Welding spot data analysis method, device, equipment and storage medium

Abstract

The present application relates to the technical field of data processing, and particularly relates to a welding point data analysis method, device, equipment and storage medium. The method comprises the following steps: acquiring a first welding point data set and a second welding point data set of a target vehicle model; determining at least one welding point binding pair based on the first welding point data set and the second welding point data set; comparing the attribute features of the first welding point and the second welding point in each welding point binding pair respectively to acquire the change content and the change amount corresponding to each welding point binding pair respectively, wherein the change content comprises the attribute features of the first welding point and the second welding point that have changed, and the change amount is used to indicate the change degree of the first welding point and the second welding point; and acquiring the analysis result of welding point changes under different data versions based on the change content and the change amount of the welding point binding pair. The present application is used to solve the defect that the welding point data analysis result in the prior art cannot comprehensively and accurately reflect the welding point changes under different data versions.

Description

Technical Field

[0001] This invention relates to the field of data processing technology, and in particular to a method, apparatus, device, and storage medium for analyzing solder joint data. Background Technology

[0002] In the field of vehicle manufacturing, welding is an important manufacturing process. Specifically, welding is required to join various parts to form the body-in-white. During design and production, weld point definitions undergo various changes; for example, weld points on a component of the same vehicle model may be moved, replaced, added, or deleted. However, identifying these changes requires comparative analysis of the old and new versions of weld point data. Current technologies for processing weld point data rely solely on simple location classification and field-by-field comparison of all historical weld point data. This data analysis fails to comprehensively and accurately reflect the actual changes in weld points across different data versions, resulting in poor usability of the analysis results and an inability to guide design and process engineers in identifying changes and their content. Summary of the Invention

[0003] This invention provides a solder joint data analysis method, apparatus, device, and storage medium to address the shortcomings of existing technologies where solder joint data analysis results cannot comprehensively and accurately reflect changes in solder joints across different data versions.

[0004] This invention provides a method for analyzing solder joint data, comprising:

[0005] Obtain a first weld point dataset and a second weld point dataset for the target vehicle model. The first and second weld point datasets correspond to different data versions. The first weld point dataset includes at least one first weld point, and the second weld point dataset includes at least one second weld point. Based on the first and second weld point datasets, determine at least one weld point binding pair. Each weld point binding pair includes one first weld point and one second weld point. Compare the attribute features of the first and second weld points in each weld point binding pair to obtain the change content and change amount corresponding to each weld point binding pair. The change content includes the attribute features of the first and second weld points that have changed, and the change amount indicates the degree of change in the first and second weld points. Based on the change content and change amount of the weld point binding pairs, obtain the analysis results of weld point changes under different data versions.

[0006] According to a solder joint data analysis method provided by the present invention, the step of determining at least one solder joint binding pair based on a first solder joint dataset and a second solder joint dataset includes: obtaining a first solder joint name for each first solder joint from the first solder joint dataset; obtaining a second solder joint name for each second solder joint from the second solder joint dataset; and determining at least one solder joint binding pair based on the first solder joint name and the second solder joint name.

[0007] According to a solder joint data analysis method provided by the present invention, after comparing the attribute features of the first solder joint and the second solder joint in each solder joint binding pair and obtaining the change amount corresponding to each solder joint binding pair, the method further includes: unbinding the solder joint binding pairs whose change amount is greater than a change threshold; obtaining a first welding feature of each unbound first solder joint from the first solder joint dataset; obtaining a second welding feature of each unbound second solder joint from the second solder joint dataset; and redetermining at least one solder joint binding pair based on the first welding feature and the second welding feature.

[0008] According to a solder joint data analysis method provided by the present invention, the step of comparing the attribute features of the first solder joint and the second solder joint in each solder joint bond pair to obtain the change amount corresponding to each solder joint bond pair includes: for each solder joint bond pair: obtaining the board overlap change amount of the first solder joint and the second solder joint, wherein the board overlap change amount is used to indicate the degree of change between the board material overlapped by the first solder joint and the board material overlapped by the second solder joint; obtaining the welding feature change amount of the first solder joint and the second solder joint, wherein the welding feature change amount is used to indicate the degree of change between the welding features of the first solder joint and the welding features of the second solder joint; obtaining the attribution feature change amount of the first solder joint and the second solder joint, wherein the attribution feature change amount is used to indicate the degree of change between the attribution features of the first solder joint and the attribution features of the second solder joint; and obtaining the change amount based on the sum of the board overlap change amount, the welding feature change amount, and the attribution feature change amount.

[0009] According to a solder joint data analysis method provided by the present invention, the step of obtaining the sheet metal overlap change amount of the first solder joint and the second solder joint includes: obtaining first sheet metal overlap information corresponding to the first solder joint, wherein the first sheet metal overlap information includes material property information and overlap relationship information of each sheet metal connected through the first solder joint; obtaining second sheet metal overlap information corresponding to the second solder joint, wherein the second sheet metal overlap information includes material property information and overlap relationship information of each sheet metal connected through the second solder joint; comparing the first sheet metal overlap information and the second sheet metal overlap information to obtain a sheet metal overlap comparison result; and quantifying the sheet metal overlap comparison result to obtain the sheet metal overlap change amount.

