Multi-use transfer mold and method of manufacturing a display device

Abstract

A multi-use transfer mold and a method of manufacturing a display device are provided. The multi-use transfer mold includes a transfer substrate and a plurality of recesses provided in the transfer substrate, wherein each recess includes a transfer area for accommodating a transfer micro light emitting device and a preliminary area for accommodating a preliminary micro light emitting device, wherein the preliminary area is connected to the transfer area.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a multi-use transfer mold for transferring micro light emitting devices onto a driving substrate and a method of manufacturing a display device using the same. BACKGROUND

[0002] As display devices, liquid crystal displays, organic light emitting diode (OLED) displays, and the like have been widely used. Recently, a technology of manufacturing a high-resolution display device by using micro light emitting devices has been attracting attention.

[0003] For a display device using micro light emitting devices, various technologies are required, for example, a technology of transferring a micro-sized light emitting diode onto a desired pixel position of a display device, a repair method, a method of realizing a desired color, and the like. SUMMARY

[0004] A multi-use transfer mold is provided, which is used multiple times to transfer micro light emitting devices onto a driving substrate.

[0005] A method of manufacturing a display device is also provided, which includes transferring micro light emitting devices by using a multi-use transfer mold.

[0006] Additional aspects will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and / or can be learned by practice of the disclosed embodiments.

[0007] According to an aspect of an example embodiment, there is provided a multi-use transfer mold, comprising: a transfer substrate including a plurality of pixels and a first recess and a second recess provided in each of the plurality of pixels, wherein the first recess includes a first transfer area configured to accommodate a transfer micro light emitting device and a first preparation area connected to the first transfer area and configured to accommodate a preparation micro light emitting device, wherein the first preparation area includes a first outlet through which the preparation micro light emitting device enters the first transfer area, wherein the second recess includes a second transfer area configured to accommodate a transfer micro light emitting device and a second preparation area connected to the second transfer area and configured to accommodate a preparation micro light emitting device, and wherein the second preparation area includes a second outlet through which the preparation micro light emitting device enters the second transfer area.

[0008] The first transfer area and the second transfer area can be spaced apart from each other.

[0009] At least a portion of the first preparation area and at least a portion of the second preparation area can be integrated with each other.

[0010] A portion of the first preparation area adjacent to the first transfer area can have a taper structure having a width decreasing toward the first transfer area, and a portion of the second preparation area adjacent to the second transfer area can have a taper structure having a width decreasing toward the second transfer area.

[0011] A portion of the first preparation area adjacent to the first transfer area can have a straight structure having a width identical to that of the first transfer area, and a portion of the second preparation area adjacent to the second transfer area can have a straight structure having a width identical to that of the second transfer area.

[0012] A first portion of the first preparation area adjacent to the first transfer area can have a straight structure having a width identical to that of the first transfer area, a second portion of the first preparation area adjacent to the first portion of the first preparation area can have a taper structure having a width decreasing toward the first portion of the first preparation area, a first portion of the second preparation area adjacent to the second transfer area can have a straight structure having a width identical to that of the second transfer area, and a second portion of the second preparation area adjacent to the first portion of the second preparation area can have a taper structure having a width decreasing toward the first portion of the second preparation area.

[0013] Each of the first and second transfer areas can have a width greater than that of the transfer micro light emitting device and less than twice that of the transfer micro light emitting device.

[0014] Each of the plurality of pixels can include a plurality of sub-pixels, and each of the first and second transfer areas can have a size corresponding to a number of transfer micro light emitting devices included in a corresponding sub-pixel of the plurality of sub-pixels.

[0015] The first preparation area can have a width equal to or greater than that of the first transfer area, and the second preparation area can have a width equal to or greater than that of the second transfer area.

[0016] According to an aspect of an example embodiment, there is provided a method of manufacturing a display device, the method including: preparing a transfer substrate including a plurality of pixels, each of the plurality of pixels including a recess including a transfer area and a preparation area; supplying a micro light emitting device to the recess of each of the plurality of pixels; aligning the transfer micro light emitting device on the transfer area and aligning the preparation micro light emitting device on the preparation area; bonding and transferring the transfer micro light emitting device to a pixel of a first driving substrate, the pixel of the first driving substrate corresponding to the transfer micro light emitting device; moving the preparation micro light emitting device to the transfer area, the transfer area being empty after the transfer micro light emitting device is bonded and transferred to the pixel of the first driving substrate; and bonding and transferring the preparation micro light emitting device moved to the transfer area to a pixel of a second driving substrate, the pixel of the second driving substrate corresponding to the preparation micro light emitting device moved to the transfer area.

[0017] Each of the plurality of pixels can include a plurality of sub-pixels, the recess of each of the plurality of pixels can include a first recess and a second recess, the first recess and the second recess being included in respective sub-pixels of the plurality of sub-pixels, the first recess can include a first transfer area configured to accommodate the transfer micro light emitting device and a first preparation area connected to the first transfer area and configured to accommodate the preparation micro light emitting device, the first preparation area can include a first exit through which the preparation micro light emitting device enters the first transfer area, the second recess can include a second transfer area configured to accommodate the transfer micro light emitting device and a second preparation area connected to the second transfer area and configured to accommodate the preparation micro light emitting device, the second preparation area can include a second exit through which the preparation micro light emitting device enters the second transfer area.

[0018] The first transfer area and the second transfer area can be spaced apart from each other.

[0019] At least a portion of the first preparation area and at least a portion of the second preparation area can be integrated with each other.

[0020] A portion of the preparation area adjacent to the transfer area can have a tapered structure having a width that decreases toward the transfer area.

[0021] A portion of the preparation area adjacent to the transfer area can have a straight structure having a width that is the same as a width of the transfer area.

[0022] A first portion of the preparation area adjacent to the transfer area can have a straight structure having a width that is the same as a width of the transfer area, and a second portion of the preparation area adjacent to the first portion of the preparation area can have a tapered structure having a width that decreases toward the first portion of the preparation area.

[0023] The transfer region can have a width that is greater than a width of the transfer micro light emitting device and less than twice the width of the transfer micro light emitting device.

