Redundant metal filling method, device, equipment and medium

Abstract

The present disclosure provides a redundant metal filling method, device, equipment and medium, which relates to the field of semiconductor manufacturing technology. The method includes providing an initial layout, which includes potential lines; determining the same-layer and same-net metal lines of each metal layer according to the wiring connection relationship in the initial layout; determining the area to be filled in each metal layer according to the same-layer and same-net metal lines; filling the same-layer metal lines in the area to be filled in each metal layer, and adding connection holes to connect the same-layer metal lines to the same potential lines; adding redundant metal to the layout after the same-layer metal lines are filled, and outputting the target layout. The present disclosure determines the area to be filled with the same-layer metal lines according to the wiring method of the potential lines, automatically adds the corresponding same-layer metal lines in the area to be filled, increases the width of the overall potential lines, and enhances the strength of the potential lines.

Description

Background Art

[0002] In the integrated circuit process, due to the different density of the chip, the pattern effect (Pattern Effect), also known as the micro-loading effect, occurs. The micro-loading effect is related to the phenomenon that occurs when exposure, etching, and / or polishing are performed on higher density patterns and lower density patterns at the same time. Due to the difference in exposure / etching / polishing rates at different locations on the film, the reaction amount generated by exposure / etching / polishing will become locally dense or sparse, causing uneven etching / polishing rates or pattern sizes after exposure.

[0003] In the related art, a layout design of redundant metal filling is usually adopted to fill the redundant metal into the position with low pattern density. However, the redundant metal itself generates additional parasitic capacitance, which causes the chip processing speed to slow down.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] The present disclosure provides a redundant metal filling method, device, equipment and chip, which at least to a certain extent overcome the problem of slow chip processing speed caused by parasitic capacitance generated by redundant metal filling provided in the related art.

[0006] Other features and advantages of the present disclosure will become apparent from the following detailed description, or may be learned in part by the practice of the present disclosure.

[0007] According to one aspect of the present disclosure, a redundant metal filling method is provided, comprising:

[0008] Providing an initial layout, wherein the initial layout includes potential lines;

[0009] Determine the same-layer and same-net metal wires of each metal layer according to the wiring connection relationship in the initial layout, wherein the same-layer and same-net metal wires are wirings in the same metal layer and connected to the same potential line;

[0010] Determine the area to be filled in each metal layer according to the metal wires of the same layer and the same network;

[0011] Filling the to-be-filled areas in each metal layer with metal wires of the same layer, and adding connection holes to connect the metal wires of the same layer to the same potential line;

[0012] On the layout in which the metal lines on the same layer are filled, redundant metal is added, and a target layout is output.

[0013] In one embodiment of the present disclosure, determining the metal wires of the same layer and the same network of each metal layer according to the wiring connection relationship in the initial layout includes:

[0014] Determining the same-net metal wires connected to the same potential line according to the wiring connection relationship in the initial layout;

[0015] The same-net metal wires in the same metal layer are screened to obtain the same-layer and same-net metal wires.

[0016] In one embodiment of the present disclosure, before filling the to-be-filled areas in the respective metal layer layers with metal wires of the same layer and adding connection holes so that the metal wires of the same layer are connected to the same potential line, the method further comprises:

[0017] The filling information of the metal wires on the same layer in each area to be filled is determined according to the area to be filled and the preset filling parameters of the metal wires on the same layer, so as to fill the area to be filled in each metal layer map using the filling information of the metal wires on the same layer.

[0018] In one embodiment of the present disclosure, the filling parameters of the metal lines in the same layer include at least one of the width of the metal lines in the same layer, the spacing between the metal lines in the same layer and the metal lines in the same layer and the same network, and the spacing between adjacent metal lines in the same layer.

[0019] In one embodiment of the present disclosure, the filling information of the metal wires in the same layer in each of the to-be-filled areas includes at least one of the filling quantity, filling position, and actual filling interval of the metal wires in the same layer.

[0020] In one embodiment of the present disclosure, the filling of the to-be-filled areas in the respective metal layer layers with metal wires of the same layer includes:

[0021] According to a repeated filling method and / or an interlaced filling method, the metal wires of the same layer are filled in the to-be-filled areas in each metal layer layer, wherein the metal wires of the same layer using the repeated filling method are connected to the same potential lines, and the metal wires of the same layer using the interlaced filling method are alternately connected to different potential lines.

[0022] In one embodiment of the present disclosure, the potential line includes at least one of a power line and a ground line with different voltage values.

[0023] In one embodiment of the present disclosure, the step of adding redundant metal to a layout after filling the metal lines on the same layer and outputting a target layout includes:

[0024] Adding redundant metal on the layout after the metal lines on the same layer are filled;

[0025] Verify the layout filled with redundant metal according to preset design rules to obtain verification results;

[0026] If the verification result is that the verification is passed, the target layout that has passed the verification is output.

