Heat dissipation back clip

Abstract

A heat dissipation back clip for dissipating heat from a terminal device, the heat dissipation back clip comprising: a clip body, a heat dissipation component, and a fixing member; the clip body includes a position-adjustable slide rail, and the fixing member is used to fix the slide rail on the back plate of the terminal device; the heat dissipation component is installed on the slide rail and can move along the slide rail. By using the solution of the present invention, the position of the heat dissipation component on the back plate of the terminal device can be conveniently adjusted, the heat dissipation effect can be improved, and thus the performance of the terminal device can be better guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation processing, and particularly to a heat dissipation back clip. Background Art

[0002] With the development of various hardware and software technologies, terminal devices such as mobile phones have seen many improvements in performance. Along with high performance comes the problem of heat dissipation. The higher the load, the more serious the heat generation of the terminal device. Especially in hot summers, during high-load usage, the temperature of the device shell can reach up to about 50 degrees Celsius, which will seriously affect the use of the device. For example, for a mobile phone, the increase in the phone's temperature will lead to a decrease in the charging speed, frequency limitation of the phone's CPU (central processing unit) and GPU (graphics processing unit), degradation of the phone's brightness, and even problems such as application crashes and forced shutdowns. Therefore, in the prior art, a heat dissipation back clip is used to dissipate heat from the mobile phone.

[0003] Currently, thermoelectric coolers are mostly used in the market to dissipate heat from terminal devices such as mobile phones. In order to achieve better heat dissipation effects, the thermoelectric cooler needs to be well attached to the terminal device during use. In the prior art, a common fixing method is a back clip made of spring silicone grippers. The spring silicone grippers are used to fix the position of the back clip, so that the heat dissipation back clip is fixed to the mobile phone. However, since the position where the mobile phone generates the most heat is often the CPU part, due to the inconsistent designs of the rear cases of different mobile phone manufacturers, the conventional silicone grippers will be blocked by the camera module, resulting in the cooling plate of the heat dissipation back clip not being able to fully adhere to the rear case of the mobile phone, and the cooling effect being greatly reduced. Moreover, since the silicone grippers of the traditional heat dissipation back clip are buckled on the side of the mobile phone, they will also block some physical buttons of certain models, and it is also easy to cause accidental touches of the physical buttons by users, affecting the user's use of the mobile phone. Summary of the Invention

[0004] One aspect of the embodiments of the present invention provides a heat dissipation back clip to improve the heat dissipation effect and the applicability to devices of different models.

[0005] For this purpose, the embodiments of the present invention provide the following technical solutions:

[0006] The embodiments of the present invention provide a heat dissipation back clip for dissipating heat from a terminal device. The heat dissipation back clip includes: a clip body, a heat dissipation component, and a fixing member; the clip body includes a position-adjustable slide rail, and the fixing member is used to fix the slide rail on the back plate of the terminal device; the heat dissipation component is installed on the slide rail and can move along the slide rail.

[0007] ​

[0008] Optionally, the first slide rail and the second slide rail are vertically distributed; the first slide rail can move up and down or left and right on the back plate of the terminal device, the second slide rail can move up and down and / or left and right along the first slide rail, and the heat dissipation component is mounted on the second slide rail.

[0009] Optionally, the length of the first slide rail and / or the second slide rail is telescopic.

[0010] Optionally, the fixing member is detachably fixed to both ends of the first slide rail.

[0011] Optionally, the fixing member is screwed to both ends of the first slide rail respectively.

[0012] Optionally, the fixing member is snap-fitted or buckled to both ends of the first slide rail.

[0013] Optionally, the fixing member and the first slide rail are of an integral structure or a split structure.

[0014] Optionally, the clamping body further includes: a support shell for fixing the slide rail and capable of being attached to the back plate of the terminal device during use.

[0015] Optionally, a chute is provided on the support shell, and one end of the second slide rail is embedded in the chute.

[0016] Optionally, the terminal device includes any one of the following: a mobile phone, a computer, a vehicle-mounted terminal, and a smart wearable device.

[0017] [[ID=2⑨]]The heat dissipation back clip provided by the embodiment of the present invention fixes the heat dissipation component on the adjustable slide rail, and the heat dissipation component can move along the slide rail. The slide rail is fixed on the back plate of the terminal device through the fixing member, so that the position of the heat dissipation component on the back plate of the terminal device can be conveniently adjusted according to the different positions of the CPU of the terminal device, making it correspond to the position of the chip with the most serious heat generation, realizing point-to-point heat dissipation, improving the heat dissipation effect, and further better ensuring the performance of the terminal device. Moreover, the heat dissipation back clip provided by the embodiment of the present invention does not affect the user's use of the terminal device and effectively improves the user experience.

