Drum ring taking device

Abstract

The application relates to the technical field of semiconductor integrated circuit manufacturing, in particular to a Taiko ring taking device. The Taiko ring taking device comprises a protective film tension adjusting ring and a cutting angle adjusting ring which can be in contact with the lower surface of the skirt of the protective film; the protective film can be attached to the surface of a wafer with a Taiko ring, and the skirt of the protective film extends out of the Taiko ring; the protective film tension adjusting ring is located outside the cutting angle adjusting ring and can move up and down to adjust the tension degree of the protective film; the cutting angle adjusting ring is located on the upper side of the horizontal direction of the protective film tension adjusting ring and can move up and down to adjust the included angle between the skirt of the protective film and the lower surface of the Taiko ring, and the included angle is the cutting angle. The Taiko ring taking device provided by the application can solve the problem that the cutting angle and the tension degree of the protective film are difficult to be considered in the related art.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor integrated circuit manufacturing, in particular to a Taiko ring taking device. BACKGROUND

[0002] The Taiko ring prepared by the Taiko thinning process can provide support for the wafer during manufacturing and reduce wafer warping. The Taiko ring needs to be removed before wafer cutting and packaging, while the integrity of the wafer edge needs to be maintained.

[0003] Laser ring cutting is one of the main methods for removing the Taiko ring. A laser beam is used to bombard the junction between the Taiko ring and the main area of the wafer, thereby generating a cutting seam at the junction. Then the Taiko ring is removed by a taking process.

[0004] REFERENCE Figure 1 Fig. 1 shows a Taiko ring taking diagram in the related art. Before the Taiko ring is taken, a protective film 102 is attached to the surface of a wafer 101 with a Taiko ring. When the ring is taken, the wafer 101 is placed on an adsorption platform 103, and the adsorption platform 102 adjusts the tightness of the protective film 102 by adsorbing the protective film 102. Then a ring cutter enters the cutting space 104 formed between the protective film 102 and the Taiko ring 101a at a specific angle, so that the Taiko ring 101a and the wafer main body 101b are broken at the cutting seam 101c.

[0005] However, in the related art, the adsorption platform needs to adsorb the protective film to adjust the tightness of the protective film. The tightness of the protective film affects the size of the cutting space. When the protective film is too tight, it is easy to cause the Taiko ring to squeeze the edge of the wafer main body, causing the wafer main body to crack. When the protective film is too loose, it is not conducive to the stability of the Taiko ring. When the tightness of the protective film is adjusted to an appropriate tightness, the cutting space may not meet the requirements, and the appropriate tightness window is small. In summary, the cutting angle and the tightness of the protective film are difficult to balance in the related art. SUMMARY

[0006] The present application provides a Taiko ring taking device, which can solve the problem that the cutting angle and the tightness of the protective film are difficult to balance in the related art.

[0007] In order to solve the technical problems described in the background art, the present application provides a Taiko ring taking device, which comprises: a protective film tightness adjusting ring capable of contacting the lower surface of the skirt of the protective film and a cutting angle adjusting ring; the protective film can be attached to the surface of the wafer with the Taiko ring, and the skirt of the protective film extends out of the Taiko ring;

[0008] The protection film tension adjusting ring is located outside the cutting-in angle adjusting ring and can move up and down to adjust the tension of the protection film.

[0009] The cutting-in angle adjusting ring is located above the protection film tension adjusting ring in the horizontal direction and can move up and down to adjust the included angle between the skirt of the protection film and the lower surface of the drum ring, and the included angle is the cutting-in angle.

[0010] Optionally, the protection film tension adjusting ring adsorbs the first position of the skirt of the protection film and applies a downward adsorption force to the first position of the skirt of the protection film.

[0011] The cutting-in angle adjusting ring supports the second position of the skirt of the protection film and applies an upward supporting force to the second position of the skirt of the protection film.

[0012] The second position of the skirt of the protection film is located between the first position of the skirt of the protection film and the edge position of the drum ring.

[0013] Optionally, the skirt of the protection film between the second position and the edge position of the drum ring is a first skirt part.

