Power conversion device

Abstract

The power conversion device of the present invention includes: a semiconductor module having connection terminals, a cooler, a control substrate, a capacitor module, a cover portion, a housing, and a connection bus bar. When viewed in a direction perpendicular to the top surface of the cooler, the semiconductor module, the cooler, the control substrate, and the capacitor module are overlapped and arranged. The capacitor module has a capacitor unit, a capacitor housing, a resin, and a capacitor bus bar. The capacitor bus bar has an inner side extension portion, an opening side extension portion, and an outer side extension portion. The connection bus bar extends from the connection terminal of the semiconductor module to the outer side surface of the outer side extension portion and has a portion extending in a direction parallel to the extension direction of the outer side extension portion. A capacitor connection portion is provided at the end portion of the connection bus bar on the outer side extension portion side.

Description

Technical Field

[0001] The present application relates to a power conversion device. Background Art

[0002] As environment-friendly vehicles, hybrid vehicles such as electric vehicles (EV: Electric Vehicle), HEVs (Hybrid Electric Vehicle), and PHEVs (Plug-in Hybrid Electric Vehicle) are being developed. For electric vehicles or hybrid vehicles, an electric motor is used as a power source. When driving an electric motor with an alternating current, in order to convert a direct current supplied from a direct current power source such as a battery into an alternating current, a power conversion device including an inverter is mounted on the vehicle. The power conversion device includes: a semiconductor module in which a switching semiconductor element for power conversion that converts a direct current into an alternating current is built; a drive circuit of the semiconductor module; a control circuit for controlling them; and a capacitor for smoothing current. In recent years, with the high-output of the power conversion device, the sizes of the semiconductor module and the capacitor tend to be enlarged.

[0003] On the other hand, for the power conversion device, it is required to have mountability on a vehicle, so miniaturization of the power conversion device is an important issue. For this reason, a power conversion device that realizes miniaturization by effectively using the space inside the housing of the power conversion device to arrange constituent components or modularizing the constituent components is disclosed (for example, refer to Patent Document 1). Although the space limitation allowed for the power conversion device in the in-vehicle environment is strict and the power conversion device needs to be miniaturized, high-output of the power conversion device is also important. Therefore, it is important to ensure a space for arranging a high-output semiconductor module in a limited space.

[0004] In the disclosed power conversion device, the semiconductor module and the capacitor are connected by a capacitor bus bar provided in the capacitor. The capacitor bus bar extends from the capacitor to the side of the semiconductor module and has a through hole at the end on the semiconductor module side. A through hole is also provided at the front end of the conductive plate connected to the semiconductor module, and the through holes on both sides are fastened with screws. The semiconductor module and the capacitor are connected by this screw fastening.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2010-183748 Summary of the Invention

[0008] Technical problems to be solved by the invention

[0009] In the above Patent Document 1, since the capacitor bus bar extending from the capacitor side to the side portion of the semiconductor module is used to connect the semiconductor module and the capacitor, the power conversion device can be miniaturized. However, since the capacitor bus bar extends from the capacitor to the side portion of the semiconductor module, a space for connection is required around the semiconductor module. Therefore, there is a problem that it is difficult to secure a space for arranging a semiconductor module with high output in the limited space of the power conversion device. In addition, in order to ensure the insulation distance, the connection portion between the capacitor bus bar and the semiconductor module needs to maintain a predetermined gap from the conductive portion such as the housing wall surface. Therefore, there is a problem that it is difficult to secure a space for arranging a semiconductor module with high output in the limited space of the power conversion device.

[0010] In addition, when the capacitor bus bar extends from the capacitor side to the side portion of the semiconductor module, due to the influence of the resin for sealing the capacitor unit, the dimensional accuracy of the front end portion of the capacitor bus bar connected to the semiconductor module is reduced. Therefore, the assembly of the semiconductor module and the capacitor requires efforts in ensuring a certain gap, etc. Therefore, a space for the gap, etc. is required around the semiconductor module. Therefore, there is a problem that it is difficult to secure a space for arranging a semiconductor module with high output in the limited space of the power conversion device.

[0011] Therefore, the object of the present application is to obtain a power conversion device that ensures a space for arranging a semiconductor module with high output and is miniaturized.

[0012] Technical means for solving the technical problems

[0013] The power conversion device disclosed in the present application includes: a semiconductor module having a main body portion formed in a plate shape with semiconductor elements disposed therein and connection terminals electrically connected to the semiconductor elements and protruding from the main body portion; a cooler having a bottom surface, a top surface, and side surfaces, and the top surface being thermally connected to one surface of the semiconductor module; a control substrate for controlling the operation of the semiconductor module; a capacitor module disposed on the bottom surface side or the top surface side of the cooler and electrically connected to the semiconductor module; a cover portion fixed to the top surface of the cooler and housing the semiconductor module, the control substrate, and the capacitor module when disposed on the top surface side; a housing fixed to the bottom surface of the cooler and housing the capacitor module when disposed on the bottom surface side; and a connection bus bar for connecting the connection terminals of the semiconductor module and the capacitor module. When viewed in a direction perpendicular to the top surface of the cooler, the semiconductor module, the cooler, the control substrate, and the capacitor module are overlapped and arranged. The capacitor module has a capacitor unit, a bottomed cylindrical capacitor housing for housing the capacitor unit and having an opening on the cooler side, a resin for sealing the capacitor unit inside the capacitor housing, and a capacitor bus bar electrically connected to the capacitor unit and exposed to the outside from the resin. The capacitor bus bar has: an inner extension portion extending toward the opening side along the inner surface of the side wall of the capacitor housing, an opening side extension portion extending outward from the opening side end portion of the inner extension portion along the end surface of the side wall located on the opening side, and an outer extension portion extending toward the bottom wall side along the outer surface of the side wall from the outer side end portion of the opening side extension portion. The connection bus bar extends from the connection terminal of the semiconductor module to the outer side surface of the outer extension portion and has a portion extending in a direction parallel to the extension direction of the outer extension portion. A capacitor connection portion connected to the outer extension portion is provided at the end portion on the outer extension portion side of the connection bus bar.

[0014] Advantages of the Invention

[0015] According to the power conversion device disclosed in the present application, the capacitor bus bar has an outer extension portion extending toward the bottom wall side along the outer surface of the side wall of the capacitor housing. The connection bus bar extends from the connection terminal of the semiconductor module to the outer side surface of the outer extension portion and has a portion extending in a direction parallel to the extension direction of the outer extension portion. A capacitor connection portion connected to the outer extension portion is provided at the end portion of the connection bus bar on the outer extension portion side. Therefore, the structure for connecting the semiconductor module and the capacitor module can be provided on the capacitor module side. Therefore, a space for arranging a high-output semiconductor module can be ensured on the top surface side of the cooler. Since a high-output semiconductor module can be arranged, the power conversion device can be made high-output. In addition, the structure for connecting the semiconductor module and the capacitor module can be provided on one side of the capacitor module, and the capacitor bus bar is arranged along the outer surface of the side wall of the capacitor housing. Thus, the gap between components required during assembly can be reduced, and the insulation distance considering the arrangement dimensional accuracy of the capacitor bus bar can be reduced. Thus, the power conversion device can be miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a perspective view showing the appearance of the power conversion device of Embodiment 1.

