A mobile phone motherboard maintenance device with anti-static structure

Abstract

The present invention relates to a mobile phone motherboard inspection and repair device, and more specifically, to a mobile phone motherboard inspection and repair device with an anti-static structure. The device comprises a housing, wherein the housing comprises an upper housing and a lower housing, wherein an ion fan is installed at the top position of the upper housing, an air outlet is provided at the bottom of the lower housing, a suction fan is installed inside the air outlet, a clamping assembly is provided in the upper chamber, a support plate is provided above the air outlet in the lower housing, a dust removal assembly is provided on the top of the support plate, and a column slides to drive the long strip hole to change its position in the longitudinal direction to control the connection and closure of the hollow chamber, the upper chamber and the lower chamber. The positive and negative charges blown out by the ion fan in the present invention can neutralize the static electricity on the surface of the mobile phone motherboard, and the column slides to drive the long strip hole to change its position in the longitudinal direction to control the connection and closure of the hollow chamber, the upper chamber and the lower chamber, and the dust particles on the surface of the mobile phone motherboard can be processed under the action of the cooperation between the ion fan and the suction fan.

Description

Technical Field

[0001] The invention relates to a mobile phone mainboard repairing device, in particular to a mobile phone mainboard repairing device with an anti-static structure. Background Art

[0002] A mobile phone, also known as a mobile phone, is a mobile phone that can be held in the hand. The mobile phone has an independent operating system and can be installed by users themselves. Software, games, navigation and other programs provided by third-party service providers, and a general term for mobile phone types that can access wireless networks through mobile communication networks. The motherboard is an integrated circuit board that carries all additional installed parts in the mobile phone. The main electronic components and interfaces, some auxiliary electronic components, circuit systems, and circuit systems for communication between these components are distributed on it. If the mobile phone motherboard is damaged, it will affect the normal use of the mobile phone, and the mobile phone motherboard needs to be repaired in time.

[0003] Mobile phone motherboards usually use PCB boards as insulating materials, and the necessary accessories of mobile phone motherboards: handset, speaker, microphone, screen keyboard motherboard and various chips, capacitors, resistors, batteries, etc., are often prone to static electricity. First, the existence of static electricity will not only cause a large number of dust particles in the air to be adsorbed onto the mobile phone motherboard, but also affect the sensitivity of components on the mobile phone motherboard; second, the existence of static electricity will bring inconvenience to people's maintenance work. During the repair, welding or testing of the mobile phone motherboard, the maintenance personnel are prone to electric shock caused by static electricity, which will not only cause discomfort to the maintenance personnel, but also easily cause injuries due to the conditioned reflex of avoiding collision when being shocked. Third, the existence of static electricity will cause the waste fine particles generated during the maintenance process to be adsorbed on the surface of the mobile phone assembly board. These fine particles will affect the assembly work after the maintenance is completed. Therefore, the mobile phone motherboard needs to be electrostatically treated before, during and after the maintenance of the faulty mobile phone motherboard. In view of this, we propose a mobile phone motherboard maintenance equipment with an anti-static structure. Summary of the invention

[0004] The purpose of the present invention is to provide a mobile phone mainboard repair device with an anti-static structure to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides a mobile phone motherboard maintenance equipment with an anti-static structure, including a shell, the shell including an upper shell and a lower shell, the upper shell is fixedly connected to the lower shell, an ion fan is installed at the top position of the upper shell, an air outlet is opened at the bottom of the lower shell, a suction fan is installed inside the air outlet, a partition is provided inside the upper shell, the partition divides the interior of the upper shell into an upper chamber and a lower chamber, a clamping assembly is provided in the upper chamber, the clamping assembly includes two pull rods, the two pull rods are respectively slidably connected to the opposite side walls of the upper shell, and the pull rod is located at one end in the upper chamber. A clamping jaw is fixedly connected, a first spring is arranged between the clamping jaw and the upper shell, and the first spring is located outside the pull rod, a support plate is arranged in the lower shell above the air outlet, a dust removal assembly is arranged on the top of the support plate, the dust removal assembly includes a column arranged on the support plate, a through hole is arranged on the partition plate, the column is slidably connected with the through hole, a hollow chamber is arranged in the column, and a plurality of long holes are arranged on the periphery of the column corresponding to the positions of the hollow chamber, the long holes are driven to change their positions in the longitudinal direction by sliding of the column to control the connection and closing of the hollow chamber, the upper chamber and the lower chamber.

