Position detection sensor and method for manufacturing a position detection sensor

Abstract

A position detection sensor having a sensor pattern composed of a coated conductor is configured in a bendable manner. A terminal portion and a sensor pattern portion are provided on one face of a substrate composed of a bendable material, and a bending region is formed between a region of the terminal portion and a region of the sensor pattern portion. The sensor pattern portion is arranged by adhering a plurality of electrode conductors each composed of a coated conductor to the substrate in a manner that each of the plurality of electrode conductors becomes a prescribed pattern. End portions of the coated conductor of each of the plurality of electrode conductors are aligned in a manner that enables connection with corresponding terminal conductors of the terminal portion. The end portions of each of the plurality of electrode conductors and the plurality of terminal conductors of the terminal portion are electrically connected via the bending region, and each of the plurality of electrode conductors in the bending region is arranged in a state that enables elongation between the terminal portion and the sensor pattern portion.

Description

Technical Field

[0001] The present invention relates to a position detection sensor having a plurality of electrode conductors disposed on a substrate for detecting the indicated position of a position indicator, and a method for manufacturing the position detection sensor. Background Technology

[0002] In conventional position detection sensors, as described in Patent Document 1 (Japanese Patent Application Publication No. 2013-186784), multiple electrode conductors are formed into a predetermined pattern by printing or vapor deposition of copper foil patterns on a sheet substrate or film substrate.

[0003] In this case, when multiple electrode conductors are disposed on a sheet substrate or a film substrate, in order to avoid the overlap of the electrode conductors, through holes are formed on the sheet substrate or the film substrate, using both the front and back sides of the sheet substrate or the film substrate.

[0004] Therefore, it is necessary to form through-holes and electrode patterns for use on both sides of the sheet-like or film-like substrate, which increases costs. This is especially true for large position detection sensors, where costs are even higher.

[0005] In contrast, Patent Document 2 (Japanese Patent Application Publication No. 7-253840) discloses a method for manufacturing a position detection sensor inexpensively. Specifically, the method described in Patent Document 2 involves pre-arranging guide pins (wiring pins) on a flat plate in a manner capable of forming a predetermined electrode conductor pattern, and then sequentially hanging covered wires (insulated sensor wires) on the guide pins, wiring is performed while folding them back, thereby forming the electrode conductor pattern.

[0006] The position detection sensor in Patent Document 2 does not have a terminal section; instead, the covered wires constituting the electrode conductors are extended from the flat plate as leads. Therefore, in order to connect each of the multiple electrode conductors of the position detection sensor to an external circuit, the covered wires of the leads must be stripped and individually soldered, which is very cumbersome and unsuitable for mass production.

[0007] To address this issue, a position detection sensor is proposed that reduces costs by forming electrode conductors using covered wires on a substrate composed of a sheet substrate or a film substrate, and provides terminals on the same substrate for easy connection to external circuits (see Patent Document 3 (WO2016 / 194543)).

[0008] Existing technical documents

[0009] Patent documents

[0010] Patent Document 1: Japanese Patent Application Publication No. 2013-186784

[0011] Patent Document 2: Japanese Patent Application Publication No. 7-253840

[0012] Patent Document 3: WO2016 / 194543 Summary of the Invention

[0013] The problem that the invention aims to solve

[0014] However, a recent invention provides an input device in which a position detection sensor is superimposed on the display screen of a display, enabling the detection of user input operations using a position indicator on the display screen. In this type of input device, the detection area of ​​the position detection sensor is typically configured to exactly overlap with the display area of ​​the screen, allowing for the detection of input operations across the entire display area. Furthermore, in this type of input device, it is desirable to minimize the outer frame of the display screen, regardless of the size of the display.

[0015] However, in the position detection sensor disclosed in Patent Document 3, since the terminal portion is formed on the same surface as the electrode conductor pattern, it exists outside the detection area formed by the area where the electrode conductor is formed. Therefore, the presence of the terminal portion outside the detection area of ​​the position detection sensor, which is the same size as the display screen, increases the size of the outer frame portion of the display screen by the amount of the terminal portion area.

[0016] The purpose of this invention is to provide a position detection sensor that can solve the above-mentioned problems.

[0017] Technical solutions for solving the problem

[0018] To address the aforementioned issues, a position detection sensor is provided, comprising:

[0019] The substrate is made of a bendable material;

[0020] A terminal portion is formed on one surface of the substrate and a plurality of terminal conductors are disposed thereon; and

[0021] In the sensor pattern section, in a region on one surface of the substrate that does not overlap with the terminal section, each of a plurality of electrode conductors composed of covered wires is arranged in a predetermined pattern, allowing them to overlap with each other, and is configured to be adhered to the substrate by an adhesive material. Furthermore, the ends of the covered wires of each of the plurality of electrode conductors are aligned in a manner that allows them to connect with the corresponding terminal conductor of the terminal section.

[0022] A bending region is formed between the terminal portion region and the sensor pattern portion region on one side of the substrate.

[0023] The ends of each of the plurality of electrode conductors in the sensor pattern portion are electrically connected to the plurality of terminal conductors in the terminal portion via the bending region.

[0024] Furthermore, each of the plurality of electrode conductors in the bending region is configured to be able to extend between the terminal portion and the sensor pattern portion.

[0025] The position detection sensor with the above-described structure has a bending region between the terminal portion and the sensor pattern portion formed on one side of a substrate made of a bendable material. Therefore, it can be bent in the bending region, so that the terminal portion is located on the side of the substrate opposite to one side of the substrate. Thus, since one side of the substrate is approximately only the area of ​​the sensor pattern portion, when the position detection sensor is arranged to overlap with the display screen of a display, the size of its outer frame portion can be narrowed.

[0026] Furthermore, in this case, the ends of the multiple electrode conductors of the sensor pattern section are usually electrically connected to the terminal section by extending to the terminal section via the bending area. However, if there is no allowance in the extension portion of the electrode conductor in the bending area, the bending stress generated when bending the terminal section to the side opposite to one side of the substrate may cause poor electrical connection between the end of the electrode conductor and the terminal section or breakage of the electrode conductor.

[0027] In contrast, in the position detection sensor with the above structure, since each of the multiple electrode conductors in the bending region is arranged in a state that allows it to extend between the terminal portion and the sensor pattern portion, there is a margin in the extension portion of the electrode conductor in the bending region. This can prevent poor electrical connection between the end of the electrode conductor and the terminal portion or breakage of the electrode conductor due to bending stress generated when the terminal portion is bent toward the side opposite to one side of the substrate. Attached Figure Description

[0028] Figure 1 This is a structural example illustrating an embodiment of the position detection sensor of the present invention.

[0029] Figure 2 This is a structural example illustrating an embodiment of the position detection sensor of the present invention.

[0030] Figure 3 This is a diagram illustrating a structural example of a position detection circuit connected to an embodiment of the position detection sensor of the present invention.

[0031] Figure 4 This is a diagram illustrating an example of a manufacturing apparatus for manufacturing an embodiment of the position detection sensor of the present invention.

[0032] Figure 5This is a diagram illustrating an example of a manufacturing method for an embodiment of the position detection sensor of the present invention.

[0033] Figure 6 This is a diagram illustrating an example of a manufacturing method for an embodiment of the position detection sensor of the present invention.

[0034] Figure 7 This is a flowchart illustrating an example of a manufacturing method for an embodiment of the position detection sensor of the present invention.

[0035] Figure 8 This is a diagram illustrating an example of a manufacturing method for an embodiment of the position detection sensor of the present invention.