[0027] In one embodiment of the present disclosure, determining the to-be-filled areas in each metal layer according to the metal lines in the same layer and the same network includes:

[0028] If the interval between two adjacent metal wires of the same layer and the same mesh meets a preset condition, the area between the two adjacent metal wires of the same layer and the same mesh is determined as the area to be filled.

[0029] In one embodiment of the present disclosure, the preset condition includes that the interval between two adjacent metal wires of the same layer and the same network is greater than or equal to a preset interval threshold.

[0030] In another aspect of the present disclosure, there is provided a redundant metal filling device, comprising:

[0031] An initial layout providing module, used to provide an initial layout, wherein the initial layout includes potential lines;

[0032] A same-layer and same-net determination module, used to determine the same-layer and same-net metal wires of each metal layer according to the wiring connection relationship of the initial layout, wherein the same-layer and same-net metal wires are wirings in the same metal layer and connected to the same potential line;

[0033] A filling area determination module, used to determine the to-be-filled area in each metal layer according to the metal wires in the same layer and the same network;

[0034] A same-layer metal filling module is used to fill the same-layer metal wires in the to-be-filled areas in each metal layer, and add connection holes to connect the same-layer metal wires to the same potential line;

[0035] The target layout output module is used to add redundant metal to the layout after the metal lines on the same layer are filled, and output the target layout.

[0036] According to another aspect of the present disclosure, an electronic device is provided, including: a processor; and a memory for storing executable instructions of the processor; wherein the processor is configured to perform the above-mentioned redundant metal filling method by executing the executable instructions.

[0037] According to another aspect of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the redundant metal filling method described above is implemented.

[0038] According to another aspect of the present disclosure, a computer program product is provided, including executable instructions, which are stored in a computer-readable storage medium. A processor of an electronic device reads the executable instructions from the computer-readable storage medium, and the processor executes the executable instructions, so that the electronic device performs any of the redundant metal filling methods described in the above embodiments.

[0039] The present disclosure provides a redundant metal filling method, which determines the area to be filled with metal lines of the same layer in the vacant area of ​​the layout according to the wiring method of the potential lines, and automatically adds corresponding metal lines of the same layer in the area to be filled, thereby increasing the width of the overall potential line, enhancing the strength of the potential line, and reducing the area that needs to be filled with redundant metal.

[0040] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0042] Figure 1 A schematic diagram showing redundant metal filling in the related art;

[0043] Figure 2 A flowchart of a redundant metal filling method provided by an embodiment of the present disclosure is shown;

[0044] Figure 3a A schematic diagram showing the structure of the initial layout of an embodiment of the present disclosure;

[0045] Figure 3b A schematic diagram showing the structure of the layout after the area to be filled with metal lines of the same layer according to the embodiment of the present disclosure is filled;

[0046] Figure 4 A flowchart showing another redundant metal filling method provided by an embodiment of the present disclosure is shown;

[0047] Figure 5 A flow chart showing another redundant metal filling method provided by an embodiment of the present disclosure;

[0048] Figure 6 A schematic diagram showing a repetitive filling method provided by an embodiment of the present disclosure;

[0049] Figure 7 A schematic diagram showing a staggered filling method provided by an embodiment of the present disclosure;

[0050] Figure 8 A flow chart showing another redundant metal filling method provided by an embodiment of the present disclosure;

[0051] Fig. 9 A schematic diagram showing a redundant metal filling device provided by an embodiment of the present disclosure is shown;

[0052] Fig.10 A schematic diagram showing the structure of an electronic device provided by an embodiment of the present disclosure is shown;

[0053] Fig.11 A schematic diagram showing a computer program product provided by an embodiment of the present disclosure.

[0054] Icons: 101, first layer potential line; 102, second layer potential line; 103, first layer area to be filled; 104, second layer area to be filled; 201, potential line; 2011, first potential line; 2012, second potential line; 202, same layer and same network metal wire; 203, area to be filled; 204, same layer metal wire; 2041, first same layer metal wire; 2042, second same layer metal wire. DETAILED DESCRIPTION

[0055] The preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0056] The terms "first" and "second" in this document are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly stated that it is a limitation.

[0057] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0058] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0059] The layout is a graphic containing relevant physical information such as the device type, device size, relative position between devices, and connection relationship between various devices of the integrated circuit. These graphics are composed of graphics located on different layers. Devices can include various semiconductor components such as transistors, capacitors, and resistors.

[0060] Integrated circuit layout design is the process of mapping circuit design circuit diagrams or circuit description languages ​​to the physical description level, so that the designed circuits can be mapped to wafer production.

[0061] Figure 1 FIG. 2 shows a schematic diagram of redundant metal filling in the related art. Figure 1 As shown, the layout includes at least one metal layer, such as Figure 1 The two metal layers are a first metal layer located at the lower layer and a second metal layer located at the upper layer. The first metal layer is provided with a plurality of first-layer potential lines 101, and the second metal layer is provided with a plurality of second-layer potential lines 102. There are first-layer areas 103 to be filled with large intervals between the first-layer potential lines 101, and there are second-layer areas 104 to be filled with large intervals between the second-layer potential lines 102. Figure 1 It can be found that due to the different pattern densities and / or positions of the metal layer, the flatness of the initial layout surface is poor.

