A method for processing round seed crystals

Abstract

This application provides a method for processing round seed crystals. The method includes: a machine tool for fixing the first end of a seed crystal matrix; and a cutting assembly mounted on the machine tool for sequentially cutting a seed crystal body, a load-bearing inclined surface, and a load-bearing head from the first end to the second end of the seed crystal matrix to form a round seed crystal. The second end is opposite to the first end. The seed crystal matrix is ​​a cylindrical frustum, and both the load-bearing head and the seed crystal body are cylindrical frustums. The diameter of the load-bearing head is larger than the diameter of the seed crystal body. The load-bearing inclined surface is a cone, with its two ends connected to the load-bearing head and the seed crystal body, respectively. The diameter of the load-bearing inclined surface increases from the end closer to the seed crystal body to the end closer to the load-bearing head. This round seed crystal processing method is simple in structure, easy to operate, and can quickly process a seed crystal matrix into a round seed crystal, improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of monocrystalline silicon production, and more specifically to a method for processing round seed crystals. Background Technology

[0002] In the monocrystalline silicon pulling industry, the seed crystal, acting as the seed for monocrystalline growth, is the foundation for forming the crystalline material. It ensures that the pulled crystal rod has the same crystal orientation as the seed crystal, thus the quality of the seed crystal affects the quality of the pulled crystal. Seed crystals have various structures and are processed from monocrystalline silicon rods according to the crystal orientation requirements of the pulled crystal rod. Currently, most of the seed crystals used are round seed crystals. The existing processing method for round seed crystals involves cutting the monocrystalline silicon rod into multiple square seed crystal preforms, then cutting the preforms to have rounded sides, and repeating this process multiple times to form the seed crystal. This processing method results in significant waste of scrap material from the seed crystal preforms, large precision errors, and relatively low production efficiency. Summary of the Invention

[0003] In view of this, the present invention provides a method for processing round seed crystals that can effectively improve the production efficiency of round seed crystals.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] According to an embodiment of the present invention, a method for processing a round seed crystal is provided. The round seed crystal includes a seed crystal body, a load-bearing inclined body, and a load-bearing head connected in sequence. The seed crystal body and the load-bearing head are cylindrical, and the diameter of the load-bearing head is larger than the diameter of the seed crystal body. The load-bearing inclined body is a cone, and the diameter of the load-bearing inclined body increases from the end closer to the seed crystal body to the end closer to the load-bearing head.

[0006] The characteristic feature is that the processing method includes:

[0007] S100, Compile the cutting program for the machine tool;

[0008] S200, Fix the first end of the cylindrical seed crystal matrix on the machine tool;

[0009] S300: According to the cutting program, the cutting component moves from the end face of the first end of the seed crystal to the second end of the seed crystal to cut out a round seed crystal.

[0010] The first and second ends of the seed crystal matrix are the two ends along the axial direction of the seed crystal matrix.

[0011] In one embodiment of this application, the cutting assembly includes a first cylindrical cutter, a second cylindrical cutter, and a file;

[0012] One end of the first cylindrical cutter is used to connect to the machine tool, and the other end is formed with the first cutting tooth. The inner diameter of the first cylindrical cutter matches the diameter of the seed crystal body.

[0013] One end of the second cylindrical cutter is used to connect to the machine tool, and the other end has a second cutting tooth. The inner diameter of the second cylindrical cutter matches the diameter of the load-bearing head.

[0014] In one embodiment of this application, step 300 specifically includes:

[0015] S310. Install a first cylindrical cutter on the machine tool. The machine tool moves the first cylindrical cutter from the first end of the seed crystal to the second end of the seed crystal according to the cutting program to cut out the seed crystal body. The distance the first cylindrical cutter moves is the length of the seed crystal body.

[0016] S320. Replace the first cylindrical cutter with the second cylindrical cutter. The machine tool moves the second cylindrical cutter from the end face of the first end of the seed crystal to the second end of the seed crystal according to the cutting program to cut out the load-bearing head.

