Wafer handling method, robot and wafer dicing machine

Abstract

The present invention discloses a wafer handling method, a robot and a dicing machine, wherein the wafer handling method adopts a robot with an anti-drop mechanism to grab the wafer, the support hook of the anti-drop mechanism comprises a connecting plate, a support plate and a guide limit plate, the top surface of the support plate is horizontally arranged and lower than the bottom of the vacuum suction cup, the guide limit plate is obliquely arranged on the top surface of the support plate, and the horizontal distance from the lower end of the guide limit plate to the front end of the support plate is smaller than the horizontal distance from the upper end of the guide limit plate to the front end of the support plate; after or at the same time when the vacuum suction cup absorbs the frame of the wafer, the support plate is extended under the frame of the wafer, even if the wafer falls from the vacuum suction cup, the wafer falling from the vacuum suction cup can be effectively supported by a group of support plates, thereby avoiding its falling damage and ensuring the safety of the wafer; several guide limit plates can position and limit the wafer to ensure the position accuracy of the wafer on the robot, and then ensure the position accuracy of the wafer when it moves to the next position.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, in particular to a wafer handling method, a robot and a wafer dicing machine. Background Art

[0002] Slicing machines, ring cutting and ring removal machines, etc. are important equipment for wafer processing. These devices usually include multiple workstations, so the wafers need to be transferred between different workstations.

[0003] The structure disclosed in the Chinese invention patent application with application number 202210076307.4 is a commonly used wafer transfer structure, in which a vacuum suction cup is used to adsorb the frame of the wafer and then move the wafer.

[0004] During vacuum adsorption, a vacuum generator is usually used to generate a vacuum, and the vacuum generator requires an air source to work. However, when used on site, the air source may be interrupted or insufficient. The vacuum of the vacuum suction cup is insufficient, and the wafer cannot be stably adsorbed. If the wafer falls off the vacuum suction cup, it is easy to break, causing huge losses.

[0005] For example, the Chinese utility model patent with application number 202121747424.6 and authorization announcement number CN215363767U discloses a structure in which four linear motors are used to drive four anti-drop trays to prevent the optoelectronic display material adsorbed by the vacuum suction cup from falling.

[0006] However, when this structure is applied to wafer anti-dropping, when several anti-dropping pallets are in the anti-dropping position, it is necessary to maintain a certain gap between the vertical plate of each anti-dropping pallet and the wafer so that the wafer can effectively fall onto the flat plates of the anti-dropping pallets. This will cause the position of the wafer to easily shift when it falls onto the flat plate of the anti-dropping pallet, that is, the position of the wafer on the vacuum suction cup is inconsistent with the position of the wafer on the flat plate of the anti-dropping pallet, which affects the position accuracy of the wafer after discharge. Summary of the invention

[0007] The purpose of the present invention is to solve the above problems existing in the prior art and to provide a wafer handling method, a robot and a dicing machine.

[0008] The purpose of the present invention is achieved through the following technical solutions:

[0009] A wafer handling method, wherein a wafer is handled by a handling robot, wherein the handling robot comprises a manipulator and a moving mechanism for driving the manipulator to translate and lift, wherein the manipulator comprises a substrate, wherein four vacuum suction cups distributed in a rectangular shape are arranged on the substrate, and an anti-drop mechanism is also arranged on the substrate, wherein the anti-drop mechanism comprises a group of hooks and a hook driving device for driving the hooks to translate toward a wafer adsorbed by the vacuum suction cups;

[0010] The support hook comprises a connecting plate, a support plate and a guide limit plate, the connecting plate is connected to the support hook driving device, the top surface of the support plate is horizontally arranged and lower than the bottom of the vacuum suction cup, the guide limit plate is obliquely arranged on the top surface of the support plate, and the horizontal distance from the lower end of the guide limit plate to the front end of the support plate is smaller than the horizontal distance from the upper end of the guide limit plate to the front end of the support plate;

