Substrate conveying device and substrate conveying method

Abstract

A substrate conveyance device and a substrate conveyance method are provided. In the substrate conveyance device, a mobile block provided in a conveyance region of a substrate includes a moving surface and a plurality of first magnets capable of changing a state of a magnetic field, and a substrate conveyance module that holds the substrate includes a second magnet that is acted on by a magnetic force between the second magnet and the magnetic field of the first magnets, and the substrate conveyance module is configured to be movable along the moving surface in a state of floating from the moving surface. A detection unit detects an index value corresponding to a size of deviation of an actual movement path of the substrate conveyance module from a set path, and a correction parameter calculation unit calculates a correction parameter in such a manner that the size of the deviation is reduced. In conveyance of the substrate along the set path thereafter, a conveyance control unit performs correction of changing the state of the magnetic field for moving the substrate conveyance module based on the correction parameter.

Description

Technical Field

[0001] This disclosure relates to a substrate conveying apparatus and a substrate conveying method. Background Technology

[0002] For example, in an apparatus that processes a semiconductor wafer (hereinafter also referred to as a "wafer") that serves as a substrate, the wafer is transported between a carrier containing the wafer and a wafer processing chamber for performing the processing. Various wafer transport mechanisms with different structures are used when transporting the wafer.

[0003] For example, Patent Document 1 describes a substrate transport system in which a first planar motor and a second planar motor disposed on a vertically movable first elevator are made coplanar, allowing a substrate carrier to levitate and move between these planar motors. According to Patent Document 1, the substrate transport system is configured to allow the substrate carrier to move smoothly between the two planar motors by adjusting the arrangement of multiple coils disposed on the first and second planar motors.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Publication No. 2018-504784 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] This disclosure provides a technique for enabling a substrate transport module to move more accurately along a pre-set path.

[0009] Solution for solving the problem

[0010] This disclosure discloses a substrate transport apparatus for transporting a substrate to a substrate processing chamber for processing a substrate. The substrate transport apparatus includes: a moving block having a moving surface and a plurality of first magnets disposed within a transport area of ​​the substrate, extending from a junction point with the outside to a processing position of the substrate within the substrate processing chamber; the plurality of first magnets being configured to change the state of their magnetic fields; and a substrate transport module holding the substrate, the substrate transport module including a second magnet subjected to a magnetic force acting on at least one of a repulsive force and an attractive force between the magnetic fields of the second magnet and the first magnets; the substrate transport module being configured to use the magnetic force to transport the substrate from the outside to the processing position of the substrate within the substrate processing chamber. The substrate transport module moves along the moving surface while the moving surface is floating; a transport control unit controls the magnetic field formed by the plurality of first magnets to move the substrate transport module along a preset path; a detection unit detects an index value corresponding to the magnitude of the deviation of the actual moving path of the substrate transport module, which moves along the moving surface under the control of the magnetic field by the transport control unit, from the preset path; and a calculation unit calculates a correction parameter for correcting the magnetic force acting on the second magnet based on the index value in a manner that reduces the magnitude of the deviation, wherein, in subsequent transport of the substrate along the preset path, the transport control unit performs correction based on the correction parameter to change the state of the magnetic field.

[0011] The effects of the invention

[0012] According to this disclosure, the substrate transport module can be made to move more accurately along a pre-set path. Attached Figure Description

[0013] Figure 1 This is a top view of the wafer processing system involved in the implementation method.

[0014] Figure 2 This is a top view of the transport module.

[0015] Figure 3 It is a perspective 3D view of the transport module and blocks.

[0016] Figure 4 This is a block diagram involving the correction mechanism for the movement path of the conveying module.

[0017] Figure 5 This is a top view showing an example of the movement path of the transport module.

[0018] Figure 6 This is a side view of the wafer transport module.

[0019] Figure 7This is an explanatory diagram showing the relationship between deviation from the moving path and the speed and acceleration of the conveying module.

[0020] Figure 8 This is an explanatory diagram illustrating an example of how the correction parameters are calculated. Detailed Implementation

[0021] Below, refer to Figure 1 The overall structure of a wafer processing system 100 having a “substrate transport apparatus” according to an embodiment of the present disclosure will be described.

[0022] exist Figure 1 The diagram shows a multi-chamber type wafer processing system 100 having multiple wafer processing chambers 110. The wafer processing chambers 110 correspond to substrate processing chambers for processing wafers W.

[0023] like Figure 1 As shown, the wafer processing system 100 includes a loading port 141, an atmospheric transport chamber 140, a loading interlock chamber 130, a vacuum transport chamber 120, and multiple wafer processing chambers 110. In the following description, the direction in which the loading port 141 is provided is defined as the front side of the wafer processing system 100.

[0024] In the wafer processing system 100, the loading port 141, the atmospheric transport chamber 140, the loading interlock chamber 130, and the vacuum transport chamber 120 are arranged in the horizontal direction from the front side in the order described. In addition, when viewed from the front side, a plurality of wafer processing chambers 110 are arranged side by side on the left and right sides of the vacuum transport chamber 120.

[0025] Loading ports 141 are configured as a mounting stage for placing a carrier C, which is used to accommodate a wafer W to be processed. Viewed from the front, four loading ports 141 are arranged in a left-right direction. For example, a FOUP (Front Opening Unified Pod) can be used as the carrier C.

[0026] The atmospheric transport chamber 140 is equipped with an atmospheric pressure (normal pressure) atmosphere, for example, forming a downward flow of clean air. Furthermore, a wafer transport mechanism 142 for transporting wafer W is provided inside the atmospheric transport chamber 140. The wafer transport mechanism 142 transports wafer W between the carrier C and the loading interlock chamber 130. Additionally, an alignment chamber 150 for aligning wafer W is provided, for example, on the left side of the atmospheric transport chamber 140.

[0027] Between the vacuum transfer chamber 120 and the atmospheric transfer chamber 140, a plurality of loading interlock chambers 130 are arranged in a left-right direction. Each loading interlock chamber 130 has a lifting pin 131 that lifts and holds the wafer W from below. In this example, three lifting pins 131 are evenly spaced circumferentially, and these lifting pins 131 are configured to move freely up and down. The loading interlock chambers 130 are configured to switch between atmospheric and vacuum atmospheres.

[0028] The loading interlock chamber 130 is connected to the atmospheric transport chamber 140 via a gate valve 133. Additionally, the loading interlock chamber 130 is connected to the vacuum transport chamber 120 via a gate valve 132.

[0029] The vacuum transfer chamber 120 is depressurized to a vacuum atmosphere via a vacuum exhaust mechanism (not shown). Figure 1 In the example shown, the vacuum transport chamber 120, which transports wafer W under a vacuum atmosphere, is constructed of a rectangular shell that is elongated in the front-to-back direction and viewed from above. In this example's wafer processing system 100, two wafer processing chambers 110 are respectively provided on the left and right sidewalls of the vacuum transport chamber 120, for a total of four wafer processing chambers 110. Viewed from the near-front side... Figure 1 When describing the interior of the vacuum transfer chamber 120, if it is divided into two regions, a front part and a rear part, the wafer processing chamber 110 is configured to face each other in a manner that sandwiches each region from the left and right.

[0030] An opening is formed in the side wall of the vacuum transfer chamber 120 that connects to each wafer processing chamber 110 for transferring wafers W into and out of the wafer processing chamber 110. A gate valve 121 configured to open and close freely is provided in the opening.

[0031] Each wafer processing chamber 110 is connected to a vacuum transfer chamber 120 via a gate valve 121. With each wafer processing chamber 110 depressurized to a vacuum atmosphere by a vacuum exhaust mechanism (not shown), a wafer W is placed on a mounting stage 111 located inside each wafer processing chamber 110, and a prescribed process is performed on the wafer W. The mounting area of ​​the wafer W on the mounting stage 111 corresponds to the processing position of the wafer W. Each wafer processing chamber 110 has lifting pins 112 that lift and hold the wafer W from below. In this example, three lifting pins 112 are evenly spaced circumferentially, and the lifting pins 112 are configured to move freely up and down.

[0032] Examples of processing performed on wafer W include etching, film formation, cleaning, and ashing.