[0024] Each of the plurality of pixels can include a plurality of sub-pixels, and the transfer region can have a size corresponding to a number of transfer micro light emitting devices included in a corresponding sub-pixel of the plurality of sub-pixels. BRIEF DESCRIPTION OF DRAWINGS

[0025] The above and other aspects, features and advantages of certain example embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0026] Figure 1 A multiple-use transfer mold according to an example embodiment is schematically illustrated;

[0027] Figure 2 A multiple-use transfer mold according to another example embodiment is illustrated;

[0028] Figure 3 A multiple-use transfer mold according to another example embodiment is illustrated; Figure 2 An enlarged pixel structure of the illustrated multiple-use transfer mold;

[0029] Figure 4 A multiple-use transfer mold according to another example embodiment is illustrated;

[0030] Figure 5 A multiple-use transfer mold according to another example embodiment is illustrated;

[0031] Figure 6 A multiple-use transfer mold according to another example embodiment is illustrated;

[0032] Figures 7 to 10 A multiple-use transfer mold according to another example embodiment is illustrated; Figure 6 A modified example of the illustrated multiple-use transfer mold;

[0033] Figures 11 to 17 is a diagram for describing a method of manufacturing a display device according to an example embodiment, the method using a multiple-use transfer mold;

[0034] Figure 18 is a schematic block diagram of an electronic device according to an example embodiment;

[0035] Figure 19 An example of applying a display device according to an example embodiment to a mobile device is illustrated;

[0036] Figure 20 An example of applying a display device according to an example embodiment to a vehicle display device is illustrated;

[0037] Figure 21An example in which the display device according to an example embodiment is applied to an augmented reality (AR) glass or a virtual reality (VR) glass is shown;

[0038] Figure 22 An example in which the display device according to an example embodiment is applied to a signboard is shown; and

[0039] Figure 23 An example in which the display device according to an example embodiment is applied to a wearable display is shown. DETAILED DESCRIPTION

[0040] Reference will now be made in detail embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the embodiments can have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the drawings, to explain aspects. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of," when preceding the term "comprising," "including," and "containing," parenthesis list one or more of the associated listed items.

[0041] Hereinafter, a multi-use transfer mold according to various embodiments and a method of manufacturing a display device will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same elements, and the size of elements can be exaggerated for clarity and convenience of explanation. Although the terms first, second, etc. can be used herein to describe various elements, these terms do not limit the components. The terms are used only to distinguish one element from another.

[0042] As used herein, the singular term "a" is intended to also include the plural form, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. The size of each element shown in the accompanying drawings can be exaggerated for clarity and convenience of explanation. Also, when a certain material layer is described as being on a substrate or another layer, the material layer can be on the substrate or the other layer by directly contacting the substrate or the other layer, or a third layer can be disposed between the material layer and the substrate or the other layer. Also, the materials included in each layer in the embodiments to be described below are merely examples, and other materials can also be used.

[0043] In addition, the terms such as "unit," "module," etc. used in the specification indicate a unit for processing at least one function or motion, and the unit can be implemented by hardware or software or by a combination of hardware and software.

[0044] The specific implementations described in this implementation are examples and not intended to limit the technical scope in any way. For the sake of brevity, conventional electronics, control systems, software development and other functional aspects of the systems can not be described in detail. Furthermore, the connecting lines, or connectors shown in the various figures presented are intended to represent example functional relationships and / or physical or logical couplings between the various elements. It should be noted that many alternative or additional functional relationships, physical connections or logical connections can be present in a practical device.

[0045] The terms "the" and other equivalent relative pronouns can correspond to a singular referent or a plural referent.

[0046] Unless the order of the operations included in the method is specifically described or there is a description to the contrary, the operations can be performed in an appropriate order. The use of all example terms (e.g., etc.) is only for the detailed description of the present disclosure, and the present disclosure is not limited to the examples and example terms.

[0047] Figure 1 is a plan view of a multi-use transfer mold according to an example implementation.

[0048] The multi-use transfer mold 100 can include a plurality of pixels PX, each of which can include a plurality of sub-pixels. Figure 1 One pixel PX is shown. The plurality of sub-pixels can include, for example, a first sub-pixel SP1 and a second sub-pixel SP2.

[0049] The multi-use transfer mold 100 can include a transfer substrate 110, a first recess 120, and a second recess 130 provided in the transfer substrate 110. Each of the first recess 120 and the second recess 130 can include an area for accommodating a micro light emitting device 140. The micro light emitting device 140 can include a transfer micro light emitting device 141 to be transferred to a driving substrate of a display apparatus to be described below and a preparatory micro light emitting device 142 waiting to be transferred to the driving substrate.

[0050] The first recess 120 includes a first transfer area 122 (e.g., an end portion) for accommodating the transfer micro light emitting device 141 and a first preparatory area 125 connected to the first transfer area 122 and provided to accommodate the preparatory micro light emitting device 142. The first preparatory area 125 can have an exit 124 (e.g., a first exit) configured such that the preparatory micro light emitting device 142 can enter the first transfer area 122 through the exit 124. The first transfer area 122 can have a size for accommodating at least one transfer micro light emitting device 141, Figure 1 An example in which the first transfer area 122 has a size for accommodating one transfer micro light emitting device 141 is shown.

[0051] To accommodate a transfer micro-light-emitting device 141, the first transfer region 122 may have a width w2 that is greater than or equal to the width w1 of the transfer micro-light-emitting device 141 and less than twice the width w1 of the transfer micro-light-emitting device 141. The width w1 of the transfer micro-light-emitting device 141 may indicate the maximum cross-sectional width of the transfer micro-light-emitting device 141. Figure 1 An example of a transfer micro-light-emitting device 141 with a circular cross-section is shown, in which the width w1 can indicate the diameter of the circular cross-section. The width w3 of the first preparatory region 125 can be equal to or greater than the width w2 of the first transfer region 122. The width w2 of the first transfer region 122 and the width w3 of the first preparatory region 125 can be in a direction perpendicular to the direction (Y direction) from the first transfer region 122 to the first preparatory region 125 (e.g., Figure 1 The measurement is taken in the X direction. The width w3 of the first preparatory region 125 may not be constant depending on its shape. The size and shape of the first preparatory region 125 are unrestricted as long as a portion of the first preparatory region 125 (where the first transfer region 122 and the first preparatory region 125 meet) (i.e., the outlet 124) has dimensions that allow the preparatory micro-light-emitting devices 142 to pass through. For example, the first preparatory region 125 may have a straight groove shape with a constant width, allowing the preparatory micro-light-emitting devices 142 to be arranged sequentially.

[0052] The first transfer region 122 may be provided at one end of the first recess 120. Although it will be described below, it can be mentioned that, since the prepared micro-light-emitting device 142 can be pushed to the first transfer region 122, it is desirable that the first transfer region 122 be provided at one end of the first recess 120.

[0053] The second recess 130 may include a second transfer region 132 for receiving the transferred micro-light-emitting device 141 and a second preparation region 135 connected to the second transfer region 132. The second preparation region 135 may have an outlet 134 (e.g., a second outlet) configured to allow the prepared micro-light-emitting device 142 to enter the second transfer region 132. The second transfer region 132 and the second preparation region 135 may have substantially the same configuration as the first transfer region 122 and the first preparation region 125 described above; therefore, a detailed description of the second transfer region 132 and the second preparation region 135 is omitted.

