Connector assembly

Abstract

A connector assembly comprising a housing defining a port, a card slot within the port, a wafer block aligned with the card slot, the wafer block comprising a pair of ground wafers and a pair of signal wafers, the pair of signal wafers each supporting at least four terminals, wherein the terminals are arranged in two rows of contacts disposed on a first side and a second side of the card slot, the pair of signal wafers positioned adjacent to each other and the pair of ground wafers positioned on either side of the pair of signal wafers, wherein the connector assembly engages the wafer block with a card slot plug having a shoulder with a slot for engaging a protrusion on top of the wafer block.

Description

[0001] This application is a divisional application of the application whose applicant is "Morris Co., Ltd.", whose application date is January 8, 2019, whose application number is 201980007783.7, and whose invention name is "High-density socket". Technical Field

[0002] The present invention relates to the field of input / output (IO) connectors, and more particularly to IO connectors suitable for very high data rate applications. Background Art

[0003] Input / output (IO) connectors are designed to support high data rates, and numerous improvements have been developed to help accommodate data rates reaching 25 Gbps and even higher. However, to support user needs and desires, several companies have been seeking ways to support significantly higher data rates. As a result, development work is underway to support very high data rate payloads using NRZ or PAM4 encoding. However, these increases will pose significant challenges for existing manufacturing technologies, as conventional circuit boards and connectors cannot readily support the associated Nyquist frequencies for signals exceeding 25 GHz. Consequently, new architectures and approaches will be required.

[0004] Another approach to supporting increased data rates has been to increase the number of ports. One way to increase the number of ports is to reduce the size of the connector, allowing similar-sized connectors to accommodate additional ports and higher signal density. For example, many standard connectors are often designed to operate at a 0.8mm or 0.75mm pitch, and a connector standard (OCULINK connector) has recently been approved to support 0.5mm. While reducing connector size is effective for clean sheet designs and supporting very high density in the front of a rack, the smaller the connector, the more challenging it becomes for optical connector design, as the very small size makes it challenging to adequately dissipate heat when used in active applications. They also tend to use smaller conductors, which makes it difficult to support cable lengths exceeding 2 or 3 meters for electrical signaling. Additionally, the new smaller connector sizes pose potential issues for backward compatibility. As a result, some groups may appreciate further improvements in connector technology. Summary of the Invention

[0005] A connector is disclosed as including a sheet assembly formed of a plurality of terminals supported by an insulating frame. The sheet assembly can be located within a housing without requiring a base. A slot element is aligned with contact portions of the plurality of terminals. In one embodiment, a connector can include a sheet supporting two rows of terminals on either side of a slot, and the connector can be arranged to have press-fit tails. Other termination methods besides press-fit tails are also contemplated.

[0006] According to one embodiment of the present application, a connector assembly is provided, comprising: a cover body, which defines a port; a card slot, located in the port; a thin film block, aligned with the card slot, the thin film block comprising a pair of grounding thin films and a pair of signal thin films, each of the pair of signal thin films supporting at least four terminals, wherein the terminals are arranged in two rows of contact portions arranged on a first side and a second side of the card slot, the pair of signal thin films are positioned adjacent to each other and the pair of grounding thin films are located on both sides of the adjacent pair of signal thin films, wherein the connector assembly utilizes a card slot type plug-in to engage the thin film block, the card slot type plug-in has a shoulder, and the shoulder has a groove for engaging a protrusion located on the top of the thin film block.

[0007] Wherein, a plurality of holding strips are arranged on opposite sides of the sheet body.

[0008] One side of the thin-sheet block has two retaining strips, and the other side of the thin-sheet block has one retaining strip, thereby forming a triangular layout.

[0009] The plurality of holding strips are connected to the thin sheet through thin sheet protrusions, and the thin sheet protrusions can be thermally welded to the holding strips.

[0010] Each of the thin sheets includes an insulating frame, and the insulating frame includes a plurality of top protrusions extending to the top wall of the cover.

[0011] The plurality of top protrusions have a plurality of notches, so that the sheet body engages the top wall at a plurality of positions while still leaving gaps.

[0012] The plurality of openings may be arranged in a pattern that allows air to flow along the top wall of the cover in a desired manner.

[0013] The protrusion can be shortened and an insert can be located between the sheet block and the top wall of the cover, the insert being able to transfer force from the top wall to the sheet block while providing a more optimized air flow path between the top wall and the sheet block.

[0014] Wherein, the bottom wall of the cover body has a tongue inserted into the card slot type connector, and the tongue is inserted into the tongue slot in the card slot type connector.

[0015] Each signal terminal includes a contact portion, a tail portion, and a body portion extending between the contact portion and the tail portion, and a terminal rib portion extends along the entire body portion of each signal terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention is illustrated by way of example and not limitation in the accompanying figures in which like references indicate similar parts and in which:

[0017] Figure 1 A perspective view of an embodiment of a connector system is shown.

[0018] Figure 2 Show Figure 1 The embodiment shown is a perspective cutaway view taken along line 1-1.

[0019] Figure 3 Show Figure 1 Another perspective view of the illustrated embodiment.

[0020] Figure 4 Show Figure 3 A simplified perspective view of the embodiment shown.

[0021] Figure 5 A perspective view of one embodiment is shown of a plug module prior to insertion into a receptacle.

[0022] Figure 6 A perspective view of one embodiment of a socket is shown.

[0023] Figure 7A Show Figure 6 The embodiment shown is a perspective cutaway view taken along line 7-7.

[0024] Figure 7B Show Figure 7A An enlarged, simplified perspective view of the illustrated embodiment.

[0025] Figure 7C Show Figure 7A An enlarged perspective view of one embodiment is shown, in which a second set of terminals can be seen following in-line behind the conventional first set of terminals.

[0026] Figure 8 Show Figure 6 A perspective view of the embodiment shown with the cover portion removed.

[0027] Figure 9 Show Figure 6 A simplified perspective view of the embodiment shown with the top wall and front of the enclosure removed.

[0028] Figure 10 A perspective cutaway view of the embodiment shown in FIG. 7 is shown with a modified top wall.

[0029] Figure 11A A perspective view of an embodiment of a connector is shown.

[0030] Figure 11B Show Figure 11A An enlarged perspective view of the illustrated embodiment.

[0031] Figure 12 Show Figure 11A Another perspective view of the illustrated embodiment.

[0032] Figure 13 Show Figure 11A An exploded perspective view of a portion of the embodiment shown.

[0033] Figure 14 Show Figure 13 An enlarged perspective view of the illustrated embodiment.

[0034] Figure 15 Show Figure 13 A perspective view of the embodiment shown, wherein the slot-type connector is removed.

[0035] Figure 16 A perspective view illustrating one embodiment of a retaining strip for securing a wafer assembly.

[0036] Figure 17 An exploded partial perspective view of one embodiment of a connector is shown.

