Sensor modules and electronic devices

Abstract

This invention discloses a sensor module and an electronic device. The sensor module includes: a substrate with a first through hole; a first housing disposed on the substrate, forming a first cavity between the first housing and the substrate; a first sensor disposed on the substrate and located in the first cavity; and a waterproof component including a first diaphragm and a second diaphragm disposed on the substrate with a gap between them. The projections of the first and second diaphragms on the substrate cover the first through hole. The first diaphragm has at least one first membrane hole, and the second diaphragm has at least one second membrane hole. The projection of the at least one first membrane hole on the second diaphragm is offset from the at least one second membrane hole. When the sensor module is in an underwater environment, the first diaphragm and the second diaphragm are bonded together to seal the first through hole. When the sensor module is not in an underwater environment, the first diaphragm and the second diaphragm are separated.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and more specifically, to a sensor module and electronic device. Background Technology

[0002] Currently, sensors are widely used in electronic devices. To meet the different functions of electronic devices, corresponding sensors are often set up. During the operation of sensors, the working environment can change. When a sensor is in an underwater environment, water can enter the sensor, causing it to malfunction. Summary of the Invention

[0003] One objective of this invention is to provide a new technical solution for sensor modules and electronic devices.

[0004] According to a first aspect of the present invention, a sensor module is provided, the sensor module comprising:

[0005] A substrate having a first through hole;

[0006] A first outer shell is disposed on the substrate, and a first cavity is formed between the first outer shell and the substrate;

[0007] A first sensor is disposed on the substrate and located in the first cavity;

[0008] A waterproof component, comprising a first membrane and a second membrane, wherein the first membrane and the second membrane are disposed on the substrate, a gap is provided between the first membrane and the second membrane, and the projections of the first membrane and the second membrane on the substrate cover the first through hole;

[0009] The first membrane has at least one first membrane pore, and the second membrane has at least one second membrane pore, wherein the projection of the at least one first membrane pore onto the second membrane is offset from the at least one second membrane pore.

[0010] When the sensor module is in an underwater environment, the first diaphragm and the second diaphragm are attached to form a seal for the first through hole;

[0011] When the sensor module is not in an underwater environment, the first diaphragm separates from the second diaphragm.

[0012] Optionally, the sensor module further includes a pressure sensor disposed on the substrate;

[0013] When the sensor module is in an underwater environment, the pressure sensor senses pressure, a first voltage exists between the first diaphragm and the second diaphragm, and the first diaphragm and the second diaphragm are close together;

[0014] When the first voltage is greater than or equal to the first threshold, the first diaphragm and the second diaphragm are attached together;

[0015] When the sensor module is not in an underwater environment, the pressure sensor does not sense pressure, and the first diaphragm separates from the second diaphragm.

[0016] Optionally, the sensor module further includes a first chip, which is electrically connected to the pressure sensor and to the first diaphragm and the second diaphragm.

[0017] When the pressure sensor senses pressure, the first chip applies a voltage to the first diaphragm and the second diaphragm to create the first voltage between the first diaphragm and the second diaphragm;

[0018] If the pressure sensor does not sense pressure, the first diaphragm separates from the second diaphragm.

[0019] Optionally, the sensor module further includes a second housing, which is disposed on the substrate, and a second cavity is formed between the second housing and the substrate, wherein the pressure sensor is disposed in the second cavity;

[0020] The second outer shell is provided with a second through hole, and the second cavity communicates with the external space of the second outer shell through the second through hole.

[0021] Optionally, the second housing is provided with a waterproof soft rubber covering the pressure sensor. The waterproof soft rubber divides the second cavity into a first sub-cavity and a second sub-cavity. The pressure sensor is located in the first sub-cavity, and the second sub-cavity is connected to the external space of the second housing through the second through hole.

[0022] Optionally, the second housing and the first housing are located on the same side of the substrate, and the second housing and the first housing are integrally formed.

[0023] Optionally, the pressure sensor and the first sensor are located on opposite sides of the substrate.

[0024] Optionally, at least one of the first membrane pore and the second membrane pore includes a plurality of micropores.

[0025] Optionally, the first sensor covers the first through hole, the back cavity of the first sensor communicates with the first through hole, and the waterproof component is located inside the back cavity.

[0026] Optionally, the waterproof component further includes a first substrate having a third through hole, the first through hole communicating with the third through hole, and the first membrane and the second membrane disposed within the third through hole.