[0054] A method of using the multi-use transfer mold 100 is described below. The micro light emitting device 140 can be transferred to the first recess 120 and the second recess 130. A pick-and-place method, a stamping method, a fluid self-assembly method, etc. can be used as a transfer method. By the transfer, the transferred micro light emitting device 141 can be arranged in the first transfer area 122 and the second transfer area 132, and the preliminary micro light emitting device 142 can be arranged in the first preliminary area 125 and the second preliminary area 135. When the transferred micro light emitting device 141 arranged in the first transfer area 122 and the second transfer area 132 is transferred onto a driving substrate to be described below, the first transfer area 122 and the second transfer area 132 can be emptied. The preliminary micro light emitting device 142 can move to the first transfer area 122 and the second transfer area 132 which have been emptied, and then the preliminary micro light emitting device 142 can be transferred onto another driving substrate. By repeatedly using this method until the preliminary micro light emitting device 142 is exhausted, the micro light emitting device 140 can be transferred onto different driving substrates multiple times.

[0055] Figure 2 is a plan view of a multi-use transfer mold 200 according to another example embodiment.

[0056] The multi-use transfer mold 200 can include a plurality of pixels PX, each of which can include a plurality of sub-pixels SP. The pixel PX can indicate a unit in which components are repeatedly arranged, or can be a unit for displaying an image. Although an image is not necessarily displayed on the multi-use transfer mold 200, the pixels PX and the sub-pixels SP of the multi-use transfer mold 200 will be used here as a concept corresponding to pixels and sub-pixels of a display device manufactured by using the multi-use transfer mold 200. For example, each of the plurality of pixels PX can include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3.

[0057] Figure 3 One pixel of the multi-use transfer mold 200 is illustrated.

[0058] The multi-use transfer mold 200 can include a transfer substrate 210, a first recess 220 provided in a first sub-pixel SP1, a second recess 230 provided in a second sub-pixel SP2, and a third recess 240 provided in a third sub-pixel SP3, in which the first sub-pixel SP1 to the third sub-pixel SP3 are arranged in the transfer substrate 210.

[0059] The first recess 220 can include a first transfer area 222 to accommodate the transfer micro light emitting device 241 and a first preparation area 225 connected to the first transfer area 222 and having an outlet 224 through which the preparation micro light emitting device 242 can pass. The first transfer area 222 can have an area to accommodate at least one transfer micro light emitting device 241. The size of the first transfer area 222 can vary according to the number of micro light emitting devices to be transferred to the driving substrate to be described below. That is, the size of the first transfer area 222 can vary according to the number of micro light emitting devices to be disposed in one sub-pixel of the display device. Figure 3 An example in which the first transfer area 222 can have an area to accommodate one transfer micro light emitting device 241 is illustrated. The first transfer area 222 can be provided at one end of the first recess 220, and the shape and size of the first transfer area 222 can be variously configured as long as the first transfer area 222 is configured such that an unintended preparation micro light emitting device does not enter the first transfer area 222 other than the transfer micro light emitting device 241. The first transfer area 222 can include a curved surface 222a corresponding to the circular shape of the transfer micro light emitting device 241.

[0060] The first preparation area 225 can be an area in which the preparation micro light emitting device 242 can be accommodated while waiting for the first transfer area 222 to be empty. The first preparation area 225 can be configured to have an area to accommodate as many preparation micro light emitting devices 242 as possible. The first preparation area 225 can have a width greater than that of the first transfer area 222, in which the width of the first preparation area 225 can increase as the distance to the first transfer area 222 increases.

[0061] The second recess 230 can include a second transfer area 232 to accommodate a transfer micro light emitting device 251 and a second preparation area 235 connected to the second transfer area 232 and having an outlet 234 configured to allow a preparation micro light emitting device 252 to pass through. The third recess 240 can include a third transfer area 262 to accommodate a transfer micro light emitting device 261 and a third preparation area 263 connected to the third transfer area 262 and having an outlet 265 through which a preparation micro light emitting device 264 can pass. The second transfer area 232 and the third transfer area 262 can have substantially the same configuration and function as the above-described first transfer area 222, and the second preparation area 235 and the third preparation area 263 can have substantially the same configuration and function as the above-described first preparation area 225. Therefore, a detailed description of the second transfer area 232, the third transfer area 262, the second preparation area 235, and the third preparation area 263 is omitted.

[0062] Figure 4A multi-use transfer mold 300 according to another example embodiment is illustrated.

[0063] The multi-use transfer mold 300 can include a transfer substrate 310 and a plurality of recesses 320, 330, and 340 provided in the transfer substrate 310. The recess 320 can include a transfer area 322 for accommodating a transfer micro light emitting device 341 and a preliminary area 325 connected to the transfer area 322 and having an exit 324 configured to allow a preliminary micro light emitting device 342 to pass through. The transfer area 322 can have a size for accommodating at least one transfer micro light emitting device 341, Figure 4 An example in which the transfer area 322 can have a size for accommodating two transfer micro light emitting devices 341 is illustrated. The transfer area 322 can be configured such that the two transfer micro light emitting devices 341 can be arranged in the X direction in the transfer area 322. Figure 4 Alternatively, the transfer area 322 can be configured such that the two transfer micro light emitting devices 341 can be arranged in the Y direction in the transfer area 322. Figure 4

[0064] The preliminary area 325 can have a width greater than that of the transfer area 322, and the preliminary area 325 can extend from the transfer area 322 in a stepped shape. Alternatively, the preliminary area 325 can extend from the transfer area 322 in a tapered shape. Alternatively, the preliminary area 325 can extend from the transfer area 322 in a straight shape.

[0065] Figure 5 A plan view of a multi-use transfer mold 400 according to another example embodiment is illustrated.

[0066] The multi-use transfer mold 400 can include a plurality of pixels PX, each of the plurality of pixels PX can have a 2x2 sub-pixel arrangement structure. The pixel PX can include a first sub-pixel SP1, a second sub-pixel SP2, a third sub-pixel SP3, and a fourth sub-pixel SP4, and the multi-use transfer mold 400 can be applied to a pixel arrangement structure having a so-called Bayer pattern including green, blue, red, and green.

[0067] The multi-use transfer mold 400 can include a transfer substrate 410 and a plurality of recesses 420 provided in the transfer substrate 410, wherein each of the plurality of recesses 420 can include a transfer area 422 for accommodating a transfer micro light emitting device 441 and a preliminary area 425 for accommodating a preliminary micro light emitting device 442. Each of the plurality of recesses 420 can correspond to a corresponding sub-pixel.

