Power supply structure and electroplating device

By designing a combination of main conductive components and branch conductive components in the power supply structure and connecting them with elastic wires, the problem of unstable power supply during movement was solved, thus achieving stability and structural simplicity in the power supply of the electroplating device.

CN115305554BActive Publication Date: 2026-04-10SHENZHEN HONGXUN M&E CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-07-28
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

In circuit design, when a structure that needs to be powered is immersed in a container filled with electroplating solution and is in a state of rotation, the power supply structure is complex and the power supply is unstable.

Method used

The power supply structure includes a power supply component, a main conductive component, and multiple branch conductive components. The branch conductive components move around the main conductive component, and the wires are elastic to adapt to changes in distance. The power supply component and the branch conductive components are connected by wires to ensure stable power supply.

Benefits of technology

It achieves stable power supply during operation, simplifies the power supply structure, and is suitable for the power supply needs of electroplating equipment.

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Abstract

The application provides a power supply structure and an electroplating device. The electroplating device comprises a conveying mechanism, a plurality of processing units and the power supply structure. The power supply structure comprises a power supply part, a main conductive part, a plurality of sub-conductive parts and a plurality of wires. The power supply part is connected with the main conductive part and supplies power to the main conductive part. Each sub-conductive part is arranged in each processing unit. The conveying mechanism is used to drive each processing unit to move around the main conductive part. The plurality of sub-conductive parts are arranged around the periphery of the main conductive part and move around the main conductive part in sequence. Each sub-conductive part is electrically connected with the main conductive part through a wire. The wire is elastic, and the length of the wire can change with the distance between the sub-conductive part and the main conductive part. Through the arrangement of the power supply structure, the plurality of sequentially moving processing units can be supplied with power by one power supply part. The power supply structure is simple and stable, thereby improving the processing stability and processing effect of the electroplating device on parts.
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Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit, and more particularly relates to a power supply structure and an electroplating device. BACKGROUND

[0002] In circuit design, when power supply is needed, the structure needing power supply can be statically powered through a power distribution box, a power supply and the like. However, if the structure needing power supply is in a rotating state and immersed in a container containing electroplating liquid, dynamic power supply in a liquid environment will make the circuit design very difficult, the power supply structure is relatively complex, and the power supply is unstable. SUMMARY

[0003] The purpose of the embodiment of the application is to provide a power supply structure and an electroplating device to solve the technical problems of complex power supply structure and unstable power supply caused by the structure needing power supply in a moving state in the prior art.

[0004] To achieve the above purpose, the technical scheme adopted by the application is to provide a power supply structure, comprising a power supply part, a main conductive part, a plurality of sub-conductive parts and a plurality of conductive wires; the power supply part is connected with the main conductive part and supplies power to the main conductive part; the plurality of sub-conductive parts are arranged around the periphery of the main conductive part and move around the main conductive part in turn, and each sub-conductive part is electrically connected with the main conductive part through one of the conductive wires; the conductive wire has elasticity, and the length of the conductive wire can change with the distance between the sub-conductive part and the main conductive part.

[0005] In a possible design, the length extension direction of the main conductive part is the same as the length extension direction of each sub-conductive part, and at least part of the conductive wires are arranged staggered along the length extension direction of the main conductive part.

[0006] In a possible design, the power supply structure comprises a plurality of wire groups, each wire group is arranged spaced apart along the length extension direction of the main conductive part, and each wire group comprises at least one conductive wire.

[0007] In a possible design, each wire group comprises at least two conductive wires; in the same wire group, the positions where the at least two conductive wires are connected with the main conductive part are located at the same length position of the main conductive part, and the at least two conductive wires are connected with the main conductive part at different circumferential positions.

[0008] In a possible design, the positions where the conductive wires are connected with the main conductive part are equally spaced along the circumferential direction of the main conductive part.

[0009] In a possible design, the main conductive member includes a copper rod and an insulating sleeve covering the surface of the copper rod, and a first connecting terminal for connecting with the wire is arranged on the copper rod, and the first connecting terminal penetrates through the insulating sleeve to connect with the wire.