[0010] According to a solder joint data analysis method provided by the present invention, the step of obtaining the welding feature change amount of the first solder joint and the second solder joint includes: obtaining a first welding feature corresponding to the first solder joint, wherein the first welding feature includes welding information possessed by the first solder joint; obtaining a second welding feature corresponding to the second solder joint, wherein the second welding feature includes welding information possessed by the second solder joint; comparing the first welding feature and the second welding feature, and calculating the welding feature change amount.

[0011] According to a solder joint data analysis method provided by the present invention, the step of obtaining the welding feature change amount of the first solder joint and the second solder joint includes: obtaining a first attribution feature corresponding to the first solder joint, wherein the first attribution feature includes the attribution information of the first solder joint; obtaining a second attribution feature corresponding to the second solder joint, wherein the second attribution feature includes the attribution information of the second solder joint; comparing the first attribution feature and the second attribution feature, and calculating the attribution feature change amount.

[0012] The present invention also provides a weld point data analysis device, comprising: an acquisition module for acquiring a first weld point dataset and a second weld point dataset of a target vehicle model, wherein the first weld point dataset and the second weld point dataset correspond to different data versions, the first weld point dataset includes at least one first weld point, and the second weld point dataset includes at least one second weld point; a binding module for determining at least one weld point binding pair based on the first weld point dataset and the second weld point dataset, wherein any weld point binding pair includes one first weld point and one second weld point; a comparison module for comparing the attribute features of the first weld point and the second weld point in each weld point binding pair, and acquiring the change content and change amount corresponding to each weld point binding pair, wherein the change content includes the attribute features of the first weld point and the second weld point that have changed, and the change amount is used to indicate the degree of change of the first weld point and the second weld point; and a result output module for acquiring the analysis results of weld point changes under different data versions based on the change content and the change amount of the weld point binding pair.

[0013] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the solder joint data analysis method as described above.

[0014] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the solder joint data analysis method as described above.

[0015] The present invention provides a weld point data analysis method, apparatus, device, and storage medium that acquires a first weld point dataset and a second weld point dataset for a target vehicle model; determines at least one weld point binding pair based on the first and second weld point datasets; compares the attribute characteristics of the first and second weld points in each weld point binding pair to obtain the change content and change amount corresponding to each weld point binding pair; and obtains the analysis results of weld point changes under different data versions based on the change content and change amount of the weld point binding pairs. In this process, for weld point data of different data versions, a first weld point dataset and a second weld point dataset are established respectively, and weld point binding pairs are determined from the first and second weld point datasets. By using weld point binding pairs, the attribute characteristics of the first and second weld points can be compared more accurately, improving the accuracy of the comparison results. Simultaneously, based on the first and second weld point datasets, one or more weld point binding pairs can be determined, achieving comprehensive comparison of weld point attribute characteristics between the two datasets. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is one of the flowcharts illustrating the solder joint data analysis method provided by the present invention;

[0018] Figure 2 This is the second flowchart of the solder joint data analysis method provided by the present invention;

[0019] Figure 3 This is a schematic diagram of the weld joint data analysis device provided by the present invention;

[0020] Figure 4 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0022] The solder joint data analysis method provided by this invention can be implemented through a software algorithm, which can run on any device with data processing capabilities, such as a server, computer, or smart mobile device. The following is in conjunction with... Figures 1 to 2 The solder joint data analysis method of the present invention is described.

[0023] In one embodiment, such as Figure 1 As shown, the workflow steps for implementing the solder joint data analysis method are as follows:

[0024] Step 101: Obtain the first weld point dataset and the second weld point dataset of the target vehicle model. The first weld point dataset and the second weld point dataset correspond to different data versions. The first weld point dataset includes at least one first weld point, and the second weld point dataset includes at least one second weld point.

[0025] In this embodiment, during vehicle generation, actual welding needs to be implemented according to a predefined welding scheme, which originates from the vehicle's product design. For the same vehicle model, different data versions of the weld point definition scheme will be released at various stages of product design, depending on needs and actual circumstances. The weld point definitions in different data versions may change. By analyzing the changes in weld points across different data versions, the obtained analysis results can guide design engineers and process engineers to identify the points and content of these changes.

[0026] Specifically, any attribute of a solder joint may change across different data versions. For example, the solder joint name, sheet metal overlap, solder joint coordinates, and weld length may vary. More specifically, solder joint data for the same data version can be stored in the corresponding solder joint dataset. The solder joint dataset can record the attribute characteristics of each solder joint using different fields, with each field forming a data record. The first and second solder joint datasets correspond to different data versions. Furthermore, the solder joint dataset can be implemented using a Bill of Materials (BOM) table.

[0027] In this embodiment, for a single solder joint, the various fields can be categorized according to actual conditions and needs, that is, the attribute features can be classified. For example, all fields of the solder joint can be divided into four categories: solder joint name, lap relationship, welding characteristics, and solder joint affiliation. Categorizing numerous fields and then analyzing based on these categories, compared to comparing each field individually, can more comprehensively and accurately reflect the actual changes in solder joints across different data versions.

[0028] Furthermore, the solder joint name includes a pre-defined solder joint number and a data version number. The solder joint number is a number assigned by the staff to a specific location of the solder joint; this number can be numbers, letters, Chinese characters, or any other form of text. The data version number is a number assigned by the staff to the data version; this number can be numbers, letters, Chinese characters, or any other form of text.

