Method for manufacturing circuit board assembly and circuit board assembly

Abstract

A method for manufacturing a circuit board assembly includes the following steps: providing a metal plate; forming a first circuit substrate on the surface of the metal plate, the first circuit substrate including a reinforcement portion; attaching a peelable adhesive to the surface of the reinforcement portion facing away from the metal plate; forming a second circuit substrate on the surface of the first circuit substrate facing away from the metal plate, the second circuit substrate also covering the peelable adhesive; removing the peelable adhesive and the second circuit substrate corresponding to the peelable adhesive to form a receiving groove, wherein the surface of the reinforcement portion facing away from the metal plate is exposed to the receiving groove; and receiving an electronic component in the receiving groove, wherein at least a portion of the electronic component is received in the receiving groove, thereby forming the circuit board assembly reinforced by the metal plate and the reinforcement portion. The present application also provides a circuit board assembly.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a method for manufacturing a circuit board assembly and a circuit board assembly. Background Art

[0002] As electronic products develop towards being thinner and more multifunctional, their density continues to increase. Some electronic components (such as cameras) are one of the difficulties in making electronic products thinner and lighter. For example, cameras have a certain thickness, so by embedding the camera part in the circuit board (especially in a rigid-flex board or a flexible board), due to the limitations of the manufacturing process, the hollow area is first made and then the reinforcement sheet is pressed together, which will cause the circuit board near the hollow area to collapse (see Figure 1 ), affecting the flatness of the circuit board and also affecting the performance of electronic products; in addition, in the process of forming the reinforcement sheet later, the dielectric layer connected to the reinforcement sheet shrinks and forms a depression (such as Figure 1 Area A) in the center is prone to the accumulation of foreign matter (such as dust). Summary of the Invention

[0003] In view of this, it is necessary to provide a method for manufacturing a circuit board assembly with improved flatness and a circuit board assembly.

[0004] A method for manufacturing a circuit board assembly includes the following steps: providing a metal plate; forming a first circuit substrate on the surface of the metal plate, the first circuit substrate including a reinforcement portion; attaching a peelable adhesive to a portion of the surface of the reinforcement portion facing away from the metal plate; forming a second circuit substrate on the surface of the first circuit substrate facing away from the metal plate, the second circuit substrate also covering the peelable adhesive; removing the peelable adhesive and the second circuit substrate corresponding to the peelable adhesive to form a receiving groove, the surface of the reinforcement portion facing away from the metal plate being exposed to the receiving groove; and receiving an electronic component in the receiving groove, with at least a portion of the electronic component being received in the receiving groove, thereby forming the circuit board assembly reinforced by the metal plate and the reinforcement portion.

[0005] In some embodiments, the step of forming the first circuit substrate on the surface of the metal plate includes: sequentially pressing a first dielectric layer and a bottom copper layer on the surface of the metal plate; forming a first groove penetrating the first dielectric layer and the bottom copper layer along the stacking direction of the first dielectric layer and the bottom copper layer to expose the surface of the metal plate; forming a copper-plated layer on the surface of the bottom copper layer facing away from the first dielectric layer, the copper-plated layer also filling the first groove to form the reinforcement portion, and the reinforcement portion being connected to the metal plate; and performing circuit fabrication on the bottom copper layer and the copper-plated layer to form the first circuit layer, wherein the first dielectric layer and the first circuit layer together form the first circuit substrate.

[0006] In some embodiments, the reinforcement is not etched.

[0007] In some embodiments, the step of forming the accommodating groove includes: forming a second groove on the second circuit substrate that is compatible with the periphery of the peelable adhesive, and the second groove passes through the second circuit substrate; and removing the second circuit substrate and the peelable adhesive surrounded by the second groove to form the accommodating groove.

[0008] In some embodiments, after forming the second circuit substrate, the following steps are further included: forming a solder mask on the surface of the second circuit substrate facing away from the first circuit substrate; and in forming the second groove, the second groove also penetrates the solder mask. In some embodiments, after forming the accommodating groove, the following steps are further included: performing surface treatment to form a protective layer on the surfaces of the reinforcement portion and the metal plate.