[0017] Figure 2 It is a perspective view showing the main part of the power conversion device of Embodiment 1.

[0018] Figure 3 It is an exploded perspective view of the power conversion device of Embodiment 1.

[0019] Figure 4 It is showing in Figure 1 The schematic cross-sectional view of the power conversion device cut at the A-A cross-section position.

[0020] Figure 5 It is showing in Figure 1 The schematic cross-sectional view of the power conversion device cut at the B-B cross-section position.

[0021] Figure 6 It is an exploded perspective view of the power conversion device of Embodiment 2.

[0022] Figure 7 It is a cross-sectional view of the power conversion device of Embodiment 2.

[0023] Figure 8 It is a cross-sectional view of the power conversion device of Embodiment 2.

[0024] Figure 9 It is an exploded perspective view of the power conversion device of Embodiment 3.

[0025] Figure 10It is a cross-sectional view of the power conversion device of Embodiment 3.

[0026] Figure 11 It is a cross-sectional view of the power conversion device of Embodiment 3.

[0027] Figure 12 It is an exploded perspective view of the power conversion device of Embodiment 4.

[0028] Figure 13 It is a cross-sectional view of the power conversion device of Embodiment 4.

[0029] Figure 14 It is a cross-sectional view of the power conversion device of Embodiment 4.

[0030] Figure 15 It is an exploded perspective view of the power conversion device of Embodiment 5.

[0031] Figure 16 It is a cross-sectional view of the power conversion device of Embodiment 5.

[0032] Figure 17 It is a cross-sectional view of the power conversion device of Embodiment 5.

[0033] Figure 18 It is an exploded perspective view of the power conversion device of Embodiment 6. Detailed Embodiment

[0034] Hereinafter, the power conversion device according to the embodiment of the present application will be described based on the drawings. In addition, the same or corresponding members and parts in each drawing are denoted by the same reference numerals for description.

[0035] Embodiment 1.

[0036] Figure 1 It is a perspective view showing the appearance of the power conversion device 100 of Embodiment 1, Figure 2 It is a perspective view showing the main part of the power conversion device 100, and is a view showing after removing the cover portion 5 and the housing 6, Figure 3 It is an exploded perspective view of the power conversion device 100, Figure 4 It is shown in Figure 1 A cross-sectional view showing the outline of the power conversion device 100 cut at the A-A cross-sectional position, Figure 5 It is shown in Figure 1 A cross-sectional view showing the outline of the power conversion device 100 cut at the B-B cross-sectional position, and is a view showing after omitting the screw 10. Figure 1The side indicated by arrow X in [the figure] is set as the front side of the power conversion device 100, and the side indicated by arrow Y is set as the side surface of the power conversion device 100. The power conversion device 100 is a device that converts DC power or AC power into AC power or DC power and outputs it.

[0037] <Power Conversion Device 100>

[0038] The power conversion device 100 is, for example, an inverter or a converter used in a vehicle such as an electric vehicle or a hybrid vehicle. To drive an electric motor including a motor, the inverter converts the DC current of the battery into an AC current. To charge the battery, the converter converts the AC current generated by the generator into a DC current. In addition, the power conversion device 100 converts the voltage through a boost converter and a buck converter to exchange energy between a low-voltage battery and a high-voltage battery.

[0039] As Figure 3 shown, the power conversion device 100 includes: a semiconductor module 1; a capacitor module 2 electrically connected to the semiconductor module 1; a cooler 3 having a bottom surface 3b, a top surface 3a, and a side surface 3c; a control substrate 4 for controlling the operation of the semiconductor module 1; a cover portion 5; a housing 6; and a connection bus bar 7 for connecting the semiconductor module 1 and the capacitor module 2. When observed in a direction perpendicular to the top surface 3a of the cooler 3, the semiconductor module 1, the cooler 3, the control substrate 4, and the capacitor module 2 are overlapped and arranged. Since the semiconductor module 1, the cooler 3, the control substrate 4, and the capacitor module 2 are overlapped and arranged, the power conversion device 100 can be miniaturized. As Figure 1 shown, in the power conversion device 100, the cover portion 5 and the housing 6 are mounted on the cooler 3 by, for example, screws (not shown), and the cooler 3, the cover portion 5, and the housing 6 form a frame structure and are mounted on the vehicle. In addition, Figure 1 there are no openings related to the input and output of the power conversion device 100 shown in [the figure].

[0040] The semiconductor module 1 includes: a main body portion 1a formed in a plate shape with semiconductor elements (not shown) provided inside; first connection terminals 1b and second connection terminals 1c that are electrically connected to the semiconductor elements and protrude from the main body portion 1a. The top surface 3a of the cooler 3 is thermally connected to one surface of the main body portion 1a of the semiconductor module 1. In the power conversion device 100, when the semiconductor module 1 is driven, the semiconductor elements and the circuits connected to the semiconductor elements generate heat. Therefore, the cooler 3 cools the semiconductor module 1. By using the cooler 3 for cooling, the temperature rise of the semiconductor module 1 is suppressed. By suppressing the temperature rise of the semiconductor module 1, the small and high-density power conversion device 100 can be effectively driven.

[0041] In the present embodiment, the power conversion device 100 hasFigure 1 a shape that is smaller in the direction of arrow Y and larger in the direction of arrow X as shown, but the shape of the power conversion device 100 is not limited thereto. Depending on the allowable space in which the power conversion device 100 is mounted, the power conversion device 100 may also have a shape that is larger in the direction of arrow Y and smaller in the direction of arrow X. Further, as Figure 2 shown, the connection between the semiconductor module 1 and the capacitor module 2 is arranged on the side surface in the Y direction where the size of the power conversion device 100 is smaller, thereby suppressing the enlargement of the overall size of the power conversion device 100. The connection between the semiconductor module 1 and the capacitor module 2 will be described in detail later.

[0042] The power conversion device 100 can of course also be used for purposes other than vehicle-mounted use. Further, although omitted in Figure 2 , electrical components such as a boost reactor are used in the power conversion device 100, and a terminal block for connecting the boost reactor and the like to the semiconductor module 1 and the like is mounted inside the power conversion device 100.

