A method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels

Abstract

The present invention relates to the field of microelectronic packaging technology, and specifically discloses a method for preparing a microwave component based on a printed circuit board with an embedded microfluidic channel. The microwave component includes a printed circuit board provided with a microfluidic channel, a high-power module, and a metal packaging box; the printed circuit board includes an upper wiring layer, a metal core board, and a lower wiring layer stacked in sequence; the upper surface of the metal core board is provided with a high-power module installation area, and the lower surface thereof is provided with a high-power module bottom heat transfer area; the high-power module is integrated in the high-power module installation area and is close to the signal output end; the high-power module installation area and the high-power module bottom heat transfer area are not provided with an upper wiring layer and a lower wiring layer. Also disclosed is a preparation method thereof, which uses a heat transfer pad located directly below the high-power module to achieve welding of the high-power module; the heat transfer pad includes a rigid heat transfer layer and an elastic heat transfer layer. The present invention has efficient heat dissipation capability and can also realize the transmission of high-density electrical signals.

Description

Technical Field

[0001] The invention relates to the technical field of microelectronic packaging, and more particularly to a method for preparing a microwave component based on a printed circuit board with embedded microchannels. Background Art

[0002] With the widespread application of third-generation semiconductor power technology represented by GaN, the transmission power of microwave components is increasing, the self-heating effect of power devices is becoming more and more prominent, and thermal management issues have gradually become a technical bottleneck restricting the development of electronic systems. Passive heat dissipation technology based on heat sinks and package box heat diffusion can no longer meet the heat dissipation needs of high-power devices. Thermal management technology that uses microfluidics to enhance heat dissipation has become an important solution.

[0003] Traditional high-power microwave components use microfluidic-based penetrating liquid cooling technology to achieve efficient heat dissipation, that is, liquid cooling microchannels are directly integrated into the metal packaging box, multiple circuit substrates are installed and integrated on both sides of the box, and feed insulators are used to interconnect electrical signals on the front and back sides of the box. This integration method has the characteristics of simple integrated structure and excellent heat dissipation performance; however, since the feed insulator occupies a large area of ​​the box, the improvement of component integration density is limited. In addition, multiple circuit substrates are installed on both sides of the box through hybrid integration, and leads are required for electrical interconnection between the multiple circuit substrates. The area occupied by the leads and interconnection pads also limits the further improvement of component integration density.

[0004] Chinese patent ZL202011304110.9 proposes a high heat dissipation digital-analog integrated packaging structure and its manufacturing method, using a high-low frequency digital-analog composite printed circuit board as an integrated carrier for components, chips, etc., which improves the integration density compared to ordinary hybrid integrated microwave components. However, the component still uses metal to achieve passive heat conduction, and the heat dissipation capacity is limited.

[0005] Chinese patent ZL202110118888.9 proposes a printed circuit board with embedded microchannels and a preparation method thereof, which greatly improves the heat dissipation capacity of the component by integrating metal core microchannels in the printed circuit board. However, the patent does not involve metal packaging structures and does not constitute a microwave component.

[0006] There are few reports on how to integrate a printed circuit board with embedded microfluidics with a metal packaging structure to achieve efficient heat dissipation while improving the integration density; at the same time, how to optimize the structure to meet the processing requirements of microassembly and packaging processes. Summary of the invention

[0007] The technical problem to be solved by the present invention is to provide a method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels; the component has efficient heat dissipation capability and can also realize the transmission of high-density electrical signals.

[0008] The solution adopted by the present invention to solve the technical problem is:

[0009] on the one hand:

[0010] The present invention discloses a microwave component based on a printed circuit board with embedded microfluidic channels, comprising a printed circuit board provided with microfluidic channels, a high-power module integrated on the printed circuit board, and a metal packaging box for mounting the printed circuit board;

[0011] The printed circuit board comprises an upper wiring layer, a metal core board with embedded microchannels, and a lower wiring layer which are stacked in sequence; a high-power module mounting area is arranged on the upper surface of the metal core board, and a high-power module bottom heat transfer area is arranged on the lower surface thereof;

[0012] The high-power module is integrated on the high-power module installation area through the upper wiring layer and is close to the signal output end of the metal packaging box;

[0013] The high-power module installation area and the heat transfer area at the bottom of the high-power module are not provided with an upper wiring layer and a lower wiring layer, which effectively ensures efficient heat dissipation of the high-power module and efficient heat conduction during the assembly process of the high-power module.