[0037] Figure 18 A partially exploded perspective view of an embodiment showing a pair of signal wafers surrounded by a ground wafer is shown.

[0038] Figure 19 Show Figure 18 A simplified perspective view of the illustrated embodiment with an insulating frame removed for illustration purposes.

[0039] Figure 20 A perspective view illustrating an embodiment of a signal wafer pair is shown.

[0040] Figure 21 A perspective view of this embodiment is shown with the insulating frame removed.

[0041] Figure 22 A perspective view of one embodiment of a plurality of terminals provided in a contact row in a bottom port is shown.

[0042] Figure 23 Show Figure 22 Another perspective view of the illustrated embodiment.

[0043] Figure 24 Show Figure 22 A side view of the embodiment shown.

[0044] Figure 25A Show Figure 21 A plan view of the embodiment shown.

[0045] Figure 25B Show Figure 25A An enlarged plan view of the illustrated embodiment.

[0046] Figure 26 A schematic diagram illustrating an embodiment of a connector having an insert.

[0047] Figure 27 A perspective view of one embodiment of a socket is shown.

[0048] Figure 28 A perspective view of an embodiment of a connector is shown.

[0049] Figure 29 Show Figure 28 An exploded perspective view of a portion of the embodiment shown.

[0050] Figure 30 Show Figure 28 An exploded perspective view of a portion of the embodiment is shown with some features removed.

[0051] Figure 31 Show Figure 28 A partially exploded perspective view of a sheet body block according to the embodiment shown.

[0052] Figure 32 Show Figure 28 A perspective view of a high-speed wafer block of the illustrated embodiment.

[0053] Figure 33 Show Figure 32 A partially exploded perspective view of a high-speed sheet body block is shown.

[0054] Figure 34 Shown from Figure 32 A partially exploded perspective view of the outer ground wafer of the high-speed wafer block is shown, illustrating the contact insert and tail insert of the ground wafer.

[0055] Figure 35 Shown from Figure 32 A side view of the right ground laminae of the high-speed laminae block is shown.

[0056] Figure 36 Shown from Figure 32 A perspective view of the middle ground laminae of the high-speed laminae block is shown.

[0057] Figure 37 Shown from Figure 32 Another perspective view of the middle ground laminae of the high-speed laminae block is shown.

[0058] Figure 38 Shown from Figure 32 An enlarged perspective view of the middle ground laminae of the high-speed laminae block is shown.

[0059] Figure 39 Shown from Figure 32 A left front perspective view of the center ground laminae of the high speed laminae block is shown.

[0060] Figure 40 Shown from Figure 32 A right front perspective view of the left signal wafer of the high-speed wafer block is shown.

[0061] Figure 41 Shown from Figure 32 An enlarged right front perspective view of the left signal wafer of the high-speed wafer block is shown.

[0062] Figure 42 Shown from Figure 32 An exploded perspective view of the right front portion of the left signal wafer of the high-speed wafer block is shown.

[0063] Figure 43 Shown from Figure 32 An exploded perspective view of the left front portion of the left signal wafer of the high-speed wafer block is shown.

[0064] Figure 44 Shown from Figure 32 A perspective view of the right grounding sheet of the high-speed sheet block is shown.

[0065] Figure 45 Shown from Figure 32 An enlarged perspective view of the right ground laminar body of the high-speed laminar body block is shown.

[0066] Figure 46 Shown from Figure 32 Another perspective view of the right grounding sheet of the high-speed sheet block is shown.

[0067] Figure 47 Shown from Figure 32 A perspective view of the left grounding sheet and the left signal sheet of the high-speed sheet block is shown.

[0068] Figure 48 Shown from Figure 32 An enlarged perspective view of the left grounding sheet and the left signal sheet of the high-speed sheet block is shown.

[0069] Figure 49 Shown from Figure 32 A perspective view of the right ground wafer and the right signal wafer of the high-speed wafer block is shown.

[0070] Figure 50 Shown from Figure 32 An enlarged perspective view of the right ground wafer and the right signal wafer of the high-speed wafer block is shown.

[0071] Figure 51 Show Figure 32 A perspective cutaway view of the high-speed sheet body is shown generally along line 51-51.

[0072] Figure 52 Show Figure 51 A partially exploded view of the high-speed laminae block is shown with the right signal laminae removed for clarity.

[0073] Figure 53 Show Figure 51 An exploded view of a portion of the high-speed sheet body is shown.

[0074] Figure 54 Shows a partial exploded view of the high-speed sheet body block, which is Figure 53 Similar, but with the insulator of the right signal wafer removed for clarity.

[0075] Figure 55 Show Figure 51 A perspective cutaway view of the high-speed laminae block is shown with a portion of the right ground contact laminae generally cutaway along line 55-55.

[0076] Figure 56 A perspective cutaway view of a high-speed sheet block is shown. Figure 55 Similar, but with the insulator of the right signal wafer removed for clarity.

[0077] Figure 57 Shown from Figure 32 A perspective view of an alternative embodiment of the intermediate ground laminae of the high speed laminae block is shown.

[0078] Figure 58 Shown from Figure 32 An enlarged perspective view of the left ground laminae and left signal laminae of the high speed laminae block is shown, but with the insulator of the left signal laminae removed for clarity.

[0079] Figure 59 Shown from Figure 32Another enlarged perspective view of the left ground laminae and left signal laminae of the high speed laminae block is shown, but with the insulator of the left signal laminae removed for clarity. DETAILED DESCRIPTION

[0080] The following detailed description describes exemplary embodiments and is not intended to be limited to the explicitly disclosed combinations. Therefore, unless otherwise stated, features disclosed herein may be combined to form additional combinations that are not shown for the sake of brevity.

[0081] As from Figures 1 to 5 As can be appreciated, a receptacle 100 is mounted on a circuit board and provides a right-angle structure configured to receive a plug module 20. The illustrated receptacle design is advantageous for use with multiple plug modules that include cooling slots 115. While the use of cooling slots 115 in a module is not required, the cooling slots 115 can provide additional cooling and, when employed with the other features disclosed herein, make it easier to cool a module that utilizes more than 8 watts of power.

[0082] The socket 100 includes a housing 120 and can support the light pipe 105 if desired. Figure 6 The housing includes a top wall 122, a first side wall 123, a second side wall 124, a rear wall 125, and a front edge 126. The socket 100 defines a top port 121a and a bottom port 121b. Both the first side wall 123 and the second side wall 124 may include ventilation holes 135.