[0011] A horizontal plate is vertically arranged at each end of the substrate, and each of the horizontal plates is provided with two vacuum suction cups symmetrically distributed on both sides of the substrate, and each of the horizontal plates is also provided with two support hooks symmetrically distributed on both sides of the substrate, and each support hook is connected to a support hook driving device arranged on the horizontal plate, and the support hook driving device drives the support hook to translate in a direction perpendicular to the horizontal plate; the two horizontal plates are connected to an adjustment mechanism arranged on the substrate, and the adjustment mechanism drives the two horizontal plates to translate relative to the substrate to adjust the distance between the two horizontal plates;

[0012] After the vacuum suction cup moves down and contacts the frame of the wafer or after the vacuum suction cup absorbs the frame of the wafer, the hook driving device moves the front end of a group of the hook support plates from the outside of the frame to the inside of the frame, and then the moving mechanism drives the manipulator to move.

[0013] Preferably, the width of the support plate is 1.2-1.4 times the width of the border of the wafer.

[0014] Preferably, the height difference between the support plate and the wafer sucked by the vacuum chuck is between 1 mm and 1.5 mm;

[0015] When the support plate is located outside the wafer, the distance between the support plate and the wafer is between 2.5 mm and 3 mm;

[0016] When the front end of the support plate moves to the inner side of the wafer, the distance between the lower end of the guide limit plate and the wafer is between 0.5 mm and 0.8 mm.

[0017] Preferably, the angle between the guide limit plate and the support plate is between 105° and 110°.

[0018] Preferably, the vacuum suction cup is movably arranged on the horizontal plate up and down, and the vacuum suction cup is provided with a spring located below the horizontal plate, one end of the spring is connected to the horizontal plate, and the other end of the spring abuts against the step surface of the vacuum suction cup.

[0019] Preferably, the distance between the two supporting hooks located on one of the transverse plates is 0.8-0.85 times the side length of the wafer, and the two supporting hooks are symmetrically distributed on both sides of the substrate.

[0020] Preferably, the hook driving device is at least one of a cylinder, a linear motor and a servo linear module. When the hook driving device is a cylinder, the working pressure of the cylinder is between 0.18 and 0.2 MPa.

[0021] The robot comprises a base plate, four vacuum suction cups are arranged in a rectangular shape on the base plate, an anti-drop mechanism is also arranged on the base plate, the anti-drop mechanism comprises a group of hooks and a hook driving device for driving the hooks to move in translation, the hooks comprise a connecting plate, a support plate and a guide limit plate, the connecting plate is connected to the hook driving device, the top surface of the support plate is arranged horizontally and is lower than the bottom of the vacuum suction cup, the guide limit plate is arranged obliquely on the top surface of the support plate, and the horizontal distance from the lower end of the guide limit plate to the front end of the support plate is less than the distance from the upper end of the guide limit plate to the top surface of the support plate. The horizontal distance of the front end of the support plate; a horizontal plate is vertically arranged at both ends of the substrate, each of the horizontal plates is provided with two vacuum suction cups symmetrically distributed on both sides of the substrate, and each of the horizontal plates is also provided with two support hooks symmetrically distributed on both sides of the substrate, each support hook is connected to a support hook driving device arranged on the horizontal plate, and the support hook driving device drives the support hook to translate in a direction perpendicular to the horizontal plate; the two horizontal plates are connected to the adjustment mechanism arranged on the substrate, and the adjustment mechanism drives the two horizontal plates to translate relative to the substrate to adjust the distance between the two horizontal plates.

[0022] A dicing machine comprises the above-mentioned robot.