[0010] In a possible design, the main conductive member further includes a plurality of sealing sleeves, the plurality of sealing sleeves are respectively sleeved on different positions of the insulating sleeve in the axial direction, a through slot is arranged on the insulating sleeve at a position corresponding to the first connecting terminal, a connecting hole is arranged on the sealing sleeve at a position corresponding to the through slot, one end of the first connecting terminal is connected with the copper rod, the other end of the first connecting terminal successively penetrates through the through slot and the connecting hole and extends out of the sealing sleeve, and the first connecting terminal and the sealing sleeve are connected in a sealed manner through a first sealing ring.

[0011] In a possible design, the sealing sleeve includes two sleeve bodies, and the two sleeve bodies respectively cover the outside of the insulating sleeve; the two sleeve bodies are respectively locked in a radial direction at two ends in the axial direction, and the two sleeve bodies are connected in a sealed manner with the insulating sleeve through a second sealing ring at the locked position; and at least one of the sleeve bodies is provided with the connecting hole.

[0012] In a possible design, the main conductive member is arranged in a rotating manner around the center line of the main conductive member.

[0013] The power supply structure provided in the embodiments of the present application has the following beneficial effects: the power supply structure provided in the embodiments of the present application is arranged by using a main conductive member and a plurality of sub-conductive members, each sub-conductive member is arranged around the periphery of the main conductive member and moves around the main conductive member in sequence, and when power supply is performed, each sub-conductive member is arranged on each to-be-powered unit in motion, so that the main conductive member arranged in a fixed manner can supply power to each to-be-powered unit in motion, and in the process of movement of each to-be-powered unit, the wire has elasticity, so that even if the distance between the to-be-powered unit and the main conductive member changes constantly, the main conductive member can still supply power to each to-be-powered unit, and the stability of power supply is improved. In addition, the present application can supply power to a plurality of to-be-powered units in motion by using one power supply member, and the overall structure is simple, easy to manufacture and easy to implement.

[0014] In addition, the present application also provides an electroplating device, which includes a conveying mechanism, a plurality of processing units and the power supply structure, each sub-conductive member is arranged in each processing unit, and the conveying mechanism is used to drive each processing unit to move around the main conductive member.

[0015] The electroplating device has the beneficial effects that the electroplating device provided by the embodiment of the application can supply power for each processing unit in constant motion, and the power supply stability is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor under the premise of the drawings.

[0017] Figure 1 A side view of the electroplating device provided by the embodiment of the application is shown in the figure.

[0018] Figure 2 A side view of the electroplating device provided by the embodiment of the application is shown in the figure. Figure 1 A transverse sectional view of the electroplating device is shown in the figure.

[0019] Figure 3 A side view of the electroplating device provided by the embodiment of the application is shown in the figure. Figure 1 A side view of the electroplating device provided by the embodiment of the application is shown in the figure.

[0020] Figure 4 A side view of the electroplating device provided by the embodiment of the application is shown in the figure. Figure 2 An enlarged view of part A of the electroplating device is shown in the figure.

[0021] Figure 5 A structure view of the sleeve of the electroplating device is shown in the figure. Figure 4 A structure view of the sleeve of the electroplating device is shown in the figure.

[0022] Figure 6 A structure view of the sleeve of the electroplating device is shown in the figure. Figure 2 A connection view of the copper bar and the first connecting terminal of the electroplating device is shown in the figure.

[0023] In the figure, each reference sign represents:

[0024] 100, power supply structure; 1, power supply part; 2, main conducting part; 21, copper bar; 211, mounting hole; 22, insulating sleeve; 221, through slot; 23, first connecting terminal; 24, sealing sleeve; 241, sleeve; 2411, accommodating groove; 242, accommodating cavity; 243, connecting hole; 244, sealing groove; 25, first sealing ring; 26, connecting column; 3, sub-conducting part; 31, electrode shaft; 32, second connecting terminal; 33, positive electrode; 4, wire; 01, wire group; 200, conveying mechanism; 300, processing unit; 400, frame. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, and not to limit the present application.