[0009] In some embodiments, the electronic component includes a first sub-component and a second sub-component, and the step of accommodating the electronic component in the accommodating groove includes: accommodating the first sub-component in the accommodating groove, and the first sub-component is electrically connected to the first circuit substrate; performing gold wire processing on the first sub-component and the second circuit substrate to electrically connect the first sub-component to the second circuit substrate; and connecting a second sub-component on the surface of the second circuit substrate, and the second sub-component is electrically connected to the first sub-component.

[0010] A circuit board assembly includes a metal plate, a first circuit substrate, a second circuit substrate, and electronic components. The first circuit substrate is located on a surface of the metal plate and includes a reinforcing portion extending through the first circuit substrate and connected to the metal plate. The second circuit substrate is located on a surface of the first circuit substrate facing away from the metal plate. The electronic component extends through the second circuit substrate and is connected to the reinforcing portion, and is electrically connected to both the first and second circuit substrates.

[0011] In some embodiments, the electronic component includes a first subcomponent and a second subcomponent, the first subcomponent passes through the second circuit substrate and is connected to the reinforcement portion, and the second subcomponent is located on a surface of the second circuit substrate and is electrically connected to the first subcomponent.

[0012] In some embodiments, the circuit board assembly further includes a protective layer, which is located on surfaces of the metal plate and the reinforcement portion, and is located between the electronic component and the reinforcement portion.

[0013] The manufacturing method of the circuit board assembly provided in the present application first forms the metal plate and the first circuit substrate with a reinforcement portion, and only after forming the second circuit substrate is the cover opened to form a receiving groove for accommodating electronic components. That is, the cover opening step (i.e., forming the receiving groove) is performed after the pressing step (i.e., forming the first circuit substrate and the second circuit substrate), thereby fundamentally avoiding the phenomenon of the circuit substrate collapsing into the receiving groove due to the pressing step in the related art, and obtaining a circuit board assembly with high flatness; in addition, the metal plate used for reinforcement has been formed at the beginning, avoiding the concavity of the dielectric layer connected to the metal plate caused by subsequent formation, that is, the side wall of the receiving groove formed in the present application is roughly perpendicular to the bottom wall of the receiving groove, effectively preventing the accumulation of foreign matter (such as dust). BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a photo of a conventional circuit board that is collapsed after first opening the cover and then pressing it together.

[0015] Figure 2 A schematic cross-sectional view of two metal plates provided in an embodiment of the present application.

[0016] Figure 3 For Figure 2 The cross-sectional view of the metal plate after the first dielectric layer and the bottom copper layer are sequentially pressed onto its surface is shown.

[0017] Figure 4 To form a penetration Figure 3 The cross-sectional view of the first dielectric layer and the bottom copper layer after the first groove is shown.

[0018] Figure 5 For Figure 4 The schematic cross-sectional view shows a surface of the bottom copper layer having a copper plating layer including a reinforcement portion, and circuits are fabricated on the copper plating layer and the bottom copper layer to form a first circuit layer.

[0019] Figure 6 For Figure 5 The cross-sectional view of the reinforcement portion after the surface is covered with peelable adhesive is shown.

[0020] Figure 7For Figure 6 The diagram shows a cross-sectional view of a first circuit substrate forming a second circuit substrate and a solder mask layer formed on the surface of the second circuit substrate.

[0021] Figure 8 Schematic diagram of the cross section after separating the two metal plates.

[0022] Figure 9 For Figure 8 The cross-sectional view of the second circuit substrate after the second groove is formed is shown.

[0023] Figure 10 To remove Figure 9 The second circuit substrate and the peelable adhesive surrounded by the second groove are shown as a cross-sectional schematic diagram after forming an accommodating groove.

[0024] Figure 11 It is a cross-sectional schematic diagram after surface treatment to form a protective layer on the surface of the reinforcement part and the metal plate.

[0025] Figure 12 For Figure 11 The figure shows a cross-sectional view of the receiving groove after the first sub-element is received therein.

[0026] Figure 13 For Figure 12 The diagram shows a cross-sectional view of a circuit board assembly obtained by connecting the second sub-component to the surface of the second circuit substrate and electrically connecting the second sub-component to the first sub-component.

