Stacking device and stacking machine

Abstract

This application relates to the field of semiconductor manufacturing technology, specifically to a stacking apparatus and stacking machine, including a stacking worktable and an upper die assembly. The stacking worktable includes a lower die and a positioning pin, the positioning pin being for extending from the top surface of the lower die. The upper die assembly includes an upper die, and a positioning hole is formed on the bottom surface of the upper die, the positioning hole being for engaging with the positioning pin. The purpose of this application is to address the problem that existing stacking apparatuses only use vacuum adsorption to fix ceramic films, resulting in unstable positioning of the ceramic films and easy movement of the ceramic films during the stacking process, reducing stacking accuracy and product quality. This application provides a stacking apparatus and stacking machine.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more specifically, to a stacking apparatus and a stacking machine. Background Technology

[0002] As electronic devices continue to evolve towards miniaturization, lightweight design, and high performance, multilayer electronic components are widely used. Ceramic diaphragm lamination is a key process in the manufacturing of these components, and lamination equipment is used in this production process. Existing lamination equipment uses only vacuum adsorption to fix the ceramic diaphragms during lamination, which is not a secure method. This allows the ceramic diaphragms to easily shift during lamination, reducing lamination accuracy and product quality. Summary of the Invention

[0003] The purpose of this application is to address the problem that existing lamination devices only use vacuum adsorption to fix ceramic diaphragms, which does not provide a secure position for the ceramic diaphragms and makes them prone to movement during the lamination process, thus reducing lamination accuracy and product quality. The application provides a lamination device and lamination machine.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] This application provides a stacking device, including a stacking worktable and an upper die assembly. The stacking worktable includes a lower die and a positioning pin. The positioning pin is used to extend from the top surface of the lower die. The upper die assembly includes an upper die, and a positioning hole is formed on the bottom surface of the upper die. The positioning hole is used to cooperate with the positioning pin.

[0006] Optionally, the stacking worktable further includes a worktable body, the positioning pin is fixed to the worktable body, and a through hole is formed on the lower pressing die, the through hole corresponding to the position of the positioning pin, so that the lower pressing die can move vertically relative to the worktable body.

[0007] The beneficial effect of this technical solution is that, after the ceramic diaphragm is stacked, the lower die can be raised, which will drive the stacked ceramic diaphragm to rise and separate from the positioning pin, and then the stacked ceramic diaphragm can be removed, which facilitates the unloading of the stacked ceramic diaphragm.

[0008] Optionally, the stacking worktable further includes a guide and a drive. One end of the drive is connected to the worktable body, and the other end of the drive is connected to the lower die, so that the top surface of the lower die can be higher than the top of the positioning pin. The guide is installed on the worktable body and is used to slide with the lower die to guide the movement of the lower die in the vertical direction.

[0009] The beneficial effects of this technical solution are as follows: that is, when the pressure of the upper die is not applied to the lower die, under the action of the driving component, the top surface of the lower die can be higher than the top of the positioning pin, and the positioning pin is hidden inside the lower die. When the ceramic diaphragm is stacked, under the action of the pressure of the upper die and the gravity of the lower die itself, the lower die moves down, and the positioning pin extends from the top surface of the lower die. After the stacking is completed, the lower die rises again under the action of the driving component, and the ceramic diaphragm is separated from the positioning pin, which facilitates the unloading of the stacked ceramic diaphragm.

[0010] Optionally, the upper die assembly includes a frame, a linear drive, a connecting plate, and a tie rod. The connecting plate is horizontally positioned, the upper die is mounted on the bottom surface of the connecting plate, a connector is fixed to the top surface of the connecting plate, the top end of the tie rod is fixed to the linear drive, and the bottom end of the tie rod is fitted with the connector so that the tie rod and the connector can slide in the vertical direction, and the tie rod can drive the connecting plate to move in the vertical direction.

[0011] Optionally, the connector is a sleeve-shaped structure, and the connector is fitted onto the bottom end of the pull rod. A first limiting part is formed on the inner edge of the top port of the connector, and a second limiting part is formed on the outer edge of the bottom end of the pull rod. The first limiting part is used to cooperate with the second limiting part. In the vertical direction, the distance between the first limiting part and the top surface of the connecting plate is greater than the vertical dimension of the second limiting part.

