Electronic device, housing assembly, film material, UV transfer mold and method for preparing the same

Abstract

The present application provides an electronic device, a housing assembly, a film material, a UV transfer mold and a preparation method thereof; the preparation method of the UV transfer mold includes: providing a mold substrate; forming a main pattern on the mold substrate; forming a micro-structure pattern on the main pattern. The preparation method of the UV transfer mold provided by the embodiments of the present application first forms a main pattern on the mold substrate; then forms a micro-structure pattern on the main pattern. The mold prepared by using this method can be used to prepare a film with a micro-structure pattern, and has the characteristics of simple process, delicate film effect and good compatibility.

Description

Technical Field

[0001] This application relates to the technical field of appearance films for electronic devices, and more specifically, to an electronic device, a housing assembly, a film, a UV transfer mold, and a preparation method thereof. Background Art

[0002] For some films with microscopic texture structures such as organza, the conventional technical solution is generally to directly encapsulate the organza material in glue and integrally bond it to a substrate to form a film with an organza texture effect. Since the organza material is directly encapsulated in glue in this kind of film, the overall thickness is too large to meet the requirements of the overall thickness of the housing. Therefore, it is necessary to redesign a preparation method that can be used for films with microscopic texture structures such as organza. Summary of the Invention

[0003] In a first aspect of an embodiment of this application, a preparation method of a UV transfer mold is provided. The preparation method includes:

[0004] Providing a mold substrate;

[0005] Forming a main pattern on the mold substrate;

[0006] Forming a micro-structure pattern on the main pattern.

[0007] In a second aspect, an embodiment of this application provides a preparation method of a film with a UV texture. The preparation method includes:

[0008] Providing a substrate;

[0009] Forming a UV glue on the surface of the substrate;

[0010] Using the mold obtained by any one of the above embodiments to transfer and form a UV texture pattern on the UV glue;

[0011] Curing the substrate with the formed UV texture pattern in a UV light environment.

[0012] In a third aspect, an embodiment of this application provides a film with a UV texture, which is prepared by using the preparation method described in the above embodiments.

[0013] In a fourth aspect, an embodiment of this application provides a housing assembly, which includes a substrate and the film described in the above embodiments attached to the substrate.

[0014] In addition, an embodiment of the present application further provides an electronic device, which includes a display screen module, a control circuit board, and the housing assembly described in the above embodiment. The housing assembly and the display screen module cooperate to form an accommodation space, and the control circuit board is disposed in the accommodation space and is coupled to the display screen module for controlling the working state of the display screen module.

[0015] The method for preparing a UV transfer mold provided by the embodiment of the present application first forms a main pattern on a mold substrate; then forms a micro-structure pattern on the main pattern. The mold prepared by using this method can be used to prepare a film sheet with a micro-structure pattern, and has the characteristics of simple process, delicate film sheet effect, and good compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 It is a schematic flowchart of an embodiment of the method for preparing a UV transfer mold of the present application;

[0018] Figure 2 It is a schematic flowchart of the method for forming a micro-structure pattern on the main pattern;

[0019] Figure 3 It is an enlarged schematic view of the quadrangular pyramid micro-structure in this embodiment;

[0020] Figure 4 It is an enlarged schematic view of the solid micro-structure;

[0021] Figure 5 It is a schematic flowchart of an embodiment of the method for preparing a UV texture film material of the present application;

[0022] Figure 6 It is a schematic structural view after forming a UV glue on the surface of the substrate;

[0023] Figure 7 It is a schematic structural view after forming a UV texture pattern;

[0024] Figure 8 It is a schematic flowchart of another embodiment of the method for preparing a UV texture film material of the present application;

[0025] Figure 9 It is a schematic structural view of another embodiment of the UV texture film material of the present application;

[0026] Figure 10It is a schematic flowchart of still another embodiment of the method for preparing the UV texture film material of the present application;

[0027] Figure 11 It is a schematic structural diagram of still another embodiment of the UV texture film material of the present application;

[0028] Figure 12 It is a schematic structural diagram of an embodiment of the housing assembly of the present application;

[0029] Figure 13 It is a schematic structural diagram of an embodiment of the electronic device of the present application;

[0030] Figure 14 is Figure 13 Schematic cross-sectional view of the structure of the electronic device at A-A in the embodiment;

[0031] Figure 15 It is a schematic block diagram of the structural composition of an embodiment of the electronic device of the present application. Detailed implementation manners

[0032] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0033] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly. The terms "include" and "have" in the embodiments of the present application and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or components inherent to these processes, methods, products, or devices.