[0036] Figure 9 This is a diagram illustrating an example of a manufacturing method for an embodiment of the position detection sensor of the present invention.

[0037] Figure 10 This is a diagram illustrating a structural example of another embodiment of the position detection sensor of the present invention.

[0038] Figure 11 This is a diagram illustrating a manufacturing method for another embodiment of the position detection sensor of the present invention. Detailed Implementation

[0039] Hereinafter, embodiments of the position detection sensor of the present invention will be described with reference to the accompanying drawings.

[0040] [Implementation of Position Detection Sensors]

[0041] The position detection sensor described below is an electromagnetic induction type position detection sensor, in which the patterns of the multiple electrode conductors constituting the patterned part of the sensor are each a ring coil pattern.

[0042] Figure 1 This is a diagram illustrating the structure of the position detection sensor 1 in this embodiment. Figure 1 (A) is a view of the surface of the position detection sensor 1 with the sensor pattern 13 formed, viewed from a direction orthogonal to that surface. Figure 1 (B) is a conceptual diagram of the cross-sectional structure of the position detection sensor 1.

[0043] In the position detection sensor 1 of this embodiment, such as Figure 1As shown in (A) and (B), a sensor pattern portion 13, consisting of multiple annular coils serving as multiple electrode conductors, is adhered to one surface 11a of a rectangular sheet or film-like substrate 11 made of a bendable insulating material, such as PET (polyethylene terephthalate), by an adhesive material 12. The substrate 11 can be a flexible substrate.

[0044] In this example, the sensor pattern portion 13 is a rectangular area ARa occupying most of the longitudinal direction and excluding the left-hand portion of the transverse direction of the substrate 11 on one side 11a of the rectangular substrate 11. A rectangular protective sheet 14 made of an insulating material, such as PET, is disposed to cover the entire exposed surface of the sensor pattern portion 13. In the sensor pattern portion 13, there is a space (air layer) outside the electrode conductor portion, and the protective sheet 14 is bonded to the substrate 11 through the space of the sensor pattern portion 13 by an adhesive material 12.

[0045] Furthermore, in this example, a terminal portion 16 is adhered to the lateral end of the lateral left side portion of one surface 11a of the substrate 11 where the sensor pattern portion 13 is not disposed, with the adhesive material 15 in between. That is, the terminal portion 16 is provided in the lateral edge region Arb of the substrate 11, which does not overlap with the region Ara where the sensor pattern portion 13 is disposed. In this example, the terminal portion 16 is formed on a sheet or film substrate made of an insulating material, such as PET, by forming, for example, a terminal conductor 17 consisting of a copper foil pattern for electrical connection to each of the plurality of electrode conductors of the sensor pattern portion 13 through printing.

[0046] Furthermore, in this example, the area between region Ara of the sensor pattern portion 13 and region Arb of the terminal portion 16 in the lateral direction of the substrate 11 is the bending region ARc. In this embodiment, the upper part of region ARb of the terminal portion 16 and the bending region Arc is not covered by the protective sheet 14. Moreover, no adhesive material 15 is applied to the bending region Arc. The lateral length of the substrate 11 of the bending region Arc is selected to be a sufficient length to bend from a position near the lateral end of region Ara of the sensor pattern portion 13 in the bending region Arc, such that the terminal portion 16 side is located on the side of the substrate 11 opposite to the side of one surface 11a.

[0047] like Figure 1 As shown in (A), the sensor pattern section 13 is composed of multiple loop coils, which are examples of multiple electrode conductors. In this example, the multiple loop coils are composed of multiple loop coils 13X in the X-axis direction and multiple loop coils 13Y in the Y-axis direction.

[0048] The X-axis direction loop coil 13X is composed of a rectangular loop coil with the longitudinal direction (Y-axis direction of position coordinates) of the substrate 11 as its long side. Multiple X-axis direction loop coils 13X are arranged at predetermined intervals in the transverse direction (X-axis direction of position coordinates) of the substrate 11. Similarly, the Y-axis direction loop coil 13Y is composed of a rectangular loop coil with the transverse direction of the substrate 11 as its long side. These Y-axis direction loop coils are arranged at predetermined intervals in the longitudinal direction of the substrate 11.

[0049] In this embodiment, each of the plurality of X-axis direction annular coils 13X and the plurality of Y-axis direction annular coils 13Y constituting the sensor pattern portion 13 is arranged on a surface 11a of the substrate 11, allowing them to overlap with each other, via the covering wire 18. In this case, as... Figure 1 As shown in (A), in this embodiment, each of the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y is arranged in a predetermined pattern at a predetermined position on a surface 11a of the substrate 11.

[0050] Moreover, in this embodiment, such as Figure 1 As shown, the two ends 18E of the X-axis loop coil 13X and the Y-axis loop coil 13Y are arranged on the lateral terminal portion 16 side of the region ARa of the sensor pattern portion 13, extending laterally from the protective sheet 14 and across the bending region Arc towards the terminal portion 16 side. At this time, the exit positions of the two ends 18E of the X-axis loop coil 13X and the Y-axis loop coil 13Y from the sensor pattern portion 13 are aligned with the positions of the corresponding terminal conductors 17 of the terminal portion 16, which are predetermined as to connect the two ends 18E.

[0051] That is, the two ends 18E of the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y are configured such that when the end edge of the terminal portion 16 on the transverse side of the region ARa of the sensor pattern portion 13 extends in a straight line across the bending region Arc, it is located exactly on the corresponding terminal conductor 17 of the terminal portion 16.

[0052] Moreover, in this case, such as Figure 1 As shown in (B), the front ends 18Ea of the two ends 18E of the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y are in a state where the insulating covering layer of the wire 18 has been peeled off and the wire is exposed. The front ends 18Ea of the exposed wire are located on the terminal conductor 17 of the terminal portion 16.

[0053] Furthermore, although the illustration is omitted, each of the terminal conductors 17 of the terminal portion 16 is electrically connected to the front end portion 18Ea of each of the two ends 18E of the X-axis circular coil 13X and the Y-axis circular coil 13Y, for example, by soldering. For example, each of the terminal conductors 17 of the terminal portion 16 is pre-filled with solder, and each of the terminal conductors 17 of the terminal portion 16, where the front end portion 18Ea of each of the two ends 18E of the X-axis circular coil 13X and the Y-axis circular coil 13Y is located, is soldered to the front end portion 18Ea of each of the two ends 18E of the X-axis circular coil 13X and the Y-axis circular coil 13Y.

[0054] Furthermore, a metal sheet 19, serving as an example of an electromagnetic shielding layer, is adhered to cover the entire surface of the substrate 11 opposite to one surface 11a. In this example, the metal sheet 19 is composed of an aluminum sheet and a non-crystalline material. The non-crystalline material of the metal sheet 19 prevents electromagnetic waves emitted from the sensor pattern portion 13 from being emitted to the outside of the surface of the substrate 11 opposite to one surface 11a, while the aluminum sheet prevents noise from the outside of the surface of the substrate 11 opposite to one surface 11a from mixing into the sensor pattern portion 13. Alternatively, the metal sheet 19 may not cover the entire surface of the substrate 11 opposite to one surface 11a, but only the area on the back side of the sensor pattern portion 13 region Ara within the surface of the substrate 11 opposite to one surface 11a.

[0055] As described above, in the position detection sensor 1 of this embodiment, a sensor pattern portion 13 consisting of an X-axis circular coil 13X and a Y-axis circular coil 13Y is formed using a covered wire 18, and the sensor pattern portion 13 is fixed between the substrate 11 and the protective sheet 14 using an adhesive material 12. Therefore, the position detection sensor 1 can be manufactured at low cost.