[0043] <Semiconductor Module 1 and Cooler 3>

[0044] The semiconductor module 1 and the cooler 3 will be described. The semiconductor elements included in the semiconductor module 1 are electronic components that constitute an inverter, a converter, an electronic relay, etc. of the power conversion device 100. The first connection terminal 1b is a terminal for electrically connecting the semiconductor element and the control substrate 4. The second connection terminal 1c is a terminal for electrically connecting the semiconductor element and the capacitor module 2. Signals such as the temperature, operating state, and abnormal state of the semiconductor module 1 are transmitted from the semiconductor module 1 to the control substrate 4 through the first connection terminal 1b. Further, a control signal for controlling the semiconductor module 1 is transmitted from the control substrate 4 to the semiconductor module 1 through the first connection terminal 1b. The DC current of a battery (not shown) is transmitted to the semiconductor module 1 through the second connection terminal 1c via the capacitor module 2. In the present embodiment, a structure including 6 second connection terminals 1c is shown, but the number of the second connection terminals 1c is not limited thereto, and may be less than 6 or more than 6.

[0045] As Figure 3As shown, the cooler 3 includes a main body portion 30, a plate-shaped base 31, and a refrigerant flow path 33. The main body portion 30 and the base 31 are joined and integrated by a joining portion 32. The joining is performed by screw fastening or FSW (Friction Stir Welding). By the joining of the main body portion 30 and the base 31, the refrigerant flow path 33 is formed inside the main body portion 30. The refrigerant is introduced into the inside of the refrigerant flow path 33 through a pipe (not shown) provided on the side surface 3c of the cooler 3, and is discharged to the outside after passing through the refrigerant flow path 33. For example, water or an ethylene glycol solution is used as the refrigerant. The base 31 is cooled by the refrigerant, and the semiconductor module 1 thermally connected to the top surface 3a of the cooler 3, i.e., the upper surface of the base 31, is also cooled by the refrigerant.

[0046] As Figure 1 shown, the side surface 3c of the cooler 3 is exposed to the outside. With such a configuration, heat generated from the semiconductor module 1, the capacitor module 2, etc. inside the power conversion device 100 can be easily dissipated to the outside. The cooler 3 is made of, for example, aluminum die casting.

[0047] The cooler 3 is integrated with the cover portion 5 and the housing 6 to form the frame structure of the power conversion device 100. According to this structure, the power conversion device 100 can have mechanical strength capable of withstanding loads such as vehicle vibrations caused by an engine and a transmission, etc. In addition, with this structure, the power conversion device 100 has space-saving properties enabling it to be mounted in an engine room. Thus, the cooler 3 has a structure suitable for the in-vehicle power conversion device 100.

[0048] <Capacitor Module 2>

[0049] The capacitor module 2 is provided on the bottom surface 3b side or the top surface 3a side of the cooler 3. In the present embodiment, as Figure 3 shown, the capacitor module 2 is arranged on the bottom surface 3b side of the cooler 3. The capacitor module 2 includes: a capacitor unit 20 ( Figure 3 not shown in the figure), a bottomed cylindrical capacitor housing 21 that houses the capacitor unit 20 and is open on the cooler 3 side, a resin 23 that seals the capacitor unit 20 inside the capacitor housing 21, and a capacitor bus bar 22 that is electrically connected to the capacitor unit 20 and exposed to the outside from the resin 23. The capacitor module 2 has fastening feet 24 fixed to the housing 6 on the outer surface of the side wall of the capacitor housing 21. The capacitor housing 21 is made of a resin such as PPS (polyphenylene sulfide), etc. Details of the capacitor bus bar 22 connected to the connection bus bar 7 will be described later.

[0050] In the present embodiment, the capacitor case 21 is formed in a bottomed rectangular cylindrical shape, and the main body portion 1a of the semiconductor module 1 is formed in a rectangular plate shape. The length of one or both of the long side and the short side of the bottom wall of the capacitor case 21 is formed to be shorter than the length of one or both of the long side and the short side of the main body portion 1a of the semiconductor module 1, respectively. As Figure 4 shown, in the present embodiment, the length of the short side of the bottom wall of the capacitor case 21 is formed to be shorter than the length of the short side of the main body portion 1a of the semiconductor module 1. By configuring in this way, the space of the main body portion 1a of the semiconductor module 1 that is overlapped and arranged with the capacitor module 2 can be ensured not to be affected by the size of the capacitor case 21. In addition, the length of the long side of the bottom wall of the capacitor case 21 may be formed to be shorter than the length of the long side of the main body portion 1a of the semiconductor module 1. In addition, the shapes of the capacitor case 21 and the main body portion 1a of the semiconductor module 1 are not limited to rectangles, and may be other shapes.

[0051] <Cover portion 5 and case 6>

[0052] The cover portion 5 houses the semiconductor module 1, the control substrate 4, and the capacitor module 2 when disposed on the top surface 3a side of the cooler 3. The cover portion 5 is fixed to the top surface 3a of the cooler 3 by screws, for example. The cover portion 5 is made of SPCE (cold-rolled steel sheet), for example. The case 6 houses the capacitor module 2 when disposed on the bottom surface 3b side of the cooler 3, and is fixed to the bottom surface 3b of the cooler 3 by screws, for example. The case 6 is made of ADC 12 (aluminum alloy), for example.

[0053] As Figure 4 and Figure 5 shown, the cover portion 5 and the case 6 are formed not to protrude in the direction away from the side surfaces 3c on both sides of the cooler 3, ensuring an appropriate insulation distance from conductive parts such as the semiconductor module 1, the control substrate 4, and the capacitor bus bar 22. The height of the fixing portion between the bottom surface 3b of the cooler 3 and the case 6 can be set within a range where fastening operations can be performed without hindering the fastening operation between the capacitor bus bar 22 and the connection bus bar 7. As an example, the outer periphery of the bottom surface 3b of the cooler 3, which is the fixing portion between the case 6 and the cooler 3, may protrude in a rib shape. Thereby, the case 6 has a structure that does not hinder the fastening operation between the capacitor bus bar 22 and the connection bus bar 7, and has a structure that is easy to manufacture. Therefore, the assemblability of the power conversion device 100 can be improved, and the productivity of the power conversion device 100 can be improved.

[0054] The fixed part between the top surface 3a of the cooler 3 and the cover part 5 can be set to any height. The outer periphery of the top surface 3a of the cooler 3, which is the fixed part between the cover part 5 and the cooler 3, can protrude in a rib shape. By making the fixed part protrude, the height of the cover part 5 can be reduced, so the productivity of the cover part 5 can be improved. In addition, by making the fixed part of the cooler 3 protrude, ribs are formed on the outer peripheral part of the top surface 3a of the cooler 3, thus improving the rigidity of the cooler 3, and thereby improving the vibration resistance of the power conversion device 100.

