodiments, the values of the preset parameters a, b, c, and d can be not exactly the same. For example, a = d = 0.045, c = 0.02, d = 0.03; or, in some embodiments, the values of the preset parameters a, b, c, and d can be completely different. For example, a = 0.045, c = 0.02, d = 0.03, d = 0.04. There are no restrictions here. As long as the values of the preset parameters a, b, c, and d all satisfy being less than 0.15 and greater than 0.01.

[0046] Please refer to Figures 3 to 5 , in some embodiments, the phase distribution of the phase surface 55 satisfies z = a * x 3 + b * x 2 y + c * xy 2 + d * y 3 , where a, b, c, and d represent preset parameters, x represents the coordinate on the X-axis of the phase surface 55, y represents the coordinate on the Y-axis of the phase surface 55, z represents the phase of the point with coordinates (x, y), and 0.01 < a = d < 0.15, b = c = 0. In this way, the depth of field of the imaging system 100 (such as Figure 1 shown) adopting this design can be improved.

[0047] In some embodiments, the phase surface 55 is a surface type that is symmetric about the X-axis and the Y-axis. Exemplarily, as Figure 6 shown, Figure 6 is a schematic diagram of the phase distribution of the first cross-section of the phase surface 55 when the preset parameter a and the preset parameter d are equal. Among them, the Y-axis coordinates of the points in the first cross-section are the same. For example, the first cross-section can be the cross-section obtained by cutting the phase surface 55 along the Figure 4 described dotted line. Figure 6 The abscissa in

[0048] Please refer to Figure 5In some embodiments, the phase plane 55 further includes a second area 552, and the second area 552 surrounds the first area 551. The phase plane 55 further includes a positioning area 553, and the positioning area 553 is located between the first area 551 and the second area 552, and is used to calibrate the position of the first area 551. Specifically, the phase of each point in the positioning area 553 is less than the first threshold, the phase of each point in the first area 551 and the second area 552 is greater than the second threshold, and the first threshold is less than the second threshold.

[0049] It should be noted that the extended depth of field is strongly dependent on the accuracy and surface shape of the phase mask 50. If the surface shape or accuracy deviates, resulting in a change in the point spread function of the extended depth of field, the previously established correspondence is no longer applicable, resulting in a decrease in image quality. Figure 1 In the process of assembling the imaging system 100 (as shown in the figure), the first area 551 of the phase mask plate 50 needs to correspond to the center of the image sensor (not shown) in the imaging module 10, so as to ensure the image quality when the phase mask plate 50 is used. Therefore, in the process of assembling the imaging system 100, the assembly machine needs to be able to accurately identify the center of the phase plane 55, that is, it needs to be able to accurately identify the first area 551 of the phase plane 55. Since in this embodiment, the positioning area 553 is located between the first area 551 and the second area 552, and the phase of each point in the positioning area 553 is less than the first threshold, the phase of each point in the first area 551 and the second area 552 is greater than the second threshold, and the first threshold is less than the second threshold. In this way, the phase of each point in the positioning area 553 is less than the phase of each point in the first area 551 and the second area 552, that is, the phase of the positioning area 553 is less than the phase of the two sides thereof, so that the positioning area 553 can be accurately identified, and the position of the first area 551 is determined by the positioning area 553. For example, during the process of assembling the imaging system 100 , the assembly machine only needs to recognize that the phase of a certain area is smaller than the phases of the areas on both sides thereof to determine that the area is the positioning area 553 , and then determine the first area 551 based on the positioning area 553 .

[0050] Furthermore, in some embodiments, the difference between the first threshold and the second threshold is greater than the first preset difference, so that the first threshold is much smaller than the second threshold. In this way, the difference between the phase of each point in the positioning area 553 and the phase of each point in the non-positioning area 553 can be increased, which is conducive to quickly identifying the positioning area 553 during the assembly of the imaging system 100.