[0017] S330. The machine tool uses a file to file the connection between the load-bearing head and the seed crystal body to form a load-bearing inclined surface.

[0018] In one embodiment of this application, the outer wall of the first cylindrical cutter is provided with at least one spiral first cutting groove in the circumferential direction.

[0019] In one embodiment of this application, the outer wall of the second cylindrical cutter is provided with at least one spiral second cutting groove in the circumferential direction.

[0020] In one embodiment of this application, replacing the first cylindrical cutter with a second cylindrical cutter includes:

[0021] S321. After the seed crystal body is cut, the machine tool controls the first cylindrical cutter to retract from the seed crystal body and replaces the first cylindrical cutter with the second cylindrical cutter.

[0022] In one embodiment of this application, in step 330, after the load-bearing head is cut, the round seed crystal intermediate body including the seed crystal body and the load-bearing head is taken out from the seed crystal mother body, and then the connection between the load-bearing head and the seed crystal body is filed with a file to form a load-bearing inclined body.

[0023] 8. The method for processing round seed crystals according to claim 1, wherein the cutting assembly includes a circumferential cutting blade;

[0024] The circumferential cutter has a third cutting tooth at one end and is connected to the machine tool at the other end, and is used to follow the rotation of the machine tool to circumferentially cut the seed crystal mother body.

[0025] In one embodiment of this application, step 300 specifically includes:

[0026] S340. Install a ring cutter on the machine tool. The machine tool uses the ring cutter to ring cut the first end of the seed crystal mother body according to the cutting program to cut out the seed crystal body.

[0027] S350. After the seed crystal body is cut, the machine tool controls the ring cutter to gradually expand the cut outward to cut out the load-bearing inclined body.

[0028] After the load-bearing inclined plane is cut, the machine tool controls the circumferential cutter to perform circumferential cutting on the second end of the seed crystal to cut out the load-bearing head.

[0029] In one embodiment of this application, in step 340, the inner diameter of the annular cutting surface formed by the circumferential cutter during circumferential cutting is the same as the diameter of the seed crystal body, and the outer diameter is larger than the diameter of the load-bearing head.

[0030] The above-described technical solution of the present invention has at least one of the following beneficial effects:

[0031] 1. In the round seed crystal processing method provided in this embodiment of the invention, a cylindrical seed crystal matrix is ​​directly used as the processing object. A cutting component moves from the first end face of the seed crystal matrix to the second end face of the seed crystal matrix to cut the round seed crystal, so that the round seed crystal is cut from the inside of the seed crystal matrix. Compared with existing round seed crystal processing methods, the processing method provided in this embodiment of the invention can make more efficient use of the seed crystal matrix and reduce waste of scrap material.

[0032] 2. The round seed crystal processing method provided in this embodiment of the invention can continuously process the seed crystal matrix, shorten the production cycle, and improve production efficiency. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the structure of a round seed crystal;

[0034] Figure 2 This is a schematic diagram of the structure of the first cylindrical cutter and the second cylindrical cutter used in the round seed crystal processing method of this invention.

[0035] Figure 3 This is a schematic diagram of the first cylindrical cutter cutting the seed crystal body in the round seed crystal processing method of this invention;

[0036] Figure 4 This is a schematic diagram of the structure of the ring cutter used in the round seed crystal processing method of this invention;

[0037] Figure 5 This is a schematic diagram of a circumferential cutter cutting the main body of a seed crystal in the round seed crystal processing method of this invention;

[0038] Figure 6 This is a schematic diagram of a circumferential cutter cutting the main body of the seed crystal inside the seed crystal matrix in the round seed crystal processing method of this invention.

[0039] Figure 7 This is a flowchart of a round seed crystal processing method according to an embodiment of the present invention.

[0040] Reference numerals: 40, Seed crystal mother body; 50, Seed crystal body; 60, Load-bearing inclined plane; 70, Load-bearing head; 110, First cylindrical cutter; 111, First cutting tooth; 112, First cutting groove; 120, Second cylindrical cutter; 121, Second cutting tooth; 122, Second cutting groove; 210, Ring cutter; 211, Third cutting tooth. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention are within the scope of protection of the present invention.

