Process for improving the quality of chip mounting

Abstract

The application discloses a process method for improving chip mounting quality, and comprises the following steps: step 1, laser marking a bare chip mounting position positioning frame; step 2, laser marking a conductive adhesive coating position positioning frame; step 3, coating conductive adhesive in the conductive adhesive coating position positioning frame area by using a dispensing machine; and step 4, mounting a chip. The process method is scientific and reasonable, easy to operate, and suitable for mass production. Meanwhile, the process method can also be applied to the manufacturing process of similar products, and has strong universality.

Description

TECHNICAL FIELD

[0001] The present application relates to the chip mounting technical field, specifically, it relates to a process method for improving the quality of chip mounting. BACKGROUND

[0002] In hybrid integrated circuits and MCM multi-chip module, a plurality of bare chips are spliced in a cavity, then the bare chips are interconnected by gold wires to form a circuit function, and are packaged in a small cavity to form a specific function module.

[0003] In the product manufacturing process, the positions of the plurality of bare chips spliced and mounted are not clear, the mounting positions are not accurately grasped by the operators, the production efficiency is low, and the span of the subsequent gold wire bonding gold wires is affected, which affects the product performance indicators. Moreover, in the production process, the bare chips are adhered in the cavity by conductive adhesive, since the conductive adhesive coating area is not clear, the coating area position is not accurately grasped by the operator, which affects the dispensing effect to some extent, and also affects the glue overflow amount of the edge of the bare chip. It can be seen that the unclear splicing and mounting positions of the bare chips and the unclear conductive adhesive coating area not only affect the quality of the bare chip mounting, but also lead to low production efficiency. SUMMARY

[0004] The purpose of the present application is to provide a process method for improving the quality of chip mounting, which is scientific and reasonable, easy to operate, and suitable for mass production. At the same time, the process method can also be applied to the manufacturing process of similar products, and has strong universality.

[0005] In order to achieve the above-mentioned purpose, the present application provides a process method for improving the quality of chip mounting, which comprises:

[0006] Step 1, laser marking of the mounting position positioning frame of the bare chip;

[0007] Step 2, laser marking of the conductive adhesive coating position positioning frame;

[0008] Step 3, using a dispensing machine to coat conductive adhesive in the conductive adhesive coating position positioning frame area;

[0009] Step 4, mounting the chip.

[0010] Preferably, in step 1, according to the length and width dimensions of the bare chip, the length and width dimensions of the mounting position positioning frame are set to be the same as the length and width dimensions of the bare chip, the mounting position positioning frame of the bare chip on the shell is drawn on the laser marking machine, and U1 bare chip mounting position positioning frame, U2 bare chip mounting position positioning frame, U3 bare chip mounting position positioning frame, U4 bare chip mounting position positioning frame and U5 bare chip mounting position positioning frame are marked on the shell by laser.

[0011] Preferably, in step 2, according to the length and width of the bare chip, the length and width of the conductive adhesive coating position positioning frame are set to 75%-80% of the length and width of the bare chip respectively; the conductive adhesive coating position positioning frame on the shell is drawn on the laser marking machine, and U1 bare chip conductive adhesive coating position positioning frame, U2 bare chip conductive adhesive coating position positioning frame, U3 bare chip conductive adhesive coating position positioning frame, U4 bare chip conductive adhesive coating position positioning frame and U5 bare chip conductive adhesive coating position positioning frame are marked on the shell by laser.

[0012] Preferably, in step 3, the conductive adhesive is uniformly coated in the areas of the bare chip conductive adhesive coating position positioning frame marked on the shell by using a dispensing machine.

[0013] Preferably, in step 4, the U1 bare chip, the U2 bare chip, the U3 bare chip, the U4 bare chip and the U5 bare chip are respectively picked up by a chip mounter and mounted on the U1 bare chip conductive adhesive coating position positioning frame, the U2 bare chip conductive adhesive coating position positioning frame, the U3 bare chip conductive adhesive coating position positioning frame, the U4 bare chip conductive adhesive coating position positioning frame and the U5 bare chip conductive adhesive coating position positioning frame coated with conductive adhesive, so that the four edges of each bare chip are aligned and overlapped with the edge lines of the positioning frame, and then the edges of the bare chip are pressed by tweezers to make the conductive adhesive overflow to the edge lines of the positioning frame.