[0062] In the related art, redundant metal (Dummy metal) is usually filled in the first layer to be filled area 103 and the second layer to be filled area 104 to improve the pattern density and avoid the occurrence of pattern effect problems. However, redundant metal can also bring negative effects. For example, redundant metal filling will generate additional parasitic capacitance, which will slow down the processing speed of the chip.

[0063] Therefore, in order to minimize the additional parasitic capacitance generated by redundant metal, in addition to optimizing the filling method of redundant metal, it is also necessary to study whether other methods can be designed to replace redundant metal while meeting process requirements.

[0064] Based on this, the present disclosure provides a redundant metal filling method, which determines the to-be-filled area of ​​the same-layer metal wires in the vacant area of ​​the layout according to the wiring method of the potential lines, automatically adds corresponding metal wires of the same layer in the to-be-filled area, increases the width of the overall potential line, enhances the strength of the potential line, and reduces the area that needs to be filled with redundant metal, thereby greatly reducing the additional parasitic capacitance generated by filling redundant metal and improving the processing speed of the chip.

[0065] It should be pointed out that the embodiments of the present invention and the technical features therein may be combined with each other without conflict.

[0066] The present exemplary implementation is described in detail below with reference to the accompanying drawings and embodiments.

[0067] Figure 2 FIG. 1 is a flow chart of a redundant metal filling method provided by an embodiment of the present disclosure. Figure 2 As shown, the redundant metal filling method in this embodiment includes:

[0068] S202, providing an initial layout, wherein the initial layout includes potential lines.

[0069] The initial layout of this embodiment includes at least potential lines and wiring connection relationships in the initial layout. The wiring connection relationship may include the connection relationship between metal lines and potential lines in each metal layer of the initial layout. It should be noted that when designing the layout, different devices, metal lines, etc. can be arranged in different layers so that operations can be performed only on a certain layer. By distinguishing different layers, it is convenient to screen metal layers and improve design efficiency.

[0070] It should be noted that the potential line may include at least one of a power line and a ground line with different voltage values. For example, the voltage value provided by the power line may include 5V, 12V, 24V, etc.

[0071] For example, in an integrated circuit, different types of N-type metal-oxide-semiconductors (NMOS) are usually used. The gate voltage of an NMOS is usually 5V, the drain voltage is usually 12V, and the source is grounded through a load resistor. At this time, for the NMOS, voltage values ​​of 0V, 5V, and 12V are required to work properly.

[0072] For other devices, chips and other structures, the voltage value of the potential line needs to be determined according to actual conditions, and this disclosure does not make any specific limitations.

[0073] S204, determining the same-layer and same-net metal wires of each metal layer according to the wiring connection relationship of the initial layout, wherein the same-layer and same-net metal wires are wirings in the same metal layer and connected to the same potential line.

[0074] In this embodiment, the metal wires of the same layer and the same net belong to the same metal layer and are connected to the same potential line. After the layout connection relationship is determined, the metal wires of the same layer and the same net can be screened in different ways.

[0075] Exemplarily, after the layout connection relationship is determined, metal wires connected to the same potential line are first screened, and then metal wires in the same metal layer are screened.

[0076] Exemplarily, after the layout connection relationship is determined, metal wires in the same metal layer are first screened, and then metal wires connected to the same potential line are screened.

[0077] S206: Determine the area to be filled in each metal layer according to the metal wires in the same layer and the same network.

[0078] The area to be filled in this embodiment is the empty area in each metal layer layer to be filled with metal wires of the same layer. The area to be filled can be a rectangle, a square, or other irregular shapes, and the shape of the metal wires of the same layer can be a straight line, a broken line, etc., which is not specifically limited in this disclosure.

[0079] Generally, the size of the region to be filled (eg, the width of the region to be filled) is at least greater than the width of the metal line in the same layer.

[0080] In one embodiment, the area to be filled in each metal layer is determined by:

[0081] If the interval between two adjacent metal wires of the same layer and the same mesh meets a preset condition, the area between the two adjacent metal wires of the same layer and the same mesh is determined as the area to be filled.

[0082] The preset condition includes that the interval between two adjacent metal wires of the same layer and the same network is greater than or equal to a preset interval threshold. It should be noted that the preset interval threshold can be a fixed value, or can be a certain interval value range, and the value of the preset interval threshold can be determined according to the width of the metal wires of the same layer, and the interval between the metal wires of the same layer and the metal wires of the same layer and the same network, which is not specifically limited in the present disclosure.

[0083] S208, filling the to-be-filled areas in each metal layer with metal wires of the same layer, and adding connection holes to connect the metal wires of the same layer to the same potential line.

[0084] It should be noted that after the metal wires of the same layer are filled in the area to be filled, connection holes need to be added to electrically connect the metal wires of the same layer with the corresponding potential wires, so that the metal wires of the same layer can enhance the width and strength of the potential wires.

