Rotary selective surface treatment laser processing system and processing method

Abstract

This invention discloses a rotary selective surface treatment laser processing system and method. The rotary selective surface treatment laser processing system includes a rotary laser processing module, a machine vision inspection module, a motion assist module, a vibration module, and a control unit. The control unit is connected to the rotary laser processing module, the motion assist module, the vibration module, and the machine vision inspection module. The rotary selective surface treatment laser processing system and method provided by this invention utilizes a modulated light spot (such as a line spot) treated with light field modulation to achieve uniform energy intensity distribution within the light spot, while simultaneously performing high-speed scanning. This can be further combined with high-speed rotational motion to achieve high-speed scanning processing using a rotating galvanometer. A single scan can cover a large area, significantly improving material removal efficiency.

Description

Technical Field

[0001] This invention relates to a laser processing system, and more particularly to a rotary selective surface treatment laser processing system and method, belonging to the fields of laser processing, optical applications, and advanced manufacturing technology. Background Technology

[0002] The scanning speed of a laser spot is limited. The coordination of scanning spacing and scanning speed, combined with a specific scanning trajectory strategy, allows for the machining of workpiece surfaces. Conventional Gaussian beams have focused spots on the micrometer scale. To ensure a certain spot overlap rate, the scanning spacing also needs to be set on the micrometer scale. Scanning a surface of a certain size requires multiple scanning paths. Furthermore, the uneven energy distribution of Gaussian laser beams results in microstructures, pits, and protrusions on the machined surface. Summary of the Invention

[0003] The main objective of this invention is to provide a rotary selective surface treatment laser processing system and method, which can be used for efficient and high-quality digital processing of workpieces such as metal materials, alloy materials and hard and brittle materials (engineering ceramics, ultra-high temperature ceramics, ceramic matrix composites, etc.), thereby overcoming the shortcomings of the prior art.

[0004] To achieve the aforementioned objectives, the technical solution adopted by this invention includes:

[0005] One embodiment of the present invention provides a rotary selective surface treatment laser processing system, comprising:

[0006] A rotary laser processing module, at least used to provide a rotating laser spot formed by the rotation of a laser beam to perform laser processing on a workpiece;

[0007] A machine vision inspection module is used to identify at least typical features of the workpiece's machining surface to generate driving data for instructing the rotary laser processing module to process the typical features.

[0008] A motion assist module is used to drive the rotating laser spot to move relative to the workpiece along at least one of the x, y, and z axes of a three-dimensional coordinate system.

[0009] The vibration module is at least used to drive the workpiece and the rotating laser spot to vibrate relative to each other along the xy plane in the three-dimensional coordinate system.

[0010] The control unit is connected to at least the rotary laser processing module, the motion assist module, the vibration module, and the machine vision inspection module, and is at least used to regulate the working status of the laser scanning processing module, the rotary laser processing module, the motion assist module, the vibration module, and the machine vision inspection module.

[0011] Another embodiment of the present invention provides a rotary selective surface treatment laser processing method, comprising:

[0012] Provided the aforementioned rotary selective surface treatment laser processing system;

[0013] The workpiece surface is laser-processed using a rotating laser spot provided by a rotating laser processing module.

[0014] The machine vision inspection module identifies typical features of the processed surface of the workpiece after laser processing, thereby generating driving data to drive the rotary laser processing module to process the typical features.

[0015] Based on the driving data, the rotary laser processing module processes the typical features until the desired workpiece processing quality is obtained.

[0016] Compared with the prior art, the advantages of the present invention include:

[0017] The present invention provides a rotary selective surface treatment laser processing system and method, which uses a modulated spot (such as a line spot) treated by light field modulation to achieve uniform energy intensity distribution within the spot, while performing high-speed scanning. It can be further combined with high-speed rotational motion to achieve high-speed scanning processing with a rotary galvanometer. A single scan can cover a large area, and the efficiency can be improved by tens of times or even more compared to point spot.

[0018] This invention provides a rotary selective surface treatment laser processing system and method. After machine vision detection, the overlapping area or typical feature area of ​​the surface to be processed is identified and a digital code is generated to locate the corresponding area, thereby driving the rotary laser processing system to achieve secondary surface treatment of the typical area to be processed.