[0014] In some possible implementations, the metal packaging box for mounting a printed circuit board integrates a radio frequency connector at a signal output end of the metal packaging box, a radio frequency connector and a low frequency connector at a signal input end of the metal packaging box, and a through hole for the printed circuit board to pass through the metal packaging box.

[0015] In some possible implementations, in order to effectively achieve heat dissipation;

[0016] The microchannel includes a liquid inlet, a liquid outlet, a liquid inlet channel connected to the liquid inlet, a liquid outlet channel connected to the liquid outlet, and a heat dissipation channel structure located between the liquid outlet channel and the liquid inlet channel and connected to each other; the heat dissipation channel structure is located at the bottom of the high-power module.

[0017] In some possible implementations, in order to achieve low flow resistance and uniform heat dissipation in a confined space and prevent the collapse and deformation of the printed circuit board that may occur during the lamination process;

[0018] A reinforcement structure is arranged in the liquid inlet flow channel and the liquid outlet flow channel; the heat dissipation flow channel structure comprises a plurality of heat dissipation flow channel units which are sequentially connected in series, and micro flow channels are arranged in the heat dissipation flow channel units.

[0019] In some possible implementations, in order to effectively achieve a uniform balance of the heat dissipation capacity of the entire microchannel;

[0020] The number of the heat dissipation channel units is N, 20≥N≥2;

[0021] The number of micro-channels inside the N heat dissipation channel units increases gradually from the liquid inlet channel to the liquid outlet channel, and the cross-sectional area of ​​the channel decreases gradually;

[0022] The heat dissipation channel unit is also provided with a flow-disturbing structure for optimizing the fluid motion trajectory.

[0023] In some possible implementations, the reinforcement structure includes one or more of an arch-shaped reinforcement structure and a pier-shaped reinforcement structure.

[0024] In some possible implementations, in order to make the liquid inlet and the liquid outlet located outside the metal packaging box body, to avoid fluid leakage at the interface position affecting the inside of the component;

[0025] The metal core plate comprises a core plate body located in a metal packaging box body, a cantilever connected to one side of the core plate body and having one end passing through the metal packaging box body, and the liquid inlet and the liquid outlet are arranged at the bottom of the cantilever.

[0026] In some possible implementations, in order to ensure welding of the printed circuit board and the metal packaging box;

[0027] The area corresponding to the cantilever in the printed circuit board is not provided with an upper wiring layer and a lower wiring layer.

[0028] on the other hand:

[0029] The present invention discloses a method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels, which specifically comprises the following steps:

[0030] Step S1: Printed circuit board preparation;

[0031] Step S2: welding the high-power module using a heat transfer pad;

[0032] Step S3: Integrate other components on the printed circuit board;

[0033] Step S4: installing the assembly prepared in step S3 in a metal packaging box;

[0034] Step S5: Capping.

[0035] In some possible implementations, step S1 specifically includes the following steps:

[0036] Step S11: using a prepreg to laminate the organic wiring layer and the metal wiring layer into an upper wiring layer and a lower wiring layer;

[0037] Step S12: using a prepreg to laminate the upper wiring layer, the metal core board provided with microfluidic channels, and the lower wiring layer into a printed circuit board with embedded microfluidic channels;

[0038] Step S13: removing the upper wiring layer and the lower wiring layer in the cantilever area, the high-power module mounting area and the heat transfer area at the bottom of the high-power module in the printed circuit board.

[0039] In some possible implementations, step S2 specifically includes the following steps:

[0040] Step S21: welding to prepare a high-power module;

[0041] Step S22: placing the heat transfer pad at the bottom of the metal core board in the printed circuit board so that its elastic heat transfer layer contacts the metal core board in the printed circuit board;

[0042] Step S23: welding the high-power module to the metal core board in the printed circuit board.

