Fluid circuits and systems for cooling server racks

Abstract

The present invention discloses a system comprising a server rack and a fluid circuit for cooling the server rack. The fluid circuit includes one or more cooling modules, a heat exchange module, and a pump. The one or more cooling modules are thermally connected to a conduit through which a coolant flows. Each cooling module includes a heat exchanger thermally connected to the conduit and a cooler fluidically connected to the heat exchanger. The heat exchange module is fluidically connected to an outlet of the conduit. The pump is configured to drive coolant from the heat exchange module to each server in the server rack.

Description

Technical Field

[0001] The present invention relates to systems and methods for cooling computing systems, and more particularly to a fluid circuit and system for cooling server racks. Background Art

[0002] Computing devices (such as servers) typically contain one or more heat-generating components, such as a central processing unit (CPU), a graphics processing unit (GPU), and the like. To help cool these heat-generating components, a fluid circuit with a heat exchange component can be used to transfer heat away from the heat-generating components. However, the coolant may be heated before it reaches the heat-generating components, which are spatially distant from the heat exchange component. Therefore, the coolant may need additional cooling to maintain the coolant's temperature before it reaches the heat-generating components.

[0003] Therefore, there is a need for better cooling solutions that can maintain the temperature of the coolant in the fluid loop low enough so that heat from the heat-generating components of the computing device can continue to be effectively removed. Summary of the Invention

[0004] The term embodiment and similar terms, such as implementations, configurations, aspects, examples, and options, are intended to refer broadly to all subject matter of the present invention and the appended claims. Statements containing these terms should be understood not to limit the subject matter described herein or to limit the meaning or scope of the appended claims. The embodiments of the invention covered herein are defined by the appended claims, not by this Summary. This Summary is a high-level overview of various aspects of the invention and introduces some concepts that are further described in the Detailed Description section that follows. This Summary is not intended to identify key or essential features of the claimed subject matter. This Summary is also not intended to be used alone to determine the scope of the claimed subject matter. The subject matter should be understood by reference to the entire specification, any or all of the drawings, and the appropriate portion of each claim.

[0005] According to certain aspects of the present invention, a fluid circuit for cooling a server rack is disclosed. The fluid circuit includes a conduit and one or more cooling modules thermally connected to the conduit. The conduit is configured to flow a coolant therethrough. Each cooling module includes a heat exchanger thermally connected to the conduit and a chiller fluidly connected to the heat exchanger.

[0006] According to certain aspects of the present invention, a system is disclosed that includes a server rack and a fluid circuit for cooling the server rack. The fluid circuit includes one or more cooling modules, a heat exchange module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat exchanger thermally connected to the conduit and a cooler fluidically connected to the heat exchanger. The heat exchange module is fluidically connected to an outlet of the conduit. The pump is configured to drive coolant from the heat exchange module to each server in the server rack.

[0007] According to certain aspects of the present invention, each cooling module further includes an inlet pipe for conveying cooling fluid from the cooler to the heat exchanger and an outlet pipe for discharging cooling fluid from the heat exchanger to the cooler.

[0008] According to certain aspects of the invention, the cooling fluid is water delivered at a temperature below about 10 degrees Celsius.

[0009] According to certain aspects of the present invention, each cooling module further includes a pump fluidly connected to the inlet pipe for driving the cooling fluid from the chiller to the heat exchanger.

[0010] According to certain aspects of the present invention, the cooler in each cooling module further includes a manifold, a radiator, a compressor, and an expansion valve. The manifold is used to circulate a refrigerant to cool the cooling fluid. The radiator is connected to the manifold and is used to remove heat from the refrigerant flowing through the manifold. The compressor is connected to the manifold and is used to drive the refrigerant into the radiator. The expansion valve is connected to the manifold and is used to control the flow of refrigerant from the radiator to the compressor.

[0011] According to certain aspects of the present invention, the heat exchange module is a rear-door heat exchanger disposed on a rear side of a server rack and connected to a plurality of fans.