[0026] It should be noted that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element.

[0027] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0028] In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0029] In one aspect, referring to Figure 1 The present application provides an electroplating device, which comprises a conveying mechanism 200, a plurality of processing units 300, and a power supply structure 100. The power supply structure 100 is used to supply power to each processing unit 300 respectively, and the processing unit 300 is used to process the parts. The conveying mechanism 200 is used to drive each processing unit 300 to move in sequence along a predetermined track. For example, when the conveying mechanism 200 is a chain conveying mechanism, the conveying mechanism 200 drives each processing unit 300 to move along a runway-shaped track.

[0030] In one specific embodiment, the plating device is a plating device, the processing units 300 are plating units, and the power supply structure 100 supplies power to each plating unit so that the electrodes in the plating unit can be powered, thereby enabling the plating process of the plating unit. When the conveying mechanism 200 drives the plating units to move in the plating solution, the contact probability of the parts in the plating units with the plating solution can be increased, thereby improving the uniformity of the plating of the parts. Understandably, in other embodiments of the present application, the processing units can also be other structures, such as electrolytic processing, solar cell processing, etc., mainly processing that requires electricity, which is not limited here.

[0031] On the other hand, referring to Figure 1 and Figure 2 the present application also provides a power supply structure 100, which includes a power supply 1, a main conductor 2, a plurality of sub-conductors 3, and a plurality of wires 4; the power supply 1 is connected to the main conductor 2 and supplies power to the main conductor 2; the plurality of sub-conductors 3 are arranged around the periphery of the main conductor 2 and move around the main conductor 2 in turn, and each sub-conductor 3 is electrically connected to the main conductor 2 through a wire 4; the wire 4 is elastic, and the length of the wire 4 can change with the distance between the sub-conductor 3 and the main conductor 2.

[0032] The power supply 1 is a distribution box, which is used to supply power to the main conductor 2. Of course, in other embodiments of the present application, the power supply 1 can also be a power supply board, which is provided with a socket, and the socket is connected to the power supply to supply power to the main conductor 2.

[0033] The position of the main conductor 2 is relatively fixed, that is, the main conductor 2 does not displace. Each sub-conductor 3 is arranged in each processing unit 300, and the conveying mechanism 200 drives each processing unit 300 to move around the main conductor 2, thereby driving each sub-conductor 3 to move around the main conductor 2 in turn.

[0034] The wire 4 is elastic, which means that the wire 4 can not only realize electrical connection, but also realize electrical connection between two objects with changing distances. The wire 4 can include a copper wire and an insulating material wrapped around the copper wire, and the insulating material is spirally twisted, such as a telephone line, so that the wire 4 is elastic.

[0035] When power supply is performed, the power supply member 1 first supplies power to the main conducting member 2, and the main conducting member 2 supplies power to each of the sub-conducting members 3 through the wires 4 one by one. When the sub-conducting members 3 move around the main conducting member 2, the distance between the sub-conducting members 3 and the main conducting member 2 changes with the movement of the sub-conducting members 3, and the length of the wires 4 changes with the change of the distance between the sub-conducting members 3 and the main conducting member 2, so that the main conducting member 2 can always supply power to each of the sub-conducting members 3, and the power supply is stable.

[0036] The power supply structure 100 provided by the embodiment of the present application is provided with the main conducting member 2 and the plurality of sub-conducting members 3, each of the sub-conducting members 3 is arranged around the periphery of the main conducting member 2 and moves around the main conducting member 2 in turn, so that when power supply is performed, each of the sub-conducting members 3 can be mounted on each of the to-be-powered units in movement, so that the main conducting member 2 fixedly arranged can supply power to each of the to-be-powered units in movement, and in the process of movement of each of the to-be-powered units, since the wires 4 are elastic, even if the distance between the to-be-powered units and the main conducting member 2 constantly changes, the main conducting member 2 can still supply power to each of the to-be-powered units, and the stability of power supply is improved. In addition, the present application can supply power to a plurality of to-be-powered units in movement by using one power supply member 1, the overall structure is simple, the manufacturing is simple, and the implementation is convenient.