[0014] The first skirt part gradually inclines downward from the edge position of the drum ring, and the included angle between the first skirt part and the lower surface of the drum ring is the cutting-in angle.

[0015] Optionally, the protection film tension adjusting ring is a vacuum adjusting ring.

[0016] Optionally, the cutting-in angle adjusting ring is located at a position 2mm-15mm above the protection film tension adjusting ring in the horizontal direction.

[0017] Optionally, the protection film tension adjusting ring is located at a position 2mm-15mm outside the cutting-in angle adjusting ring.

[0018] Optionally, the ring width of the cutting-in angle adjusting ring is 2mm-10mm.

[0019] The technical scheme of the present application has at least the following advantages: the protection film is controlled by the protection film tension adjusting ring and the cutting-in angle adjusting ring, the cutting-in angle adjusting ring on the inner side limits the inclination direction of the skirt of the protection film to define the cutting-in space and control the cutting-in direction, so that the ring taking cutter can perform the cutting-in and ring taking operation from the bonding position of the lower surface of the drum ring and the protection film, that is, the drum ring can be taken off from the protection film according to the specific cutting-in angle in the cutting-in space. The protection film tension adjusting ring on the outer side can control the tension of the protection film, expand the ring taking tension window, avoid the edge of the wafer main body part 201b being pressed during the taking of the drum ring, and reduce the edge crack rate. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the specific embodiments or the prior art of the present application, the accompanying drawings needed to be used in the specific embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0021] Figure 1 A taiko ring taking ring schematic diagram in the related art is shown.

[0022] Figure 2 A taiko ring taking ring half-section structure schematic diagram provided by an embodiment of the present application is shown. DETAILED DESCRIPTION

[0023] The technical solutions in the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative effort fall within the scope of the present application.

[0024] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through an intermediate medium; it can be the internal communication of two elements, or it can be wireless connection, or wired connection. Those skilled in the art can understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0026] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0027] REFERENCE Figure 2It shows a schematic diagram of a half-section structure of a drum ring according to an embodiment of this application, from... Figure 2 As can be seen, after the tadpoles are thinned, the middle part of the wafer 201 is thinned to the required thickness to form the wafer body 201b, while the edge part of the wafer 201 is not thinned and forms the tadpoles 201a. The thickness of the thinned wafer body 201b is 20um-250um.

[0028] Before using the taiko ring removal device provided in this embodiment to remove the ring, a protective film 202 needs to be pasted on the surface of the wafer, and then laser circumcision is performed. After the laser circumcision produces a cutting slit 201c, the taiko ring 201a and the wafer body 201b are still adhered to the protective film 202 by the adhesive effect of the protective film 202. The ring removal device is needed to remove the taiko ring 201a that is adhered to the protective film 202.

[0029] Continue to refer to Figure 2 The taiko ring taking device provided in this embodiment includes: a protective film tension adjusting ring 203 and a cutting angle adjusting ring 204 that can contact the lower surface of the skirt 222 of the protective film 202. Figure 2 The protective film 202 shown includes a protective film skirt 222 that extends beyond the drum ring 201a.

[0030] The protective film tension adjustment ring 203 is located outside the infeed angle adjustment ring 204 and can move up and down. Figure 2 The tension of the protective film 202 is adjusted in the z-direction.

[0031] The infeed angle adjustment ring 204 is located above the protective film tension adjustment ring 203 in the horizontal direction, and can move up and down. Figure 2 The angle between the skirt 222 of the protective film and the lower surface of the drum ring 201a is adjusted in the z direction, and the angle is the entry angle α.

[0032] In this embodiment, the protective film is controlled by two adjusting rings: a protective film tension adjusting ring and a cutting angle adjusting ring. The inner cutting angle adjusting ring restricts the tilt direction of the protective film skirt to limit the cutting space and control the cutting direction. This allows the ring-removing cutter to perform the ring-removal operation at a specific cutting angle from the adhesion point between the lower surface of the tatami ring and the protective film within this cutting space, thus removing the tatami ring from the protective film. The outer protective film tension adjusting ring controls the tension of the protective film, expanding the ring-removal tension window and preventing the tatami ring from compressing the edge of the wafer body 201b during the ring-removal process, thereby reducing the edge crack rate.