[0019] The present invention provides a rotary selective surface treatment laser processing system and method, which, with the assistance of strategies such as airflow pressure and atmosphere protection, can further improve the surface quality of the workpiece and make important innovative contributions to the fields of laser processing and optical applications. Attached Figure Description

[0020] Figure 1a This is a schematic diagram of the structure of a modulated laser rotary high-speed scanning processing system provided in Embodiment 1 of the present invention;

[0021] Figure 1b This is a schematic diagram of the structure of a rotating component in a modulated laser rotary high-speed scanning processing system provided in Embodiment 1 of the present invention;

[0022] Figure 1c yes Figure 1bA schematic diagram of the cross-sectional structure formed along the middle AA;

[0023] Figure 2a This is a schematic diagram of the structure of a rotating multibeam laser precision machining system based on optical field modulation provided in Embodiment 2 of the present invention;

[0024] Figure 2b This is a schematic diagram of the structure of a rotating component in a rotating multibeam laser precision machining system based on optical field modulation, as provided in Embodiment 2 of the present invention.

[0025] Figure 2c yes Figure 2b A schematic diagram of the cross-sectional structure formed along the middle AA;

[0026] Figure 3a and Figure 3b This is a schematic diagram of an optical field structure formed by optical field modulation via a rotary laser processing module in a typical embodiment of the present invention.

[0027] Figure 4a , Figure 4c This is a schematic diagram of an irregular optical field structure formed by optical field modulation via a rotating laser processing module in a typical embodiment of the present invention.

[0028] Figure 4b yes Figure 4a A schematic diagram of the cross-sectional structure formed along the middle AA;

[0029] Figure 5a , Figure 5c This is a schematic diagram of another irregular optical field structure formed by optical field modulation via a rotating laser processing module in a typical embodiment of the present invention.

[0030] Figure 5b yes Figure 5a A schematic diagram of the cross-sectional structure formed along the middle AA;

[0031] Figure 6a , 6c This is a schematic diagram of another irregular optical field structure formed by optical field modulation via a rotating laser processing module in a typical embodiment of the present invention.

[0032] Figure 6b yes Figure 6a A schematic diagram of the cross-sectional structure formed along the middle AA;

[0033] Figure 7a , Figure 7c This is a schematic diagram of another irregular optical field structure formed by optical field modulation via a rotating laser processing module in a typical embodiment of the present invention.

[0034] Figure 7b yes Figure 7aA schematic diagram of the cross-sectional structure formed along the middle AA;

[0035] Figure 8 This is a schematic diagram of a rotary selective surface treatment laser processing flow provided in a typical embodiment of the present invention. Detailed Implementation

[0036] In view of the shortcomings of the prior art, the inventors of this invention, through long-term research and extensive practice, have proposed the technical solution of this invention. The following will further explain and illustrate this technical solution, its implementation process, and its principles.

[0037] One embodiment of the present invention provides a rotary selective surface treatment laser processing system, comprising:

[0038] A rotary laser processing module, at least used to provide a rotating laser spot formed by the rotation of a laser beam to perform laser processing on a workpiece;

[0039] A machine vision inspection module is used to identify at least typical features of the workpiece's machining surface to generate driving data for instructing the rotary laser processing module to process the typical features.

[0040] A motion assist module is used to drive the rotating laser spot to move relative to the workpiece along at least one of the x, y, and z axes of a three-dimensional coordinate system.

[0041] The vibration module is at least used to drive the workpiece and the rotating laser spot to vibrate relative to each other along the xy plane in the three-dimensional coordinate system.

[0042] The control unit is connected to at least the rotary laser processing module, the motion assist module, the vibration module, and the machine vision inspection module, and is at least used to regulate the working status of the laser scanning processing module, the rotary laser processing module, the motion assist module, the vibration module, and the machine vision inspection module.

[0043] In one specific implementation, the rotating laser spot is capable of rotating around its own axis.

[0044] In one specific implementation, the rotary laser processing module includes a laser source, a laser beam expander, a beam shaper, a laser reflector, a scanning galvanometer, and a focusing lens sequentially arranged in the optical path of the laser beam provided by the laser source, and a first driving mechanism. The first driving mechanism is connected to the beam shaper and is used to drive the beam shaper to rotate around its own axis. The shaped light spot modulated by the beam shaper can rotate around its own axis on the workpiece surface.

[0045] Alternatively, the rotary laser processing module includes a laser source, a laser beam expander, a beam splitter, and a laser reflector sequentially arranged in the optical path of the laser beam provided by the laser source, and a first driving mechanism. The first driving mechanism is connected to the beam splitter and is used to drive the beam splitter to rotate around its own axis. Multiple laser spots modulated by the beam splitter can rotate around a rotation axis on the workpiece surface.