[0006] As a further improvement of the technical solution, the partition is fixedly connected to the upper shell.

[0007] As a further improvement of the present technical solution, a baffle is fixedly provided on the lower surface of the partition near the front end, a handle is fixedly provided in the middle of the front surface of the baffle, two sliding holes are symmetrically provided in the middle of the front surface of the upper shell, the handle is slidably connected to the sliding holes, and the partition is movably connected to the upper shell.

[0008] As a further improvement of the technical solution, a threaded hole is provided in the middle of the front surface of the handle, a bolt is threadedly connected inside the threaded hole, and the rear end of the bolt is movably matched with the outer wall of the upper shell.

[0009] As a further improvement of the technical solution, the lower ends of the plurality of columns are fixedly connected with second springs, the lower ends of the plurality of second springs are fixedly connected with the support plate, and the upper ends of the two clamping jaws are hingedly provided with U-shaped rods on opposite sides.

[0010] As a further improvement of the technical solution, a protrusion is fixedly provided on the opposite sides of the front ends of the two clamping jaws near the upper end, and the protrusion is in a "triangle" shape.

[0011] As a further improvement of the technical solution, multiple bosses are provided in a circular array on the upper ends of the multiple columns.

[0012] As a further improvement of the technical solution, the partition has a sealing ring fixedly provided at a plurality of through holes on the lower surface thereof, and the sealing ring is slidably connected to the column.

[0013] As a further improvement of the technical solution, when the upper end of the column is not subjected to force, the upper end of the column is higher than the upper surface of the U-shaped rod.

[0014] As a further improvement of the technical solution, an inspection opening is provided at the front end of the upper shell located at the upper chamber, and a sealed viewing window is hinged at the inspection opening.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the mobile phone motherboard repairing equipment with an anti-static structure, multiple long holes are located at the through hole to ensure that the upper chamber, the long holes, the hollow chamber, the lower chamber and the lower shell are interconnected, so that the suction fan can absorb the dust particles blown off by the ion fan before the mobile phone motherboard is repaired, and absorb the dust particles into the interior of the lower shell through the multiple long holes;

[0017] In addition, multiple long holes are located on the lower surface of the partition, so that the upper chamber of the upper shell is in a closed state, which is conducive to preventing the loss of positive and negative charges blown out by the ion fan. A large number of positive and negative charges are located inside the upper chamber, which is conducive to improving the efficiency of neutralizing the charges on the surface of the mobile phone motherboard;

[0018] Again, multiple long holes are located at the through holes, so that the ion fan can blow off the waste fine particles generated during the maintenance process on the surface of the mobile phone motherboard, which plays an auxiliary role in the assembly work after the maintenance is completed.

[0019] 2. In the mobile phone motherboard repair equipment with an anti-static structure, by pulling the pull rod to the left and right sides of the outer wall of the upper shell, the clamping claws at the end of the pull rod located at one end of the upper chamber can clamp and fix the mobile phone motherboard, which is beneficial to ensure the stability of the position of the mobile phone motherboard during the repair process, and under the action of the contraction or relaxation of the first spring, the clamping claws can be suitable for clamping and fixing mobile phone motherboards of different sizes.