[0027] Description of main component symbols

[0028]

[0029] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0030] In order to more clearly understand the above-mentioned objects, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application. The embodiments described are only a part of the embodiments of the present application, rather than all of the embodiments.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes all and any combinations of one or more of the relevant listed items.

[0032] In the various embodiments of the present application, for ease of description and not limitation, the term "connection" used in the patent specification and claims of the present application is not limited to physical or mechanical connections, whether direct or indirect. "Up," "down," "above," "below," "left," "right," etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0033] See also Figures 2 to 13 The present invention provides a method for manufacturing a circuit board assembly 100, comprising the following steps:

[0034] Step S1: Please refer to Figure 2 , providing a metal plate 10.

[0035] The metal plate 10 can be a metal plate with a certain hardness, such as a copper plate, an aluminum plate, etc. The metal plate 10 is used to form a circuit board assembly 100 (see Figure 13 ) plays the role of a reinforcing plate to improve the hardness of the circuit board assembly 100. In this embodiment, the metal plate 10 is a copper plate.

[0036] In some embodiments, the number of metal plates 10 can be one or two. When there are two metal plates 10, the two metal plates 10 are bonded together by an adhesive layer 12. This facilitates separation of the two metal plates 10 in subsequent manufacturing processes, allowing two circuit board assemblies 100 to be manufactured simultaneously, thus saving manufacturing time. In this embodiment, two metal plates 10 are used as an example.

[0037] Step S2: Please refer to Figures 3 to 5 A first circuit substrate 20 is formed on the surface of the metal plate 10 , and the first circuit substrate 20 includes a reinforcing portion 272 .

[0038] The first circuit substrate 20 includes a first dielectric layer 22 and a first circuit layer 27 embedded in the first dielectric layer 22. The reinforcement 272 is a portion of the first circuit layer 27. The reinforcement 272 penetrates the first dielectric layer 22 and is connected to the metal plate 10.

[0039] In some embodiments, the step of forming the first circuit substrate 20 on the surface of the metal plate 10 may include steps S201 - S204 .

[0040] Step S201: Please refer to Figure 3 The first dielectric layer 22 and the bottom copper layer 24 are sequentially pressed onto the surface of the metal plate 10 .

[0041] The bottom copper layer 24 is located on the surface of the first dielectric layer 22 facing away from the metal plate 10. In this embodiment, the first dielectric layer 22 and the bottom copper layer 24 are laminated on the surfaces of the two metal plates 10.

[0042] Step S202: Please refer to Figure 4 A first slot 25 is formed along the stacking direction of the first dielectric layer 22 and the bottom copper layer 24 , penetrating the first dielectric layer 22 and the bottom copper layer 24 , so as to expose the surface of the metal plate 10 .

[0043] It should be noted that in some embodiments, due to process limitations, the surface of the metal plate 10 where the first slot 25 is exposed may be uneven during the formation of the first slot 25 , but this does not affect the flatness of the final circuit board assembly 100 .

[0044] Step S203: Please refer to Figure 5 A copper plating layer 26 is formed on the surface of the bottom copper layer 24 away from the first dielectric layer 22 . The copper plating layer 26 also fills the first groove 25 to form the reinforcing portion 272 . The reinforcing portion 272 is connected to the metal plate 10 .

[0045] Step S204: Please refer again Figure 5 , the bottom copper layer 24 and the copper plating layer 26 are subjected to circuit fabrication to form the first circuit layer 27 , wherein the first dielectric layer 22 and the first circuit layer 27 together form the first circuit substrate 20 .

[0046] In some embodiments, the reinforcing portion 272 is not etched during the circuit fabrication process.

[0047] Step S3: Please refer to Figure 6 A peelable adhesive 30 is attached to the surface of the reinforcement portion 272 facing away from the metal plate 10 .

[0048] The peelable adhesive 30 will be removed in a subsequent process. The peelable adhesive 30 is used to temporarily bond and facilitate separation.

[0049] Step S4: Please refer to Figure 7A second circuit substrate 40 is formed on the surface of the first circuit substrate 20 facing away from the metal plate 10 , and the second circuit substrate 40 also covers the peelable adhesive 30 .