[0046] It should be noted that the beam splitter is mainly used to process the laser beam after beam expansion into a light field with a certain shape. However, the beam splitter cannot handle the energy distribution of the light field. It can control the shape and distribution of the light field or spot and further use it for processing. The beam shaper is a widely used diffractive optical element (DOE). Its function is to flatten the top of the Gaussian beam to obtain a spot with uniform energy distribution and steep edges. The laser processed by the beam shaper can be of various forms, including multiple laser beams. The shape of the spot projected onto the workpiece surface is flexible and not limited to a single laser beam.

[0047] In one specific implementation, the motion assist module includes a second drive mechanism, which cooperates with the rotary laser processing module or the workpiece transmission and is used to drive the rotary laser processing module or the workpiece to move along the x-axis of the three-dimensional coordinate system.

[0048] In one specific implementation, the motion assist module further includes a third drive mechanism, which cooperates with the rotary laser processing module or the workpiece transmission and is used to drive the rotary laser processing module or the workpiece to move along the y-axis of the three-dimensional coordinate system.

[0049] In one specific implementation, the motion assist module further includes a fourth drive mechanism, which cooperates with the rotary laser processing module or the workpiece transmission and is used to drive the rotary laser processing module or the workpiece to move along the z-axis of the three-dimensional coordinate system.

[0050] In one specific implementation, the motion assist module is also used to drive the workpiece to rotate about at least one rotation axis.

[0051] In one specific implementation, the motion assist module further includes a fifth drive mechanism, which is in transmission cooperation with the workpiece and is used to drive the workpiece to rotate around the z-axis of the three-dimensional coordinate system.

[0052] In one specific implementation, the vibration module includes a vibration generating mechanism for driving the rotary laser processing module or the workpiece to vibrate along the xy plane of the three-dimensional coordinate system.

[0053] In one specific implementation, the machine vision inspection module includes a CCD camera and / or a light field imaging camera.

[0054] In one specific implementation, the rotary selective surface treatment laser processing system further includes a gas-assisted module, which is at least used to provide a selected gas and to make the selected gas contact or cover the processing area of ​​the workpiece.

[0055] Another embodiment of the present invention provides a rotary selective surface treatment laser processing method, comprising:

[0056] Provided the aforementioned rotary selective surface treatment laser processing system;

[0057] The workpiece surface is laser-processed using a rotating laser spot provided by a rotating laser processing module.

[0058] The machine vision inspection module identifies typical features of the processed surface of the workpiece after laser processing, thereby generating driving data to drive the rotary laser processing module to process the typical features.

[0059] Based on the driving data, the rotary laser processing module processes the typical features until the desired workpiece processing quality is obtained.

[0060] In one specific implementation, the rotary selective surface treatment laser processing method further includes: during the laser processing of the workpiece surface with a rotary laser spot, the rotary laser spot is rotated around its own axis or around a rotation axis.

[0061] In one specific implementation, the rotary selective surface treatment laser processing method further includes: using a motion assist module to drive the rotary laser spot to generate relative motion with the workpiece along at least one of the x, y, and z axes of a three-dimensional coordinate system.

[0062] In one specific implementation, the rotary selective surface treatment laser processing method further includes: using a motion assist module to drive the workpiece to rotate around the z-axis of the three-dimensional coordinate system.

[0063] In one specific implementation, the rotary selective surface treatment laser processing method further includes: using a vibration module to drive the workpiece and the rotary laser spot to generate relative vibration along the xy plane direction in the three-dimensional coordinate system.

[0064] In one specific implementation, the rotary selective surface treatment laser processing method further includes: providing a selected gas with a gas-assisted module, and making the selected gas contact or cover the processing area of ​​the workpiece.

[0065] The following will further explain the technical solution, its implementation process and principle in conjunction with the accompanying drawings and specific implementation examples. Unless otherwise specified, the optical components such as lasers, laser beam expanders, beam shapers, beam splitters, laser reflectors, scanning galvanometers, and focusing lenses used in the embodiments of the present invention, as well as drive motors, drive cylinders, vibration generating mechanisms, control computers, CNC programs and software, can all be those known to those skilled in the art and can all be obtained commercially. Different models and sizes of the above components will not affect the implementation of the technical solution of the present invention and the corresponding results obtained. Those skilled in the art can select different models or sizes of components according to specific needs. Here, no special limitation is made on the model of each functional component.