[0042] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an" or "a" and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "connected" or "linked" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0043] In the single-crystal pulling industry, the seed crystal, as the seed for single-crystal growth, is the foundation for forming crystalline material. It ensures that the pulled crystal rod has the same crystal orientation as the seed crystal, and the quality of the seed crystal affects the quality of crystal pulling. Seed crystals have various structures and are processed from single-crystal silicon rods according to the crystal orientation requirements of the pulled crystal rod. Currently, most of them are round seed crystals. The processing of round seed crystals is relatively complex. It requires cutting the single-crystal silicon rod into multiple square seed crystal preforms, then cutting the preforms into rounded sides, and repeating this process multiple times to form the seed crystal. This processing method results in a lot of waste of scrap material from the seed crystal preforms, large precision errors, and low production efficiency. At the same time, the round seed crystal structure can be deformed during the multiple cutting processes, leading to damage or unusable round seed crystals, increasing production costs and wasting production time. To solve the above problems, this invention provides a method for processing round seed crystals.

[0044] The following describes, with reference to the accompanying drawings, a method for processing round seed crystals according to an embodiment of the present invention.

[0045] According to an embodiment of the present invention, a method for processing round seed crystals is provided, wherein, as shown in the figure... Figure 1 As shown, the machine tool is used to fix the first end of the seed crystal matrix 40; the cutting assembly is set on the machine tool and is used to sequentially cut the seed crystal body 50, the load-bearing inclined body 60, and the load-bearing head 70 from the first end to the second end of the seed crystal matrix 40 to form a round seed crystal, with the second end facing away from the first end; wherein, the seed crystal matrix 40 is a cylindrical frustum, the load-bearing head 70 and the seed crystal body 50 are cylindrical frustums, the diameter of the load-bearing head 70 is larger than the diameter of the seed crystal body 50, and the load-bearing inclined body 60 is a cone, with the diameter increasing from the end closer to the seed crystal body 50 to the end closer to the load-bearing head 70. Specifically, the seed crystal matrix 40 is generally formed as a cylinder, and the seed crystal matrix 40 includes a first end and a second end, with the second end facing away from the first end. Figure 7 As shown, the method for processing round seed crystals in this application includes:

[0046] S100, Compile the cutting program for the machine tool;

[0047] S200, Fix the first end of the seed crystal matrix on the machine tool;

[0048] S300: Using a cutting component, the seed crystal body, the load-bearing inclined body, and the load-bearing head are cut sequentially from the first end to the second end of the seed crystal mother body, with the second end facing away from the first end.

[0049] Specifically, when processing the round seed crystal, the first end of the seed crystal matrix 40 can be fixed on a machine tool, and a cutting assembly can be used to cut the seed crystal body 50, the load-bearing inclined surface 60, and the load-bearing head 70 from the first end of the seed crystal matrix 40 to the second end in one operation to form a round seed crystal. Thus, the round seed crystal can be cut from the seed crystal matrix 40 in only one operation, effectively saving time and improving production efficiency. At the same time, the cutting assembly forms the seed crystal matrix 40 in one piece, avoiding damage or material waste caused by multiple processing of the round seed crystal, saving costs while improving the quality of the round seed crystal.

[0050] like Figure 2 As shown, in one embodiment of the present invention, the cutting assembly includes: a first cylindrical cutter 110, a second cylindrical cutter 120, and a file. The first cylindrical cutter 110 is connected to a machine tool at one end, and has a serrated first cutting tooth 111 at the other end. The inner diameter of the first cylindrical cutter 110 matches the diameter of the seed crystal body 50, and is used to cut the seed crystal body 50 through the first cutting tooth 111. The second cylindrical cutter 120 is connected to the machine tool at one end, and has a serrated second cutting tooth 121 at the other end. The inner diameter of the second cylindrical cutter 120 matches the diameter of the load-bearing head 70, and is used to cut the load-bearing head 70 through the second cutting tooth 121. The file is connected to the machine tool and is used to file out the load-bearing inclined surface 60.

