A composite sensor, switch cabinet online monitoring comprehensive analysis system and method

Abstract

The application provides a composite sensing device, which comprises a support, a control mainboard installed in a first circular groove, a first pressure collecting module installed on a long plate, a second pressure collecting module installed on a short plate, a pressure sensor installed outside the support, a pressure conducting sheet, an upper end of which is installed in a first groove, a middle end of which is attached to the pressure sensor, and a lower end of which is installed in a second groove, an equalizing spring installed in a second circular groove and pressed on the upper end of the pressure conducting sheet, a temperature sensor installed on an opening and attached to an upper end of any one of the moving contact assemblies, an insertion depth detection mechanism installed on the moving contact assemblies, and a power supply mechanism installed between the second circular groove and the base. The application also provides a switch cabinet online monitoring and comprehensive analysis system, which can monitor data in real time and avoid safety hazards.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of switch cabinet online monitoring, in particular to a composite sensor and a switch cabinet online monitoring comprehensive analysis system. BACKGROUND

[0002] With the development of society, people's demand for electricity is increasing. The carrying capacity of high-voltage transmission lines mainly depends on the rated working current of the switch cabinet and the cable. However, in practice, due to the use of trolley or middle-mounted circuit breakers in most high-voltage switch cabinets, the phenomenon of heating at the moving and static contact parts between the circuit breaker and the switch cabinet often occurs, affecting the carrying capacity of the line, and in severe cases, it may also cause the switch cabinet to burn out and other accidents. Through analysis of the causes of high-voltage switch cabinet contact heating and switch cabinet burning, the following problems exist:

[0003] 1. Insufficient tension of the fastening spring outside the moving contact: due to factors such as material quality or improper installation matching, the tension of the fastening spring outside the moving contact may be insufficient, causing an increase in the contact resistance of the moving contact, which leads to heating of the moving contact. The heating of the contact further causes the spring to heat up, further reducing the tension of the spring, thereby exacerbating the heating of the moving contact. For the heating of the moving contact caused by this factor, high-quality moving contacts and springs should be selected, and the tension of the spring should be checked during regular maintenance of the circuit breaker;

[0004] 2. Loose connection between the moving contact and the conducting arm: the moving contact of the circuit breaker is generally connected to the conducting arm through a bolt. During operation, the connecting bolt may become loose due to factors such as electric force, which increases the contact resistance and causes the temperature of the connecting part to rise. The temperature of the moving contact also rises, which further causes the fastening spring to heat up. Long-term temperature rise will further reduce the tension of the spring, leading to heating and blackening of the moving contact. For the heating of the moving contact caused by this reason, the loose connection of the moving contact must be checked during regular maintenance of the circuit breaker, and the tightening of the moving contact connection should be made a fixed item during regular maintenance of the circuit breaker;

[0005] 3. Poor contact between the moving and static contacts of the switch cabinet due to insufficient insertion depth: improper installation precision or processing precision may cause the static contact to be misaligned, leading to poor point contact between the moving and static contacts. It is also possible that the use of different types of backup circuit breakers causes the moving and static contacts to be incompatible in terms of insertion depth. This is because the insufficient insertion depth causes the static contact to not be properly connected, resulting in a decrease in the load current carrying capacity, poor contact between the moving and static contacts, increased heating, the generation of metal ions, and ultimately a rapid decrease in insulation, leading to a three-phase short circuit.

[0006] Therefore, through effective technical means, the tightening force of the contact spring, the contact temperature and the insertion depth of the moving and static contact assemblies of the switch cabinet are comprehensively monitored, the monitored data is more truly reflected to the real-time operation condition of the equipment, the operation condition of the circuit breaker is provided in time, the hidden danger is found early, the accident outage time is effectively reduced, unnecessary economic loss is avoided, and the demand for quality improvement and efficiency increase is urgent. SUMMARY

[0007] To solve one of the above problems, the application provides a composite sensing device for real-time monitoring data and avoiding safety hazards.

[0008] One of the problems of the application is solved in the following way: a composite sensing device comprises:

[0009] A bracket has a cavity inside, a first circular groove is arranged at the upper end of the bracket, a second circular groove is arranged at the outer circle of the upper part of the bracket, a base is arranged at the bottom of the bracket, a long placing plate and a short placing plate are arranged on the base, at least three first grooves are longitudinally and uniformly distributed in the second circular groove, the corresponding number of second grooves are arranged at the positions directly below the first grooves on the base, and an opening is arranged at the corresponding position of the base.

[0010] A control mainboard is installed in the first circular groove.

[0011] A first pressure acquisition module is installed on the long placing plate.

[0012] A second pressure acquisition module is installed on the short placing plate.

[0013] At least three pressure sensors are installed on the outer side of the bracket and between the first grooves and the second grooves.

[0014] At least three pressure conductive sheets are installed at the upper end of the first grooves, the lower end of the pressure conductive sheets is attached to the pressure sensors, and the lower end of the pressure conductive sheets is installed in the second grooves.

[0015] An equalizing spring is installed in the second circular groove and pressed on the upper end of the pressure conductive sheet; the lower end of the pressure conductive sheet is used to contact the two contact spring of the moving contact assembly.

[0016] A temperature sensor is installed on the opening and attached to the upper end of any moving contact of the moving contact assembly.

[0017] An insertion depth detection mechanism is installed on the moving contact of the moving contact assembly for monitoring the insertion depth when the static contact assembly is inserted into the moving contact assembly.

[0018] A power supply mechanism is installed between the second annular groove and the base;

[0019] The control motherboard is electrically connected to the power supply mechanism, the first pressure acquisition module, the second pressure acquisition module, the temperature sensor, and the insertion depth detection mechanism. The first pressure acquisition module is electrically connected to at least two of the pressure sensors, and the second pressure acquisition module is electrically connected to at least one of the pressure sensors.

[0020] Furthermore, the insertion depth detection mechanism includes at least one laser emitting module. Each laser emitting module includes a housing cover plate, a detection circuit board, and a housing body. The detection circuit board is mounted on the housing body, and the housing cover plate closes onto the housing body. The housing body is provided with a U-shaped groove. One end of the U-shaped groove has a set of elastic positioning beads on its inner wall. A moving contact of the moving contact assembly is inserted into the U-shaped groove and positioned by the elastic positioning beads. The other end of the U-shaped groove is connected to a protrusion. A set of laser emitting tubes are longitudinally tangentially distributed on the protrusion. The detection circuit board is electrically connected to the laser emitting tubes and the control main board, respectively.