[0033] Continue to refer to Figure 2The protective film tension adjustment ring 203 adsorbs the first position 211 of the protective film skirt 222, applying a downward adsorption force (along the first position 211 of the protective film skirt 222) to the protective film skirt 222. Figure 2 (As shown, the z-direction is downward).

[0034] The insertion angle adjustment ring 212 supports the second position 212 of the protective film skirt 222 and applies an upward supporting force (along the direction of insertion angle) to the second position 212 of the protective film skirt 222. Figure 2 (As shown, the z-direction is upward).

[0035] The second position 212 of the protective film skirt 222 is located between the first position 211 of the protective film skirt 222 and the edge position 213 of the drum ring 201a.

[0036] The protective film skirt 222 between the second position 212 and the edge position 213 of the drum ring 201a is a first skirt portion. This first skirt portion gradually slopes downward from the edge position 213 of the drum ring 201a, and the angle between the first skirt portion and the lower surface of the drum ring is the cutting angle α. The cutting angle α is controlled by adjusting the degree of inclination of this first skirt portion.

[0037] in, Figure 2 The protective film tension adjustment ring 203 shown is a vacuum adjustment ring, which can provide negative pressure to the first position 211 of the protective film skirt 222, so that the first position 211 of the protective film skirt 222 is adsorbed onto the protective film tension adjustment ring 203.

[0038] Optionally, the cutting angle adjustment ring 204 is located 2mm-15mm above the protective film tension adjustment ring 203 in the horizontal direction, that is, the cutting angle adjustment ring 204 and the protective film tension adjustment ring 203 are positioned at... Figure 2 The height difference y is 2mm-15mm. The protective film tension adjustment ring 203 is located 2mm-15mm outside the cutting angle adjustment ring 204, that is, the horizontal distance x between the protective film tension adjustment ring 203 and the cutting angle adjustment ring 204 is 2mm-15mm. The ring width w of the cutting angle adjustment ring is 2mm-10mm.

[0039] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this application.

Claims

1. A device for taking a taiko drum ring, characterized in that, The taiko ring removal device includes: a protective film tension adjustment ring and a cutting angle adjustment ring that can contact the lower surface of the skirt of the protective film; the protective film can adhere to the surface of the wafer with the taiko ring, and the skirt of the protective film extends beyond the taiko ring; The protective film tension adjustment ring is located outside the cutting angle adjustment ring and adsorbs the first position of the protective film skirt. The protective film tension adjustment ring applies a downward adsorption force to the first position of the protective film skirt, and can move up and down to adjust the tension of the protective film. The cutting angle adjustment ring is located above the protective film tension adjustment ring in the horizontal direction and supports the second position of the protective film skirt. The cutting angle adjustment ring applies an upward supporting force to the second position of the protective film skirt and can move up and down to adjust the angle between the protective film skirt and the lower surface of the drum ring. The angle is the cutting angle. The second position of the protective film skirt is located between the first position of the protective film skirt and the edge position of the drum ring.

2. The taiko ring taking device as described in claim 1, characterized in that, The protective film skirt between the second position and the edge of the drum ring is the first skirt portion; The first skirt edge gradually slopes downwards from the edge of the taiko ring, and the angle between the first skirt edge and the lower surface of the taiko ring is the entry angle.

3. The taiko ring taking device as described in claim 1, characterized in that, The protective film tension adjustment ring is a vacuum adjustment ring.

4. The taiko ring taking device as described in claim 1, characterized in that, The cutting angle adjustment ring is located 2mm-15mm above the horizontal direction of the protective film tension adjustment ring.

5. The taiko ring taking device as described in claim 1, characterized in that, The protective film tension adjustment ring is located 2mm-15mm outside the cutter angle adjustment ring.

6. The taiko ring taking device as described in claim 1, characterized in that, The width of the tool entry angle adjustment ring is 2mm-10mm.

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