[0033] A heater (not shown) is provided on the stage 111 for heating the wafer W to a preset temperature, for example. If the processing of the wafer W is performed using a processing gas, a processing gas supply unit (not shown) consisting of a spray head or the like is provided in the wafer processing chamber 110. Additionally, a plasma forming mechanism for plasma-generating the processing gas can be provided in the wafer processing chamber 110.

[0034] A plurality of transport modules 20 configured as square plates are housed within a vacuum transport chamber 120. Each transport module 20 is configured to move within the vacuum transport chamber 120 by magnetic levitation. The transport module 20 corresponds to the substrate transport module of this embodiment.

[0035] In the wafer processing system 100 of this example, the wafer W is transported between the loading interlock chamber 130 and each wafer processing chamber 110 using the transport module 20.

[0036] The wafer processing system 100 includes a control unit 5. The control unit 5 is a computer equipped with a CPU and a storage unit, and it controls various parts of the wafer processing system 100. The storage unit stores programs containing groups of steps (commands) for controlling the operation of the transfer module 20, the wafer processing chamber 110, etc. These programs are stored, for example, on storage media such as hard disks, optical disks, magneto-optical disks, or memory cards, and are installed from these storage media onto the computer.

[0037] Below, refer to Figure 2 , Figure 3 The structure of the equipment related to the transport of wafer W using the transport module 20 will be explained.

[0038] The transport module 20 includes a mounting stage 2, which serves as a substrate holding part, for placing and holding a wafer W with a diameter of 300 mm. For example, the mounting stage 2 is formed into a flat square plate with a side length of more than 300 mm.

[0039] The transport module 20 enters the wafer processing chamber 110 and the loading interlock chamber 130 to transfer the wafer W between itself and the lifting pins 112 and 131. A slit 21 is formed in the transport module 20 to prevent interference with the lifting pins 112 and 131 during the transfer of the wafer W. The lifting pins 112 and 131 hold the wafer W while protruding from the bottom surface of the wafer processing chamber 110 and the loading interlock chamber 130. The slit 21 is formed along the track that the lifting pins 112 and 131 travel when the stage 2 enters and exits from a position below the wafer W held by the lifting pins 112 and 131. Furthermore, the slit 21 is configured to reverse the entry direction towards the lower position of the wafer W by 180°. With this structure, the transport module 20 and the wafer W can be arranged vertically in a center-aligned manner without interference between the transport module 20 and the lifting pins 112 and 131.

[0040] like Figure 3 As schematically shown, multiple blocks (moving blocks) 10 are provided on the bottom surface of the loading interlock chamber 130, the vacuum transport chamber 120, and the wafer processing chamber 110. These blocks 10 are located within the transport area of ​​the wafer W, extending from the junction position (the configuration position of the lifting pin 131) between the wafer W and the external atmospheric transport chamber 140 to the processing position of the wafer W within the wafer processing chamber 110.

[0041] Multiple movable surface coils 11 are arranged inside each block 10. The movable surface coils 11 generate magnetic fields by being powered by the power supply unit 53, which will be described later. The movable surface coils 11 correspond to the first magnet of this embodiment.

[0042] On the other hand, multiple module-side magnets 23, such as permanent magnets, are arranged inside the transport module 20. A repulsive force (magnetic force) acts between the module-side magnets 23 and the magnetic field generated by the moving surface-side coils 11. Through this action, the transport module 20 can be magnetically levitated (magnetically floated) relative to the moving surface on the upper surface side of the block 10. Furthermore, the block 10 can adjust the position and intensity of the generated magnetic force via the multiple moving surface-side coils 11, thereby changing the state of the magnetic field. By controlling this magnetic field, the transport module 20 can move in a desired direction on the moving surface, the levitation distance from the moving surface can be adjusted, and the orientation of the transport module 20 can be changed.

[0043] The module-side magnet 23 provided in the conveying module 20 is equivalent to the second magnet in this embodiment. Furthermore, the multiple module-side magnets 23 can be constructed by coils that function as electromagnets and are powered by a battery located within the conveying module 20, or by using both permanent magnets and coils.

[0044] In the wafer processing system 100 of this example, Figure 3 The block 10 and the transport module 20 shown schematically constitute a device for transporting wafer W (wafer transport device 101).

[0045] Figure 4 This is a block diagram showing the electrical structure involved in the wafer transport apparatus 101. DC power is supplied from the power supply unit 53 to each of the moving-side coils 11 provided in block 10. The power supply unit 53 is connected via bus 51 to the previously described control unit 5, which controls the entire wafer processing system 100. The control unit 5 functions as a transport control unit 501, which controls the magnetic field formed by the moving-side coils 11 provided in block 10, thereby controlling the operation of the transport module 20.

[0046] The magnetic field of the moving surface coil 11 is controlled by setting the selection of the moving surface coil 11 as the object to which power is supplied, the power supply amount to the selected moving surface coil 11, and the switching of the power supply direction (switching of magnetic poles). Moreover, by adjusting these operating variables, the conveying module 20 can be moved along a preset path.

[0047] The control unit 5 has the function of a transport control unit 501, which controls the magnetic field formed by the moving surface coil 11 in the wafer transport device 101 so that the transport module 20 moves along a preset path.

[0048] For example, when the carrier C is placed on the loading port 141, the processing process that specifies the processing content for the multiple wafers W housed inside the carrier C is read out.

[0049] Based on the processing process, the transport control unit 501 determines the wafer processing chamber 110 capable of performing the processes specified in the processing process and creates a transport schedule for the plurality of wafers W. The transport schedule includes, for example, information on the loading interlock chamber 130 used when transporting wafers W removed from the carrier C into and out of the vacuum transport chamber 120, and information on the wafer processing chamber 110 for processing the wafers W. Furthermore, the transport schedule includes information on the transport module 20 used when transporting wafers W within the vacuum transport chamber 120, and information on the path (set path) used when transporting wafers W between the loading interlock chamber 130 and the wafer processing chamber 110.

[0050] The transport control unit 501 controls the supply of power to each moving surface coil 11 located in block 10 based on the transport schedule described above. As a result, the magnetic field formed by the moving surface coil 11 can be adjusted. Furthermore, by changing the magnetic force applied to the module-side magnet 23 of the transport module 20, the transport module 20 can be moved along a preset path.

[0051] In the wafer transport apparatus 101 with the above-described structure, the power supply control for each moving surface coil 11 is performed by the transport control unit 501. If a magnetic force can be applied to the transport module 20 according to the design, the transport module 20 can be moved accurately along the set path. On the other hand, the configuration positions of the moving surface coils 11 in the block 10, the module-side magnets 23 in the transport module 20, and the detectors (e.g., Hall sensors) used to detect the position of the transport module 20 are sometimes configured to deviate from the design positions within tolerance. The configuration positions of the numerous blocks 10 located on the bottom surface of the loading interlock chamber 130, the vacuum transport chamber 120, and the wafer processing chamber 110 are also the same. In addition, the uniformity of the winding of each moving surface coil 11 and the magnetic force of the module-side magnets 23 also vary between each device.

[0052] The inventors of this application discovered that, due to the various errors mentioned above, etc., when it is desired to make the conveying module 20 move along... Figure 5 , Figure 6 When the set path 40, indicated by the dashed line, moves, it sometimes actually moves by vibrating along a movement path 41 that deviates from the set path 40. In order to achieve a high speed of movement of the conveying module 20, it is preferable to minimize such vibration as much as possible to avoid the conveying module 20 coming into contact with other conveying modules 20 or equipment during movement.

[0053] Therefore, the wafer transport apparatus 101 of this disclosure includes a mechanism for detecting the magnitude of the deviation of the actual movement path 41 of the transport module 20 moving along the moving surface of the block 10 from the set path 40 and correcting the deviation.

[0054] Regarding the mechanism for correcting deviations, the conveying module 20 includes a known accelerometer 22, which detects an index value corresponding to the magnitude of the force acting on the conveying module 20. The accelerometer 22 has the function of detecting the direction and magnitude of the acceleration of the moving conveying module 20. The accelerometer 22 corresponds to the detection unit in this example.

[0055] In this example, the accelerometer 22 can detect the sub-coordinate system set for each conveying module 20. Figure 2 , Figure 3 , Figure 5 , Figure 6The accelerations in each direction of the X'-Y'-Z' orthogonal coordinate system are recorded in the text.