[0043] In some possible implementations, the step S23 specifically refers to: welding the high-power module to the metal core board in the printed circuit board through a vacuum eutectic welding process.

[0044] In some possible implementations, in order to ensure that the vacuum eutectic heat transfer surface can fit tightly with the printed circuit board, the heat transfer pad is composed of a rigid heat transfer layer and an elastic heat transfer layer located on top of the rigid heat transfer layer.

[0045] The rigid heat transfer layer is made of a plate-shaped high-thermal-conductivity metal material; the elastic heat transfer layer is made of an elastic material with high-temperature resistance and high thermal conductivity.

[0046] Compared with the prior art, the present invention has the following beneficial effects:

[0047] The present invention utilizes a printed circuit board with embedded microfluidics as a substrate for interconnecting electrical signals, and integrates the printed circuit board with embedded microfluidics with a metal packaging box, thereby realizing structural and functional integration of the components; compared with traditional through-type liquid-cooled metal packaging, the integration density can be increased by more than double.

[0048] The present invention uses a printed circuit board with embedded microchannels as a substrate for electrical signal interconnection, and uses a micron-scale fluid flowing through the metal core microchannels in the printed circuit board to achieve 300W / cm 2 Compared with ordinary non-liquid cooling packages, its efficient heat dissipation capacity is increased by more than 3 times.

[0049] The present invention forms a "brick-type" microwave component by placing the liquid inlet and outlet separately outside the metal packaging box and adopting a cantilever bottom vertical liquid inlet / outlet method, thereby realizing the separation of the liquid interface from components such as chips in the component.

[0050] The present invention eliminates the influence of the wiring layer (mainly the organic wiring layer and the prepreg) in the printed circuit board on the eutectic welding heat transfer efficiency by removing the wiring layer in the high-power module installation area and the heat transfer area at the bottom of the high-power module, thereby meeting the process requirements of low thermal resistance vacuum eutectic of high-power chips / high-power modules.

[0051] The present invention avoids the problem that the vacuum eutectic heat transfer surface in the printed circuit board cannot fit tightly by providing a heat transfer pad to replace the ordinary heat transfer pad in the prior art; the heat transfer pad is directly supported on the bottom of the metal core board, which facilitates effective heat conduction during the vacuum eutectic welding process of the high-power module and the printed circuit board.

[0052] The present invention provides a plurality of heat dissipation channel units connected in sequence and utilizes a single fluid network to replace a flow distribution network flow distribution channel layout, thereby effectively solving the technical problem that multiple heat dissipation channel units are difficult to evenly distribute and merge in a confined space.

[0053] The present invention optimizes the structure of each heat dissipation channel unit, comprehensively considers the physical factors that the temperature rises and the heat dissipation capacity decreases after the fluid flows through the heat source, and adopts a structural layout in which the cross-sectional area of ​​the channel decreases successively, that is, the heat dissipation capacity of the heat dissipation channel unit near the liquid inlet is appropriately reduced, and the heat dissipation capacity of the heat dissipation channel unit near the liquid outlet is increased, and a spoiler structure is added to optimize the fluid movement trajectory, so as to achieve a balance in the heat dissipation capacity of the entire network, and ultimately ensure the normal operation of this component. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a schematic diagram of the cross-sectional structure of the printed circuit board, the high-power module, and the heat transfer pad in the present invention;

[0055] Figure 2 Schematic diagram of the structure of the microfluidic channel in the present invention;

[0056] Figure 3 A top view of the printed circuit board of the present invention;

[0057] Figure 4 A bottom view of the printed circuit board of the present invention;

[0058] Figure 5 is a flow chart of the preparation method of the present invention;

[0059] Figure 6 It is a side view of the connection relationship between the radio frequency connector at the signal output end of the microwave component and the metal packaging box body in the present invention;

[0060] Figure 7 It is a schematic diagram of the structural position of the metal packaging box and the printed circuit board in the present invention;

[0061] Figure 8 It is a side view of the structure position of the low-frequency connector, through hole and metal packaging box at the signal input end of the microwave component in the present invention;