[0066] Example 1

[0067] Please see Figure 1a A modulated laser rotary high-speed scanning processing system includes a rotary laser processing module, a machine vision inspection module, a motion assist module, a vibration module, and a control unit. The control unit is connected to the rotary laser processing module, the motion assist module, the vibration module, and the machine vision inspection module, and is at least used to regulate the working state of the laser scanning processing module, the rotary laser processing module, the motion assist module, the vibration module, and the machine vision inspection module.

[0068] In this embodiment, the rotary laser processing module is at least used to provide a rotary laser spot formed by the rotation of the laser beam to perform laser processing on the workpiece; the machine vision inspection module is at least used to identify typical features (e.g., protrusions, pits, cracks, etc.) of the processed surface of the workpiece to form driving data for driving the rotary laser processing module to process the typical features; the motion assist module is at least used to drive the rotary laser spot and the workpiece to generate relative motion along at least one of the x, y, and z axes of a three-dimensional coordinate system; the vibration module is at least used to drive the workpiece and the rotary laser spot to generate relative vibration along the xy plane direction in the three-dimensional coordinate system.

[0069] In this embodiment, please refer again. Figure 1aThe rotary laser processing module includes a laser source 2 and a laser beam expander 3, a rotating component 4, a laser reflector 5, a scanning galvanometer 7, and a focusing lens 8, which are sequentially arranged on the optical path of the laser beam provided by the laser source 2. The rotating component 4 includes a first driving mechanism 4-1 and a beam shaper 4-2. The beam shaper 4-2 is arranged on the optical path of the laser beam and is connected to the first driving mechanism 4-1. The beam shaper 4-2 can rotate around its own axis under the drive of the first driving mechanism 4-1. The energy intensity is uniformly distributed in the shaped spot or modulated spot (e.g., a line spot) formed by the beam shaper 4-2. At the same time, the beam shaper 4-2 can rotate around its own axis, so that the formed shaped spot or modulated spot can rotate around its own axis, thereby realizing high-speed scanning processing of the workpiece by the rotary galvanometer.

[0070] In this embodiment, the rotary laser processing module can modulate the laser beam, generating modulated laser (such as a line laser). The modulated laser includes, but is not limited to, line spots, and may include various shaped spots that are reflected by a scanning galvanometer and focused by a lens to achieve high-speed scanning processing. The structure of a type of irregularly shaped laser beam / field formed after optical field modulation by the beam shaper of the rotary laser processing module can be as follows: Figure 3a , Figure 3b as well as Figures 4a-4c , Figures 5a-5c , Figures 6a-6c , Figures 7a-7c As shown.

[0071] In this embodiment, the laser source 2 can be a Gaussian laser source, including a fiber laser, etc. The first driving mechanism 4-1 can be a rotary drive motor or a rotary drive cylinder, etc. The laser source 2, laser beam expander 3, rotating component 4, laser reflector 5, scanning galvanometer 7 and focusing lens 8 can be jointly packaged to form a laser processing head for performing laser processing on a workpiece.

[0072] In this embodiment, the rotary laser processing module further includes a laser controller 1, which is connected to the laser source 2 and used to control the working state of the laser source 2. It should be noted that the laser controller 1 can be an independently set laser control computer or other similar device, or it can be part of the control unit 12.

[0073] In this embodiment, please refer again. Figure 1a The motion assist module includes a second drive mechanism, which is in transmission cooperation with the rotary laser processing module or the workpiece 9, and is used to drive the rotary laser processing module or the workpiece 9 to move along the x-axis of the three-dimensional coordinate system.

[0074] As a preferred embodiment, the second drive mechanism is driven and cooperates with the rotary laser processing module. Specifically, the motion assist module includes a first motion platform 6, the rotary laser processing module is mounted on the first motion platform 6 and is movably cooperated with the first motion platform 6, the rotary laser processing module is driven and connected to the second drive mechanism, and can move along the x-axis of the three-dimensional coordinate system on the first motion platform 6 under the drive of the second drive mechanism, thereby realizing the movement of the rotary laser processing module along the x-axis.

[0075] In this embodiment, the second drive mechanism can be fixedly mounted on the first motion platform 6. The first motion platform 6 can be provided with a guide rail arranged along the x-axis. The rotary laser processing module can be mounted on the guide rail and can move along the guide rail. The second drive mechanism is a linear drive mechanism, such as a linear drive motor or a linear drive cylinder.