[0056] Furthermore, the detection unit provided in the conveying module 20 can be composed of a torque sensor for detecting the angular acceleration applied to the conveying module 20. In this case, by decomposing the torque applied to the conveying module 20 into directions along the sub-coordinate system, the magnitude of the acceleration acting in each direction can be determined.

[0057] The acceleration detected by the accelerometer 22 and torque sensor is increased or decreased accordingly, corresponding to the force acting on the moving conveying module 20. Furthermore, if using... Figure 7 As will be described later, the acceleration in the specified direction of the conveying module 20 is an index value corresponding to the magnitude of the deviation of the actual moving path 41 of the conveying module 20 from the set path 40.

[0058] Information indicating the magnitude of acceleration in each direction detected by accelerometer 22 is output to communication unit 52 via wireless communication, for example. Figure 4 ).

[0059] And, as Figure 4 As shown, the control unit 5 includes a correction parameter calculation unit 502. The correction parameter calculation unit 502 calculates correction parameters that are used to correct the magnetic force acting on the module-side magnet 23 of the transport module 20 in a way that reduces the magnitude of the previously described deviation during the transport of the wafer W along the set path 40. Based on these correction parameters, the control of the magnetic field by the transport control unit 501 is corrected. The specific method of correction will be described later in the explanation of the operation of the wafer processing system 100 (wafer transport device 101).

[0060] Regarding the wafer processing system 100 having the structure described above, an example of the operation of using the transfer module 20 to transfer the wafer W and processing the wafer W in the wafer processing chamber 110 will be described.

[0061] First, when the carrier C, which houses the wafer W to be processed, is placed in the loading port 141, the processing procedure set for the wafer W within the carrier C is read out, and a transport schedule for each wafer W is created. Based on this transport schedule, the wafer W transport operation described below is performed.

[0062] The wafer W housed in the carrier C is removed by the wafer transport mechanism 142 within the atmospheric transport chamber 140. Next, the wafer W is transported to the alignment chamber 150 for alignment. Furthermore, when the wafer W is removed from the alignment chamber 150 by the wafer transport mechanism 142, the gate valve 133 of the loading interlock chamber 130 selected in the transport schedule is opened.

[0063] Next, the wafer transport mechanism 142 enters the loading interlock chamber 130, where the gate valve 133 has been opened, and lifts and receives the wafer W using the lifting pin 131 located in the loading interlock chamber 130. Afterwards, when the wafer transport mechanism 142 retracts from the loading interlock chamber 130, the gate valve 133 is closed. Furthermore, the atmosphere inside the loading interlock chamber 130 is switched from atmospheric pressure to a vacuum atmosphere.

[0064] After creating a vacuum atmosphere within the loading interlock chamber 130, the gate valve 132 on the vacuum transfer chamber 120 side is opened. Then, the transfer module 20 selected in the transfer schedule is magnetically levitated, and it enters the loading interlock chamber 130 from the vacuum transfer chamber 120. Next, the transfer module 20 is positioned below the wafer W supported by the lifting pin 131, and the lifting pin 131 is lowered to transfer the wafer W to the transfer module 20. Afterward, the transfer module 20, holding the wafer W, exits the loading interlock chamber 130.

[0065] The transfer module 20, returning to the vacuum transfer chamber 120, moves within the chamber in a magnetically levitated state. Furthermore, it moves toward the wafer processing chamber 110 selected from the four wafer processing chambers 110 in the transfer schedule. At this time, the transfer module 20 moves along a pre-set path based on the transfer schedule.

[0066] When the transport module 20 reaches a position facing the selected wafer processing chamber 110, it opens the gate valve 121 of the wafer processing chamber 110. The transport module 20 enters the wafer processing chamber 110 in a magnetically levitated state and moves towards the configuration area of ​​the lifting pin 112. Furthermore, by raising the lifting pin 112, the wafer W held by the transport module 20 is lifted from below and received.

[0067] After the transfer module 20, which has received wafer W, retracts from the wafer processing chamber 110, the gate valve 121 is closed. Meanwhile, inside the wafer processing chamber 110, the lifting pin 112 is lowered to transfer wafer W to the mounting stage 111. The wafer W, mounted on the mounting stage 111, is heated by a heater, and processing gas is supplied via a processing gas supply unit. Furthermore, the processing gas is plasmaized as needed, thereby performing the prescribed processing.

[0068] The wafer W is processed during the pre-set period, after which heating of the wafer W is stopped and the supply of processing gas is stopped. Alternatively, cooling gas can be supplied to the wafer processing chamber 110 as needed to cool the wafer W. Then, following the reverse process of loading, the transfer module 20 enters the wafer processing chamber 110, and the wafer W is returned from the wafer processing chamber 110 to the loading interlock chamber 130 via the vacuum transfer chamber 120.

[0069] Furthermore, after switching the atmosphere of the loading interlock chamber 130 to atmospheric pressure, the wafer W in the loading interlock chamber 130 is taken out by the wafer transport mechanism 142 on the atmospheric transport chamber 140 side and sent back to the designated carrier C.

[0070] Reference Figures 5-8 This section describes an example of a method for detecting and correcting the deviation of the actual moving path 41 of the transport module 20 from the set path 40 during the processing of the wafer W described above.

[0071] Figure 5 It is Figure 1 The vacuum transfer chamber 120 described in the wafer processing system 100 is shown in a top view with an enlarged view. A set path 40, shown by dashed lines, is set within the vacuum transfer chamber 120 for the transfer module 20, which is configured such that the opening of the slit 21 faces the loading interlock chamber 130.

[0072] Figure 5 The illustrated path 40 is set as follows: Starting from position P1 opposite the centrally located loading interlock chamber 130, the vehicle travels straight backwards, then changes direction to the left at position P2 where the wafer processing chamber 110 (gate valve 121) is located on the rear side. After moving to position P3 opposite the rear left-side wafer processing chamber 110, the transport module 20 is then... Figure 6 The central axis, indicated by the single-dotted line, is rotated 90° to the right, thereby stopping the slit 21 so that its opening faces the wafer processing chamber 110.

[0073] Regarding the aforementioned path 40, it is actually based on Figure 5 The solid arrow in the diagram indicates the movement path 41, which moves while vibrating left and right relative to the direction of travel. Furthermore, for simplicity, the conveying module 20 is not considered... Figure 6 The solid arrows in the image indicate the vertical vibration and the rotational motion of the main body of the conveying module 20 around the X'-Y'-Z' axes.

[0074] Figure 7 The horizontal axis of (a) to (e) represents the achievement Figure 5 The positions P1~P2~P3 are set on the path 40. Figure 7 The vertical axis of (a) represents the deviation Δg of the actual movement path 41 from the set path 40 in a direction orthogonal to the direction of travel. Additionally, Figure 7 The vertical axis of (b) represents the velocity v in the X' axis direction of the sub-coordinate set for the conveying module 20. X’ , Figure 7 The vertical axis of (c) represents the acceleration a in the X' direction. X’ .and, Figure 7 The vertical axis of (d) represents the velocity v in the Y' axis direction of the sub-coordinate. Y’ , Figure 7 The vertical axis of (e) represents the acceleration a in the Y' direction. Y’ Furthermore, the rotation of the conveying module 20 at position P3 is not shown in these figures.

[0075] according to Figure 7 (b) During the movement from position P1 to P2, in the direction of travel (X' axis), the conveying module 20 accelerates at a roughly constant acceleration and then moves at a constant speed, and decelerates at an acceleration of approximately the same magnitude as the acceleration during acceleration. As a result, as... Figure 7 As shown in (c), the acceleration that the conveying module 20 experiences when it accelerates and decelerates in the direction of travel is detected in the acceleration sensor 22 installed in the conveying module 20.

[0076] On the other hand, such as Figure 7 As shown in (d), the deviation of the actual moving path 41 from the set path 40 manifests as a change in the velocity of the conveying module 20 in the direction intersecting the travel direction (Y' axis direction). Furthermore, this velocity change is detected by the acceleration sensor 22 as a change in acceleration in the direction intersecting the travel direction. Figure 7 (e)).