[0056] Furthermore, in the position detection sensor 1 of the above embodiment, a terminal portion 16 with a pre-formed terminal conductor 17 is formed on one surface 11a of the substrate 11. The front ends 18Ea of the two ends 18E of the covering wire 18 of the annular coil of the sensor pattern portion 13 are aligned in such a way that they can be connected to the corresponding terminal conductors of the terminal conductors 17 of the terminal portion 16. For example, by soldering, they can be easily electrically connected to each of the corresponding terminal conductors 17 of the terminal portion 16.

[0057] Therefore, the position detection sensor 1 of this embodiment uses the covered wire 18 to form the electrode conductor, which can provide a position detection sensor with a cheap and simple structure, and the connection with the external circuit is very easy by using the terminal part 16.

[0058] In this embodiment, a circuit board 22 is connected to the terminal portion 16 via a flexible substrate 21. In this case, a conductive pattern 21a is formed on the flexible substrate 21, electrically connected to each of the terminal conductors 17 of the terminal portion 16. One end of the conductive pattern 21a is electrically connected to each of the terminal conductors 17 of the terminal portion 16, and the other end is electrically connected to each terminal conductor (not shown) of the connector terminal portion of the circuit board 22. A position detection circuit, described later, is formed on the circuit board 22.

[0059] Moreover, such as Figure 2 As shown in (A) and (B), the position detection sensor 1 is configured such that the substrate 11 is bent at the position of the bending region ARc to the side opposite to the side of one surface 11a. In this example, the terminal portion 16, the flexible substrate 21, and the circuit board 22 are located on the side of the substrate 11 opposite to the side of one surface 11a. Furthermore, Figure 2 (A) is used to clarify Figure 2 The diagram shown in (B) illustrates the bending state of position detection sensor 1, which is related to... Figure 1 The same diagram as (B).

[0060] Therefore, most of the terminal portion 16 region ARb and the bending region Arc of the substrate 11 are located on the side of the substrate 11 opposite to the side of one surface 11a, and the side of one surface 11a of the substrate 11 is almost entirely occupied by the sensor pattern portion 13. Therefore, it is possible to narrow the size of the frame area when the position detection sensor 1 of this embodiment is superimposed on the display screen of the display device.

[0061] In this case, the two ends 18E of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y of the sensor pattern section 13 extend through the bending region Arc to the region ARb of the terminal section 16 and are electrically connected to the terminal section 16. In this case, if the two ends 18E of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y extend in a straight line through the bending region Arc to the region ARb of the terminal section 16, there is no allowance in the extension portion of the two ends 18E in the bending region Arc. It is possible that due to the bending stress generated when bending the terminal section 16 toward the side opposite to one surface 11a of the substrate 11, the front end 18Ea of the two ends 18E may have poor electrical connection with the terminal conductor 17 of the terminal section 16 or the covering wire 18 may break.

[0062] In view of this, in this embodiment, the two ends 18E of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y are not arranged in a straight line connecting the sensor pattern portion 13 and the terminal portion 16, but are arranged in such a way that the bending area Arc between the terminal portion 16 and the sensor pattern portion 13 is in a state that can be extended.

[0063] That is, in this embodiment, within the bending region Arc between the terminal portion 16 and the sensor pattern portion 13, the two ends 18E of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y are configured to have a margin portion consisting of a non-linear portion in the bending region Arc, so that the bending region Arc can be elongated.

[0064] exist Figure 1 In the example, the allowance portion consisting of the non-linear portion is composed of winding allowance portions 18Eb and 18Ec. These winding allowance portions 18Eb and 18Ec are formed by winding the covering wire 18 of the two ends 18E of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y in the bending region Arc once or multiple times to form a coil shape. In this embodiment, as described later, the winding allowance portions 18Eb and 18Ec are formed by winding the covering wire onto the guide pin used when patterning the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y on the sensor pattern portion 13.

[0065] Thus, the two ends 18E of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y in the bending region Arc are formed and arranged with winding allowance portions 18Eb and 18Ec that allow the bending region Arc between the terminal portion 16 and the sensor pattern portion 13 to be elongated. Therefore, even when the substrate 11 of the position detection sensor 1 of this embodiment is bent at the position of the bending region Arc toward the side of the substrate 11 opposite to the side of one surface 11a, the covering wires 18 of the two ends 18E of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y in the bending region Arc will have a margin for bending stress due to the presence of the winding allowance portions 18Eb and 18Ec, which can prevent poor electrical connection between the front end 18Ea of the two ends 18E and the terminal conductor 17 of the terminal portion 16 or breakage of the covering wires 18.

[0066] [Regarding the position detection circuit of the position detection sensor using the implementation method]

[0067] Next, use Figure 3 An example of the structure of the electromagnetic induction-based position detection circuit 200 formed on the circuit board 22 of the position detection sensor 1 in the above-described embodiment will be described. Furthermore, as... Figure 3 As shown, the pen-shaped position indicator 3 used with the position detection sensor 1 of this embodiment has a built-in resonant circuit consisting of a coil 31 and a capacitor 32 connected in parallel with the coil 31.

[0068] In this case, Figure 3In the example, the X-axis direction loop coil 13X consists of n (n is an integer greater than 2) rectangular loop coils 13X1 to 13X arranged in the X-axis direction. n Furthermore, the Y-axis loop coil 13Y consists of m (m is an integer of 2 or more) loop coils 13Y1 to 13Y arranged in the Y-axis direction. m constitute.

[0069] exist Figure 3 In the example, the position detection circuit 200 is configured to include a selection circuit 201, an oscillator 202, a current driver 203, a transmit / receive switching circuit 204, a receive amplifier 205, an indication position detection circuit 206, and a processing control unit 207.

[0070] The selection circuit 201 sequentially selects one of the multiple X-axis direction loop coils 13X and multiple Y-axis direction loop coils 13Y. Through the selected loop coil, it sends a signal to the position indicator 3 and receives the signal fed back from the position indicator 3.

[0071] The transmit / receive switching circuit 204, which is switched and controlled by the processing control unit 207, is connected to the selection circuit 201. When the transmit / receive switching circuit 204 is connected to the transmit-side terminal T, an AC signal is supplied from the oscillator 202 to the selection circuit 201. When it is connected to the receive-side terminal R, the signal from the selection circuit 201 is supplied to the position detection circuit 206 through the receive amplifier 205.

[0072] The position detection circuit 206 detects the induced voltage generated in the loop coil of the position detection sensor 1, i.e., the received signal, converts the detected output signal into a digital signal, and outputs it to the processing control unit 207. The processing control unit 207 calculates the coordinate values ​​of the indicated position of the position indicator 3 in the X-axis and Y-axis directions based on the digital signal from the position detection circuit 206, i.e., the voltage level of the induced voltage generated in each loop coil.

[0073] [Embodiment for the Manufacturing Method of Position Detection Sensor 1]

[0074] Next, an embodiment of the method for manufacturing the position detection sensor 1 will be described. Figure 4 and Figure 5 This is a diagram illustrating an embodiment of the manufacturing method of the position detection sensor 1. Figure 4 This diagram illustrates a structural example of a manufacturing apparatus for a position detection sensor that performs the manufacturing method of this embodiment. The manufacturing apparatus for the position detection sensor in this example comprises a wiring supply unit 100, a preprocessing unit 110, and a wiring unit 120.