[0029] Overlap relationships refer to the relationship data generated when two or more sheet metals are spliced ​​and welded together via weld points. Specifically, overlap relationships can include any one or more of the following: sheet metal (or vehicle part) code, the material of the overlapped sheet metals, the thickness of the overlapped sheet metals, the plating of the overlapped sheet metals, and the overlap sequence of the overlapped sheet metals. Overlap relationships contain relevant information for each sheet metal being welded together.

[0030] Welding features represent the welding characteristics of the weld joint itself. Specifically, welding features can include any one or more of the following: weld joint coordinates, weld joint type, weld joint diameter, and weld length (also known as adhesive joint length).

[0031] Weld point attribution refers to the attribution relationship between a weld point and a vehicle. Specifically, weld point attribution can include any one or more of the following: the set of vehicle models to which the weld point belongs, the vehicle component (or region) to which the weld point belongs, the importance of the weld point, and whether the weld point is a critical weld point.

[0032] Of course, the above data classification is only one possible classification. Staff can classify the data according to other rules based on actual circumstances and needs. The number of data categories and the specific content of each category can be set separately.

[0033] Step 102: Based on the first solder joint dataset and the second solder joint dataset, determine at least one solder joint binding pair, wherein any solder joint binding pair includes a first solder joint and a second solder joint.

[0034] In this embodiment, comparing weld point data at the same location on different vehicles of the same model can better reflect whether the weld points have changed and the specific details of the changes. Therefore, weld points in the first and second weld point datasets can be matched pairwise. Successfully matched first and second weld points are bound into a weld point binding pair. The features of the weld point binding pair are then analyzed to obtain the analysis results.

[0035] In one embodiment, the process of matching the first solder joint and the second solder joint can be achieved through solder joint names. Specifically, based on the first solder joint dataset and the second solder joint dataset, at least one solder joint binding pair is determined, and the process is as follows: obtain the first solder joint name of each first solder joint from the first solder joint dataset; obtain the second solder joint name of each second solder joint from the second solder joint dataset; and determine at least one solder joint binding pair based on the first solder joint name and the second solder joint name.

[0036] In this embodiment, the weld point name includes the weld point number and the data version number. Generally, for different data versions of the same vehicle model, weld points at the same location have the same weld point number. Even if the data version number changes, the weld point number at the same location will not change. Therefore, the first weld point and the second weld point can be matched using the weld point name. When any first weld point successfully matches any second weld point, the first weld point and the second weld point are bound together to obtain a corresponding weld point binding pair.

[0037] In this embodiment, after determining all solder joint binding pairs in the first and second solder joint datasets through the above process, the first solder joint dataset may still have at least one unbound first solder joint remaining. Therefore, the unbound first solder joint in the first solder joint dataset is classified as a deleted solder joint. Similarly, the second solder joint dataset may still have at least one unbound second solder joint remaining. Therefore, the unbound second solder joint in the second solder joint dataset is classified as a newly added solder joint. The classified deleted and newly added solder joints facilitate subsequent solder joint analysis.

[0038] In one embodiment, after determining at least one solder joint binding pair, it is necessary to compare the attribute features of the first solder joint and the second solder joint in each solder joint binding pair, obtain the change amount corresponding to each solder joint binding pair, and then unbind the solder joint binding pairs whose change amount is greater than the change threshold; obtain the first welding feature of each unbound first solder joint from the first solder joint dataset; obtain the second welding feature of each unbound second solder joint from the second solder joint dataset; and redetermine at least one solder joint binding pair based on the first welding feature and the second welding feature.

[0039] In this embodiment, for different data versions of the same vehicle model, there may be solder joints in different locations with the same solder joint number. For example, when the data version is updated, a solder joint is deleted, and the number of the deleted solder joint is then used by a newly added solder joint, resulting in solder joints in different locations having the same solder joint number. The analysis results obtained after performing binding analysis on the first and second solder joints in different locations show that, by comparing the change amount with the change threshold, incorrect solder joint binding pairs can be identified and unbound.

[0040] In this embodiment, for different vehicles of the same model, there may be first and second weld points at the same location, but with different weld point numbers. In this case, it is impossible to determine all weld point binding pairs based on the weld point name alone. However, by comparing the first and second welding features, the first and second weld points with different numbers but the same location can be identified from the unbound first and second weld points. This allows for the identification of all weld point binding pairs, resulting in more comprehensive analysis results obtained through weld point binding pairs.

[0041] Step 103: Compare the attribute characteristics of the first solder joint and the second solder joint in each solder joint binding pair, and obtain the change content and change amount corresponding to each solder joint binding pair. The change content includes the attribute characteristics of the first solder joint and the second solder joint that have changed, and the change amount is used to indicate the degree of change of the first solder joint and the second solder joint.

[0042] In this embodiment, after determining the solder joint bonding pair, a targeted comparative analysis is performed on the first and second solder joints. Specifically, the attribute characteristics of the first and second solder joints are compared to obtain the changes and the amount of change. The changes refer to the attribute characteristics that have changed. The amount of change characterizes the degree of change in the first and second solder joints.