[0077] Furthermore, during the movement from position P2 to P3, the acceleration sensor 22 detects the acceleration and deceleration of the conveying module 20 when it accelerates and decelerates in the direction of travel (Y' axis). Figure 7 (e)). Furthermore, the effect of deviation from the actual movement path 41 is detected by the acceleration sensor 22 as a change in acceleration in the direction intersecting the direction of travel (X' axis direction). Figure 7 (c)).

[0078] In this way, during linear movement, the deviation of the actual movement path 41 from the set path 40 can be detected by the acceleration sensor 22 as a change in acceleration in a direction intersecting the direction of travel. This acceleration is an index value representing the magnitude of the force, i.e., the external force, acting in a direction intersecting the direction along the set path 40. As already described, this external force includes forces generated by various error factors of the equipment constituting block 10 and the conveying module 20.

[0079] Therefore, in this example, the correction parameter calculation unit 502 calculates the external force F (=ma) based on the weight m of the transport module 20 holding the wafer W and the acceleration a in the direction intersecting the travel direction. Furthermore, the correction parameter calculation unit 502 calculates a correction force corresponding to the magnitude of the external force as a correction parameter and outputs it to the control unit 501. The transport control unit 501 corrects the state of the magnetic field formed by the moving surface coil 11 by increasing the magnetic force generated by the module-side magnet 23 of the transport module 20 by an amount corresponding to the correction force, in a direction that counteracts the aforementioned deviation, compared to the magnetic force when the aforementioned acceleration a was obtained.

[0080] Specifically, compared to the magnetic field formed when the conveying module 20 moves along the set path 40 without the influence of external forces, a magnetic field is formed at each position on the moving path 41, increasing the magnetic force generated by the module-side magnet 23 in the direction of canceling the deviation by an amount corresponding to the corrective force. The magnetic field is adjusted by regulating the various operating variables described above (selection of the moving surface-side coil 11 as the object of power supply, power supply quantity, switching of power supply direction, etc.).

[0081] Figure 8 This is an example of a method for calculating correction parameters. Figure 8 The horizontal axis represents the positions along the set path 40 of the conveying module 20. Additionally, Figure 8 The vertical axis of (a) represents the acceleration 'a' acting in the direction intersecting the direction of travel of the set path 40. Figure 8 (b) represents the corrective force F'.

[0082] exist Figure 8 In example (a), determine the locations Q1 to Q4 where the direction of acceleration a (the direction of the external force) changes, and calculate the average acceleration a during the period passing through these locations. av (1)~a av (3). Moreover, based on these average accelerations a av The corrective force F' (=ma) acting in the direction of offsetting the deviation is calculated based on the weight m of the conveying module 20. av Alternatively, it could be compared to... Figure 8 The example shown uses short position intervals and time intervals to calculate the average value of acceleration a, thereby improving the resolution of the correction force F'.

[0083] The calculation of the correction parameters (correction force) and the correction of changing the state of the magnetic field formed by the moving surface coil 11, as described above, can also be applied to the use of... Figure 5 , Figure 7 The cases other than the deviations in the X' and Y' axes of the secondary coordinates have been explained.

[0084] For example, targeting Figure 6 The deviation of the movement path 41 in the Z' axis direction shown can also be corrected by calculating the correction parameters based on the change in acceleration in the Z' axis direction that intersects the travel direction of the conveying module 20.

[0085] Furthermore, correction parameters can be calculated for changes in the moving speed along the travel direction of the conveying module 20, such as longitudinal waves. For example, the difference Δa between the change in acceleration when accelerating and decelerating along the set path 40 according to the settings and the change in acceleration detected in the actual moving path 41 can be obtained. Moreover, a correction force F' (=mΔa) is calculated based on this difference and the weight m of the conveying module 20.

[0086] Furthermore, the above method can be applied not only to the case where the conveying module 20 moves in a straight line, but also to the case of curved movement to correct deviations. In this case, the change in acceleration acting in the normal direction orthogonal to the tangent direction of the curve is detected at each position of the set path 40 of the curve. However, in the case of curved movement, the acceleration acting in the normal direction is also detected in the conveying module 20 moving along the set path 40.

[0087] Therefore, at each position along the set path 40, the difference Δa between the acceleration detected by the accelerometer 22 and the acceleration that would be detected if the conveying module 20 had moved along the set path 40 is calculated. Furthermore, based on this difference and the weight m of the conveying module 20, a correction force F' (=mΔa) is calculated.

[0088] Furthermore, regarding the winding of the conveying module 20 Figure 6 The rotation of each sub-axis shown can also detect the magnitude of the deviation of the actual movement path 41 of the conveying module 20 from the set path 40 related to the rotation, and correct the deviation. Examples of the set path 40 can be listed below. Figure 5 The conveying module 20 rotates around a 90° track R around position P3. In this case, for example, multiple acceleration sensors 22 are set at different positions in block 10. Based on the magnitude and direction of the acceleration detected by each acceleration sensor 22, the position of the rotation axis of the conveying module 20 and the angular velocity around the rotation axis can be determined.

[0089] Furthermore, the angular acceleration in the direction intersecting the set path 40 (in the case of the rotating track R, the angular acceleration involved in the rotational motion around the X' and Y' axes orthogonal to the Z' axis) detected by multiple acceleration sensors 22 is used as an index value. Moreover, the correction parameter calculation unit 502 can calculate the magnitude N (=Iα) of the correction torque N used to correct the deviation based on the angular acceleration α in the intersecting direction, the inertial torque I determined according to the shape of the conveying module 20, the density distribution of the constituent components, and the position of the rotation axis.

[0090] The transport control unit 501 corrects the state of the magnetic field formed by the moving surface coil 11 by changing the magnetic force generated by the module-side magnet 23 in a manner that increases the magnetic force in the direction of offsetting the aforementioned deviation compared to the magnetic force when the aforementioned angular acceleration α is obtained.

[0091] Next, an example of timing for implementing the above-described correction will be explained. First, an example can be given of setting a trial movement period, which is a period during which only the movement of the transport module 20 along the set path 40 is performed before the processing of wafer W begins in the wafer processing chamber 110. During the trial movement period, the transport module 20 can move along the set path 40 while actually transporting wafer W.

[0092] In this case, the movement of the conveying module 20 during the trial movement is assessed by detecting index values ​​(acceleration, angular acceleration) using the accelerometer 22. The correction parameter calculation unit 502 calculates correction parameters based on the index values ​​detected during the trial movement, using the method described above.

[0093] Furthermore, during the processing, the transport control unit 501 corrects the state of the magnetic field by changing the state of the magnetic field based on the calculated correction parameters in a manner that has been described for deviation correction. The processing period is the period during which the trial movement period ends and the wafer W is processed in the wafer processing chamber 110.

[0094] Secondly, an example can be illustrated as follows: An index value is detected by the accelerometer 22 through a movement action that moves the transport module 20 along a set path 40 during processing, wherein the processing period is during the processing of wafer W in the wafer processing chamber 110. The correction parameter calculation unit 502 calculates a correction parameter based on the index value detected in this movement action using the method described above. In this case, the index value can be detected in multiple movement actions, and the average of these index values ​​can be used as the index value for the single movement action.

[0095] In other movement actions that move the conveying module 20 along the same set path 40 after the aforementioned movement action, the correction parameter calculation unit 502 corrects the state of the magnetic field by changing the state of the magnetic field based on the calculated correction parameters in a manner that has been described for deviation correction.

[0096] According to the wafer transport apparatus 101 of this embodiment, the transport module 20 can move more accurately along a preset path. As a result, contact between the transport module 20 and other transport modules 20 or equipment can be avoided when the transport module 20 is moved at high speed.

[0097] Here, the index value corresponding to the magnitude of the force acting on the conveying module 20 is not limited to detecting the magnitude of the acceleration of the conveying module 20 moving in a direction that intersects with the direction along the set path 40.

[0098] For example, the deviation of the actual movement path 41 from the set path 40 can be detected and set as an index value. In this case, the sensor constituting the detection unit can be a camera that captures the position of the transport module 20 within the moving surface, or a Hall sensor that detects the position of the transport module 20 from the block 10 side. Alternatively, the detection unit can be composed of a laser displacement meter that detects the position of the transport module 20 based on the distance from the laser beam's irradiation position. By detecting the position of the transport module 20, the actual movement path 41 can be determined, and the deviation from the set path 40 can be calculated.