[0012] According to certain aspects of the present invention, a heat exchange module is placed within a cooling distribution unit provided in a server rack, and the heat exchange module is a heat sink connected to a plurality of fans.

[0013] According to certain aspects of the present invention, the fluid circuit includes a temperature sensor connected to the outlet passage of the conduit and configured to measure the temperature of the coolant exiting the conduit.

[0014] According to certain aspects of the present invention, a method for cooling a fluid circuit of a server rack is disclosed. The method includes measuring a temperature of coolant flowing into a conduit of the fluid circuit and determining whether the coolant temperature is higher than a temperature of a cooler fluidically connected to a heat exchanger in a cooling module thermally connected to the fluid circuit via the conduit. The method also includes operating the cooler to transfer cooling fluid from the cooler to the heat exchanger in response to the coolant temperature being higher than a temperature of the cooler.

[0015] According to certain aspects of the present invention, the temperature of the coolant is measured using a waterproof temperature sensor connected to the outlet channel of the conduit.

[0016] According to certain aspects of the invention, the cooling fluid is water delivered at a temperature below about 10 degrees Celsius.

[0017] In order to better understand the above and other aspects of the present invention, the following embodiments are given and described in detail with reference to the accompanying drawings: BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A is a side schematic diagram of a system having a first embodiment of a fluid circuit for cooling a server rack in accordance with certain aspects of the present invention;

[0019] Figure 1B For some aspects of the present invention Figure 1A A top view of a fluid circuit;

[0020] Figure 1C For some aspects of the present invention Figure 1A A perspective view of the system and server racks;

[0021] Figure 2A is a side schematic diagram of a system having a second embodiment of a fluid circuit for cooling a server rack in accordance with certain aspects of the present invention;

[0022] Figure 2B For some aspects of the present invention Figure 2A A top view of a fluid circuit;

[0023] Figure 2C For some aspects of the present invention, the Figure 2A A perspective view of a cooling distribution unit in a rack;

[0024] Figure 3 A schematic diagram of a cooling module thermally connected to a fluid circuit for cooling a server rack according to certain aspects of the present invention;

[0025] Figure 4 For some aspects of the present invention Figure 3 Operation flow chart of the cooling module;

[0026] Figure 5 A block diagram of a method of cooling a fluid circuit for cooling a server rack according to certain aspects of the present invention.

[0027] Explanation of symbols

[0028] 100,200:System

[0029] 105a~105n, 205a~205n: Server

[0030] 110,210: rack

[0031] 120,220: Fluid circuit

[0032] 130,230: Catheter

[0033] 131,231:Entrance

[0034] 132,232:Entranceway

[0035] 134,234: Allocation channel

[0036] 136a~136n, 236a~236n: Supply channel

[0037] 138a~138n,238: Exit channel

[0038] 139,239: Export

[0039] 140,240:Cooling distribution unit

[0040] 150,250: Cooling module

[0041] 152,252:Heat exchanger

[0042] 154,254: Cooler

[0043] 156,256: inlet pipe

[0044] 158,258:Export pipe

[0045] 160,260: Pump

[0046] 170a~170n,270: Temperature sensor

[0047] 180,280: heat exchange module

[0048] 190,290: Fan

[0049] 245: Control Unit

[0050] 330: Catheter

[0051] 350: Cooling module

[0052] 352:Heat exchanger

[0053] 353: Pump

[0054] 354: Cooler

[0055] 356: Inlet pipe

[0056] 358:Export pipe

[0057] 355m: Manifold

[0058] 355c: compressor

[0059] 355r: Radiator

[0060] 355v: Expansion valve

[0061] 400:Flowchart

[0062] 410~450: Steps

[0063] 500: Block Diagram

[0064] 510~530: Block DETAILED DESCRIPTION

[0065] Embodiments of the present invention provide systems and methods for a fluid circuit for cooling a server rack. The fluid circuit includes one or more cooling modules thermally connected to a conduit for circulating a coolant in the fluid circuit. Each cooling module includes a heat exchanger thermally connected to the conduit and a cooler fluidically connected to the heat exchanger. When it is determined that the temperature of the coolant flowing out of the conduit is greater than a specific value (e.g., the cooler startup temperature is 40 degrees Celsius and the cooler standby temperature is 35 degrees Celsius), the cooler is turned on to cool the coolant in the fluid circuit. This ensures that the coolant maintains a sufficiently low temperature before reaching each server in the rack.