[0055] <Connection structure of semiconductor module 1 and capacitor module 2>

[0056] The connection structure between the semiconductor module 1 and the capacitor module 2 will be described. As Figure 4 shown, the capacitor bus bar 22 connected to the connection bus bar 7 has an inner extension part 22a, an opening side extension part 22b, and an outer extension part 22c. The inner extension part 22a extends toward the opening side along the inner surface of the side wall of the capacitor housing 21. The opening side extension part 22b extends outward from the opening side end of the inner extension part 22a along the end surface of the side wall on the opening side. The outer extension part 22c extends toward the bottom wall side along the outer surface of the side wall from the outer end of the opening side extension part 22b. Extending toward the bottom wall side along the outer surface of the side wall means that the outer extension part 22c extends along the outer surface of the side wall toward the side close to the bottom wall, or the outer extension part 22c extends along the outer surface of the side wall in the direction approaching the bottom wall.

[0057] The connection bus bar 7 extends from the second connection terminal 1c of the semiconductor module 1 to the outer side surface of the outer extension part 22c, and has a part extending in a direction parallel to the extension direction of the outer extension part 22c. The connection bus bar 7 is provided with a capacitor connection part 7a connected to the outer extension part 22c at the end located on the outer extension part 22c side. The capacitor connection part 7a is a through hole, and the capacitor connection part 7a is fastened to the threaded hole 22c1 provided at the end on the outer extension part 22c side by a screw 10, so that the connection bus bar 7 and the capacitor bus bar 22 are electrically connected.

[0058] With such a configuration, the structure for connecting the semiconductor module 1 and the capacitor module 2 can be provided on the side of the capacitor module 2. Therefore, a space for arranging the high-output semiconductor module 1 can be ensured on the side of the top surface 3a of the cooler 3. Since the high-output semiconductor module 1 can be arranged, the high-output of the power conversion device 100 can be achieved. In addition, the structure for connecting the semiconductor module 1 and the capacitor module 2 can be provided on the side of the capacitor module 2, so that a connection space on the side of the top surface 3a of the cooler 3 is not required, and thus the power conversion device 100 can be miniaturized. Furthermore, compared with the case where the capacitor bus bar sealed with resin extends from the capacitor module side to the semiconductor module side, the capacitor bus bar 22 is arranged along the outer surface of the side wall of the capacitor housing 21, so that the dimensional accuracy of the arrangement of the portion of the capacitor bus bar 22 connected to the semiconductor module 1 can be improved. Therefore, the assemblability of the power conversion device 100 is improved, the gap between components required during assembly is reduced, the insulation distance considering the dimensional accuracy of the arrangement of the capacitor bus bar 22 can be reduced, and thus the power conversion device 100 can be miniaturized.

[0059] In the present embodiment, the second connection terminal 1c of the semiconductor module 1 and the connection bus bar 7 are integrally formed. With such a configuration, the number of components of the power conversion device 100 can be reduced, so that the productivity of the power conversion device 100 can be improved. In addition, since there is no need for a portion connecting the second connection terminal 1c and the connection bus bar 7, the power conversion device 100 can be miniaturized.

[0060] The cooler 3 has a through opening portion 34 that is a through hole penetrating between the top surface 3a and the bottom surface 3b. The through opening portion 34 is provided between the refrigerant flow path 33 and the side surface 3c. The connection bus bar 7 is arranged to penetrate the through opening portion 34. With such a configuration, the power conversion device 100 can be miniaturized while ensuring the insulation of the connection bus bar 7.

[0061] At least a part of the second connection terminal 1c and the connection bus bar 7 is covered with the resin 11. With such a configuration, the insulation between the portion of the second connection terminal 1c and the connection bus bar 7 covered with the resin 11 and the surrounding conductive portions can be improved. In addition, by using the resin to improve the rigidity and dimensional accuracy, the vibration resistance of the portion of the second connection terminal 1c and the connection bus bar 7 covered with the resin 11 can be improved.

[0062] In the present embodiment, as Figure 5 shown, the resin 11 is provided up to the portion of the through opening portion 34, but is not limited thereto. The resin 11 can be provided to extend to the side surface portion of the capacitor module 2. In addition, in the present embodiment, as Figure 3As shown, the resin 11 is provided on the two connection busbars 7 arranged side by side on the right side, but the resin 11 can also be provided on other connection busbars 7. In addition, a portion fixed to the cooler 3 may be provided on the resin 11. For example, the resin 11 may be provided with a portion extending along the top surface 3a, an insertion bushing is arranged on the extending portion, and the resin 11 is fixed to the cooler 3 via the insertion bushing.

[0063] As described above, in the power conversion device 100 of Embodiment 1, the capacitor busbar 22 has an outer extension portion 22c extending toward the bottom wall side along the outer surface of the side wall of the capacitor housing 21. The connection busbar 7 extends from the second connection terminal 1c of the semiconductor module 1 to the outer side surface of the outer extension portion 22c and has a portion extending in a direction parallel to the extension direction of the outer extension portion 22c. A capacitor connection portion 7a connected to the outer extension portion 22c is provided at the end of the connection busbar 7 on the side of the outer extension portion 22c. Therefore, the structure for connecting the semiconductor module 1 and the capacitor module 2 can be provided on the side of the capacitor module 2, so that a space for arranging the high-output semiconductor module 1 can be ensured on the top surface 3a side of the cooler 3. Since the high-output semiconductor module 1 can be arranged, the power conversion device 100 can be made to have a high output. In addition, the structure for connecting the semiconductor module 1 and the capacitor module 2 can be provided on the side of the capacitor module 2, so that a connection space on the top surface 3a side of the cooler 3 is not required, and thus the power conversion device 100 can be miniaturized.

[0064] When viewed in a direction perpendicular to the top surface 3a of the cooler 3, the semiconductor module 1, the cooler 3, the control substrate 4, and the capacitor module 2 are overlapped and arranged, so that the power conversion device 100 can be miniaturized. In addition, when the second connection terminal 1c of the semiconductor module 1 and the connection busbar 7 are integrally formed, the number of components of the power conversion device 100 can be reduced, and thus the productivity of the power conversion device 100 can be improved. In addition, since a portion for connecting the second connection terminal 1c and the connection busbar 7 is not required, the power conversion device 100 can be miniaturized.

[0065] When at least a part of the second connection terminal 1c and the connection busbar 7 is covered with the resin 11, the insulation between the portion of the second connection terminal 1c and the connection busbar 7 covered with the resin 11 and the surrounding conductive portions can be improved. In addition, when the cooler 3 has a through-opening portion 34 penetrating between the top surface 3a and the bottom surface 3b and the connection busbar 7 is arranged to penetrate the through-opening portion 34, the power conversion device 100 can be miniaturized while ensuring the insulation of the connection busbar 7.