[0037] In one embodiment, please refer to Figure 1 Each of the sub-conducting members 3 moves around the main conducting member 2 according to a preset track, wherein the preset track is a racetrack type track, and the main conducting member 2 is located at the position of the center symmetry line of the racetrack type track, and in the process of movement around the main conducting member 2, the distance between the sub-conducting members 3 and the main conducting member 2 first slowly increases, then slowly decreases, then slowly increases again, and then slowly decreases again, so as to complete one round, and the process is repeated in turn. It can be understood that in other embodiments of the present application, the sub-conducting members 3 can also move according to other tracks, for example, a circular track, an elliptical track, a rectangular track, a square track or a regular hexagonal track, etc., as long as the track is a closed track, which is not limited herein.

[0038] In one embodiment, please refer to Figure 3 The length extension direction of the main conducting member 2 is the same as the length extension direction of each of the sub-conducting members 3, that is, in the process of movement of each of the sub-conducting members 3, the main conducting member 2 and each of the sub-conducting members 3 are in a parallel state in the three-dimensional space.

[0039] At least part of the wires 4 are arranged staggered along the length extension direction of the main conductor 2, that is, the connection positions of the wires 4 and the main conductor 2 can be staggered along the length extension direction of the main conductor 2. Meanwhile, the connection ends of the wires 4 and the sub conductors 3 are also staggered along the length extension direction of the main conductor 2, that is, the wires 4 are always staggered along the length extension direction of the main conductor 2 during the movement of the sub conductors 3, which not only avoids the complexity of the structure of the main conductor 2 caused by the wires 4 being connected to the same position of the main conductor 2 along the length extension direction, but also avoids the mutual entanglement of the wires 4 during the movement of the sub conductors 3, which affects the entire power supply structure 100 and the operation of the electroplating device using the power supply structure 100.

[0040] In one embodiment, referring to Figure 1 , the power supply structure 100 includes a plurality of wire groups 01, each wire group 01 is arranged spaced apart along the length extension direction of the main conductor 2, and each wire group 01 includes at least one wire 4. For example, as shown in Figure 1 and Figure 3 , the power supply structure 100 includes 12 sub conductors 3 and 12 wires 4, and the 12 wires 4 are divided into 6 wire groups 01, each wire group 01 includes two wires 4. Among them, the 6 wire groups 01 are arranged spaced apart along the length extension direction of the main conductor 2, that is, six mounting positions are divided on the main conductor 2 along the length extension direction of the main conductor 2, the six mounting positions are arranged spaced apart, and the six wire groups 01 are respectively mounted on the six mounting positions, so that each wire group 01 is staggered along the length direction of the main conductor 2, and the structure interference between the wire groups 01 is avoided. In addition, by arranging a wire group 01 at each length position of the main conductor 2, when the number of each wire group 01 is greater than one, different wires 4 can be used to provide tension in different directions to the main conductor 2 to keep the main conductor 2 balanced. It can be understood that in other embodiments of the present application, the number of wires 4 in each wire group 01 can also be one, three or more than three. When each wire group 01 includes one wire 4, that is, each wire 4 is staggered along the length extension direction of the main conductor 2, and when each wire group 01 includes three or more than three wires 4, the number of wire groups 01 can be reduced, and the length of the main conductor 2 and the sub conductor 3 can also be reduced, thereby reducing the occupied space of the entire power supply structure 100 along the length direction of the main conductor 2, which is not limited here.