[0021] Furthermore, when the number of laser emitting modules is 2, the distance between the upper end of the protrusion in the first laser emitting module and the upper end of the inner circle of the uppermost laser emitting tube is H1, and the distance between the upper end of the protrusion in the second laser emitting module and the upper end of the inner circle of the uppermost laser emitting tube is H2, and H2 > H1; each group of laser emitting tubes is longitudinally tangentially distributed, and all the laser emitting tubes are the same size, with an inner circle diameter of d, i.e., a spot size of d, and an outer circle diameter of D, where D = 2d and H2 - H1 = d.

[0022] Furthermore, the power supply mechanism includes a power supply board, a power supply coil, and a power supply ring. The base is provided with a mounting plate and a mounting slot. The power supply board is mounted on the mounting plate, and the power supply coil is mounted in the mounting slot. A plurality of limiting posts are provided between the lower surface of the second annular groove and the upper surface of the base. The power supply ring passes through the power supply coil and the limiting posts and surrounds the outer ring of the bracket. The power supply board is electrically connected to the power supply coil and the control main board, respectively, and the power supply coil is magnetically connected to the power supply ring.

[0023] The power supply board is equipped with a power management chip and a protection chip. The power management chip is electrically connected to the protection chip, the power supply coil, and the control motherboard, respectively.

[0024] Furthermore, the control motherboard is equipped with a processor chip, a wireless transceiver circuit, a signal acquisition circuit, a storage circuit, and a power supply circuit. The processor chip is electrically connected to the wireless transceiver circuit, the signal acquisition circuit, the storage circuit, and the power supply circuit, respectively. The signal acquisition circuit is electrically connected to the first pressure acquisition module, the second pressure acquisition module, the temperature sensor, and the insertion depth detection mechanism, respectively. The power supply circuit is electrically connected to the power supply mechanism, the first pressure acquisition module, the second pressure acquisition module, the temperature sensor, and the insertion depth detection mechanism, respectively.

[0025] Furthermore, the number of the first groove, the second groove, the pressure sensor, and the pressure transmitting plate are all 3, and they are all evenly distributed at 120° between each pair of the first grooves, each pair of the second grooves, each pair of the pressure sensors, and each pair of the pressure transmitting plates.

[0026] Furthermore, each of the pressure transmitting plates has a boss in the middle of its inner side, a first slot at the upper outer side of the pressure transmitting plate, a second slot and a third slot at the lower outer side of the pressure transmitting plate, the boss is attached to the pressure sensor, the pressure equalizing spring is locked in the first slot, and the two contact clamping springs are locked in the second slot and the third slot respectively, forming a lever with the boss as the support point.

[0027] Furthermore, it also includes a protective cover, the upper surface of which has an opening that matches the cavity, and the protective cover is fitted onto the bracket;

[0028] The power-collecting ring is a permalloy sheet;

[0029] The power-collecting coil is a CT power-collecting coil;

[0030] The lower end of the temperature sensor is heat-conducted by being attached to the upper end of any moving contact in the moving contact assembly through a heat conductor.

[0031] The heat conductor is thermally conductive silicone or an insulating thermally conductive sheet;

[0032] The long board, short board, and flat plate are all provided with fixing slots at both ends, and the first pressure acquisition module, the second pressure acquisition module, and the power supply circuit board are all fixed through the fixing slots on both sides.

[0033] The pressure sensor is fixed to the outside of the bracket with screws.

[0034] To address the second problem mentioned above, this invention provides an online monitoring and comprehensive analysis system for switchgear, which monitors data in real time and avoids potential safety hazards.

[0035] The second problem of this invention is solved as follows: A comprehensive online monitoring and analysis system for switchgear includes a switchgear, a moving contact assembly, a support frame, four contact clamping springs, a stationary contact assembly, a data acquisition device, and a back-end terminal; it also includes a composite sensing device with the structure described above; the moving contact assembly is fixed to the outer end of the support frame, the upper and lower ends of the moving contact assembly are fastened by contact clamping springs, and the bottom of the moving contact assembly is mounted on the switchgear; the two contact clamping springs located at the top press against the lower end of the pressure transmission plate; the stationary contact assembly is inserted into the moving contact assembly through a cavity, and the insertion depth of the stationary contact assembly into the moving contact assembly is monitored by an insertion depth detection mechanism; the control motherboard is wirelessly connected to the data acquisition device, and the data acquisition device is connected to the back-end terminal.

[0036] To address the third problem mentioned above, this invention provides a comprehensive online monitoring and analysis method for switchgear, enabling real-time data monitoring and preventing potential safety hazards.

[0037] The third problem of this invention is achieved as follows: a comprehensive analysis method for online monitoring of switchgear, which requires providing the aforementioned comprehensive analysis system for online monitoring of switchgear, specifically including the following steps:

[0038] Step 1: The composite sensing device is powered on and initialized.

[0039] Step 2: Detect the main power supply level via the control motherboard;

[0040] Step 3: Determine if the main power supply is sufficient based on the battery level. If so, the control board controls the temperature sensor to collect the temperature signal of the moving contact assembly, and the control board controls the insertion depth detection mechanism to collect the depth signal when the stationary contact assembly is inserted into the moving contact assembly. The control board controls the first pressure acquisition module and the second pressure acquisition module, which in turn control the pressure sensor to collect the pressure signal of the contact clamping spring, and proceeds to Step 4. Otherwise, enter sleep mode, and re-enter working mode after a set time, returning to Step 2.

[0041] Step 4: The control motherboard determines whether the data acquisition is complete. If so, it receives the acquired data, processes it, and sends it to the data acquisition device via wireless communication. Otherwise, it enters sleep mode and re-enters working mode after a set time, returning to step 2.

[0042] Step 5: The data acquisition device is powered on and initialized.

[0043] Step 6: The data acquisition device queries the wireless transceiver module in real time to see if it has received data. If so, the data is saved; otherwise, it continues to query the wireless transceiver module to see if it has received data. At the same time, the data acquisition device communicates with the backend terminal via a terminal connector or USB connector using RS485 / USB to determine in real time whether data has been received. If so, the data is returned to the backend terminal; otherwise, it continues to query the terminal connector or USB connector to see if data has been received.

[0044] The beneficial effects of this invention are:

[0045] 1. This invention includes a pressure sensor and a pressure transmission plate. The pressure transmission plate is attached to the pressure sensor at its middle end, and a pressure equalizing spring presses against the upper end of the pressure transmission plate. Two contact clamping springs located above press against the lower end of the pressure transmission plate, forming a lever with the middle end of the pressure transmission plate as the support point. The pressure sensor can obtain the pressure value applied by the contact clamping springs through the pressure transmission plate and transmit it to the control board for processing. The pressure value reflects the tension of the contact clamping springs, thereby allowing for real-time monitoring of the tension of the contact clamping springs.