[0034] References to "embodiments" in this specification mean that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase does not necessarily refer to the same embodiment each time it appears in the specification, nor is it an independent or alternative embodiment mutually exclusive of other embodiments. Those skilled in the art will understand explicitly and implicitly that the embodiments described herein can be combined with other embodiments.

[0035] As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, a device configured to receive / transmit communication signals via a wired connection (such as via a public switched telephone network (PSTN), digital subscriber line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via a wireless interface (such as for a cellular network, wireless local area network (WLAN), digital television network such as a DVB-H network, satellite network, AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; personal communication system (PCS) terminals that may combine cellular radiotelephone with data processing, facsimile, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notepads, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device configured with a cellular communication module.

[0036] In the conventional technical solution, a new composite glue is used to encapsulate the organza element (organza fabric) to form a diaphragm. However, a major problem arises, that is, the thickness is more than 100 um thicker than the conventional diaphragm, which causes the newly developed organza diaphragm (total thickness 0.2 - 0.22 mm) to be incompatible with the previous middle frame. When encapsulating the organza fabric into the diaphragm, the following problems mainly occur: 1. The finished diaphragm is too thick (0.2 - 0.22 mm), while the conventional diaphragm is 0.12 mm, and the thickness of the integrated organza diaphragm is 0.1 mm thicker than the conventional one, so the middle frame of the conventional mobile phone cannot be compatible with the genuine organza diaphragm; 2. After the organza is made, due to the softness of the fabric itself, when integrated into the diaphragm, the organza element becomes twisted and distorted, resulting in serious poor appearance; 3. For the organza fabric with structural color, after being encapsulated with glue, the structure of the organza is filled with glue, resulting in the inability to present the high-quality structural color of the organza.

[0037] In view of this, the embodiments of the present application first provide a preparation method for a UV transfer mold. Of course, this preparation method can also be used to fabricate a texture pattern with microstructures on the surface of materials such as glass. Please refer to Figure 1 , Figure 1 which is a schematic flow chart of an embodiment of the preparation method for the UV transfer mold of the present application. The preparation method includes but is not limited to the following steps.

[0038] Step S110: Provide a mold substrate.

[0039] Among them, the mold substrate can be a metal plate, such as a steel plate, a glass plate, etc.

[0040] Please continue to refer to Figure 1 , and the preparation method in this embodiment further includes step S120: Form a main pattern on the mold substrate.

[0041] In step S120, specifically, the main pattern can be formed on the mold substrate by means of rubbing. Among them, the main pattern is the pattern part with relatively large and clear outlines and lines. Taking the organza texture as an example, first prepare the organza gauze with the desired effect, and the texture of the organza gauze can be rubbed on the mold substrate. At this time, the texture on the mold substrate can replicate most of the texture of the organza.

[0042] Please continue to refer to Figure 1 , and the preparation method in this embodiment further includes step S130: Form a micro-structure pattern on the main pattern.

[0043] Still taking the organza texture as an example, in the previous step, after most of the texture of the organza is replicated, a part of the remaining micro-structures (which play a role in refracting light to form a glittering effect) cannot be completely rubbed out. Then, through this step, a micro-structure pattern needs to be formed on the main pattern. Specifically, the micro-structure pattern can be formed on the main pattern by using the etching method of exposure and development.

[0044] Specifically, this step can further include the following steps. Please refer to Figure 2 , Figure 2 which is a schematic flow chart of the method for forming a micro-structure pattern on the main pattern.

[0045] Step S131: Simulate the micro-structure pattern to be etched into a drawing.

[0046] Specifically, it can be to observe the structure of the organza through an optical microscope and simulate the structure into a drawing.