[0085] S210, adding redundant metal to the layout in which the metal lines of the same layer are filled, and outputting the target layout.

[0086] After the to-be-filled areas of each metal layer of the initial layout are filled with metal lines of the same layer, there may still be empty areas on the layout. The pattern density can be improved by adding redundant metal to improve the surface flatness of the layout.

[0087] The present disclosure provides a redundant metal filling method, which determines the area to be filled with metal lines of the same layer in the vacant area of ​​the layout according to the wiring method of the potential lines, and automatically adds corresponding metal lines of the same layer in the area to be filled, thereby increasing the width of the overall potential line, enhancing the strength of the potential line, and reducing the area that needs to be filled with redundant metal.

[0088] In order to understand the redundant metal filling method disclosed in the present invention, the following is combined with Figure 3a and Figure 3b Provide explanation.

[0089] Figure 3a A schematic diagram showing the structure of the initial layout of the embodiment of the present disclosure is shown. Figure 3a As shown, in the initial layout, there are three potential lines 201 arranged horizontally, and three metal lines 202 of the same layer and the same mesh arranged vertically to the potential lines 201, wherein one end of the first metal line of the same layer and the same mesh is connected to the potential line of the metal layer layer located in the next layer through a connection hole, and the other end is connected to the potential line of the metal layer layer located in the previous layer through a connection hole. Figure 3a It can be found that the interval L between the first metal wire of the same layer and the same mesh and the second metal wire of the same layer and the same mesh is relatively wide, and the above interval area is determined as the to-be-filled area 203 of the metal layer.

[0090] Figure 3b FIG. 1 is a schematic diagram showing the structure of the layout after the area to be filled with metal wires of the same layer according to the embodiment of the present disclosure. Figure 3b As shown, a metal line 204 of the same layer is filled in the area to be filled 203, wherein the width W of the metal line 204 of the same layer, the interval A between the metal line 204 of the same layer and the first metal line of the same layer and the same mesh, and the interval B between the metal line 204 of the same layer and the second metal line of the same layer and the same mesh satisfy the following relationship:

[0091] L=W+A+B

[0092] It should be noted that the width W of the metal wire 204 on the same layer can be the same as or different from the width of the metal wire 202 on the same layer and the same mesh. The interval A between the metal wire 204 on the same layer and the first metal wire on the same layer and the interval B between the metal wire 204 on the same layer and the second metal wire on the same layer and the same mesh can be the same or different. The value ranges of W, A, and B are pre-set in the automatic filling program.

[0093] Figure 4 A flowchart of another redundant metal filling method provided by an embodiment of the present disclosure is shown. Figure 2 Based on this, step S204 is further refined into S2041-S2042, such as Figure 4 As shown, the redundant metal filling method of this embodiment includes steps S202, S2041-S2042, S206-S210, specifically including:

[0094] S2041, determining the same-net metal wires connected to the same potential line according to the wiring connection relationship in the initial layout;

[0095] S2042, screening the metal wires of the same mesh in the same metal layer to obtain the metal wires of the same layer and mesh.

[0096] It should be noted that the implementation method of steps S202 and S206 to S210 is the same as that of the above embodiment and will not be repeated here.

[0097] It is worth noting that, with regard to the method for determining the metal wires of the same layer and the same network, the order of the above steps S2041 and S2042 can be adjusted, and this application does not limit it.

[0098] The present disclosure can determine the number of areas to be filled in each metal layer by screening metal wires of the same layer and the same network. During the filling process, the areas to be filled can be filled one by one, thereby improving the accuracy of filling the metal wires of the same layer.

[0099] Figure 5 A flow chart of another redundant metal filling method provided by an embodiment of the present disclosure is shown. Figure 2 Based on the embodiment, before step S208, step S207 is added to determine the specific information of the metal wires in the same layer that need to be filled according to the area to be filled and the preset filling parameters of the metal wires in the same layer. Figure 5 As shown, in one embodiment, the redundant metal filling method includes S202 to S210, specifically including:

[0100] S207 , determining filling information of the metal lines on the same layer in each area to be filled according to the area to be filled and preset filling parameters of the metal lines on the same layer, so as to fill the area to be filled of each metal layer using the filling information of the metal lines on the same layer.

[0101] It should be noted that steps S202 to S206 and S208 to S210 are implemented in the same manner as in the above embodiment and will not be described in detail herein.

[0102] In this embodiment, the filling parameters of the metal lines in the same layer are pre-set in the automatic filling program, so that the filling information of the metal lines in the same layer can be obtained by directly calling the automatic filling program, thereby realizing automatic filling of the metal lines.

[0103] In one embodiment, the filling parameters of the metal lines on the same layer include at least one of the width of the metal lines on the same layer, the spacing between the metal lines on the same layer and the metal lines on the same layer and the same mesh, and the spacing between adjacent metal lines on the same layer. It should be noted that the filling parameters of the metal lines on the same layer can be a specific value or a specific range of values. The value of the filling parameters depends on the process parameters and is not specifically limited in this disclosure.