[0066] When the side surface 3c of the cooler 3 is exposed to the outside, heat generated inside the power conversion device 100 from the semiconductor module 1, the capacitor module 2, etc. can be easily dissipated to the outside. Further, when the capacitor housing 21 is formed in a bottomed rectangular tubular shape and the main body portion 1a of the semiconductor module 1 is formed in a rectangular plate shape, and the length of one or both of the long side and the short side of the bottom wall of the capacitor housing 21 is respectively smaller than the length of one or both of the long side and the short side of the main body portion 1a of the semiconductor module 1, the space of the main body portion 1a of the semiconductor module 1 arranged overlapping the capacitor module 2 can be ensured without being affected by the size of the capacitor housing 21.

[0067] Embodiment 2.

[0068] The power conversion device 100 according to Embodiment 2 will be described. Figure 6 is an exploded perspective view of the power conversion device 100 according to Embodiment 2, Figure 7 is a cross-sectional view of the power conversion device 100, and is a view showing an outline of the power conversion device 100 cut at the same position as the A-A cross-section position of Figure 1 is a cross-sectional view of the power conversion device 100, and is a view showing the power conversion device 100 cut at the same position as the B-B cross-section position of Figure 8 and with the screw 10 omitted. The connection bus bar 7 in the power conversion device 100 of Embodiment 2 has a structure different from that of Embodiment 1. Figure 1

[0069] Figure 6 As shown, the semiconductor module 1 has six second connection terminals 1c. The six second connection terminals 1c extend from the other surface of the main body portion 1a of the semiconductor module 1 in the normal direction of the top surface 3a of the cooler 3. The connection bus bar 7 has a terminal connection portion 7b, a conductor plate 7c, an extended connection portion 7d, and a capacitor connection portion 7a. The terminal connection portion 7b is a terminal respectively connected to the six second connection terminals 1c. The conductor plate 7c is a plate connecting the six terminal connection portions 7b to each other. The extended connection portion 7d is connected to the conductor plate 7c and extends in a direction parallel to the extending direction of the outer side extending portion 22c. The capacitor connection portion 7a is provided at the end of the extended connection portion 7d on the side of the outer side extending portion 22c. The capacitor connection portion 7a is a through hole, and the capacitor connection portion 7a is fastened to a threaded hole 22c1 provided at the end on the side of the outer side extending portion 22c by a screw 10, so that the connection bus bar 7 and the capacitor bus bar 22 are electrically connected.

[0070] With this configuration, compared with the case where the capacitor bus bar sealed with resin extends from the capacitor module side to the semiconductor module side, the dimensional accuracy of the configuration of the portion of the capacitor bus bar 22 connected to the semiconductor module 1 can be improved. Therefore, the assemblability of the power conversion device 100 is improved, the gap between components required during assembly is reduced, the insulation distance considering the dimensional accuracy of the configuration of the capacitor bus bar 22 can be reduced, and thus the power conversion device 100 can be miniaturized. In addition, since the terminal connection portions 7b of the connection bus bar 7 are respectively connected to a plurality of second connection terminals 1c, the number of connection bus bars 7 and capacitor bus bars 22 can be reduced compared with the first embodiment. Since the number of connection bus bars 7 and capacitor bus bars 22 can be reduced, the productivity of the power conversion device 100 can be improved.

[0071] The connection bus bar 7 is made of a metal such as copper or a copper alloy having good conductivity and a relatively high thermal conductivity. At least a part of the extended connection portion 7d and the conductor plate 7c are covered with the resin 7e. With this configuration, the insulation between the portions of the extended connection portion 7d and the conductor plate 7c covered with the resin 7e and the surrounding conductive portions can be improved.

[0072] The connection bus bar 7 is fixed to the cooler 3 through a part of the resin 7e. A flange portion 7f, which is a portion extending along the top surface 3a, is provided on the resin 7e, and the insertion bushing 12 is provided on the flange portion 7f. The connection bus bar 7 is fixed to the cooler 3 through the insertion bushing 12. The fixing method of the connection bus bar 7 is not limited to this. It is also possible to fix the connection bus bar 7 to the cooler 3 by fitting a protrusion provided on a part of the resin 7e into a hole provided on the top surface 3a side of the cooler 3. With this configuration, since the connection bus bar 7 is in contact with the cooler 3 through the resin 7e, the connection bus bar 7 can be effectively cooled. In addition, the second connection terminal 1c and the capacitor bus bar 22 can be effectively cooled through the connection bus bar 7. In addition, since the connection bus bar 7 can be accurately arranged on the cooler 3 through the flange portion 7f, the productivity of the capacitor bus bar 22 and the connection bus bar 7 can be improved.

[0073] In the present embodiment, as Figure 7As shown, the resin 7e is provided up to a part of the through-opening 34, but is not limited thereto. The resin 7 can be provided so as to extend to the side portion of the capacitor module 2. In the present embodiment, the connection bus bar 7 is adjacent to the semiconductor module 1, and on the other surface side of the main body portion 1a of the semiconductor module 1, the terminal connection portion 7b and the second connection terminal 1c are connected. Therefore, a part of the connection bus bar 7 can be arranged on the other surface of the semiconductor module 1, and thus the power conversion device 100 can be miniaturized. When a part of the connection bus bar 7 is arranged on the other surface of the semiconductor module 1, a metal plate or a metal foil can be arranged on the upper portion of the connection bus bar 7. The metal plate or the metal foil functions as a shield for reducing the influence of electromagnetic noise received by the control substrate 4 from the outside.

[0074] It can be configured to connect the semiconductor module 1 and the capacitor module 2 through a wiring structure concentrated on the high-potential side and the low-potential side. The semiconductor module 1 has a plurality of second connection terminals 1c1 on the high-potential side and a plurality of second connection terminals 1c2 on the low-potential side. The capacitor bus bar 22 has an outer extension portion 22c2 on the high-potential side and an outer extension portion 22c3 on the low-potential side.

