A display panel and a method for manufacturing the same

Abstract

Embodiments of the present application disclose a display panel and a manufacturing method thereof. The display panel is defined with a display area and a bonding area. The manufacturing method includes the following steps: providing a substrate; attaching a protective layer on the substrate, the protective layer covering the display area and the bonding area and extending beyond the bonding area; cutting the protective layer along a cutting route so that the protective layer is divided into a first protective layer and a second protective layer; peeling off the first protective layer so that the connection terminals and the connection traces are exposed; forming a conductive film, the conductive film covering the side surface of the substrate layer and the connection terminals; peeling off the second protective layer to remove the conductive film located in the display area; and using laser to ablate the remaining conductive film to form a conductive connection line for connecting the first connection terminal and the second connection terminal.

Description

Technical Field

[0001] This application relates to the field of display technology, and particularly to a display panel and a method for manufacturing the same. Background Art

[0002] The double-sided manufacturing process is one of the processes for realizing seamless splicing display of products such as Mini LED and Micro LED. In the double-sided manufacturing process, the light-emitting layer is disposed on the front surface of the display panel, and the OLB (Outer Lead Bonding) area is placed on the back surface of the display panel. Then, by fabricating multiple metal traces on the front, side, and back surfaces of the display panel, the conduction between the front connection terminals and the back connection terminals is achieved. The connection between the front connection terminals and the light-emitting layer is realized through the bottom circuit, and the connection between the back connection terminals and the driving signal source is also realized through the bottom circuit. Finally, the back driving signal drives the front light-emitting layer to emit light through the metal traces, and the side without the metal traces can be seamlessly spliced with other display panels to form a large-size display panel.

[0003] Generally, the manufacturing process of the display panel includes: first, attaching a layer of protective film to the front and back surfaces of the substrate respectively, then fabricating the metal traces, and finally peeling off the protective film. When attaching the protective film, due to the limitations of the edge accuracy of the protective film and the accuracy of the film laminating machine, it is easy to cause poor alignment between the protective film and the substrate and poor adhesion of the protective film, which in turn leads to serious detachment of the metal traces when the protective film is peeled off. Both situations will cause the final metal traces to be unable to conduct and the light-emitting layer to be unable to emit light normally. Among them, the edge accuracy of the protective film refers to when the protective film is cut by the die-cutting method, due to the imperfect accuracy of the die-cutting method for cutting the protective film, the edge accuracy of the protective film is greater than 50 μm. The accuracy of the film laminating machine refers to when the protective film is laminated to the front and back surfaces of the substrate, due to the alignment accuracy of the film laminating machine itself, the protective film cannot be accurately aligned with the substrate during lamination, and the accuracy of the film laminating machine is greater than 30 μm. Summary of the Invention

[0004] To achieve the above object, the present invention provides a display panel and a method for manufacturing the same, so as to solve the technical problem that the light-emitting layer cannot emit light normally due to poor alignment between the protective film and the substrate and poor adhesion of the protective film.

[0005] To achieve the above object, the present invention provides a method for manufacturing a display panel, the display panel being defined with a display area and a bonding area, and the manufacturing method including the following steps:

[0006] Provide a substrate, which includes a substrate layer, a light-emitting layer located in the display area, connection terminals located in the bonding area, and connection traces for connecting the light-emitting layer and the connection terminals; wherein, the substrate includes a first surface and a second surface arranged opposite to each other, and a third surface connecting between the first surface and the second surface; the connection terminals include a first connection terminal and a second connection terminal, the connection traces include a first connection trace and a second connection trace, the first connection terminal and the first connection trace are formed on the first surface, and the second connection terminal and the second connection trace are formed on the second surface;

[0007] Attach a protective layer on the substrate, the protective layer covers the display area and the bonding area, and extends beyond the bonding area;

[0008] Cut the protective layer along a cutting route so that the protective layer is divided into a first protective layer and a second protective layer;

[0009] Peel off the first protective layer so that the connection terminals and the connection traces are exposed;

[0010] Form a conductive film, the conductive film covers the third surface and the connection terminals;

[0011] Peel off the second protective layer to remove the conductive film located in the display area; and

[0012] Use a laser to ablate the remaining conductive film to form a conductive connection line for connecting the first connection terminal and the second connection terminal.