[0068] Figure 6 A multi-use transfer mold 500 according to another example embodiment is illustrated. ​

[0069] The multi-use transfer mold 500 can include a plurality of pixels PX, each of which can include a plurality of sub-pixels. Each of the plurality of pixels PX can include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3. The multi-use transfer mold 500 can include a transfer substrate 510, a first recess 520 provided in the first sub-pixel SP1, a second recess 530 provided in the second sub-pixel SP2, and a third recess 540 provided in the third sub-pixel SP3, in which the first sub-pixel SP1 to the third sub-pixel SP3 are arranged in the transfer substrate 510.

[0070] Each of the first recess 520 to the third recess 540 can include a transfer area 522 for accommodating a transfer micro light emitting device 541 and a preparation area 525 for accommodating a preparation micro light emitting device 542 and having an outlet 524. The transfer area 522 of the first recess 520, the transfer area 522 of the second recess 530, and the transfer area 522 of the third recess 540 can be spaced apart from each other. A portion of the preparation area 525 (which is adjacent to the transfer area 522) can have a tapered structure 527 having a width that decreases toward the transfer area 522. The tapered structure 527 can help to efficiently move the preparation micro light emitting device 542 to the transfer area 522.

[0071] According to an example embodiment, the one-body structure of the preparation area 525 can be formed such that at least a portion of each of the preparation areas 525 of the first recess 520 to the third recess 540 is connected to each other. When the entirety or a portion of each of the preparation areas 525 of the first recess 520 to the third recess 540 is one-body, a space for accommodating the preparation micro light emitting device 542 can be obtained relatively wider, and thus, the number of times of using the multi-use transfer mold 500 can be increased. As long as the transfer areas 522 of each of the first recess 520 to the third recess 540 are spaced apart from each other, the preparation areas 525 of each of the first recess 520 to the third recess 540 can have various configurations in terms of shape, structure, whether they are formed one-body or separately, etc.

[0072] In the multi-use transfer mold 500, the preparation area 525 of the first sub-pixel SP1 and the preparation area 525 of the third sub-pixel SP3 can have an area greater than that of the preparation area 525 of the second sub-pixel SP2. For example, in the first sub-pixel SP1 and the third sub-pixel SP3, the tapered structure 527 of the preparation area 525 can be asymmetric.

[0073] Figure 7 A multi-use transfer mold 500A according to another example embodiment is illustrated. The multi-use transfer mold 500A can have the same configuration as the multi-use transfer mold 500 except for a tapered structure 527a. Figure 6The configuration of the multiple-use transfer mold 500 is substantially the same as that of the multiple-use transfer mold 500A. Reference numeral 545 indicates an electrode of a micro light emitting device. The preliminary area 525 of each of the first to third sub-pixels SP1 to SP3 can have the same shape as each other, and the tapered structure 527a of each of the first to third sub-pixels SP1 to SP3 can be symmetrical. Figure 8 The multiple-use transfer mold 500A is shown Figure 7 The pixel array structure of the multiple-use transfer mold 500A is shown, and a state in which the transfer micro light emitting devices 541 and the preliminary micro light emitting device 542 are transferred in the first to third recesses 520 to 540 of the first to third sub-pixels SP1 to SP3 is indicated.

[0074] Figure 9 The multiple-use transfer mold 500A is shown Figure 6 A modified example of the multiple-use transfer mold 500 is shown. In the multiple-use transfer mold 500B, the preliminary area 526 of each of the first to third sub-pixels SP1 to SP3 can have a straight shape structure 526a having the same width as the width of the transfer area 522, and a tapered structure 526b having a width decreasing toward the straight shape structure 526a. Figure 9 Figure 6 The components indicated by using the same reference numerals as those of the multiple-use transfer mold 500A can have substantially the same structure and function as those of the multiple-use transfer mold 500A, and thus a detailed description thereof is omitted here. Figure 6 The multiple-use transfer mold 500B can include the transfer area 522 and the preliminary area 526 in each of the first to third sub-pixels SP1 to SP3. A portion of the preliminary area 526 (the portion adjacent to the transfer area 522) can have a straight shape structure 526a having the same width as the width of the transfer area 522, and a portion of the preliminary area 526 (the portion adjacent to the straight shape structure 526a of the preliminary area 526) can have a tapered structure 526b having a width decreasing toward the straight shape structure 526a. It is described that the preliminary area 526 can have the straight shape structure 526a and the tapered structure 526b. However, as needed, the preliminary area 526 can have the tapered structure 526b, and the transfer area 522 can have a straight shape structure for accommodating three transfer micro light emitting devices 541.

[0075]

[0076] The multiple-use transfer mold 500B is shown Figure 10 A modified example of the multiple-use transfer mold 500B is shown. Figure 9 The multiple-use transfer mold 500C can have the same configuration as that of the multiple-use transfer mold 500B of the multiple-use transfer mold 500A except that the transfer area 522 and the preliminary area 529 of each of the first and third sub-pixels SP1 and SP3 can have a straight line 529a on a respective side.

[0077] Figure 9 The multiple-use transfer mold 500C can have the same configuration as that of the multiple-use transfer mold 500B of the multiple-use transfer mold 500A except that the transfer area 522 and the preliminary area 529 of each of the first and third sub-pixels SP1 and SP3 can have a straight line 529a on a respective side.

[0078] ​​As described above, the multiple-use transfer mold according to the embodiment can have various structures, shapes, and sizes, as long as a transfer area for accommodating a transfer micro light emitting device in each sub-pixel is formed individually for each sub-pixel unit. Since the micro light emitting device can be transferred multiple times onto different driving substrates by using the multiple-use transfer mold, manufacturing costs can be reduced and yield can be improved.

[0079] Referring to Figures 11 to 17 A method of manufacturing a display device according to an example embodiment will be described.

[0080] Referring to Figure 11 A multiple-use transfer mold 600 including a transfer substrate 610 and a recess 620 provided in the transfer substrate 610 can be prepared. For the multiple-use transfer mold 600, various embodiments described with reference to Figures 1 to 10 may be applied. A micro light emitting device 630 can be supplied in the recess 620 of the transfer substrate 610. The transfer substrate 610 can include a plurality of recesses 620, each of which can include a transfer area 621 and a standby area 622. The micro light emitting device 630 can be arranged on the transfer substrate 610 by using a transfer method. The micro light emitting device 630 can include a transfer micro light emitting device 631 arranged in the transfer area 621 and a standby micro light emitting device 632 arranged in the standby area 622. The micro light emitting device 630 can each include a first semiconductor layer 6301, an emission layer 6302, and a second semiconductor layer 6303, which are sequentially stacked. For example, the first semiconductor layer 6301 can include an n-type semiconductor. The first semiconductor layer 6301 can include an n-type semiconductor based on group III-V, such as n-GaN. The first semiconductor layer 6301 can have a single layer or a multi-layer structure.