[0076] In an embodiment, the motion assist module further includes a third drive mechanism, which is in transmission cooperation with the rotary laser processing module or the workpiece 9 and is used to drive the rotary laser processing module or the workpiece 9 to move along the y-axis of the three-dimensional coordinate system.

[0077] As a preferred embodiment, the third driving mechanism is in transmission cooperation with the workpiece 9. Specifically, the motion auxiliary module includes a second motion platform 11, which is movable. The workpiece 9 is fixedly mounted on the second motion platform 11. The second motion platform 11 is connected to the third driving mechanism and can move along the y-axis of the three-dimensional coordinate system under the drive of the third driving mechanism, thereby realizing the movement of the workpiece 9 along the y-axis. Alternatively, the second motion platform 11 can be fixed, and the workpiece 9 is movably mounted on the second motion platform 11. The third driving mechanism is in transmission cooperation with the workpiece 9 and is used to drive the workpiece 9 to move along the y-axis on the second motion platform 11.

[0078] In this embodiment, the third driving mechanism is a linear driving mechanism, such as a linear drive motor or a linear drive cylinder.

[0079] In this embodiment, the motion assist module further includes a fourth drive mechanism, which is in transmission cooperation with the rotary laser processing module or the workpiece 9, and is used to drive the rotary laser processing module or the workpiece to move along the z-axis of the three-dimensional coordinate system.

[0080] As a preferred embodiment, the fourth driving mechanism is in transmission cooperation with the rotary laser processing module. Specifically, the motion auxiliary module includes a third motion platform, which is movable. The rotary laser processing module is mounted on the third motion platform, and the third motion platform is connected to the fourth driving mechanism. Under the drive of the fourth driving mechanism, the third motion platform moves along the z-axis of the three-dimensional coordinate system, thereby realizing the movement of the rotary laser processing module along the z-axis. Alternatively, the third motion platform is fixed, and the rotary laser processing module is movably mounted on the third motion platform. The fourth driving mechanism is in transmission cooperation with the rotary laser processing module and is used to drive the rotary laser processing module to move along the z-axis on the third motion platform. For example, the third motion platform may be provided with a guide rail extending along the z-axis, and the rotary laser processing module is mounted on the guide rail and can move along the z-axis.

[0081] In this embodiment, the fourth driving mechanism is a linear driving mechanism, such as a linear drive motor or a linear drive cylinder.

[0082] As a more preferred embodiment, the third motion platform can be mounted on the first motion platform 6, and the rotary laser processing module can be mounted on the third motion platform. The third motion platform is movable with the first motion platform 6 in the x-axis direction, and the rotary laser processing module is movable with the third motion platform in the z-axis direction. The second drive mechanism is connected to the third motion platform. The rotary laser processing module and the third motion platform as a whole can move along the first motion platform 6 in the x-axis direction first under the drive of the second drive mechanism, and the rotary laser processing module can move along the z-axis first under the drive of the fourth drive mechanism. For example, the third motion platform can be movable with the first motion platform 6 via a guide rail set along the x-axis, and the rotary laser processing module can be movable with the third motion platform via a guide rail set along the z-axis.

[0083] In this embodiment, the motion assist module further includes a fifth drive mechanism, which is in transmission cooperation with the workpiece 9 and is used to drive the workpiece to rotate around the z-axis of the three-dimensional coordinate system. The fifth drive mechanism is a rotary drive mechanism, such as a rotary drive motor or a rotary drive cylinder.

[0084] In this embodiment, the motion assist module further includes a motion system controller 13, which is connected to the second drive mechanism and / or the third drive mechanism and / or the fourth drive mechanism and / or the fifth drive mechanism, and is used to control / adjust the working state of the second drive mechanism and / or the third drive mechanism and / or the fourth drive mechanism and / or the fifth drive mechanism. The motion system controller may be a motion system control computer, which may be independently set up and connected to the control unit, or it may be part of the control unit 12.

[0085] In this embodiment, the vibration module includes a vibration generating mechanism, which drives the rotary laser processing module or the workpiece to vibrate along the xy plane of the three-dimensional coordinate system. The introduction of vibration can change the periodicity of the interaction mechanism between the workpiece and the laser, and realize diversified control of energy distribution (dynamic spot overlap rate, energy uniformity). For example, the vibration generating mechanism includes a vibration platform 10, which can be fixedly mounted on the second motion platform 11. The workpiece 9 is placed on the vibration platform, and the vibration platform 10 can move along the y-axis together with the workpiece 9. For example, the vibration platform can be an electric vibration table, an ultrasonic vibration table, etc., which can realize conventional, ultrasonic or ultra-high frequency vibration.