[0083] As can be appreciated, the illustrated design is intended to facilitate cooling of an inserted plug module 20. Thus, the design has been tailored to improve airflow in a number of ways, as will be discussed herein. In certain embodiments, the receptacle 100 may include an internally mounted heat sink 134 in communication with a front grill 130 and a rear aperture set 132. The top wall 122 may include a cooling aperture 122a, and an externally mounted heat sink 133 may be positioned within the cooling aperture 122a. These mounted heat sinks are typically designed so that they extend into the port and engage an inserted plug module, helping to provide a conductive path to direct heat away from the plug module. It should be noted that in some cases, additional cooling may not be desirable (e.g., in applications where active modules are not intended), and in such cases, many optional thermal features may be omitted. Thus, the illustrated internally mounted heat sink and various ventilation features may be omitted if not required (for clarity, the use of the techniques described herein may be considered in both active and passive modules).

[0084] A common design for existing receptacles utilizes a base located within a housing that helps define a connector. The housing helps support the mating plug module, helps support the connector, and also provides EMI protection. The connector, located within the housing, supports multiple terminals, each of which includes a tail and a contact portion that allows the mating plug module to be electrically connected to a circuit board (or, if a bipass design is desired, to a cable). For ease of assembly, the receptacle, which is typically press-fit onto a circuit board, must therefore align the connector terminals with the housing terminals. As will be appreciated, the housing can be formed of metal and is intended to have a fairly repeatable layout of tails with desired dimensional control relative to one another. The connector tails can also be carefully manufactured so that the tails align with one another. However, aligning the connector tails with the housing tails is somewhat more difficult due to the presence of multiple dimensional stacking. This dimensionality issue is exacerbated by the fact that, in a typical press-fit design, the base supports a thin wafer that in turn supports the multiple terminals. Thus, the terminals are dimensionally controlled relative to each other within a wafer but are dimensionally stacked relative to the base and other wafers, while the base is dimensionally stacked relative to the cover. Existing designs have attempted to have a datum that acts as a stop to carefully control the insertion of the base into the cover, controlling the tolerances between the datum point and the tail of both the cover and the connector.

[0085] While such control is possible, it becomes more challenging and difficult to turn out, particularly as the tail decreases in size. Applicants have determined that, instead of having a stop that limits and controls the position of the base relative to the cover, it is more desirable to have a system in which the cover 120 and connector 129 mate together in a manner that allows infinite adjustment within a small range, so that the mating of the cover 120 and connector 129 can be accomplished in a controlled manner and ensure dimensional control. As shown, the cover 120 includes bottom walls 140, 141, each having a tongue 142 that inserts into a respective card slot plug 150, 160. More specifically, these tongues 142 from the cover 120 insert into tongue slots 153, 163 in the mating portions 152, 162 of the card slot plugs 150, 160, respectively. As can be appreciated, the slotted connectors 150, 160 engage a wafer assembly 220 and provide some additional dimensional stacking between the two. In one embodiment, this insertion can be accomplished based on alignment between the wafer assembly 220 and the housing 120, thereby eliminating some dimensional stacking that would otherwise exist. In one embodiment, the tongue 142 has an interference fit with the tongue slots 153, 163 so that the housing and connector 129 properly engage and remain in the proper position relative to each other. Such a manufacturing process allows for better control over the position of the housing 120 and wafer assembly 220 relative to each other and improves the productivity of the socket 100 while ensuring that the socket 100 can be properly installed on a circuit board.

[0086] As can be appreciated from these figures, the connector 129 shown omits a base. Applicants have surprisingly discovered that a base is not necessary to support a wafer assembly 220, as long as the wafers are securely fastened together, preferably on at least two sides. In one illustrated embodiment, a plurality of retaining bars 171 are located on opposite sides, with one side having two retaining bars 171. The retaining bars 171 are connected to the wafers 221 via wafer nubs 229, which can be heat-soldered to the retaining bars 171. The illustrated connector 129 shows an embodiment in which a triangular layout is provided by two retaining bars 171 on one side and one retaining bar 171 on a second side of the wafer assembly. While it is desirable to have at least two retaining bars 171 (each located on a different side of the connector), a triangular arrangement of the plurality of retaining bars 171 has been determined to be beneficial because it provides improved control and support for the plurality of lamellae 221 that make up the lamellae assembly 220. It has been determined that eliminating the base provides certain unexpected benefits. One issue is that no base is perfectly square and straight, so tolerances in the base are added to the tolerances in the lamellae and thereby increase the tolerances in the location of the plurality of tails. By eliminating the base, applicants are able to better control the position of the tails of the lamellae assembly relative to the housing. Eliminating the base also allows the size of the socket to be reduced, thereby allowing for increased density.

[0087] Each wafer 221 includes an insulating frame 221a. The illustrated insulating frame 221a includes a top protrusion 224 and supports a plurality of terminal sets 252, 262, 272 (as contemplated, in some embodiments, there is a three-wafer system comprising a ground wafer and two signal wafers). It should be noted that the illustrated terminal configuration, while beneficial for the illustrated receptacle, is not intended to be limiting, as the features of providing a connector without a base have broad applicability. These design elements, thereby providing for the elimination of the base, can be used with a wide range of wafer configurations.

[0088] The terminal group 252 includes a plurality of terminals 253, each of which includes a contact portion 253a, a tail portion 253b, and a body portion 253c extending therebetween. Similarly, the terminal group 262 includes a plurality of terminals 263, each of which includes a contact portion 263a, a tail portion 263b, and a body portion 263c extending therebetween. Because the tail portions 253b and 263b shown are used for press-fitting into a circuit board, it would be helpful to provide a socket that can quickly apply force to these tail portions to press them into multiple guide holes on a circuit board. As shown, the insulating frame 121a includes a plurality of top protrusions extending to a top wall 122 of the cover 120. Due to the design shown, the force applied to the cover 120 is transmitted to the tail portions 253b and 263b through the insulating frame 121a, thereby making a reliable press-fit operation possible.

[0089] The plurality of top protrusions 124 are shown with a plurality of notches 124a, so that the sheet engages the top wall at various locations while leaving gaps. The plurality of notches 124a can be arranged in a pattern that allows air to flow along the top wall 122 of the cover in a desired manner. As can be appreciated, the number, size, and location of the notches 124a can be varied appropriately to provide the desired air flow.

[0090] It should be noted that although the plurality of notches 124a provide a serpentine path for air to flow through, the plurality of notches 124a do not provide a straight path for air to flow between the plurality of lamellae and the top wall and thus may increase the pressure drop of the air flow through the receptacle. Although the path shown may be considered a zigzag or wavy path, other paths may be provided, depending on the configuration of the top wall. Chamfers may be used on some or all of the top protrusions (see, e.g., Figure 32 In an alternative embodiment, the protrusion 124 may be shortened and an insert 129a (at the top of the Figure 26 120 and the top wall 122. Insert 129a can transfer force from the top wall 122 to the lamellae 221 while providing a more optimized air flow path between the top wall 122 and the lamellae 220 (thereby reducing air resistance). In another alternative embodiment, insert 129a can be removable and used only to mount the connector on the circuit board 10 before being removed. In such a design, the rear wall 125 of the cover 120 can be attached after both the cover 120 (or at least a large portion thereof) and the connector 129 are pressed into the circuit board, and the opening can provide reduced air resistance. Thus, many variations are possible, depending on the need for air flow and the desire to manage costs.