[0013] Further, in the step of providing a substrate, define the cutting route between the light-emitting layer and the connection trace, and form a positioning mark perpendicular to the cutting route on the third surface;

[0014] In the step of cutting the protective layer along a cutting route, cut the protective layer according to the position of the positioning mark.

[0015] Further, between the step of peeling off the first protective layer and the step of forming a conductive film, it further includes: performing an edge grinding treatment on the substrate so that the connection between the third surface and the first surface and / or the second surface is an arc structure.

[0016] Further, the length by which the protective layer extends beyond the edge of the substrate is -200μm - 1cm; the thickness of the protective layer is greater than 10μm.

[0017] Further, in the step of cutting the protective layer along a cutting route, use a water jet film cutting device to cut the protective layer.

[0018] Further, between the step of peeling the first protective layer and the step of forming a conductive film, the method further includes: forming a barrier layer that covers at least a part of the connection trace.

[0019] Further, in the step of forming a barrier layer, a positive projection of the barrier layer on the substrate layer covers a positive projection of the connection trace on the substrate layer.

[0020] To achieve the above object, the present invention further provides a display panel, which is defined with a display area and a bonding area. The display panel includes: a substrate, which includes a substrate layer, a light-emitting layer located in the display area, connection terminals located in the bonding area, and connection traces for connecting the light-emitting layer and the connection terminals; wherein, the substrate includes a first surface and a second surface that are oppositely arranged, and a third surface connecting between the first surface and the second surface; the connection terminals include a first connection terminal and a second connection terminal, the connection traces include a first connection trace and a second connection trace, the first connection terminal and the first connection trace are formed on the first surface, and the second connection terminal and the second connection trace are formed on the second surface; a protective layer, which is disposed on the substrate, the protective layer covers the display area and the bonding area, and extends beyond the bonding area; and a conductive connection line, which is disposed on the third surface of the substrate and connects between the first connection terminal and the second connection terminal.

[0021] Further, the display panel further includes: a barrier layer that covers at least a part of the connection trace.

[0022] Further, the material of the protective layer is polyimide; the thickness of the protective layer is greater than 10 μm.

[0023] Any one of the above technical solutions has the following advantages or beneficial effects: providing a display panel and a manufacturing method thereof, the display panel includes a display area and a bonding area, and the protective layer extends beyond the bonding area. On the one hand, it can improve the alignment accuracy between the protective layer and the substrate layer, and avoid poor contact between the conductive connection line and the connection terminal; on the other hand, it is not necessary to peel off the part of the protective layer in contact with the substrate, so that the protective layer can be peeled off better, and the problem of line (such as connection trace, connection terminal) detachment can be avoided, thereby improving the yield of the display panel.

[0024] Further, a water jet cutting film device is used to cut the protective layer, which can correct the attachment range of the protective layer and improve the problem of poor attachment accuracy of the protective film in the conventional solution, and avoid the problem that the protective film covers a large amount of the connection terminals, resulting in poor connection between the connection terminals and the side traces, so as to achieve precise alignment between the protective layer and the connection terminals on the substrate layer. Description of the Drawings

[0025] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0026] Figure 1 It is a flowchart of the method for preparing a display panel provided in Embodiment 1 of the present application.

[0027] Figure 2 It is a schematic structural diagram of the protective layer exceeding the substrate from one perspective provided in Embodiment 1 of the present application.

[0028] Figure 3 It is a schematic structural diagram of the protective layer exceeding the substrate from another perspective provided in Embodiment 1 of the present application.

[0029] Figure 4 It is a schematic structural diagram of the protective layer from one perspective provided in Embodiment 1 of the present application.

[0030] Figure 5 It is a schematic structural diagram of the protective layer from another perspective provided in Embodiment 1 of the present application.

[0031] Figure 6 It is a schematic structural diagram of the formation of the conductive film from one perspective provided in Embodiment 1 of the present application.

[0032] Figure 7 It is a schematic structural diagram of the formation of the conductive film from another perspective provided in Embodiment 1 of the present application.

[0033] Figure 8 It is a schematic structural diagram of the conductive film after being peeled off from one perspective provided in Embodiment 1 of the present application.

[0034] Figure 9 It is a schematic structural diagram of the conductive film after being peeled off from another perspective provided in Embodiment 1 of the present application.