[0075] The wiring unit 120 comprises a worktable 121 for forming the position detection sensor 1 and a two-axis moving wiring device 122 disposed on the worktable 121. The two-axis moving wiring device 122 includes a direction in the X-axis direction of the position detection sensor 1 (refer to...). Figure 3 The moving bridge 1221 slides along the direction of arrow Ax and moves along the Y-axis direction of position detection sensor 1 (refer to the direction of arrow Ax). Figure 3 The wiring nozzle mechanism 1222 slides along the direction of the arrow Ay.

[0076] The movable bridge 1221 includes two legs 1221a and 1221b, and a bridging portion 1221c that bridges the two legs 1221a and 1221b by crossing a position detection sensor 1 along its Y-axis direction. The two legs 1221a and 1221b of the movable bridge 1221 are mounted on a worktable 121 on each of two tracks 121a and 121b arranged along the X-axis direction. With the bridging portion 1221c maintained parallel to the Y-axis direction, the movable bridge 1221 slides along the X-axis direction guided by the two tracks 121a and 121b.

[0077] The wiring nozzle mechanism 1222, relative to the bridging portion 1221c of the moving bridge 1221, in its bridging direction (the Y-axis direction of the position detection sensor 1 (reference) Figure 4 The cable is movably mounted in the direction of arrow Ay. A cable nozzle 1222a is mounted on the part of the cable nozzle mechanism 1222 opposite to the surface of the worktable 121. The cable nozzle 1222a feeds the coated wire, which has been pretreated by the pretreatment unit 110, out of its outlet.

[0078] With the above structure, the wiring nozzle 1222a can move in any direction on the 2D plane of the worktable 121 by sliding the moving bridge 1221 in the X-axis direction and the wiring nozzle mechanism 1222 in the Y-axis direction of the 2-axis moving wiring device 122.

[0079] The 2-axis moving wiring device 122 is equipped with Figure 4 The motion control unit, which is omitted from the illustration, is configured to control the sliding movement of the moving bridge 1221 in the X-axis direction and the sliding movement of the wiring nozzle mechanism 1222 in the Y-axis direction. Furthermore, in this embodiment, the motion control unit pre-stores information about the movement trajectories of the wiring nozzle 1222a to move and configure each of the plurality of X-axis annular coils 13X and the plurality of Y-axis annular coils 13Y.

[0080] The movement control unit of the 2-axis moving wiring device 122 controls the sliding movement of the moving bridge 1221 in the X-axis direction and the sliding movement of the wiring nozzle mechanism 1222 in the Y-axis direction according to the stored information, and performs movement control on the wiring nozzle 1222a to configure each of the plurality of X-axis direction annular coils 13X and each of the plurality of Y-axis direction annular coils 13Y.

[0081] A pin table 123 is provided on the workbench 121 of the wiring unit 120. A guide pin is provided on the pin table 123. The guide pin is used to guide the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y so that they are formed into a pattern by the wrapped wire.

[0082] Figure 5 This is a diagram illustrating the structure of the pin 123. For example... Figure 5 As shown above, the pin mounting plate 123 consists of a guide pin mounting plate 1231, an intermediate plate 1232, and a release tab 1233. Furthermore, as... Figure 5 As shown below, the pin mounting base 123 is constructed by combining these guide pin mounting plates 1231, intermediate plates 1232, and release tabs 1233. Furthermore, Figure 5 The image below the sales counter 123 is... Figure 5 The image above shows an enlarged view of the area corresponding to the region indicated by the dashed line.

[0083] A plurality of guide pins 124 are mounted on the guide pin mounting plate 1231. These guide pins 124 are used to guide the formation of each of a plurality of X-axis annular coils 13X and a plurality of Y-axis annular coils 13Y by means of the coated wire discharged from the wiring nozzle 1222a. Figure 5 For ease of explanation, it is shown that the guide pin 124 is only installed at the end of the guide pin mounting plate 1231, but in reality, the guide pin 124 is at least respectively located at the point where each of the plurality of X-axis direction annular coils 13X and each of the plurality of Y-axis direction annular coils 13Y bends.

[0084] The intermediate plate 1232 is positioned between the guide pin mounting plate 1231 and the peeling piece 1233, such as Figure 5 As shown, through holes 125 are formed at each corresponding position of the guide pin 124 provided on the guide pin mounting plate 1231.

[0085] The release tab 1233 is disposed on the intermediate plate 1232 which is adhered to the guide pin mounting plate 1231. At this time, the guide pin 124 pierces the release tab 1233, and the tip of the guide pin 124 protrudes onto the release tab 1233. Furthermore, in this example, the tip of the guide pin 124 is sharp and needle-shaped.

[0086] As described above, the guide pin mounting plate 1231, the intermediate plate 1232, and the peeling piece 1233 are as follows: Figure 5 As shown below, they are combined to form a pin platform 123 in which multiple guide pins 124 are erected at a specified position.

[0087] Furthermore, on the peeling tab 1233 of the pin station 123, each of the plurality of X-axis direction annular coils 13X and the plurality of Y-axis direction annular coils 13Y is formed into a predetermined annular coil pattern by the wrapped wire fed from the wiring nozzle 1222a of the wiring nozzle mechanism 1222, thereby forming the sensor pattern portion 13. The surface of the peeling tab 1233 is processed to allow the formed sensor pattern portion 13 to be easily peeled off from the pin station 123.

[0088] Using a manufacturing apparatus for a position detection sensor with the above structure, position detection sensor 1 is manufactured according to the steps described below. Furthermore... Figure 4 The manufacturing apparatus for the position detection sensor performs sequential control of the operations of the wiring supply unit 100, the preprocessing unit 110, and the wiring unit 120 by means of a sequence control unit (omitted in the figure), thereby manufacturing the position detection sensor 1.

[0089] Before describing the overall process flow of the manufacturing method of the position detection sensor according to this embodiment, refer to... Figure 6 The arrangement of the guide pins 124 of the pin platform 123 required to form a Y-axis ring coil 13Y and an X-axis ring coil 13X, and the pattern generation of these ring coils 13Y and 13X are explained.

[0090] First, let's explain the case of the Y-axis loop coil 13Y. For example... Figure 6 As shown, in the area Ara of the sensor pattern portion 13 of the substrate 11 on the pin platform 123, four guide pins 124a, 124b, 124c, and 124d are provided for forming a horizontally elongated rectangular Y-axis direction annular coil 13Y, and two guide pins 124e and 124f are provided for defining the exit positions of the two ends 18E of the Y-axis direction annular coil 13Y.

[0091] Then, in the bending area ARc, guide pins 124g and 124h are provided to form winding allowance portions 18Eb and 18Ec, which are examples of allowance portions composed of non-straight portions.

[0092] As will be described later, the covered conductor 18 is as follows Figure 6As shown, a rectangular Y-axis direction annular coil 13Y is formed in region Ara of sensor pattern portion 13, thereby forming a rectangular Y-axis direction annular coil 13Y, which extends from region Ara of sensor pattern portion 13 to region ARb of terminal portion 16 via bending region Arc. The two ends 18E of the covering wire 18 of the Y-axis direction annular coil 13Y are formed.

[0093] In this case, such as Figure 6 As shown, the two ends 18E of the Y-axis circular coil 13Y are composed of one end 18Es and the other end 18Et, and the leading position of the one end 18Es becomes the position of the corresponding terminal conductor 17 of the terminal portion 16. Therefore, by making the one end 18Es of the two ends 18E of the Y-axis circular coil 13Y extend in a straight line across the bending region Arc, it becomes a state that can be connected to the terminal conductor 17 of the terminal portion 16. However, in this embodiment, the one end 18Es is not arranged in a straight line, but rather as follows: Figure 6 As shown, the winding allowance portion 18Eb is configured to have a guide pin 124g wound one or more times relative to the bending region Arc.