[0047] Please continue to refer to Figure 2 , and the method for forming a micro-structure pattern on the main pattern in this embodiment further includes step S132: Use the etching method of exposure and development to form the micro-structure pattern on the drawing on the main pattern.

[0048] Expose and develop on the semi-finished template to lithograph the pattern on the drawing, and finally form the master mold. Prepare the master mold and then make a copy to obtain the sub-mold for standby.

[0049] Among them, in this embodiment, the microstructure in the microstructure pattern can be a quadrangular pyramid microstructure. In order to achieve a better flash point effect and take into account the process difficulty of etching, please refer to Figure 3 , Figure 3 is an enlarged schematic view of the quadrangular pyramid microstructure in this embodiment. The size design of the microstructure quadrangular pyramid 130a in this embodiment is as follows: the bottom length d of the quadrangular pyramid microstructure is 160 - 180um, specifically it can be 160um, 162um, 165um, 170um, 180um, etc.; the height h is 21 - 32um, specifically it can be 21um, 22um, 25um, 30um, 32um, etc.; the edge length l is 110 - 130um, specifically it can be 110um, 115um, 120um, 125um, 130um, etc. Please refer to Figure 4 , Figure 4 is an enlarged schematic view of the solid microstructure.

[0050] The preparation method of the UV transfer mold provided by the embodiment of the present application is as follows: First, form a main pattern on the mold substrate; then form a microstructure pattern on the main pattern. The mold prepared by using this method can be used to prepare a diaphragm with a microstructure pattern, and has the characteristics of simple process, delicate diaphragm effect and good compatibility.

[0051] The embodiment of the present application also provides a preparation method of a film material with UV texture. Please refer to Figure 5 , Figure 5 is a schematic flow chart of an embodiment of the preparation method of the film material with UV texture in the present application. This preparation method includes but is not limited to the following steps.

[0052] Step S100, provide a substrate.

[0053] Among them, the substrate can be a resin material film (such as a PET film) or a glass film.

[0054] Prepare a PET film with a width and length of 400 * 300mm, tear off the surface release film, and place the PET film on the UV transfer equipment.

[0055] Please continue to refer to Figure 5 , in this embodiment, the preparation method of the film material with UV texture further includes step S200, forming a UV glue on the surface of the substrate.

[0056] Please refer to Figure 6 , Figure 6It is a schematic structural diagram after forming a UV glue on the surface of a substrate. Among them, the one marked 201 represents the substrate, and the one marked 202 represents the UV glue layer. The specific formation method of the UV glue can be to drop UV glue droplets on a PET film.

[0057] Please continue to refer to Figure 5 , in this embodiment, the preparation method of the UV texture film material further includes step S300 of transferring and forming a UV texture pattern on the UV glue by using a mold.

[0058] Among them, the mold used in this step is the one obtained by the method in the foregoing embodiment. At this time, the mold (the mold with organza texture) on the equipment presses down and extrudes the semi-finished product, and transfers the texture on the mold to the UV glue water.

[0059] Please continue to refer to Figure 5 , in this embodiment, the preparation method of the UV texture film material further includes step S400 of curing the substrate with the formed UV texture pattern in a UV light environment.

[0060] At this time, it is transferred to the UV curing lamp for curing. The curing method is bottom curing, and the energy of the lamp is 600 - 1000 mJ / cm 2 , specifically, it can be 600 mJ / cm 2 , 650 mJ / cm 2 , 700 mJ / cm 2 , 800 mJ / cm 2 , 1000 mJ / cm 2 etc. At this time, the UV glue is crosslinked and cured, with a very high modulus. At this time, the mold is demolded. Please refer to Figure 7 , Figure 7 is a schematic structural diagram after forming a UV texture pattern. In the figure, the one marked 203 represents the UV texture pattern layer.

[0061] The embodiment of the present application relates to a novel UV texture with an imitation organza structural color and a process method, involving processes such as texture transfer, exposure and development, and photolithography. In our latest design, the organza texture is transferred onto the mold by the transfer method. Due to the limitations of the transfer process, some small microstructures cannot be completely transferred. Then, through exposure and development, the microstructures on the imitation organza are repaired by the photolithography process, and finally, the UV texture with an imitation organza structural color is realized, which not only has the texture of organza, but also can sparkle through the interference of light by the microstructures.