[0027] According to a second aspect of the present invention, an electronic device is provided, the electronic device comprising a sensor module as described in the first aspect.

[0028] According to one embodiment of this disclosure, by setting a waterproof component to form a protection at the first through hole, water can be prevented from entering through the first through hole and damaging the device in the first cavity. When the sensor module is in an underwater environment, the first diaphragm and the second diaphragm are bonded together to form a waterproof layer to seal the first through hole and prevent water from entering through the first through hole. When the sensor module is not in an underwater environment, the first diaphragm and the second diaphragm are separated, and signals from the outside of the sensor module can enter the first cavity through the first diaphragm hole and the second diaphragm hole to be sensed by the first sensor, ensuring that the sensor module can work normally.

[0029] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0030] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0031] Figure 1 This is a schematic diagram of the structure of the waterproof component of the sensor module in an embodiment of the present invention when it is not subjected to water pressure.

[0032] Figure 2 This is a schematic diagram of the structure of the waterproof component of the sensor module under water pressure in an embodiment of the present invention.

[0033] Figure 3 This is a schematic diagram of the sensor module in another embodiment of the present invention.

[0034] Figure 4 This is a schematic diagram of the waterproof component of the sensor module in an embodiment of the present invention.

[0035] Figure 5 This is a schematic diagram of the structure of the second diaphragm of the sensor module in an embodiment of the present invention.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. Substrate; 10. First through-hole; 2. First outer shell; 20. First cavity; 3. First sensor; 30. Back cavity; 4. Waterproof component; 41. First diaphragm; 410. First membrane pore; 42. Second diaphragm; 420. Second membrane pore; 421. Micropore; 43. First substrate; 44. Pad; 5. Pressure sensor; 6. First chip; 7. Second outer shell; 70. Second through-hole; 8. Waterproof soft adhesive; 9. Second chip. Detailed Implementation

[0038] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0039] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0040] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0041] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0042] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0043] According to one embodiment of this disclosure, a sensor module is provided, such as... Figures 1-5 As shown, the sensor module includes:

[0044] Substrate 1, wherein the substrate is provided with a first through hole 10;

[0045] A first outer shell 2 is disposed on the substrate 1, and a first cavity 20 is formed between the first outer shell 2 and the substrate 1.

[0046] The first sensor 3 is disposed on the substrate 1 and located in the first cavity 20.

[0047] Waterproof component 4, the waterproof component 4 includes a first membrane 41 and a second membrane 42, the first membrane 41 and the second membrane 42 are disposed on the substrate 1, there is a gap between the first membrane 41 and the second membrane 42, and the projection of the first membrane 41 and the second membrane 42 on the substrate 1 covers the first through hole 10.

[0048] The first diaphragm 41 has at least one first membrane hole 410, and the second diaphragm 42 has at least one second membrane hole 420. The projection of the at least one first membrane hole 410 onto the second diaphragm 42 is offset from the at least one second membrane hole 420. Signals entering the first cavity 20 through the first through hole 10 must pass through the first membrane hole 410 on the first diaphragm 41 and the second membrane hole 420 on the second diaphragm 42 before entering the first cavity 20.

[0049] When the sensor module is in an underwater environment, such as Figure 2 As shown, the first membrane 41 and the second membrane 42 are attached to form a seal for the first through hole 10, preventing water from entering the first cavity 20 through the first through hole 10.

[0050] Optionally, the areas where the first diaphragm 41 and the second diaphragm 42 are attached are: the area of ​​the first diaphragm 41 with the first membrane hole 410 and the area of ​​the second diaphragm 42 with the second membrane hole 420.

[0051] Because the first membrane pore 410 on the first diaphragm 41 and the second membrane pore 420 on the second diaphragm 42 are staggered, when the first diaphragm 41 and the second diaphragm 42 are in contact, the first membrane pore 410 is blocked by the non-porous area of ​​the second diaphragm 42, and the second membrane pore 420 is blocked by the non-porous area of ​​the first diaphragm 41, thus forming a sealed waterproof membrane layer. This waterproof membrane layer seals the first through hole 10, preventing water from the outside of the sensor module from entering the first cavity 20 through the first through hole 10, thereby preventing water ingress that could cause the first sensor 3 to malfunction and ensuring the normal operation of the sensor module.