[0094] In addition, such as Figure 6 As shown, the other end 18Et of the two ends 18E of the Y-axis direction annular coil 13Y is also configured as a winding allowance portion 18Ec formed by winding once or more relative to the guide pin 124h of the bending region Arc.

[0095] Furthermore, in the position detection sensor 1 of this example, each of the two ends 18E of the multiple Y-axis direction loop coils 13Y and the other end 18Et is interconnected to form a grounding wire GD, as shown below. Figure 1 As shown in (A), the terminal conductor connected to the ground electrode is connected to the terminal portion 16. The winding allowance portion 18Ec of the other end 18Et is formed in the bending region Arc between the exit position from the sensor pattern portion 13 and the ground wire portion GD.

[0096] Next, for the case of the X-axis loop coil 13X, the same applies, as... Figure 6 As shown, in the area Ara of the sensor pattern portion 13 of the substrate 11 on the pin platform 123, four guide pins 124i, 124j, 124k, 124l for forming an X-axis direction annular coil 13X with a longitudinal rectangular shape, and two guide pins 124m, 124n for defining the exit positions of the two ends 18E of the X-axis direction annular coil 13X.

[0097] Then, the wire 18 is covered as follows Figure 6As shown, a rectangular X-axis direction annular coil 13X is formed in region Ara of sensor pattern portion 13, thereby forming a rectangular X-axis direction annular coil 13X, which extends from region Ara of sensor pattern portion 13 through bending region Arc to region ARb of terminal portion 16, and the two ends 18E of the covering wire 18 of the X-axis direction annular coil 13X are formed.

[0098] Then, as Figure 6 As shown, the exit position of one end 18Es of the two ends 18E of the X-axis direction ring coil 13X becomes the position of the corresponding terminal conductor 17 of the terminal part 16. By making this one end 18Es extend in a straight line across the bending area Arc, it becomes a state that can be connected to the terminal conductor 17 of the terminal part 16.

[0099] Moreover, similar to the Y-axis direction loop coil 13Y, such as Figure 6 As shown, one end 18Es and the other end 18Et of the X-axis direction annular coil 13X are configured as winding allowance portions 18Eb and 18Ec, which are formed by winding each of the guide pins 124o and 124p relative to the bending region Arc once or more.

[0100] Furthermore, the front ends of the other ends 18Et of the two ends 18E of the multiple X-axis directional ring coils 13X are each connected to the grounding wire GD, such as Figure 1 As shown in (A), the terminal conductor 17 is connected to the grounding electrode connected to the terminal portion 16.

[0101] As described above, in the bending region Arc, the winding allowances 18Eb and 18Ec at both ends 18E of the Y-axis annular coil 13Y and the X-axis annular coil 13X are pulled out from the guide pins 124g, 124h, 124o, and 124p to become hollow coils, serving as allowances that can elongate and displace in the lateral direction of the substrate 11. Therefore, as described above, when the substrate 11 is bent in the bending region Arc, the elongation allowances covering the conductor 18 can prevent the aforementioned adverse conditions caused by bending stress.

[0102] Next, refer to Figure 7 The flowchart below describes the process flow of the manufacturing method for the position detection sensor according to this embodiment. Furthermore, the following steps are executed under the control of the sequence control unit of the position detection sensor manufacturing apparatus.

[0103] First, the sequence control unit instructs the wire-covered conductor 18 to be fed from the wiring supply unit 100 to the pre-processing unit 110 (step S101). In the pre-processing unit 110, the wire-covered conductor 18 from the wiring supply unit 100 is cut to a length matching each of the X-axis direction loop coil 13X or the Y-axis direction loop coil 13Y, and the covering layer of the front end portion 18Ea of both ends 18E of the X-axis direction loop coil 13X or the Y-axis direction loop coil 13Y is peeled off to expose the conductor. Then, the pre-processing unit 110 conveys the pre-processed wire-covered conductor 18 to the wiring nozzle mechanism 1222 of the wiring unit 120 (step S102).

[0104] The wiring unit 120 controls the movement of the wiring nozzle 1222a of the wiring nozzle mechanism 1222 via the movement control unit of the two-axis moving wiring device 122. As a result, the covered wire 18 is hung on the guide pin on the pin table 123, and each of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y is formed. At both ends 18E of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y, a margin portion is formed in the bending area Arc. In this example, the winding margin portions 18Eb and 18Ec are formed (step S103).

[0105] In this case, such as Figure 8 As shown, the front ends 18Ea of the two ends 18E of the covered wires 18 of the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y, which are exposed after the peeling of the covering layer, protrude laterally (in the X-axis direction) from the pin 123 toward the substrate 11. Furthermore, the position of the front ends 18Ea of these two ends 18E is configured by the guide pin 124 to position the covered wires 18, thereby achieving the effect described above. Figure 1 As shown in the description, it is aligned in such a way that it is positioned on the corresponding terminal conductor 17 of the terminal portion 16.

[0106] After the formation of one X-axis direction loop coil 13X or Y-axis direction loop coil 13Y is completed, the sequence control unit finishes the formation of all multiple X-axis direction loop coils 13X and multiple Y-axis direction loop coils 13Y on the pin stage 123, and determines whether the sensor pattern unit 13 is completed (step S104).

[0107] In step S104, when it is determined that the sensor pattern section 13 is not completed, the sequence control section returns the process to step S101 and controls each of the plurality of X-axis direction loop coils 13X or the plurality of Y-axis direction loop coils 13Y in the same way as steps S101 to S103.

[0108] In step S104, when it is determined that the sensor pattern section 13 is complete, as follows: Figure 8 As shown, the substrate 11 is pressed onto the sensor pattern portion 13 on the pin 123 by means of an adhesive material 12, such as double-sided tape, and the sensor pattern portion 13 on the pin 123 is adhered to the substrate 11 by means of the adhesive material 12 (step S105).

[0109] In this case, such as Figure 8 As shown, a terminal portion 16 is pre-adhered to the surface 11a of the substrate 11 opposite to the pin base 123, and the terminal portion 16 has a plurality of terminal conductors 17 (in Figure 8 The text is omitted. See reference. Figure 1 In this embodiment, such as Figure 1 As shown, the substrate 11 includes a region Arb where the terminal portion 16 is formed, a bending region Arc, and a region ARa where the sensor pattern portion is formed (see reference). Figure 8 (The area indicated by the dashed line).

[0110] In this embodiment, the double-sided tape constituting the adhesive material 12 is the size corresponding to the size of the region Ara of the sensor pattern portion 13. In this example, the region ARb where the terminal portion 16 is formed and the bending region ARc are positioned without the adhesive material 12. Then, the substrate 11 is positioned such that the sensor pattern portion 13 of the pin 123 corresponds to the region Ara of the sensor pattern portion 13, and is pressed onto the pin 123 via the adhesive material 12.

[0111] The positioning of the double-sided adhesive tape 12 and the substrate 11 is achieved by pre-defined guide pins (e.g., guide pins corresponding to the four corner positions of region Ara) protruding from the pin base 123. Alternatively, the adhesive material 12 may be pre-adhered to region Ara of the substrate 11.

[0112] On the other hand, such as Figure 8 As shown, the sensor pattern section 13 on the pin 123 is such that the two ends 18E of each of the multiple X-axis direction ring coils 13X or multiple Y-axis direction ring coils 13Y are led to the bending area ARc, and the exposed front ends 18Ea of the wires at the two ends 18E are connected to each of the corresponding terminal conductors 17 of the terminal section 16, so that it protrudes from the area Ara of the sensor pattern section 13 across the bending area Arc toward the terminal section 16.