[0043] In one embodiment, the attribute characteristics of the first and second solder joints in each solder joint bond pair are compared to obtain the change amount corresponding to each solder joint bond pair. The specific implementation process is as follows:

[0044] For each solder joint pair: obtain the changes to the first solder joint and the second solder joint; obtain the board overlap change amount for the first solder joint and the second solder joint, wherein the board overlap change amount is used to indicate the degree of change between the board material overlapped through the first solder joint and the board material overlapped through the second solder joint; obtain the welding feature change amount for the first solder joint and the second solder joint, wherein the welding feature change amount is used to indicate the degree of change between the welding features of the first solder joint and the welding features of the second solder joint; obtain the attribution feature change amount for the first solder joint and the second solder joint, wherein the attribution feature change amount is used to indicate the degree of change between the attribution features of the first solder joint and the attribution features of the second solder joint; obtain the change amount based on the sum of the board overlap change amount, the welding feature change amount, and the attribution feature change amount.

[0045] In this embodiment, based on the data changes of each field of the first and second solder joints, the changes to the first and second solder joints are obtained. The main comparison is made between the board overlap, welding features and attribution features of the first and second solder joints. After determining the changes, the pre-set changes in board overlap, welding features and attribution features are calculated. Finally, the sum of the changes in board overlap, welding features and attribution features is calculated to obtain the final change amount.

[0046] In one embodiment, the process of obtaining the change amount of the board overlap between the first solder joint and the second solder joint is as follows: First, obtain the first board overlap information corresponding to the first solder joint, wherein the first board overlap information includes material property information and overlap relationship information of each type of board connected through the first solder joint; second, obtain the second board overlap information corresponding to the second solder joint, wherein the second board overlap information includes material property information and overlap relationship information of each type of board connected through the second solder joint; compare the first board overlap information and the second board overlap information to obtain a board overlap comparison result; quantify the board overlap comparison result to obtain the change amount of the board overlap.

[0047] In this embodiment, during the welding process, two or more layers of sheet metal are overlapped by a weld point, that is, two or more layers of sheet metal are welded together by a single weld point.

[0048] For the material properties of the sheet metal, the sheet metal overlapped by the first solder joint is identified, and its material properties are obtained. Simultaneously, the sheet metal overlapped by the second solder joint is identified, and its material properties are obtained. Specifically, the material properties include the material of the overlapped sheet metal, its thickness, and its plating. Each of these material properties is compared to determine if any changes have occurred between the first and second solder joints. The sheet metal overlap change amount is initialized to 0. When a material property corresponding to the first and second solder joints differs (i.e., a change has occurred), the sheet metal overlap change amount is increased by a preset quantization value (e.g., the sheet metal overlap change amount is incremented by 1), thus quantifying the comparison result.

[0049] Regarding the overlap relationship information of the sheet metal, the sheet metal overlapped by the first solder joint is determined, and the overlap relationship information of the sheet metal overlapped by the first solder joint is obtained; by determining the sheet metal overlapped by the second solder joint, the overlap relationship information of the sheet metal overlapped by the second solder joint is obtained. More specifically, the overlap relationship information includes whether the number of sheet metal layers has increased or decreased. For example, if the first solder joint overlaps with 2 sheet metal layers and the second solder joint overlaps with 3 sheet metal layers, then the number of sheet metal layers has changed, and the change in sheet metal overlap is increased by a preset quantitative value (for example, the change in sheet metal overlap is increased by 1).

[0050] The overlap relationship information also includes the overlap sequence of the boards. For example, if the first solder joint overlaps with boards A, B, and C in sequence, and the second solder joint overlaps with boards A, C, and B in sequence, then the overlap sequence of the boards has changed, and the change amount of the board overlap will be increased by a preset quantitative value (for example, the change amount of the board overlap will be increased by 1).

[0051] It should be noted that if, under two data versions, the board materials overlapped by the first and second solder joints in a solder joint pair both include two types of board materials, A and B, and the overlap order of the first solder joint is A, B, and the overlap order of the second solder joint is B, A, then the overlap order of the first and second solder joints is considered unchanged. Furthermore, if the board materials overlapped by the first and second solder joints in a solder joint pair both include three types of board materials, A, B, and C, and the overlap order of the first solder joint is A, B, C, and the overlap order of the second solder joint is C, B, A, then the overlap order of the first and second solder joints is considered unchanged.

[0052] In this embodiment, the results of comparing the material property information and overlap relationship information of the sheet metal are quantified to obtain the final sheet metal overlap change amount.

[0053] In one embodiment, the specific process for obtaining the welding feature change amount of the first solder joint and the second solder joint is as follows: obtaining the first welding feature corresponding to the first solder joint, wherein the first welding feature includes the welding information possessed by the first solder joint; obtaining the second welding feature corresponding to the second solder joint, wherein the second welding feature includes the welding information possessed by the second solder joint; comparing the first welding feature and the second welding feature, and calculating the welding feature change amount.

[0054] In this embodiment, the first welding feature and the second welding feature are obtained respectively, the first welding feature and the second welding feature are compared, and the amount of welding feature change is calculated.

[0055] In one embodiment, the calculation of the welding feature change amount is mainly based on the weld point position coordinates and the weld length. Specifically, the first welding feature includes the first weld point position coordinates and the first weld length; the second welding feature includes the second weld point position coordinates and the second weld length.