[0052] If the sensor module is not in an underwater environment, such as Figure 1 As shown, the first membrane 41 is separated from the second membrane 42.

[0053] Because there is a gap between the first diaphragm 41 and the second diaphragm 42, when the first diaphragm 41 and the second diaphragm 42 are separated, the first diaphragm aperture 410 and the second diaphragm aperture 420 are connected through this gap, thereby connecting the first cavity 20 with the first through hole 10. This allows a signal to enter through the first through hole 10 and pass through the first diaphragm 41 and the second diaphragm 42 into the first cavity 20, where it is sensed by the first sensor 3. For example, an audio signal enters the first through hole 10 and then passes through the second diaphragm aperture 420 and the first diaphragm aperture 410 into the first cavity 20, where it is picked up by the first sensor 3.

[0054] In one embodiment, such as Figures 1-3 As shown, the sensor module also includes a pressure sensor 5, which is disposed on the substrate 1;

[0055] When the sensor module is in an underwater environment, the pressure sensor 5 senses pressure, and a first voltage is applied between the first diaphragm 41 and the second diaphragm 42, bringing them closer together. The greater the pressure sensed by the pressure sensor 5, the greater the first voltage between the first diaphragm 41 and the second diaphragm 42. For example, by acquiring the pressure value of the pressure sensor 5 and applying a voltage to the first diaphragm 41 and the second diaphragm 42 according to the pressure value, a greater voltage is applied for a greater pressure value. As the value of the first voltage increases, the first diaphragm 41 and the second diaphragm 42 move closer together.

[0056] When the first voltage is greater than or equal to the first threshold, the first diaphragm 41 and the second diaphragm 42 are bonded together. When the first voltage reaches the first threshold, the first diaphragm 41 and the second diaphragm 42 are bonded together. When the first voltage is greater than the first threshold, the first diaphragm 41 and the second diaphragm 42 remain bonded together.

[0057] Optionally, the maximum voltage between the first diaphragm 41 and the second diaphragm 42 is set to a first threshold to avoid excessive voltage applied between the first diaphragm 41 and the second diaphragm 42, which could damage the diaphragms.

[0058] When the sensor module is not in an underwater environment, the pressure sensor 5 does not sense pressure, and the first diaphragm 41 separates from the second diaphragm 42.

[0059] When pressure sensor 5 does not detect pressure, no voltage is applied to the first diaphragm 41 and the second diaphragm 42 to maintain a gap between them. Sound signals can then enter the first cavity 20 normally, ensuring the normal operation of the first sensor 3.

[0060] Optionally, the first sensor 3 is a MEMS chip used to sense sound signals. A second chip 9 is also provided on the substrate 1. The second chip 9 is electrically connected to the first sensor 3 and is used to process the signals sensed by the first sensor 3.

[0061] In one embodiment, such as Figures 1-5 As shown, at least one of the first membrane pore 410 and the second membrane pore 420 includes a plurality of micropores 421. Figure 5 The second membrane pore 420 shown in the figure includes multiple micropores 421 as an example for illustration.

[0062] During the process of the sensor module being submerged in water and placed in an underwater environment, the water pressure at the sensor module's location gradually increases. When the water pressure is low, the first diaphragm 41 and the second diaphragm 42 cannot adhere tightly. In this case, water will enter the first cavity 20 through the first membrane hole 410 and the second membrane hole 420.

[0063] In this embodiment, at least one of the first membrane pore 410 and the second membrane pore 420 includes a plurality of micropores 421. Under low water pressure, water cannot pass through the micropores 421, thereby preventing water from entering the first cavity 20.

[0064] Taking the second membrane aperture 420, which includes multiple micropores 421, as an example, when the sensor module is in a small underwater environment, the first membrane 41 and the second membrane 42 are not attached. The multiple micropores 421 will isolate water on the outside of the second membrane 42, preventing water from entering between the first membrane 41 and the second membrane 42 through the second membrane aperture 420 and then entering the first cavity through the first membrane aperture 410.

[0065] For example, when the pressure sensor 5 senses water pressure, the voltage between the first diaphragm 41 and the second diaphragm 42 is not yet sufficient to make the first diaphragm 41 and the second diaphragm 42 adhere together. The micropores 421 can prevent water from entering the first cavity 20.

[0066] In one embodiment, the sensor module further includes a first chip 6, which is electrically connected to the pressure sensor 5 and to the first diaphragm 41 and the second diaphragm 42.