[0046] 2. The present invention is equipped with a temperature sensor, which is located at the upper end of the moving contact. It can monitor the temperature of the moving contact in real time. When the temperature is too high, troubleshooting can be carried out. This can check for problems such as loose connection between the moving contact and the conductive arm caused by the moving contact overheating.

[0047] 3. The present invention is equipped with an insertion depth detection mechanism, which can measure the depth of the stationary contact inserted into the moving contact. When the depth is insufficient, it can be detected in real time. This can avoid poor contact between the moving and stationary contacts of the switch cabinet due to insufficient insertion depth, thereby avoiding problems such as three-phase short circuits caused by incomplete contact between the moving and stationary contacts.

[0048] 4. Employing sputtered thin-film pressure sensor technology, the system uses a geometric principle of determining the center of a circle through three pressure test points to sample the clamping force of the circular moving contact. The sampled data from the three pressure test points is transmitted to the control motherboard. The processor chip on the control motherboard amplifies the differential signal and performs high-precision A / D conversion, then performs weighted averaging of the three pressure monitoring data to accurately measure the spring clamping force. Simultaneously, a lateral comparison of the three pressure data is used to analyze whether there is localized aging deformation or misalignment of the contact. A surface-mount semiconductor temperature sensor is used to perform contact temperature measurement of the moving contact. A laser reflection photosensitive sensor is used to receive the signal. A laser emitting tube is set up; when the stationary contact is inserted into the moving contact, the laser emitting array is blocked. The laser signal received by the receiving array is converted into the corresponding insertion depth. This enables real-time monitoring of the spring clamping force (pressure sensor), stationary contact insertion depth (insertion depth sensor), and moving contact temperature (temperature sensor) of the switchgear moving contact, providing more accurate three-in-one monitoring.

[0049] 5. The interaction force between the contact clamping spring and the equalizing spring is used to realize the snap-fit ​​installation between the moving contact assembly and the composite sensing device, eliminating the need for binding and avoiding the safety hazards caused by the breakage of the binding strip.

[0050] 6. The use of power-taking rings and coils for CT power supply eliminates the need for additional wiring, significantly reducing work time, lowering the labor intensity of construction workers, improving construction efficiency, and saving costs. Attached Figure Description

[0051] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0052] Figure 1 This is an assembly diagram of the composite sensing device and the moving contact assembly in an embodiment of the present invention.

[0053] Figure 2 This is one of the perspective views of the bracket in an embodiment of the present invention.

[0054] Figure 3 This is a second perspective view of the bracket in an embodiment of the present invention.

[0055] Figure 4 This is a schematic diagram of the structure in which the control motherboard, the first pressure acquisition module, and the power supply board are mounted on the bracket in an embodiment of the present invention.

[0056] Figure 5This is a schematic diagram of the structure of the control motherboard and the second pressure acquisition module mounted on the bracket in an embodiment of the present invention.

[0057] Figure 6 This is a schematic diagram of the composite sensing device in an embodiment of the present invention (with the protective cover removed).

[0058] Figure 7 This is an exploded view of the composite sensing device in an embodiment of the present invention (excluding the power-taking coil and power-taking ring).

[0059] Figure 8 This is a schematic diagram of a temperature sensor mounted on a moving contact in an embodiment of the present invention.

[0060] Figure 9 This is a schematic diagram of the pressure transmission plate in an embodiment of the present invention.

[0061] Figure 10 This is an exploded view of the insertion depth detection mechanism in an embodiment of the present invention.

[0062] Figure 11 This is a schematic diagram of the structure of the outer shell body in an embodiment of the present invention.

[0063] Figure 12 This is a schematic diagram of the structure of the laser emitting tube in an embodiment of the present invention.

[0064] Figure 13 This is a schematic diagram of the support frame in an embodiment of the present invention.

[0065] Figure 14 This is a schematic diagram of the moving contact assembly mounted on the support frame in an embodiment of the present invention.

[0066] Figure 15 This is a complete structural diagram of the composite sensing device and moving contact assembly in an embodiment of the present invention.

[0067] Figure 16 This is an overall structural diagram of the data acquisition device in an embodiment of the present invention.

[0068] Figure 17 This is an exploded view of the data acquisition device in an embodiment of the present invention.

[0069] Figure 18 This is a schematic diagram of the lever principle of the pressure transmission plate in an embodiment of the present invention.

[0070] Figure 19 This is a schematic diagram of the power extraction principle of the power extraction coil and power extraction ring in an embodiment of the present invention.

[0071] Figure 20 This is a schematic diagram of the circuit connection of the control motherboard in an embodiment of the present invention.

[0072] Figure 21This is a schematic diagram of the power supply connection of the power supply circuit in an embodiment of the present invention.

[0073] Figure 22 This is a schematic diagram of the wiring connection of the data acquisition controller in an embodiment of the present invention.

[0074] Figure 23 This is a structural diagram of a switchgear online monitoring and comprehensive analysis system according to an embodiment of the present invention.

[0075] Figure 24 This is a flowchart illustrating the operation of the composite sensing device in an embodiment of the present invention.

[0076] Figure 25 This is a flowchart illustrating the workflow of the data acquisition controller in an embodiment of the present invention.

[0077] The attached diagram is labeled as follows:

[0078] 100-Composite sensing device, 1-Bracket, 11-Cavity, 12-First annular groove, 13-Second annular groove, 14-Base, 15-Long plate mounting, 16-Short plate mounting, 17-First groove, 18-Second groove, 19-Opening, 110-Plate mounting, 111-Mounting slot, 112-Limiting post, 113-Fixing slot, 2-Control motherboard, 21-Processor chip, 22-Wireless transceiver circuit, 23-Signal acquisition circuit, 24-Storage circuit, 25-Power supply circuit, 3-First pressure acquisition module, 4-Second pressure acquisition module, 5-Pressure sensor, 6-Pressure transmission plate, 6 1-Boss, 62-First slot, 63-Second slot, 64-Third slot, 7-Equalizing spring, 8-Temperature sensor, 81-Heat conductor, 9-Insertion depth detection mechanism, 91-Laser emitting module, 92-Outer shell cover, 93-Detection circuit board, 94-Outer shell body, 95-U-shaped groove, 951-Protrusion, 96-Elastic positioning bead, 97-Laser emitting tube, 98-Mounting groove, 99-Mounting hole, 10-Power supply mechanism, 101-Power supply board, 102-Power supply coil, 103-Power supply ring, 104-Power management chip, 105-Protection chip, 11A-Protective cover, 11B-Opening;