[0051] In addition, in some embodiments, the positioning area 553 can completely separate the first area 551 and the second area 552, for example, Figure 7 As shown, Figure 7The circle at the center of the phase plane 55 is the first area 551, the ring surrounding the first area 551 is the positioning area 553, and the rest is the second area 552. Of course, in some embodiments, the positioning area 553 may also only separate part of the first area 551 and the second area 552, for example, Figure 5 As shown, Figure 5 The circle at the center of the image is the first area 551, the 3 / 4 ring surrounding the first area 551 is the positioning area 553, and the rest is the second area 552. The present application does not limit whether the positioning area 553 can completely separate the first area 551 and the second area 552, nor does it limit the size of the positioning area 553. It only needs to be able to determine the first area 551 through the positioning area 553.

[0052] See also Figure 8 and Fig. 9 In some embodiments, the second area 552 includes a calibration area 5521, and the calibration area 5521 is used to mark the X-axis and / or the Y-axis of the phase plane 55. In the second area 552, the phase of each point in the calibration area 5521 is smaller than the phase of each point outside the calibration area 5521. For example, assuming that point E and point F are both points in the second area 552, point E is located in the calibration area 5521, and point F is located outside the calibration area 5521, then the phase at point E is smaller than the phase at point F.

[0053] It should be noted that the X-axis includes an X-positive semi-axis and an X-negative semi-axis extending from the coordinate origin to opposite sides, and the Y-axis includes a Y-positive semi-axis and a Y-negative semi-axis extending from the coordinate origin to opposite sides. In the process of assembling the imaging system 100, the X-axis and the Y-axis of the phase plane 55 need to correspond to the X-axis and the Y-axis on the image sensor, so that the imaging system 100 can achieve a better depth of field effect. In this embodiment, since a calibration area 5521 with a smaller phase is provided on the X-axis and / or the Y-axis of the phase plane 55, the X-axis and the Y-axis of the phase plane 55 can be determined by identifying the calibration area 5521, which is conducive to reducing the difficulty of assembling the imaging system 100.

[0054] In some embodiments, the second region 552 includes a calibration area 5521, and the calibration area 5521 is used to calibrate the X-axis of the phase plane 55. For example, Fig. 9 As shown, the second area 552 includes a calibration area 5521, and the center of the calibration area 5521 is located at the positive X semi-axis of the phase plane 55. In this way, the positive X semi-axis can be determined according to the center of the calibration area 5521 and the center of the phase plane 55, and then the positive X semi-axis can be rotated counterclockwise by 90°, 180° and 270° respectively to determine the negative Y semi-axis, the negative X semi-axis and the positive Y semi-axis of the phase plane 55. Of course, in some embodiments, the second area 552 may also include a calibration area 5521 for determining the Y axis of the phase plane 55, which is not limited here.

[0055] It should be noted that, in some embodiments, Fig. 9 As shown, the calibration area 5521 includes two connected calibration sub-areas 55210, and the intersection point of the two calibration sub-areas 5522 is the center point of the calibration area 5521. This is conducive to quickly obtaining the center of the calibration area 5521, thereby facilitating the speed of determining the X-axis and Y-axis of the phase plane 55.

[0056] In some embodiments, the number of the calibration areas 5521 of the second region 552 may be more than one. The following implementation is described by taking the number of the calibration areas 5521 as four as an example. Figure 8 As shown, the first area 551 is located at the center of the phase plane 55, the X-axis on the upper side of the center of the first area 551 is the positive X-axis, the X-axis on the lower side of the center of the first area 551 is the negative X-axis, the Y-axis on the right side of the center of the first area 551 is the positive Y-axis, and the Y-axis on the left side of the center of the first area 551 is the negative Y-axis. The second area 552 includes a first calibration area 5523, a second calibration area 5524, a third calibration area 5525, and a fourth calibration area 5526. The first calibration area 5523 and the second calibration area 5524 are arranged along the X-axis of the phase plane 55 and are respectively located on two opposite sides of the first area 551; the third calibration area 5525 and the fourth calibration area 5526 are arranged along the Y-axis of the phase plane 55 and are respectively located on two opposite sides of the first area 551. In the first calibration area 5523, the second calibration area 5524, the third calibration area 5525 and the fourth calibration area 5526, there are at least two calibration areas 5521 with different numbers of calibration points 5527, and the phase of the calibration point 5527 is less than the first threshold. In this way, the four calibration areas 5521 are respectively located at the X positive semi-axis, X negative semi-axis, Y positive semi-axis and Y negative semi-axis of the phase plane 55, and the four calibration areas 5521 can be distinguished by the number of calibration points 5527 in the calibration area 5521, so as to determine the X positive semi-axis, X negative semi-axis, Y positive semi-axis and Y negative semi-axis of the phase plane 55.