[0099] At this time, the transport control unit 501 calculates the acceleration, which is the second-order time derivative of the detected deviation amplitude over time. Based on this acceleration, the transport control unit 501 calculates a correction force corresponding to the magnitude of the external force acting on the transport module 20 along the intersection direction and sets it as a correction parameter. Furthermore, the correction parameter calculation unit 502 performs the aforementioned correction by increasing the magnetic force acting on the module-side magnet 23 by an amount corresponding to the correction force in the direction of offsetting the deviation, compared to the magnetic force at the time the deviation amplitude was obtained.

[0100] Here, the conveying module 20 can also be configured to move in a suspended state by changing the distance from the moving surface of the block 10. In this case, the various index values ​​described above can be detected multiple times by changing the distance of the conveying module 20 from the moving surface.

[0101] The correction parameter calculation unit 502 can estimate a preset index value for the distance from the moving surface by interpolation or extrapolation based on changes in these index values ​​detected under different distances from the moving surface. Based on this estimation result, the correction parameter calculation unit 502 can calculate a correction parameter corresponding to the preset distance from the moving surface.

[0102] Furthermore, the transport module 20 can also be configured to transport objects with a weight different from that of the wafer W, such as replacement parts within the wafer processing chamber 110, in addition to transporting the wafer W as described above. In this case, the load applied to the transport module 20 can be varied to perform the detection of the various index values ​​described above multiple times.

[0103] The correction parameter calculation unit 502 can estimate the weight index value of the transported object transported by the transport module 20 by interpolation or extrapolation based on the changes in these index values ​​detected under different load conditions. Based on this estimation result, the correction parameter calculation unit 502 can calculate correction parameters corresponding to the weight of the transported object transported by the transport module 20.

[0104] In use Figures 1-6 In the described embodiment, a structural example is illustrated where the block 10 is arranged on the bottom surface of the loading interlock chamber 130, the vacuum transfer chamber 120, and the wafer processing chamber 110, and the transfer module 20 is magnetically levitated on a horizontal moving surface. However, the moving surface is not limited to the horizontal case; it can also be an inclined surface or a vertical surface. In this case, the accelerometer 22 of the transfer module 20 is subjected to a magnetic force acting on at least one of the repulsive and attractive forces between the magnetic field of the moving surface-side coil 11 and the block 10 side, thereby moving in a state of levitation from the moving surface.

[0105] Furthermore, regarding the conveying module 20 that moves in these inclined and vertical planes, the state of the magnetic field formed by the moving surface side coil 11 can be corrected based on the detection of indicators such as the acceleration of the conveying module 20 and the deviation from the set path 40 by the detection unit, the calculation of correction parameters by the correction parameter calculation unit 502, and the correction parameters of the conveying control unit 501.

[0106] Furthermore, the structure of the conveying module 20, to which the technology of this disclosure can be applied, is not limited to... Figure 2 , Figure 3 The structure described above. For example, a conveying module 20 with a circular plate shape can be used instead of a square plate shape.

[0107] Alternatively, the structure can be configured such that the fork member extends laterally from the main body of the square or round plate-shaped transport module 20, on which the module-side magnet 23 is provided, and the wafer W is held on the fork member. In this case, even if the block 10 is not provided in the wafer processing chamber 110 or the loading interlock chamber 130, the fork member can be allowed to enter to transfer the wafer W.

[0108] It should be considered that the embodiments disclosed herein are illustrative in all respects and not restrictive. The above embodiments may be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

[0109] Explanation of reference numerals in the attached figures

[0110] W: Wafer; 10: Block; 11: Moving surface side coil; 101: Wafer transport device; 100: Wafer processing system; 110: Wafer processing chamber; 120: Vacuum transport chamber; 20: Transport module; 22: Accelerometer; 23: Module side magnet; 501: Transport control unit; 502: Calibration parameter calculation unit.

Claims

1. A substrate conveying apparatus for conveying substrates into a substrate processing chamber for processing substrates, the substrate conveying apparatus comprising: A movable block having a movable surface and a plurality of first magnets disposed in a transport area of ​​the substrate from the junction position where the substrate is connected to the outside to the processing position of the substrate in the substrate processing chamber, and the plurality of first magnets being configured to change the state of the magnetic field. A substrate transport module that holds the substrate, the substrate transport module having a second magnet, the second magnet being acted upon by a magnetic force acting on at least one of a repulsive force and an attractive force between the magnetic fields of the second magnet and the first magnet, the substrate transport module being configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The transfer control unit controls the magnetic field formed by the plurality of first magnets to make the substrate transfer module move along a preset path; The detection unit detects an index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field by the conveying control unit, from the set path. as well as The calculation unit calculates correction parameters for correcting the magnetic force acting on the second magnet based on the index value, in a manner that reduces the magnitude of the deviation. During the subsequent transport of the substrate along the predetermined path, the transport control unit performs corrections based on the correction parameters to change the state of the magnetic field. The detection of the index value performed by the detection unit is carried out during the trial movement period, which is the period during which the substrate transport module moves along the set path before the substrate processing chamber begins. The transport control unit performs corrections based on the correction parameters to change the state of the magnetic field during processing, which is the period after the trial move when the substrate is processed in the substrate processing chamber. The detection unit consists of a sensor for detecting the acceleration of the substrate transport module. The index value is the magnitude of the acceleration of the substrate transport module as it moves in a direction intersecting the direction along the predetermined path. The correction parameter calculation unit calculates a correction force based on the acceleration and the magnitude of the external force acting on the substrate conveying module along the intersection direction, and uses it as the correction parameter. The conveying control unit performs the correction by increasing the magnetic force acting on the second magnet by an amount corresponding to the correction force in the direction of offsetting the deviation compared to the magnetic force when the index value was obtained.

2. A substrate conveying apparatus for conveying substrates into a substrate processing chamber for processing substrates, the substrate conveying apparatus comprising: A movable block having a movable surface and a plurality of first magnets disposed in a transport area of ​​the substrate from the junction position where the substrate is connected to the outside to the processing position of the substrate in the substrate processing chamber, and the plurality of first magnets being configured to change the state of the magnetic field. A substrate transport module that holds the substrate, the substrate transport module having a second magnet, the second magnet being acted upon by a magnetic force acting on at least one of a repulsive force and an attractive force between the magnetic fields of the second magnet and the first magnet, the substrate transport module being configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The transfer control unit controls the magnetic field formed by the plurality of first magnets to make the substrate transfer module move along a preset path; The detection unit detects an index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field by the conveying control unit, from the set path. as well as The calculation unit calculates correction parameters for correcting the magnetic force acting on the second magnet based on the index value, in a manner that reduces the magnitude of the deviation. During the subsequent transport of the substrate along the predetermined path, the transport control unit performs corrections based on the correction parameters to change the state of the magnetic field. The detection of the index value performed by the detection unit is carried out during the trial movement period, which is the period during which the substrate transport module moves along the set path before the substrate processing chamber begins. The transport control unit performs corrections based on the correction parameters to change the state of the magnetic field during processing, which is the period after the trial move when the substrate is processed in the substrate processing chamber. The detection unit consists of sensors for detecting the position of the substrate conveying module within the moving surface, and the index value is the deviation of the moving path from the set path. The correction parameter calculation unit calculates a correction force based on the second-order time derivative of the deviation amplitude, i.e., the acceleration, and the magnitude of the external force acting on the substrate conveying module in the direction intersecting the direction along the set path. The conveying control unit performs the correction by increasing the magnetic force acting on the second magnet by an amount corresponding to the correction force in the direction of offsetting the deviation compared to when the index value was obtained.