[0086] In this embodiment, the machine vision inspection module includes a CCD camera and / or a light field imaging camera. The CCD camera can observe the processing process and images of the processed surface. The light field imaging camera can observe and acquire image information of the processed workpiece according to a predetermined motion path, and use a selected algorithm to identify typical features of the workpiece's processed surface (such as microcracks, pits, protrusions, grooves, scaly structures, etc.). The surface processed by line laser scanning will form new surface microstructures, reconstituted layers, and other geometric features. The CCD camera and the light field imaging camera observe the processed surface of the workpiece 9 according to a predetermined scanning path, detect, acquire, analyze, and identify surface features such as protrusions, pits, and cracks, and extract their adaptive coordinate data to form driving data for secondary rotational selective laser surface treatment of the processed surface of the workpiece 9. Then, the area to be processed by the machine vision inspection module is formed into a digital code description, driving the rotary laser processing module to the corresponding area to carry out secondary surface treatment, thereby improving the surface quality of the workpiece's processed surface.

[0087] In this embodiment, the modulated laser rotary high-speed scanning processing system further includes a gas-assisted module. The gas-assisted module is at least used to provide a selected gas and to make the selected gas contact or cover the processing area of ​​the workpiece. The gas-assisted module can achieve a certain airflow pressure and gas protection environment; realize the reorganization and morphological reconstruction of the structure and properties of the workpiece interacting with the laser beam, thereby controlling the process strategy, controlling the heat-affected zone and recast layer, and avoiding the generation of microcracks in the workpiece; for example, the gas-assisted module can be a gas container with an adjustable airflow valve, etc.

[0088] In this embodiment, the control unit may be a control computer, etc., and the CNC program / control software used by the control unit can be obtained commercially. The specific structure of the control unit is not limited here.

[0089] Example 2

[0090] The structure of a rotating multi-beam laser precision machining system based on optical field modulation is as follows: Figure 2a As shown, the structure of the optical field modulation-based rotary multibeam laser precision machining system in this embodiment is basically the same as that of the modulation laser rotary high-speed scanning machining system in Embodiment 1. The machine vision detection module, motion assistance module, vibration module, gas assistance module, and control unit can all be the same. The following mainly introduces and explains the structure of the rotary laser machining module in Embodiment 2, which has the main differences from Embodiment 1.

[0091] Please refer to it again. Figure 2a The rotary laser processing module in this embodiment includes a laser source 22, a laser beam expander 23, a rotating assembly 24, and a laser reflector 25, which are sequentially arranged in the optical path of the laser beam provided by the laser source 22. The rotating assembly 24 includes a first driving mechanism 24-1 and a beam splitter 24-2 connected by transmission. The beam splitter 24-2 is arranged in the optical path between the laser beam expander 23 and the laser reflector 25. The beam splitter 24-2 is connected to the first driving mechanism 24-1 and can rotate around its own axis under the drive of the first driving mechanism 24-1, so that multiple laser spots modulated by the beam splitter 24-2 can generate equivalent rotation on the workpiece surface. The circular (or irregular) uniform intensity distribution of the light field modulated by the beam splitter 24-2 can achieve equivalent rotational motion of the light spot projected on the workpiece surface by the high-speed rotating beam splitter 24-2.

[0092] It should be noted that the structure of the beam / field formed by the rotatable beam splitter of the rotary laser processing module in this embodiment, after optical field modulation, is similar to that of... Figure 3a , Figure 3b as well as Figures 4a-4c , Figures 5a-5c , Figures 6a-6c , Figures 7a-7c The same or similar as shown.

[0093] In this embodiment, the laser source 22 may be a fiber laser, the first driving mechanism 24-1 may be a rotary drive motor or a rotary drive cylinder, and the laser source 22, laser beam expander 23, rotating component 4, and laser reflector 25 may be encapsulated together to form a laser processing head for performing laser processing on a workpiece.

[0094] In this embodiment, the rotary laser processing module further includes a laser controller 21, which is connected to the laser source 22 and used to control the working state of the laser source 22. It should be noted that the laser controller 21 can be an independently set laser control computer or other similar device, or it can be part of the control unit 12.