[0104] The filling information of the metal wires of the same layer in each area to be filled includes at least one of the filling quantity, filling position, filling shape, and actual filling interval of the metal wires of the same layer. It should be noted that the filling information of the metal wires of the same layer in the areas to be filled in different metal layers can be the same or different; the filling information of the metal wires of the same layer in different areas to be filled in the same metal layer can be the same or different, and the actual filling interval of the metal wires of the same layer can be adjusted based on the filling parameters, which is not specifically limited in the present disclosure.

[0105] The present invention conveniently and quickly determines the filling information of metal lines on the same layer according to the to-be-filled areas in each metal layer map and the pre-set filling parameters of the metal lines on the same layer, thereby automatically filling the to-be-filled areas of each metal layer map with metal lines according to the filling information of the metal lines on the same layer, thereby improving the metal line filling efficiency.

[0106] In one embodiment, filling the to-be-filled area in each metal layer layer with metal wires of the same layer includes:

[0107] The metal wires of the same layer are filled in the to-be-filled areas in each metal layer layer according to a repeated filling method and / or an interlaced filling method, wherein the metal wires of the same layer using the repeated filling method are connected to the same potential lines, and the metal wires of the same layer using the interlaced filling method are alternately connected to different potential lines.

[0108] Figure 6 A schematic diagram showing a repetitive filling method provided by an embodiment of the present disclosure is shown. Figure 6As shown, the initial layout includes a potential line 201 and a metal wire 202 of the same layer and the same network, wherein the interval between adjacent metal wires 202 of the same layer and the same network serves as an area to be filled, and in the area to be filled, at least one metal wire 204 of the same layer is filled, and a connection hole is set at one end of at least one metal wire 204 of the same layer, so that at least one metal wire 204 of the same layer is connected to the same potential line 201.

[0109] Figure 7 A schematic diagram showing the staggered filling method provided by the embodiment of the present disclosure is shown. Figure 7 As shown, the initial layout includes a first potential line 2011, a second potential line 2012, and at least two metal lines of the same layer and the same network, wherein the interval between the two metal lines of the same layer and the same network forms a to-be-filled area, in which at least two metal lines of the same layer 204 are filled, and the metal lines of the same layer 204 at least include a first metal line of the same layer 2041 and a second metal line of the same layer 2042, and the first metal line of the same layer and the second metal line of the same layer 2042 are staggered, wherein the first metal line of the same layer 2041 is connected to the first potential line 2011 through a connection hole, and the second metal line of the same layer 2042 is connected to the second potential line 2012 through a connection hole, so as to achieve staggered filling. It should be noted that the first metal line of the same layer 2041 or the second metal line of the same layer 2042 includes at least one metal line.

[0110] In addition, the metal wires on the same layer may be divided into two groups. The two groups of metal wires on the same layer are sequentially arranged in the area to be filled, and the two groups of metal wires on the same layer are electrically connected to different potential wires through connection holes.

[0111] It should be noted that the specific forms of the above-mentioned filling methods are merely examples provided to illustrate the embodiments of the present disclosure and should not be regarded as limiting the scope of protection of the present disclosure.

[0112] The present invention realizes automatic filling of metal wires in the same layer by adopting a repeated filling method or an interlaced filling method, fully considering factors such as the purpose and function of the metal wires in the same layer, greatly improving the strength and performance of the potential wires, and improving the chip processing speed.

[0113] Figure 8 FIG. 2 is a flow chart showing another redundant metal filling method provided by an embodiment of the present disclosure. Figure 8 As shown, in one embodiment, step S210 adds redundant metal to the layout after the metal lines of the same layer are filled, and outputs the target layout, which specifically includes:

[0114] S2102, adding redundant metal to the layout after the metal lines on the same layer are filled;

[0115] S2104, verifying the layout filled with redundant metal according to preset design rules to obtain a verification result;

[0116] S2106. If the verification result is passed, output the target layout that passed the verification.

[0117] The preset design rules of this embodiment include design rule check (DRC), electrical rule check (ERC), layout and principle Figure 1 At least one of the following operations: LVS, Netlist Extraction (NET), and Layout Parameter Extraction (LPE).

[0118] The following is an explanation using design rule checking as an example.

[0119] Design rule checking is to check whether the various sizes of the mask layer patterns in the layout meet the requirements of the design rules. The design rules of the layout are determined based on the minimum pattern size, the thinnest line width and the spacing between lines that can be produced by the specific process production line.

[0120] When checking the design rules of the layout, two aspects are mainly checked. The first is the width and spacing of the geometric figures on the same layer. Only the minimum size and minimum width need to be checked. The second is the spacing and overlay spacing between graphics on different layers. It is necessary to check whether the graphics on two different layers are completely nested, intersecting, tangent, and completely separated.