3. A substrate conveying apparatus for conveying substrates into a substrate processing chamber for processing substrates, the substrate conveying apparatus comprising: A movable block having a movable surface and a plurality of first magnets disposed in a transport area of ​​the substrate from the junction position where the substrate is connected to the outside to the processing position of the substrate in the substrate processing chamber, and the plurality of first magnets being configured to change the state of the magnetic field. A substrate transport module that holds the substrate, the substrate transport module having a second magnet, the second magnet being acted upon by a magnetic force acting on at least one of a repulsive force and an attractive force between the magnetic fields of the second magnet and the first magnet, the substrate transport module being configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The transfer control unit controls the magnetic field formed by the plurality of first magnets to make the substrate transfer module move along a preset path; The detection unit detects an index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field by the conveying control unit, from the set path. as well as The calculation unit calculates correction parameters for correcting the magnetic force acting on the second magnet based on the index value, in a manner that reduces the magnitude of the deviation. During the subsequent transport of the substrate along the predetermined path, the transport control unit performs corrections based on the correction parameters to change the state of the magnetic field. The detection of the index value performed by the detection unit is carried out during the trial movement period, which is the period during which the substrate transport module moves along the set path before the substrate processing chamber begins. The transport control unit performs corrections based on the correction parameters to change the state of the magnetic field during processing, which is the period after the trial move when the substrate is processed in the substrate processing chamber. The substrate transport module is configured to change the distance from the moving surface when moving in a floating state. The index value can be detected multiple times by changing the distance between the substrate conveying module and the moving surface. The correction parameter calculation unit calculates the correction parameter corresponding to a preset distance from the moving surface based on these index values ​​detected under different distances from the moving surface.

4. A substrate conveying apparatus for conveying substrates into a substrate processing chamber for processing substrates, the substrate conveying apparatus comprising: A movable block having a movable surface and a plurality of first magnets disposed in a transport area of ​​the substrate from the junction position where the substrate is connected to the outside to the processing position of the substrate in the substrate processing chamber, and the plurality of first magnets being configured to change the state of the magnetic field. A substrate transport module that holds the substrate, the substrate transport module having a second magnet, the second magnet being acted upon by a magnetic force acting on at least one of a repulsive force and an attractive force between the magnetic fields of the second magnet and the first magnet, the substrate transport module being configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The transfer control unit controls the magnetic field formed by the plurality of first magnets to make the substrate transfer module move along a preset path; The detection unit detects an index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field by the conveying control unit, from the set path. as well as The calculation unit calculates correction parameters for correcting the magnetic force acting on the second magnet based on the index value, in a manner that reduces the magnitude of the deviation. During the subsequent transport of the substrate along the predetermined path, the transport control unit performs corrections based on the correction parameters to change the state of the magnetic field. The detection of the index value performed by the detection unit is carried out during the trial movement period, which is the period during which the substrate transport module moves along the set path before the substrate processing chamber begins. The transport control unit performs corrections based on the correction parameters to change the state of the magnetic field during processing, which is the period after the trial move when the substrate is processed in the substrate processing chamber. The substrate conveying module is configured to also convey objects with a weight different from that of the substrate. The index value is detected multiple times by changing the load applied to the substrate conveying module. The correction parameter calculation unit calculates the correction parameter corresponding to the weight of the object being transported by the substrate transport module based on these index values ​​detected under different load conditions.

5. A substrate conveying apparatus for conveying substrates into a substrate processing chamber for processing substrates, the substrate conveying apparatus comprising: A movable block having a movable surface and a plurality of first magnets disposed in a transport area of ​​the substrate from the junction position where the substrate is connected to the outside to the processing position of the substrate in the substrate processing chamber, and the plurality of first magnets being configured to change the state of the magnetic field. A substrate transport module that holds the substrate, the substrate transport module having a second magnet, the second magnet being acted upon by a magnetic force acting on at least one of a repulsive force and an attractive force between the magnetic fields of the second magnet and the first magnet, the substrate transport module being configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The transfer control unit controls the magnetic field formed by the plurality of first magnets to make the substrate transfer module move along a preset path; The detection unit detects an index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field by the conveying control unit, from the set path. as well as The calculation unit calculates correction parameters for correcting the magnetic force acting on the second magnet based on the index value, in a manner that reduces the magnitude of the deviation. During the subsequent transport of the substrate along the predetermined path, the transport control unit performs corrections based on the correction parameters to change the state of the magnetic field. The detection of the index value performed by the detection unit is carried out by a movement action that moves the substrate transport module along the set path during the processing period, which is the period during which the substrate is processed in the substrate processing chamber. The conveying control unit performs corrections based on the correction parameters to change the state of the magnetic field in other moving actions that cause the substrate conveying module to move along the set path after the first moving action. The detection unit consists of a sensor for detecting the acceleration of the substrate transport module. The index value is the magnitude of the acceleration of the substrate transport module as it moves in a direction intersecting the direction along the predetermined path. The correction parameter calculation unit calculates a correction force based on the acceleration and the magnitude of the external force acting on the substrate conveying module along the intersection direction, and uses it as the correction parameter. The conveying control unit performs the correction by increasing the magnetic force acting on the second magnet by an amount corresponding to the correction force in the direction of offsetting the deviation compared to the magnetic force when the index value was obtained.

6. A substrate conveying apparatus for conveying substrates into a substrate processing chamber for processing substrates, the substrate conveying apparatus comprising: A movable block having a movable surface and a plurality of first magnets disposed in a transport area of ​​the substrate from the junction position where the substrate is connected to the outside to the processing position of the substrate in the substrate processing chamber, and the plurality of first magnets being configured to change the state of the magnetic field. A substrate transport module that holds the substrate, the substrate transport module having a second magnet, the second magnet being acted upon by a magnetic force acting on at least one of a repulsive force and an attractive force between the magnetic fields of the second magnet and the first magnet, the substrate transport module being configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The transfer control unit controls the magnetic field formed by the plurality of first magnets to make the substrate transfer module move along a preset path; The detection unit detects an index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field by the conveying control unit, from the set path. as well as The calculation unit calculates correction parameters for correcting the magnetic force acting on the second magnet based on the index value, in a manner that reduces the magnitude of the deviation. During the subsequent transport of the substrate along the predetermined path, the transport control unit performs corrections based on the correction parameters to change the state of the magnetic field. The detection of the index value performed by the detection unit is carried out by a movement action that moves the substrate transport module along the set path during the processing period, which is the period during which the substrate is processed in the substrate processing chamber. The conveying control unit performs corrections based on the correction parameters to change the state of the magnetic field in other moving actions that cause the substrate conveying module to move along the set path after the first moving action. The detection unit consists of sensors for detecting the position of the substrate conveying module within the moving surface, and the index value is the deviation of the moving path from the set path. The correction parameter calculation unit calculates a correction force based on the second-order time derivative of the deviation amplitude, i.e., the acceleration, and the magnitude of the external force acting on the substrate conveying module in the direction intersecting the direction along the set path. The conveying control unit performs the correction by increasing the magnetic force acting on the second magnet by an amount corresponding to the correction force in the direction of offsetting the deviation compared to when the index value was obtained.

7. A substrate conveying apparatus for conveying substrates into a substrate processing chamber for processing substrates, the substrate conveying apparatus comprising: A movable block having a movable surface and a plurality of first magnets disposed in a transport area of ​​the substrate from the junction position where the substrate is connected to the outside to the processing position of the substrate in the substrate processing chamber, and the plurality of first magnets being configured to change the state of the magnetic field. A substrate transport module that holds the substrate, the substrate transport module having a second magnet, the second magnet being acted upon by a magnetic force acting on at least one of a repulsive force and an attractive force between the magnetic fields of the second magnet and the first magnet, the substrate transport module being configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The transfer control unit controls the magnetic field formed by the plurality of first magnets to make the substrate transfer module move along a preset path; The detection unit detects an index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field by the conveying control unit, from the set path. as well as The calculation unit calculates correction parameters for correcting the magnetic force acting on the second magnet based on the index value, in a manner that reduces the magnitude of the deviation. During the subsequent transport of the substrate along the predetermined path, the transport control unit performs corrections based on the correction parameters to change the state of the magnetic field. The detection of the index value performed by the detection unit is carried out by a movement action that moves the substrate transport module along the set path during the processing period, which is the period during which the substrate is processed in the substrate processing chamber. The conveying control unit performs corrections based on the correction parameters to change the state of the magnetic field in other moving actions that cause the substrate conveying module to move along the set path after the first moving action. The substrate transport module is configured to change the distance from the moving surface when moving in a floating state. The index value can be detected multiple times by changing the distance between the substrate conveying module and the moving surface. The correction parameter calculation unit calculates the correction parameter corresponding to a preset distance from the moving surface based on these index values ​​detected under different distances from the moving surface.