[0023] The advantages of the technical solution of the present invention are mainly reflected in:

[0024] The present invention adopts a manipulator with an anti-drop mechanism to grab the wafer. After or at the same time as the vacuum suction cup adsorbs the wafer, the support plate is extended under the wafer. Even when the wafer falls from the vacuum suction cup in the air, the wafer can be supported by a group of support plates, thereby preventing it from continuing to fall and being damaged, thereby ensuring the safety of the wafer; at the same time, the guide and limit plates on the support hooks can guide, position and limit the wafer that falls thereon, thereby ensuring the position accuracy of the wafer on the manipulator, and then ensuring the position accuracy of the wafer when it moves to the next position. It is particularly suitable for moving the wafer between a cutting station and a cleaning station and moving the wafer between a cleaning station and a degumming station.

[0025] The present invention can effectively ensure that the pallet stably supports and accurately positions the wafer by designing multiple parameters such as the angle between the guide limit plate and the pallet, the distance between the guide limit plate and the wafer when it is contracted, the width of the pallet, the distance between the support hooks, the lateral distance and the height difference between the pallet and the wafer, thereby ensuring that the robot can quickly, effectively, stably and accurately transfer the wafer.

[0026] The vacuum suction cup connection elastic structure of the present invention can effectively reduce the impact on the wafer during wafer adsorption and unloading, ensuring the safety of the wafer. At the same time, the spring can effectively seal the vacuum suction cup and the wafer during wafer adsorption, thereby ensuring the stability of adsorption.

[0027] The present invention arranges the vacuum suction cup and the supporting hook in pairs on the transverse plate, and connects the transverse plate to the adjustment mechanism, which can conveniently adjust the distance between the two transverse plates, so that the vacuum suction cup and the supporting hook can move synchronously to meet the transfer needs of wafers of different sizes, and the application is more flexible. At the same time, the adjustment mechanism can have only one power source, the structure is simpler, the use cost is lower, and the adjustment consistency is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a partial stereogram of the handling robot of the present invention;

[0029] Figure 2 is a bottom view of the robot of the present invention, in which only the frame of the wafer is shown;

[0030] Figure 3 It is a partial side view of the support hook of the robot of the present invention being located outside the wafer;

[0031] Figure 4 It is a partial side view of the support plate of the support hook of the robot of the present invention moving to the bottom of the frame of the wafer;

[0032] Figure 5 It is a top view of the manipulator of the present invention, in which the vacuum suction cup, the support hook and the support hook driving device are hidden. DETAILED DESCRIPTION

[0033] The purpose, advantages and features of the present invention will be illustrated and explained by the non-limiting description of the following preferred embodiments. These embodiments are only typical examples of the application of the technical solution of the present invention, and any technical solution formed by equivalent replacement or equivalent transformation falls within the scope of protection claimed by the present invention.

[0034] In the description of the scheme, it should be noted that the terms "center", "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of description and simplified description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. Moreover, in the description of the scheme, with the operator as a reference, the direction close to the operator is the proximal end, and the direction away from the operator is the distal end.

[0035] Example 1

[0036] The wafer handling method disclosed by the present invention is described below in conjunction with the accompanying drawings. Figure 1 -Attached Figure 4 As shown, the wafer handling method uses a handling robot to carry out wafer handling. The handling robot includes a manipulator 100 and a moving mechanism 200 for driving the manipulator 100 to translate and lift. The manipulator 100 includes a substrate 1, and four vacuum suction cups 2 distributed in a rectangular shape are arranged on the substrate 1. The substrate 1 is also provided with an anti-drop mechanism, and the anti-drop mechanism includes a group of hooks 3 and a hook driving device 4 for driving each of the hooks 3 to translate toward the wafer adsorbed by the vacuum suction cup 2. The hooks 3 include A connecting plate 31, a supporting plate 32 and a guide limit plate 33, wherein the connecting plate 31 is connected to the supporting hook driving device 4, and the supporting plate 32 and the connecting plate 31 are L-shaped. Of course, they can be in other feasible forms. The top surface of the supporting plate 32 is horizontally arranged and lower than the bottom of the vacuum suction cup 2, and the guide limit plate 33 is obliquely arranged on the top surface of the supporting plate 32, and the horizontal distance from the lower end of the guide limit plate 33 to the front end of the supporting plate 32 is smaller than the horizontal distance from the upper end of the guide limit plate 33 to the front end of the supporting plate 32;