[0079] 200-Moving contact assembly, 201-Moving contact, 300-Four-contact clamping spring, 400-Stationary contact assembly, 500-Support frame, 501-Mounting plate, 502-Column, 503-Positioning slot, 600-Switch cabinet, 700-Data acquisition device, 701-Housing, 702-Data acquisition controller, 703-Communication interface cover, 704-Antenna interface cover, 705-Antenna, 706-Limiting slot, 707-Screw hole, 708-Terminal connection port, 709-Through hole, 710-USB connection port, 711-Antenna hole, 712-Power management module, 713-Processor module, 714-Storage module, 715-Wireless transceiver module, 716-Terminal connector, 717-USB connector; 800-Back-end terminal. Detailed Implementation

[0080] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0081] like Figures 1-22 As shown, in this embodiment, a composite sensing device 100 includes:

[0082] A bracket 1, which is the outer shell of the entire sensing device, is cylindrical. The bracket 1 has an internal cavity 11 for inserting a stationary contact assembly 400. A first annular groove 12 is provided at the upper end of the bracket 1 for housing the control main board 2. A second annular groove 13 is provided on the outer upper ring of the bracket 1 for housing a pressure equalizing spring 7. A base 14 is provided at the bottom of the bracket 1, on which a long plate 15 and a short plate 16 are mounted. The long plate 15 is used to place the first pressure acquisition module 3, and the short plate 16 is used to place the second pressure acquisition module 4; at least three first grooves 17 are evenly distributed longitudinally in the second annular groove 13, and the first grooves 17 are used to place the upper end of the pressure transmission plate 6; the base 14 is provided with a corresponding number of second grooves 18 located directly below the first grooves 17, and the second grooves 18 are used to place the lower end of the pressure transmission plate 6; the base 14 is provided with an opening 19 at a corresponding position, and the opening 19 is used to place the temperature sensor 8.

[0083] A control motherboard 2 is installed in the first annular groove 12. The control motherboard 2 is a data processing MCU and a wireless communication motherboard, which is mainly responsible for receiving and processing pressure signals, temperature signals and insertion depth signals, and then transmitting the data to the data acquisition device 700 through the wireless transceiver circuit.

[0084] A first pressure acquisition module 3 is installed on a mounting plate 15; both ends of the mounting plate 15 are provided with fixing grooves 113, and both ends of the first pressure acquisition module 3 are fixed in the fixing grooves 113.

[0085] A second pressure acquisition module 4 is installed on the mounting short plate 16; the mounting short plate 16 has fixing slots 113 at both ends, and the two ends of the second pressure acquisition module 4 are fixed in the fixing slots 113; after the first pressure acquisition module 3 and the second pressure acquisition module 4 acquire the small signal of the pressure sensor 5, the signal is amplified by the operational amplifier into a signal that can be recognized by the processor chip 21, and then sent to the control motherboard 2;

[0086] At least three pressure sensors 5 are mounted on the outside of the bracket 1 and located between the first groove 17 and the second groove 18;

[0087] At least three pressure transmitting plates 6, the upper end of which is installed in the first groove 17, the middle end of which is attached to the pressure sensor 5, and the lower end of which is installed in the second groove 18;

[0088] A pressure equalizing spring 7 is installed in the second annular groove 13. The pressure equalizing spring 7 is a tension spring, connected end to end, and presses against the upper end of the pressure transmitting plate 6. The lower end of the pressure transmitting plate 6 is used to contact the two contact clamping springs 300 of the moving contact assembly 200.

[0089] A temperature sensor 8 is mounted on the opening 19 and attached to the upper end of any moving contact 201 in the moving contact assembly 200.

[0090] An insertion depth detection mechanism 9 is installed on the moving contact 201 of the moving contact assembly 200, and is used to monitor the insertion depth when the stationary contact assembly 400 is inserted into the moving contact assembly 200; and

[0091] A power supply mechanism 10 is installed between the second annular groove 13 and the base 14;

[0092] The control motherboard 2 is electrically connected to the power supply mechanism 10, the first pressure acquisition module 3, the second pressure acquisition module 4, the temperature sensor 8, and the insertion depth detection mechanism 9. The first pressure acquisition module 3 is electrically connected to at least two of the pressure sensors 5, and the second pressure acquisition module 4 is electrically connected to at least one of the pressure sensors 5. The control motherboard 2 is connected to the power supply mechanism 10, the first pressure acquisition module 3, the second pressure acquisition module 4, the temperature sensor 8, and the insertion depth detection mechanism 9 via connecting wires. The three pressure sensors 5 are respectively connected to the first pressure acquisition module 3 and the second pressure acquisition module 4 via connecting wires. The pressure sensors 5 acquire the pressure value applied by the contact clamping spring 300, which reflects the tension of the contact clamping spring, allowing for real-time monitoring of the tension. The temperature sensor 8 acquires the temperature of the moving contact assembly 200 to prevent potential hazards caused by overheating. The insertion depth detection mechanism 9 acquires the insertion depth of the stationary contact assembly 400 into the moving contact assembly 200 to prevent incomplete contact between the moving and stationary contacts.

[0093] In this embodiment, the insertion depth detection mechanism 9 includes at least one laser emitting module 91. Each laser emitting module 91 includes a housing cover plate 92, a detection circuit board 93, and a housing body 94. The detection circuit board 93 is mounted on the housing body 94, and the housing cover plate 92 covers the housing body 94. The detection circuit board 93 is embedded in the mounting groove 98 of the housing body 94, and the housing cover plate 92 is inserted into the mounting holes 99 at both ends of the housing body 91 by means of barbs at both ends. The housing body 94 is provided with a U-shaped groove 95. A set of elastic positioning beads 96 is provided on the inner wall of one end of the U-shaped groove 95. A moving contact 201 of the moving contact assembly 200 is inserted into the U-shaped groove 95 and positioned by the elastic positioning beads 96. A protrusion 951 is connected to the other end of the U-shaped groove 95. A set of laser emitting tubes 97 are longitudinally tangentially distributed on the protrusion 951. The detection circuit board 93 is electrically connected to the laser emitting tubes 97 and the control main board 2, respectively.