[0020] 3. In the mobile phone motherboard maintenance equipment with an anti-static structure, the positive and negative charged airflows blown out by the ion fan can neutralize the static electricity on the mobile phone motherboard, which is helpful to avoid the discomfort caused by electric shock caused by static electricity when the maintenance personnel are repairing the mobile phone motherboard, and prevent the maintenance personnel from being injured unnecessary due to the conditioned reflex of avoiding collision when being shocked. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a cross-sectional view of the overall structure of the present invention;

[0023] Figure 3It is a cross-sectional view of the overall structure of the housing of the present invention;

[0024] Figure 4 This is a first exploded view of the overall structure of the housing of the present invention;

[0025] Figure 5 This is a schematic diagram of the overall structure of the dust removal assembly and the partition of the present invention;

[0026] Figure 6 This is a schematic diagram of the overall structure of the partition of the present invention;

[0027] Figure 7 This is a schematic diagram of the overall structure of the clamping jaw of the present invention;

[0028] Figure 8 The second schematic diagram of the overall structure of the present invention;

[0029] Fig. 9 The second is a cross-sectional view of the overall structure of the present invention;

[0030] Fig.10 It is a schematic diagram of the overall structure of the housing of the present invention;

[0031] Fig.11 This is the second exploded view of the overall structure of the housing of the present invention;

[0032] Fig.12 The second schematic diagram of the overall structure of the dust removal assembly and the partition of the present invention;

[0033] Fig.13 The second schematic diagram of the overall structure of the partition of the present invention;

[0034] Fig.14 This is the second schematic diagram of the overall structure of the clamping jaw of the present invention.

[0035] The meaning of each number in the figure is:

[0036] 1. Shell; 10. Upper shell; 100. Inspection port; 101. Sealed window; 11. Lower shell; 110. Air outlet; 111. Suction fan; 12. Ion fan; 13. Support plate; 14. Partition plate; 140. Through hole; 141. Handle; 1410. Threaded hole; 1411. Bolt; 142. Baffle; 15. Sliding hole;

[0037] 2. dust removal assembly; 20. column; 200. long hole; 21. boss; 22. second spring;

[0038] 3. Clamping assembly; 30. Pull rod; 31. First spring; 32. Clamping claw; 320. Protrusion; 321. U-shaped rod. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined. Example

[0042] See also Figure 1-Figure 7As shown, the present invention provides a mobile phone motherboard maintenance equipment with an anti-static structure, including a shell 1, the shell 1 includes an upper shell 10 and a lower shell 11, the upper shell 10 is fixedly connected to the lower shell 11, an ion fan 12 is installed at the top of the upper shell 10, an air outlet 110 is opened at the bottom of the lower shell 11, and a suction fan 111 is installed inside the air outlet 110, the main purpose of which is: before the ion fan 12 is repaired, a large amount of dust particles on the surface of the mobile phone motherboard can be blown off, when the mobile phone motherboard is repaired, the positive and negative charge airflows blown by the ion fan 12 can neutralize the static electricity on the surface of the mobile phone motherboard, and after the mobile phone motherboard is repaired, the ion fan 12 can be blown for a second time to remove the dust on the surface of the mobile phone motherboard caused by the repair process The waste fine particles generated are blown off, and a partition 14 is provided inside the upper shell 10. The partition 14 divides the interior of the upper shell 10 into an upper chamber and a lower chamber. Its main purpose is: the upper chamber and the lower chamber are different working areas. The mobile phone motherboard is repaired and electrostatically treated in the upper chamber, and the lower chamber is used to collect dust particles on the mobile phone motherboard. A clamping assembly 3 is provided in the upper chamber, and the clamping assembly 3 includes two pull rods 30. The two pull rods 30 are slidably connected to the opposite side walls of the upper shell 10 respectively. One end of the pull rod 30 located in the upper chamber is fixedly connected with a clamping claw 32. A first spring 31 is provided between the clamping claw 32 and the upper shell 10, and the first spring 31 is located outside the pull rod 30. Its main purpose is: by pulling the pull rod 30 to the left and right sides of the outer wall of the upper shell 10, it can The clamping claw 32 at the end of the pull rod 30 is driven to squeeze the first spring 31, so that the two clamping claws 32 move away from each other, thereby expanding the distance between the two, which is convenient for placing the mobile phone motherboard. At this time, the pull rod 30 is released, and the clamping claw 32 at the end of the pull rod 30 clamps and fixes the mobile phone motherboard under the elastic force of the first spring 31, and the clamping claw 32 is suitable for clamping and fixing mobile phone motherboards of different sizes. A support plate 13 is provided above the air outlet 110 in the lower shell 11, and a dust removal component 2 is provided on the top of the support plate 13. The dust removal component 2 includes a column 20 arranged on the support plate 13, and a through hole 140 is opened on the partition 14. The column 20 is slidably connected with the through hole 140. A hollow chamber is arranged in the column 20, and a plurality of holes are opened at the position corresponding to the hollow chamber on the periphery of the column 20. The main purpose of the long hole 200 is to drive the long hole 200 to change its position in the longitudinal direction by sliding the column 20 to control the connection and closure of the hollow chamber, the upper chamber and the lower chamber. When the long hole 200 is located at the through hole 140, the hollow chambers, the upper chamber and the lower chamber inside the plurality of columns 20 are connected. At this time, the ion fan 12 blows off a large amount of dust on the surface of the mobile phone motherboard, and the suction fan 111 absorbs a large amount of dust particles into the lower shell 11 and discharges them from the air outlet 110. When the long hole 200 is located at the lower part of the through hole 140, the through hole 140 is sealed by the outer wall of the column 20, effectively preventing the positive and negative charges blown out by the ion fan 12 in the upper chamber from flowing to the lower chamber, so that the mobile phone motherboard is in a closed environment full of positive and negative charges.It is beneficial to carry out static treatment on the mobile phone motherboard, and brings convenience to the repair, welding and overhaul of the mobile phone motherboard. After the overhaul of the mobile phone motherboard is completed, when the long hole 200 is located at the through hole 140 again, the hollow chambers, upper chambers and lower chambers inside the multiple columns 20 are connected, and then the suction fan 111 blows off the waste fine particles generated during the overhaul, which plays an auxiliary role in the assembly work after the overhaul is completed.