[0037] Before the vacuum cup 2 moves down, Figure 3 As shown, the front end of the support plate 32 (the end facing the wafer) is located outside the wafer. When the vacuum chuck 2 moves down to contact the frame 300 of the wafer or the vacuum chuck 2 absorbs the frame 300 of the wafer, as shown in the attached figure Figure 4As shown, the hook driving device 4 moves the front end of the support plate 32 of a group of the hooks 3 from the outside of the frame to the inside of the frame, and then the moving mechanism 200 drives the manipulator 100 to move.

[0038] The robot 100 adopts this structure and extends the support plate 32 under the wafer after or while the vacuum suction cup 2 adsorbs the wafer. Even when the wafer is suspended in the air and the vacuum suction cup 2 is unstable or has no suction, the wafer falling from the vacuum suction cup 2 can still be effectively supported by a group of support plates 32, thereby preventing it from falling and being damaged, thereby ensuring the safety of the wafer; at the same time, several guide limit plates 33 can guide and limit the wafer, thereby ensuring the position accuracy of the wafer on the robot 100, and then ensuring the position accuracy of the subsequent wafer when it reaches the next position.

[0039] As attached Figure 3 As shown, in order to enable the support plate 32 to smoothly enter under the wafer adsorbed by the vacuum suction cup 2, the height difference L2 between the support plate 32 and the wafer adsorbed by the vacuum suction cup 2 is made between 1mm-1.5mm. Such a spacing design can also make the falling height of the wafer very small, thereby avoiding the wafer from colliding with the support plate 32 when falling onto the support plate 32 and causing damage, thereby ensuring the safety of the wafer.

[0040] As attached Figure 3 As shown, when the support plate 32 is located outside the frame 300 of the wafer, the distance L1 between the support plate 32 and the wafer is between 2.5 mm and 3 mm; such a distance design can effectively ensure that when the robot 100 is adsorbing, the support plate 32 can smoothly move from above the wafer to below the wafer, avoiding interference with the wafer or the workbench when the product placement position is offset. At the same time, the moving stroke of the support plate 32 can be effectively shortened.

[0041] In order to ensure that the support plate 32 can have as large a contact area with the wafer as possible so that the hook 3 can effectively support and limit the wafer, the width of the support plate 32 is 1.2-1.4 times the width of the border 300 of the wafer.

[0042] In order to ensure that the guide limit plate 33 can fully limit the wafer, and at the same time avoid the guide limit plate 33 generating a clamping force on the wafer and causing damage to the wafer when it moves toward the wafer, when the front end of the support plate 32 moves to the inner side of the wafer, the distance between the lower end of the guide limit plate 33 and the wafer is controlled between 0.5mm-0.8mm. Such a distance can effectively ensure the consistency of the position of the wafer on the several support hooks 3 and the position of the wafer on the vacuum suction cup 2.

[0043] As attached Figure 3As shown, due to the different lengths of the air supply pipelines and the different service cycles of the vacuum chucks 2, some of the vacuum chucks 2 may be unstable during adsorption, causing the stored wafers to tilt and fall. At this time, the position of the wafer after falling will be offset. In order to enable the guide limit plate 33 to meet the guidance and positioning needs of wafers in different tilt states as much as possible, the angle a between the guide limit plate 33 and the support plate 32 is between 105° and 110°.

[0044] As attached Figure 2 -Attached Figure 4 As shown, the substrate 1 can be a relatively large plate, and the vacuum suction cup 2 can be directly and vertically arranged on the substrate 1. More preferably, the substrate 1 is a long strip, and a horizontal plate 5 is respectively arranged at both ends of the substrate 1, and the length direction of each horizontal plate 5 is perpendicular to the length direction of the substrate 1, and two vacuum suction cups 2 are arranged on each horizontal plate 5, and the two vacuum suction cups 2 on each horizontal plate 5 are symmetrically arranged on both sides of the substrate 1.