[0051] Specifically, such as Figure 3 As shown, Figure 3This is a schematic diagram of the first cylindrical cutter 110 cutting the seed crystal body 50 in this application. In one embodiment of the present invention, the cutting assembly includes a first cylindrical cutter 110 and a second cylindrical cutter 120, both of which are hollow cylindrical cutters. When processing the seed crystal body 40, the first cylindrical cutter 110, whose inner diameter matches the diameter of the seed crystal body 50, can be used to start from the first end of the seed crystal body 40 and rotate inward to cut out the seed crystal body 50. Then, the first cylindrical cutter 110 is withdrawn, and the second cylindrical cutter 120 is replaced. The second cylindrical cutter 120, whose inner diameter matches the weighing head, enters from the first end of the seed crystal body 40 and continues to rotate inward to cut out the load-bearing head 70. Finally, a file is used to file the connection between the seed crystal body 50 and the load-bearing head 70 to process the load-bearing inclined surface 60. Therefore, the cutting component can cut the seed crystal body 50, the load-bearing inclined body 60 and the load-bearing head 70 into a round seed crystal in only one process, which effectively reduces the working time and improves the work efficiency.

[0052] In one embodiment of the present invention, the outer diameter of the first cylindrical cutter 110 is the same as the outer diameter of the second cylindrical cutter 120. Specifically, since the first cylindrical cutter 110 is preferred to be used to rotate and cut inward from the first end of the seed crystal body 40 to cut out the seed crystal body 50, and since the diameter of the seed crystal body 50 is smaller than the diameter of the support head 70, the outer diameter of the first cylindrical cutter 110 needs to be the same as the outer diameter of the second cylindrical cutter 120. Thus, after the first cylindrical cutter 110 is withdrawn, the second cylindrical cutter 120 can directly enter through the reserved cutting hole to continue cutting the support head 70 without having to start over, further shortening the working time and improving production efficiency.

[0053] In one embodiment of the present invention, a cutting assembly is used to sequentially cut a seed crystal body, a load-bearing inclined surface, and a load-bearing head from a first end to a second end of the seed crystal matrix, including:

[0054] S310. Install a first cylindrical cutter on the machine tool. The machine tool uses the first cylindrical cutter to cut the seed crystal mother body according to the cutting program to cut out the seed crystal body. The distance that the first cylindrical cutter moves is the length of the seed crystal body.

[0055] S320. Replace the first cylindrical cutter with the second cylindrical cutter. The machine tool uses the second cylindrical cutter to cut the seed crystal matrix according to the cutting program to cut out the load-bearing head.

[0056] S330. The machine tool uses a file to file the connection between the load-bearing head and the seed crystal body to form a load-bearing inclined surface.

[0057] like Figure 2As shown, in one embodiment of the present invention, the outer wall of the first cylindrical cutter 110 is provided with at least one spiral first cutting groove 112 in the circumferential direction, and the outer wall of the second cylindrical cutter 120 is provided with at least one spiral second cutting groove 122 in the circumferential direction. Specifically, the outer wall of the first cylindrical cutter 110 is provided with multiple inwardly recessed first cutting grooves 112 extending from the first cutting teeth 111 to the tail, and the outer wall of the second cylindrical cutter 120 is provided with multiple inwardly recessed second cutting grooves 122 extending from the second cutting teeth 121 to the tail. During cutting, the generated single-crystal powder can flow outward along the cutting grooves. Therefore, the single-crystal powder will not remain in the cut, increasing the smoothness of cutting and further shortening the processing time.

[0058] In one embodiment of the present invention, replacing the first cylindrical cutter with a second cylindrical cutter includes:

[0059] S321. After the seed crystal body is cut, the machine tool controls the first cylindrical cutter to retract from the seed crystal body to replace the first cylindrical cutter with the second cylindrical cutter.