[0057] For example, in some embodiments, the number of calibration points 5527 in only one calibration area 5521 among the first calibration area 5523, the second calibration area 5524, the third calibration area 5525, and the fourth calibration area 5526 is different from the number of calibration points 5527 in the other three calibration areas 5521. For example, assuming that the first calibration area 5523, the second calibration area 5524, the third calibration area 5525, and the fourth calibration area 5526 correspond to the positive X semi-axis, the negative X semi-axis, the positive Y semi-axis, and the negative Y semi-axis, respectively, and there are two calibration points 5527 in the first calibration area 5523, and there is only one calibration point 5527 in each of the second calibration area 5524, the third calibration area 5525, and the fourth calibration area 5526. In the process of assembling the imaging system 100, four calibration areas 5521 with a lower phase than the surrounding can be first obtained through the phase of each point in the second area 552. Since the number of calibration points 5527 in the first calibration area 5523 is different from that in the other three areas, the first calibration area 5523 can be determined according to the number of calibration points 5527 in the four calibration areas 5521. After the first calibration area 5523 is determined, the calibration area 5521 opposite to the first calibration area 5523 can be determined as the second calibration area 5524, the calibration area 5521 located on the left side of the first calibration area 5523 can be determined as the fourth calibration area 5526, and the calibration area 5521 located on the right side of the first calibration area 5523 can be determined as the third calibration area 5525; then, the positive X semi-axis, negative X semi-axis, positive Y semi-axis and negative Y semi-axis of the phase plane 55 are determined according to the center of the phase plane 55, the center of the first calibration area 5523, the center of the second calibration area 5524, the center of the third calibration area 5525 and the center of the fourth calibration area 5526.

[0058] For further information, see Figure 8In some embodiments, the number of calibration points 5527 in the first calibration area 5523 is different from the number of calibration points 5527 in the second calibration area 5524 and the third calibration area 5525, and the number of calibration points 5527 in the third calibration area 5525 is different from the number of calibration points 5527 in the fourth calibration area 5526. The number of calibration points 5527 in the second calibration area 5524 and the number of calibration points 5527 in the fourth calibration area 5526 may be the same or different. For example, it is assumed that the first calibration area 5523, the second calibration area 5524, the third calibration area 5525, and the fourth calibration area 5526 correspond to the positive X semi-axis, the negative X semi-axis, the positive Y semi-axis, and the negative Y semi-axis, respectively, and there are 2 calibration points 5527 in the first calibration area 5523, 3 calibration points 5527 in the third calibration area 5525, and the number of calibration points 5527 in the second calibration area 5524 and the fourth calibration area 5526 is 0. In the process of assembling the imaging system 100, four calibration areas 5521 with a lower phase than the surrounding can be obtained through the phase of each point in the second area 552. Then, the number of calibration points 5527 in the four calibration areas 5521 is identified respectively. If the number of calibration points 5527 in a calibration area 5521 is identified as 2, the calibration area 5521 is determined to be the first calibration area 5523; if the number of calibration points 5527 in a calibration area 5521 is identified as 3, the calibration area 5521 is determined to be the third calibration area 5525. After the first calibration area 5523 and the third calibration area 5525 are determined, the calibration area 5521 opposite to the first calibration area 5523 can be determined as the second calibration area 5524, and the calibration area 5521 opposite to the third calibration area 5525 can be determined as the fourth calibration area 5526. Then, the positive X axis, negative X axis, positive Y axis, and negative Y axis of the phase plane 55 are determined according to the center of the phase plane 55, the center of the first calibration area 5523, the center of the second calibration area 5524, the center of the third calibration area 5525, and the center of the fourth calibration area 5526. This is helpful to increase the speed of determining the X axis and Y axis of the phase plane 55, and to reduce the difficulty of assembling the imaging system 100.