[0056] Based on the first welding feature and the second welding feature, the welding feature change amount is calculated. The specific implementation process is as follows: Based on the coordinates of the first weld point position and the coordinates of the second weld point position, the weld point distance is calculated; the weld point distance is weighted to obtain the position change amount; based on the length of the first weld and the length of the second weld, the weld change ratio is calculated; the weld change ratio is weighted to obtain the weld change amount; based on the position change amount and the weld change amount, the welding feature change amount is obtained.

[0057] In this embodiment, the weld point location can be represented by its spatial coordinates within the vehicle coordinate system, i.e., by the weld point location coordinates. The degree of change in weld point characteristics is reflected by the spatial distance between the first and second weld points. More specifically, the position change is calculated using the following formula:

[0058] f1 = 5 * L * k1 (1);

[0059] Where f1 represents the position change amount; L represents the difference between the first position coordinate and the second position coordinate, in millimeters (mm); and k1 is the preset position weighting coefficient.

[0060] In the above formula, the position weighting coefficient k1 is used to change the degree of influence of position movement on the position change. The larger the position weighting coefficient, the greater the influence of solder joint movement on the position change is considered; otherwise, the influence of solder joint movement on the position change is considered smaller. The position weighting coefficient k1 is set according to the actual situation and practical experience; for example, k1 is set to a value of 0.1.

[0061] For weld length (also known as adhesive joint length), depending on the welding method, weld points include weld points represented by point elements (i.e., the actual weld point shape is dot-shaped), such as spot welding, stud welding, projection welding, carbon dioxide (CO2) welding points, etc.; and weld points represented by line elements (i.e., the actual weld point shape is line-shaped), such as weld seams and adhesive joints.

[0062] Weld joints represented by elements of the point class have a weld length of 0.

[0063] For weld joints represented by line elements, the lengths of the first and second welds are used to calculate the weld change amount using the following formula:

[0064] f2 = 5 * P * k2 (2);

[0065] P = abs(L1-L2) / L1 (3);

[0066] Where f2 represents the weld change amount; P is the intermediate calculation amount; k2 is the preset weld weighting coefficient; abs represents taking the absolute value; L1 represents the first weld length; and L2 represents the second weld length.

[0067] In the above formula, the weld weighting coefficient k2 is used to change the intermediate calculated quantity based on the first and second weld lengths, thus affecting the degree of influence on the weld modification amount. A larger weld weighting coefficient indicates a greater influence of weld length on the weld modification amount; conversely, a smaller influence indicates a smaller influence. The weld weighting coefficient k2 is set based on actual conditions and experience; for example, k1 can be set to 0.05.

[0068] In one embodiment, the attribute features being compared can be a first attribution feature of a first solder joint and a second attribution feature of a second solder joint. Based on the first and second attribution features, the change amount of the attribution features of the first and second solder joints is obtained. Specifically, the process of obtaining the change amount of the welding features of the first and second solder joints is as follows: obtaining the first attribution feature corresponding to the first solder joint, wherein the first attribution feature includes the attribution information of the first solder joint; obtaining the second attribution feature corresponding to the second solder joint, wherein the second attribution feature includes the attribution information of the second solder joint; comparing the first and second attribution features, and calculating the change amount of the attribution features.

[0069] In this embodiment, the first attribution feature includes the vehicle model to which the first weld point belongs, the vehicle component (or region) to which the weld point belongs, and whether the weld point is a critical weld point. Similarly, the second attribution feature includes the vehicle model to which the second weld point belongs, the vehicle component (or region) to which the weld point belongs, and whether the weld point is a critical weld point.

[0070] Initialize the attribution feature change amount to 0. For the vehicle model to which the weld point belongs, determine whether the vehicle models to which the first weld point and the second weld point belong are the same. Set the determination result to a Boolean value: 1 if the determination result is different, and 0 if the determination result is the same. If the determination result indicates that the vehicle models to which the first weld point and the second weld point belong are different, then add 1 unit quantization value to the attribution feature change amount based on the Boolean value of the determination result. The unit quantization value can be obtained in advance based on the weighting coefficient.

[0071] For each solder joint region, determine whether the regions of the first and second solder joints are the same. Set the result to a Boolean value: 1 if the results are different, and 0 if the results are the same. If the results indicate that the regions of the first and second solder joints are different, add one unit quantization value to the attribute feature change based on the Boolean value of the result. The unit quantization value can be pre-determined based on the weighting coefficients.

[0072] To determine whether a solder joint is a critical solder joint, we first check if both the first and second solder joints are critical joints simultaneously, or if both are non-critical joints simultaneously. The result is then set to a Boolean value: 1 for a negative result (critical joint information changed), and 0 for a positive result (critical joint information unchanged). If the result indicates a change in critical joint information for both the first and second solder joints, the change in attribution feature is incremented by one unit based on the Boolean value of the result. This unit quantization value can be pre-determined using weighting coefficients.

[0073] It should be noted that, in addition to the comparison of the three attribute characteristics of plate overlap, welding characteristics and attribution characteristics provided in the above embodiments, the first and second weld points can also be compared according to actual needs.

[0074] Step 104: Based on the changes and amounts of the solder joint binding pairs, obtain the analysis results of solder joint changes under different data versions.