[0062] Among them: 1. Microwave component; 2. Printed circuit board; 3. Liquid inlet; 4. Liquid outlet; 5. High-power module installation area; 6. Metal packaging box; 7. RF connector; 8. Low-frequency connector; 9. Through hole; 10. Liquid inlet channel; 11. Liquid outlet channel; 12. Heat dissipation channel unit; 13. Reinforcement structure; 14. High-power chip; 15. Heat sink; 16. Upper wiring layer; 17. Lower wiring layer; 18. Metal core board; 19. Prepreg; 20. Organic wiring layer; 21. Metal wiring layer; 22. Heat transfer pad; 23. Heat transfer area at the bottom of high-power module; 24. High-power module; 25. Rigid heat transfer layer; 26. Elastic heat transfer layer; 27. Cantilever; 28. Core board body; 29 Heat dissipation channel structure; 30 spoiler structure. DETAILED DESCRIPTION

[0063] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, it can be the connection within two elements or the interaction relationship between two elements. The "first", "second" and similar words mentioned in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, "one" or "one" and other similar words do not indicate a quantity limit, but indicate the existence of at least one. In the implementation of this application, "and / or" describes the association relationship of the associated objects, indicating that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more. For example, multiple positioning columns refer to two or more positioning columns. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0064] The present invention is described in detail below.

[0065] Embodiment 1:

[0066] like Figure 1-Figure 8 As shown:

[0067] This embodiment discloses a microwave component 1 based on a printed circuit board with embedded microfluidic channels, comprising a printed circuit board 2 provided with microfluidic channels, a high-power module 24 integrated on the printed circuit board, and a metal packaging box 6 for mounting the printed circuit board;

[0068] The printed circuit board 2 includes an upper wiring layer 16, a metal core board 18 provided with microchannels, and a lower wiring layer 17 which are stacked in sequence;

[0069] The upper surface of the metal core plate 18 is provided with a high-power module mounting area 5, and the lower surface thereof is provided with a high-power module bottom heat transfer area 23; the high-power module bottom heat transfer area 23 is located below the high-power module mounting area 5;

[0070] The high-power module is integrated on the high-power module installation area through the upper wiring layer and is close to the signal output end of the metal packaging box;

[0071] The high-power module 24 is integrated on the high-power module installation area 5 through the upper wiring layer 16, close to the signal output end of the metal packaging box 6;

[0072] The high-power module installation area 5 and the high-power module bottom heat transfer area 23 are not provided with an upper wiring layer and a lower wiring layer, which effectively ensures efficient heat dissipation of the high-power module 24 and efficient heat conduction during the assembly process of the high-power module 24.

[0073] In some possible embodiments, the metal packaging box body 6 for installing a printed circuit board integrates a radio frequency connector 7 located at the signal output end of the metal packaging box body 6, a radio frequency connector 7 and a low-frequency connector 8 located at the signal input end of the metal packaging box body 6, and a through hole 9 for the printed circuit board to pass through the metal packaging box body.

[0074] In some possible implementations, in order to effectively achieve heat dissipation;

[0075] The microchannel includes a liquid inlet 3, a liquid outlet 4, a liquid inlet channel 10 connected to the liquid inlet 3, a liquid outlet channel 11 connected to the liquid outlet 4, and a heat dissipation channel structure 29 located between the liquid outlet channel 11 and the liquid inlet channel 10 and connected to each other; the heat dissipation channel structure 29 is located at the bottom of the high-power module 24.

[0076] In some possible implementations, in order to achieve low flow resistance and uniform heat dissipation in a confined space and prevent the collapse and deformation of the printed circuit board that may occur during the lamination process;

[0077] A reinforcement structure 13 is provided in the liquid inlet channel 10 and the liquid outlet channel 11 ; the heat dissipation channel structure 29 includes a plurality of heat dissipation channel units 12 connected in series, and micro channels are provided in the heat dissipation channel units 12 .