[0018] The heat dissipation back clip surface provided by the embodiment of the present invention has better adaptability and can conveniently cool different models of terminal devices and different heat generation areas. Brief Description of the Drawings

[0019] Figure 1 is a schematic structural diagram of the heat dissipation back clip according to an embodiment of the present invention;

[0020] Figure 2 is a schematic diagram of the position of the heat dissipation component on the heat dissipation back clip according to an embodiment of the present invention adjusted to the heat generation area A;

[0021] Figure 3 It is a schematic diagram of adjusting the position of the heat dissipation component on the heat dissipation back clip in the embodiment of the present invention to the heat generation area B;

[0022] Figure 4 It is a schematic diagram of adjusting the retractable slide rail in the embodiment of the present invention;

[0023] Figure 5 It is another structural schematic diagram of the heat dissipation back clip in the embodiment of the present invention. Detailed implementation manners

[0024] To make the above objects, features and beneficial effects of the present invention more obvious and understandable, the following will describe the specific embodiments of the present invention in detail with reference to the accompanying drawings.

[0025] In view of the problems existing in the structural design of the existing heat dissipation back clip, the embodiment of the present invention provides a heat dissipation back clip for dissipating heat from a terminal device, and the terminal device can be, for example, but not limited to: mobile phones, computers, vehicle-mounted terminals, smart wearable devices, etc. Through a slide rail with adjustable position, the position of the heat dissipation component on the back panel of the terminal device can be conveniently adjusted to correspond to the position of the chip with the most serious heat generation, improving the heat dissipation effect, and further better ensuring the performance of the terminal device.

[0026] Next, taking the heat dissipation back clip for a mobile phone as an example, the structure of the heat dissipation back clip provided in the embodiment of the present invention will be described in detail.

[0027] As Figure 1 shown, it is a structural schematic diagram of the heat dissipation back clip in the embodiment of the present invention.

[0028] The heat dissipation back clip in this embodiment is used to dissipate heat from the mobile phone 10, and the heat dissipation back clip includes: a clip body, a heat dissipation component 30, and a fixing member 40; the clip body includes a slide rail with adjustable position, and the fixing member 40 is used to fix the slide rail on the back panel of the terminal device 10; the heat dissipation component 30 is installed on the slide rail and can move along the slide rail.

[0029] Furthermore, a locking mechanism can be further provided on the heat dissipation component 30 to lock it with the slide rail after the position of the heat dissipation component 30 is adjusted, so as to avoid the position of the heat dissipation component 30 changing during the use of the mobile phone and affecting the heat dissipation effect of the mobile phone.

[0030] The heat dissipation component 30 can adopt a semiconductor radiator, also known as a thermoelectric cooler. The semiconductor radiator utilizes the Peltier effect of semiconductor materials. When direct current passes through an electric couple formed by two different semiconductor materials connected in series, heat can be absorbed and released at both ends of the electric couple respectively.

[0031] In practical applications, the heat dissipation component can adopt existing products. To facilitate its installation on the slide rail, a housing adapted to the product structure of the corresponding heat dissipation component can be designed, and an installation structure, such as a sliding buckle, can be provided on the housing to conveniently and slidably install the heat dissipation component on the slide rail.

[0032] When using a thermoelectric cooler as the heat dissipation component, direct current needs to be provided for it. For this purpose, a corresponding power interface, such as a USB interface, can be provided on the heat dissipation component. When in use, a USB data cable is inserted into the power interface to externally connect a direct current power supply; of course, a heat dissipation component with a built-in charging power supply can also be adopted, and the embodiments of the present invention do not make any limitations in this regard.

[0033] It should be noted that the heat dissipation component in the embodiments of the present invention is not limited to the above-mentioned thermoelectric cooler, and any component with a corresponding heat dissipation function can be used. Moreover, no limitations are made on the specific structure and shape of the heat dissipation component.

[0034] In order to make the adjustment of the heat dissipation component 30 more convenient and flexible, in a non-limiting embodiment, the slide rail can be designed into two, as Figure 1 shown, the slide rail includes: a first slide rail 21 and a second slide rail 22. The first slide rail 21 and the second slide rail 22 are cross-distributed, for example, they are perpendicular to each other. Of course, they can also be non-vertically crossed, and the embodiments of the present invention do not make any limitations in this regard.

[0035] Taking Figure 1 the vertical crossing shown as an example, the first slide rail 21 can move up and down or left and right on the back panel of the terminal device 10, and the second slide rail 22 can move up and down and / or left and right along the first slide rail 21. Correspondingly, in this embodiment, the heat dissipation component 30 is installed on the second slide rail 22.

[0036] For different device models, the positions of the mainly heating chips may be different. Taking the CPU as an example, for instance, in some models, the CPU is located at Figure 1 the position of the heating area A in Figure 1 while in some other models, the CPU is located at

[0037] Using the heat dissipation back clip provided by the present invention, the position of the heat dissipation component 30 can be conveniently adjusted. Figure 2 shows a schematic diagram of adjusting the heat dissipation component 30 to Figure 1 the position of the heating area A in Figure 3 and Figure 1 shows a schematic diagram of adjusting the heat dissipation component 30 to