[0045] As attached Figure 3 , Attachment Figure 4 As shown, in order to prevent the wafer from being damaged by a large impact when the vacuum suction cup 2 absorbs and releases the wafer, the vacuum suction cup 2 is preferably a side-inlet vacuum suction cup, and the vacuum suction cup 2 is arranged on the horizontal plate 5 so as to be movable up and down, and a baffle plate located above the horizontal plate 5 is arranged on the vacuum suction cup 2, and a spring 6 located below the horizontal plate 5 is mounted on the vacuum suction cup 2, one end of the spring 6 is connected to the bottom of the horizontal plate 5, and the other end of the spring 6 abuts against the step surface of the vacuum suction cup 2. Therefore, when the vacuum suction cup 2 moves down and contacts the frame 300 of the wafer, the vacuum suction cup 2 can move upward and compress the spring 6 for buffering, and at the same time, the reaction force of the spring 6 can press the vacuum suction cup 2 against the frame 300 of the wafer to ensure the sealing between the vacuum suction cup 2 and the wafer.

[0046] The number of the hooks 3 is preferably four and they are distributed in a rectangular shape. In one embodiment, the hooks 3 may be distributed on four sides of the wafer. In this case, the wafer may be square or round.

[0047] As attached Figure 2 As shown, there are four supporting hooks 3 and they are divided into two pairs, each pair of the supporting hooks 3 is arranged on one of the transverse plates 5, that is, a pair of the supporting hooks 3 are respectively arranged on the two transverse plates 5, and the spacing between the two supporting hooks 3 located on one of the transverse plates 5 is 0.8-0.85 times the side length of the rounded square wafer, and the two supporting hooks 3 located on one of the transverse plates 5 are symmetrically distributed on both sides of the substrate 1 and they are located on the outside of the two vacuum suction cups 2. This structure can effectively meet the stable support and limiting requirements of the square wafer.

[0048] As attached Figure 2 -Attached Figure 4 As shown, each of the hooks 3 is connected to a hook driving device 4, and the hook driving device 4 is arranged on the horizontal plate 5. The hook driving device 4 drives the hook 3 to translate in a direction perpendicular to the horizontal plate 5. The hook driving device 4 is at least one of a cylinder, a linear motor and a servo linear module. When the hook driving device 4 is a cylinder, an L-shaped baffle 7 covering the top and the outer side of the cylinder is arranged on the cylinder, and the working pressure of the cylinder is between 0.18 and 0.2 MPa. Such a working pressure can effectively avoid the situation where the vacuum suction cup 2 cannot stably adsorb the wafer due to excessive impact during the operation of the cylinder. At the same time, such a working pressure can make the cylinder work stably when the air pressure is unstable. Further, the cylinder can be a known cylinder with a self-locking function of air cut-off. The specific structure of the self-locking cylinder is a known technology and will not be repeated here.

[0049] Furthermore, since the wafers may have different sizes, the positions of the vacuum suction cup 2 and the hook 3 need to be adjusted to meet the needs of grabbing wafers of different sizes.

[0050] As attached Figure 5 As shown, the two transverse plates 5 are connected to the adjustment mechanism 8 arranged on the base plate 1, and the adjustment mechanism 8 drives the two transverse plates 5 to translate relative to the base plate 1 to adjust the distance between the two transverse plates 5, so as to realize the movement of the vacuum suction cups 2 and the hook driving device 4 arranged thereon.

[0051] As attached Figure 5 As shown, the transverse plate 5 can be slidably arranged on the guide rail 9 on the substrate 1, and the adjustment mechanism 8 can be two linear motors or servo linear modules, each linear motor or servo linear module is connected to a transverse plate 5, so that the two linear motors or servo linear modules can drive the two transverse plates 5 to move toward each other so that the distance between them is reduced, and correspondingly, the distance between the vacuum suction cups 2 and the hooks 3 on the two transverse plates 5 will be reduced accordingly, and small-sized wafers can be adsorbed at this time. When the two linear motors or servo linear modules drive the two transverse plates 5 to move in opposite directions, the distance between the two transverse plates 5 increases, and the distance between the vacuum suction cups 2 and the hooks 3 on the two transverse plates 5 will be increased accordingly, and large-sized wafers can be adsorbed at this time.