[0041] In one embodiment, referring to Figure 1Each group of wire groups 01 includes at least two wires 4; in the same wire group 01, the positions where the at least two wires 4 are connected to the main conductor 2 are located at the same length position of the main conductor 2, the at least two wires 4 are connected to different positions of the main conductor 2 in the circumferential direction, and the at least two wires 4 are arranged at equal intervals in the circumferential direction of the main conductor 2. In this embodiment, by arranging the at least two wires 4 located at the same length position of the main conductor 2 at equal intervals in the circumferential direction of the main conductor 2, the wires 4 in the same wire group 01 are prevented from being entangled with each other, and the connectors for connecting the wires 4 on the main conductor 2 are prevented from interfering with each other. In addition, the wires 4 in the same wire group 01 are connected to different positions of the main conductor 2 in the circumferential direction, so that the forces applied by the wires 4 to the main conductor 2 are evenly distributed in the circumferential direction and offset each other, thereby balancing the force applied to the main conductor 2 and keeping the position stable.

[0042] Optionally, referring to Figure 1 , each sub-conductor 3 moves along a racetrack-shaped track around the main conductor 2, and during the movement of each sub-conductor 3, two sub-conductors 3 are always arranged symmetrically with the center line of the main conductor 2 as the center. Therefore, in this embodiment, each group of wire groups 01 includes two wires 4, and the two wires 4 are connected to different positions of the main conductor 2 in the circumferential direction.

[0043] In one embodiment, referring to Figure 1 , the connection positions of the wires 4 on the main conductor 2 are arranged at equal intervals in the circumferential direction of the main conductor 2, for example Figure 1 , the 12 wires 4 are arranged at equal intervals in the circumferential direction, so that the wires 4 are connected to the main conductor 2 in a straight line without detours.

[0044] In another embodiment of the present application, the length extension direction of the main conductor 2 can also be different from the length extension direction of each sub-conductor 3. For example, the main conductor 2 has a long strip structure, and the sub-conductors 3 are not long strip structures, but the sub-conductors 3 are arranged at intervals in the length extension direction of the main conductor 2 in space, one end of each wire 4 connected to the main conductor 2 is arranged at intervals in the length extension direction of the main conductor 2, and the other end of each wire 4 is connected to each sub-conductor 3. Therefore, the other end of each wire 4 is also arranged at intervals in the length extension direction of the main conductor 2, so that no matter how the sub-conductors 4 move, the wires 4 are arranged at intervals in the length extension direction of the main conductor 2, thereby preventing the wires 4 from being entangled with each other.

[0045] In another embodiment of the present application, the length extension direction of the main conducting member 2 can also be different from the length extension direction of each sub-conducting member 3. For example, the main conducting member 2 is in a long strip structure, while the sub-conducting member 3 is not in a long strip structure, one end of each wire 4 connected with the main conducting member 2 is staggered along the length extension direction of the main conducting member 2, and the other end of each wire 4 is connected with each sub-conducting member 3 respectively. In this embodiment, since one end of each wire 4 is staggered, the mutual entanglement of each wire 4 can also be avoided.

[0046] In one embodiment, the main conducting member 2 is arranged to rotate around the center line of the main conducting member 2. For example, referring to Figure 3 , the external device to which the power supply structure 100 is applied is provided with a frame 400, that is, the electroplating device also comprises the frame 400, and the main conducting member 2 is arranged to rotate on the frame 400. Specifically, the frame 400 is provided with through holes at two opposite positions, and the opposite ends of the main conducting member 2 along the length direction are arranged to rotate in the two through holes respectively. When each sub-conducting member 3 moves along the runway-type track under the driving of the external conveying mechanism, each sub-conducting member 3 pulls each wire 4 along the circumferential direction, thereby driving the main conducting member 2 to rotate around the center line thereof. In this embodiment, the main conducting member 2 is arranged to rotate around the center line thereof, so that when each sub-conducting member 3 moves along the runway-type track, each wire 4 will also be pulled to move. In order to avoid the entanglement of each wire 4 on the main conducting member 2 and the mutual entanglement of each wire 4, the main conducting member 2 is arranged to rotate around the center line thereof.