[0081] The emission layer 6302 can be provided on an upper surface of the first semiconductor layer 6301. The emission layer 6302 can emit light via combination of electrons and holes. The emission layer 6302 can have a multi-quantum well (MQW) structure or a single-quantum well (SQW) structure. The emission layer 6302 can include a semiconductor based on group III-V, such as GaN.

[0082] The second semiconductor layer 6303 may be disposed on the upper surface of the emitter layer 6302. The second semiconductor layer 6303 may include, for example, a p-type semiconductor. The second semiconductor layer 6303 may include a III-V group-based p-type semiconductor, such as p-GaN. The second semiconductor layer 6303 may have a single-layer or multi-layer structure. Alternatively, when the first semiconductor layer 6301 includes a p-type semiconductor, the second semiconductor layer 6303 may include an n-type semiconductor. The micro-light-emitting device 630 may have a horizontal electrode structure, and an electrode 640 may be provided on the second semiconductor layer 6303. The micro-light-emitting device 630 may have a width, for example, equal to or less than 200 μm. Furthermore, the depth of the groove 620 may be less than the thickness of the micro-light-emitting device 630, such that the electrode 640 of the micro-light-emitting device 630 can protrude outward from the groove 620.

[0083] Pick-and-place methods, stamping methods, and fluid self-assembly methods can be used as transfer methods.

[0084] Reference Figure 12 The description describes the transfer of the micro-light-emitting device 630 using a fluid self-assembly method. Figure 11 The method for transferring the micro-light-emitting device 630 onto the transfer substrate 610. To transfer the micro-light-emitting device 630 to the recess 620, a liquid may be supplied to the recess 620 (S101). The liquid may include any type of liquid that does not corrode or damage the micro-light-emitting device 630. The liquid may include, for example, one or a combination of the group consisting of water, ethanol, alcohol, polyols, ketones, halogenated hydrocarbons, acetone, flux, and organic solvents. Organic solvents may include, for example, isopropanol (IPA). The liquids available are not limited to these and may be modified in various ways.

[0085] The method of supplying liquid to the multiple recesses 620 can include various methods. For example, methods such as spraying, dispensing, inkjet dot distribution, or causing liquid to overflow onto the transfer substrate 610 can be used. The amount of liquid supplied can be adjusted in various ways. For example, the amount of liquid can be supplied to exactly fill the multiple recesses 620 or to overflow the recesses 620.

[0086] A plurality of micro light emitting devices 630 can be supplied onto the transfer substrate 610 (S102). The micro light emitting devices 630 can be directly scattered on the transfer substrate 610 without other liquid, or can be supplied onto the transfer substrate 610 by being included in a suspension. A method of supplying the micro light emitting devices 630 included in the suspension can include various methods. For example, spraying, dispensing of dropping liquid, inkjet dot scattering of discharging liquid like a printing method, a method of overflowing the suspension onto the transfer substrate 610, etc. can be used. In addition, the transfer substrate 610 can be scanned by an absorbent capable of absorbing liquid (S103). The absorbent can include any type of material capable of absorbing liquid, and the shape or structure of the absorbent is not particularly limited. The absorbent can include, for example, a fabric, a tissue, a polyester fiber, a paper, a wipe, etc.

[0087] The absorbent can scan the transfer substrate 610 by pressing the transfer substrate 610 by applying appropriate pressure to the transfer substrate 610. The scanning can include the absorbent passing through the grooves 620 in contact with the transfer substrate 610 to absorb the liquid. The scanning can be performed based on various methods including, for example, sliding, rotation, translation, reciprocation, rolling, spinning, and / or friction of the absorbent. Here, the method can include both regular and irregular motions. The scanning can be performed by moving the transfer substrate 610 rather than the absorbent. The scanning of the transfer substrate 610 can also be performed based on sliding, rotation, translation, reciprocation, rolling, spinning, friction, etc. of the transfer substrate 610. However, the scanning can also be performed based on the cooperative motion of the absorbent and the transfer substrate 610. Based on the above-described methods, the micro light emitting devices 630 can be aligned in the grooves 620 of the transfer substrate 610 by using a fluid self-assembly method (S104).

[0088] When the micro light emitting devices 630 are aligned in the grooves 620, the micro light emitting devices 630 can be arranged such that the electrodes 640 of the micro light emitting devices 630 are in an upward direction. The electrodes 640 of the micro light emitting devices 630 can be arranged in the upward direction, and the micro light emitting devices 630 can have a flat lower surface, and thus, the roughness between the upper and lower portions of the micro light emitting devices 630 can be different, resulting in a difference in surface energy. Accordingly, when the liquid absorbent scans the transfer substrate 610 while absorbing the liquid, the upper and lower positions of the micro light emitting devices 630 can be guided. According to the flow of the liquid during the scanning of the liquid absorbent, one surface of the micro light emitting devices 630 having a relatively large roughness can be arranged in the upward direction, and one surface of the micro light emitting devices 630 having a relatively small roughness can be arranged in the downward direction.

[0089] By moving the micro light emitting device 630 to the recess 620, the transfer micro light emitting device 631 can be aligned in the transfer area 621, and the first preparatory micro light emitting device 632 can be aligned in the preparatory area 622.

[0090] Referring to Figure 13 A first driving substrate 650 can be provided. The first driving substrate 650 can include driving devices 652 configured to drive the micro light emitting device 630. The driving devices 652 can include transistors, capacitors, etc., and electrode pads 651 electrically connected to the driving devices 652 can be provided on a surface of the first driving substrate 650. The electrode pads 651 can protrude from the surface of the first driving substrate 650, and the first driving substrate 650 can include an alignment mark 655.

[0091] Referring to Figure 14 The first driving substrate 650 can be disposed to face the transfer substrate 610, and the electrode pads 651 can be aligned to meet the electrodes 640 corresponding to the electrode pads 651 of the transfer micro light emitting device 631. The first driving substrate 650 can be disposed based on the alignment mark 655 to match the electrode pads 651 to the electrodes 640 corresponding to the electrode pads 651.

[0092] Referring to Figure 15 The electrodes 640 and the electrode pads 651 corresponding to the electrodes 640 can be bonded to each other, and the first driving substrate 650 can be moved to perform a bonding transfer of the transfer micro light emitting device 631 to a pixel area of the first driving substrate 650, the pixel area corresponding to the transfer micro light emitting device 631. When the transfer micro light emitting device 631 is bonding transferred to the first driving substrate 650, the transfer area 621 of the recess 620 can become an empty space.