[0121] Specifically, check whether the layout after inserting the same-layer metal lines and redundant metals complies with the design rule check;

[0122] If the layout after inserting the same-layer metal lines and redundant metals does not meet the design rule check, the surface verification fails and returns to the step of filling the same-layer metal lines or redundant metals for modification; if it meets the design rule check, it means that the verification has passed, the inserted same-layer metal lines and redundant metals meet the design requirements, and the target layout is obtained.

[0123] It should be noted that the preset design rules (such as design rule checking) are pre-set in the automatic metal line filling program to achieve automatic filling of metal lines, and the filled metal lines on the same layer meet the process requirements, avoid DRC violations, and improve the reliability of circuit design.

[0124] Based on the same inventive concept, the present disclosure also provides a redundant metal filling device, as described in the following embodiments. Since the principle of solving the problem in the device embodiment is similar to that in the above method embodiment, the implementation of the device embodiment can refer to the implementation of the above method embodiment, and the repeated parts will not be repeated.

[0125] Fig. 9 FIG. 1 is a schematic diagram of a redundant metal filling device provided in an embodiment of the present disclosure. Fig. 9 As shown, a redundant metal filling device of this embodiment includes:

[0126] An initial layout providing module 901 is used to provide an initial layout, wherein the initial layout includes potential lines;

[0127] The same-layer and same-net determination module 902 is used to determine the same-layer and same-net metal wires of each metal layer according to the wiring connection relationship in the initial layout, wherein the same-layer and same-net metal wires are wires in the same metal layer and connected to the same potential line;

[0128] A filling area determination module 903 is used to determine the area to be filled in each metal layer according to the metal wires of the same layer and the same network;

[0129] The same-layer metal filling module 904 is used to fill the same-layer metal wires in the to-be-filled area in each metal layer, and add connection holes to connect the same-layer metal wires to the same potential line;

[0130] The target layout output module 905 is used to add redundant metal to the layout after the metal lines on the same layer are filled, and output the target layout.

[0131] In one embodiment of the present disclosure, the same-layer and same-network determination module 902 includes a same-network metal screening submodule and a same-layer metal screening submodule which are not shown in the drawings, wherein:

[0132] The same-net metal screening submodule is used to determine the same-net metal wires connected to the same potential line according to the wiring connection relationship in the initial layout;

[0133] The same-layer metal screening submodule is used to screen the same-net metal wires in the same metal layer to obtain the same-layer and same-net metal wires.

[0134] In one embodiment of the present disclosure, the device further includes a filling information determination module not shown in the accompanying drawings, the filling information determination module being used to fill the same-layer metal wires in the to-be-filled areas in each metal layer layer and add connection holes so that the same-layer metal wires are connected to the same potential line, and to determine the filling information of the same-layer metal wires in each to-be-filled area according to the to-be-filled area and preset filling parameters of the same-layer metal wires;

[0135] The same-layer metal filling module 904 is used to fill the to-be-filled area in each metal layer map using the filling information of the same-layer metal line.

[0136] It should be noted that the filling parameters of the metal lines in the same layer include at least one of the width of the metal lines in the same layer, the interval between the metal lines in the same layer and the metal lines in the same layer and the same network, and the interval between adjacent metal lines in the same layer.

[0137] It should be noted that the filling information of the metal wires in the same layer in each area to be filled includes at least one of the filling quantity, filling position and actual filling interval of the metal wires in the same layer.

[0138] In one embodiment of the present disclosure, the same-layer metal filling module 904 is used to fill the same-layer metal wires in the to-be-filled area in each metal layer according to a repeated filling method and / or a staggered filling method, wherein the same-layer metal wires using the repeated filling method are connected to the same potential line, and the same-layer metal wires using the staggered filling method are alternately connected to different potential lines.

[0139] In one embodiment of the present disclosure, the potential line includes at least one of a power line and a ground line having different voltage values.

[0140] In one embodiment of the present disclosure, the target layout output module 905 includes a redundant metal filling submodule, a layout verification submodule, and a layout output submodule, which are not shown in the drawings.

[0141] The redundant metal filling submodule is used to add redundant metal to the layout after the metal lines on the same layer are filled;

[0142] A layout verification submodule is used to verify the layout filled with redundant metal according to preset design rules to obtain a verification result;

[0143] The layout output submodule is used to output the verified target layout if the verification result is passed.

[0144] In one embodiment of the present disclosure, the filling area determination module 903 is used to determine the area between two adjacent metal wires of the same layer and the same mesh as the area to be filled if the interval between the two adjacent metal wires of the same layer and the same mesh meets a preset condition.

[0145] It should be noted that the preset condition includes that the interval between two adjacent metal wires of the same layer and the same network is greater than or equal to a preset interval threshold.

[0146] A redundant metal filling device disclosed herein determines, in a vacant area of ​​a layout, an area to be filled with metal wires of the same layer according to the wiring method of the potential lines, and automatically adds corresponding metal wires of the same layer in the area to be filled, thereby increasing the width of the overall potential line, enhancing the strength of the potential line, and reducing the area that needs to be filled with redundant metal.