[0075] In this embodiment, after obtaining the change amount of any solder joint pair, the change amount is compared with a preset change threshold. When the change amount is greater than the change threshold, it indicates that the changed attribute characteristics between the first solder joint and the second solder joint have changed, and the solder joint pair is incorrectly bound. In this case, the solder joint pair is unbound. When the change amount is less than or equal to the change threshold, the solder joint pair is correctly bound. The change amount obtained by the above comparison can represent the degree of change of the first solder joint and the second solder joint. The final analysis result is obtained through the change amount.

[0076] In one embodiment, the analysis results can be used to generate different reports based on the analysis content provided in the above embodiment, so that staff can view them. Specifically, according to the above processing procedure, four reports are generated: "Add Solder Joint", "Delete Solder Joint", "Change Solder Joint", and "Change Solder Joint Number".

[0077] The "Added Solder Joints" report includes solder joint data and / or attribute characteristics of at least one solder joint added in a new version. The "Deleted Solder Joints" report includes solder joint data and / or attribute characteristics of at least one solder joint deleted in an older version. The "Changed Solder Joints" report includes solder joint pairs with changes less than or equal to the change threshold, as well as the solder joint data and / or attribute characteristics of the first solder joint in each pair, the solder joint data and / or attribute characteristics of the second solder joint in each pair, the changes and amounts to each pair, the changes and amounts to the board overlap of each pair, the changes and amounts to the welding characteristics of each pair, and the changes and amounts to the attribution characteristics of each pair. The report "Solder Joint Number Change" includes solder joint binding pairs with different solder joint numbers but bound by solder joint features, as well as the solder joint data and / or attribute features of the first solder joint in each solder joint binding pair, the solder joint data and / or attribute features of the second solder joint in each solder joint binding pair, the amount and content of changes to each solder joint binding pair, the amount and content of changes to the board overlap of each solder joint binding pair, the amount and content of changes to the welding features of each solder joint binding pair, and the amount and content of changes to the attribution characteristics of each solder joint binding pair.

[0078] In one specific embodiment, the first solder joint dataset is an older version of the soldering dataset; the second solder joint dataset is a newer version of the soldering dataset. Both the first and second solder joint datasets store data in the form of a BOM table. Figure 2 As shown, the specific process of implementing the solder joint data analysis method is as follows:

[0079] Step 201: The algorithm program of this method begins to read the contents of the new / old versions of the Bom table, that is, to obtain the first solder joint dataset and the second solder joint dataset. The solder joint data of all fields are divided into four types of attribute features, including solder joint name, lap relationship, solder joint characteristics and solder joint ownership.

[0080] Step 202: Analyze all solder joints and match the first solder joint and the second solder joint in pairs by solder joint name;

[0081] Step 203: Determine if there are any unanalyzed solder joint pairs. If yes, proceed to step 204; otherwise, proceed to step 210.

[0082] Step 204: Obtain an unanalyzed solder joint bond pair;

[0083] Step 205: Calculate the change in sheet metal overlap, change in welding characteristics, and change in attribution characteristics for the weld joint pair;

[0084] Step 206: Calculate the sum of the sheet metal overlap change, welding feature change, and attribution characteristic change for the weld joint pair, and use the sum as the change amount of the weld joint pair.

[0085] Step 207: Determine whether the amount of change is greater than the change threshold. If not, proceed to step 208; if yes, proceed to step 209.

[0086] Step 208: Based on the change amount of each solder joint binding pair, update the preset analysis result dictionary, repeat step 203, and process the next solder joint binding pair that is successfully bound by solder joint name.

[0087] Step 209: Discard the changes, unbind the solder joint pair, and repeat step 203 to process the next solder joint pair that is successfully bound by solder joint name.

[0088] Step 210: Match the welding features of the unbonded first solder joint and the unbonded second solder joint using welding features;

[0089] Step 211: Determine whether there is a first weld point and a second weld point that have been successfully matched through welding features. If yes, proceed to step 203; otherwise, proceed to step 212.

[0090] Step 212: Export the analysis results based on the analysis result dictionary.

[0091] The weld point data analysis method provided by this invention obtains a first weld point dataset and a second weld point dataset for a target vehicle model; based on the first and second weld point datasets, at least one weld point binding pair is determined; the attribute characteristics of the first and second weld points in each weld point binding pair are compared to obtain the change content and change amount corresponding to each weld point binding pair; based on the change content and change amount of the weld point binding pairs, the analysis results of weld point changes under different data versions are obtained. In this process, for weld point data of different data versions, a first weld point dataset and a second weld point dataset are established respectively, and weld point binding pairs are determined from the first and second weld point datasets. By using weld point binding pairs, the attribute characteristics of the first and second weld points can be compared more accurately, improving the accuracy of the comparison results. Simultaneously, based on the first and second weld point datasets, one or more weld point binding pairs can be determined, achieving comprehensive comparison of weld point attribute characteristics between the two datasets. Furthermore, the setting of a change threshold further determines weld point binding pairs whose change amount meets the threshold requirements, thereby making the final analysis results more accurate.

[0092] More specifically, by using solder joint binding pairs, a more precise comparative analysis can be performed on the first and second solder joints that have been successfully matched, resulting in more accurate analysis results. At the same time, by changing the amount, it is possible to determine whether there are binding errors in the bound solder joint binding pairs, further improving the accuracy of the analysis results. Furthermore, by comparing the secondary welding features, it is possible to avoid missing the first and second solder joints that cannot be successfully matched by solder joint name, ensuring the comprehensiveness of the analysis results.