[0050] The second circuit substrate 40 includes a second dielectric layer 42 and a second circuit layer 44 embedded in the second dielectric layer 42. The second circuit layer 44 is electrically connected to the first circuit layer 27. The second circuit layer 44 can have one or more layers. In this embodiment, the second circuit layer 44 has three layers.

[0051] In some embodiments, after the step of forming the second circuit substrate 40, the process further includes forming a solder resist layer 50 on a surface of the second circuit substrate 40 facing away from the first circuit substrate 20 (see FIG. 2 ). Figure 7 ), the solder mask 50 covers the second circuit layer 44 located on the outer surface to prevent the second circuit layer 44 from being oxidized.

[0052] In the step of forming the solder mask layer 50, a portion of the second circuit layer 44 is exposed to the solder mask layer 50 for connection with the electronic component 80 (see Figure 13 ) to make electrical connections.

[0053] In some embodiments, when the number of the metal plates 10 is two, the step of separating the two metal plates 10 is further included (see Figure 8 ).

[0054] Step S5: Please refer to Figure 9 and Figure 10 , the peelable adhesive 30 and the second circuit substrate 40 corresponding to the peelable adhesive 30 are removed to form a receiving groove 60 , and the surface of the first circuit substrate 20 facing away from the metal plate 10 is exposed to the receiving groove 60 .

[0055] In some embodiments, the step of forming the receiving groove 60 may include steps S501 - S502 .

[0056] Step S501: Please refer to Figure 9 A second slot 62 adapted to the periphery of the peelable adhesive 30 is formed on the second circuit substrate 40 , and the second slot 62 penetrates the second circuit substrate 40 along the stacking direction.

[0057] In some embodiments, when the manufacturing method includes the step of forming the solder mask layer 50 , the second groove 62 also penetrates the solder mask layer 50 .

[0058] Step S502: Please refer to Figure 10, remove the second circuit substrate 40 and the peelable adhesive 30 surrounded by the second groove 62 to form the accommodating groove 60.

[0059] After the step of forming the accommodating groove 60, there is no pressing process, and the side walls of the accommodating groove 60, the bottom wall of the accommodating groove 60 (i.e., the surface of the reinforcing portion 272), and the surface of the second circuit substrate 40 facing away from the first circuit substrate 20 are all roughly vertical, which avoids the pressing process causing the second circuit substrate 40 adjacent to the accommodating groove 60 to collapse into the accommodating groove 60.

[0060] In some embodiments, after the step of forming the receiving groove 60, the following steps may be further included: Figure 11 The exposed surfaces of the first circuit layer 27 and the second circuit layer 44 are treated to form a protective layer 70, wherein the protective layer 70 also covers the exposed surface of the metal plate 10. The protective layer 70 is used to prevent metal oxidation.

[0061] Step S6: Please refer to Figure 12 and Figure 13 The electronic component 80 is accommodated in the accommodating groove 60 , and at least a portion of the electronic component 80 is accommodated in the accommodating groove 60 , thereby forming the circuit board assembly 100 that is reinforced by the metal plate 10 and the first circuit substrate 20 .

[0062] The electronic component 80 is located on the surface of the copper-plated layer 26 facing away from the metal plate 10. The copper-plated layer 26 and the metal plate 10 together function as a reinforcement, thereby supporting the electronic component 80. The electronic component 80 is electrically connected to both the first circuit substrate 20 and the second circuit substrate 40. Furthermore, at least a portion of the electronic component 80 is accommodated in the accommodating groove 60, effectively reducing the height of the circuit board assembly 100, thereby facilitating the miniaturization of electronic products.

[0063] When a protective layer 70 is provided on the surface of the copper plating layer 26 , the electronic component 80 is located on the surface of the protective layer 70 .

[0064] The electronic component 80 may be an integral structure, or may include at least one first sub-component 82 and at least one second sub-component 84 .

[0065] In this embodiment, the electronic component 80 includes a first subcomponent 82 and a second subcomponent 84. The electronic component 80 is a lens module, the first subcomponent 82 is a sensor, and the second subcomponent 84 is a lens. In other embodiments, the electronic component 80 is not limited to a lens module.