[0091] The design shown provides a plurality of lamellae 221 having a front contact row 245 and a rear contact row 246 spaced apart in a plug module insertion direction, and these contact rows are configured to engage two rows of pads on a mating connector. Although not required, the benefit of such a design is a significant increase in density. If such density is not required, then the plurality of lamellae can be made to support a smaller number of terminals. It should be noted that the plurality of lamellae shown are arranged in a pattern that provides a repeatable ground, signal, signal pattern. Other patterns are also possible if desired. If desired, the ground lamellae can include terminals that are commoned together, and in one embodiment, the ground lamellae can have the contacts engage the top wall to provide electrical grounding to the cover.

[0092] Because connector 129 does not require a base (although a base is feasible if desired in certain embodiments), the illustrated connector 129 utilizes a wafer assembly 220 to support a slot-type connector. As shown, each slot-type connector 150, 160 includes shoulders 156a, 156b similar to the retaining features on at least some of the wafers in wafer assembly 220 to provide the desired position and stability control. In one embodiment, only the grounding wafer may include the retaining features. As shown, shoulders 156a, 156b may include grooves 154 that engage protrusions 226, but other retaining configurations are also suitable. The slot-type connectors 150, 160 are positioned in ports 121a, 121b defined by housing 120 and provide slots 151 that have multiple contacts located on either side of the slots 151. The card slot 151 preferably includes terminal slots 155 for the front contact row 245 so that the most vulnerable contacts are protected during initial mating with a mating plug connector. Because the front of the card slot connectors 150, 160 helps align and control the mating paddle card, the rear contact row 246 can advantageously omit the terminal slots. If desired, a card slot connector 160 can include a peg 166 for insertion into a circuit board, but such a feature is optional and is not expected to be helpful for a design including two vertically arranged ports in a 2XN configuration.

[0093] In one embodiment, the retaining strip 171 can be configured to engage the cover 120. The retaining strip 171 can be made wider than the wafer array 220 so that the retaining strip 171 slides along the side walls of the cover 220. If such a structure is desired (which helps ensure proper alignment of the cover 120 to the wafer array 220), the retaining strip 171 can include ventilation holes 172 to allow air to flow through the socket more quickly.

[0094] It has been determined that for a fully double-row design, die-cut forming is desirable for all contacts (it has been determined that this provides mechanical and signal integrity benefits). Thus, the illustrated embodiment features two rows of stamped contacts on either side 151 a, 151 b of the slot 151.

[0095] To support the front contact row 245, the sheet 221 includes an arm 228 that extends beyond the rear contact row 246. The arm 228 helps ensure that the impedance across the body of the sheet is more uniformly managed. To provide suitable flexibility, the arm 228 may include a notch 228a that allows the arm 228 to flex slightly.

[0096] As described above, each of the multiple terminals includes a contact portion, a tail portion, and a body portion extending therebetween. The illustrated configuration includes a grounding wafer 271 and a signal wafer assembly 250, which includes a first signal wafer 251 and a second signal wafer 261. One signal wafer can be said to support multiple negative (-v) signals, while the other signal wafer can correspondingly be said to support multiple positive (+v) signals; together, these signals form a set of differential pair signals (-v / +v). The signal wafer assembly 250 thus provides a top port, a first differential pair 254a, a second differential pair 254b, a third differential pair 254c, and a fourth differential pair 254d. The signal wafer assembly 250 also provides a bottom port, a fifth differential pair 255a, a sixth differential pair 255b, a seventh differential pair 255c, and an eighth differential pair 255d. What can be recognized from the terminal structure shown is that, for the top port and the bottom port, the terminals forming the two rear differential pairs are positioned so that the tails are located between the tails of the two differential pairs forming the front contacts. For example, differential tail groups 257b and 257c are associated with contact pairs 258b and 258c, respectively, while contact pairs 258b and 258c are located in the rear contact row. Differential tail groups 257a and 257d are on both sides of differential tail groups 257b and 257c and are associated with contact pairs 258a and 258d located in the front contact row. It has been confirmed that this structure is beneficial because, although it has a significantly long terminal, it allows three rows of terminals to have similar lengths. The embodiment shown thus helps provide more consistent terminal lengths.

[0097] As can be appreciated, a top row of contacts is positioned opposite a bottom row of contacts. In one embodiment, the contacts of the terminals forming the top row of contacts may have a formed portion 256b that is bent in a first direction, while the terminals forming the bottom row of contacts may have a formed portion 256a that is also bent in the first direction. For example, when viewing the contacts straight ahead in a plug module insertion direction, all groups of contacts may have formed portions that bend to one side (e.g., they may all bend to the left or to the right). While such a configuration is beneficial, it has been found that for some applications, it is desirable to offset the top row of contacts from the bottom row of contacts. To provide this functionality, the contacts may taper downward from a beam portion 302a, 302b to a pad contact portion 301a, 301b, wherein the pad contact portion 301a, 301b is less than half the width of the beam portion 302a, 302b. If desired, the pad contacts of the top row and the pad contacts of the bottom row can be located on opposite sides of the beam to provide an offset alignment. If such an alignment is not desired, the contacts can be arranged symmetrically or in some other desired configuration.

[0098] The spacing can vary depending on the interface that will be used. As shown, the multiple terminals are at an x-spacing, which may be 0.8mm and the top and bottom terminals may have a y-offset, which may be 0.4mm. If the connector provides a double row of contacts at the top and bottom and the front contacts are intended to be compatible with existing designs, it would be beneficial to match the spacing of the contacts to the existing design. If a completely new design is preferred, the spacing can be varied as needed, keeping in mind that signal integrity performance will be more challenging as the spacing decreases below 0.8mm and a spacing below 0.65 typically requires additional features, such as biased plug-in cards and / or contact interfaces (such as used in OCULINK connectors).

[0099] Figures 27 to 51 Shown above reference Figures 1 to 26 Alternative embodiments of certain aspects of the connector embodiments described. Figures 27 to 51 The illustrated embodiments may be combined in whole or in part with certain connector embodiments already described, depending on the specific aspects of the implementation. Thus, some aspects of the connector embodiments may remain unchanged, some aspects may be replaced with the currently described structures, and some aspects may be modified to incorporate the currently described structures.

[0100] As from Figure 27As can be appreciated, a receptacle 500 is mounted on a circuit board 510 and provides a right-angle structure configured to receive a plug module (not shown), such as, for example, plug module 20. The illustrated receptacle 500 is designed for use with plug modules that include cooling slots (such as, for example, cooling slot 115), although such cooling slots are not required in receptacle 500 for compatible plug modules.