[0093] Referring to Figure 16 By moving the first preparatory micro light emitting device 632 to the transfer area 621 of the transfer substrate 610 after the transfer area 621 has become empty, the first preparatory micro light emitting device becomes another transfer micro light emitting device 631 disposed in the transfer area 621. When the preparatory micro light emitting device 632 is moved to the transfer area 621, the remaining preparatory micro light emitting devices 632 can be collectively shifted, and one preparatory micro light emitting device 632 can be moved to the transfer area 621.

[0094] Referring to Figure 17 A second driving substrate 660 can be provided. The second driving substrate 660 can include driving devices 662 configured to drive the micro light emitting device 630. Electrode pads 661 electrically connected to the driving devices 662 can be provided on a surface of the second driving substrate 660, and the second driving substrate 660 can include an alignment mark 655.

[0095] The second driving substrate 660 can be arranged to face the transfer substrate 610, and the electrode pad 661 can be aligned to meet the electrode 640 corresponding to the electrode pad 661 of the transfer micro light emitting device 631. The electrode 640 and the electrode pad 661 corresponding to the electrode 640 can be bonded to each other, and the second driving substrate 660 can be moved to perform a bonding transfer of the transfer micro light emitting device 631 to a pixel area of the second driving substrate 660, which corresponds to the transfer micro light emitting device 631. By using this method, the micro light emitting device 630 can be transferred to a plurality of driving substrates until the preliminary micro light emitting device 632 remaining in the recess 620 is completely exhausted.

[0096] According to the method of manufacturing a display device according to an example embodiment, a plurality of display devices can be manufactured by using the multi-use transfer mold 600 multiple times. Since the multi-use transfer mold 600 can be used multiple times, the transfer time and cost can be reduced. In addition, the micro light emitting device 630 can be easily pushed into the transfer area 621 of the multi-use transfer mold 600, and thus, the possibility of missing the transfer micro light emitting device 631 in the transfer area 621 can be reduced. Accordingly, the pixel error rate and the repair process in the display device can be reduced.

[0097] Figure 18 FIG. 21 is a block diagram of an electronic device 8201 including a display device according to an example embodiment.

[0098] Referring to FIG. 21, Figure 18 The electronic device 8201 can be provided in a network environment 8200. In the network environment 8200, the electronic device 821 can communicate with another electronic device 8202 over a first network 8298 (e.g., a short-range wireless communication network), or can communicate with another electronic device 8204 and / or a server 8208 over a second network 8299 (e.g., a long-range wireless communication network). The electronic device 8201 can communicate with the server 8208 via the electronic device 8204. The electronic device 8201 can include a processor 8220, a memory 8230, an input device 8250, a sound output device 8255, a display device 8260, an audio module 8270, a sensor module 8276, an interface 8277, a haptic module 8279, a camera module 8280, a power management module 8288, a battery 8289, a communication module 8290, a subscriber identification module 8296, and / or an antenna module 8297. The electronic device 8201 can omit one or more of the components or can further include other components. One or more of the components can be implemented as an integrated circuit. For example, the sensor module 8276 (e.g., a fingerprint sensor, an iris sensor, an illumination sensor, etc.) can be embedded in the display device 8260 (e.g., a display, etc.).

[0099] The processor 8220 can be configured to control one or more components (hardware or software components) of the electronic device 8201 connected thereto, and be configured to perform various data processing or computation by running a software (program 8240, etc.). As part of the data processing or computation, the processor 8220 can be configured to load a command or data received from the other component (sensor module 8276, communication module 8290, etc.) into the volatile memory 8232, process the command or the data stored in the volatile memory 8232, and store resulting data in the non-volatile memory 8234. The non-volatile memory 8234 can include an embedded memory 8236 and an external memory 8238. The processor 8220 can include a main processor 8221 (central processing unit (CPU), application processor (AP), etc.) and an auxiliary processor 8223 (graphics processing unit (GPU), image signal processor, sensor hub processor, communication processor, etc.) that can operate independently of or in conjunction with the main processor 8221. The auxiliary processor 8223 can consume less power than the main processor 8221 and can perform specific functions.

[0100] When the main processor 8221 is in an inactive state (sleep state), the auxiliary processor 8223 can control the operation of functions and / or states related to one or more components (display device 8260, sensor module 8276, communication module 8290, etc.) among the components of the electronic device 8201, or, when the main processor 8221 is in an active state (application running state), the auxiliary processor 8223 can perform the operation together with the main processor 8221. The auxiliary processor 8223 (image signal processor, communication processor, etc.) can be implemented as part of other functionally related components (camera module 8280, communication module 8290, etc.).

[0101] The memory 8230 can store various data required for the components (processor 8220, sensor module 8276, etc.) of the electronic device 8201. The data can include, for example, software (program 8240, etc.), input data and / or output data of commands related to the software. The memory 8230 can include a volatile memory 8232 and / or a non-volatile memory 8234.

[0102] The program 8240 can be stored in the memory 8230 as software, and can include an operating system 8242, middleware 8244, and / or an application 8246.

[0103] The input device 8250 can receive a command and / or data to be used by the components of the electronic device 8201 (e.g., the processor 8220) from the outside of the electronic device 8201. The input device 8250 can include, for example, a remote control, a microphone, a mouse, a keyboard, and / or a digital pen (e.g., a stylus pen).

[0104] The sound output device 8255 can output sound signals to the outside of the electronic device 8201. The sound output device 8255 can include, for example, a speaker and / or a receiver. The speaker can be used for general purposes, such as multimedia play or recording play, and the receiver can be used for receiving an incoming call. The receiver can be implemented as part of the speaker or can be implemented as a separate from the speaker.

[0105] The display device 8260 can visually provide information to the outside of the electronic device 8201. The display device 8260 can include, for example, a display, a hologram device, or a projection device. The display device 8260 can include a touch circuitry configured to sense a touch operation and / or a sensor circuitry (e.g., a pressure sensor) configured to measure the intensity of a force generated by the touch operation. Figures 1 to 10 A display device manufactured by using the multi-use transfer mold described above can be manufactured by using the method of manufacturing a display device described above. The display device 8260 can include a touch circuitry configured to sense a touch operation and / or a sensor circuitry (e.g., a pressure sensor) configured to measure the intensity of a force generated by the touch operation. Figures 11 to 17

[0106] The audio module 8270 can convert sound and / or an electrical signal to a sound and / or an electrical signal. The audio module 8270 can obtain sound from a microphone, or output sound through a speaker and / or a headphone of an electronic device (e.g., the electronic device 8202) connected to the electronic device 8201 directly or wirelessly.

[0107] The sensor module 8276 can sense an operational state (power, temperature, and / or the like) of the electronic device 8201 or an external environmental state (user state and / or the like), and generate an electrical signal and / or data value corresponding to the sensed state. The sensor module 8276 can include, for example, a gesture sensor, a gyro sensor, an atmospheric sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor.