[0060] Specifically, in step 330, after the load-bearing head 70 is cut, the round seed crystal intermediate body including the seed crystal body 50 and the load-bearing head 70 is taken out from the seed crystal mother body 40, and then the connection between the load-bearing head 70 and the seed crystal body 50 is filed to form the load-bearing inclined body 60.

[0061] In one embodiment of the present invention, a cutting assembly is used to sequentially cut a seed crystal body, a load-bearing inclined surface, and a load-bearing head from a first end to a second end of the seed crystal matrix, including:

[0062] S340. Install a ring cutter on the machine tool. The machine tool uses the ring cutter to ring cut the first end of the seed crystal mother body according to the cutting program to cut out the seed crystal body.

[0063] S350. After the seed crystal body is cut, the machine tool controls the ring cutter to gradually expand the cut outward to cut out the load-bearing inclined body.

[0064] After the load-bearing inclined plane is cut, the machine tool controls the circumferential cutter to perform circumferential cutting on the second end of the seed crystal to cut out the load-bearing head.

[0065] Specifically, such as Figure 4 As shown, in one embodiment of the present invention, the cutting assembly includes a circumferential cutter 210. One end of the circumferential cutter 210 has a third cutting tooth 211, and the other end is connected to a machine tool for rotating with the machine tool to circumferentially cut the seed crystal matrix 40. Specifically, as... Figure 5As shown, the length of the circumferential cutter 210 is slightly longer than the length of the round seed crystal. During cutting, the circumferential cutter first cuts from the first end to the second end of the seed crystal body 40, first cutting out the seed crystal body 50. Then, the circumferential cutter 210 gradually cuts outward to cut out the load-bearing inclined body 60. Finally, the circumferential cutter is performed again to cut out the load-bearing head 70. Thus, the cutting assembly can cut out the seed crystal body 50, the load-bearing inclined body 60, and the load-bearing head 70 to form a round seed crystal in only one process, effectively reducing working time and improving work efficiency.

[0066] like Figure 6 As shown, in one embodiment of the present invention, the inner diameter of the annular cutting surface formed by the circumferential cutter 210 during circumferential cutting is the same as the diameter of the seed crystal body 50, while the outer diameter is larger than the diameter of the support head 70. Specifically, when cutting the seed crystal body 50, the inner diameter of the annular cutting surface of the circumferential cutter 210 is the same as that of the seed crystal body 50, thereby cutting out the seed crystal body 50. The outer diameter of the cutting surface is larger than the diameter of the support head 70, so that after cutting the seed crystal body 50, the circumferential cutter 210 can use the reserved space in the outer diameter to cut out the support inclined body and the support head 70. Thus, the circumferential cutter 210 can continue to cut inward without re-cutting the seed crystal body 40, thereby effectively reducing working time and improving production efficiency. The round seed crystal processing method of this invention can continuously cut the seed crystal matrix, resulting in a short production cycle and effectively improving production efficiency. In addition, the seed crystal body, the load-bearing inclined body, and the load-bearing head are sequentially cut from the first end to the second end of the seed crystal matrix to form a round seed crystal, which is formed in one step. This avoids material waste and damage caused by multiple processing of the round seed crystal, and saves time and costs.