[0094] In this embodiment, as Figure 12 and Figure 14As shown, when the number of laser emitting modules 91 is 2, the distance between the upper end of the protrusion 96 in the first laser emitting module 91 and the upper end of the inner circle of the uppermost laser emitting tube 97 is H1, and the distance between the upper end of the protrusion 96 in the second laser emitting module 91 and the upper end of the inner circle of the uppermost laser emitting tube 97 is H2, and H2 > H1; each group of laser emitting tubes 97 is longitudinally tangentially distributed, and all the laser emitting tubes 97 are the same size, with an inner circle diameter of d, i.e., a light spot size of d, and an outer circle diameter of D, where D = 2d and H2 - H1 = d. This ensures that the stationary contact assembly 400 can continuously contact the laser emitted from the inner circle of the laser emitting tube 97 after insertion, ensuring the accuracy of depth detection;

[0095] For example: Figure 12 and Figure 14 As shown: The distance L1 between the position where the upper end of the moving contact 201 first contacts the stationary contact assembly 400 and the top of the support frame 500 is fixed at 10mm. Adding the distance L2 between the top of the support frame 500 and the top of the laser emitting module 91, which is 2mm, the distance H1 between the upper end of the protrusion 96 in the first laser emitting module 91 and the upper end of the inner circle of the uppermost laser emitting tube 97 is 2mm. The distance H2 between the upper end of the protrusion 96 in the second laser emitting module 91 and the upper end of the inner circle of the uppermost laser emitting tube 97 is 4mm. The distance L1 between the upper end of the protrusion 96 in the second laser emitting module 91 and the upper end of the inner circle of the uppermost laser emitting tube 97 is 4mm. The first laser emitting module 91 has 3 laser emitting tubes 97, whose laser tube address numbers n are 1, 3, and 5 from top to bottom; the second laser emitting module 91 also has 3 laser emitting tubes 97, whose laser tube address numbers are 2, 4, and 6 from top to bottom; all the laser emitting tubes 97 are the same size, with an inner diameter d of 2mm (i.e., a spot size of d) and an outer diameter D of 4mm; the laser emitting tube spacing (the distance between the center of the circle with laser tube address number 1 and the center of the circle with laser tube address number 2) H3 is 2mm; the tops of the two laser emitting modules 91 are placed at the same height;

[0096] The distance from the point where the upper end of the moving contact 201 first contacts the stationary contact assembly 400 to the top of the laser emitting module 91 is L1+L2=10+2=12mm. Therefore, when the reflected signal of the laser emitting tube 97 of the first laser emitting module 91 is measured, the insertion depth of the contact is 10+2+2=14mm. Since H2-H1=2mm, and the spot size of each laser emitting tube 97 is 2mm, the distance between the spots of the same series lasers in the two sets of laser emitting modules 91 differs by 2mm. Thus, a completely illuminated area is formed between the laser emitting tubes 97 of the two sets of laser emitting modules 91. Within this area, the insertion depth of the stationary contact assembly 400 is calculated based on the intensity of the light reflected back from the different laser emitting tubes 97.

[0097] The insertion depth M of the stationary contact assembly 400 is M = L1 + L2 + H1 + (laser tube address number - 1) * laser emitter tube spacing + (received light intensity / total internal reflection light intensity) * laser tube spot size = L1 + L2 + H1 + (n-1) * H3 + (received light intensity / total internal reflection light intensity) * d.

[0098] The laser tube address is the polling address of the acquisition module that returns reflected light signals. The received light intensity is the light intensity of the last laser tube address returned by the polling laser tube (the light intensity can be obtained through a photosensitive sensor). The total internal reflection light intensity is the light intensity reflected when the entire laser spot is blocked by the contact.

[0099] For example, the insertion depth of the stationary contact assembly 400 is 19.5 mm. According to the formula: 19.5 = 10 + 2 + 2 + (3-1) * 2 + 0.75 * 2.

[0100] In this embodiment, the power supply mechanism 10 includes a power supply board 101, a power supply coil 102, and a power supply ring 103. The base 14 has a mounting plate 110 and a mounting groove 111. The power supply board 101 is mounted on the mounting plate 110. The mounting plate 110 has fixing grooves 113 at both ends, and the power supply board 101 is fixed within the fixing grooves 113 at both ends. The power supply coil 102 is installed within the mounting groove 111. The lower surface of the second annular groove 13 is flush with the base 101. A plurality of limiting posts 112 are provided between the upper surfaces of 4. The power-taking ring 103 passes through the power-taking coil 102 and the limiting posts 112 and surrounds the outer ring of the bracket 1. The power-taking board 101 is electrically connected to the power-taking coil 102 and the control board 2 respectively. The power-taking coil 102 is magnetically connected to the power-taking ring 103. The power-taking ring 103 is used for online power taking. After passing through multiple limiting posts 112, the power-taking ring 103 passes through the power-taking coil 102. The power-taking coil 102 is connected to the power-taking board 101 through a connecting wire.

[0101] like Figure 19As shown, the arrow represents alternating current. In the sensing device, a current-collecting ring 103 surrounds the outer ring of the bracket 1. According to the phenomenon of electromagnetic induction, when a conductor in a closed circuit moves in a magnetic field, cutting magnetic field lines, an induced current and an induced electromotive force are generated in the conductor. The current-collecting ring 103 acts like an iron core, and the current-collecting coil 102 acts like a part of the conductor in the closed circuit. Therefore, alternating current generates a changing magnetic field, and the current-collecting coil induces an induced current and an induced electromotive force in this changing magnetic field. However, since the induced electromotive force is alternating current, the power management chip 104 on the power supply board 101 converts the induced electromotive force induced by the current-collecting coil 102 into direct current through a rectifier circuit on the power management chip 104. An overvoltage clamping circuit is connected after the rectifier circuit to clamp the rectified direct voltage within a safe voltage range. Then, the clamped and protected voltage is connected to the control motherboard 2 through a voltage sampling circuit, and to the power supply circuit 25 of the control motherboard 2 through a voltage regulator circuit.

[0102] Since the sensor is powered online, the power-taking ring 103, under the power frequency AC current, can induce AC current through the power-taking coil 102. After rectification and filtering by the power supply board 101, the AC current is transmitted to the power supply circuit 25 to supply the pressure sensor 5, temperature sensor 8, and insertion depth detection mechanism 9. When the control board 2 of the sensor detects that the power supply meets the working requirements, it will activate the pressure sensor 5, temperature sensor 8, and insertion depth detection mechanism 9 to detect data. These monitor the pressure of the contact clamping spring 300 of the moving contact 201, the temperature of the moving contact 201, and the insertion depth of the stationary contact assembly 400 (contact arm), respectively. The data is then transmitted wirelessly to the data acquisition device 700.

[0103] In this embodiment, the power supply board 101 is provided with a power management chip 104 and a protection chip 105. The power management chip 104 is electrically connected to the protection chip 105, the power supply coil 102 and the control motherboard 2 respectively. The protection chip 105 can control the power supply when a large current is sent at one time, thereby protecting the downstream circuit board.

[0104] In this embodiment, the control motherboard 2 is provided with a processor chip 21, a wireless transceiver circuit 22, a signal acquisition circuit 23, a storage circuit 24, and a power supply circuit 25. The processor chip 21 is electrically connected to the wireless transceiver circuit 22, the signal acquisition circuit 23, the storage circuit 24, and the power supply circuit 25. The signal acquisition circuit 23 is electrically connected to the first pressure acquisition module 3, the second pressure acquisition module 4, the temperature sensor 8, and the insertion depth detection mechanism 9. The power supply circuit 25 is electrically connected to the power management chip 104, the first pressure acquisition module 3, the second pressure acquisition module 4, the temperature sensor 8, and the insertion depth detection mechanism 9 in the power supply mechanism 10.