[0108] The interface 8277 can support one or more designated protocols to enable the electronic device 8201 to be directly or wirelessly connected to another electronic device (e.g., the electronic device 8202).

[0109] ​The connection terminal 8278 can include a connector through which the electronic device 8201 can be physically connected to another electronic device (the electronic device 8202, etc.). The connection terminal 8278 can include a HDMI connector, a USB connector, a SD card connector, and / or an audio connector (a headphone connector, etc.).

[0110] The haptic module 8279 can convert electrical signals into mechanical stimuli (vibration, movement, etc.) or electrical stimuli that can be recognized by users via tactile or kinesthetic sensation. The haptic module 8279 can include a motor, a piezoelectric device, and / or an electrical stimulation device.

[0111] The camera module 8280 can capture still images and videos. The camera module 8280 can include a lens assembly including one or more lenses, an image sensor, an image signal processor, and / or a flash. The lens assembly included in the camera module 8280 can collect light emitted from an object whose image is to be captured.

[0112] The power management module 8288 can manage power supplied to the electronic device 8201. The power management module 8288 can be implemented as part of a power management integrated circuit (PMIC).

[0113] The battery 8289 can supply power to the components of the electronic device 8201. The battery 8289 can include a primary cell that can not be recharged, a secondary cell that can be recharged, and / or a fuel cell.

[0114] The communication module 8290 can support establishing a direct (wired) communication channel and / or a wireless communication channel between the electronic device 8201 and the other electronic devices (the electronic device 8202, the electronic device 8204, the server 8208, etc.) and communicating through the established communication channel. The communication module 8290 can include one or more communication processors operable independently from the processor 8220 (an application processor, etc.) and support direct communication and / or wireless communication. The communication module 8290 can include a wireless communication module 8292 (a cellular communication module, a short-range wireless communication module, a global navigation satellite system (GNSS) communication module) and / or a wired communication module 8294 (a local area network (LAN) communication module, a power line communication module, etc.). Respective ones of these communication modules can communicate with the other electronic devices through a first network 8298 (a short-range wireless communication network, such as Bluetooth, WiFi direct, or infrared data association (IrDA)) or a second network 8299 (a long-range communication network, such as a cellular network, the Internet, or a computer network (LAN, WAN, etc.). The above-described various types of communication modules can be integrated as a single component (a single chip, etc.) or implemented as multiple components (multiple chips). The wireless communication module 8292 can identify and authenticate the electronic device 8201 within the first network 8298 and / or the second network 8299 by using subscriber information (international mobile subscriber identity (IMSI) etc.) stored in the subscriber identification module 8296.

[0115] The antenna module 8297 can transmit and / or receive a signal and / or power to / from an external (the other electronic devices, etc.). The antenna module 8297 can include a transmitter including a conductive pattern formed on a substrate (a printed circuit board (PCB) etc.). The antenna module 8297 can include one antenna or a plurality of antennas. When the antenna module 8297 includes a plurality of antennas, an appropriate antenna suitable for a communication method used in a communication network, such as the first network 8298 and / or the second network 8299, can be selected. Through the selected antenna, a signal and / or power can be transmitted or received between the communication module 8290 and the other electronic devices. In addition to the antenna, another component (a radio frequency integrated circuit (RFIC) etc.) can be included in the antenna module 8297.

[0116] One or more of the components of the electronic device 8201 can be connected to and exchange signals (commands, data, etc.) with each other through a communication method (a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), a mobile industry processor interface (MIPI), etc.) performed between the peripheral devices.

[0117] Commands or data can be transmitted or received between the electronic device 8201 and the other external electronic device 8204 via the server 8208 coupled with the second network 8299. The other electronic devices 8202 and 8204 can be a device of a same type as or different from the electronic device 8201. All or a part of operations that are performed by the electronic device 8201 can be performed by one or more of the other electronic devices 8202, 8204, and 8208. For example, when the electronic device 8201 must perform a function or a service automatically, it can request the one or more of the other electronic devices to perform some or all of the function or the service, instead of performing the function or the service by itself. The one or more of the other electronic devices receiving the request can perform additional functions or services associated with the request and can transmit the results of the performance to the electronic device 8201. To that end, a cloud computing, distributed computing, and / or client-server computing technology can be used.

[0118] Figure 19 An example in which a display device according to an example embodiment is applied to a mobile device 9100 is illustrated. The mobile device 9100 can include a display device 9110, which can include a display panel 9111 manufactured by using a method of manufacturing a display device described with reference to Figures 11 to 17 A display device manufactured by using a method of manufacturing a display device described with reference to

[0119] Figure 20 An example in which a display device according to an example embodiment is applied to a vehicle is illustrated. The display device can correspond to a vehicle head-up display device 9200, and can include a display 9210 provided in an area of the vehicle and a light path changing member 9220 configured to change a light path so that a driver views an image generated by the display 9210.

[0120] Figure 21 An example in which a display device according to an example embodiment is applied to an augmented reality (AR) or virtual reality (VR) glasses 9300 is illustrated. The AR or VR glasses 9300 can include a projection system 9310 configured to form an image and a component 9320 configured to guide the image from the projection system 9310 to a user's eye. The projection system 9310 can include a display device manufactured by using a method of manufacturing a display device described with reference to Figures 11 to 17 A display device manufactured by using a method of manufacturing a display device described with reference to

[0121] Figure 22 An example in which a display device according to an example embodiment is applied to a large signboard 9400 is illustrated. The signboard 9400 can be used for outdoor advertising using a digital information display, and can control advertising content through a communication network. The signboard 9400 can be implemented, for example, by using an electronic device described with reference to Figure 18 A display device manufactured by using a method of manufacturing a display device described with reference to

[0122] Figure 23 is a diagram of an example in which the display device according to an example embodiment is applied to a wearable display. The wearable display 9500 can include a display device manufactured by using the method of manufacturing a display device described with reference to Figures 11 to 17 FIG. 1, or can be implemented by the electronic device 8201 described with reference to Figure 18 FIG. 2.

[0123] The display device according to an example embodiment can be applied to other various products, such as a rollable television (TV), a stretchable display, or the like.

[0124] The above-described embodiments are merely examples. It is to be understood that a variety of modifications and equivalent embodiments can be made based on the embodiments in accordance with the principles of the present disclosure. Accordingly, the true technical protection scope of the embodiments should be defined based on the technical spirit of the present disclosure as stated in the appended claims.

[0125] The multiple-use transfer mold according to an example embodiment can efficiently transfer micro light emitting devices onto a driving substrate and can be used multiple times. The multiple-use transfer mold can include a plurality of grooves, each of which can include a transfer area for accommodating a micro light emitting device to be transferred onto a driving substrate and a preparation area for accommodating a micro light emitting device waiting to be transferred onto a driving substrate. Accordingly, the transfer mold can be used multiple times, and yield can be improved.