[0012] The beneficial effects of this technical solution are as follows: When the linear drive component moves the pull rod up and down, the pull rod can also move the connecting plate and the upper die up and down through the cooperation between the first and second limiting parts. When the ceramic diaphragm is stacked, the position of the upper die in the vertical direction remains basically unchanged. Since the distance between the first limiting part and the top surface of the connecting plate in the vertical direction is greater than the dimension of the second limiting part in the vertical direction, the pull rod can still move down a certain distance within the connecting component without contacting the top surface of the connecting plate. This achieves a flexible connection between the upper die and the linear drive component through the pull rod. When the processing error of the upper die affects the stacking accuracy of the upper die, the above-mentioned flexible connection can allow the upper die to adapt appropriately to the shape and size of the ceramic diaphragm, reducing the impact on production accuracy to a low level.

[0013] Optionally, the upper mold assembly includes two tie rods, which are symmetrically arranged on both sides of the linear drive member in the horizontal direction. Two connectors are fixed on the connecting plate, and the two connectors are matched with the two tie rods in a one-to-one correspondence.

[0014] The beneficial effect of this technical solution is that it improves the stability of the linear drive component in moving the connecting plate and the upper die.

[0015] Optionally, the upper mold assembly further includes a pad and a disc spring. The disc spring is mounted on the top surface of the connecting plate. The pad is located between the linear drive and the disc spring, and the pad is in contact with the linear drive and the disc spring. The pad is used to transmit the force of the linear drive to the disc spring.

[0016] The beneficial effects of this technical solution are as follows: In this way, during the stacking process, the top surface of the connecting plate only generates force with the disc spring, and does not generate force with the tie rod. When the connecting plate moves upward, the disc spring does not generate force with the connecting plate, but only the tie rod generates force with the connecting plate, thereby further realizing the flexible connection between the linear drive component and the upper die.

[0017] Optionally, the upper pressure mold assembly further includes a pressure sensor mounted on the linear drive member, wherein the pressure sensor is located between the linear drive member and the pad in the vertical direction, and the pressure sensor is in contact with the pad.

[0018] The beneficial effect of this technical solution is that pressure information can be obtained in a timely manner by setting up sensors, which facilitates further control based on the pressure information.

[0019] Optionally, the upper mold assembly further includes a vacuum shroud, which is fitted onto the upper mold and slides in the vertical direction. A first sealing ring is provided between the inner wall of the vacuum shroud and the outer wall of the upper mold. A port for fitting with the upper surface of the lower mold is formed at the bottom of the vacuum shroud, and a second sealing ring is provided at the outer edge of the port. A vacuum hole is formed on the upper mold.

[0020] The beneficial effects of this technical solution are as follows: Before lamination, the lower mold is located at the bottom of the vacuum chamber. During lamination, the port of the vacuum chamber is fitted with the upper surface of the lower mold and sealed with the lower mold by a second sealing ring. This creates a vacuum chamber between the upper mold, the vacuum chamber, and the lower mold. The vacuum chamber is then evacuated through a vacuum hole before lamination. This vacuum environment reduces the likelihood of air bubbles forming between the ceramic diaphragms during lamination.

[0021] Another aspect of this application provides a stacking machine, including the stacking apparatus provided in this application.

[0022] The technical solution provided in this application can achieve the following beneficial effects:

[0023] The lamination apparatus and lamination machine provided in this application first place the ceramic diaphragm on the lower die before laminating it. The ceramic diaphragm is then positioned using positioning pins that engage with through-holes in the diaphragm and vacuum adsorption. During the lamination process, the positioning pins engage with positioning holes in the upper die to prevent them from obstructing the lamination process. This positioning of the ceramic diaphragm by the positioning pins during lamination makes it less prone to movement, improving lamination accuracy and product quality.

[0024] The additional technical features and advantages of this application will become more apparent from the following description or from practical application. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the specific embodiments of this application, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a front view schematic diagram of one embodiment of the stacking device provided in this application.

[0027] Figure 2 A side view of one embodiment of the stacking device provided in this application;

[0028] Figure 3 This is a front view structural schematic diagram of one embodiment of the stacking worktable provided in this application;

[0029] Figure 4 A top view of one embodiment of the stacking worktable provided in this application;

[0030] Figure 5 A bottom view of one embodiment of the upper pressure mold provided in this application;

[0031] Figure 6 A top view schematic diagram of one embodiment of the vacuum chamber provided in this application;

[0032] Figure 7 This is a partial structural schematic diagram of one embodiment of the upper molding assembly provided in this application.