[0105] In this embodiment, the number of the first groove 17, the second groove 18, the pressure sensor 5, and the pressure transmission plate 6 are all 3. The first groove 17, the second groove 18, the pressure sensor 5, and the pressure transmission plate 6 are all evenly distributed at 120° intervals. That is, the three pressure sensors 5 are respectively arranged along the bracket 1 at 120° intervals. The three pressure sensors 5 can determine three pressure test points, thereby determining the center position, which can measure the pressure more evenly and stably, making the test results more accurate.

[0106] In this embodiment, each pressure transmitting plate 6 has a protrusion 61 in the middle of its inner side, a first slot 62 at the upper outer side of the pressure transmitting plate 6, a second slot 63 and a third slot 64 at the lower outer side of the pressure transmitting plate 6, the protrusion 61 is attached to the pressure sensor 5, the pressure equalizing spring 7 is locked in the first slot 62, and the two contact clamping springs 300 are locked in the second slot 63 and the third slot 64 respectively, forming a lever with the protrusion 61 as the support point;

[0107] like Figure 18 As shown, the equalizing spring 7 and the two contact clamping springs 300 are tension springs. They apply force to both ends of the pressure transmitting plate 6. The boss 61 of the pressure transmitting plate 6 is a support point, and the pressure sensor 5 serves as a support plane. The entire structure is like a seesaw.

[0108] In the initial state (i.e., when the pressure transmitting plate 6 is not in contact with the two contact clamping springs 300), under the pressure of the equalizing spring 7, the protrusion 61 of the pressure transmitting plate 6 tilts outward downwards, and the upper end is pressed inwards. The contact point between the pressure transmitting plate 6 and the pressure sensor 5 shifts upwards. Since there is no balancing force below, the pressure sensor 5 is essentially unaffected at this time. When the force of the two contact clamping springs 300 acts on the pressure transmitting plate 6, under their force, the protrusion 61 of the pressure transmitting plate 6 is pressed inwards downwards, causing the protrusion 61 of the pressure transmitting plate 6 to tilt outwards upwards. The contact point between the pressure transmitting plate 6 and the pressure sensor 5 shifts downwards to achieve equilibrium. At this time, the force measured by the pressure sensor 5 is the resultant force of the equalizing spring 7 and the two contact clamping springs 300. Because the contact point is at the midpoint of the pressure sensor 5, the resultant force of the two contact clamping springs 300 is half the force measured by the pressure sensor 5.

[0109] In this embodiment, a protective cover 11A is also included. The upper surface of the protective cover 11A is provided with an opening 11B that matches the cavity 11, and the protective cover 11A is sleeved on the bracket 1.

[0110] In this embodiment, the power-taking ring 103 is a permalloy sheet;

[0111] The power-collecting coil 102 is a CT power-collecting coil;

[0112] The temperature sensor 8 is a surface-mount semiconductor temperature sensor;

[0113] The lower end of the temperature sensor 8 is heat-conducted by being attached to the upper end of any moving contact 201 in the moving contact assembly 200 through a heat conductor 81.

[0114] The heat conductor 81 is thermally conductive silicone or an insulating thermally conductive sheet;

[0115] The pressure sensor 5 is fixed to the outside of the bracket 1 by screws 51.

[0116] To address the second problem mentioned above, this invention provides an online monitoring and comprehensive analysis system for switchgear, which monitors data in real time and avoids potential safety hazards.

[0117] The second problem of this invention is achieved as follows:

[0118] like Figure 23As shown, the present invention provides an online monitoring and comprehensive analysis system for switchgear, comprising a composite sensing device 100, a moving contact assembly 200, a four-contact clamping spring 300, a stationary contact assembly 400, a support frame 500, a switchgear 600, a data acquisition device 700, and a back-end terminal 800; the back-end terminal 800 is a host computer; the moving contact assembly 200 is fixed to the outer end of the support frame 500, the upper and lower ends of the moving contact assembly 200 are fastened by the contact clamping spring 300, and the bottom of the moving contact assembly 200 is mounted on the switchgear 600; the composite sensing device 100 includes:

[0119] A bracket 1 has a cavity 11 inside. The upper end of the bracket 1 is provided with a first annular groove 12. The upper outer ring of the bracket 1 is provided with a second annular groove 13. The bottom of the bracket 1 is provided with a base 14. The base 14 is provided with a long plate 15 and a short plate 16. At least three first grooves 17 are evenly distributed longitudinally in the second annular groove 13. The base 14 is provided with a corresponding number of second grooves 18 located directly below the first grooves 17. The base 14 is provided with an opening 19 at the corresponding position.

[0120] A control motherboard 2 is installed in the first annular groove 12;

[0121] A first pressure acquisition module 3 is mounted on the mounting plate 15;

[0122] A second pressure acquisition module 4 is mounted on the mounting short plate 16;

[0123] At least three pressure sensors 5 are mounted on the outside of the bracket 1 and located between the first groove 17 and the second groove 18;

[0124] At least three pressure transmitting plates 6, the upper end of which is installed in the first groove 17, the middle end of which is attached to the pressure sensor 5, and the lower end of which is installed in the second groove 18;

[0125] A pressure equalizing spring 7 is installed in the second annular groove 13 and presses against the upper end of the pressure transmitting plate 6; the two contact clamping springs 300 located above press against the lower end of the pressure transmitting plate 6.

[0126] A temperature sensor 8 is mounted on the opening 19 and attached to the upper end of any moving contact 201 in the moving contact assembly 200.

[0127] An insertion depth detection mechanism 9 is installed on the moving contact 201 of the moving contact assembly 200. The stationary contact assembly 400 is inserted into the moving contact assembly 200 through the cavity 11. The insertion depth detection mechanism 9 monitors the insertion depth of the stationary contact assembly 400 when it is inserted into the moving contact assembly 200.

[0128] A power supply mechanism 10 is installed between the second annular groove and the base;

[0129] The control motherboard 2 is electrically connected to the power supply mechanism 10, the first pressure acquisition module 3, the second pressure acquisition module 4, the temperature sensor 8, and the insertion depth detection mechanism 9. The first pressure acquisition module 3 is electrically connected to at least two of the pressure sensors 5, and the second pressure acquisition module 4 is electrically connected to at least one of the pressure sensors 5. The control motherboard 2 is wirelessly connected to the data acquisition device 700, and the data acquisition device 700 is connected to the back-end terminal 800.