[0147] It will be appreciated by those skilled in the art that various aspects of the present invention may be implemented as a system, method or program product. Therefore, various aspects of the present invention may be specifically implemented in the following forms, namely: a complete hardware implementation, a complete software implementation (including firmware, microcode, etc.), or a combination of hardware and software, which may be collectively referred to herein as a "circuit", "module" or "system".

[0148] Refer to the following Fig.10 The electronic device 1000 according to this embodiment of the present invention will be described. Fig.10 The electronic device 1000 shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0149] like Fig.10 As shown, the electronic device 1000 is in the form of a general computing device. The components of the electronic device 1000 may include but are not limited to: the at least one processing unit 1010, the at least one storage unit 1020, and a bus 1030 connecting different system components (including the storage unit 1020 and the processing unit 1010).

[0150] The storage unit stores program codes, which can be executed by the processing unit 1010, so that the processing unit 1010 performs the steps according to various exemplary embodiments of the present invention described in the above “Exemplary Method” section of this specification. For example, the processing unit 1010 can perform the following steps: Figure 2 Provide an initial layout as shown in the figure, the initial layout includes potential lines; determine the same-layer and same-net metal lines of each metal layer layer according to the wiring connection relationship of the initial layout, wherein the same-layer and same-net metal lines are wirings in the same metal layer layer and connected to the same potential line; determine the to-be-filled area in each metal layer layer according to the same-layer and same-net metal lines; fill the same-layer metal lines in the to-be-filled area in each metal layer layer, and add connection holes to connect the same-layer metal lines to the same potential line; add redundant metal to the layout after the same-layer metal lines are filled, and output the target layout.

[0151] The storage unit 1020 may include a readable medium in the form of a volatile storage unit, such as a random access storage unit (RAM) 10201 and / or a cache storage unit 10202 , and may further include a read-only storage unit (ROM) 10203 .

[0152] The storage unit 1020 may also include a program / utility 10204 having a set (at least one) of program modules 10205, such program modules 10205 including but not limited to: an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment.

[0153] Bus 1030 may represent one or more of several types of bus structures, including a memory unit bus or memory unit controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus architectures.

[0154] The electronic device 1000 may also communicate with one or more external devices 1040 (e.g., keyboards, pointing devices, Bluetooth devices, etc.), may also communicate with one or more devices that enable a user to interact with the system 1000, and / or communicate with any device that enables the electronic device 1000 to communicate with one or more other computing devices (e.g., routers, modems, etc.). Such communication may be performed via an input / output (I / O) interface 1050. In addition, the system 1000 may also communicate with one or more networks (e.g., a local area network (LAN), a wide area network (WAN), and / or a public network, such as the Internet) via a network adapter 1060. As shown, the network adapter 1060 communicates with other modules of the electronic device 1000 via a bus 1030. It should be understood that, although not shown in the figure, other hardware and / or software modules may be used in conjunction with the electronic device 1000, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0155] Through the description of the above implementation, it is easy for those skilled in the art to understand that the example implementation described here can be implemented by software, or by software combined with necessary hardware. Therefore, the technical solution according to the implementation of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, including several instructions to enable a computing device (which can be a personal computer, a server, a terminal device, or a network device, etc.) to execute the method according to the implementation of the present disclosure.

[0156] In an exemplary embodiment of the present disclosure, a computer-readable storage medium is further provided, on which a program product capable of implementing the above method of the present specification is stored. Fig.11 A computer program product provided by an embodiment of the present disclosure is shown. Fig.11As shown, in some possible implementations, various aspects of the present invention may also be implemented in the form of a program product, which includes program code. When the program product is run on a terminal device, the program code is used to enable the terminal device to execute the steps of various exemplary implementations of the present invention described in the above "Exemplary Method" section of this specification.

[0157] A program product for implementing the above method according to an embodiment of the present invention is described, which can adopt a portable compact disk read-only memory (CD-ROM) and include program code, and can be run on a terminal device, such as a personal computer. However, the program product of the present invention is not limited thereto, and in this document, a readable storage medium can be any tangible medium containing or storing a program, which can be used by or in combination with an instruction execution system, an apparatus or a device.

[0158] The program product may use any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0159] Computer readable signal media may include data signals propagated in baseband or as part of a carrier wave, in which readable program code is carried. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Readable signal media may also be any readable medium other than a readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0160] The program code embodied on the readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wired, optical cable, RF, etc., or any suitable combination of the foregoing.

[0161] Program code for performing the operations of the present invention may be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving a remote computing device, the remote computing device may be connected to the user computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computing device (e.g., through the Internet using an Internet service provider).

[0162] It should be noted that, although several modules or units of the device for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. On the contrary, the features and functions of one module or unit described above can be further divided into multiple modules or units to be embodied.

[0163] In addition, although the steps of the method in the present disclosure are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps, etc.