[0113] As described above, when the substrate 11 is pressed against the pin 123 with one side 11a aligned, the guide pin 124 penetrates and pierces the substrate 11, but the sensor pattern portion 13 is adhered to the area Ara of the substrate 11 by the adhesive material 12. Furthermore, as... Figure 9As shown, the front ends 18Ea of the two ends 18E of the wires 18 of each of the multiple X-axis direction loop coils 13X or multiple Y-axis direction loop coils 13Y are exposed after the outer sheath of the wires 18 is peeled off, and are located on the corresponding terminal conductors 17 of the terminal portion 16.

[0114] After the sensor pattern portion 13 is adhered to one surface 11a of the substrate 11 by the adhesive material 12, the substrate 11 is peeled off from the pin stand 123 (step S106). In this case, by using a lifting mechanism such as a robot (omitted), the substrate 11 is lifted together with portions of the intermediate plate 1232 and the peeling piece 1233 from the guide pin mounting plate 1231 and detached from the guide pin 124. Alternatively, instead of lifting the substrate 11 together with portions of the intermediate plate 1232 and the peeling piece 1233, a robot (omitted) can be used to lower the guide pin mounting plate 1231 downwards above the height of the guide pin while holding the substrate 11 together with portions of the intermediate plate 1232 and the peeling piece 1233, thereby detaching the substrate 11 from the guide pin 124.

[0115] Then, the surface and back sides of the substrate 11 with the release tab 1233, which has detached from the guide pin 124, are reversed and placed on a different mounting table (not shown) than the pin table 123. Then, the release tab 1233 is peeled off from the sensor pattern portion 13 adhered to one side 11a of the substrate 11.

[0116] As described above, a sensor pattern portion 13 is adhered to one side 11a of the substrate 11 removed from the pin table 123, and as described above, the front end portion 18Ea of the wires 18 at both ends 18E of the plurality of X-axis direction annular coils 13X or the plurality of Y-axis direction annular coils 13Y is exposed by peeling off the covering layer of the wires 18, and is located on the corresponding terminal conductor 17 of the terminal portion 16.

[0117] In this embodiment, such as Figure 9 As shown, solder 17a is pre-applied to each terminal conductor 17 of the terminal portion 16 on one side 11a of the substrate 11. Furthermore, in this embodiment, by heating a portion of the solder 17a on each terminal conductor 17 of the terminal portion 16, the solder 17a is melted, and the front ends 18Ea of the two ends 18E of the wire 18 exposed after the peeling off of the coating layer are soldered to the corresponding terminal conductor 17 of the terminal portion 16 to form an electrical connection (step S107).

[0118] Next, in this embodiment, a protective sheet 14 (see reference 14) is adhered to the sensor pattern portion 13 on region Ara of one surface 11a of the substrate 11 using an adhesive material. Figure 1Then, the substrate is covered (step S108). Next, in this embodiment, a metal sheet 19 constituting an electromagnetic shielding layer is adhered to the side of the substrate 11 opposite to one of the surfaces 11a (step S109).

[0119] Then, in this embodiment, the flexible substrate 21 is connected to the terminal portion 16, and each of the terminal conductors 17 of the terminal portion 16 is connected to the connector terminal portion of the circuit board 22 (step S110).

[0120] Therefore, the position detection sensor 1 of this embodiment can be manufactured. Then, when the position detection sensor 1 of this embodiment is arranged, for example, superimposed on the display screen of the input device and placed on the back side of the display screen, the position detection sensor 1 is arranged by bending at the bending area Arc as described above.

[0121] In addition, the adhesive material used to adhere the protective sheet 14 can be used separately from the adhesive material 12. Alternatively, the adhesive material 12 that exists in the portion other than the sensor pattern portion 13 (the portion of the sensor pattern portion 13 where there is no covering wire forming a ring coil pattern) can be used as the adhesive material to bond the protective sheet 14 to one surface 11a of the substrate 11.

[0122] As described above, the manufacturing method of the position detection sensor according to this embodiment enables the manufacture of a position detection sensor 1 in which the sensor pattern portion 13 is simply disposed on one surface 11a of a substrate using a covered wire, and the electrical connection between the terminal conductor 17 of the terminal portion 16 and each annular coil of the sensor pattern portion 13 is also easily achieved. Furthermore, by using the manufacturing method of this embodiment, the position detection sensor 1 can be mass-produced.

[0123] [Other examples of allowance portions in the Arc bend area]

[0124] In the position detection sensor 1 of the above-described embodiment, the allowance portion formed by the non-straight portion of the covering wire in the bending region Arc is achieved by forming winding allowance portions 18Eb and 18Ec at both ends 18E of the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y, respectively. However, the allowance portion formed by the non-straight portion in the bending region Arc is not limited to this example.

[0125] Figure 10 and Figure 11 This is a diagram illustrating an example of a position detection sensor 1A whose structure, consisting of a non-linear portion in the bent region Arc, differs from that of the position detection sensor 1 in the above-described embodiment. In this example, the allowance portion is achieved by forming a bent portion at both ends 18E of the loop coil 13X in the X-axis direction and the loop coil 13Y in the Y-axis direction.

[0126] Figure 10 It is the position detection sensor 1 of the above-described embodiment. Figure 1 The corresponding diagram, Figure 10 (A) is a view of the surface of the position detection sensor 1A with the sensor pattern portion 13 formed, viewed from a direction orthogonal to that surface. Figure 10 (B) is a conceptual diagram of the cross-sectional structure of the position detection sensor 1A. Additionally, Figure 11 It is the position detection sensor 1 of the above-described embodiment. Figure 6 The corresponding figures are used to illustrate the pattern generation of a Y-axis circular coil 13Y and an X-axis circular coil 13X, as well as the generation of the allowance portion on the bending region Arc.

[0127] In the position detection sensor 1A of this example described below, the same reference numerals are used for the same components as those in the position detection sensor 1 of the above embodiment, and their detailed descriptions are omitted.

[0128] like Figure 10 (A) and (B) and Figure 11 As shown, in the position detection sensor 1A of this example, the structure of the portion that generates the rectangular ring coil pattern of the Y-axis ring coil 13Y and the X-axis ring coil 13X, and the portion of the terminal portion 16 are the same as those of the position detection sensor 1 of the above embodiment.

[0129] In the position detection sensor 1A of this example, in the bending region ARc, two guide pins 124q, 124r and 124s, 124t are provided for each of the two ends 18E of the loop coil 13Y in the Y-axis direction and the loop coil 13X in the X-axis direction, forming a bend 18Ed.

[0130] And, as Figure 11 As shown, each of the two ends 18E of the Y-axis annular coil 13Y and the X-axis annular coil 13X, one end 18Es and the other end 18Et, is wrapped around these guide pins 124q, 124r and 124s, 124t, thereby forming a bent portion 18Ed in a zigzag shape in the bending region Arc.

[0131] Furthermore, in this example, such as Figure 11 As shown, for the X-axis direction annular coil 13X, guide pins 124u and 124v are also provided at positions where its two ends 18E extend from the sensor pattern portion 13 toward the bending region ARc. Other structures are configured similarly to the position detection sensor 1 of the embodiment described above.