[0047] In one embodiment, referring to Figure 3 , the main conducting member 2 comprises a copper rod 21 and an insulating sleeve 22 covering the surface of the copper rod 21, and the copper rod 21 is provided with a first connecting terminal 23 for connecting with the wire 4, and the first connecting terminal 23 penetrates through the insulating sleeve 22 to connect with the wire 4. In this embodiment, the copper rod 21 is arranged to have good electrical conductivity and high structural strength; the first connecting terminal 23 is arranged to connect the copper rod 21 with the wire 4; and the insulating sleeve 22 is arranged to insulate the copper rod 21 from the outside, so that the main conducting member 2 can be applied in a conductor environment, for example, the main conducting member 2 is arranged in an electroplating liquid environment, that is, the copper rod 21 can supply power to each processing unit 300 in the electroplating liquid.

[0048] In one embodiment, referring to Figure 3The main electrically conductive part 2 further comprises a plurality of sealing sleeves 24, which are respectively sleeved at different positions of the insulating sleeve 22 along the axial direction. The insulating sleeve 22 is provided with a through slot 221 at a position corresponding to the first connecting terminal 23, and the sealing sleeve 24 is provided with a connecting hole 243 at a position corresponding to the through slot 221. One end of the first connecting terminal 23 is connected with the copper bar 21, and the other end of the first connecting terminal 23 is sequentially penetrated through the through slot 221 and the connecting hole 243 and extends out of the sealing sleeve 24. The first connecting terminal 23 is sealingly connected with the sealing sleeve 24 through the first sealing ring 25.

[0049] Specifically, please refer to Figure 4 A sealing groove 244 is arranged on the sealing sleeve 24, the sealing groove 244 extends from the inner wall of the connecting hole 243 to the inside of the sealing sleeve 24, the first sealing ring 25 is installed in the sealing groove 244 and at least partially extends radially out of the sealing groove 244 and towards the connecting hole 243. When the first connecting terminal 23 is penetrated through the connecting hole 243, the first sealing ring 25 abuts against the outer peripheral wall of the first connecting terminal 23, thereby realizing the connection between the first connecting terminal 23 and the sealing sleeve 24, and further realizing the sealing connection between the first connecting terminal 23 and the insulating sleeve 22.

[0050] The sealing sleeve 24 is provided with a containing cavity 242, the containing cavity 242 is arranged through the sealing sleeve 24 along the axial direction, and the insulating sleeve 22 is arranged through the containing cavity 242. The two ends of the sealing sleeve 24 along the axial direction are provided with the second sealing ring at positions connected with the insulating sleeve 22, and the sealing connection between the sealing sleeve 24 and the insulating sleeve 22 is realized through the second sealing ring.

[0051] Specifically, please refer to Figure 4 and Figure 5 The sealing sleeve 24 comprises two sleeve bodies 241, the two sleeve bodies 241 are respectively wrapped outside the insulating sleeve 22, the sleeve body 241 has a containing groove 2411, and the two containing grooves 2411 are combined into the containing cavity 242 after the two sleeve bodies 241 are buckled with each other. The two sleeve bodies 241 are symmetrically arranged, and the two containing grooves 2411 are symmetrically arranged. The two ends of the two sleeve bodies 241 along the axial direction are buckled with each other along the radial direction and locked, and the two sleeve bodies 241 are sealingly connected with the insulating sleeve 22 through the second sealing ring at the buckled positions. At least one of the sleeve bodies is provided with the above-mentioned connecting hole 243.

[0052] The two sleeve bodies 241 are relatively buckled and locked through the fastener.

[0053] Optionally, when the wire group 01 comprises two wires 4, the copper bar 21 is provided with two first connecting terminals 23 at the same axial position, and the two sleeve bodies 241 are respectively provided with the connecting hole 243 at the symmetrical positions, and the two first connecting terminals 23 are respectively penetrated through the two connecting holes 243 and extended out to be connected with the corresponding wires 4.

[0054] Please refer to Figure 6 The copper bar 21 is provided with a mounting hole 211 which penetrates the copper bar 21 along the radial direction, and a connecting column 26 is mounted in the mounting hole 211. The connecting column 26 is electrically conductive. Each first connecting terminal 23 is provided with a sleeve cavity which is sleeved on the connecting column 26, so as to realize the electrical connection between the first connecting terminal 23 and the copper bar 21.