[0043] In addition, the two ends of the mobile phone mainboard are clamped and fixed by the clamping claws 32, and the lower surface of the mobile phone mainboard lacks support and has insufficient stability. The multiple columns 20 can support the lower surface of the mobile phone mainboard.

[0044] Among them, the ion fan 12 is also called an ion blower, and its main function is to remove static electricity and prevent static electricity pollution and damage; it is generally divided into desktop ion blowers, horizontal ion blowers, hanging ion blowers, and micro ion blowers. The ion fan 12 of the present invention is preferably: a hanging ion blower.

[0045] The working principle of the ion fan 12 is: the ion fan can generate a large amount of airflow with positive and negative charges to neutralize the charges on the object; when the charge on the surface of the object is negative, it will absorb the positive charge in the airflow, and when the charge on the surface of the object is positive, it will absorb the negative charge in the airflow, thereby neutralizing the static electricity on the surface of the object and achieving the purpose of eliminating static electricity.

[0046] Working process: before the inspection, the mobile phone motherboard is placed on the upper end of the plurality of columns 20, so that the ion fan 12 first blows off a large amount of dust particles on the surface of the mobile phone motherboard. At this time, the long holes 200 on the plurality of columns 20 are located at the through holes 140, and the hollow chambers, upper chambers and lower chambers inside the plurality of columns 20 are connected. At this time, the ion fan 12 blows off a large amount of dust on the surface of the mobile phone motherboard, and the suction fan 111 absorbs a large amount of dust particles into the lower shell 11 and discharges them from the air outlet 110; after the dust particles on the surface of the mobile phone motherboard are cleaned, the pull rod 30 is pulled to the left and right sides of the outer wall of the upper shell 10, so that the clamping claws 32 at the ends of the pull rod 30 can clamp and fix the mobile phone motherboard;

[0047] When repairing the mobile phone motherboard, when the long hole 200 is located at the lower part of the through hole 140, the through hole 140 is sealed by the outer wall of the column 20, which effectively prevents the positive and negative charges blown out by the ion fan 12 in the upper chamber from flowing into the lower chamber, so that the mobile phone motherboard is in a closed environment full of positive and negative charges, which is beneficial to the electrostatic treatment of the mobile phone motherboard; and after the repair work of the mobile phone motherboard is completed, when the long hole 200 is located at the through hole 140 again, the hollow chambers, upper chambers and lower chambers inside the multiple columns 20 are connected, so that the suction fan 111 can blow off the waste fine particles generated during the repair process, which plays an auxiliary role in the assembly work after the repair is completed.