[0075] The connection bus bar 7 has a high-potential side terminal connection portion 7b1 connected to each of the plurality of second connection terminals 1c1 on the high-potential side, a low-potential side terminal connection portion 7b2 connected to each of the plurality of second connection terminals 1c2 on the low-potential side, a high-potential side conductor plate 7c1 connecting the plurality of high-potential side terminal connection portions 7b1 to each other, and a low-potential side conductor plate 7c2 connecting the plurality of low-potential side terminal connection portions 7b2 to each other. In addition, the connection bus bar 7 has: a high-potential side extension connection portion 7d1 connected to the high-potential side conductor plate 7c1 and extending in a direction parallel to the extension direction of the high-potential side outer extension portion 22c2; a low-potential side extension connection portion 7d2 connected to the low-potential side conductor plate 7c2 and extending in a direction parallel to the extension direction of the low-potential side outer extension portion 22c3; a high-potential side capacitor connection portion 7a1 provided at the end of the high-potential side extension connection portion 7d1 on the side of the high-potential side outer extension portion 22c2; and a low-potential side capacitor connection portion 7a2 provided at the end of the low-potential side extension connection portion 7d2 on the side of the low-potential side outer extension portion 22c3.

[0076] The high-potential side conductor plate 7c1 and the low-potential side conductor plate 7c2 are arranged in parallel at intervals. By configuring in this way, low inductance of the wiring between the semiconductor module 1 and the capacitor module 2 can be achieved.

[0077] As described above, in the power conversion device 100 of Embodiment 2, the connection bus bar 7 includes a terminal connection portion 7b, a conductor plate 7c, an extended connection portion 7d, and a capacitor connection portion 7a. The terminal connection portion 7b is a terminal connected to each of the plurality of second connection terminals 1c. Therefore, the number of connection bus bars 7 and capacitor bus bars 22 can be reduced, and thus the productivity of the power conversion device 100 can be improved. In addition, when the semiconductor module 1 and the capacitor module 2 are connected in a wiring structure concentrated on the high-potential side and the low-potential side, and the conductor plate 7c1 on the high-potential side and the conductor plate 7c2 on the low-potential side are arranged in parallel at intervals, low inductance of the wiring between the semiconductor module 1 and the capacitor module 2 can be achieved.

[0078] When the second connection terminal 1c extends from the other surface of the main body portion 1a of the semiconductor module 1 in the normal direction of the top surface 3a of the cooler 3, a part of the connection bus bar 7 can be arranged on the other surface of the semiconductor module 1, and thus the power conversion device 100 can be miniaturized. In addition, when at least a part of the extended connection portion 7d and the conductor plate 7c are covered with the resin 7e, the insulation between the part of the extended connection portion 7d and the conductor plate 7c covered with the resin 11 and the surrounding conductive portions can be improved. When the connection bus bar 7 is fixed to the cooler 3 through a part of the resin 7e, the connection bus bar 7 can be effectively cooled. In addition, the second connection terminal 1c and the capacitor bus bar 22 can be effectively cooled through the connection bus bar 7.

[0079] Embodiment 3.

[0080] The power conversion device 100 according to Embodiment 3 will be described. Figure 9 is an exploded perspective view of the power conversion device 100 according to Embodiment 3, Figure 10 is a cross-sectional view of the power conversion device 100 and is a diagram showing an outline of the power conversion device 100 cut at a position between the connection bus bars 7 covered with the resin 11, Figure 11 is a cross-sectional view of the power conversion device 100 and is a diagram showing the power conversion device 100 cut at a position identical to the B-B cross-sectional position of Figure 1 and with the screw 10 omitted. The configuration of the capacitor module 2 in the power conversion device 100 of Embodiment 3 has a structure different from that of Embodiment 1.

[0081] In the present embodiment, as Figure 10As shown, the capacitor module 2 is disposed on the top surface 3a side of the cooler 3 and is located between the control substrate 4 and the cover portion 5. Since the control substrate 4 is provided between the semiconductor module 1 and the capacitor module 2, the connection bus bar 7 passes through the side portion of the control substrate 4 and extends from the second connection terminal 1c of the semiconductor module 1 to the outer side surface of the outer extension portion 22c. The connection bus bar 7 has a portion extending in a direction parallel to the extension direction of the outer extension portion 22c. In the connection bus bar 7, a capacitor connection portion 7a connected to the outer extension portion 22c is provided at the end portion of the connection bus bar 7 on the side of the outer extension portion 22c. The capacitor connection portion 7a is a through hole, and the capacitor connection portion 7a is fastened to the threaded hole 22c1 provided at the end portion on the side of the outer extension portion 22c by a screw 10, and the connection bus bar 7 and the capacitor bus bar 22 are electrically connected.

[0082] Thus, in the power conversion device 100 of the third embodiment, compared with the case where the capacitor bus bar sealed with resin extends from the capacitor module side to the semiconductor module side, the dimensional accuracy of the arrangement of the portion of the capacitor bus bar 22 connected to the semiconductor module 1 can be improved. Therefore, the assemblability of the power conversion device 100 is improved, the gap between components required during assembly is reduced, the insulation distance considering the dimensional accuracy of the arrangement of the capacitor bus bar 22 can be reduced, and thus the power conversion device 100 can be miniaturized.

[0083] Since the capacitor module 2 is not provided on the bottom surface 3b side of the cooler 3, electrical components such as a boost reactor, a boost converter, and a buck converter that require cooling can be provided on the bottom surface 3b side of the cooler 3, and thus these electrical components can be effectively cooled by the cooler 3. In addition, since these electrical components can be disposed close to the cooler 3 for effective arrangement, a space-saving power conversion device 100 can be obtained. Further, since the connection bus bar 7 is configured not to penetrate the cooler 3, a through opening 34 is not required in the cooler 3, and thus the productivity of the power conversion device 100 can be improved.

[0084] Embodiment 4.

[0085] The power conversion device 100 according to Embodiment 4 will be described. Figure 12 is an exploded perspective view of the power conversion device 100 of Embodiment 4, Figure 13 is a cross-sectional view of the power conversion device 100 and is a view showing an outline of the power conversion device 100 cut at a position avoiding the low-potential side extension connection portion 7d2 of the screw 10, Figure 14 is a cross-sectional view of the power conversion device 100 and is a view showing at Figure 1A view showing the screw 10 cut off and omitted at a position corresponding to the B-B cross-section. The configuration of the capacitor module 2 in the power conversion device 100 of Embodiment 4 has a structure different from that of Embodiment 2.

[0086] In the present embodiment, as Figure 13 shown, the capacitor module 2 is arranged on the top surface 3a side of the cooler 3 and is located between the control substrate 4 and the cover portion 5. Since the control substrate 4 is provided between the semiconductor module 1 and the capacitor module 2, the extended connection portion 7d of the connection bus bar 7 passes through the side portion of the control substrate 4 and extends in a direction parallel to the extending direction of the outer side extending portion 22c. The capacitor connection portion 7a is provided at the end of the extended connection portion 7d on the side of the outer side extending portion 22c. The capacitor connection portion 7a is a through hole, and the capacitor connection portion 7a is fastened to the threaded hole 22c1 provided at the end on the side of the outer side extending portion 22c by the screw 10, and the connection bus bar 7 and the capacitor bus bar 22 are electrically connected.