[0062] Through the technical solution in this application, the element texture of organza can be applied to the appearance film of the mobile phone, and the specific excellent effects are as follows: 1. Since the organza element is made into a UV texture, the thickness will be the same as that of the conventional film (0.12 mm), which can be compatible with the conventional middle frame; 2. Making the organza into a texture mold and performing UV transfer printing through the mold can better ensure the consistency of the effect and make the effect more delicate; 3. The organza with structural color can produce the structural color through photolithography, achieving a glittering effect. Combine the methods of stamping and photolithography to apply the organza element to the mold; make the texture of the organza on the appearance effect of the mobile phone structural part through the UV texture; the flash point effect is realized by a quadrangular pyramid micro-structure, and the quadrangular pyramid micro-structure needs to meet the bottom side length of 160 - 180 um, the edge length of 110 - 130 um, and the height of 21 - 31 um.

[0063] Please refer to Figure 8 , the embodiment of the present application also provides a preparation method of a film material with a UV texture, Figure 8 is a schematic flowchart of another embodiment of the preparation method of the film material with a UV texture in the present application. The preparation method includes but is not limited to the following steps.

[0064] Step S100, provide a substrate.

[0065] Step S200, form a UV glue on the surface of the substrate.

[0066] Step S300, use a mold to transfer and form a UV texture pattern on the UV glue.

[0067] Step S400, cure the substrate with the formed UV texture pattern in a UV light environment.

[0068] Among them, for the detailed processes of steps S100 - S400, please refer to the relevant descriptions of the foregoing embodiments. Different from the foregoing embodiments, the preparation method of the film material with a UV texture in this embodiment further includes step S500, plating a brightening high - reflection film on the surface of the cured UV texture pattern.

[0069] Please refer to Figure 9 , Figure 9It is a schematic structural diagram of another embodiment of the present application with a UV texture film material. Among them, the coating thickness of the brightening and high-reflection film 204 is between 400-600 nm, specifically it can be 400 nm, 450 nm, 480 nm, 500 nm, 5500 nm, 600 nm, etc. The brightening and high-reflection film 204 can make the texture of the organdy more prominent. Among them, the brightening and high-reflection film 204 can be formed by NCVM (NCVM is also known as discontinuous coating technology or non-conductive electroplating technology, which is a high-tech originating from ordinary vacuum electroplating. Vacuum electroplating, abbreviated as VM, is the abbreviation of vacuummetallization). The coating material can be tin, indium, silicon-aluminum, etc.

[0070] The UV texture film material in this embodiment has the characteristics of prominent texture and high brightness, improving the product expressiveness.

[0071] Please refer to Figure 10 , the embodiment of the present application also provides a preparation method of a UV texture film material, Figure 10 It is a schematic process diagram of another embodiment of the preparation method of the UV texture film material of the present application. This preparation method includes but is not limited to the following steps.

[0072] Step S100, provide a substrate.

[0073] Step S200, form a UV glue on the surface of the substrate.

[0074] Step S300, use a mold to transfer and form a UV texture pattern on the UV glue.

[0075] Step S400, cure the substrate with the formed UV texture pattern in a UV light environment.

[0076] Step S500, deposit a brightening and high-reflection film on the surface of the cured UV texture pattern.

[0077] Different from the foregoing embodiment, the preparation method of the UV texture film material in this embodiment further includes step S600, screen-print an ink layer on the brightening and high-reflection film.

[0078] Please refer to Figure 11 , Figure 11 It is a schematic structural diagram of another embodiment of the UV texture film material of the present application. Screen-print the color we need on the brightening and high-reflection film, then cover it with a bottom masking ink and bake it. The baking temperature is 80 °C, and there are a total of 5 inks. The baking times are 20 min / 45 min / 45 min / 45 min / 60 min (corresponding to the first to fifth inks respectively), and finally our final solution is achieved. Figure 10 The label 205 in the figure is expressed as an ink layer.

[0079] In addition, an embodiment of the present application further provides a housing assembly. Please refer to Figure 12 , Figure 12 which is a schematic structural diagram of an embodiment of the housing assembly of the present application. Among them, the housing assembly 10 includes a substrate 100 and a film material 200 attached to the substrate 100. The film material 200 is obtained by the preparation method in the foregoing embodiment.