[0130] The data acquisition device 700 includes a housing 701, a data acquisition controller 702, a communication interface cover 703, an antenna interface cover 704, and an antenna 705. The housing 701 has a limiting groove 706, through which the data acquisition controller 702 is fixed inside the housing 701. The communication interface cover 703 has four screw holes 707 for fixing to the front end of the housing 701 with screws (not shown). The communication interface cover 703 has a terminal connection port 708 for connecting a terminal connector 716 to a host computer, thereby enabling the host computer to acquire data from the data acquisition device. The data in the data acquisition device 700; the communication interface cover 703 has two through holes 709 for highlighting indicator lights; the communication interface cover 703 has a USB connection port 710 for the USB connector 717 to connect to the host computer through the USB connection port 710, so that the host computer can obtain the data in the data acquisition device 700; the antenna interface cover 704 has four screw holes 707 for fixing to the rear end of the outer shell 701 with screws (not shown); the antenna interface cover 704 has an antenna hole 711, through which the antenna 705 passes and connects to the antenna chip at the rear end of the data acquisition controller 702.

[0131] The data acquisition controller 702 includes a power management module 712, a processor module 713, a storage module 714, a wireless transceiver module 715, a terminal connector 716, and a USB connector 717. The processor module 713 is electrically connected to the power management module 712, the storage module 714, the wireless transceiver module 715, the terminal connector 716, and the USB connector 717. The wireless transceiver module 715 on the data acquisition controller 702 is wirelessly connected to the wireless transceiver circuit 22 on the control motherboard 2, enabling real-time wireless transmission of data monitored by the composite sensor device 100 to the data acquisition device 700. The terminal connector 716 communicates with the backend terminal 800 via an RS485 interface, enabling the transmission of monitored data to the backend terminal 800 for management. The USB connector 717 communicates with the backend terminal 800 via a USB interface, enabling the transmission of monitored data to the backend terminal 800 for management. The power management module 712 stabilizes the input voltage within a certain range to the output voltage within a certain range, supplying power to subsequent circuits. The processor module 713 communicates with the wireless transceiver module 715 via the SPI communication protocol. The processor module 713 continuously communicates with the wireless transceiver module 715 to check whether it has received data. If data is successfully received, the processor module 713 stores the data in the storage module 714 and then continues to query the data.

[0132] The data acquisition device 700 continuously queries whether the wireless transceiver module 715 has received data. If data is received, it saves the data to the storage module 714 and then continues to query whether the wireless transceiver module 715 has received data; otherwise, it keeps querying whether the wireless transceiver module 715 has received data. The backend terminal 800 can acquire the monitored data via USB or RS485 communication.

[0133] The support frame 500 includes two mounting pieces 501 and a plurality of columns 502. The upper and lower mounting pieces 501 are fixed by the columns 502. Each mounting piece 501 has a plurality of positioning grooves 503 at its outer end. The upper and lower positioning grooves 503 are positioned opposite each other. The upper end of the moving contact 201 is installed in the upper positioning groove 503, and the lower end of the moving contact 201 is installed in the lower positioning groove 503.

[0134] like Figures 24-25 As shown, this invention provides a comprehensive analysis method for online monitoring of switchgear. This method requires the aforementioned comprehensive analysis system for online monitoring of switchgear, and specifically includes the following steps:

[0135] Step 1: The composite sensing device 100 is powered on and initialized.

[0136] Step 2: Detect the main power supply level via the control motherboard 2;

[0137] Step 3: Determine if the main power supply is sufficient based on the battery level. If so, the control motherboard 2 controls the temperature sensor 8 to collect the temperature signal of the moving contact assembly 200, and the control motherboard 2 controls the insertion depth detection mechanism 9 to collect the depth signal when the stationary contact assembly 400 is inserted into the moving contact assembly 200. The control motherboard 2 controls the first pressure acquisition module 3 and the second pressure acquisition module 4, which in turn control the pressure sensor 5 to collect the pressure signal of the contact clamping spring 300, and proceed to step 4. Otherwise, enter sleep mode, and re-enter working mode after a set time, returning to step 2.

[0138] Step 4: The control motherboard 2 determines whether the data acquisition is complete. If so, it receives the acquired data, processes it, and sends it to the data acquisition device 700 via wireless communication. Otherwise, it enters sleep mode and re-enters working mode after a set time, returning to step 2.

[0139] Step 5: The data acquisition device 700 is powered on and initialized.

[0140] Step 6: The data acquisition device 700 queries the wireless transceiver module 715 in real time to see if it has received data. If so, the data is saved; otherwise, it continues to query the wireless transceiver module 715 to see if it has received data. At the same time, the data acquisition device 700 communicates with the backend terminal 800 via the terminal connector 716 or the USB connector 717 using RS485 / USB to determine in real time whether data has been received. If so, the data is returned to the backend terminal 800; otherwise, it continues to query the terminal connector 716 or the USB connector 717 to see if data has been received.

[0141] This invention designs an online monitoring system capable of simultaneously measuring contact temperature, contact insertion depth, and contact clamping force. By real-time monitoring of these three parameters—contact temperature, contact insertion depth, and contact spring clamping force—an artificial intelligence algorithm is used to build an artificial neural network analysis model from massive data records. This enables the judgment of high-voltage switch status trends, overcoming the limitations of relying solely on temperature measurements and resulting in insufficient data and analysis. It allows for a comprehensive analysis and judgment of the switch's condition from multiple perspectives, providing more technologically advanced and evidence-based safety precautions and operational guidance.

[0142] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the invention by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A composite sensing device, characterized in that, include: A bracket has an internal cavity, a first annular groove at the upper end of the bracket, a second annular groove on the outer ring of the upper part of the bracket, a base at the bottom of the bracket, a long plate and a short plate on the base, at least three first grooves evenly distributed longitudinally in the second annular groove, a corresponding number of second grooves on the base located directly below the first grooves, and an opening at the corresponding position on the base; A control motherboard, wherein the control motherboard is installed in the first annular groove; A first pressure acquisition module is mounted on the mounting plate; A second pressure acquisition module is mounted on the mounting short plate; At least three pressure sensors are mounted on the outside of the bracket and located between the first and second grooves; At least three pressure transmitting plates, the upper end of which is installed in the first groove, the middle end of which is attached to the pressure sensor, and the lower end of which is installed in the second groove; A pressure equalizing spring is installed in the second annular groove and presses against the upper end of the pressure transmitting plate; the lower end of the pressure transmitting plate is used to contact the two contact clamping springs of the moving contact assembly. Each pressure transmitting plate has a protrusion in the middle of its inner side, a first slot at the upper outer side of the pressure transmitting plate, a second slot and a third slot at the lower outer side of the pressure transmitting plate, the protrusion is attached to the pressure sensor, the pressure equalizing spring is locked in the first slot, and the two contact clamping springs are locked in the second slot and the third slot respectively, forming a lever with the protrusion as the support point; A temperature sensor is mounted on the opening and attached to the upper end of any moving contact in the moving contact assembly. An insertion depth detection mechanism is installed on the moving contact of the moving contact assembly to monitor the insertion depth of the stationary contact assembly when it is inserted into the moving contact assembly; and A power supply mechanism is installed between the second annular groove and the base; The control motherboard is electrically connected to the power supply mechanism, the first pressure acquisition module, the second pressure acquisition module, the temperature sensor, and the insertion depth detection mechanism. The first pressure acquisition module is electrically connected to at least two of the pressure sensors, and the second pressure acquisition module is electrically connected to at least one of the pressure sensors.