[0126] According to the method of manufacturing a display device according to an example embodiment, micro light emitting devices can be efficiently transferred onto a driving substrate by using a multiple-use transfer mold, and the multiple-use transfer mold can be used multiple times to manufacture a display device.

[0127] It is to be understood that the embodiments described herein are to be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the attached drawings, those skilled in the art will appreciate that various changes in form and detail can be made therein without departing from the spirit and scope as defined by the following claims.

[0128] This application is based on U.S. Provisional Patent Application No. 63 / 180,295 filed on April 27, 2021, in the U.S. Patent and Trademark Office, and Korean Patent Application No. 10-2021-0082328 filed on June 24, 2021, in the Korean Intellectual Property Office, and claims priority thereto, the disclosures of which are incorporated by reference herein in their entireties.

Claims

1. A multi-use transfer mold, comprising: a transfer substrate including a plurality of pixels and a first recess and a second recess provided in each of the plurality of pixels, wherein the first recess includes a first transfer area configured to accommodate a transfer micro light emitting device to be transferred onto a driving substrate and a first preparation area connected to the first transfer area and configured to accommodate a preparation micro light emitting device waiting to be transferred onto the driving substrate, wherein the first preparation area includes a first exit through which the preparation micro light emitting device enters the first transfer area, wherein the second recess includes a second transfer area configured to accommodate the transfer micro light emitting device and a second preparation area connected to the second transfer area and configured to accommodate the preparation micro light emitting device, and wherein the second preparation area includes a second exit through which the preparation micro light emitting device enters the second transfer area. 2.The multi-use transfer mold of claim 1, wherein the first transfer area and the second transfer area are spaced apart from each other. 3.The multi-use transfer mold of claim 1, wherein at least a portion of the first preparation area and at least a portion of the second preparation area are integrated with each other. 4.The multi-use transfer mold of claim 1, wherein a portion of the first preparation area adjacent to the first transfer area has a tapered structure having a width decreasing toward the first transfer area, and wherein a portion of the second preparation area adjacent to the second transfer area has a tapered structure having a width decreasing toward the second transfer area. 5.The multi-use transfer mold of claim 1, wherein a portion of the first preparation area adjacent to the first transfer area has a straight structure having a width identical to that of the first transfer area, and wherein a portion of the second preparation area adjacent to the second transfer area has a straight structure having a width identical to that of the second transfer area. 6.The multi-use transfer mold of claim 1, wherein a first portion of the first preparation area adjacent to the first transfer area has a straight structure having a width identical to that of the first transfer area, wherein a second portion of the first preparation area adjacent to the first portion of the first preparation area has a tapered structure having a width decreasing toward the first portion of the first preparation area, wherein a first portion of the second preparation area adjacent to the second transfer area has a straight structure having a width identical to that of the second transfer area, and wherein a second portion of the second preparation area adjacent to the first portion of the second preparation area has a tapered structure having a width decreasing toward the first portion of the second preparation area.

7. The multi-use transfer mold of claim 1, wherein each of the first transfer region and the second transfer region has a width that is greater than a width of the transfer micro light emitting device and less than twice the width of the transfer micro light emitting device.

8. The multi-use transfer mold of claim 1, wherein each of the plurality of pixels comprises a plurality of sub-pixels, and wherein each of the first transfer region and the second transfer region has a size corresponding to a number of transfer micro light emitting devices included in a respective sub-pixel of the plurality of sub-pixels.

9. The multi-use transfer mold of claim 1, wherein the first preparation region has a width that is equal to or greater than a width of the first transfer region, and wherein the second preparation region has a width that is equal to or greater than a width of the second transfer region.

10. A method of manufacturing a display device, the method comprising: preparing a transfer substrate comprising a plurality of pixels, each of the plurality of pixels comprising a recess, the recess comprising a transfer region and a preparation region; supplying a micro light emitting device to the recess of each of the plurality of pixels; aligning a transfer micro light emitting device to be transferred onto a drive substrate on the transfer region and a preparation micro light emitting device waiting to be transferred onto a drive substrate on the preparation region; bond-transferring the transfer micro light emitting device to a pixel of a first drive substrate, the pixel of the first drive substrate corresponding to the transfer micro light emitting device; moving the preparation micro light emitting device to the transfer region, the transfer region being empty after the transfer micro light emitting device is bond-transferred to the pixel of the first drive substrate; and bond-transferring the preparation micro light emitting device moved to the transfer region to a pixel of a second drive substrate, the pixel of the second drive substrate corresponding to the preparation micro light emitting device moved to the transfer region.

11. The method of claim 10, wherein each of the plurality of pixels comprises a plurality of sub-pixels, wherein the recess of each of the plurality of pixels comprises a first recess and a second recess, the first recess and the second recess being included in a respective sub-pixel of the plurality of sub-pixels, wherein the first recess comprises a first transfer region configured to accommodate the transfer micro light emitting device and a first preparation region connected to the first transfer region and configured to accommodate the preparation micro light emitting device, wherein the first preparation region comprises a first exit through which the preparation micro light emitting device enters the first transfer region, wherein the second recess comprises a second transfer region configured to accommodate the transfer micro light emitting device and a second preparation region connected to the second transfer region and configured to accommodate the preparation micro light emitting device, and wherein the second preparation region comprises a second exit through which the preparation micro light emitting device enters the second transfer region.

12. The method of claim 11, wherein the first transfer region and the second transfer region are spaced apart from each other. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 13. The method of claim 11, wherein at least a portion of the first preparation region and at least a portion of the second preparation region are integral to each other.

14. The method of claim 10, wherein a portion of the preparation region adjacent to the transfer region has a tapered structure with a width that decreases toward the transfer region.

15. The method of claim 10, wherein a portion of the preparation region adjacent to the transfer region has a straight structure with a width that is the same as a width of the transfer region.

16. The method of claim 10, wherein a first portion of the preparation region adjacent to the transfer region has a straight structure with a width that is the same as a width of the transfer region, and wherein a second portion of the preparation region adjacent to the first portion of the preparation region has a tapered structure with a width that decreases toward the first portion of the preparation region.

17. The method of claim 10, wherein the transfer region has a width that is greater than a width of the transfer micro light emitting device and less than twice the width of the transfer micro light emitting device.

18. The method of claim 10, wherein each of the plurality of pixels comprises a plurality of sub-pixels, and wherein the transfer region has a size corresponding to a number of transfer micro light emitting devices included in a respective sub-pixel of the plurality of sub-pixels. ​ ​

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