[0078] In some possible implementations, in order to effectively achieve a uniform balance of the heat dissipation capacity of the entire microchannel;

[0079] The number of the heat dissipation channel units 12 is 6;

[0080] The six heat dissipation channel units 12 are numbered as heat dissipation channel unit 1, heat dissipation channel unit 2, ... heat dissipation channel unit 6 from the liquid inlet channel 10 to the liquid outlet channel 11;

[0081] The number of micro channels in the heat dissipation channel unit 1, the heat dissipation channel unit 2, ... the heat dissipation channel unit 6 increases in sequence, and the cross-sectional areas of the channels decrease in sequence;

[0082] The heat dissipation channel unit 12 is further provided with a spoiler structure 30 for optimizing the fluid motion trajectory.

[0083] In some possible implementations, the reinforcement structure 13 includes one or more of an arch-shaped reinforcement structure and a pier-shaped reinforcement structure.

[0084] In some possible implementations, in order to make the liquid inlet 3 and the liquid outlet 4 located outside the metal packaging box 6 to avoid fluid leakage at the interface position affecting the components;

[0085] The metal core board 18 includes a core board body 28 located in the metal packaging box body 6 , a cantilever 27 connected to one side of the core board body 28 and having one end passing through the metal packaging box body 6 , and the liquid inlet 3 and the liquid outlet 4 are arranged at the bottom of the cantilever 27 .

[0086] In some possible implementations, in order to ensure the welding of the printed circuit board 2 and the metal packaging box 6, to ensure efficient heat dissipation of the high-power module 24, and to ensure efficient heat conduction during the assembly process of the high-power module 24;

[0087] The upper wiring layer 16 and the lower wiring layer 17 are not provided in the cantilever 27 area, the high-power module mounting area 5 and the high-power module bottom heat transfer area 23 in the printed circuit board.

[0088] This embodiment utilizes a printed circuit board 2 with embedded microfluidics as a substrate for interconnecting electrical signals, and integrates the printed circuit board 2 with embedded microfluidics with a metal packaging box 6, thereby realizing structural and functional integration of the components; compared with conventional through-type liquid-cooled metal packaging, the integration density can be more than doubled.

[0089] This embodiment uses a printed circuit board 2 with embedded microfluidic channels as a substrate for electrical signal interconnection, and uses a micron-scale fluid flowing through the metal core microfluidic channels in the printed circuit board to achieve 300W / cm 2Compared with ordinary non-liquid cooling packages, its efficient heat dissipation capacity is increased by more than 3 times.

[0090] In this embodiment, the liquid inlet 3 and the liquid outlet 4 are separately arranged outside the metal packaging box 6, and the liquid inlet / outlet is vertically connected to the bottom of the cantilever 27, thereby forming a "brick-type" microwave component 1, thereby separating the liquid interface from components such as chips in the component.

[0091] This embodiment provides a plurality of heat dissipation channel units 12 connected in sequence and utilizes a single fluid network to replace a flow distribution network flow distribution channel layout, thereby effectively solving the technical problem that it is difficult for a plurality of heat dissipation channel units 12 to evenly distribute and merge in a confined space.

[0092] This embodiment optimizes the structure of each heat dissipation channel unit 12, comprehensively considers the physical factors that the temperature rises and the heat dissipation capacity decreases after the fluid flows through the heat source, and adopts a structural layout in which the cross-sectional area of ​​the channel decreases successively, that is, the heat dissipation capacity of the heat dissipation channel unit near the liquid inlet is appropriately reduced, and the heat dissipation capacity of the heat dissipation channel unit near the liquid outlet is increased, and a spoiler structure is added to optimize the fluid movement trajectory, so as to achieve a balance in the heat dissipation capacity of the entire network, and ultimately ensure the normal operation of this component.

[0093] Embodiment 2:

[0094] like Figure 5 As shown, this embodiment specifically discloses the preparation method of Example 1, which specifically includes the following steps:

[0095] Step S1: preparing a printed circuit board 2;

[0096] Step S2: welding the high-power module 24 using the heat transfer pad 22;

[0097] Step S3: Integrate other components on the printed circuit board 2;

[0098] Step S4: installing the assembly prepared in step S3 in the metal packaging box 6;

[0099] Step S5: Capping.