[0066] The specific steps of accommodating the electronic component 80 in the accommodating groove 60 include:

[0067] Step S601: Please refer to Figure 12 The first sub-component 82 is accommodated in the accommodation groove 60 , and the first sub-component 82 is electrically connected to the first circuit substrate 20 .

[0068] Step S602: Please refer again Figure 12 , gold wire bonding is performed on the first sub-component 82 and the second circuit substrate 40 to electrically connect the first sub-component 82 and the second circuit substrate 40 .

[0069] Step S603: Please refer to Figure 13 A second sub-element 84 is connected to the surface of the second circuit substrate 40 , and the second sub-element 84 is electrically connected to the first sub-element 82 .

[0070] It is understandable that in other embodiments, when a plurality of the accommodating grooves 60 are required to accommodate a plurality of electronic components 80 , the above-mentioned steps of embedding the peelable adhesive 30 first and then opening the cover can be adopted to avoid collapse of the circuit substrate due to pressing.

[0071] See also Figure 13 The present application also provides a circuit board assembly 100, which includes a metal plate 10, a first circuit substrate 20, a second circuit substrate 40, and an electronic component 80. The first circuit substrate 20 and the second circuit substrate 40 can be a flexible board, a rigid board, or a rigid-flex board.

[0072] The metal plate 10 can be a metal plate with a certain hardness, such as a copper plate, an aluminum plate, etc.

[0073] The first circuit substrate 20 is located on one surface of the metal plate 10 . The first circuit substrate 20 includes a first dielectric layer 22 and a first circuit layer 27 embedded in the first dielectric layer 22 . The first dielectric layer 22 is located on the surface of the metal plate 10 .

[0074] The first circuit layer 27 includes a reinforcement portion 272, which penetrates the first dielectric layer 22 and is connected to the metal plate 10. The reinforcement portion 272 is made of copper, which has a certain hardness and is formed during the copper electroplating process.

[0075] The second circuit substrate 40 is located on a surface of the first circuit substrate 20 facing away from the metal plate 10 , and the second circuit substrate 40 is electrically connected to the first circuit substrate 20 .

[0076] The second circuit substrate 40 includes a second dielectric layer 42 and a second circuit layer 44 embedded in the second dielectric layer 42. The second circuit layer 44 is electrically connected to the first circuit layer 27. The second circuit layer 44 can have one or more layers. In this embodiment, the second circuit layer 44 has three layers.

[0077] The electronic component 80 passes through the second circuit substrate 40 and is located on a surface of the first circuit substrate 20 . The electronic component 80 is connected to the reinforcing portion 272 .

[0078] In some embodiments, the electronic component 80 includes a first sub-component 82 and a second sub-component 84. The first sub-component 82 may be a sensor, and the second sub-component 84 may be a lens. The first sub-component 82 extends through the second circuit substrate 40 and is connected to the reinforcing portion 272. The second sub-component 84 is located on a surface of the second circuit substrate 40 and is electrically connected to the first sub-component 82.

[0079] In some embodiments, the circuit board assembly 100 further includes a protective layer 70 . The protective layer 70 is located on the surfaces of the metal plate 10 and the reinforcing portion 272 . The protective layer 70 is located between the electronic component 80 and the reinforcing portion 272 .

[0080] In some embodiments, the circuit board assembly 100 further includes a solder mask 50 , which covers the second circuit layer 44 on the outer surface to prevent the second circuit layer 44 from being oxidized.

[0081] The manufacturing method of the circuit board assembly 100 provided in the present application first forms the metal plate 10 and the first circuit substrate 20 with the reinforcement portion 272, and only after forming the second circuit substrate 40 is the cover opened to form the accommodating groove 60 for accommodating the electronic component 80. That is, the cover opening step (i.e., forming the accommodating groove 60) is performed after the pressing step (i.e., forming the first circuit substrate 20 and the second circuit substrate 40), thereby fundamentally avoiding the phenomenon of the circuit substrate collapsing into the accommodating groove 60 due to the pressing step in the related art, and obtaining a circuit board assembly 100 with high flatness; in addition, the metal plate 10 for reinforcement is formed at the very beginning, avoiding the concavity of the dielectric layer connected to the metal plate 10 caused by subsequent formation, that is, the side wall of the accommodating groove 60 formed in the present application is roughly perpendicular to the bottom wall of the accommodating groove 60, effectively preventing the accumulation of foreign matter (such as dust).