[0059] It should be noted that the phase of the calibration point 5527 is less than the third threshold value, and the phases of the calibration area 5521 except the calibration point 5527 are all greater than the third threshold value, so the number of calibration points 5527 in the calibration area 5521 can be obtained by obtaining the number of points in the calibration area 5521 whose phases are less than the third threshold value. In particular, in some embodiments, the phase of the calibration point 5527 can also be much smaller than the phase of the calibration area 5521 except the calibration point 5527, which is conducive to more rapid acquisition of the number of calibration points 5527.

[0060] See also Figure 2The driving member 70 can be in any form, such as any one of a piezoelectric driver, an electromagnetic driver, a rotary motor, a linear motor, etc. In the embodiment of the present application, the driving member 70 is an electromagnetic driver, including an electromagnet 71 and a coil 73. The driving member 70 is mounted on the top of the light guide element 33, one of the electromagnet 71 and the coil 73 is mounted on the top of the light guide element 33, and the other is mounted on the connecting rod 80. One end of the connecting rod 80 is rotatably connected to the top of the light guide element 33, and the other end of the connecting rod 80 is connected to the phase mask plate 50.

[0061] The driving member 70 is used to drive the phase mask plate 50 to move so that the phase mask plate 50 selectively blocks or opens the through hole 330. Specifically, if the initial position of the phase mask plate 50 is at a position covering the through hole 330 (such as Fig.10 As shown in FIG. 1 , when the imaging module 10 performs conventional imaging, such as microscopic imaging, the coil 73 passes a current in one direction and acts with the electromagnet 71 to generate a driving force, and the driving force drives the connecting rod 80 to rotate, so as to drive the phase mask plate 50 away from the through hole 330, that is, not to enter the optical path of the imaging module 10, and not to affect the normal imaging of the imaging module 10, as shown in FIG. Fig.12 As shown, at this time, the point spread function of the optimal imaging surface is collected and saved.

[0062] See also Fig.10 If the depth of field needs to be extended, the coil 73 passes a current in the opposite direction and acts with the electromagnet 71 to generate a driving force. The driving force at this time drives the connecting rod 80 to rotate in the opposite direction to drive the phase mask plate 50 to block the through hole 330. The phase mask plate 50 will enter the optical path of the imaging module 10, affecting the normal imaging of the imaging module 10. Specifically, the phase mask plate 50 masks the incident light so that the entire sensor can receive the modulated light illumination, which can change the point spread function at different focal depths, ensure that the point spread function at different defocus amounts has extremely high similarity, and collect relevant point spread function data, thereby increasing the imaging depth of field and improving the imaging, especially the quality of microscopic imaging.

[0063] Specifically, see Fig.11 , Fig.11 The first row is an image obtained by a conventional imaging module that does not use a phase mask. Fig.11 The middle line in the embodiment of the present application Fig.10 The image obtained by the imaging module 10 in the state shown, Fig.11Finally, the first line is an image obtained by the imaging module 10 in the embodiment of the present application after being processed by the algorithm. It can be clearly seen that the traditional imaging module can only obtain a clear image at a certain distance, while the blur degree of the image obtained by the imaging module in the embodiment of the present application at different distances is consistent. After subsequent image processing, such as deconvolution algorithm, neural network algorithm, etc., clear images can be obtained at different distances. In this way, the depth of field of the imaging system 100 using the phase mask plate 50 of this design is improved, thereby reducing the electronic device 1000 (such as Fig.13 The difficulty of achieving clear microscopic features (as shown).

[0064] In some embodiments, the imaging system 100 may further include a cover glass 90 , which is disposed on the object side of the phase mask plate 50 to protect the cover glass 90 from dust and water.