[0100] In some possible implementations, step S1 specifically includes the following steps:

[0101] Step S11: using the prepreg 19 to laminate the organic wiring layer 20 and the metal wiring layer 21 into the upper wiring layer 16 and the lower wiring layer 17;

[0102] Step S12: using the prepreg 19 to press the upper wiring layer 16, the metal core board 18 provided with the microfluidic channel, and the lower wiring layer 17 into a microfluidic channel embedded printed circuit board 2;

[0103] Step S13: removing the upper wiring layer 16 and the lower wiring layer 17 in the cantilever 27 area, the high-power module mounting area 5 and the high-power module bottom heat transfer area 23 in the printed circuit board.

[0104] Preferably, the removal process in step S13 is a depth-controlled milling or laser ablation process.

[0105] In some possible implementations, step S2 specifically includes the following steps:

[0106] Step S21: welding to prepare a high-power module 24;

[0107] Preferably, the high-power module 24 includes a high-power chip 14 and a heat sink 15 ; the high-power chip 14 and the heat sink 15 are welded by a low thermal resistance welding process using high melting point solder such as gold-tin, nano-silver sintering, etc.

[0108] Step S22: placing the heat transfer pad 22 at the bottom of the metal core board 18 in the printed circuit board 2, i.e., the heat transfer area 23 at the bottom of the high-power module, so that the elastic heat transfer layer 26 is in contact with the metal core board 18 in the printed circuit board 2;

[0109] Step S23: welding the high-power module 24 to the metal core board 18 in the printed circuit board 2.

[0110] In some possible implementations, the step S23 specifically refers to: welding the high-power module 24 to the metal core board 18 in the printed circuit board 2 through a vacuum eutectic welding process.

[0111] Preferably, the solder used in the vacuum eutectic welding process is a low melting point solder such as InPb, SnPb, InAg, SnAgCu, etc.

[0112] In some possible implementations, due to the influence of lamination process parameters when the printed circuit board 2 is laminated in steps S11 and S12, the total thickness d1 of the wiring layer will change before and after lamination, with a certain tolerance;

[0113] After removing the wiring layer of the bottom area corresponding to the high-power module 24 in the printed circuit board 2 by depth-controlled milling or laser ablation, a small amount of the embedded microchannel metal core board 18 may be removed due to the processing tolerance, and the thickness is d2. The total thickness of "d1+d2" has a certain tolerance range, and the variable thickness of the elastic material must be used to ensure the close fit of the vacuum eutectic heat transfer surface.

[0114] In order to ensure that the vacuum eutectic heat transfer surface can be closely attached to the printed circuit board, the heat transfer pad 22 is composed of a rigid heat transfer layer 25 and an elastic heat transfer layer 26 located on top of the rigid heat transfer layer.

[0115] The rigid heat transfer layer 25 is made of a plate-shaped high-thermal-conductivity metal material; the elastic heat transfer layer 26 is made of an elastic material with high-temperature resistance and high thermal conductivity.

[0116] In some possible implementations, the step S3 specifically includes the following steps: integrating other components on the printed circuit board 2 by welding or bonding processes.

[0117] In some possible implementations, the step S4 specifically includes the following steps: inserting the assembly in step S3 into the metal packaging box 6 so that the liquid inlet 3 and the liquid outlet 4 on the cantilever are located outside the through hole 9 .

[0118] In some possible implementations, the step S5 specifically includes the following steps: assembling and capping by laser sealing or parallel sealing.

[0119] This embodiment eliminates the influence of the wiring layers in the printed circuit board (mainly the organic wiring 20 layers and the semi-cured sheet 19) on the eutectic welding heat transfer efficiency by removing the wiring layers in the high-power module installation area 5 and the high-power module bottom heat transfer area 23, thereby meeting the process requirements of low thermal resistance vacuum eutectic of the high-power module 24.

[0120] This embodiment avoids the problem that the vacuum eutectic heat transfer surface in the printed circuit board cannot fit tightly by providing a heat transfer pad 22; the heat transfer pad 22 is directly supported on the bottom of the metal core board 18, so that heat conduction can be effectively achieved during the vacuum eutectic welding process between the high-power module 24 and the printed circuit board 2.