[0093] The solder joint data analysis device provided by the present invention is described below. The solder joint data analysis device described below can be referred to in correspondence with the solder joint data analysis method described above. Figure 3 As shown, the solder joint data analysis device includes:

[0094] The acquisition module 301 is used to acquire a first weld point dataset and a second weld point dataset of the target vehicle model. The first weld point dataset and the second weld point dataset correspond to different data versions. The first weld point dataset includes at least one first weld point, and the second weld point dataset includes at least one second weld point.

[0095] The binding module 302 is used to determine at least one solder joint binding pair based on the first solder joint dataset and the second solder joint dataset, wherein any solder joint binding pair includes a first solder joint and a second solder joint;

[0096] The comparison module 303 is used to compare the attribute characteristics of the first solder joint and the second solder joint in each solder joint binding pair, and obtain the change content and change amount corresponding to each solder joint binding pair. The change content includes the attribute characteristics of the first solder joint and the second solder joint that have changed, and the change amount is used to indicate the degree of change of the first solder joint and the second solder joint.

[0097] The results output module 304 is used to obtain analysis results of solder joint changes under different data versions based on the changes and amounts of changes to the solder joint binding pairs.

[0098] Figure 4 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 4As shown, the electronic device may include: a processor 401, a communication interface 402, a memory 403, and a communication bus 404, wherein the processor 401, the communication interface 402, and the memory 403 communicate with each other through the communication bus 404. The processor 401 can call logical instructions in the memory 403 to execute a solder joint data analysis method. This method includes: acquiring a first solder joint dataset and a second solder joint dataset for the target vehicle model, wherein the first and second solder joint datasets correspond to different data versions, the first solder joint dataset includes at least one first solder joint, and the second solder joint dataset includes at least one second solder joint; based on the first and second solder joint datasets, determining at least one solder joint binding pair, wherein any solder joint binding pair includes one first solder joint and one second solder joint; comparing the attribute characteristics of the first and second solder joints in each solder joint binding pair, and acquiring the change content and change amount corresponding to each solder joint binding pair, wherein the change content includes the changed attribute characteristics of the first and second solder joints, and the change amount indicates the degree of change of the first and second solder joints; and based on the change content and change amount of the solder joint binding pairs, acquiring analysis results of solder joint changes under different data versions.

[0099] Furthermore, the logical instructions in the aforementioned memory 403 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0100] On the other hand, the present invention also provides a computer program product, the computer program product including a computer program stored on a non-transitory computer-readable storage medium, the computer program including program instructions, when the program instructions are executed by a computer, the computer can execute the weld point data analysis method provided in the above embodiments, the method including: obtaining a first weld point dataset and a second weld point dataset of a target vehicle model, wherein the first weld point dataset and the second weld point dataset correspond to different data versions, the first weld point dataset includes at least one first weld point, and the second weld point dataset includes at least one second weld point; based on the first weld point dataset and the second weld point dataset, determining at least one weld point binding pair, wherein any weld point binding pair includes one first weld point and one second weld point; comparing the attribute characteristics of the first weld point and the second weld point in each weld point binding pair, obtaining the change content and change amount corresponding to each weld point binding pair, wherein the change content includes the attribute characteristics of the first weld point and the second weld point that have changed, and the change amount is used to indicate the degree of change of the first weld point and the second weld point; based on the change content and change amount of the weld point binding pair, obtaining the analysis results of weld point changes under different data versions.

[0101] In another aspect, the present invention also provides a non-transitory computer-readable storage medium storing a computer program thereon. When executed by a processor, the computer program implements the weld point data analysis method provided in the above embodiments. The method includes: acquiring a first weld point dataset and a second weld point dataset of a target vehicle model, wherein the first weld point dataset and the second weld point dataset correspond to different data versions, the first weld point dataset includes at least one first weld point, and the second weld point dataset includes at least one second weld point; determining at least one weld point binding pair based on the first weld point dataset and the second weld point dataset, wherein any weld point binding pair includes one first weld point and one second weld point; comparing the attribute features of the first weld point and the second weld point in each weld point binding pair, and obtaining the change content and change amount corresponding to each weld point binding pair, wherein the change content includes the attribute features of the first weld point and the second weld point that have changed, and the change amount is used to indicate the degree of change of the first weld point and the second weld point; and obtaining the analysis results of weld point changes under different data versions based on the change content and change amount of the weld point binding pair.

[0102] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0103] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0104] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for analyzing solder joint data, characterized in that, include: Obtain a first weld point dataset and a second weld point dataset for the target vehicle model. The first weld point dataset and the second weld point dataset correspond to different data versions. The first weld point dataset is an old version of the welding data set, and the second weld point dataset is a new version of the welding data set. The first weld point dataset includes at least one first weld point, and the second weld point dataset includes at least one second weld point. Based on the first solder joint dataset and the second solder joint dataset, at least one solder joint binding pair is determined, wherein any one of the solder joint binding pairs includes a first solder joint and a second solder joint; The attribute features of the first solder joint and the second solder joint in each solder joint binding pair are compared respectively to obtain the change content and change amount corresponding to each solder joint binding pair. The change content includes the attribute features of the first solder joint and the second solder joint that have changed, and the change amount is used to indicate the degree of change of the first solder joint and the second solder joint. The change amount is compared with a preset change threshold; the solder joint binding pairs whose change amount is greater than the change threshold are unbound; a first welding feature of each unbound first solder joint is obtained from the first solder joint dataset; a second welding feature of each unbound second solder joint is obtained from the second solder joint dataset; based on the first welding feature and the second welding feature, at least one solder joint binding pair is re-determined. Based on the changes and amounts of the solder joint binding pairs, analysis results of solder joint changes under different data versions are obtained.