[0052] As attached Figure 5As shown, in order to reduce the power source, the adjustment mechanism 8 may include a driving wheel 81, a driven wheel 82, a belt 83, a motor 84 and two connecting parts 85. The driving wheel 81 may be connected to a motor 84 that drives it to rotate. The motor 84 may be a reduction motor and is arranged above the substrate 1. The rotating shaft of the motor is directly connected to the driving wheel 81 and drives the driving wheel to rotate. Of course, the driving wheel 81 may also be rotatably arranged on the substrate 1, and the driving wheel 81 may be connected to the motor 84 through a known gear transmission mechanism or a synchronous belt transmission mechanism 86.

[0053] The axes of the driving wheel 81 and the driven wheel 82 are perpendicular to the base plate 1, and the driven wheel 82 is rotatably arranged on the base plate 1. The belt 83 is mounted on the driving wheel 81 and the driven wheel 82, and the two connecting members 85 are connected to the first straight belt segment 831 and the second straight belt segment 832 of the belt 83. Each of the connecting members 85 is connected to one of the transverse plates 5, so that when the motor 84 drives the driving wheel 81 to rotate, the two connecting members 85 can be driven by the belt 83 to move in opposite directions or towards each other to adjust the distance between the two transverse plates 5.

[0054] As attached Figure 1 As shown, the specific structure of the moving mechanism 200 is a known technology, which can be a structure composed of a transverse servo linear module 210 and a longitudinal cylinder 220, that is, the longitudinal cylinder 220 is arranged on the moving block of the transverse servo linear module 210 through an L-shaped connector 230, and the longitudinal cylinder 220 is connected to the manipulator 100 through a connecting frame 240. The specific structure of the servo linear module is a known technology and will not be described here. Of course, the moving mechanism 200 can also be a four-axis robot or a six-axis robot.

[0055] Example 2

[0056] This embodiment discloses a dicing machine, including the robot arm 100 in the above embodiment.

[0057] There are many implementation methods of the present invention, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A wafer handling method, wherein a wafer is handled by a handling robot, wherein the handling robot comprises a manipulator and a moving mechanism for driving the manipulator to translate and lift, wherein the manipulator comprises a substrate, wherein four vacuum suction cups distributed in a rectangular shape are arranged on the substrate, and an anti-drop mechanism is also arranged on the substrate, wherein the anti-drop mechanism comprises a group of hooks and a hook driving device for driving the hooks to translate toward a wafer adsorbed by the vacuum suction cups, wherein: The support hook comprises a connecting plate, a support plate and a guide limit plate, the connecting plate is connected to the support hook driving device, the top surface of the support plate is horizontally arranged and lower than the bottom of the vacuum suction cup, the guide limit plate is obliquely arranged on the top surface of the support plate, and the horizontal distance from the lower end of the guide limit plate to the front end of the support plate is smaller than the horizontal distance from the upper end of the guide limit plate to the front end of the support plate; A horizontal plate is vertically arranged at each end of the substrate, and each of the horizontal plates is provided with two vacuum suction cups symmetrically distributed on both sides of the substrate, and each of the horizontal plates is also provided with two support hooks symmetrically distributed on both sides of the substrate, each support hook is connected to a support hook driving device arranged on the horizontal plate, and the support hook driving device drives the support hook to translate in a direction perpendicular to the horizontal plate; the two horizontal plates are connected to an adjustment mechanism arranged on the substrate, and the adjustment mechanism drives the two horizontal plates to translate relative to the substrate to adjust the spacing between the two horizontal plates; the adjustment mechanism includes a driving wheel, a driven wheel, a belt, a motor and two connecting parts, the driving wheel is connected to the motor driving it to rotate, the axes of the driving wheel and the driven wheel are perpendicular to the substrate, the driven wheel can be rotatably arranged on the substrate, the belt is mounted on the driving wheel and the driven wheel, the two connecting parts are connected to the first straight belt segment and the second straight belt segment of the belt, and each of the connecting parts is connected to one of the horizontal plates After the vacuum suction cup moves down and contacts the frame of the wafer or after the vacuum suction cup absorbs the frame of the wafer, the hook driving device moves the front end of a group of the hook support plates from the outside of the frame to the inside of the frame, and then the moving mechanism drives the manipulator to move.