[0101] The receptacle 500 includes a housing 520 and can support a light pipe, if desired (see, for example, light pipe 105). The housing includes a top wall 522, a first side wall 523, a second side wall 524, a rear wall 525, and a front edge 526. The receptacle 500 defines a top port 521a and a bottom port 521b. The top wall and both side walls may include ventilation holes 535.

[0102] As can be appreciated, the illustrated design is intended to facilitate cooling of an inserted plug module. Thus, the design has been tailored to improve airflow in a variety of ways, as will be discussed herein. In certain embodiments, the receptacle 500 may include an internally mounted heat sink (see, for example, internally mounted heat sink 134) in communication with a front grille 530 and a rear aperture array (see, for example, rear aperture array 132). The top wall 522 may include a cooling opening 522a, and an externally mounted heat sink may be positioned within the cooling opening 522a. These mounted heat sinks are typically designed so that they extend into the port and engage an inserted plug module, which helps provide a conductive path for directing heat away from the plug module. It should be noted that in some cases, additional cooling may not be desirable (e.g., in applications where active modules are not intended), and in such cases, many optional thermal features may be omitted. Thus, the illustrated internally mounted heat sink and various ventilation features may be omitted if not required.

[0103] A common design for existing receptacles utilizes a base located within a housing that helps define a connector. The housing helps support the mating plug module and can also help support the connector and provide EMI protection. The connector, located within the housing, supports multiple terminals, each of which includes a tail and a contact portion that allows the mating plug module to be electrically connected to a circuit board (or, if a bipass design is desired, to a cable). For ease of assembly, the receptacle, which is typically press-fit onto a circuit board, aligns the connector terminals with the ends of the housing. As will be appreciated, the housing can be formed of metal and is intended to have a fairly repeatable layout of tails with desired dimensional control relative to one another. The connector's tails can also be carefully manufactured so that the tails align with one another. However, aligning the connector tails with the housing tails is somewhat more difficult due to the presence of multiple dimensional stacking. This dimensionality issue is exacerbated by the fact that, in a typical press-fit design, the base supports a thin wafer that, in turn, supports the multiple terminals. Thus, the terminals are dimensionally controlled relative to each other within a wafer but are dimensionally stacked relative to the base and other wafers, while the base is dimensionally stacked with the cover. Existing designs have attempted to have a datum that acts as a stop to carefully control the insertion of the base into the cover, controlling the tolerances between the datum point and the tail of both the cover and the connector.

[0104] While such control is possible, it presents more challenges and difficulties, particularly as the tail decreases in size. Applicants have determined that, instead of having a stop that limits and controls the position of the base relative to the cover, it is more desirable to have a system in which the cover 520 and connector 529 are docked together in a manner that allows for infinite adjustment within a small range, so that docking of the cover 520 and connector 529 can be accomplished in a controlled manner and dimensional control can be ensured. Figure 7BFor example, referring to bottom walls 140 and 141, tongue 142, and tongue slots 153 and 163, the housing 520 includes two bottom walls, each having a tongue that inserts into a respective slot-type connector 550, 560. More specifically, these tongues from the housing 520 insert into the tongue slots in the mating portions of the slot-type connectors 550, 560, respectively. As can be appreciated, the slot-type connectors 550, 560 engage a thin-plate assembly 620 and provide some additional dimensional stacking between them. In one embodiment, this insertion can be accomplished based on alignment between the thin-plate assembly 620 and the housing 620, thereby eliminating some dimensional stacking that would otherwise exist. In one embodiment, the tongues provide an interference fit with the tongue slots, so that the housing and connector 529 are properly engaged and remain in the proper position relative to each other. Such a manufacturing process allows the positions of the cover 520 and the wafer assembly 620 relative to each other to be better controlled and improves the productivity of the socket while ensuring that the socket can be properly mounted on a circuit board.

[0105] As can be appreciated from these figures, the illustrated connector 529 omits a base. Applicants have surprisingly discovered that a base is not necessary to support a wafer assembly 620, as long as the wafers are securely fastened together, preferably on at least two sides. In one illustrated embodiment, a plurality of retaining bars 571 are located on opposing sides, with one side having two retaining bars 571. The plurality of retaining bars 571 are connected to the wafer assembly 620 via wafer protrusions, such as wafer protrusions 629, which can be heat-soldered to the retaining bars 571. The illustrated connector 529 shows an embodiment in which two retaining bars are located on one side, one retaining bar is located on a second side, and one retaining bar is located on a third side of the wafer assembly 620. It has been determined that eliminating the base provides certain unexpected benefits. One aspect is that no base is perfectly square and straight, so tolerances in the base are added to the tolerances in the wafers, and thus increase the tolerances in the locations of the multiple tails. By removing the base, it is believed that the position of the tails of the wafer group relative to the cover can be better controlled. Removing the base also allows the size of the socket to be reduced, thereby allowing for increased density.

[0106] The illustrated connector 529 shows an embodiment having two retaining clips 572 for securing the card slot connectors 550 and 560 to the wafer assembly 620. The retaining clips 572 connect to the card slot connectors 550 and 560 via protrusions or posts that can be heat-soldered to the retaining clips 572. Depending on the embodiment, some or all of the retaining strips or either or both of the retaining clips can be conductive structures for providing a common ground across some or all of the ground wafers. Also depending on the embodiment, there can be a digital ground and a chassis ground, with the digital ground typically associated with signal transmission and a signal reference, while the chassis ground typically relates to an external shield function and an earth reference. In some systems or situations, it is desirable to isolate the digital and chassis grounds from each other, while in other situations it may be advantageous to share a common ground for the digital and chassis grounds. The retaining strips and retaining clips may not perform any common grounding function, or they may perform common grounding for either the digital ground or the chassis ground, or some combination thereof. For example, the retaining strips may perform common grounding for the digital ground, while the retaining clips may perform common grounding for the chassis ground. In other embodiments, at least some of the retaining strips engage the cover, so it may be undesirable for them to contact the plastic coating of one or more grounded foils, thereby maintaining isolation between the different grounds of the foils and the cover.

[0107] Similar to the previously described wafer design, wafer assembly 620 has a front row 641 and a rear row 642 of contacts spaced apart in a plug module insertion direction, with the two rows of contacts configured to engage two rows of pads on a mating connector. While not required, such a design benefits from a significant increase in density. If such density is not desired, the wafer can be manufactured to support a smaller number of terminals.

[0108] The illustrated laminar assembly 620 includes three laminar blocks, with two high-speed laminar blocks 660 flanking a low-speed / power laminar block 670. It should be noted that the illustrated high-speed laminar blocks 660 are arranged to provide a ground-signal-signal-ground-signal-signal-ground pattern, while the low-speed / power laminar block 670 is arranged to provide a signal-signal-power-signal-signal pattern or a signal-signal-ground-signal-signal pattern. Other patterns are also possible. Thus, the high-speed laminar block 660 includes a left ground laminar block 661, a left differential pair signal laminar block 662, a middle ground laminar block 663, a right differential pair signal laminar block 664, and a right ground laminar block 665, arranged in sequence.