2. The composite sensing device according to claim 1, characterized in that, The insertion depth detection mechanism includes at least one laser emitting module. Each laser emitting module includes a housing cover, a detection circuit board, and a housing body. The detection circuit board is mounted on the housing body, and the housing cover is fitted onto the housing body. The housing body has a U-shaped groove. One end of the U-shaped groove has a set of elastic positioning beads on its inner wall. A moving contact of the moving contact assembly is inserted into the U-shaped groove and positioned by the elastic positioning beads. The other end of the U-shaped groove is connected to a protrusion. A set of laser emitting tubes are longitudinally and tangentially distributed on the protrusion. The detection circuit board is electrically connected to the laser emitting tubes and the control main board, respectively.

3. The composite sensing device according to claim 2, characterized in that, When the number of laser emitting modules is 2, the distance between the upper end of the protrusion in the first laser emitting module and the upper end of the inner circle of the uppermost laser emitting tube is H1, and the distance between the upper end of the protrusion in the second laser emitting module and the upper end of the inner circle of the uppermost laser emitting tube is H2, and H2 > H1; each group of laser emitting tubes is longitudinally tangent, and all the laser emitting tubes are the same size, with an inner circle diameter of d, i.e., a spot size of d, and an outer circle diameter of D, where D = 2d and H2 - H1 = d.

4. A composite sensing device according to claim 1, characterized in that, The power supply mechanism includes a power supply board, a power supply coil, and a power supply ring. The base has a mounting plate and a mounting slot. The power supply board is mounted on the mounting plate, and the power supply coil is mounted in the mounting slot. A plurality of limiting posts are provided between the lower surface of the second annular groove and the upper surface of the base. The power supply ring passes through the power supply coil and the limiting posts and surrounds the outer ring of the bracket. The power supply board is electrically connected to the power supply coil and the control main board, and the power supply coil is magnetically connected to the power supply ring. The power supply board is equipped with a power management chip and a protection chip. The power management chip is electrically connected to the protection chip, the power supply coil, and the control motherboard, respectively.

5. A composite sensing device according to claim 1, characterized in that, The control motherboard is equipped with a processor chip, a wireless transceiver circuit, a signal acquisition circuit, a storage circuit, and a power supply circuit. The processor chip is electrically connected to the wireless transceiver circuit, the signal acquisition circuit, the storage circuit, and the power supply circuit. The signal acquisition circuit is electrically connected to the first pressure acquisition module, the second pressure acquisition module, the temperature sensor, and the insertion depth detection mechanism. The power supply circuit is electrically connected to the power supply mechanism, the first pressure acquisition module, the second pressure acquisition module, the temperature sensor, and the insertion depth detection mechanism.

6. A composite sensing device according to claim 1, characterized in that, The number of the first groove, the second groove, the pressure sensor, and the pressure transmitting plate are all 3, and they are evenly distributed at 120° between every two first grooves, between every two second grooves, between every two pressure sensors, and between every two pressure transmitting plates.

7. A composite sensing device according to claim 4, characterized in that, It also includes a protective cover, the upper surface of which has an opening that matches the cavity, and the protective cover is fitted onto the bracket; The power-collecting ring is a permalloy sheet; The power-collecting coil is a CT power-collecting coil; The lower end of the temperature sensor is heat-conducted by being attached to the upper end of any moving contact in the moving contact assembly through a heat conductor. The heat conductor is thermally conductive silicone or an insulating thermally conductive sheet; The long board, short board, and flat plate are all provided with fixing slots at both ends, and the first pressure acquisition module, the second pressure acquisition module, and the power supply circuit board are all fixed through the fixing slots on both sides. The pressure sensor is fixed to the outside of the bracket with screws.

8. A comprehensive online monitoring and analysis system for switchgear, comprising a switchgear, a moving contact assembly, a support frame, four contact clamping springs, a stationary contact assembly, a data acquisition device, and a back-end terminal; characterized in that, It also includes a composite sensing device with a structure as described in any one of claims 1-7; the moving contact assembly is fixed to the outer end of the support frame, the upper and lower ends of the moving contact assembly are fastened by contact clamping springs, and the bottom of the moving contact assembly is mounted on the switch cabinet; the two contact clamping springs located at the top press against the lower end of the pressure transmitting plate; the stationary contact assembly passes through the cavity and is inserted into the interior of the moving contact assembly, and the insertion depth of the stationary contact assembly when inserted into the interior of the moving contact assembly is monitored by the insertion depth detection mechanism; the control motherboard is wirelessly connected to the data acquisition device, and the data acquisition device is connected to the back-end terminal.

9. A comprehensive analysis method for online monitoring of switchgear, characterized in that, This method requires providing a comprehensive online monitoring and analysis system for switchgear as described in claim 8, specifically including the following steps: Step 1: The composite sensing device is powered on and initialized. Step 2: Detect the main power supply level via the control motherboard; Step 3: Determine if the main power supply is sufficient based on the battery level. If so, the control board controls the temperature sensor to collect the temperature signal of the moving contact assembly, and the control board controls the insertion depth detection mechanism to collect the depth signal when the stationary contact assembly is inserted into the moving contact assembly. The control board controls the first pressure acquisition module and the second pressure acquisition module, which in turn control the pressure sensor to collect the pressure signal of the contact clamping spring, and proceeds to Step 4. Otherwise, enter sleep mode, and re-enter working mode after a set time, returning to Step 2. Step 4: The control motherboard determines whether the data acquisition is complete. If so, it receives the acquired data, processes it, and sends it to the data acquisition device via wireless communication. Otherwise, it enters sleep mode and re-enters working mode after a set time, returning to step 2. Step 5: The data acquisition device is powered on and initialized. Step 6: The data acquisition device queries the wireless transceiver module in real time to see if it has received data. If so, the data is saved; otherwise, it continues to query the wireless transceiver module to see if it has received data. At the same time, the data acquisition device communicates with the backend terminal via a terminal connector or USB connector using RS485 / USB to determine in real time whether data has been received. If so, the data is returned to the backend terminal; otherwise, it continues to query the terminal connector or USB connector to see if data has been received.

Images