2. The wafer handling method according to claim 1, characterized in that: The width of the support plate is 1.2-1.4 times the width of the frame.

3. The wafer handling method according to claim 1, characterized in that: The height difference between the support plate and the wafer sucked by the vacuum chuck is between 1 mm and 1.5 mm; When the support plate is located outside the wafer, the distance between the support plate and the wafer is between 2.5 mm and 3 mm; When the front end of the support plate moves to the inner side of the wafer, the distance between the lower end of the guide limit plate and the wafer is between 0.5 mm and 0.8 mm.

4. The wafer handling method according to claim 1, characterized in that: The included angle between the guide limiting plate and the supporting plate is between 105° and 110°.

5. The wafer handling method according to claim 1, characterized in that: The vacuum suction cup is movably arranged on the horizontal plate, and a spring located below the horizontal plate is mounted on the vacuum suction cup. One end of the spring is connected to the horizontal plate, and the other end of the spring abuts against the step surface of the vacuum suction cup.

6. The wafer handling method according to claim 1, characterized in that: The distance between the two supporting hooks on one of the transverse plates is 0.8-0.85 times the side length of the wafer.

7. The wafer handling method according to any one of claims 1 to 6, characterized in that: The hook driving device is at least one of a cylinder, a linear motor and a servo linear module. When the hook driving device is a cylinder, the working pressure of the cylinder is between 0.18 and 0.2 MPa.

8. A manipulator, comprising a base plate, on which four vacuum suction cups are arranged in a rectangular shape, and on which an anti-drop mechanism is also arranged, wherein the anti-drop mechanism comprises a group of hooks and a hook driving device for driving the hooks to translate, characterized in that: The support hook comprises a connecting plate, a support plate and a guide limit plate, the connecting plate is connected to the support hook driving device, the top surface of the support plate is horizontally arranged and lower than the bottom of the vacuum suction cup, the guide limit plate is obliquely arranged on the top surface of the support plate, and the horizontal distance from the lower end of the guide limit plate to the front end of the support plate is smaller than the horizontal distance from the upper end of the guide limit plate to the front end of the support plate; a horizontal plate is vertically arranged at both ends of the substrate, each of the horizontal plates is provided with two vacuum suction cups symmetrically distributed on both sides of the substrate, each of the horizontal plates is also provided with two support hooks symmetrically distributed on both sides of the substrate, each support hook is connected to a support hook driving device arranged on the horizontal plate, the support The hook driving device drives the support hook to translate along a direction perpendicular to the transverse plate; the two transverse plates are connected to an adjustment mechanism arranged on the base plate, and the adjustment mechanism drives the two transverse plates to translate relative to the base plate to adjust the distance between the two transverse plates; the adjustment mechanism includes a driving wheel, a driven wheel, a belt, a motor and two connecting parts, the driving wheel is connected to a motor that drives it to rotate, the axes of the driving wheel and the driven wheel are perpendicular to the base plate, the driven wheel is rotatably arranged on the base plate, the belt is mounted on the driving wheel and the driven wheel, the two connecting parts are connected to the first straight belt segment and the second straight belt segment of the belt, and each of the connecting parts is connected to one transverse plate.

9. A dicing machine, characterized in that: Including the robot described in claim 8.

Images