[0067] When the pressure sensor 5 senses pressure, the first chip 6 applies a voltage to the first diaphragm 41 and the second diaphragm 42 so that the first diaphragm 41 and the second diaphragm 42 have the first voltage.

[0068] When the pressure sensor 5 does not sense pressure, the first diaphragm 41 separates from the second diaphragm 42.

[0069] In this embodiment, the pressure data received by the pressure sensor 5 is acquired by the first chip 6, and a voltage is applied to the first diaphragm 41 and the second diaphragm 42 based on the pressure data. For example, the first chip 6 is an ASIC chip.

[0070] For example, when the sensor module is in an underwater environment, water pressure acts on the pressure sensor 5. The first chip 6 acquires the water pressure data sensed by the pressure sensor 5 and applies voltage to the first diaphragm 41 and the second diaphragm 42 according to the water pressure data.

[0071] In one embodiment, such as Figures 1-3 As shown, the sensor module also includes a second housing 7, which is disposed on the substrate 1, and a second cavity is formed between the second housing 7 and the substrate 1. The pressure sensor 5 is disposed in the second cavity.

[0072] The second outer shell 7 is provided with a second through hole 70, and the second cavity communicates with the external space of the second outer shell 7 through the second through hole 70.

[0073] In this embodiment, the second housing 7 protects the pressure sensor 5 from impact damage.

[0074] Optionally, the second housing 7 is a metal housing, which provides shielding protection for the pressure sensor 5 and prevents external signals from interfering with the pressure sensor 5.

[0075] Water can enter the second cavity through the second through hole 70 and act on the pressure sensor 5.

[0076] In one embodiment, such as Figures 1-3 As shown, the second housing 7 is provided with a waterproof soft rubber 8, which covers the pressure sensor 5. The waterproof soft rubber 8 divides the second cavity into a first sub-cavity and a second sub-cavity. The pressure sensor 5 is located in the first sub-cavity, and the second sub-cavity is connected to the external space of the second housing 7 through the second through hole 70.

[0077] In this embodiment, the waterproof adhesive 8 seals and isolates the pressure sensor 5 within the first sub-cavity, preventing water entering through the second through-hole 70 from directly contacting the pressure sensor 5 and thus avoiding water-induced failure of the pressure sensor 5. External water pressure can act on the waterproof adhesive 8 and then on the pressure sensor 5.

[0078] In one embodiment, such as Figure 3 As shown, the second outer shell 7 and the first outer shell 2 are located on the same side of the substrate 1, and the second outer shell 7 and the first outer shell 2 are integrally formed.

[0079] In this embodiment, the first housing 2 and the second housing 7 are located on the same side of the substrate 1, so that adding the second housing 7 does not increase the thickness of the sensor module. The first housing 2 and the second housing 7 are integrally formed, which simplifies the structure of the sensor module.

[0080] In one embodiment, such as Figure 1 , Figure 2 As shown, the pressure sensor 5 and the first sensor 3 are located on opposite sides of the substrate 1.

[0081] In this embodiment, the sound signal enters the first cavity 20 through the first through hole 10 and is received by the first sensor 3. The position of the first through hole 10, which communicates with the outside, is located on the side of the substrate 1 opposite to the first sensor 3. By placing the pressure sensor 5 and the first sensor 3 on opposite sides, the pressure sensor 5 and the position where the sound signal enters the first through hole 10 are on the same side. During the process of the sensor module entering the underwater environment, when water enters the first through hole 10, the pressure sensor 5 located on the same side can synchronously sense the water pressure, thereby enabling the first diaphragm 41 and the second diaphragm 42 to adhere in time, thereby forming a seal for the first through hole 10.

[0082] In one embodiment, such as Figures 1-3 As shown, the first sensor 3 covers the first through hole 10, the back cavity 30 of the first sensor 3 is connected to the first through hole 10, and the waterproof component 4 is located inside the back cavity 30.

[0083] In this embodiment, the sound signal, after passing through the first through-hole 10, can act on the first sensor 3 after passing through the back cavity 30. The waterproof component 4 forms a protective barrier within the back cavity 30, preventing water from entering through the first through-hole 10. The waterproof component 4 being located in the back cavity 30 reduces the increase in the size of the sensor module.