[0033] Figure 8 This is a partial structural schematic diagram of one embodiment of the upper molding assembly provided in this application.

[0034] Figure label:

[0035] 1-First sealing ring; 2-Second sealing ring;

[0036] 3-Frame; 4-Lower die;

[0037] 5-Upper mold; 6-Vacuum chamber;

[0038] 7-Connecting plate; 8-Pressure sensor;

[0039] 9-Linear drive component; 10-Vacuum enclosure;

[0040] 11-Spring; 12-Guide post;

[0041] 13-Workbench body; 14-Positioning pin;

[0042] 15 - Tear-off position; 16 - Positioning hole;

[0043] 17 - Port; 18 - Disc spring;

[0044] 19-Padded block; 20-Pull rod;

[0045] 21-Connector; 22-Heating plate. Detailed Implementation

[0046] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] like Figures 1 to 8 As shown, this application provides a stacking device, including a stacking worktable and an upper pressing die assembly. The stacking worktable includes a lower pressing die 4 and a positioning pin 14. The positioning pin 14 is used to extend from the top surface of the lower pressing die 4. The upper pressing die assembly includes an upper pressing die 5. A positioning hole 16 is formed on the bottom surface of the upper pressing die 5. The positioning hole 16 is used to cooperate with the positioning pin 14.

[0050] In this embodiment, the number of positioning pins 14 and positioning holes 16 is preferably multiple, such as 2-10, preferably 8, and a film tearing position 15 is provided on the top surface of the lower mold 4.

[0051] The lamination apparatus provided in this application first places the ceramic diaphragm on the lower die 4 before laminating it. The diaphragm is then positioned using a positioning pin 14 that engages with a through-hole on the diaphragm and vacuum adsorption. During the lamination process, the positioning pin 14 engages with a positioning hole 16 on the upper die 5, preventing the positioning pin 14 from obstructing the lamination process. Thus, by positioning the ceramic diaphragm with the positioning pin 14 during lamination, the diaphragm is less prone to movement, improving lamination accuracy and product quality.

[0052] Optionally, the stacking worktable further includes a worktable body 13, with the positioning pin 14 fixed to the worktable body 13. A through hole is formed on the lower pressing mold 4, and the through hole corresponds to the position of the positioning pin 14, allowing the lower pressing mold 4 to move vertically relative to the worktable body 13. When the lower pressing mold 4 moves vertically relative to the worktable body 13, the through hole and the positioning pin 14 slide into each other. Thus, after the ceramic diaphragm is stacked, the lower pressing mold 4 can be raised, causing the stacked ceramic diaphragm to rise and separate from the positioning pin 14, allowing the stacked ceramic diaphragm to be removed for easy unloading.

[0053] Optionally, the stacking worktable also includes a guide and a drive. One end of the drive is connected to the worktable body 13, and the other end is connected to the lower die 4, so that the top surface of the lower die 4 can be higher than the top of the positioning pin 14. The guide is installed on the worktable body 13 and is used to slide with the lower die 4 to guide the vertical movement of the lower die 4. That is, when the pressure of the upper die 5 is not applied to the lower die 4, under the action of the drive, the top surface of the lower die 4 can be higher than the top of the positioning pin 14, and the positioning pin 14 is hidden inside the lower die 4. When stacking ceramic diaphragms, under the action of the pressure of the upper die 5 and the weight of the lower die 4 itself, the lower die 4 moves downward, and the positioning pin 14 protrudes from the top surface of the lower die 4. After stacking is completed, the lower die 4 rises again under the action of the drive, and the ceramic diaphragm is separated from the positioning pin 14, which facilitates the unloading of the stacked ceramic diaphragm. In this embodiment, the driving component can be an elastic component such as a disc spring or a rubber spring.

[0054] Optionally, the stacking device provided in this application embodiment includes a frame 3. The upper die 5 assembly further includes a linear drive 9, a connecting plate 7, and a pull rod 20. The connecting plate 7 is horizontally arranged, and the upper die 5 is installed on the bottom surface of the connecting plate 7. A connector 21 is fixed on the top surface of the connecting plate 7. The top end of the pull rod 20 is fixed to the linear drive 9, and the bottom end of the pull rod 20 is fitted with the connector 21, so that the pull rod 20 and the connector 21 can slide in the vertical direction, and the pull rod 20 can drive the connecting plate 7 to move in the vertical direction. In this application embodiment, the linear drive 9 is preferably a hydraulic cylinder.