[0132] As described above, in the bending region Arc, the bent portions 18Ed formed at both ends 18E of the Y-axis annular coil 13Y and the X-axis annular coil 13X become relaxed in the bending region Arc when pulled out from the pin 123, acting as a margin for elongation displacement in the lateral direction of the substrate 11. Therefore, as described above, when the substrate 11 is bent in the bending region Arc, it becomes an elongation margin covering the conductor 18, preventing the aforementioned adverse conditions caused by bending stress.

[0133] Furthermore, the allowance portion formed by the non-straight portion of the covering wire in the bending region Arc is not limited to the winding allowance portion or the bending portion as in the example above. As long as it functions as an allowance portion that can elongate and displace in the transverse direction of the substrate 11 when the substrate 11 is bent, it can be any shape.

[0134] <Other embodiments of the manufacturing method of the position detection sensor>

[0135] In the above-described method for manufacturing a position detection sensor, a pin stage 123 with a guide pin 124 is used, but the position detection sensor 1 or position detection sensor 1A may be formed without using the pin stage 123.

[0136] In another embodiment of the manufacturing method of the position detection sensor, a layer of adhesive material 12 is provided on one surface 11a of the substrate 11, and a terminal portion 16 and a sensor pattern portion 13 are arranged on this layer of adhesive material 12 via a wiring nozzle mechanism. In this case, the wiring nozzle mechanism of the wiring unit does not form an annular coil pattern by hanging it on a guide pin, but rather forms an annular coil pattern by pressing the covered wire 18 to the adhesive material 12 side of one surface 11a of the substrate 11 to adhere it, while moving the wiring nozzle. A known structure can be used for this purpose, and examples of its structure are omitted here. Furthermore, the covered wire 18 is also pressed in the bending region Arc, and a margin portion consisting of a non-linear portion is formed. Other structures are the same as those described in the above embodiment of the manufacturing method of the position detection sensor.

[0137] Furthermore, in other embodiments of the above-described method for manufacturing the position detection sensor, the method is described in which a layer of adhesive material is coated onto the substrate 11, and then the covered wire is adhered to the layer of adhesive material. However, instead of coating the adhesive material layer, a covered wire with an adhesive material that melts upon heating can be used as the covered wire. The adhesive material of the covered wire is melted by heat, and then it is adhered to the substrate. However, the two ends 18E in the bending region Arc are not adhered to one surface 11a of the substrate 11.

[0138] [Other implementation methods or variations]

[0139] In the position detection sensor 1 of the above-described embodiment, the terminal portion 16 is configured such that terminal conductors 17 for electrical connection to each of the plurality of electrode conductors of the sensor pattern portion 13 are formed, for example, by printing copper foil patterns, on a sheet or film substrate made of an insulating material, such as PET, and the terminal portion 16 is adhered to the substrate 11 by an adhesive material. However, the structure of the terminal portion 16 and the method of forming the terminal portion 16 on the substrate 11 described above are only examples and are not limited to the above examples. For example, the terminal conductors 17, for example, made of copper foil patterns, may be directly formed on one surface 11a of the substrate 11 by printing, thereby forming the terminal portion.

[0140] Furthermore, in the above embodiment, only the terminal conductor 17 is formed in the terminal portion 16, and the circuit board 22 is connected to the terminal portion 16 via the flexible substrate 21. However, it is also possible to provide a terminal conductor 17 in the terminal portion 16. Figure 3 The position detection circuit 200 shown can be configured with its individual circuit components, or an IC-based position detection circuit 200 can be provided. In this case, when the position detection circuit 200 is configured with its individual circuit components or an IC-based position detection circuit 200 is provided on the terminal portion 16, only terminals for input / output connection to the processing control unit 207 and terminals for power supply connection need to be provided for connecting the terminal portion 16 of the position detection sensors 1 and 1A to external devices.

[0141] Furthermore, in the above embodiment, the protective sheet 14 is adhered only to the sensor pattern portion 13. However, the protective sheet 14 may also be adhered to cover not only the sensor pattern portion 13 but also the terminal portion 16. However, in this case, the conductor portion of the terminal portion 16 used for connecting the position detection sensor 1 to an external device is not covered by the protective sheet 14.

[0142] Furthermore, in the example of the manufacturing method described above, the soldering process of the terminal conductor 17 of the terminal portion 16 to the two ends of each of the plurality of X-axis direction annular coils 13X or the plurality of Y-axis direction annular coils 13Y is performed before the protective sheet 14 is attached to the sensor pattern portion 13. However, the soldering process at the terminal portion 16 can also be performed after the protective sheet 14 is attached to the sensor pattern portion 13.

[0143] In addition, in the above embodiment, each of the terminal conductors 17 of the terminal portion 16 is electrically connected to both ends of the plurality of X-axis direction annular coils 13X or the plurality of Y-axis direction annular coils 13Y by soldering. However, when the terminal conductors 17 of the terminal portion 16 are covered with a protective sheet by adhesive material, the front ends 18Ea of the two ends 18E of the plurality of X-axis direction annular coils 13X or the plurality of Y-axis direction annular coils 13Y are pressed by the protective sheet while in contact with each of the terminal conductors 17, so the soldering process can be omitted.

[0144] Furthermore, in the above embodiments, the position detection sensor has a rectangular shape, but its shape is not limited to rectangle and can be any shape. Additionally, the substrate is planar, but can also be curved. Furthermore, the pattern shape of the loop coil is not limited to the rectangular shape of the above embodiments.

[0145] In addition, multiple loop coils can be arranged in both the X-axis and Y-axis directions, but multiple coils can also be arranged in only one direction.

[0146] Furthermore, in the above-described method for manufacturing a position detection sensor, before forming a sensor pattern portion formed by covered wires through the wiring unit 120, the preprocessing unit 110 is used to peel off the covering layer of the covered wire portion that becomes the end of the electrode conductor in a pattern matching the electrode conductor, thereby exposing the internal wires.

[0147] However, in this invention, it is sufficient to align the ends of the electrode conductor patterns with the corresponding terminal conductors of the terminal portion 16. Therefore, it is not necessary to peel off the covering layer of the wire portion covering the ends of the electrode conductor patterns before forming the sensor pattern portion using the preprocessing unit 110. For example, it is also possible to peel off the covering layer of the wire portion covering each end 18E of the patterns of the plurality of electrode conductors of the sensor pattern portion 13 after forming the sensor pattern portion 13. Alternatively, it is also possible to heat the wire portion covering the wire 18 at both ends 18E of the electrode conductor patterns while aligning with the corresponding terminal conductor 17 of the terminal portion 16, melt and remove the covering portion of the wire 18, thereby exposing the wire, and electrically connect the exposed wire to the terminal conductor 17 using solder contained in the terminal conductor 17.

[0148] Furthermore, in the above-described method for manufacturing a position detection sensor, the wiring nozzle mechanism of the wiring unit is moved in a two-dimensional plane to form a predetermined pattern shape of the covering wire into an electrode conductor. Alternatively, multiple components that form the covering wire into a predetermined pattern shape of the electrode conductor (including the allowance in the bending area Arc) can be prepared in advance, and the electrode conductor formed into the predetermined pattern can be bonded to the substrate 11 with an adhesive material.

[0149] In this case, electrode conductors formed into a predetermined pattern can be adhered one by one to the substrate 11, or multiple electrode conductors formed into a predetermined pattern (which may be all or part of the sensor pattern portion) can be bonded together in advance to the substrate 11. Furthermore, adhesive material can be pre-applied to the substrate 11, or adhesive material applied to the covering portion of the covering wire can be used (which may be a hot-melt type or applied to the covering wire).