[0035] Figure 10 It is a schematic structural diagram of the formation of the conductive connection line provided in Embodiment 1 of the present application.

[0036] Figure 11 It is a flowchart of the method for preparing a display panel provided in Embodiment 2 of the present application.

[0037] Figure 12 It is a schematic structural diagram of the formation of the conductive connection line provided in Embodiment 2 of the present application.

[0038] Description of the Reference Numerals:

[0039] 100, Display area; 200, Bonding area;

[0040] 1, Substrate; 2, Protective layer;

[0041] 3, Conductive connection line; 4, Barrier layer;

[0042] 11, First surface; 12, Second surface;

[0043] 13, Third surface; 101, Substrate layer;

[0044] 102, Light-emitting layer; 103, Connection terminal;

[0045] 104, Connection trace; 103a, First connection terminal;

[0046] 103b, Second connection terminal; 104a, First connection trace;

[0047] 104b, Second connection trace; K1, Cutting route;

[0048] K2, Positioning mark; 21, First protective layer;

[0049] 33, Second protective layer; 31, Conductive film. Detailed implementation mode

[0050] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0051] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, and can be the connection inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0052] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but are in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0053] Embodiment 1

[0054] As Figure 1 shown, this embodiment provides a method for manufacturing a display panel. The display panel is defined with a display area 100 and a bonding area 200. The manufacturing method includes the following steps S11)-S18):

[0055] S11) Provide a substrate 1. As Figure 2 shown, the substrate 1 includes a substrate layer 101, a light-emitting layer 102 located in the display area 100, connection terminals 103 located in the bonding area 200, and connection traces 104 for connecting the light-emitting layer 102 and the connection terminals 103. Among them, the substrate includes a first surface 11 and a second surface 12 which are oppositely arranged, and a third surface 13 connecting between the first surface 11 and the second surface 12. The connection terminals 103 include a first connection terminal 103a and a second connection terminal 103b. The connection traces 104 include a first connection trace 104a and a second connection trace 104b. The first connection terminal 103a and the first connection trace 104a are formed on the first surface 11, and the second connection terminal 103b and the second connection trace 104b are formed on the second surface 12.

[0056] As Figure 2 - Figure 3 shown, a cutting route K1 is defined between the light-emitting layer 102 and the connection traces 104, and a positioning mark K2 perpendicular to the cutting route K1 is formed on the third surface 13. Among them, the first surface 11 or the second surface 12 where the cutting route K1 is located is perpendicular to the third surface 13 where the positioning mark K2 is located. With such a setting, the alignment accuracy between the substrate 1 and other film layers (such as the protective layer 2) can be improved.

[0057] S12) Attach a protective layer 2 on the substrate 1. The protective layer 2 covers the display area 100 and the bonding area 200 and extends beyond the bonding area 200.

[0058] Specifically, the protective layer 2 is attached to the light-emitting layer 102, the connection terminals 103, and the connection traces 104, and extends beyond the bonding area 200. Wherein, the length by which the protective layer 2 extends beyond the edge of the substrate 1 is -200 μm to 1 cm. Therefore, in this embodiment, the protective layer 2 extending beyond the bonding area 200 can, on the one hand, improve the alignment accuracy between the protective layer 2 and the underlying layer 101, and avoid poor contact between the subsequently formed conductive connection line 3 and the connection terminal 103; on the other hand, it is not necessary to peel off the part of the protective layer 2 in contact with the substrate 1, which can better peel off the protective layer 2 and avoid the detachment of lines (such as connection traces 104, connection terminals 103), thereby improving the yield of the display panel.

[0059] The material used for the protective layer 2 is polyimide; the thickness of the protective layer 2 is greater than 10 μm. Such a setting can improve the cutting yield of the protective layer 2 during cutting.

[0060] S13) Perform an edge grinding process on the substrate 1 so that the connection between the third surface 13 and the first surface 11 or the second surface 12 is an arc structure. That is to say, there can be an arc structure between the connection of the third surface 13 and the first surface 11, and / or there can also be an arc structure between the connection of the third surface 13 and the second surface 12. In this way, the contact area between the subsequently formed conductive connection line 3 and the outer surface of the arc structure can be increased, and the risk of wire breakage during wire routing pulling caused by a right-angle structure or other special-shaped structures can be avoided, thereby reducing the risk of conductive damage.