[0121] The present invention is not limited to the above-mentioned specific embodiments, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. A method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels, It is characterized in that The embedded microfluidic printed circuit board includes a printed circuit board provided with a microfluidic channel, a high-power module integrated on the printed circuit board, and a metal packaging box for mounting the printed circuit board; The printed circuit board comprises an upper wiring layer, a metal core board with embedded microchannels, and a lower wiring layer which are stacked in sequence; a high-power module mounting area is arranged on the upper surface of the metal core board, and a high-power module bottom heat transfer area is arranged on the lower surface thereof; the high-power module is integrated on the high-power module mounting area through the upper wiring layer and is close to the signal output end of the metal packaging box; the high-power module mounting area and the high-power module bottom heat transfer area are not arranged with an upper wiring layer and a lower wiring layer; The specific steps include: Step S1: Printed circuit board preparation; Step S11: using a prepreg to laminate the organic wiring layer and the metal wiring layer into an upper wiring layer and a lower wiring layer; Step S12: using a prepreg to laminate the upper wiring layer, the metal core board provided with microfluidic channels, and the lower wiring layer into a printed circuit board with embedded microfluidic channels; Step S13: removing the upper wiring layer and the lower wiring layer in the cantilever area, the high-power module mounting area and the heat transfer area at the bottom of the high-power module in the printed circuit board; Step S2: welding the high-power module using a heat transfer pad; Step S21: welding to prepare a high-power module; Step S22: placing the heat transfer pad at the bottom of the metal core board in the printed circuit board so that its elastic heat transfer layer contacts the metal core board in the printed circuit board; Step S23: welding the high-power module to the metal core board in the printed circuit board; Step S3: Integrate other components on the printed circuit board; Step S4: installing the assembly prepared in step S3 in a metal packaging box; Step S5: Capping.

2. A method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels according to claim 1, It is characterized in that The step S23 specifically refers to: welding the high-power module to the metal core board in the printed circuit board through a vacuum eutectic welding process.

3. A method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels according to claim 2, It is characterized in that The heat transfer pad is composed of a rigid heat transfer layer and an elastic heat transfer layer located on top of the rigid heat transfer layer; the rigid heat transfer layer is made of a plate-shaped high thermal conductivity metal material; the elastic heat transfer layer is made of an elastic material with high temperature resistance and high thermal conductivity.

4. The method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels according to claim 1, It is characterized in that The metal packaging box body integrates a radio frequency connector located at the signal output end of the metal packaging box body, a radio frequency connector and a low frequency connector located at the signal input end of the metal packaging box body, and a through hole for a printed circuit board to pass through the metal packaging box body.

5. According to a method for preparing a microwave component based on an embedded microfluidic printed circuit board according to claim 1, the microfluidic channel includes a liquid inlet, a liquid outlet, a liquid inlet channel connected to the liquid inlet, a liquid outlet channel connected to the liquid outlet, and a heat dissipation channel structure located between the liquid outlet channel and the liquid inlet channel and connected to each other; the heat dissipation channel structure is located at the bottom of the high-power module.

6. A method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels according to claim 5, It is characterized in that A reinforcement structure is arranged in the liquid inlet flow channel and the liquid outlet flow channel; the heat dissipation flow channel structure comprises a plurality of heat dissipation flow channel units which are sequentially connected in series, and micro flow channels are arranged in the heat dissipation flow channel units.

7. A method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels according to claim 6, It is characterized in that The number of the heat dissipation channel units is N, wherein 20≥N≥2; The number of micro-channels inside the N heat dissipation channel units increases gradually from the liquid inlet channel to the liquid outlet channel, and the cross-sectional area of ​​the channel decreases gradually; The heat dissipation channel unit is also provided with a flow-disturbing structure for optimizing the fluid motion trajectory.

8. A method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels according to any one of claims 5 to 7, It is characterized in that The metal core plate comprises a core plate body located in a metal packaging box body, a cantilever connected to one side of the core plate body and having one end passing through the metal packaging box body, and the liquid inlet and the liquid outlet are arranged at the bottom of the cantilever.

9. A method for preparing a microwave component based on a printed circuit board with embedded microfluidic channels according to claim 8, It is characterized in that The area corresponding to the cantilever in the printed circuit board is not provided with an upper wiring layer and a lower wiring layer.

Images