[0109] Each of the signal wafer pairs 662, 664 includes an insulating frame (molded plastic, such as LCP, for example) disposed on or around a plurality of signal terminals. Figures 40 to 43 The signal sheet pair 662 includes an insulating frame 662a and an insulating frame 662b. Figure 21 In the embodiment of the present invention, for example, as shown in the plurality of terminal groups 252, 262), the insulating frames 662a, 662b shown support the plurality of terminal groups 710, 712, respectively. The insulating frames can be formed by insert molding or overmolding around the plurality of terminal groups 710, 712 or with a base member manufactured independently of the plurality of terminal groups. The terminal groups 710, 712 and the terminals 711, 713 can be the same or similar to the terminal groups 252, 263 and the terminals 253, 263 described above.

[0110] like Figure 42 and Figure 43 As shown (and refer to Figure 21 to Figure 2 5), each terminal of each differential pair is broad-side coupled to another terminal with only an air gap between them except along their outer edges (where they are supported by the insulating frame of their respective thin sheets). More specifically, each terminal 711 of the terminal group 710 includes a terminal web 715 of insulating material of the insulating frame 662a, which partially surrounds the terminal along the length or substantially the entire length of the terminal. The terminal web 715 includes: an upper portion 715a, which extends in a continuous manner along the entire length of each terminal 711 and along the upper edge; and a lower portion 715b, which extends in a continuous manner along the entire length of each terminal and along the lower edge. The inner surface of each terminal (i.e., facing its broadside coupled mating terminal) is free of insulating material, such as Figure 42 The opposite side of each terminal (i.e., facing its adjacent grounding sheet 661) is generally free of insulating material but includes insulating material along certain portions thereof. The insulating frame 662a also includes connecting webs 716 extending between and connecting the plurality of terminal ribs 715. As shown, the connecting webs 716 extend over portions of the terminals 711 at 716a. In some embodiments, the overlapping portion 716a may be omitted. The terminal ribs 715 and the connecting webs 716 define a plurality of voids or openings 717 along their lengths between the vertically aligned pairs of terminal ribs.

[0111] The terminal 713 of the terminal group 712 is configured with a terminal rib 720 of the insulating material of the insulating frame 662b. The terminal rib 720 is similar to the rib 715 but mirrored along the length of the terminal or substantially the entire length of the terminal. The terminal rib 720 includes a similar upper portion 720a, a lower portion 720b, a connecting rib 721, an insulating portion 721a, and an opening 722, and their descriptions are not repeated. When the insulating frames 662a and 662b are aligned and fixed together, the terminal rib 715, the connecting rib 716, and the opening 717 of the frame 662a are aligned with the terminal rib 720, the connecting rib 721, and the opening 722 of the frame 662b respectively. When the insulating frames 662a and 662b are fixed together, the aligned openings 717 and 722 define an opening 723 that passes through the entire signal sheet body pair.

[0112] The insulating frames of each signal sheet pair 662, 664 can be fixed together in any desired manner. Figures 42 to 43 As shown, the insulating frames 662a, 662b of the pair of signal blades 662 have posts or protrusions 691 and complementary-shaped holes or recesses 692 for mating with each other when combined. (Depending on the embodiment, some or all of the holes of the signal blades may not extend all the way through the blades, and the illustrated arrangement of posts and holes is merely one example; many variations are possible.) In some embodiments, the posts and holes of one signal blade have an interference fit with the other. Furthermore, in some embodiments, the pair of signal blades are welded together to secure the alignment of their respective plurality of terminal sets and, therefore, the alignment of the corresponding pairs of terminals (one terminal from each terminal set) that create the resulting differential pairs.

[0113] The grounding sheets 661, 663, 665 are formed of metallized plastic to allow for conductivity and a common ground. For example, the metallized plastic can take a variety of forms: it can be doped to become sufficiently conductive, it can be plated, it can be doped and plated, it can be inked, it can be etched, or it can be some combination of any of the foregoing. Although, in the case of plating, the plating can cover the entire surface of the grounding sheet, selective plating may be desirable. In some embodiments, the metal contact insert 668 and the metal tail insert 669 (e.g., Figure 34 As shown) is stitched or inserted into the recess of the grounding sheet body 665 (as shown) Figure 35, 661, 663, 665.

[0114] Furthermore, and more generally, the method being described facilitates combining a molded and galvanized series conductive path with a conductive sheet supported communication portion, such as a press-fit terminal set connected to a PCB, between a conventional mateable connector portion and a conventional termination portion. The conductive communication portion is conventionally formed by extension of a stamped press-fit tail portion, while similarly stamped metal portions form ground and / or signal terminals. The contemplated press-fit plug-in is contemplated to provide a hybrid solution that combines the versatility of stamped features with the precision and versatility of molded plastic with inherent conductive elements. Although the set of solutions described herein primarily relates to the incorporation of a molded conductive ground system with a common ground terminal set, the application of the technology can also be applied to discrete signal terminals.

[0115] As shown, the grounding sheets 661, 663, and 665 have multiple raised areas (protrusions), posts, and recesses for mating with each other when the signal sheet pair 662 and 664 are interposed therebetween. In some embodiments, the posts and recesses of one grounding sheet provide an interference fit with the opposing sandwiching grounding sheet, and in some embodiments, the raised areas of each grounding sheet substantially fill the cavity of the sandwiching signal sheet pair. (Depending on the embodiment, some or all of the recesses of the grounding sheets may instead be holes in the grounding sheet for receiving the posts of the opposing grounding sheets, and the illustrated post and recess layout is merely an example; numerous embodiments are possible depending on variations.) It is desirable that some or all of the raised areas (protrusions), posts, and / or recesses be metallized to enable electrical continuity and shared grounding between the grounding sheets 661, 663, and 665.

[0116] More specifically, the ground wafers 661, 663, 665 are configured to be substantially or completely electrically isolated and provide desired impedance control along each differential signal pair of the signal wafer pair 662, 664. Figures 51 to 56 Each adjacent pair of grounding blades (i.e., grounding blades 661, 663 and grounding blades 663, 665) includes a series of interlocking protrusions 735, 738, 739 that form part of a shielding structure that, along with the generally planar structure of the grounding blades, surrounds or substantially surrounds the path 730 in which the terminal ribs 715, 720 are disposed to substantially shield at least the differential pair of terminals along the entire length of the terminals or a significant portion of the length of the terminals. The interlocking protrusions 735, 738, 739 form conductive grounding links between the grounding blades 661, 663, 665.