[0061] S14) Cut the protective layer 2 along a cutting route K1 so that the protective layer 2 is divided into a first protective layer 21 and a second protective layer 22.

[0062] As Figure 4 - Figure 5 shown, according to the position of the positioning mark K2, use a water jet film-cutting device to cut the protective layer 2 so that the protective layer 2 is divided into a first protective layer 21 and a second protective layer 22. Among them, using a water jet film-cutting device to cut the protective layer 2 can correct the attachment range of the protective layer 2 and improve the problem of poor attachment accuracy of the protective film in the conventional solution, and avoid the problem that the protective film covers the connection terminal 103 in large quantities, resulting in poor connection between the connection terminal 103 and the side trace, thereby achieving precise alignment between the protective layer 2 and the connection terminal 103 on the underlying layer 101.

[0063] It should be noted that in addition to using a water jet film-cutting device to cut the protective layer 2, other methods can also be used to cut the protective layer 2, which is not specifically limited here.

[0064] S15) Peel off the first protective layer 21 so that the connection terminals 103 and the connection traces 104 are exposed, refer to Figure 5 .

[0065] S16) Form a conductive film 31 that covers the third surface 13 of the substrate 1 and the connection terminals 103.

[0066] As Figure 6 - Figure 7 shown, the conductive film 31 is formed on the first protective layer 21, the connection terminals 103, and the connection traces 104 by PVD (Physical Vapor Deposition), and the conductive film 31 completely covers the third surface 13 to connect the first connection terminal 103a and the second connection terminal 103b.

[0067] S17) Peel off the second protective layer 22 to remove the conductive film 31 located in the display area 100.

[0068] As Figure 8 - Figure 9 shown, the second protective layer 22 is peeled off along the cutting route K1 perpendicular to the positioning mark K2 to remove the conductive film 31 in the display area 100.

[0069] S18) Use a laser to ablate the remaining conductive film 31 to form a conductive connection line 3 for connecting the first connection terminal 103a and the second connection terminal 103b.

[0070] As Figure 10 shown, a plurality of equally spaced conductive connection lines 3 are provided on the side surface (i.e., the third surface 13) of the substrate 1, and each conductive connection line 3 is connected between the first connection terminal 103a and the second connection terminal 103b, enabling the light-emitting layer 102 to emit light normally and improving the yield of the display panel.

[0071] This embodiment also provides a display panel, which is defined with a display area 100 and a bonding area 200, refer to Figure 4 . Specifically, the display panel includes a substrate 1, a protective layer 2, and a conductive connection line 3, refer to Figure 8 and Figure 10 .

[0072] Combined with Figure 2As shown, the substrate 1 includes a first surface 11 and a second surface 12 that are oppositely arranged, and a third surface 13 connected between the first surface 11 and the second surface 12. The substrate 1 includes a light-emitting layer 102 located in the display area 100, connection terminals 103 located in the bonding area 200, and connection traces 104 for connecting the light-emitting layer 102 and the connection terminals 103; wherein, the connection terminals 103 include a first connection terminal 103a and a second connection terminal 103b, the connection traces 104 include a first connection trace 104a and a second connection trace 104b, the first connection terminal 103a and the first connection trace 104a are disposed on the first surface 11, and the second connection terminal 103b and the second connection trace 104b are disposed on the second surface 12.

[0073] Combined with Figure 8 and Figure 10 As shown, a conductive connection line 3 is disposed on the third surface 13 of the substrate 1 and is connected between the first connection terminal 103a and the second connection terminal 103b.

[0074] Embodiment 2

[0075] This embodiment provides a display panel and a manufacturing method thereof, which includes all the technical solutions of Embodiment 1, and is characterized in that it further includes a barrier layer 4.

[0076] As Figure 11 - Figure 12 shown, this embodiment provides a manufacturing method of a display panel. The display panel is defined with a display area 100 and a bonding area 200. The manufacturing method includes the following steps S21)-S29):

[0077] S21) Provide a substrate 1. The substrate 1 includes a substrate layer 101, a light-emitting layer 102 located in the display area 100, connection terminals 103 located in the bonding area 200, and connection traces 104 for connecting the light-emitting layer 102 and the connection terminals 103; wherein, the substrate includes a first surface 11 and a second surface 12 that are oppositely arranged, and a third surface 13 connected between the first surface 11 and the second surface 12; the connection terminals 103 include a first connection terminal 103a and a second connection terminal 103b, the connection traces 104 include a first connection trace 104a and a second connection trace 104b, the first connection terminal 103a and the first connection trace 104a are formed on the first surface 11, and the second connection terminal 103b and the second connection trace 104b are formed on the second surface 12.