[0048] See also Figure 2 or Figure 3 The partition 14 is fixedly connected to the upper shell 10. When the plurality of columns 20 slide relative to the through holes 140 on the surface of the partition 14, the partition 14 fixedly connected to the upper shell 10 can play a role in ensuring the stability of the structure.

[0049] Based on the above, further public introduction is made: a method and process for controlling the connection and closure of the hollow chamber, the upper chamber and the lower chamber by sliding the column 20 to drive the long hole 200 to change its position in the longitudinal direction, a plurality of second springs 22 are fixedly connected to the lower ends of the columns 20, the lower ends of the plurality of second springs 22 are fixedly connected to the support plate 13, the upper ends of the two clamping jaws 32 are hingedly provided with a U-shaped rod 321 on the opposite sides, before the mobile phone motherboard is tested, the second spring 22 is in a relaxed state, at this time, the hollow chamber, the upper chamber and the lower chamber are connected, placing the mobile phone motherboard on the upper ends of the plurality of columns 20, can facilitate the ion fan 12 to blow off a large amount of dust particles on the surface of the mobile phone motherboard at a close distance; the dust particles are then blown off by the suction fan 111 After the cleaning is completed, the U-shaped rod 321 is opened, and the mobile phone motherboard is pressed downward, while driving multiple columns 20 to compress the second spring 22, and driving the long hole 200 to slide to the lower part of the through hole 140, so that the hollow chamber, the upper chamber and the lower chamber are connected and closed, which can prevent the loss of the ion charge airflow blown by the ion fan 12, which is beneficial to the electrostatic treatment of the mobile phone motherboard; when the mobile phone motherboard maintenance work is completed, slowly pull the pull rod 30 to the left and right sides of the outer wall of the upper shell 10, so that the clamping claw 32 can release the mobile phone motherboard, at this time The second spring 22 returns to the relaxed state again, and drives multiple columns 20 to push the mobile phone motherboard to the position before the mobile phone motherboard detection, so that the ion fan 12 can blow off the waste fine particles generated during the mobile phone maintenance process again.

[0050] Furthermore, when the plurality of columns 20 push the mobile phone mainboard, the U-shaped rod 321 can block the mobile phone mainboard, thereby preventing the mobile phone mainboard from bouncing off due to the elastic force of the second spring 22 and causing unnecessary damage.

[0051] It should be noted that in order to ensure that the mobile phone motherboard can be stably clamped under the cooperation of the clamping jaws 32 and multiple columns 20, a protrusion 320 is fixedly provided on the opposite side of the front end of the two clamping jaws 32 near the upper end, and the protrusion 320 is "triangular" in shape. When the mobile phone motherboard is pressed downward, so that the mobile phone motherboard drives multiple columns 20 to compress the second spring 22 downward, the "triangular" shaped protrusion 320 not only facilitates the mobile phone motherboard to slide down along the inclined surface of the "triangular" protrusion 320, but also allows the lower surface of the "triangular" protrusion 320 to press against the upper surfaces of the two ends of the mobile phone motherboard (at this time, the columns 20 need to cooperate to support the lower surface of the mobile phone motherboard).

[0052] As mentioned above, multiple columns 20 are against the lower surface of the mobile phone motherboard, and the lower surface of the mobile phone motherboard often has uneven protrusions (the protrusions include solder joints generated during the welding process of electronic components), and the upper ends of the multiple columns 20 are provided with multiple bosses 21 in a circular array. The multiple bosses 21 can reduce the contact area with the lower surface of the mobile phone motherboard, and gaps are left between the multiple bosses 21. The gaps can be used to accommodate the welding protrusions of electronic components and facilitate the air intake of the hollow chamber.