[0087] In the present embodiment, the portion of the connection bus bar 7 covered by the resin 7e is arranged on the other surface of the semiconductor module 1, as Figure 12 shown, and a shield 7g made of a metal plate or metal foil is arranged on the upper portion of the resin 7e of the connection bus bar 7. The shield 7g is electrically connected to the cooler 3 with low impedance. The shield 7g reduces the influence of electromagnetic noise received by the control substrate 4 from the outside.

[0088] As described above, in the power conversion device 100 of Embodiment 4, since the shield 7g that is connected to the cooler 3 with low impedance is provided between the semiconductor module 1 and the control substrate 4, the influence of electromagnetic noise received by the control substrate 4 from the outside can be effectively reduced.

[0089] Embodiment 5.

[0090] The power conversion device 100 according to Embodiment 5 will be described. Figure 15 is an exploded perspective view of the power conversion device 100 of Embodiment 5, Figure 16 is a cross-sectional view of the power conversion device 100, and is a view showing an outline of the power conversion device 100 in which the screw 10 is cut off and omitted at the position of the through opening 34 of the cooler 3, Figure 17 is a cross-sectional view of the power conversion device 100, and is a view cut at a position between the side portion of the semiconductor module 1 and the first connection terminal 1b. The configuration of the connection bus bar 7 and the capacitor bus bar 22 in the power conversion device 100 of Embodiment 5 has a structure different from that of Embodiment 1.

[0091] The capacitor housing 21 is formed in a bottomed rectangular tubular shape, and the main body portion 1a of the semiconductor module 1 is formed in a rectangular plate shape. The second connection terminal 1c is provided on the short side, i.e., the front side, of the main body portion 1a of the semiconductor module 1. The connection bus bar 7 integrally formed with the second connection terminal 1c is provided on the short side, i.e., the front side, of the main body portion 1a of the semiconductor module 1. The capacitor bus bar 22 is provided on the short side, i.e., the front side, of the bottom wall of the capacitor housing 21. The capacitor connection portion 7a of the connection bus bar 7 is fastened to the threaded hole 22c1 provided at the end on the outer extension portion 22c side by a screw 10, and the connection bus bar 7 and the capacitor bus bar 22 are electrically connected.

[0092] In the present embodiment, the connection bus bar 7 and the capacitor bus bar 22 are arranged only on one short side of the main body portion 1a of the semiconductor module 1 and one short side of the bottom wall of the capacitor housing 21, but it is not limited thereto, and the connection bus bar 7 and the capacitor bus bar 22 may also be arranged on the other short side of the main body portion 1a of the semiconductor module 1 and the other short side of the bottom wall of the capacitor housing 21. When the connection bus bar 7 and the capacitor bus bar 22 are arranged on both short sides, the connection bus bar 7 and the capacitor bus bar 22 are electrically connected on both short sides.

[0093] In addition, the structure of the connection bus bar 7 is not limited to the structure integrally formed with the second connection terminal 1c, and may also be the structure of the connection bus bar 7 separately formed as shown in Embodiment 2. In addition, the capacitor module 2 may be arranged on the top surface 3a side of the cooler 3.

[0094] Thus, in the power conversion device 100 of Embodiment 5, the structure for connecting the semiconductor module 1 and the capacitor module 2 can be provided on the capacitor module 2 side. Therefore, a space for arranging the high-output semiconductor module 1 can be ensured on the top surface 3a side of the cooler 3. Since the high-output semiconductor module 1 can be arranged, the power conversion device 100 can be made to have a high output. In addition, since the structure for connecting the semiconductor module 1 and the capacitor module 2 can be provided on the capacitor module 2 side, a connection space on the top surface 3a side of the cooler 3 is not required, and thus the power conversion device 100 can be miniaturized.

[0095] Embodiment 6.

[0096] The power conversion device 100 according to Embodiment 6 will be described. Figure 18 is an exploded perspective view of the power conversion device 100 according to Embodiment 6. The power conversion device 100 of Embodiment 6 is different from Embodiment 1 in that it is configured to include a plurality of semiconductor modules 1.

[0097] The power conversion device 100 includes a plurality of semiconductor modules 1. In the present embodiment, the power conversion device 100 includes three semiconductor modules 1, but the number of the semiconductor modules 1 is not limited thereto. On the top surface 3a of the cooler 3, the plurality of semiconductor modules 1 are arranged in the same direction. One surface of the plurality of semiconductor modules 1 is thermally connected to the top surface 3a of the cooler 3.

[0098] Each of the plurality of semiconductor modules 1 has a second connection terminal 1c on the side surface side of the power conversion device 100. A connection bus bar 7 integrally formed with the second connection terminal 1c is provided on the side surface side of the power conversion device 100. A capacitor bus bar 22 is provided on the side surface side of the power conversion device 100. The capacitor connection portion 7a ( Figure 18 not shown in the figure) of the connection bus bar 7 is fastened to a threaded hole 22c1 provided at the end portion on the side of the outer extension portion 22c by a screw 10, and the connection bus bar 7 and the capacitor bus bar 22 are electrically connected.

[0099] In the present embodiment, the connection bus bar 7 and the capacitor bus bar 22 are only arranged on one side surface side of the power conversion device 100, but are not limited thereto. The connection bus bar 7 and the capacitor bus bar 22 may also be arranged on the other side surface side of the power conversion device 100. When the connection bus bar 7 and the capacitor bus bar 22 are arranged on both side surface sides, the connection bus bar 7 and the capacitor bus bar 22 are electrically connected on both side surface sides.

[0100] In addition, the structure of the connection bus bar 7 is not limited to the structure integrally formed with the second connection terminal 1c, and may also be the structure of the connection bus bar 7 formed separately as shown in Embodiment 2. In addition, the capacitor module 2 may be arranged on the top surface 3a side of the cooler 3.

[0101] As described above, in the power conversion device 100 of Embodiment 6, the power conversion device 100 includes a plurality of semiconductor modules 1. The plurality of semiconductor modules 1 are arranged in the same direction on the top surface 3a of the cooler 3, and one surface of the plurality of semiconductor modules 1 is thermally connected to the top surface 3a of the cooler 3. Therefore, the semiconductor modules 1 having different output characteristics can be used for the power conversion device 100. In addition, a plurality of semiconductor modules 1 can be cooled by one cooler 3. In addition, when a plurality of motors are operated by three-phase alternating current from the power conversion device 100, three-phase alternating current corresponding to the output required by the motors can be converted in the power conversion device 100.

[0102] In addition, although various exemplary embodiments and examples are described in the present application, the various features, modes, and functions described in one or more embodiments are not limited to being applied to a specific embodiment, and may be applied to the embodiments alone or in various combinations.