[0080] Furthermore, an embodiment of the present application further provides an electronic device. Please refer to Figure 13 and Figure 14 , Figure 13 which is a schematic structural diagram of an embodiment of the electronic device of the present application. Figure 14 is Figure 13 a schematic cross-sectional structural diagram of the electronic device in the embodiment at A-A. The electronic device in this embodiment may include a display screen module 30, a housing assembly 10, a control circuit board 20, and a middle frame 40. Among them, for the structure of the housing assembly 10, please refer to the relevant description in the foregoing embodiment.

[0081] Optionally, the housing assembly 10 may be the rear case or the battery cover of the electronic device. The display screen module 30 cooperates with the housing assembly 10 and the middle frame 40 to form an accommodation space 1000. The control circuit board 20 is disposed in the accommodation space 1000. The control circuit board 20 is electrically connected to the display screen module 30, and the control circuit board 20 is used to control the working state of the display screen module 30. The detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art and will not be elaborated here.

[0082] Please refer to Figure 15 , Figure 15 which is a schematic block diagram of the structural composition of an embodiment of the electronic device of the present application. The electronic device may be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. This embodiment is illustrated by taking a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen module 30 in the foregoing embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the foregoing embodiment), and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide electrical energy for the entire electronic device.

[0083] Specifically, the RF circuit 910 is used for receiving and transmitting signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., and is used for detecting user proximity signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 and are used for receiving and transmitting sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing the data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant descriptions in the above embodiments and will not be introduced in detail here.

[0084] In the electronic device of this embodiment, the diaphragm of the housing assembly is formed by using a UV transfer mold. The preparation method of the UV transfer mold is as follows: first, a main pattern is formed on the mold substrate; then a micro-structure pattern is formed on the main pattern. The mold prepared by this method can be used to prepare a diaphragm with a micro-structure pattern, and has the characteristics of simple process, delicate diaphragm effect and good compatibility.

[0085] The above are only some embodiments of the present application, and thus do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A preparation method of a UV transfer mold, characterized in that, the preparation method includes: providing a mold substrate; forming a main pattern on the mold substrate, and the main pattern is formed on the mold substrate by means of rubbing; forming a micro-structure pattern on the main pattern, and the micro-structure pattern is formed on the main pattern by means of exposure development and etching. The scale of the micro-structure pattern is smaller than that of the main pattern; the micro-structures in the micro-structure pattern are quadrangular pyramid micro-structures; the bottom length of the quadrangular pyramid micro-structure is 160-180um, the height is 21-32um, and the edge length is 110-130um.

2. The preparation method according to claim 1, characterized in that, before the step of forming the micro-structure pattern on the main pattern by means of exposure development and etching, it further includes: simulating the micro-structure pattern to be etched into a drawing; the step of forming the micro-structure pattern on the main pattern by means of exposure development and etching includes: forming the micro-structure pattern on the drawing on the main pattern by means of exposure development and etching.

3. A preparation method of a film material with a UV texture, characterized in that, the preparation method includes: providing a substrate; forming a UV glue on the surface of the substrate; transferring and forming a UV texture pattern on the UV glue by using the mold obtained by the preparation method according to claim 1 or 2; curing the substrate with the formed UV texture pattern in a UV light environment.

4. The preparation method according to claim 3, characterized in that, the preparation method further includes: plating a brightening and high-reflection film on the surface of the cured UV texture pattern; screen-printing an ink layer on the brightening and high-reflection film.

5. A film material with a UV texture, characterized in that, the film material is prepared by using the preparation method according to claim 3 or 4.

6. A housing assembly, characterized in that, the housing assembly includes a substrate and the film material according to claim 5 attached to the substrate.

7. An electronic device, characterized in that, the electronic device includes a display screen module, a control circuit board, and the housing assembly according to claim 6. The housing assembly and the display screen module cooperate to form an accommodation space, and the control circuit board is arranged in the accommodation space and is coupled to the display screen module for controlling the working state of the display screen module.

Images