[0053] Furthermore, since the through hole 140 needs to be sealed when the mobile phone motherboard is repaired, on the one hand, it is beneficial to neutralize the positive and negative charges blown out by the ion fan 12 with the static electricity on the mobile phone motherboard, the partition 14 has a lower surface located at multiple through holes 140 and is fixed with sealing rings, which are slidably connected to the column 20, and the sealing ring can play a sealing role.

[0054] It should be noted that before maintenance, the mobile phone motherboard needs to be placed on the upper ends of multiple columns 20 so that the ion fan 12 can first blow off a large amount of dust particles on the surface of the mobile phone motherboard. When the upper ends of the columns 20 are not subjected to force, the upper ends of the columns 20 are higher than the upper surface of the U-shaped rod 321.

[0055] In addition, in order to facilitate maintenance personnel to carry out maintenance work on the mobile phone motherboard and to facilitate maintenance personnel to observe the electrostatic treatment of the mobile phone motherboard when it is stationary inside the upper shell 10, an inspection port 100 is opened at the front end of the upper shell 10 at the upper chamber, and a sealed window 101 is hinged at the inspection port 100. It should be noted here that: during maintenance, the inspection port 100 is in an open state, but the ion fan 12 blows downward, but some positive and negative charge airflows will overflow through the inspection port 100, so the through hole 140 needs to be sealed to ensure the amount of positive and negative charges in the upper chamber.

[0056] When the mobile phone motherboard inspection device with an anti-static structure of the present invention is used, the mobile phone motherboard is placed on the upper end of the plurality of columns 20, so that the ion fan 12 first blows off a large amount of dust particles on the surface of the mobile phone motherboard, and then the suction fan 111 sucks the large amount of dust particles blown off by the ion fan 12 into the lower shell 11 through the long strip hole 200 and discharges them from the air outlet 110;

[0057] After the dust particles on the surface of the mobile phone mainboard are cleaned, the U-shaped rod 321 is opened, and the mobile phone mainboard is pressed downward, so that the mobile phone mainboard slides down along the inclined surface of the "triangular" protrusion 320, until the lower surface of the "triangular" protrusion 320 abuts against the upper surfaces of the two ends of the mobile phone mainboard, and the multiple columns 20 abut against the lower surface of the mobile phone mainboard. The cooperation of the clamping claws 32 and the multiple columns 20 clamps the mobile phone mainboard stably, and while pressing the mobile phone mainboard downward, the mobile phone mainboard can drive the multiple columns 20 to slide to the lower part of the through hole 140 and compress the second spring 22. When the multiple columns 20 slide to make the long hole 200 located at the lower part of the through hole 140, the through hole 140 is sealed by the outer wall of the column 20, effectively preventing the positive and negative charges blown out by the ion fan 12 in the upper chamber from flowing to the lower chamber, which is beneficial to the electrostatic treatment of the mobile phone mainboard;

[0058] When the inspection of the mobile phone motherboard is completed, the pull rod 30 is slowly pulled toward the left and right sides of the outer wall of the upper shell 10 to make the clamping claws 32 release the mobile phone motherboard. At this time, the second spring 22 returns to the relaxed state again, and drives the multiple columns 20 to push the mobile phone motherboard to the position before the mobile phone motherboard inspection. In addition, the U-shaped rod 321 can block the mobile phone motherboard to prevent the mobile phone motherboard from bouncing off due to the rebound force of the relaxation of the second spring 22. Example

[0059] In order to clamp and fix the mobile phone mainboard stably at one time before, during and after the repair of the mobile phone mainboard, and to prevent the mobile phone mainboard from being repeatedly adjusted so that the clamping claws 32 and the plurality of columns 20 clamp the mobile phone mainboard more than once, thus causing secondary damage to the mobile phone mainboard, the following improvements are made on the basis of Example 1:

[0060] See also Figure 8-Figure 14, wherein, a baffle 142 is fixedly provided on the lower surface of the partition 14 near the front end, a handle 141 is fixedly provided on the front surface of the baffle 142 in the middle, and two sliding holes 15 are symmetrically provided on the front surface of the upper shell 10 in the middle, and the handle 141 is slidably connected to the sliding hole 15, and the partition 14 is movably connected to the upper shell 10. When repairing the mobile phone motherboard, the clamping claws 32 and the multiple columns 20 are directly coordinated with each other to clamp and fix the mobile phone motherboard, and the handle 141 is manually lifted to make the handle 141 move up and down along the sliding hole 15 to drive the partition 14 to control the connection and closing of the hollow chamber, the upper chamber and the lower chamber; before repairing the mobile phone motherboard, the through hole 140 on the surface of the partition 14 is adjusted to a position connected to the long hole 200. At this time, the hollow chamber, the upper chamber and the lower chamber are connected, and the positive and negative charge airflows blown out by the ion fan 12 can blow off a large number of dust particles on the mobile phone motherboard, and the suction fan 111 The dust particles are sucked into the lower shell 11 through the long hole 200 and discharged through the air outlet 110. When the mobile phone motherboard is overhauled, the partition 14 is adjusted to the upper part of the long hole 200. At this time, the through hole 140 is sealed by the outer wall of the column 20, effectively preventing the positive and negative charges blown out by the ion fan 12 in the upper chamber from flowing to the lower chamber, so as to facilitate the electrostatic treatment of the mobile phone motherboard; and after the overhaul of the mobile phone motherboard is completed, the partition 14 is adjusted again so that the through hole 140 on the surface of the partition 14 is connected with the long hole 200. At this time, the hollow chamber, the upper chamber and the lower chamber are connected, so that the suction fan 111 can blow off the waste fine particles generated during the overhaul process, which plays an auxiliary role in the assembly work after the overhaul is completed, and can ensure that the position of the mobile phone motherboard does not need to be repeatedly adjusted before, during and after the overhaul of the mobile phone motherboard, which is conducive to avoiding the secondary damage of the clamping jaws 32 and multiple columns 20 to the mobile phone motherboard.

[0061] Furthermore, when adjusting the position of the partition 14 relative to the long hole 200 , the baffle 142 at the front end of the partition 14 fits with the inner wall of the front side of the upper shell 10 , which is beneficial to ensure the airtightness of the lower chamber.

[0062] In addition, since the presence of static electricity will affect the sensitivity of various components on the mobile phone motherboard, when the mobile phone motherboard is overhauled, it is necessary to place the mobile phone motherboard in the upper chamber and let it stand for a period of time to ensure that the static electricity on its surface is completely removed. Finally, slowly release the clamp 32, and the second spring 22 can push the mobile phone out to the upper part of the clamp 32, making it easier to remove the mobile phone motherboard.

[0063] The main thing is that after adjusting the position of the partition 14, the partition 14 needs to be limited. A threaded hole 1410 is opened in the middle of the front surface of the handle 141, and a bolt 1411 is threadedly connected inside the threaded hole 1410. The rear end of the bolt 1411 is movably matched with the outer wall of the upper shell 10. The bolt 1411 is screwed into the threaded hole 1410 so that the rear end of the bolt 1411 is against the front surface of the outer wall of the upper shell 10, so that the partition 14 can be limited.

[0064] When the mobile phone motherboard repair equipment with an anti-static structure of the present invention is used, the position of the through hole 140 on the surface of the partition 14 relative to the long hole 200 can be adjusted by moving the partition 14 up and down along the sliding hole 15, and the through hole 140 is sealed by the outer wall of the column 20, so that there is no need to repeatedly adjust the position of the mobile phone motherboard before, during and after the repair of the mobile phone motherboard, which is beneficial to avoid secondary damage to the mobile phone motherboard caused by the clamping claw 32 and multiple columns 20. The bolt 1411 is screwed into the threaded hole 1410 so that the rear end of the bolt 1411 is against the front surface of the outer wall of the upper shell 10, so that the partition 14 can be limited.