[0084] Optionally, the waterproof component 4 can also be disposed on the side of the substrate 1 opposite to the first sensor 3.

[0085] In one embodiment, such as Figures 1-3 As shown, the waterproof component 4 further includes a first substrate 43, the first substrate 43 having a third through hole, the first through hole 10 communicating with the third through hole, and the first membrane 41 and the second membrane 42 disposed in the third through hole.

[0086] In this embodiment, the first substrate 43 is disposed on the substrate 1 as a support structure for the first diaphragm 41 and the second diaphragm 42. The first substrate 43 forms a third through hole. The sound signal entering through the first through hole 10 enters the third through hole and then enters the back cavity 30 through the first membrane hole 410 and the second membrane hole 420.

[0087] In one embodiment, a pad 44 is provided on the first substrate 43, and the waterproof component 4 is electrically connected to the substrate 1 through the pad 44.

[0088] For example, the first substrate 43 is provided with pads 44 corresponding to the first diaphragm 41 and the second diaphragm 42, and the first diaphragm 41 and the second diaphragm 42 are each electrically connected to the first chip 6 through the pads 44.

[0089] According to one embodiment of the present disclosure, an electronic device is provided, the electronic device including a sensor module as described in any one of the embodiments of the present disclosure.

[0090] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0091] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A sensor module, characterized in that, include: A substrate having a first through hole; A first outer shell is disposed on the substrate, and a first cavity is formed between the first outer shell and the substrate; A first sensor is disposed on the substrate and located in the first cavity; A waterproof component, comprising a first membrane and a second membrane, wherein the first membrane and the second membrane are disposed on the substrate, a gap is provided between the first membrane and the second membrane, and the projections of the first membrane and the second membrane on the substrate cover the first through hole; The first membrane has at least one first membrane pore, and the second membrane has at least one second membrane pore, wherein the projection of the at least one first membrane pore onto the second membrane is offset from the at least one second membrane pore. A pressure sensor, wherein the pressure sensor is disposed on the substrate; When the sensor module is in an underwater environment, the pressure sensor senses pressure, and a first voltage exists between the first diaphragm and the second diaphragm, and the first diaphragm and the second diaphragm are close together; when the first voltage is greater than or equal to a first threshold, the first diaphragm and the second diaphragm adhere to each other to form a seal for the first through hole; When the sensor module is not in an underwater environment, the pressure sensor does not sense pressure, and the first diaphragm separates from the second diaphragm.

2. The sensor module according to claim 1, characterized in that, The sensor module further includes a first chip, which is electrically connected to the pressure sensor and to the first diaphragm and the second diaphragm. When the pressure sensor senses pressure, the first chip applies a voltage to the first diaphragm and the second diaphragm to create the first voltage between the first diaphragm and the second diaphragm; If the pressure sensor does not sense pressure, the first diaphragm separates from the second diaphragm.

3. The sensor module according to claim 1, characterized in that, The sensor module further includes a second housing, which is disposed on the substrate, and a second cavity is formed between the second housing and the substrate, wherein the pressure sensor is disposed in the second cavity; The second outer shell is provided with a second through hole, and the second cavity communicates with the external space of the second outer shell through the second through hole.

4. The sensor module according to claim 3, characterized in that, The second housing is provided with waterproof soft rubber, which covers the pressure sensor and divides the second cavity into a first sub-cavity and a second sub-cavity. The pressure sensor is located in the first sub-cavity, and the second sub-cavity is connected to the external space of the second housing through the second through hole.

5. The sensor module according to claim 3, characterized in that, The second outer shell and the first outer shell are located on the same side of the substrate, and the second outer shell and the first outer shell are integrally formed.

6. The sensor module according to claim 1, characterized in that, The pressure sensor and the first sensor are located on opposite sides of the substrate.

7. The sensor module according to claim 1, characterized in that, At least one of the first membrane pore and the second membrane pore includes a plurality of micropores.

8. The sensor module according to claim 1, characterized in that, The first sensor covers the first through hole, the back cavity of the first sensor communicates with the first through hole, and the waterproof component is located inside the back cavity.

9. The sensor module according to claim 1, characterized in that, The waterproof component further includes a first substrate, the first substrate having a third through hole, the first through hole communicating with the third through hole, and the first membrane and the second membrane disposed within the third through hole.

10. An electronic device, characterized in that, The electronic device includes a sensor module as described in any one of claims 1-9.

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