[0078] S22) Attach a protective layer 2 onto the substrate 1, where the protective layer 2 covers the display area 100 and the bonding area 200, and extends beyond the bonding area 200.

[0079] S23) Perform an edge grinding process on the substrate 1 so that the connection between the third surface 13 and the first surface 11 or the second surface 12 is an arc structure.

[0080] S24) Cut the protective layer 2 along a cutting route K1 so that the protective layer 2 is divided into a first protective layer 21 and a second protective layer 22.

[0081] S25) Peel off the first protective layer 21 so that the connection terminals 103 and the connection traces 104 are exposed.

[0082] S26) Form a barrier layer 4 that covers at least part of the connection traces 104.

[0083] The orthographic projection of the barrier layer 4 on the underlayer 101 covers the orthographic projection of the connection traces 104 on the underlayer 101. Such a setting can provide comprehensive protection for the conductive connection lines 3, ensuring that the conductive connection lines 3 will not be damaged under laser irradiation at any position.

[0084] S27) Form a conductive film 31 that covers the third surface 13 of the substrate 1 and the connection terminals 103.

[0085] S28) Peel off the second protective layer 22 to remove the conductive film 31 located in the display area 100.

[0086] S29) Use laser to irradiate the remaining conductive film 31 to form conductive connection lines 3 for connecting the first connection terminal 103a and the second connection terminal 103b.

[0087] This embodiment also provides a display panel, which defines a display area 100 and a bonding area 200. Specifically, the display panel includes a substrate 1, a protective layer 2, conductive connection lines 3, and a barrier layer 4. Refer to Figure 12 。

[0088] Combined with Figure 12As shown, the substrate 1 includes a first surface 11 and a second surface 12 that are oppositely arranged, and a third surface 13 connected between the first surface 11 and the second surface 12. The substrate 1 includes a substrate layer 101, a light-emitting layer 102 located in the display area 100, connection terminals 103 located in the bonding area 200, and connection traces 104 for connecting the light-emitting layer 102 and the connection terminals 103; wherein, the connection terminals 103 include a first connection terminal 103a and a second connection terminal 103b, the connection traces 104 include a first connection trace 104a and a second connection trace 104b, the first connection terminal 103a and the first connection trace 104a are disposed on the first surface 11, and the second connection terminal 103b and the second connection trace 104b are disposed on the second surface 12.

[0089] Combined with Figure 8 and Figure 10 As shown, the conductive connection line 3 is disposed on the third surface 13 of the substrate 1 and is connected between the first connection terminal 103a and the second connection terminal 103b.

[0090] The barrier layer 4 covers at least a part of the connection traces 104. The material used for the barrier layer 4 can be photoresist, insulating material, etc., and no special limitation is made here. The orthographic projection of the barrier layer 4 on the substrate layer 101 coincides with the orthographic projection of the connection traces 104 on the substrate layer 101. The connection traces 104 actually include several traces, and each trace can have its own shape, or the formation of each trace can also be the same. The orthographic projection of the barrier layer 4 on the substrate layer 101 coincides with the orthographic projection of the connection traces 104 on the substrate layer 101, that is, the barrier layer 4 has the same shape as the connection traces 104, and the orthographic projection of the barrier layer 4 covers each connection trace 104, but does not cover the gap between two adjacent connection traces 104. Such a setting can protect the connection traces 104 from being damaged and can reduce the material used for the barrier layer 4, saving costs.

[0091] An embodiment of the present application provides a display panel and a manufacturing method thereof. The protective layer 2 extends beyond the bonding area 200. On the one hand, it can improve the alignment accuracy between the protective layer 2 and the substrate layer 101 and avoid poor contact between the conductive connection line 3 and the connection terminals 103; on the other hand, there is no need to peel off the part where the protective layer 2 is in contact with the substrate 1, so that the protective layer 2 can be peeled off better, and the disconnection of lines (such as connection traces 104, connection terminals 103) can be avoided, improving the yield of the display panel.