[0150] The position detection sensor described above is a case where position detection is performed by electromagnetic induction and the electrode conductor is a ring coil pattern. However, the position detection sensor of the present invention is not limited to electromagnetic induction and can also be applied to position detection sensors using electrostatic coupling or other methods.

[0151] Label Explanation

[0152] 1, 1A…position detection sensor, 3…position indicator, 11…substrate, 12…adhesive material, 13…sensor pattern area, 14…protective sheet, 15…adhesive material, 16…terminal area, 17…terminal conductor, 18…covered wire, 18E…both ends of the loop coil (wires exposed after the cover layer is peeled off), 18Eb, 18Ec…winding allowance, 18Ed…bending area, 19…metal sheet, 21…flexible substrate, 22…circuit board, 200…position detection circuit, ARa…area of ​​the sensor pattern area, ARb…area of ​​the terminal area, ARc…bending area

Claims

1. A position detecting sensor characterized by comprising: Possessing: a substrate composed of a bendable material; a terminal portion formed on one face of the substrate and provided with a plurality of terminal conductors; and a sensor pattern portion in a region of the one face of the substrate that does not overlap the terminal portion, each of a plurality of electrode conductors composed of a covered conductor being allowed to overlap each other to become a prescribed pattern in the sensor pattern portion and being disposed by being adhered to the substrate with an adhesive material, and end portions of the covered conductor of each of the plurality of electrode conductors being disposed in a state in which they can be connected to corresponding terminal conductors of the terminal portion, a bend region being formed between a region of the terminal portion and a region of the sensor pattern portion on the one face of the substrate, the end portions of each of the plurality of electrode conductors of the sensor pattern portion and the plurality of terminal conductors of the terminal portion being electrically connected via the bend region, and each of the plurality of electrode conductors in the bend region being composed of a surplus portion composed of a non-straight portion at both end portions of each of the plurality of electrode conductors in the bend region, the surplus portion being composed of a winding surplus portion that is formed in a coil shape by winding the covered conductor of each of the electrode conductors in the bend region one or more times.

2. The position detection sensor according to claim 1, wherein the plurality of electrode conductors of the sensor pattern portion are composed of a first annular coil group and a second annular coil group, the first annular coil group being composed of a plurality of annular coils arranged at prescribed intervals in a first direction on one face of the substrate, the second annular coil group being composed of a plurality of annular coils arranged at prescribed intervals in a second direction orthogonal to the first direction on one face of the substrate, the annular coils being obtained by winding the covered conductor a prescribed number of times.

3. The position detection sensor according to claim 2, wherein one end of the annular coil of each of the first annular coil group and the second annular coil group of the sensor pattern portion is connected to a ground line in the bend region.

4. The position detection sensor according to claim 1, wherein the terminal portion is composed of a portion in which a connection flexible substrate is joined to the substrate, the connection flexible substrate being formed with a plurality of conductor patterns connected to each of the terminal conductors of the terminal portion.

5. The position detection sensor according to claim 4, wherein an end portion of the connection flexible substrate on a side opposite the terminal portion of the substrate is connected to a circuit substrate, the circuit substrate possessing another terminal portion to which the plurality of conductor patterns are connected.

6. The position detection sensor according to claim 1, wherein the plurality of electrode conductors in the bend region are not adhered to the substrate.

7. The position detection sensor according to claim 1, wherein a metal sheet is disposed on a face of the substrate opposite the one face.

8. The position detection sensor according to claim 1, wherein the base material is composed of a flexible substrate.

9. The position detection sensor according to claim 1, wherein the base material is bent at the bending region to a side opposite to the one face side, and the terminal portion is located on the side of the base material opposite to the one face side.

10. The position detection sensor according to claim 5, wherein the base material is bent at the bending region to a side opposite to the one face side, and the flexible substrate and the circuit substrate are located on the side of the base material opposite to the one face side.

11. The position detection sensor according to claim 1, further comprising a protective sheet disposed on the sensor pattern portion disposed on the adhesive material of the base material, the protective sheet being joined to the base material through the adhesive material with the sensor pattern portion interposed therebetween.

12. A method of manufacturing a position detection sensor, the method of manufacturing a position detection sensor using a base material composed of a bendable material and having a region in which a terminal portion formed with a plurality of terminal conductors is provided on one face, a region in which a sensor pattern portion is provided, and a bending region between the region of the terminal portion and the region of the sensor pattern portion, wherein the method of manufacturing a position detection sensor has: a first process in which, in the region of the sensor pattern portion, a plurality of electrode conductors composed of covered wires are allowed to overlap each other to become a prescribed pattern, and are disposed by being adhered to the base material through an adhesive material, and end portions of the electrode conductors are disposed so as to be connectable to corresponding terminal conductors of the terminal portion; a second process in which, in the region of the terminal portion, each of the terminal conductors of the terminal portion formed on the base material is electrically connected to an end portion of the electrode conductor of the sensor pattern portion; and a third process, which is performed before the first process or after the first process and before the second process, of processing each of the plurality of electrode conductors in the bending region so as to become elongatable between the terminal portion and the sensor pattern portion by providing a margin portion composed of a non-linear portion at both end portions of each of the plurality of electrode conductors in the bending region, the margin portion being composed of a winding margin portion formed in a coil shape by winding the covered wire of each of the electrode conductors in the bending region one or more times.

13. The method of manufacturing a position detection sensor according to claim 12, wherein before the first process and the third process, a fourth process of peeling off a covering layer of an end portion of the covered wire of each of the plurality of electrode conductors to expose the wire is performed, and in the second process, the plurality of terminal conductors of the terminal portion and the exposed wires of each of the plurality of electrode conductors of the sensor pattern portion are electrically connected.

14. The method of manufacturing a position detection sensor according to claim 12, wherein ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ In the first process, a plurality of electrode conductors composed of the covered wire are arranged in a manner allowing mutual overlapping to become the prescribed pattern using guide pins on a pin mounting plate provided with the guide pins, and end portions of the electrode conductors are arranged in a manner capable of being connected to corresponding terminal conductors of the terminal portion by the guide pins, thereby arranging the sensor pattern portion, In the third process, the electrode conductors are bent by guide pins on the pin mounting plate arranged at the bending region when the electrode conductors are erected between the terminal portion and the sensor pattern portion, In the second process, after the sensor pattern portion is adhered to the base material, the base material to which the sensor pattern portion is adhered is separated from the pin mounting plate.

15. The manufacturing method of a position detection sensor according to claim 12, wherein In the first process, a plurality of electrode conductors composed of the covered wire are arranged in a manner allowing mutual overlapping to become the prescribed pattern using guide pins on a pin mounting plate provided with the guide pins, and end portions of the electrode conductors are arranged in a manner capable of being connected to corresponding terminal conductors of the terminal portion by the guide pins, thereby arranging the sensor pattern portion, In the third process, the electrode conductors are bent by guide pins on the pin mounting plate arranged at the bending region when the electrode conductors are erected between the terminal portion and the sensor pattern portion, In the second process, after the sensor pattern portion is adhered to the base material, the base material to which the sensor pattern portion is adhered is separated from the pin mounting plate.

16. The manufacturing method of a position detection sensor according to claim 12, wherein The plurality of electrode conductors of the sensor pattern portion are composed of a first annular coil group and a second annular coil group, the first annular coil group is formed by arranging a plurality of annular coils at a prescribed interval in a first direction on one face of the base material, the second annular coil group is formed by arranging a plurality of the annular coils at a prescribed interval in a second direction orthogonal to the first direction on one face of the base material, and the annular coil is obtained by winding the covered wire a prescribed number of times.

Images