[0095] Example 3

[0096] A rotary selective surface treatment laser processing procedure can be referenced. Figure 8 As shown, the rotary selective surface treatment laser processing method is implemented by a modulated laser rotary high-speed scanning processing system in Example 1 or a rotary multi-beam laser precision processing system based on optical field modulation in Example 2, specifically including:

[0097] 1) Laser processing of the workpiece surface is performed using a rotating laser spot provided by a rotating laser processing module;

[0098] 2) The machine vision inspection module identifies the typical features of the processed surface of the workpiece after laser processing, thereby forming driving data for driving the rotary laser processing module to process the typical features.

[0099] 3) Based on the driving data, the rotary laser processing module processes the typical features.

[0100] Repeat steps 1)-3) at least once until the desired workpiece machining quality is obtained.

[0101] Of course, the processing method further includes: during the laser processing of the workpiece surface by the rotating laser spot provided by the rotating laser processing module, the rotating laser spot is rotated around its own axis or around a rotation axis; the motion assist module drives the rotating laser spot and the workpiece to generate relative motion along at least one of the x, y, and z axes of a three-dimensional coordinate system; the motion assist module drives the workpiece to rotate around the z axis of the three-dimensional coordinate system; the vibration module drives the workpiece and the rotating laser spot to generate relative vibration along the xy plane direction in the three-dimensional coordinate system; and the gas assist module provides a selected gas and makes the selected gas contact or cover the processing area of ​​the workpiece.

[0102] It should be noted that the order of steps 1) and 2) can be interchanged.

[0103] It should be noted that the rotary selective surface treatment laser processing process can be preset and controlled by the CNC program in the control unit.

[0104] It should be noted that the form of the rotary laser processing module in the embodiments of the present invention is diverse, and the beam / light field formed by the rotary laser processing module is also diverse. For example, in embodiment 1, a beam shaper is used to modulate the light field to achieve a circular array distribution of multiple laser beams. Combined with the high-speed rotation of the beam shaper with light field modulation function, a microscale "light knife" effect with a certain coverage area can be achieved. In this case, the modulated light field itself has a spatial distribution of multiple beams and can be rotated at high speed and controllably. Alternatively, as in embodiment 2, a circular (or irregular) light field with uniform intensity distribution is formed after light field modulation by a high-speed rotating beam splitter. This can achieve the equivalent rotational motion of the light spot projected on the workpiece surface, and the relative motion (including relative rotational motion) between the laser beam and the workpiece can achieve dynamic coverage of the workpiece processing surface by the light field.

[0105] The present invention provides a rotary selective surface treatment laser processing system and method, which uses a modulated light spot (such as a line spot) to achieve uniform energy intensity distribution within the light spot after light field modulation treatment, and performs high-speed scanning at the same time. It can be further combined with high-speed rotational motion to realize high-speed scanning processing of rotating galvanometer. A single scan can cover a large area, and the efficiency can be improved by tens of times or even more compared with point spot, which can significantly improve the material removal efficiency.

[0106] The present invention provides a rotary selective surface treatment laser processing system and processing method. For the overlapping area or typical feature area of ​​the processing surface, after machine vision detection, a digital code is formed to locate the corresponding area, thereby driving the rotary laser processing system to realize secondary surface treatment of the typical area to be processed.

[0107] The present invention provides a rotary selective surface treatment laser processing system and method, which, with the assistance of strategies such as airflow pressure and atmosphere protection, can further improve the surface quality of the workpiece and make important innovative contributions to the fields of laser processing and optical applications.