[0055] In one embodiment, please refer to Figure 3 The electrically conductive member 3 comprises an electrode shaft 31, a second connecting terminal 32 and a plurality of positive electrodes 33. The length extension direction of the electrode shaft 31 is the same as that of the copper bar 21, and the electrode shaft 31 is made of an electrically conductive material, for example, copper. The second connecting terminal 32 is arranged on the electrode shaft 31 and is used for electrical connection with the wire 4. The plurality of positive electrodes 33 are distributed on the electrode shaft 31 along the length extension direction of the electrode shaft 31. In this embodiment, by distributing the plurality of positive electrodes 33 on the electrode shaft 31, the probability of the part colliding with the electrode during the electroplating is improved, and the uniformity of the part coating is further improved.

[0056] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A power supply structure characterized by comprising: The power supply structure comprises a power supply part, a main conducting part, a plurality of sub-conducting parts and a plurality of conducting wires; the power supply part is connected with the main conducting part and supplies power to the main conducting part; the plurality of sub-conducting parts are arranged around the periphery of the main conducting part and move around the main conducting part in sequence; each sub-conducting part is electrically connected with the main conducting part through one conducting wire; the conducting wire has elasticity and its length can change with the distance between the sub-conducting part and the main conducting part.

2. The power supply structure of claim 1, wherein The length extension direction of the main conducting part is the same as the length extension direction of each sub-conducting part, and at least part of the conducting wires are arranged staggered along the length extension direction of the main conducting part.

3. The power supply structure of claim 2, wherein The power supply structure comprises a plurality of wire groups, each wire group is arranged spaced apart along the length extension direction of the main conducting part, and each wire group comprises at least one conducting wire.

4. The power supply structure of claim 3, wherein Each wire group comprises at least two conducting wires; in the same wire group, the positions where the at least two conducting wires are connected with the main conducting part are located at the same length position of the main conducting part, and the at least two conducting wires are connected with the main conducting part at different circumferential positions.

5. The power supply structure of claim 1, wherein The positions where each conducting wire is connected with the main conducting part are distributed equidistantly along the circumferential direction of the main conducting part.

6. The power supply structure according to any one of claims 1 to 5, wherein The main conducting part comprises a copper rod and an insulating sleeve covering the surface of the copper rod, the copper rod is provided with a first connecting terminal for connecting with the conducting wire, and the first connecting terminal penetrates through the insulating sleeve to connect with the conducting wire.

7. The power supply structure of claim 6, wherein The main conducting part further comprises a plurality of sealing sleeves, each sealing sleeve is arranged at a different axial position of the insulating sleeve, the insulating sleeve is provided with a through slot corresponding to the position of the first connecting terminal, the sealing sleeve is provided with a connecting hole corresponding to the position of the through slot, one end of the first connecting terminal is connected with the copper rod, and the other end of the first connecting terminal penetrates through the through slot and the connecting hole in sequence and extends out of the sealing sleeve, and the first connecting terminal and the sealing sleeve are sealed and connected by a first sealing ring.

8. The power supply structure of claim 7, wherein The sealing sleeve comprises two sleeve bodies, each sleeve body covers the outside of the insulating sleeve; the two sleeve bodies are locked and buckled in the radial direction at the two axial ends respectively, and the two sleeve bodies are sealed and connected with the insulating sleeve by a second sealing ring at the buckling position; at least one sleeve body is provided with the connecting hole.

9. The power supply structure according to any one of claims 1 to 5, wherein The main conducting part is arranged to rotate around the center line of the main conducting part.

10. A plating apparatus characterized by comprising: The power supply structure comprises a conveying mechanism, a plurality of processing units and the power supply structure according to any one of claims 1 to 9, each sub-conducting part is arranged in each processing unit, and the conveying mechanism drives each processing unit to move around the main conducting part.

Citation Information

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