[0066] Various embodiments are described with reference to the accompanying drawings, in which the same reference numerals are used throughout the drawings to represent similar or equivalent elements. The drawings are not necessarily drawn to scale and are provided only to illustrate aspects and features of the present invention. Many specific details, relationships, and methods are set forth to provide a comprehensive understanding of certain aspects and features of the present invention, although one of ordinary skill in the relevant art will recognize that these aspects and features can be practiced with other relationships, or with other methods without one or more specific details. In some cases, for illustrative purposes, well-known structures or operations are not shown in detail. The various embodiments disclosed herein are not necessarily limited to the order of the actions or events described, as some actions may occur in different orders and / or simultaneously with other actions or events. In addition, not all of the actions or events in the accompanying drawings are necessary to implement certain aspects and features of the present invention.

[0067] For the purpose of detailed description, unless otherwise stated and where appropriate, the singular includes the plural and vice versa. The word "including" means "including but not limited to". In addition, approximate words such as "approximately", "almost", "substantially", "substantially" and the like may be used herein to mean "at", "close to", "almost", "within 3-5%", "within an acceptable manufacturing tolerance range" or any logical combination thereof. Similarly, the terms "vertical" or "horizontal" are intended to additionally include "within 3-5%" of the vertical or horizontal direction, respectively. In addition, directional words such as "top", "bottom", "left", "right", "above" and "below" are intended to relate to equivalent directions described in the referenced drawings; to be understood from the context of the object or element to which it is referenced, such as from the usual position of the object or element; or as otherwise described herein.

[0068] Figure 1A and Figure 1B A schematic side view and a top view of a system 100 are shown having a first embodiment of a fluid circuit 120 for cooling a rack 110 of “n” servers 105a, 105b, ..., 105n. Figure 1C Draw Figure 1A The system 100 and the perspective view of the rack 110 are shown in FIG. The letter "n" is used throughout the specification to indicate a plurality of components and represents an integer greater than 2. The air flow through the rack 110 is represented by solid arrows, while the flow of heated coolant and cooled coolant is represented by dashed arrows and straight arrows, respectively, as shown in FIG. Figures 1A to 1C The index is shown.

[0069] System 100 includes a fluid circuit 120 for cooling racks 110. A coolant, such as, but not limited to, propylene glycol heat transfer fluid (PG-25), flows through conduits 130 of fluid circuit 120 and removes or carries away heat generated by each of servers 105a, 105b, ..., 105n in rack 110. Fluid circuit 120 also includes a cooling distribution unit 140 and a heat exchange module 180. Cooling distribution unit 140 controls the distribution of coolant within fluid circuit 120. Heat exchange module 180 is fluidically connected to conduits 130 and delivers cooled coolant to conduits 130.

[0070] Conduit 130 has an inlet 131 through which cooled coolant from heat exchange module 180 enters inlet channel 132, which is fluidically connected to cooling distribution unit 140 of fluid circuit 120. Conduit 130 has a distribution channel 134 exiting cooling distribution unit 140. Distribution channel 134 branches into individual supply channels 136a, 136b, ..., 136n for each server 105a, 105b, ..., 105n. Coolant is distributed by cooling distribution unit 140 to the respective servers 105a, 105b, ..., 105n via distribution channel 134 and the individual supply channels 136a, 136b, ..., 136n. Conduit 130 has outlet channels 138a, 138b, ..., 138n exiting the respective servers 105a, 105b, ..., 105n. The coolant carries heat from heat-generating components (eg, processors, memory cards, etc.) of the servers 105 a , 105 b , . . . , 105 n , flows through the outlet channels 138 a , 138 b , . . . , 138 n , and flows out of the outlet 139 into the heat exchange module 180 .