8. A substrate conveying apparatus for conveying substrates into a substrate processing chamber for processing substrates, the substrate conveying apparatus comprising: A movable block having a movable surface and a plurality of first magnets disposed in a transport area of ​​the substrate from the junction position where the substrate is connected to the outside to the processing position of the substrate in the substrate processing chamber, and the plurality of first magnets being configured to change the state of the magnetic field. A substrate transport module that holds the substrate, the substrate transport module having a second magnet, the second magnet being acted upon by a magnetic force acting on at least one of a repulsive force and an attractive force between the magnetic fields of the second magnet and the first magnet, the substrate transport module being configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The transfer control unit controls the magnetic field formed by the plurality of first magnets to make the substrate transfer module move along a preset path; The detection unit detects an index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field by the conveying control unit, from the set path. as well as The calculation unit calculates correction parameters for correcting the magnetic force acting on the second magnet based on the index value, in a manner that reduces the magnitude of the deviation. During the subsequent transport of the substrate along the predetermined path, the transport control unit performs corrections based on the correction parameters to change the state of the magnetic field. The detection of the index value performed by the detection unit is carried out by a movement action that moves the substrate transport module along the set path during the processing period, which is the period during which the substrate is processed in the substrate processing chamber. The conveying control unit performs corrections based on the correction parameters to change the state of the magnetic field in other moving actions that cause the substrate conveying module to move along the set path after the first moving action. The substrate conveying module is configured to also convey objects with a weight different from that of the substrate. The index value is detected multiple times by changing the load applied to the substrate conveying module. The correction parameter calculation unit calculates the correction parameter corresponding to the weight of the object being transported by the substrate transport module based on these index values ​​detected under different load conditions.

9. A substrate conveying method, comprising conveying a substrate to a substrate processing chamber for processing the substrate, the substrate conveying method comprising the following steps: A moving block having a moving surface and a plurality of first magnets, and a substrate transport module are used to control the magnetic field formed by the plurality of first magnets, so that the substrate transport module moves along a predetermined path. In the moving block, the plurality of first magnets are disposed in the transport area of ​​the substrate from the junction position where the substrate is handed over to the outside to the processing position of the substrate in the substrate processing chamber. The plurality of first magnets are configured to change the state of the magnetic field. The substrate transport module holds the substrate. The substrate transport module has a second magnet. The second magnet is subjected to a magnetic force acting on at least one of the repulsive force and the attractive force between the magnetic field of the second magnet and the magnetic field of the first magnet. The substrate transport module is configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field, from the set path. Based on the index value, correction parameters for correcting the magnetic force acting on the second magnet are calculated in a manner that reduces the magnitude of the deviation. as well as During the transfer of the substrate along the set path after the step of moving the substrate transfer module, a correction is performed to change the state of the magnetic field based on the correction parameters. The process of detecting the index value is carried out during the trial movement, which is the period during which the substrate transport module moves along the set path before the substrate processing chamber begins. The correction process is performed to change the state of the magnetic field during processing, which occurs during substrate processing in the substrate processing chamber after the trial movement. In the process of detecting the index value, a sensor for detecting the acceleration of the substrate transport module is used to detect the magnitude of the acceleration of the substrate transport module moving in a direction intersecting the direction along the set path, and this magnitude is used as the index value. In the process of calculating the correction parameter, a correction force corresponding to the magnitude of the external force acting on the substrate conveying module along the intersection direction is calculated based on the acceleration and used as the correction parameter. In the process of performing the correction, the correction is performed by increasing the magnetic force acting on the second magnet by an amount corresponding to the correction force in the direction of offsetting the deviation compared to the magnetic force when the index value was obtained.

10. A substrate conveying method, comprising conveying a substrate into a substrate processing chamber for processing the substrate, the substrate conveying method comprising the following steps: A moving block having a moving surface and a plurality of first magnets, and a substrate transport module are used to control the magnetic field formed by the plurality of first magnets, so that the substrate transport module moves along a predetermined path. In the moving block, the plurality of first magnets are disposed in the transport area of ​​the substrate from the junction position where the substrate is handed over to the outside to the processing position of the substrate in the substrate processing chamber. The plurality of first magnets are configured to change the state of the magnetic field. The substrate transport module holds the substrate. The substrate transport module has a second magnet. The second magnet is subjected to a magnetic force acting on at least one of the repulsive force and the attractive force between the magnetic field of the second magnet and the magnetic field of the first magnet. The substrate transport module is configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field, from the set path. Based on the index value, correction parameters for correcting the magnetic force acting on the second magnet are calculated in a manner that reduces the magnitude of the deviation. as well as During the transfer of the substrate along the set path after the step of moving the substrate transfer module, a correction is performed to change the state of the magnetic field based on the correction parameters. The process of detecting the index value is carried out during the trial movement, which is the period during which the substrate transport module moves along the set path before the substrate processing chamber begins. The correction process is performed to change the state of the magnetic field during processing, which occurs during substrate processing in the substrate processing chamber after the trial movement. In the process of detecting the index value, a sensor used to detect the position of the substrate conveying module within the moving surface is used to detect the deviation of the moving path from the set path, and this deviation is used as the index value. In the process of calculating the correction parameter, a correction force corresponding to the magnitude of the external force acting on the substrate conveying module in the direction intersecting the direction along the set path is calculated based on the second-order time derivative of the deviation amplitude, i.e., the acceleration, and is used as the correction parameter. In the process of performing the correction, the correction is performed by increasing the magnetic force acting on the second magnet by an amount corresponding to the correction force in the direction of offsetting the deviation compared to the magnetic force when the index value was obtained.

11. A substrate conveying method, comprising conveying a substrate into a substrate processing chamber for processing the substrate, the substrate conveying method comprising the following steps: A moving block having a moving surface and a plurality of first magnets, and a substrate transport module are used to control the magnetic field formed by the plurality of first magnets, so that the substrate transport module moves along a predetermined path. In the moving block, the plurality of first magnets are disposed in the transport area of ​​the substrate from the junction position where the substrate is handed over to the outside to the processing position of the substrate in the substrate processing chamber. The plurality of first magnets are configured to change the state of the magnetic field. The substrate transport module holds the substrate. The substrate transport module has a second magnet. The second magnet is subjected to a magnetic force acting on at least one of the repulsive force and the attractive force between the magnetic field of the second magnet and the magnetic field of the first magnet. The substrate transport module is configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field, from the set path. Based on the index value, correction parameters for correcting the magnetic force acting on the second magnet are calculated in a manner that reduces the magnitude of the deviation. as well as During the transfer of the substrate along the set path after the step of moving the substrate transfer module, a correction is performed to change the state of the magnetic field based on the correction parameters. The process of detecting the index value is carried out during the trial movement, which is the period during which the substrate transport module moves along the set path before the substrate processing chamber begins. The correction process is performed to change the state of the magnetic field during processing, which occurs during substrate processing in the substrate processing chamber after the trial movement. The substrate transport module is configured to change the distance from the moving surface when moving in a floating state. The process of detecting the index value is performed multiple times by changing the distance between the substrate conveying module and the moving surface. In the process of calculating the correction parameters, the correction parameters corresponding to a preset distance from the moving surface are calculated based on these index values ​​detected under different distances from the moving surface.