[0055] Optionally, the connector 21 is a sleeve-shaped structure, and the connector 21 is fitted onto the bottom end of the pull rod 20. A first limiting part is formed on the inner edge of the top port of the connector 21, and a second limiting part is formed on the outer edge of the bottom end of the pull rod 20. The first limiting part is used to cooperate with the second limiting part. In the vertical direction, the distance between the first limiting part and the top surface of the connecting plate 7 is greater than the vertical dimension of the second limiting part. Thus, when the linear drive 9 moves the pull rod 20 up and down, the pull rod 20 can also move the connecting plate 7 and the upper die 5 up and down through the cooperation between the first and second limiting parts. When the ceramic diaphragm is being stacked, the position of the upper die 5 in the vertical direction remains basically unchanged. Since the distance between the first limiting part and the top surface of the connecting plate 7 in the vertical direction is greater than the dimension of the second limiting part in the vertical direction, the pull rod 20 can still move down a certain distance within the connecting member 21 without contacting the top surface of the connecting plate 7. This achieves a flexible connection between the upper die 5 and the linear drive 9 through the pull rod 20. When the processing error of the upper die 5 affects the stacking accuracy of the upper die 5, the above-mentioned flexible connection can allow the upper die 5 to appropriately adapt to the shape and size of the ceramic diaphragm, reducing the impact on production accuracy to a low level. Of course, the bottom end of the pull rod 20 can also be a sleeve-shaped structure, with the bottom end of the pull rod 20 sleeved on the connecting member 21, forming a limiting structure between the pull rod 20 and the connecting member 21.

[0056] Optionally, the upper die 5 assembly includes two tie rods 20, which are symmetrically arranged on both sides of the linear drive member 9 in the horizontal direction. Two connectors 21 are fixed on the connecting plate 7, and the two connectors 21 are matched one-to-one with the two tie rods 20. This improves the stability of the linear drive member 9 in moving the connecting plate 7 and the upper die 5.

[0057] Optionally, the upper die 5 assembly further includes a pad 19 and a disc spring 18. The disc spring 18 is mounted on the top surface of the connecting plate 7, and the pad 19 is located between the linear drive member 9 and the disc spring 18, and the pad 19 contacts both the linear drive member 9 and the disc spring 18. The pad 19 is used to transmit the force of the linear drive member 9 to the disc spring 18. Thus, during stacking, the top surface of the connecting plate 7 only interacts with the disc spring 18, not with the pull rod 20. When the connecting plate 7 moves upward, there is no interaction between the disc spring 18 and the connecting plate 7, only between the pull rod 20 and the connecting plate 7, further achieving a flexible connection between the linear drive member 9 and the upper die 5. Of course, in some embodiments, the pad 19 and the disc spring 18 may be omitted, and the pressure between the linear drive member 9 and the upper die 5 may be directly transmitted through the pull rod 20. In this embodiment, the butterfly spring 18 is preferably a disc-shaped butterfly spring 18.

[0058] Optionally, the upper pressure mold 5 assembly further includes a pressure sensor 8 mounted on the linear drive 9. In the vertical direction, the pressure sensor 8 is located between the linear drive 9 and the pad 19, and the pressure sensor 8 is in contact with the pad 19. By setting the sensor, pressure information can be acquired in a timely manner, thus facilitating further control based on this pressure information. It is understood that in this case, the pad 19 is indirectly in contact with the linear drive 9 through the pressure sensor 8.

[0059] Optionally, the upper mold 5 assembly further includes a vacuum chamber 10, which is fitted onto the upper mold 5 and slides vertically with it. A first sealing ring 1 is provided between the inner wall of the vacuum chamber 10 and the outer wall of the upper mold 5. A port 17 for contacting the upper surface of the lower mold 4 is formed at the bottom of the vacuum chamber 10, and a second sealing ring 2 is provided along the outer edge of the port 17. A vacuum hole is formed on the upper mold 5. Before lamination, the lower mold 4 is located below the vacuum chamber 10. During lamination, the port 17 of the vacuum chamber 10 is in contact with the upper surface of the lower mold 4 and is sealed with the lower mold 4 by the second sealing ring 2. Thus, a vacuum chamber 6 is formed between the upper mold 5, the vacuum chamber 10, and the lower mold 4. At this time, the vacuum chamber 6 is evacuated through the vacuum hole, and lamination is performed after evacuation. In this way, lamination is performed in a vacuum environment, making it less likely for air bubbles to form between the ceramic films during lamination. In this embodiment of the application, preferably, the upper pressure mold 5 assembly also includes a heating plate 22 installed above the upper pressure mold 5, and the vacuum chamber 6 is suspended from the heating plate 22 by a spring 11 and a guide post 12, thereby ensuring that the vacuum chamber 6 can be formed before the upper pressure mold 2 and the lower pressure mold 4 come into contact, so as to realize the vacuuming of the ceramic diaphragm first, and then the ceramic diaphragm is stacked.