[0038] ​In order to further improve the adaptability of the heat dissipation back clip according to the embodiments of the present invention to different device sizes and structures, in another non-restrictive embodiment, the lengths of the first slide rail 21 and / or the second slide rail 22 can also be designed as telescopic structures. Accordingly, through this telescopic structure, the length of the first slide rail 21 can be adapted to the widths of different mobile phones, and the length of the second slide rail 22 can be adapted to the structures of different mobile phones. For example Figure 2 in the shown example, if the length of the second slide rail 22 is fixed, when adjusting the heat dissipation component 30 to Figure 1 the position of the heat generation area A, the second slide rail 22 will adhere to the camera 50. For a camera structure that protrudes significantly from the back shell of the mobile phone, it may affect the movement of the second slide rail 22. If the length of the second slide rail 22 is adjustable, when it is necessary to adjust the heat dissipation component 30 to Figure 1 the position of the heat generation area A as described above, the length of the second slide rail 22 close to the camera 50 can be shortened first to avoid the influence of the camera 50 when the heat dissipation component 30 moves, as Figure 4 shown.

[0039] In the above embodiments, the fixing member 40 is detachably fixed at both ends of the first slide rail 21, so as to fix the slide rail after adjusting the positions of the slide rail and the heat dissipation component 30, and avoid deviation during use, which may affect the heat dissipation effect. It should be noted that the connection manner between the fixing member 40 and both ends of the first slide rail 21 is not limited. For example, it can be connected by screwing, clamping, or buckling, etc.

[0040] It should be noted that depending on the connection manner and material between the fixing member 40 and both ends of the first slide rail 21, the fixing member 40 and the first slide rail 21 can adopt an integral structure or a split structure, and the embodiments of the present invention do not limit this.

[0041] As Figure 5 shown, it is another schematic structural diagram of the heat dissipation back clip according to the embodiments of the present invention.

[0042] Different from the embodiment shown in Figure 1 in this embodiment, the clip body further includes: a support shell 60, which is used to fix the slide rail and can be attached to the back plate of the terminal device 10 during use.

[0043] It should be noted that the materials of the slide rail and the support shell 60 can be the same or different, and the embodiments of the present invention do not limit this. The support shell 60 can be a structure similar to a mobile phone case and can be buckled on the back plate of the mobile phone during use.

[0044] Further, in a non-restrictive embodiment, a chute 70 can also be provided on the support shell 60, and one end of the second slide rail 22 is embedded in the chute 70 to play a role in fixing the second slide rail 22.

[0045] Further, the sliding grooves can be designed to be symmetrically distributed, such that both ends of the second slide rail 22 are respectively embedded in the symmetrically distributed sliding grooves.

[0046] For the second slide rail 22 with adjustable length, when its length is contracted, one end or both ends of the second slide rail 22 can be retracted from the sliding grooves, without affecting the adjustment of its telescopic movement.

[0047] The above description has been given by taking the heat dissipation back clip for mobile phones as an example for the solution of the present invention. For the heat dissipation back clips of other terminal devices, the above heat dissipation back clip can be adaptively adjusted according to the size and shape of the back plates of the corresponding terminal devices, and thus can be used for other terminal devices.

[0048] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A heat dissipation back clip for dissipating heat from a terminal device, characterized in that: The heat dissipation back clip comprises: a clamp body, a heat dissipation component, and a fixing member; the clamp body comprises a position-adjustable slide rail, and the fixing member is used to fix the slide rail to the back panel of the terminal device; the heat dissipation component is mounted on the slide rail and can move along the slide rail; The slide rail comprises: a first slide rail and a second slide rail, the first slide rail and the second slide rail are cross-distributed, and the second slide rail can move along the first slide rail; The lengths of the first slide rail and the second slide rail are retractable so that the length of the first slide rail adapts to the width of the terminal device and the length of the second slide rail adapts to the structure of the terminal device to prevent the structure from affecting the movement of the second slide rail.

2. The heat dissipation back clip according to claim 1, characterized in that: The first slide rail and the second slide rail are distributed vertically; the first slide rail can move up and down or left and right on the back panel of the terminal device, the second slide rail can move up and down and / or left and right along the first slide rail, and the heat dissipation component is installed on the second slide rail.

3. The heat dissipation back clip according to claim 2, characterized in that: The fixing members are detachably fixed to both ends of the first slide rail.

4. The heat dissipation back clip according to claim 3, characterized in that: The fixing members are respectively screwed to both ends of the first slide rail.

5. The heat dissipation back clip according to claim 3, characterized in that: The fixing member is clamped or buckled on both ends of the first slide rail.

6. The heat dissipation back clip according to claim 5, characterized in that: The fixing member and the first slide rail are an integral structure or a separate structure.

7. The heat dissipation back clip according to any one of claims 1 to 6, characterized in that: The clamping body further comprises: a supporting shell for fixing the slide rail and can be attached to the back panel of the terminal device during use.

8. The heat dissipation back clip according to claim 7, characterized in that: A slide groove is provided on the supporting shell, and one end of the second slide rail is embedded in the slide groove.

9. The heat dissipation back clip according to claim 7, characterized in that: The terminal device includes any one of the following: mobile phone, computer, vehicle terminal, smart wearable device.

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