[0071] exist Figures 1A to 1C In the illustrated embodiment, heat exchange module 180 is a rear heat exchanger disposed on the rear side (not shown) of rack 110. Heat exchange module 180 is connected to a plurality of fans 190, which are used to remove heat from the coolant in heat exchange module 180. Temperature sensors 170a, 170b, ..., 170n are thermally coupled to respective outlet channels 138a, 138b, ..., 138n and are used to measure the temperature of the coolant exiting conduit 130 and the temperature of the coolant entering heat exchange module 180. In some embodiments, temperature sensors 170a, 170b, ..., 170n are inherently waterproof.

[0072] Please refer to Figure 1B , Figure 1B Detailed drawing Figure 1AThe fluid circuit 120 is a cooling distribution unit (cooling distribution unit 140). The cooling distribution unit 140 includes a pump 160 and one or more cooling modules 150. Each cooling module 150 is thermally connected to the fluid circuit 120 via a conduit 130 and a pump 160 within the cooling distribution unit 140. The pump 160 is used to drive the cooled coolant from the heat exchange module 180 through the distribution channel 134 and the individual supply channels 136a, 136b, ..., 136n to each server 105a, 105b, ..., 105n in the rack 110.

[0073] Each cooling module 150 includes a heat exchanger 152 thermally connected to the conduit 130 and a cooler 154 fluidly connected to the heat exchanger 152. An inlet pipe 156 is used to transport cooling fluid from the cooler 154 to the heat exchanger 152, and an outlet pipe 158 is used to discharge cooling fluid from the heat exchanger 152 to the cooler 154. In some embodiments, the cooler 154 is operated and controlled by a control unit (not shown) within the cooling distribution unit. Further details of the operation of the cooler 154 are described below. Figure 3 In some embodiments, the cooling fluid is ice water or water delivered at a temperature below about 10 degrees Celsius.

[0074] It should be noted that coolant from heat exchange module 180 enters inlet channel 132 through inlet 131. Inlet channel 132 is fluidically connected to heat exchanger 152 within cooling distribution unit 140 for heat exchange, and is driven through distribution channel 134 by pump 160. This constitutes one fluid path (thick black line). Furthermore, inlet pipe 156 within cooling distribution unit 140 is used to transport cooling fluid from cooler 154 to heat exchanger 152, while outlet pipe 158 is used to discharge cooling fluid from heat exchanger 152 to cooler 154. This constitutes another independent fluid path and does not directly contact the liquid within the aforementioned fluid path (thick black line), but only exchanges heat with it.

[0075] Figure 2A and Figure 2B A schematic side view and a top view of a system 200 are shown having a second embodiment of a fluid circuit 220 for cooling a rack 210 of “n” servers 205a, 205b, ..., 205n. Figure 2C Draw the image to be set in Figure 2A 2 is a perspective view of the cooling distribution unit 240 in the rack 210. The air flow through the rack 210 is represented by the solid arrows, while the flow directions of the heated coolant and the cooled coolant are represented by the dashed arrows and the straight arrows, respectively. Figures 2A to 2C The index is shown.

[0076] System 200 includes a fluid circuit 220 for cooling racks 210. A coolant, such as, but not limited to, propylene glycol heat transfer fluid (PG-25), flows through conduits 230 of fluid circuit 220 to remove or carry away heat from each of servers 205a, 205b, ..., 205n in rack 210. Fluid circuit 220 also includes a cooling distribution unit 240 having heat exchange modules 280 disposed therein. Cooling distribution unit 240 is configured to controllably distribute the coolant in fluid circuit 220. Heat exchange modules 280 are fluidically connected to conduits 230 and configured to deliver cooled coolant to a heat sink in conduits 230. Heat exchange modules 280 are connected to a plurality of fans 290, which are configured to remove heat from the coolant in heat exchange modules 280.