[0117] Reference Figures 36 to 37 , the middle ground wafer 663 includes a plurality of spaced-apart raised areas or protrusions 735 on each of a first side 663a and an opposite second side 663b. The plurality of protrusions 735 are grouped together and aligned to form a plurality of channels 731a, which form a portion of a path 730 within which the terminal ribs 715, 720 of the signal wafer pair 662, 664 are disposed. The protrusions 735 are shown as having a variety of shapes and configurations, but in each case, the protrusions 735 are configured to abut or engage a similar but oppositely configured structure on the facing ground wafer 661, 665 to create a complementary, mutually engaging structure.

[0118] In one example, some protrusions 735a include a plurality of generally rectangular, spaced-apart smaller protrusions or teeth 736. In another example, protrusion 735b includes one or more circular pillars or protrusions 737, with or without one or more rectangular protrusions 736. In yet another example, protrusion 735c includes a single rectangular protrusion 736. In still other examples, protrusion 735d includes a circular socket, while protrusion 735e includes a single rectangular socket. The multiple protrusions 735 may extend linearly and / or at an angle and be spaced apart to further define the channel 732a within which the connecting ribs 716, 721 are disposed. Other configurations are also contemplated. As shown, the protrusions 736, 737 have different heights, which may aid in aligning and assembling the grounding sheets 661, 663, 665. In some cases, alternating the heights of the protrusions 736, 737 may also provide improved electrical functionality.

[0119] Reference Figure 34Left grounding sheet 661 includes a flat first surface 661a and an opposite second side 661b. Second side 661b includes a plurality of protrusions 738 that are similar to, but inversely configured, the protrusions 735 on first side 663a of center grounding sheet 663. Using the example described above, each protrusion 738a abuts an oppositely configured and aligned protrusion 735a, each protrusion 738b abuts an oppositely configured and aligned protrusion 735b, and each protrusion 738c abuts an oppositely configured and aligned protrusion 735c. The plurality of protrusions 738 similarly define channels 731b within which portions of terminal ribs 715 and 720 are disposed, as well as channels 732b within which portions of connecting ribs 716 and 721 are disposed. The channels 731a, 731b interact to define a shielded terminal path 730 within which the terminal ribs 715, 720 are disposed, while the channels 732a, 732b interact to define a rib path 733 within which the connecting ribs 716, 721 are disposed.

[0120] Similarly, right grounding sheet 665 includes a flat first surface 665a and an opposite second side 665b. Second side 665b includes a plurality of protrusions 739 that are similar to, but inversely configured, the protrusions 735 on second side 663b of center grounding sheet 663. Using the example described above, each protrusion 739a abuts against an oppositely configured and aligned protrusion 735a, each protrusion 739d abuts against an oppositely configured and aligned protrusion 735d, and each protrusion 739e abuts against an oppositely configured and aligned protrusion 735d. The plurality of protrusions 739 similarly define channels 731b within which portions of terminal ribs 715 and 720 are disposed, as well as channels 732b within which connecting ribs 716 and 721 are disposed. The channels 731a, 731b interact to define a terminal path 730 within which the terminal ribs 715, 720 are disposed, while the channels 732a, 732b interact to define a rib path 733 within which the connecting ribs 716, 721 are disposed.

[0121] Although the protrusions 735 on the opposite sides 663a, 663b of the intermediate grounding sheet 663 are identically constructed and therefore the protrusions 738 and 739 are identically constructed, other constructions may be employed as long as these protrusions of the grounding sheets 661, 663, 665 engage with one another to form a terminal path 730 formed by the terminal channel 731 and a rib path 733 formed by the rib channel 732.

[0122] The grounding sheets 661, 663, and 665 can be secured together in any desired manner. As shown, the center grounding sheet 663 includes a plurality of recesses or sockets 740 on a first side 663a and a plurality of posts 741 on a second side 663b. The left grounding sheet 661 includes a plurality of posts 742 on a second side 661b that are configured to be secured within the sockets 740 on the first side 663a of the center grounding sheet 663 to secure the left and center grounding sheets together. The right grounding sheet 665 includes a plurality of sockets 743 on a second side 665b that are configured to be secured to the posts 741 on the second side 663b of the center grounding sheet 663 to secure the right and center grounding sheets together. If desired, the posts 741, 742 may include compression ribs 741a, 742a to assist in securing the grounding sheets 661, 663, 665 together.

[0123] To assemble a high-speed wafer block 660, a signal wafer pair 662 is assembled by aligning and securing the insulating frames 662a and 662b containing the terminal groups 710 and 712 therein. A second signal wafer pair 664 can be assembled in the same manner. The left ground wafer 661 is secured to the middle ground wafer 663 by the first signal wafer pair 662 positioned between the left ground wafer 661 and the middle ground wafer 663. In doing so, the first signal wafer pair 662 is positioned between the left ground wafer 661 and the middle ground wafer 663, with the terminal ribs 715 and 720 aligned with the terminal channels 731a on the first side 663a of the middle ground wafer 663 and the terminal channels 731b on the second side 661b of the left ground wafer 661. The connecting ribs 716 , 721 are aligned with the rib channels 732 a on the first side 663 a of the middle ground sheet 663 and the rib channels 732 b on the second side 661 b of the left ground sheet 661 .

[0124] The right ground sheet 665 is secured to the middle ground sheet 663 by the second signal sheet pair 664 positioned between the right ground sheet 665 and the middle ground sheet 663. In doing so, the second signal sheet pair 664 is positioned between the middle ground sheet 663 and the right ground sheet 665, with the terminal ribs 715, 720 aligned with the terminal channels 731a on the second side 663a of the middle ground sheet 663 and the terminal channels 731b on the second side 665b of the right ground sheet 665. The connecting ribs 716, 721 are aligned with the rib channels 732a on the second side 663b of the middle ground sheet 663 and the rib channels 732b on the second side 665b of the right ground sheet 665.

[0125] Reference Figures 51 to 56The first signal blade pair 662 is interposed between the left ground blade 661 and the middle ground blade 663, while the second signal blade pair 664 is interposed between the middle ground blade 663 and the right ground blade 665. The conductive properties and structure of the ground blades 661, 663, and 665 along the terminal channels 731a and 731b provide lateral shielding and impedance control for the terminals within the signal blade pairs 662 and 664. The protrusions 735 of the middle ground blade 663 interact or engage with the protrusions 738 of the left ground upright blade 661 and the protrusions 739 of the right ground blade 665 to substantially fill the voids or openings 723 in the signal blade pairs 662 and 664. The conductive properties and structure of the protrusions 735, 738, and 739 within the opening 723 provide vertical shielding and impedance control for the terminals within the signal wafer pair 662 and 664. Thus, due to the conductive plating on the ground wafers 661, 663, and 665, the terminals 711 and 713 of each differential signal pair are substantially surrounded by a conductive shield from the ground wafer along their entire length. Interruptions in this shielding occur within the gaps between the protrusions 735, 738, and 739 that form the rib channel 732. However, such interruptions are sufficiently small and infrequent that they do not significantly interrupt or affect the electrical performance of the illustrated connector system.