[0092] Further, by using a water jet film cutting device to cut the protective layer 2, the attachment range of the protective layer 2 can be corrected, and the problem of poor attachment accuracy of the protective film in the conventional solution can be improved. The problem that the protective film largely covers the connection terminal 103, resulting in poor connection between the connection terminal 103 and the side traces, can be avoided, so as to achieve precise alignment between the protective layer 2 and the connection terminal 103 on the substrate layer 101.

[0093] The above has introduced in detail a display panel and a manufacturing method thereof provided by the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A method for manufacturing a display panel, characterized in that, the display panel is defined with a display area and a bonding area, and the manufacturing method includes the following steps: Provide a substrate, the substrate includes a substrate layer, a light-emitting layer located in the display area, connection terminals located in the bonding area, and connection traces for connecting the light-emitting layer and the connection terminals; wherein, the substrate includes a first surface and a second surface disposed opposite to each other, and a third surface connected between the first surface and the second surface; the connection terminals include a first connection terminal and a second connection terminal, the connection traces include a first connection trace and a second connection trace, the first connection terminal and the first connection trace are formed on the first surface, and the second connection terminal and the second connection trace are formed on the second surface; Attach a protective layer on the substrate, the protective layer covers the display area and the bonding area, and extends beyond the bonding area; the length of the protective layer extending beyond the edge of the substrate is -200 μm - 1 cm; the thickness of the protective layer is greater than 10 μm; Cut the protective layer along a cutting route, so that the protective layer is divided into a first protective layer and a second protective layer; Peel off the first protective layer, so that the connection terminals and the connection traces are exposed; Form a conductive film, the conductive film covers the third surface and the connection terminals; Peel off the second protective layer to remove the conductive film located in the display area; and Use laser to laser the remaining conductive film to form a conductive connection line for connecting the first connection terminal and the second connection terminal; Wherein, in the step of providing a substrate, a cutting route is defined between the light-emitting layer and the connection trace, and a positioning mark perpendicular to the cutting route is formed on the third surface; In the step of cutting the protective layer along a cutting route, the protective layer is cut according to the position where the positioning mark is located.

2. The method for manufacturing a display panel according to claim 1, characterized in that, Between the step of peeling off the first protective layer and the step of forming a conductive film, it further includes: Perform an edge grinding process on the substrate, so that the connection between the third surface and the first surface and / or the second surface is an arc structure.

3. The method for manufacturing a display panel according to claim 1, characterized in that, In the step of cutting the protective layer along a cutting route, a water jet film cutting device is used to cut the protective layer.

4. The method for manufacturing a display panel according to claim 1, characterized in that, Between the step of peeling off the first protective layer and the step of forming a conductive film, it further includes: Form a barrier layer, the barrier layer covers at least a part of the connection traces.

5. The method for manufacturing a display panel according to claim 4, characterized in that, In the step of forming a barrier layer, the orthographic projection of the barrier layer on the substrate layer covers the orthographic projection of the connection traces on the substrate layer.

6. A display panel manufactured by the method for manufacturing a display panel according to claim 1, It is characterized in that a display area and a bonding area are defined, and the display panel includes: a substrate, which includes a substrate layer, a light-emitting layer located in the display area, connection terminals located in the bonding area, and connection traces for connecting the light-emitting layer and the connection terminals; wherein, the substrate includes a first surface and a second surface arranged opposite to each other, and a third surface connected between the first surface and the second surface; the connection terminals include a first connection terminal and a second connection terminal, the connection traces include a first connection trace and a second connection trace, the first connection terminal and the first connection trace are formed on the first surface, and the second connection terminal and the second connection trace are formed on the second surface; a protective layer, which is disposed on the substrate, covers the display area and the bonding area, and extends beyond the bonding area; and a conductive connection line, which is disposed on the third surface of the substrate and is connected between the first connection terminal and the second connection terminal.

7. The display panel according to claim 6, It is characterized in that further includes: a barrier layer, which covers at least a part of the connection traces.

8. The display panel according to claim 6, It is characterized in that the material of the protective layer is polyimide; the thickness of the protective layer is greater than 10 μm.

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