[0077] The conduit 230 has an inlet 231 through which cooled coolant from the heat exchange module 280 enters an inlet channel 232, which is fluidically connected to a cooling distribution unit 240. The conduit 230 has a distribution channel 234 exiting the cooling distribution unit 240. The distribution channel 234 branches into separate supply channels 236a, 236b, ..., 236n for each server 205a, 205b, ..., 205n. The coolant is distributed by the cooling distribution unit 240 to the respective servers 205a, 205b, ..., 205n via the distribution channel 234 and the separate supply channels 236a, 236b, ..., 236n. The conduit 230 has an outlet channel 238 for receiving the heated coolant from the respective servers 205a, 205b, ..., 205n. Coolant carries heat from heat-generating components (e.g., processors, memory cards, etc.) of servers 205a, 205b, ..., 205n through outlet channel 238 and out of outlet 239 into heat exchange module 280. Temperature sensor 270 is thermally coupled to outlet channel 238 and is used to measure the temperature of the coolant exiting conduit 230 and the temperature of the coolant entering heat exchange module 280. In some embodiments, temperature sensor 270 is waterproof.

[0078] The cooling distribution unit 240 includes a pump 260 and one or more cooling modules 250. Each cooling module 250 is thermally connected to the fluid circuit 220 via conduits 230 and a pump 260 within the cooling distribution unit 240. The pump 260 is used to drive cooled coolant from the heat exchange module 280 through the distribution channel 234 and the individual supply channels 236a, 236b, ..., 236n to each server 205a, 205b, ..., 205n in the rack 210.

[0079] Please refer to Figure 2B , Figure 2B Detailed drawing Figure 2AThe fluid circuit (cooling distribution unit 240) of each cooling module 250 includes a heat exchanger 252 thermally connected to the conduit 230 and a cooler 254 fluidly connected to the heat exchanger 252. An inlet pipe 256 is used to transport the cooling fluid from the cooler 254 to the heat exchanger 252, and an outlet pipe 258 is used to discharge the cooling fluid from the heat exchanger 252 to the cooler 254. In some embodiments, the cooler 254 is controlled by a control unit 245 ( Figure 2C ) operation and control. Further details on the operation of the cooler 254 are described below Figure 3 In some embodiments, the cooling fluid is ice water or water delivered at a temperature below about 10 degrees Celsius.

[0080] It should be noted that coolant from heat exchange module 280 enters inlet channel 232 through inlet 231. Inlet channel 232 is fluidically connected to heat exchanger 252 within cooling distribution unit 240 for heat exchange, and is driven through distribution channel 234 by pump 260. This constitutes one fluid path (thick black line). Furthermore, inlet pipe 256 within cooling distribution unit 240 is used to transport cooling fluid from cooler 254 to heat exchanger 252, while outlet pipe 258 is used to discharge cooling fluid from heat exchanger 252 to cooler 254. This constitutes another independent fluid path and does not directly contact the liquid within the aforementioned fluid path (thick black line), but only exchanges heat with it.

[0081] Figure 3 Drawing and fluid circuit (such as Figure 1A-1B Schematic diagram of a cooling module 350 thermally connected to a conduit 330 of a fluid circuit 120 in FIG. The cooling module 350 is structurally and functionally similar to the cooling module 150 ( FIG. Figures 1A to 1C )、250( Figures 2A to 2C ) is substantially similar. The cooling module 350 includes a heat exchanger 352 thermally connected to the conduit 330 carrying the coolant. The conduit 330 is similar in structure and function to the conduit 130 ( Figures 1A to 1C )、230( Figures 2A to 2C ). The cooling module further includes a cooler 354, which is fluidically connected to the heat exchanger 352 via an inlet pipe 356 and an outlet pipe 358. The inlet pipe 356 is used to transport cooled cooling fluid from the cooler 354 to the heat exchanger 352. The outlet pipe 358 is used to discharge heated cooling fluid from the heat exchanger 352 to the cooler 354. A pump 353 is fluidically connected to the inlet pipe 356 to drive the cooling fluid from the cooler 354 to the heat exchanger 352.