[0108] It should be understood that the above embodiments are merely illustrative of the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A rotary selective surface treatment laser processing system, characterized in that... include: A rotary laser processing module is at least used for laser processing of a workpiece with a rotary laser spot formed by the rotation of a laser beam. The rotary laser processing module includes a laser source, a laser beam expander, a beam shaper, a laser reflector, a scanning galvanometer, and a focusing lens sequentially arranged in the optical path of the laser beam provided by the laser source, and a first driving mechanism. The first driving mechanism is drivenly connected to the beam shaper and is used to drive the beam shaper to rotate around its own axis, so that the shaped laser spot modulated by the beam shaper can rotate around its own axis on the workpiece surface. Alternatively, the rotary laser processing module includes a laser source, a laser beam expander, a beam splitter, and a laser reflector sequentially arranged in the optical path of the laser beam provided by the laser source, and a first driving mechanism. The first driving mechanism is drivenly connected to the beam splitter and is used to drive the beam splitter to rotate around its own axis, so that multiple laser spots modulated by the beam splitter can rotate around a rotation axis on the workpiece surface, and the energy intensity within the modulated laser spots is uniformly distributed. A machine vision inspection module is used to identify at least typical features of the workpiece's machining surface to generate driving data for instructing the rotary laser processing module to process the typical features. A motion assist module is used to drive the rotating laser spot to move relative to the workpiece along at least one of the x, y, and z axes of a three-dimensional coordinate system. The vibration module is at least used to drive the workpiece and the rotating laser spot to vibrate relative to each other along the xy plane in the three-dimensional coordinate system. The control unit is connected to at least the rotary laser processing module, the motion assist module, the vibration module, and the machine vision inspection module, and is at least used to regulate the working status of the laser scanning processing module, the rotary laser processing module, the motion assist module, the vibration module, and the machine vision inspection module.

2. The rotary selective surface treatment laser processing system according to claim 1, characterized in that: The motion assist module includes a second drive mechanism, which cooperates with the rotary laser processing module or the workpiece transmission and is used to drive the rotary laser processing module or the workpiece to move along the x-axis of the three-dimensional coordinate system.

3. The rotary selective surface treatment laser processing system according to claim 2, characterized in that: The motion assist module also includes a third drive mechanism, which cooperates with the rotary laser processing module or the workpiece transmission and is used to drive the rotary laser processing module or the workpiece to move along the y-axis of the three-dimensional coordinate system.

4. The rotary selective surface treatment laser processing system according to claim 2, characterized in that: The motion assist module also includes a fourth drive mechanism, which cooperates with the rotary laser processing module or the workpiece transmission and is used to drive the rotary laser processing module or the workpiece to move along the z-axis of the three-dimensional coordinate system.

5. The rotary selective surface treatment laser processing system according to claim 1, 2, 3, or 4, characterized in that: The motion assist module is also used to drive the workpiece to rotate about at least one rotation axis.

6. The rotary selective surface treatment laser processing system according to claim 5, characterized in that: The motion assist module also includes a fifth drive mechanism, which is in transmission cooperation with the workpiece and is used to drive the workpiece to rotate around the z-axis of the three-dimensional coordinate system.

7. The rotary selective surface treatment laser processing system according to claim 1, characterized in that: The vibration module includes a vibration generating mechanism, which is used to drive the rotary laser processing module or the workpiece to vibrate along the xy plane of the three-dimensional coordinate system.

8. The rotary selective surface treatment laser processing system according to claim 1, characterized in that: The machine vision inspection module includes a CCD camera and / or a light field imaging camera.

9. The rotary selective surface treatment laser processing system according to claim 1, characterized in that, It also includes a gas-assisted module, which is at least used to provide a selected gas and to make the selected gas contact or cover the processing area of ​​the workpiece.

10. A rotary selective surface treatment laser processing method, characterized in that... include: Provides a rotary selective surface treatment laser processing system according to any one of claims 1-9; The workpiece surface is laser-processed using a rotating laser spot provided by a rotating laser processing module. During the laser processing of the workpiece surface using the rotating laser spot, the rotating laser spot is rotated around its own axis or around a rotation axis. The machine vision inspection module identifies typical features of the processed surface of the workpiece after laser processing, thereby generating driving data to drive the rotary laser processing module to process the typical features. Based on the driving data, the rotary laser processing module processes the typical features until the desired workpiece processing quality is obtained.

11. The rotary selective surface treatment laser processing method according to claim 10, characterized in that, Also includes: The rotating laser spot is driven by a motion assist module to generate relative motion with the workpiece along at least one of the x, y, and z axes of a three-dimensional coordinate system.

12. The rotary selective surface treatment laser processing method according to claim 10 or 11, characterized in that, Also includes: The workpiece is rotated around the z-axis of the three-dimensional coordinate system by a motion assist module.

13. The rotary selective surface treatment laser processing method according to claim 10, characterized in that, Also includes: The vibration module drives the workpiece and the rotating laser spot to vibrate relative to each other along the xy plane in the three-dimensional coordinate system.

14. The rotary selective surface treatment laser processing method according to claim 10, characterized in that, Also includes: A gas-assisted module provides a selected gas and makes the selected gas contact or cover the processing area of ​​the workpiece.

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