[0103] Therefore, it can be considered that numerous unillustrated modification examples are also included in the technical scope disclosed in the specification of the present application. For example, it is assumed to include cases where at least one component is modified, added, or omitted, and cases where at least one component is extracted and combined with components of other embodiments.

[0104] Reference Numeral Explanation

[0105] 1 semiconductor module, 1a main body portion, 1b first connection terminal, 1c second connection terminal, 1c1 second connection terminal on the high potential side, 1c2 second connection terminal on the low potential side, 2 capacitor module, 3 cooler, 3a top surface, 3b bottom surface, 3c side surface, 4 control substrate, 5 cover portion, 6 housing, 7 connection bus bar, 7a capacitor connection portion, 7b terminal connection portion, 7c conductor plate, 7d extended connection portion, 7e resin, 7f flange portion, 7g shield, 10 screw, 11 resin, 12 insertion bushing, 20 capacitor unit, 21 capacitor housing, 22 capacitor bus bar, 22a inner extended portion, 22b extended portion on the opening side, 22c outer extended portion, 22c1 threaded hole, 22c2 outer extended portion on the high potential side, 22c3 outer extended portion on the low potential side, 23 resin, 24 fastening leg, 30 main body portion, 31 base, 32 joint portion, 33 refrigerant flow path, 34 through opening, 100 power conversion device.

Claims

1. A power conversion device, characterized in that, Comprising: A semiconductor module having a main body portion formed in a plate shape with semiconductor elements disposed therein and connection terminals electrically connected to the semiconductor elements and protruding from the main body portion; A cooler having a bottom surface, a top surface, and side surfaces, and the top surface being thermally connected to one surface of the semiconductor module; A control substrate for controlling the operation of the semiconductor module; A capacitor module disposed on the bottom surface side or the top surface side of the cooler and electrically connected to the semiconductor module; A cover portion fixed to the top surface of the cooler and housing the semiconductor module, the control substrate, and the capacitor module when disposed on the top surface side; A housing fixed to the bottom surface of the cooler and housing the capacitor module when disposed on the bottom surface side; And A connection bus bar for connecting the connection terminals of the semiconductor module and the capacitor module, When viewed in a direction perpendicular to the top surface of the cooler, the semiconductor module, the cooler, the control substrate, and the capacitor module are overlapped and arranged; The capacitor module has a capacitor unit, a bottomed cylindrical capacitor housing for housing the capacitor unit and having an opening on the cooler side, a resin for sealing the capacitor unit inside the capacitor housing, and a capacitor bus bar electrically connected to the capacitor unit and exposed to the outside from the resin; The capacitor bus bar has an inner side extension portion extending toward the opening side along the inner surface of the side wall of the capacitor housing, an opening side extension portion extending outward along the end surface of the side wall on the opening side from the end portion on the opening side of the inner side extension portion, and an outer side extension portion extending toward the bottom wall side along the outer surface of the side wall from the outer end portion of the opening side extension portion; The connection bus bar extends from the connection terminals of the semiconductor module to the outer side surface of the outer side extension portion and has a portion extending in a direction parallel to the extension direction of the outer side extension portion, and a capacitor connection portion connected to the outer side extension portion is provided at the end portion of the connection bus bar on the outer side extension portion side.

2. The power conversion device according to claim 1, wherein: The connection terminals of the semiconductor module and the connection bus bar are integrally formed.

3. The power conversion device according to claim 2, wherein: At least a part of the connection terminals and the connection bus bar is covered with resin.

4. The power conversion device according to claim 1, wherein: The semiconductor module has a plurality of the connection terminals, The connection bus bar includes: a terminal connection portion that is connected to each of the plurality of connection terminals; a conductor plate that interconnects the plurality of terminal connection portions; an extension connection portion that is connected to the conductor plate and extends in a direction parallel to the extension direction of the outer extension portion; and the capacitor connection portion that is provided at an end of the extension connection portion on the side of the outer extension portion.

5. The power conversion device according to claim 4, wherein the semiconductor module has a plurality of connection terminals on the high potential side and a plurality of connection terminals on the low potential side, the capacitor bus bar has an outer extension portion on the high potential side and an outer extension portion on the low potential side, the connection bus bar has: a terminal connection portion on the high potential side that is connected to each of the plurality of connection terminals on the high potential side; a terminal connection portion on the low potential side that is connected to each of the plurality of connection terminals on the low potential side; a conductor plate on the high potential side that is used to interconnect the plurality of terminal connection portions on the high potential side; a conductor plate on the low potential side that is used to interconnect the plurality of terminal connection portions on the low potential side; an extension connection portion on the high potential side that is connected to the conductor plate on the high potential side and extends in a direction parallel to the extension direction of the outer extension portion on the high potential side; an extension connection portion on the low potential side that is connected to the conductor plate on the low potential side and extends in a direction parallel to the extension direction of the outer extension portion on the low potential side; a capacitor connection portion on the high potential side that is provided at an end of the extension connection portion on the high potential side on the side of the outer extension portion on the high potential side; and a capacitor connection portion on the low potential side that is provided at an end of the extension connection portion on the low potential side on the side of the outer extension portion on the low potential side, the conductor plate on the high potential side and the conductor plate on the low potential side are arranged in parallel with a gap therebetween.

6. The power conversion device according to claim 4 or 5, wherein the connection terminals of the semiconductor module extend from the other surface of the main body portion of the semiconductor module in the normal direction of the top surface of the cooler.

7. The power conversion device according to any one of claims 4 to 6, wherein at least a part of the extension connection portion and the conductor plate are covered with resin.

8. The power conversion device according to claim 7, wherein the connection bus bar is fixed to the cooler by a part of the resin.

9. The power conversion device according to any one of claims 1 to 8, wherein the cooler has a through hole that penetrates between the top surface and the bottom surface, the connection bus bar is arranged to penetrate the through hole.

10. The power conversion device according to any one of claims 1 to 9, characterized in that the side surface of the cooler is exposed to the outside.

11. The power conversion device according to any one of claims 1 to 10, characterized in that the capacitor housing is formed in a rectangular cylindrical shape with a bottom, and the main body portion of the semiconductor module is formed in a rectangular plate shape, the length of one or both of the long side and the short side of the bottom wall of the capacitor housing is shorter than the length of one or both of the long side and the short side of the main body portion of the semiconductor module.

12. The power conversion device according to any one of claims 1 to 11, characterized in that it includes a plurality of the semiconductor modules, the plurality of semiconductor modules are arranged and disposed on the top surface of the cooler in the same direction, one surface of the plurality of semiconductor modules is thermally connected to the top surface of the cooler.

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