[0082] The cooler 354 has a manifold 355m for circulating refrigerant to cool the cooling fluid flowing between the cooler 354 and the heat exchanger 352. The radiator 355r is connected to the manifold 355m and is used to remove heat from the refrigerant flowing through the manifold 355m. The compressor 355c is connected to the manifold 355m and is used to drive the refrigerant into the radiator 355r. The expansion valve 355v is connected to the manifold 355m and is used to produce low-temperature refrigerant gas. In operation, the heat from the heated cooling fluid is absorbed by the refrigerant in the manifold 355m. The compressor 355c compresses the heated refrigerant gas from the manifold 355m into a liquid phase and drives the heated refrigerant to the radiator 355r. Heat in the heated refrigerant is removed by the radiator 355 r to significantly reduce the temperature of the refrigerant in the manifold 355 m , thereby maintaining the refrigerant at a sufficiently low temperature, and the heated cooling fluid flows between the cooler 354 and the heat exchanger 352 and is cooled.

[0083] Figure 4 The cooling distribution unit of the server is shown as a control unit (eg, Figure 2C The cooling module 350 (eg, Figure 3 FIG4 is a flowchart 400 illustrating the operation of the cooling module 350 in the heat exchange module. In some embodiments, the control unit may be a baseboard management controller (BMC) in each server or computing system. In other embodiments, the control unit may be a rack control unit (RCU) mounted on a server rack. Operation begins at step 410, where the system is initialized. At this point, the cooler in the refrigeration module remains in standby mode. In step 420, the inlet temperature of the heat exchange module is read. In some embodiments, the inlet temperature of the heat exchange module corresponds to the coolant temperature at the outlet of the conduit in the system's fluid circuit. The temperature of the coolant flowing out of the conduit is measured using a temperature sensor connected to the outlet of the conduit.

[0084] At decision point 430, the control unit determines whether the inlet temperature of the heat exchange module is lower than the starting temperature of the cooler (e.g., 40 degrees Celsius). If the inlet temperature of the heat exchange module is lower than the starting temperature of the cooler, the system returns to step 420 to read the inlet temperature of the heat exchange module.

[0085] On the other hand, if the inlet temperature of the heat exchange module is not less than, ie, greater than, the starting temperature of the cooler, then in step 440 , the cooler is operated to cool the temperature of the coolant passing through the conduit to the inlet temperature of the heat exchange module.

[0086] Then, at decision point 450, the control unit determines whether the inlet temperature of the heat exchange module is lower than the standby temperature of the cooler (e.g., 35 degrees Celsius). If the inlet temperature of the heat exchange module is lower than the standby temperature of the cooler, the cooler is turned off, and the system returns to step 420 to continue reading the inlet temperature of the heat exchange module. On the other hand, if the inlet temperature of the heat exchange module is not lower than, that is, higher than, the standby temperature of the cooler, the system returns to step 440 to operate the cooler.

[0087] Figure 5 A block diagram 500 illustrates a method for cooling a fluid circuit for cooling a server rack. The method begins at block 510 by measuring the temperature of a coolant flowing into a conduit of the fluid circuit. The coolant temperature is measured using a waterproof temperature sensor connected to the conduit outlet. In some embodiments, the coolant is propylene glycol.

[0088] At block 520, the method determines whether the temperature of the coolant is higher than the temperature of the cooler. The cooler is fluidically connected to a heat exchanger in a cooling module, which is thermally connected to the fluid circuit via a conduit. A control unit disposed in the server rack and communicatively connected to the cooling module determines whether the temperature of the coolant is higher than the temperature of the cooler.

[0089] At block 530, in response to the temperature of the coolant being greater than the temperature of the cooler, the cooler is operated to deliver cooling fluid from the cooler to the heat exchanger. Operation of the cooler is initiated by a control unit disposed in the server rack. In some embodiments, the cooling fluid is water delivered at a temperature less than approximately 10 degrees Celsius.