[0065] See also Fig.13 The embodiment of the present application further provides an electronic device 1000. The electronic device 1000 includes a housing 200 and an imaging system 100 in any of the above embodiments, and the imaging system 100 is combined with the housing 200. The electronic device 1000 may be a mobile phone, a tablet computer, a notebook, a smart watch, a smart bracelet, etc., which is not limited here.

[0066] Please combine Figure 1 and Figure 2 The electronic device 1000 of the present application sets a phase mask plate 50 and uses a driving member 70 to drive the phase mask plate 50 to move, so that the phase mask plate 50 selectively blocks or opens the through hole 330, so that the light entering the imaging module 10 can be phase-encoded by the phase mask plate 50, and then the imaging module 10 can perform depth-of-field extension wavefront coding imaging on the object, which can not only greatly increase the depth of field of the imaging system 100, but also correct the defocus aberration caused by installation errors and temperature changes, so as to improve the imaging performance.

[0067] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0068] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0069] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations to the present application. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An imaging system, characterized in that: include: Imaging module; A fill light component is provided with a through hole, the fill light component is arranged on the object side of the imaging module, and the through hole corresponds to the light entrance of the imaging module; A phase mask plate, arranged on a side of the fill light component away from the imaging module, the phase mask plate comprises a lens and a microstructure layer, the microstructure layer is located on one side of the lens to form a phase plane, the phase plane comprises a first area, the first area comprises adjacent first sub-areas and second sub-areas, in the direction from the center of the first area to the edge of the first area, the phase of each point on the first sub-area gradually increases, and the phase of each point on the second sub-area gradually decreases, the phase plane also comprises a second area and a positioning area, the second area surrounds the first area, and the positioning area is located between the first area and the second area; the phase of each point in the positioning area is less than a first threshold, the phase of each point in the first area and the second area is greater than a second threshold, and the first threshold is less than the second threshold, the difference between the first threshold and the second threshold is greater than a first preset difference, and the positioning area can separate the first area and the second area; and A driving member, mounted on the fill light assembly and connected to the phase mask plate, the driving member being used to drive the phase mask plate to move so that the phase mask plate selectively blocks or opens the through hole; The second area includes a calibration area, the calibration area is used to mark the X-axis and / or Y-axis of the phase plane, and in the second area, the phase of each point in the calibration area is smaller than the phase of each point outside the calibration area; The second area includes a first calibration area, a second calibration area, a third calibration area and a fourth calibration area, the first calibration area and the second calibration area are arranged along the X-axis of the phase plane and are respectively located on two opposite sides of the first area; the third calibration area and the fourth calibration area are arranged along the Y-axis of the phase plane and are respectively located on two opposite sides of the first area; In the first calibration area, the second calibration area, the third calibration area and the fourth calibration area, there are at least two calibration areas with different numbers of calibration points, and the phases of the calibration points are smaller than a third threshold.

2. The imaging system according to claim 1, characterized in that The fill light component comprises: a light source for emitting light; and A light guide element, the light guide element comprises a light incident surface and a light emitting surface, the light emitted from the light source enters the light guide element through the light incident surface and is emitted from the light emitting surface, and the light incident surface and the light emitting surface have different directions.

3. The imaging system according to claim 2, characterized in that The emission direction of the light emitted from the light emitting surface is consistent with the optical axis of the imaging module; and / or The light incident surface and the light emitting surface are orthogonal in orientation.

4. The imaging system according to claim 1, characterized in that The thickness of the lens is in the millimeter range of 0.15 mm to 1.50 mm.

5. The imaging system according to claim 4, characterized in that: The thickness of the microstructure layer is in the micrometer range of 2um to 20um.

6. The imaging system according to claim 1, characterized in that: The number of the calibration points in the first calibration area is different from the number of the calibration points in the second calibration area and the third calibration area, and the number of the calibration points in the third calibration area is different from the number of the calibration points in the fourth calibration area.

7. The imaging system according to claim 1, characterized in that: The thickness of the microstructure layer is in the micrometer range of 2um to 20um.

8. An electronic device, characterized in that: The electronic device comprises: a housing; and The imaging system according to any one of claims 1 to 7, wherein the imaging system is combined with the housing.

Images