[0060] Another aspect of this application provides a stacking machine, including the stacking apparatus provided in this application.

[0061] The laminating machine provided in this application embodiment employs the laminating device provided in this application. Before laminating the ceramic diaphragm, the ceramic diaphragm is first placed on the lower die 4, and positioned by the positioning pin 14 engaging with the through hole on the ceramic diaphragm and by vacuum adsorption. During the lamination process, the positioning pin 14 engages with the positioning hole 16 on the upper die 5 to prevent the positioning pin 14 from obstructing the lamination process. In this way, the positioning of the ceramic diaphragm by the positioning pin 14 during the lamination process makes it less prone to movement, improving lamination accuracy and product quality.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A stacking device, characterized in that, The device includes a stacking worktable and an upper die assembly. The stacking worktable includes a lower die and a positioning pin. The positioning pin extends from the top surface of the lower die. The upper die assembly includes an upper die, and a positioning hole is formed on the bottom surface of the upper die. The positioning hole is used to cooperate with the positioning pin. The stacking device includes a frame, and the upper die assembly further includes a linear drive, a connecting plate, and a pull rod. The connecting plate is horizontally arranged, and the upper die is mounted on the bottom surface of the connecting plate. A connector is fixed on the top surface of the connecting plate. The top end of the pull rod is fixed to the linear drive, and the bottom end of the pull rod is fitted with the connector so that the pull rod and the connector can slide in the vertical direction, and the pull rod can drive the connecting plate to move in the vertical direction. The connector is a sleeve-shaped structure and is fitted on the bottom end of the pull rod. A first limiting part is formed on the inner edge of the top port of the connector, and a second limiting part is formed on the outer edge of the bottom end of the pull rod. The first limiting part is used to cooperate with the second limiting part. In the vertical direction, the distance between the first limiting part and the top surface of the connecting plate is greater than the vertical dimension of the second limiting part.

2. The stacking device according to claim 1, characterized in that, The stacking worktable also includes a worktable body, the positioning pin is fixed to the worktable body, and a through hole is formed on the lower pressing die, the through hole corresponding to the position of the positioning pin, so that the lower pressing die can move vertically relative to the worktable body.

3. The stacking device according to claim 2, characterized in that, The stacking worktable also includes a guide and a drive. One end of the drive is connected to the worktable body, and the other end of the drive is connected to the lower die, so that the top surface of the lower die can be higher than the top of the positioning pin. The guide is installed on the worktable body and is used to slide with the lower die to guide the movement of the lower die in the vertical direction.

4. The stacking device according to claim 1, characterized in that, The upper mold assembly includes two tie rods, which are symmetrically arranged on both sides of the linear drive member in the horizontal direction. Two connectors are fixed on the connecting plate, and the two connectors are matched with the two tie rods in a one-to-one correspondence.

5. The stacking device according to claim 1, characterized in that, The upper mold assembly also includes a pad and a disc spring. The disc spring is mounted on the top surface of the connecting plate. The pad is located between the linear drive and the disc spring, and the pad is in contact with the linear drive and the disc spring. The pad is used to transmit the force of the linear drive to the disc spring.

6. The stacking device according to claim 5, characterized in that, The upper pressure mold assembly also includes a pressure sensor mounted on the linear drive member. In the vertical direction, the pressure sensor is located between the linear drive member and the pad, and the pressure sensor is in contact with the pad.

7. The stacking apparatus according to any one of claims 1-6, characterized in that, The upper mold assembly also includes a vacuum cover, which is fitted onto the upper mold and slides in the vertical direction. A first sealing ring is provided between the inner wall of the vacuum cover and the outer wall of the upper mold. A port for fitting with the upper surface of the lower mold is formed at the bottom of the vacuum cover. A second sealing ring is provided at the outer edge of the port. A vacuum hole is formed on the upper mold.

8. A stacking press, characterized in that, Includes the stacking apparatus as described in any one of claims 1-7.

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