[0090] Advantageously, the cooling module with the cooler and heat exchanger described herein enhances the thermal performance of the coolant in the fluid circuit for the server rack. The combination of the cooling module with the cooler and heat exchanger in the fluid circuit enhances the thermal performance of the coolant in the fluid circuit for the server rack. Figure 1A-1B ) of the fluid circuit 120 to remove approximately 10,000 watts of heat and heat from the system 200 ( Figure 2A-2B ) fluid loop 220 removes approximately 2,000 watts of heat. This represents an approximately 30.7% and 24.2% improvement in cooling performance for fluid loop 120 and fluid loop 220, respectively. This ensures that the coolant maintains a sufficiently low temperature before reaching each server in the rack. As a result, heat can continue to be effectively removed from heat-generating components throughout all parts of the computing equipment.

[0091] Although the disclosed embodiments have been illustrated and described with respect to one or more implementations, equivalent changes and modifications will occur to others skilled in the art upon reading and understanding this specification and the accompanying drawings. In addition, although a particular feature of the invention may be disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations, if this is desirable and advantageous for any given or particular application.

[0092] Although various embodiments of the present invention have been described above, it should be understood that they are presented by way of example only and not limitation. Many changes may be made to the disclosed embodiments according to the disclosure herein without departing from the spirit or scope of the present invention. Therefore, the breadth and scope of the present invention should not be limited by any of the above-described embodiments. On the contrary, the scope of the present invention should be defined in accordance with the appended claims and their equivalents.

[0093] In summary, while the present invention has been disclosed in conjunction with the above embodiments, they are not intended to limit the present invention. Persons skilled in the art may make various modifications and alterations without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A server rack, comprising: a fluid conduit for allowing a coolant to flow therethrough, the fluid conduit being arranged in the server rack and comprising an outlet channel, an inlet channel, a distribution channel, and a supply channel; a plurality of servers in heat exchange with the fluid conduit, the plurality of servers being disposed in the server rack and causing the coolant to be heated; a heat exchange module, fluidically connected to the fluid conduit to receive coolant from the plurality of servers, the heat exchange module being disposed inside the server rack and used to cool the coolant; as well as A cooling module is installed inside the server rack and serves as an independent cooling distribution unit. The cooling module includes: a heat exchanger in fluid communication with the heat exchange module to receive the coolant outputted therefrom; a cooler, fluidically connected to the heat exchanger, for cooling the coolant; and A pump is configured to receive the cooled coolant and circulate the coolant to the fluid conduits for heat exchange with the plurality of servers.

2. The server rack according to claim 1, wherein the cooling module further comprises: an inlet pipe for conveying cooling fluid from the cooler to the heat exchanger; as well as An outlet pipe is used to discharge the cooling fluid from the heat exchanger to the cooler.

3. The server rack of claim 2, wherein the cooling fluid is water delivered at a temperature below 10 degrees Celsius.

4. The server rack of claim 2, wherein the pump is connected to the inlet pipe for driving the cooling fluid from the cooler to the heat exchanger.

5. The server rack according to claim 2, wherein the cooler in the cooling module further comprises: a manifold for circulating a refrigerant to cool the cooling fluid; a radiator connected to the manifold and removing heat from the refrigerant flowing through the manifold; a compressor connected to the manifold and driving the refrigerant into the radiator; as well as An expansion valve is connected to the manifold and controls the flow of the refrigerant from the radiator to the compressor.

6. The server rack according to claim 1, wherein: The heat exchange module is fluidly connected to the conduit outlet; and The pump is used to drive the coolant from the heat exchange module to each server in the server rack.

7. The server rack of claim 6, wherein the heat exchange module is connected to a rear-door heat exchanger of the plurality of fans.

8. The server rack according to claim 6, wherein: The heat exchange module is placed in a heat dissipation distribution unit provided in the server rack; and The heat exchange module is a heat sink connected to multiple fans.

9. The server rack according to claim 1, further comprising: A temperature sensor is connected to the outlet passage of the conduit and is used to measure the temperature of the coolant flowing out of the conduit.

10. A cooling system comprising the server rack according to any one of claims 1 to 9.

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