[0082] The above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent replacements of the technical solutions of the present application should not depart from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that: The following steps are involved: Provide metal sheets; forming a first circuit substrate on a surface of the metal plate, wherein the first circuit substrate includes a reinforcing portion; Attaching peelable adhesive to the surface of the reinforcement portion facing away from the metal plate; forming a second circuit substrate on a surface of the first circuit substrate facing away from the metal plate, wherein the second circuit substrate is further covered with the peelable adhesive; Removing the peelable adhesive and the second circuit substrate corresponding to the peelable adhesive to form a receiving groove, wherein the surface of the reinforcing portion facing away from the metal plate is exposed in the receiving groove; as well as The electronic component is accommodated in the accommodating groove, wherein at least a portion of the electronic component is accommodated in the accommodating groove, thereby forming the circuit board assembly reinforced by the metal plate and the reinforcing portion; The step of forming the first circuit substrate on the surface of the metal plate includes: sequentially pressing a first dielectric layer and a bottom copper layer on the surface of the metal plate; forming a first slot penetrating the first dielectric layer and the bottom copper layer along a stacking direction of the first dielectric layer and the bottom copper layer to expose a surface of the metal plate; forming a copper plating layer on a surface of the bottom copper layer facing away from the first dielectric layer, wherein the copper plating layer further fills the first groove to form the reinforcing portion, and the reinforcing portion is connected to the metal plate; and The bottom copper layer and the copper plating layer are subjected to circuit fabrication to form a first circuit layer, wherein the first dielectric layer and the first circuit layer together form the first circuit substrate, and the reinforcing portion is not etched.

2. The method for manufacturing a circuit board assembly according to claim 1, wherein: The steps of forming the accommodating groove include: forming a second slot on the second circuit substrate to match the periphery of the peelable adhesive, wherein the second slot penetrates the second circuit substrate; and The second circuit substrate and the peelable adhesive surrounded by the second groove are removed to form the accommodating groove.

3. The method for manufacturing a circuit board assembly according to claim 2, wherein: After the step of forming the second circuit substrate, the method further includes the following steps: A solder mask is formed on a surface of the second circuit substrate facing away from the first circuit substrate; In the step of forming the second groove, the second groove also penetrates the solder resist layer.

4. The method for manufacturing a circuit board assembly according to claim 1, wherein: After the step of forming the receiving groove, the following steps are also included: Surface treatment is performed to form a protective layer on the surfaces of the reinforcement portion and the metal plate.

5. The method for manufacturing a circuit board assembly according to claim 1, wherein: The electronic component includes a first sub-component and a second sub-component, and the step of accommodating the electronic component in the accommodating groove includes: A first sub-component is accommodated in the accommodating groove, and the first sub-component is electrically connected to the first circuit substrate; Performing gold wire bonding on the first sub-element and the second circuit substrate to electrically connect the first sub-element and the second circuit substrate; and A second sub-element is connected to the surface of the second circuit substrate, and the second sub-element is electrically connected to the first sub-element.

6. A circuit board assembly manufactured by the method for manufacturing a circuit board assembly according to any one of claims 1 to 5, characterized in that: The circuit board assembly comprises: Metal sheets; a first circuit substrate, located on a surface of the metal plate, the first circuit substrate comprising a reinforcing portion penetrating the first circuit substrate, the reinforcing portion being connected to the metal plate; a second circuit substrate, located on a surface of the first circuit substrate facing away from the metal plate; and An electronic component passes through the second circuit substrate and is connected to the reinforcing portion. The electronic component is electrically connected to the first circuit substrate and the second circuit substrate.

7. The circuit board assembly according to claim 6, wherein: The electronic component includes a first sub-component and a second sub-component. The first sub-component passes through the second circuit substrate and is connected to the reinforcing portion. The second sub-component is located on the surface of the second circuit substrate and is electrically connected to the first sub-component.

8. The circuit board assembly according to claim 7, wherein: The circuit board assembly further includes a protective layer, which is located on the surfaces of the metal plate and the reinforcement portion, and the protective layer is located between the electronic component and the reinforcement portion.

Images