[0164] Through the description of the above implementation, it is easy for those skilled in the art to understand that the example implementation described here can be implemented by software, or by software combined with necessary hardware. Therefore, the technical solution according to the implementation of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, including several instructions to enable a computing device (which can be a personal computer, a server, a mobile terminal, or a network device, etc.) to execute the method according to the implementation of the present disclosure.

[0165] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A redundant metal filling method, characterized in that: include: Providing an initial layout, wherein the initial layout includes potential lines; Determine the same-layer and same-net metal wires of each metal layer according to the wiring connection relationship in the initial layout, wherein the same-layer and same-net metal wires are wirings in the same metal layer and connected to the same potential line; Determine the area to be filled in each metal layer according to the metal wires of the same layer and the same network; Filling the to-be-filled areas in each metal layer with metal wires of the same layer, and adding connection holes to connect the metal wires of the same layer to the same potential line; After the metal lines on the same layer are filled, redundant metal is added and the target layout is output; Wherein, determining the to-be-filled areas in each metal layer according to the metal wires in the same layer and the same network includes: If the interval between two adjacent metal wires of the same layer and the same mesh meets a preset condition, the area between the two adjacent metal wires of the same layer and the same mesh is determined as the area to be filled; The preset condition includes that the interval between two adjacent metal wires of the same layer and the same network is greater than or equal to a preset interval threshold.

2. The redundant metal filling method according to claim 1, characterized in that: Determining the same-layer and same-net metal lines of each metal layer according to the wiring connection relationship in the initial layout includes: Determining the same-net metal wires connected to the same potential line according to the wiring connection relationship in the initial layout; The same-net metal wires in the same metal layer are screened to obtain the same-layer and same-net metal wires.

3. The redundant metal filling method according to claim 1, characterized in that: Before filling the to-be-filled areas in the metal layer layers with metal wires of the same layer and adding connection holes so that the metal wires of the same layer are connected to the same potential line, the method further includes: The filling information of the metal wires on the same layer in each area to be filled is determined according to the area to be filled and the preset filling parameters of the metal wires on the same layer, so as to fill the area to be filled in each metal layer map using the filling information of the metal wires on the same layer.

4. The redundant metal filling method according to claim 3, characterized in that: The filling parameters of the metal lines in the same layer include at least one of the width of the metal lines in the same layer, the spacing between the metal lines in the same layer and the metal lines in the same layer and the same network, and the spacing between adjacent metal lines in the same layer.

5. The redundant metal filling method according to claim 3, characterized in that: The filling information of the metal lines of the same layer in each to-be-filled area includes at least one of the filling quantity, filling position, and actual filling interval of the metal lines of the same layer.

6. The redundant metal filling method according to claim 1, characterized in that: The filling of the to-be-filled areas in each of the metal layer layers with metal wires of the same layer comprises: According to a repeated filling method and / or an interlaced filling method, the metal wires of the same layer are filled in the to-be-filled areas in each metal layer layer, wherein the metal wires of the same layer using the repeated filling method are connected to the same potential lines, and the metal wires of the same layer using the interlaced filling method are alternately connected to different potential lines.

7. The redundant metal filling method according to claim 1, characterized in that: The potential line includes at least one of a power line and a ground line having different voltage values.

8. The redundant metal filling method according to claim 1, characterized in that: The method of adding redundant metal to the layout after the metal lines on the same layer are filled and outputting the target layout includes: Adding redundant metal on the layout after the metal lines on the same layer are filled; Verify the layout filled with redundant metal according to preset design rules to obtain verification results; If the verification result is that the verification is passed, the target layout that has passed the verification is output.

9. A redundant metal filling device, characterized in that: include: An initial layout providing module, used to provide an initial layout, wherein the initial layout includes potential lines; A same-layer and same-net determination module, used to determine the same-layer and same-net metal wires of each metal layer according to the wiring connection relationship in the initial layout, wherein the same-layer and same-net metal wires are wirings in the same metal layer and connected to the same potential line; A filling area determination module, used to determine the area to be filled in each metal layer according to the metal wires of the same layer and the same network of each metal layer; A same-layer metal filling module is used to fill the same-layer metal wires in the to-be-filled areas in each metal layer, and add connection holes to connect the same-layer metal wires to the same potential line; A target layout output module, used to add redundant metal to the layout after the metal lines on the same layer are filled, and output the target layout; The filling area determination module is used to determine the area to be filled in each metal layer according to the metal wires of the same layer and the same network of each metal layer, including: If the interval between two adjacent metal wires of the same layer and the same mesh meets a preset condition, the area between the two adjacent metal wires of the same layer and the same mesh is determined as the area to be filled; The preset condition includes that the interval between two adjacent metal wires of the same layer and the same network is greater than or equal to a preset interval threshold.

10. An electronic device, characterized in that: include: processor; as well as A memory, configured to store executable instructions of the processor; Wherein, the processor is configured to perform the redundant metal filling method described in any one of claims 1-8 by executing the executable instructions.

11. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the redundant metal filling method according to any one of claims 1 to 8 is implemented.

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