12. A substrate conveying method, comprising conveying a substrate to a substrate processing chamber for processing the substrate, the substrate conveying method comprising the following steps: A moving block having a moving surface and a plurality of first magnets, and a substrate transport module are used to control the magnetic field formed by the plurality of first magnets, so that the substrate transport module moves along a predetermined path. In the moving block, the plurality of first magnets are disposed in the transport area of ​​the substrate from the junction position where the substrate is handed over to the outside to the processing position of the substrate in the substrate processing chamber. The plurality of first magnets are configured to change the state of the magnetic field. The substrate transport module holds the substrate. The substrate transport module has a second magnet. The second magnet is subjected to a magnetic force acting on at least one of the repulsive force and the attractive force between the magnetic field of the second magnet and the magnetic field of the first magnet. The substrate transport module is configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field, from the set path. Based on the index value, correction parameters for correcting the magnetic force acting on the second magnet are calculated in a manner that reduces the magnitude of the deviation. as well as During the transfer of the substrate along the set path after the step of moving the substrate transfer module, a correction is performed to change the state of the magnetic field based on the correction parameters. The process of detecting the index value is carried out during the trial movement, which is the period during which the substrate transport module moves along the set path before the substrate processing chamber begins. The correction process is performed to change the state of the magnetic field during processing, which occurs during substrate processing in the substrate processing chamber after the trial movement. The substrate conveying module is configured to also convey objects with a weight different from that of the substrate. The process of detecting the index value is performed multiple times by changing the load applied to the substrate conveying module. In the process of calculating the correction parameters, the correction parameters corresponding to the weight of the transported object transported by the substrate transport module are calculated based on these index values ​​detected under different load conditions.

13. A substrate conveying method, comprising conveying a substrate to a substrate processing chamber for processing the substrate, the substrate conveying method comprising the following steps: A moving block having a moving surface and a plurality of first magnets, and a substrate transport module are used to control the magnetic field formed by the plurality of first magnets, so that the substrate transport module moves along a predetermined path. In the moving block, the plurality of first magnets are disposed in the transport area of ​​the substrate from the junction position where the substrate is handed over to the outside to the processing position of the substrate in the substrate processing chamber. The plurality of first magnets are configured to change the state of the magnetic field. The substrate transport module holds the substrate. The substrate transport module has a second magnet. The second magnet is subjected to a magnetic force acting on at least one of the repulsive force and the attractive force between the magnetic field of the second magnet and the magnetic field of the first magnet. The substrate transport module is configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field, from the set path. Based on the index value, correction parameters for correcting the magnetic force acting on the second magnet are calculated in a manner that reduces the magnitude of the deviation. as well as During the transfer of the substrate along the set path after the step of moving the substrate transfer module, a correction is performed to change the state of the magnetic field based on the correction parameters. The process of detecting the index value is performed by moving the substrate transport module along the predetermined path during processing, which takes place in the substrate processing chamber. The correction process is performed to change the state of the magnetic field in other movement actions that move the substrate transport module along the set path after the first movement action. In the process of detecting the index value, a sensor for detecting the acceleration of the substrate transport module is used to detect the magnitude of the acceleration of the substrate transport module moving in a direction intersecting the direction along the set path, and this magnitude is used as the index value. In the process of calculating the correction parameter, a correction force corresponding to the magnitude of the external force acting on the substrate conveying module along the intersection direction is calculated based on the acceleration and used as the correction parameter. In the process of performing the correction, the correction is performed by increasing the magnetic force acting on the second magnet by an amount corresponding to the correction force in the direction of offsetting the deviation compared to the magnetic force when the index value was obtained.

14. A substrate conveying method, comprising conveying a substrate into a substrate processing chamber for processing the substrate, the substrate conveying method comprising the following steps: A moving block having a moving surface and a plurality of first magnets, and a substrate transport module are used to control the magnetic field formed by the plurality of first magnets, so that the substrate transport module moves along a predetermined path. In the moving block, the plurality of first magnets are disposed in the transport area of ​​the substrate from the junction position where the substrate is handed over to the outside to the processing position of the substrate in the substrate processing chamber. The plurality of first magnets are configured to change the state of the magnetic field. The substrate transport module holds the substrate. The substrate transport module has a second magnet. The second magnet is subjected to a magnetic force acting on at least one of the repulsive force and the attractive force between the magnetic field of the second magnet and the magnetic field of the first magnet. The substrate transport module is configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field, from the set path. Based on the index value, correction parameters for correcting the magnetic force acting on the second magnet are calculated in a manner that reduces the magnitude of the deviation. as well as During the transfer of the substrate along the set path after the step of moving the substrate transfer module, a correction is performed to change the state of the magnetic field based on the correction parameters. The process of detecting the index value is performed by moving the substrate transport module along the predetermined path during processing, which takes place in the substrate processing chamber. The correction process is performed to change the state of the magnetic field in other movement actions that move the substrate transport module along the set path after the first movement action. In the process of detecting the index value, a sensor used to detect the position of the substrate conveying module within the moving surface is used to detect the deviation of the moving path from the set path, and this deviation is used as the index value. In the process of calculating the correction parameter, a correction force corresponding to the magnitude of the external force acting on the substrate conveying module in the direction intersecting the direction along the set path is calculated based on the second-order time derivative of the deviation amplitude, i.e., the acceleration, and is used as the correction parameter. In the process of performing the correction, the correction is performed by increasing the magnetic force acting on the second magnet by an amount corresponding to the correction force in the direction of offsetting the deviation compared to the magnetic force when the index value was obtained.

15. A substrate conveying method, comprising conveying a substrate into a substrate processing chamber for processing the substrate, the substrate conveying method comprising the following steps: A moving block having a moving surface and a plurality of first magnets, and a substrate transport module are used to control the magnetic field formed by the plurality of first magnets, so that the substrate transport module moves along a predetermined path. In the moving block, the plurality of first magnets are disposed in the transport area of ​​the substrate from the junction position where the substrate is handed over to the outside to the processing position of the substrate in the substrate processing chamber. The plurality of first magnets are configured to change the state of the magnetic field. The substrate transport module holds the substrate. The substrate transport module has a second magnet. The second magnet is subjected to a magnetic force acting on at least one of the repulsive force and the attractive force between the magnetic field of the second magnet and the magnetic field of the first magnet. The substrate transport module is configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field, from the set path. Based on the index value, correction parameters for correcting the magnetic force acting on the second magnet are calculated in a manner that reduces the magnitude of the deviation. as well as During the transfer of the substrate along the set path after the step of moving the substrate transfer module, a correction is performed to change the state of the magnetic field based on the correction parameters. The process of detecting the index value is performed by moving the substrate transport module along the predetermined path during processing, which takes place in the substrate processing chamber. The correction process is performed to change the state of the magnetic field in other movement actions that move the substrate transport module along the set path after the first movement action. The substrate transport module is configured to change the distance from the moving surface when moving in a floating state. The process of detecting the index value is performed multiple times by changing the distance between the substrate conveying module and the moving surface. In the process of calculating the correction parameters, the correction parameters corresponding to a preset distance from the moving surface are calculated based on these index values ​​detected under different distances from the moving surface.

16. A substrate conveying method, comprising conveying a substrate to a substrate processing chamber for processing the substrate, the substrate conveying method comprising the following steps: A moving block having a moving surface and a plurality of first magnets, and a substrate transport module are used to control the magnetic field formed by the plurality of first magnets, so that the substrate transport module moves along a predetermined path. In the moving block, the plurality of first magnets are disposed in the transport area of ​​the substrate from the junction position where the substrate is handed over to the outside to the processing position of the substrate in the substrate processing chamber. The plurality of first magnets are configured to change the state of the magnetic field. The substrate transport module holds the substrate. The substrate transport module has a second magnet. The second magnet is subjected to a magnetic force acting on at least one of the repulsive force and the attractive force between the magnetic field of the second magnet and the magnetic field of the first magnet. The substrate transport module is configured to move along the moving surface while being levitated from the moving surface by the magnetic force. The index value corresponding to the magnitude of the deviation of the actual moving path of the substrate conveying module, which moves along the moving surface under the control of the magnetic field, from the set path. Based on the index value, correction parameters for correcting the magnetic force acting on the second magnet are calculated in a manner that reduces the magnitude of the deviation. as well as During the transfer of the substrate along the set path after the step of moving the substrate transfer module, a correction is performed to change the state of the magnetic field based on the correction parameters. The process of detecting the index value is performed by moving the substrate transport module along the predetermined path during processing, which takes place in the substrate processing chamber. The correction process is performed to change the state of the magnetic field in other movement actions that move the substrate transport module along the set path after the first movement action. The substrate conveying module is configured to also convey objects with a weight different from that of the substrate. The process of detecting the index value is performed multiple times by changing the load applied to the substrate conveying module. In the process of calculating the correction parameters, the correction parameters corresponding to the weight of the transported object transported by the substrate transport module are calculated based on these index values ​​detected under different load conditions.

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