[0065] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above invention. The above invention and the description are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A mobile phone motherboard maintenance device with an anti-static structure, comprising a housing (1), characterized in that: The shell (1) comprises an upper shell (10) and a lower shell (11), the upper shell (10) being fixedly connected to the lower shell (11), an ion fan (12) being installed at the top of the upper shell (10), an air outlet (110) being provided at the bottom of the lower shell (11), a suction fan (111) being installed inside the air outlet (110), a partition (14) being provided inside the upper shell (10), the partition (14) dividing the interior of the upper shell (10) into an upper chamber and a lower chamber, a clamping assembly (3) being provided inside the upper chamber, the clamping assembly (3) comprising two pull rods (30), the two pull rods (30) being slidably connected to opposite side walls of the upper shell (10), one end of the pull rod (30) located in the upper chamber being fixedly connected to a clamping claw (32), the clamping claw (32) being rotatable with the upper shell (10), and the clamping claw (32) being rotatable with the upper shell (10). A first spring (31) is arranged between the upper and lower shells (10), and the first spring (31) is located on the periphery of the pull rod (30); a support plate (13) is arranged in the lower shell (11) above the air outlet (110); a dust removal assembly (2) is arranged on the top of the support plate (13); the dust removal assembly (2) comprises a column (20) arranged on the support plate (13); a through hole (140) is opened on the partition (14); the column (20) is slidably connected to the through hole (140); a hollow chamber is arranged in the column (20), and a plurality of long holes (200) are opened on the periphery of the column (20) at positions corresponding to the hollow chamber; the long holes (200) are driven by the sliding of the column (20) to change their positions in the longitudinal direction, so as to control the connection and closure of the hollow chamber, the upper chamber and the lower chamber.

2. The mobile phone motherboard maintenance equipment with anti-static structure according to claim 1 is characterized in that: The partition plate (14) is fixedly connected to the upper shell (10).

3. The mobile phone motherboard repairing equipment with anti-static structure according to claim 2 is characterized in that: A baffle (142) is fixedly provided on the lower surface of the partition (14) near the front end, a handle (141) is fixedly provided on the front surface of the baffle (142) in the middle, two sliding holes (15) are symmetrically provided on the front surface of the upper shell (10) in the middle, the handle (141) is slidably connected to the sliding holes (15), and the partition (14) is movably connected to the upper shell (10).

4. The mobile phone motherboard repairing device with anti-static structure according to claim 3 is characterized in that: A threaded hole (1410) is provided in the middle of the front surface of the handle (141), a bolt (1411) is threadedly connected inside the threaded hole (1410), and a rear end of the bolt (1411) is movably engaged with the outer wall of the upper shell (10).

5. The mobile phone motherboard maintenance equipment with anti-static structure according to claim 1 or 3, characterized in that: The lower ends of the plurality of columns (20) are fixedly connected to a second spring (22), the lower ends of the plurality of second springs (22) are fixedly connected to a support plate (13), and the upper ends of the two clamping jaws (32) are hingedly provided with a U-shaped rod (321) at opposite sides.

6. The mobile phone motherboard repairing device with anti-static structure according to claim 1 is characterized in that: A protrusion (320) is fixedly provided on opposite sides of the front ends of the two clamping jaws (32) close to the upper end, and the protrusion (320) is in a "triangle" shape.

7. The mobile phone motherboard repairing equipment with anti-static structure according to claim 1 is characterized in that: The upper ends of the plurality of columns (20) are each provided with a plurality of bosses (21) in a circular array.

8. The mobile phone motherboard repairing equipment with anti-static structure according to claim 1 is characterized in that: The partition plate (14) has a lower surface at which a plurality of through holes (140) are fixedly provided with sealing rings, and the sealing rings are slidably connected to the column (20).

9. The mobile phone motherboard repairing equipment with anti-static structure according to claim 3 is characterized in that: When the upper end of the column (20) is not subjected to force, the upper end of the column (20) is higher than the upper surface of the U-shaped rod (321).

10. The mobile phone motherboard repairing equipment with anti-static structure according to claim 1, characterized in that: An inspection opening (100) is provided at the front end of the upper shell (10) located at the upper chamber, and a sealing window (101) is hingedly connected to the inspection opening (100).

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