2. The solder joint data analysis method according to claim 1, characterized in that, The step of determining at least one solder joint binding pair based on the first solder joint dataset and the second solder joint dataset includes: From the first solder joint dataset, obtain the first solder joint name for each of the first solder joints; From the second solder joint dataset, obtain the second solder joint name for each second solder joint; Based on the first solder joint name and the second solder joint name, at least one solder joint binding pair is determined.

3. The solder joint data analysis method according to claim 1, characterized in that, The step of comparing the attribute features of the first solder joint and the second solder joint in each solder joint binding pair to obtain the change content and change amount corresponding to each solder joint binding pair includes: For each of the aforementioned solder joint pairs: Obtain the changes to the first solder joint and the second solder joint; Obtain the sheet metal overlap change amount of the first solder joint and the second solder joint, wherein the sheet metal overlap change amount is used to indicate the degree of change between the sheet metal overlapped through the first solder joint and the sheet metal overlapped through the second solder joint; Obtain the welding feature change amount of the first solder joint and the second solder joint, wherein the welding feature change amount is used to indicate the degree of change of the welding feature of the first solder joint and the welding feature of the second solder joint; Obtain the change amount of the attribution characteristics of the first solder joint and the second solder joint, wherein the change amount of the attribution characteristics is used to indicate the degree of change of the attribution characteristics of the first solder joint and the attribution characteristics of the second solder joint; The change amount is obtained based on the sum of the sheet metal overlap change amount, the welding feature change amount, and the attribution feature change amount.

4. The solder joint data analysis method according to claim 3, characterized in that, The step of obtaining the change in the overlap of the first solder joint and the second solder joint includes: Obtain the first plate overlap information corresponding to the first weld point, wherein the first plate overlap information includes the material property information and overlap relationship information of each type of plate connected through the first weld point; Obtain the second sheet metal overlap information corresponding to the second weld point, wherein the second sheet metal overlap information includes the material property information and overlap relationship information of each sheet metal connected through the second weld point; Compare the overlap information of the first sheet metal and the overlap information of the second sheet metal to obtain the sheet metal overlap comparison result; The comparison results of the sheet metal overlaps are quantified to obtain the amount of sheet metal overlap change.

5. The solder joint data analysis method according to claim 3, characterized in that, The step of obtaining the welding feature change amount of the first solder joint and the second solder joint includes: Obtain the first welding feature corresponding to the first weld point, wherein the first welding feature includes the welding information possessed by the first weld point; Obtain the second welding feature corresponding to the second weld point, wherein the second welding feature includes the welding information possessed by the second weld point; Compare the first welding feature and the second welding feature, and calculate the amount of change in the welding feature.

6. The solder joint data analysis method according to any one of claims 3-5, characterized in that, The step of obtaining the change in attribution characteristics of the first solder joint and the second solder joint includes: Obtain the first attribution feature corresponding to the first solder joint, wherein the first attribution feature includes the attribution information of the first solder joint; Obtain the second attribution feature corresponding to the second solder joint, wherein the second attribution feature includes the attribution information of the second solder joint; Compare the first attribution feature and the second attribution feature, and calculate the change amount of the attribution feature.

7. A solder joint data analysis device, characterized in that, include: The acquisition module is used to acquire a first weld point dataset and a second weld point dataset of the target vehicle model. The first weld point dataset and the second weld point dataset correspond to different data versions. The first weld point dataset is an old version of the welding data set, and the second weld point dataset is a new version of the welding data set. The first weld point dataset includes at least one first weld point, and the second weld point dataset includes at least one second weld point. A binding module is configured to determine at least one solder joint binding pair based on the first solder joint dataset and the second solder joint dataset, wherein any solder joint binding pair includes a first solder joint and a second solder joint; A comparison module is used to compare the attribute features of the first solder joint and the second solder joint in each solder joint binding pair, and to obtain the change content and change amount corresponding to each solder joint binding pair. The change content includes the attribute features of the first solder joint and the second solder joint that have changed, and the change amount indicates the degree of change of the first solder joint and the second solder joint. The module compares the change amount with a preset change threshold; unbinds solder joint binding pairs whose change amount is greater than the change threshold; obtains a first welding feature for each unbound first solder joint from the first solder joint dataset; obtains a second welding feature for each unbound second solder joint from the second solder joint dataset; and redetermines at least one solder joint binding pair based on the first welding feature and the second welding feature. The results output module is used to obtain analysis results of solder joint changes under different data versions based on the changes and the amount of changes to the solder joint binding pair.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the solder joint data analysis method as described in any one of claims 1 to 6.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the solder joint data analysis method as described in any one of claims 1 to 6.

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