[0126] The fully assembled structure includes the terminal ribs 715, 720 tightly positioned within the terminal channels 731a, 731b and the connecting ribs 716, 721 positioned within the rib channels 732a, 732b, so that the assembled signal blades 662, 664 and ground blades 661, 663, 665 form a rigid assembly. The rigidity of the assembly helps distribute forces during press-fitting of the assembly onto a circuit board.

[0127] Various alternative configurations are contemplated. For example, referring to Figure 57 The ground connections, such as protrusions 735, 738, 739, between the ground wafers 661, 663, 665 may have other configurations, including a small number of rectangular protrusions 745 and a large number of cylindrical posts 746, as well as complementary shaped docking structures on the aligned ground wafers 661, 663, 665. Additionally, in some embodiments, all ground connections may not be plated or directly electrically connected to an adjacent ground wafer.

[0128] Further, rather than forming the grounding sheets 661, 663, 665 of metallized plastic and inserting the metal contact insert 668 and the metal tail insert 669, these grounding sheets can be formed in other ways, such as by stamping the contacts and tails as part of a lead frame assembly and then forming a metallized plastic structure around the lead frame including the contacts and tails. In other words, an alternative form of grounding sheet can be used in conjunction with Figure 18 A similar ground wafer is formed (i.e., a lead frame with contacts and tails) but incorporates a ground connection between the wafers that extends through the pair of signal wafers. This alternative ground wafer including the ground connection may be formed from metallized plastic that is then electrically connected to the lead frame within the wafer.

[0129] Still further, in another embodiment, a structure can be formed, such as from metallized plastic, including protrusions 735, 738, and 739, wherein such structure is subsequently connected to a conductive ground plane having contacts and tails. Alternatively, the signal terminals can be edge-coupled rather than broadside-coupled. In one example, the terminals of each differential pair can be located in a separate signal wafer or pedestal and edge-coupled so that they are horizontally aligned and located between a pair of ground wafers. In another example, the terminals of each differential pair can be edge-coupled and vertically aligned in a pedestal located between a pair of ground wafers.

[0130] In yet another aspect, the grounding sheets 661, 663, 665 can be configured to enhance shielding and further electrical isolation between the front contact row 641 and the rear contact row 642 within the slots 750, 751. More specifically, referring to Figures 58 to 59 The grounding sheets 661, 663, and 665 further include protrusions extending laterally within the upper and lower slots 750 and 751. The left grounding sheet 661 includes a protrusion 755 extending laterally within the slots 750 and 751 from the second side 661b toward the middle sheet 663 and toward a horizontal centerline of the slots.

[0131] The middle ground sheet 663 includes a protrusion 756 extending laterally within the slots 750, 751 from a first side 663a toward the left ground sheet 661 and toward a horizontal centerline of the slots. The middle ground sheet 663 also includes a protrusion 757 extending laterally within the slots 750, 751 from a second side 663b toward the right ground sheet 665 and toward a horizontal centerline of the slots. The right ground sheet 665 includes a protrusion 758 extending laterally within the slots 750, 751 from a second side 665b toward the middle sheet 663 and toward a horizontal centerline of the slots. Figure 44). Protrusions 755-58 enhance shielding and further electrical isolation between the front contact row 641 and the rear contact row 642 within the slots 750 and 751. In one embodiment, pairs of protrusions (e.g., 755, 756 and 757, 758) can be mechanically or electrically interconnected to further enhance shielding and isolation functions.

[0132] The disclosure provided herein illustrates features by means of preferred and exemplary embodiments thereof. Upon reading this disclosure, one of ordinary skill in the art will envision numerous other embodiments, modifications, and variations within the scope and spirit of the appended claims.

Claims

1. A connector assembly comprising: a housing defining a port; a card slot located in the port; a sheet block aligned with the card slot, the sheet block including a pair of grounding sheets and a pair of signal sheets, the pair of signal sheets each supporting at least four terminals, wherein the terminals are arranged in two rows with contact portions disposed on a first side and a second side of the card slot, the pair of signal sheets being positioned adjacent to each other and the pair of grounding sheets being located on both sides of the adjacent pair of signal sheets, wherein the connector assembly engages the thin-sheet body block with a slot-type connector having a shoulder having a groove for engaging a protrusion located on the top of the thin-sheet body block, and Wherein, each of the pair of signal thin sheets includes a plurality of signal terminals, and each of the plurality of signal terminals includes: a terminal rib of insulating material, the terminal rib not completely surrounding each signal terminal along substantially the entire length of each signal terminal; A connecting rib extends between and connects the plurality of terminal ribs, wherein the terminal ribs and the connecting rib define a plurality of cavities between pairs of vertically aligned terminal ribs along their lengths.

2. The connector assembly according to claim 1, wherein A plurality of holding strips are disposed on opposite sides of the sheet body.

3. The connector assembly according to claim 2, wherein: The wafer block has two retaining strips on one side and one retaining strip on the other side, thereby forming a triangular layout.

4. The connector assembly according to claim 2, wherein: The plurality of holding strips are connected to the thin sheet through thin sheet protrusions, and the thin sheet protrusions can be thermally welded to the holding strips.

5. The connector assembly of claim 1, wherein: Each of the thin sheets includes an insulating frame, and the insulating frame includes a plurality of top protrusions extending to the top wall of the cover.

6. The connector assembly according to claim 5, wherein: The plurality of top protrusions have a plurality of notches, so that the thin sheet body engages the top wall at a plurality of locations while leaving gaps.

7. The connector assembly of claim 6, wherein: The plurality of apertures can be arranged in a pattern that allows air to flow along the top wall of the enclosure in a desired manner.

8. The connector assembly of claim 5, wherein: The protrusion can be shortened and an insert can be located between the laminar block and the top wall of the cover, the insert being able to transfer forces from the top wall to the laminar block while providing a more optimized air flow path between the top wall and the laminar block.

9. The connector assembly of claim 1, wherein: The bottom wall of the cover body is provided with a tongue piece inserted into the card slot type plug-in connector, and the tongue piece is inserted into the tongue piece groove in the card slot type plug-in connector.

10. The connector assembly of claim 1, wherein: Each signal terminal includes a contact portion, a tail portion, and a body portion extending between the contact portion and the tail portion, and a terminal rib portion extends along the entire body portion of each signal terminal.

11. The connector assembly of claim 5, wherein: The terminal ribs include: an upper portion, which extends continuously along the entire length of each terminal and along the upper edge; and a lower portion, which extends continuously along the entire length of each terminal and along the lower edge. The insulating frame also includes a connecting rib extending between and connecting the plurality of terminal ribs. The inner surface of each terminal and the opposite side facing the adjacent grounding sheet are free of insulating material.

Images