[0067] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for processing a round seed crystal, the round seed crystal comprising a seed crystal body, a load-bearing inclined surface, and a load-bearing head connected in sequence, wherein the seed crystal body and the load-bearing head are cylindrical, the diameter of the load-bearing head is larger than the diameter of the seed crystal body, the load-bearing inclined surface is conical, and the diameter of the load-bearing inclined surface increases from the end closer to the seed crystal body to the end closer to the load-bearing head; Its features are, The processing method includes: S100, Compile the cutting program for the machine tool; S200. Fix the first end of the cylindrical seed crystal matrix on the machine tool; S300: According to the cutting program, the cutting component is controlled to move from the end face of the first end of the seed crystal matrix to the second end of the seed crystal matrix to cut out the round seed crystal. The first and second ends of the seed crystal matrix are the two ends of the seed crystal matrix along the axial direction. The cutting assembly includes a ring cutter. One end of the ring cutter has a third cutting tooth, and the other end is connected to the machine tool for rotating with the machine tool to ring cut the seed crystal matrix. Step 300 specifically includes: S340. Install a ring cutter on the machine tool. The machine tool uses the ring cutter to perform a ring cut on the first end of the seed crystal mother body according to the cutting program to cut out the seed crystal body. The inner diameter of the annular cutting surface formed by the ring cutter during ring cutting is the same as the diameter of the seed crystal body, and the outer diameter is larger than the diameter of the load-bearing head. S350. After the seed crystal body is cut, the machine tool controls the circumferential cutter to gradually expand the cut outward to cut out the load-bearing inclined body. S360. After the load-bearing inclined body is cut, the machine tool controls the circumferential cutting blade to perform circumferential cutting on the second end of the seed crystal mother body to cut out the load-bearing head.

2. A method for processing a round seed crystal, the round seed crystal comprising a seed crystal body, a load-bearing inclined surface, and a load-bearing head connected in sequence, wherein the seed crystal body and the load-bearing head are cylindrical, the diameter of the load-bearing head is larger than the diameter of the seed crystal body, the load-bearing inclined surface is conical, and the diameter of the load-bearing inclined surface increases from the end closer to the seed crystal body to the end closer to the load-bearing head; Its features are, The processing method includes: S100, Compile the cutting program for the machine tool; S200, the first end of the cylindrical seed crystal matrix is ​​fixed on the machine tool; S300: According to the cutting program, the cutting component is controlled to move from the end face of the first end of the seed crystal matrix to the second end of the seed crystal matrix to cut out the round seed crystal. The first and second ends of the seed crystal matrix are the two ends along the axial direction of the seed crystal matrix. The cutting assembly includes a first cylindrical cutter, a second cylindrical cutter, and a file. One end of the first cylindrical cutter is used to connect to the machine tool, and the other end has a first cutting tooth. The inner diameter of the first cylindrical cutter matches the diameter of the seed crystal matrix. One end of the second cylindrical cutter is used to connect to the machine tool, and the other end has a second cutting tooth. The inner diameter of the second cylindrical cutter matches the diameter of the load-bearing head. The outer diameter of the first cylindrical cutter is the same as the outer diameter of the second cylindrical cutter. Step 300 specifically includes: S310. The first cylindrical cutter is installed on the machine tool. The machine tool moves the first cylindrical cutter from the end face of the first end of the seed crystal to the second end of the seed crystal according to the cutting program to cut out the seed crystal body. The distance that the first cylindrical cutter moves is the length of the seed crystal body. S320. Replace the first cylindrical cutter with the second cylindrical cutter. The machine tool moves the second cylindrical cutter from the end face of the first end of the seed crystal matrix to the second end of the seed crystal matrix according to the cutting program to cut out the load-bearing head. S330, The machine tool uses a file to file the connection between the load-bearing head and the seed crystal body to form the load-bearing inclined surface.

3. The method for processing round seed crystals according to claim 2, characterized in that, The outer wall of the first cylindrical cutter is provided with at least one spiral-shaped first cutting groove in the circumferential direction.

4. The method for processing round seed crystals according to claim 2, characterized in that, The second cylindrical cutter has at least one spiral second cutting groove on its outer circumferential surface.

5. The method for processing round seed crystals according to claim 2, characterized in that, Replacing the first cylindrical cutter with the second cylindrical cutter includes: S321. After the seed crystal body is cut, the machine tool controls the first cylindrical cutter to retract from the seed crystal body and replaces the first cylindrical cutter with the second cylindrical cutter.

6. The method for processing round seed crystals according to claim 2, characterized in that, In step 330, after the load-bearing head is cut, the round seed crystal intermediate body, including the seed crystal body and the load-bearing head, is taken out from the seed crystal mother body. Then, the connection between the load-bearing head and the seed crystal body is filed with the file to form the load-bearing inclined body.

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