[0014] According to the above technical solution, the bare chip mounting position is determined by marking the bare chip mounting position positioning frame diagram by laser, and the relative distance of the gold wire bonding gold wire of the bare chip is determined. The conductive adhesive coating area is determined by marking the conductive adhesive coating position positioning frame diagram by laser, the amount of conductive adhesive is ensured, the conductive adhesive overflow amount of the bare chip mounting is controlled, the product quality and consistency are improved, and the chip mounting efficiency is greatly improved.

[0015] Other features and advantages of the present application will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, and together with the specific embodiments below, serve to explain the present application, but do not constitute a limitation on the present application. In the drawings:

[0017] Figure 1 is a flowchart of a process for improving chip mounting quality provided by the present application;

[0018] Figure 2 is a schematic diagram of the laser marking frame in the present application;

[0019] Figure 3 is a schematic diagram of chip mounting in the present application.

[0020] Reference Signs List

[0021] 1-Shell

[0022] 2-U1 bare chip mounting position positioning frame

[0023] 3-U1 bare chip conductive adhesive coating position positioning frame

[0024] 4-U2 bare chip mounting position positioning frame

[0025] 5-U2 bare chip conductive adhesive coating position positioning frame

[0026] 6-U3 bare chip mounting position positioning frame

[0027] 7-U3 bare chip conductive adhesive coating position positioning frame

[0028] 8-U4 bare chip mounting position positioning frame

[0029] 9-U4 bare chip conductive adhesive coating position positioning frame

[0030] 10-U5 bare chip mounting position positioning frame

[0031] 11-U5 bare chip conductive adhesive coating position positioning frame DETAILED DESCRIPTION

[0032] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present application, and are not intended to limit the present application.

[0033] In the present application, the orientation words contained in the terms such as "inner, outer" represent the orientation of the terms in the conventional use state or the common name understood by those skilled in the art, without being regarded as a limitation of the terms, unless otherwise stated.

[0034] Referring to Figure 1 The present application provides a process method for improving chip mounting quality, which comprises the following steps:

[0035] Step 1, laser marking a bare chip mounting position positioning frame;

[0036] Step 2, laser marking a conductive adhesive coating position positioning frame;

[0037] Step 3, using a dispensing machine to coat conductive adhesive in the conductive adhesive coating position positioning frame area;

[0038] Step 4, mounting the chip.

[0039] In step 1, according to the length and width dimensions of the bare chip, the length and width dimensions of the mounting position positioning frame are set to be the same as those of the bare chip, and the mounting position positioning frame of the bare chip on the shell is drawn on the laser marking machine, as shown in the figure. Figure 2 As shown in the figure, the U1 bare chip mounting position positioning frame 2, the U2 bare chip mounting position positioning frame 4, the U3 bare chip mounting position positioning frame 6, the U4 bare chip mounting position positioning frame 8 and the U5 bare chip mounting position positioning frame 10 are marked on the shell 1 by laser.

[0040] In step 2, according to the length and width dimensions of the bare chip, the length and width dimensions of the conductive glue coating position positioning frame are set to be 75%-80% of the length and width dimensions of the bare chip, respectively, to ensure the control of the edge glue overflow amount during subsequent chip mounting; the conductive glue coating position positioning frame on the shell is drawn on the laser marking machine, as shown in the figure. Figure 2 As shown in the figure, the U1 bare chip conductive glue coating position positioning frame 3, the U2 bare chip conductive glue coating position positioning frame 5, the U3 bare chip conductive glue coating position positioning frame 7, the U4 bare chip conductive glue coating position positioning frame 9 and the U5 bare chip conductive glue coating position positioning frame 11 are marked on the shell 1 by laser.

[0041] In step 3, the conductive glue is uniformly coated in the areas of the multiple bare chip conductive glue coating position positioning frames marked on the shell 1 by using a glue dispenser.

[0042] In step 4, the U1 bare chip, the U2 bare chip, the U3 bare chip, the U4 bare chip and the U5 bare chip are picked up by a chip mounter and mounted at the U1 bare chip conductive glue coating position positioning frame 3, the U2 bare chip conductive glue coating position positioning frame 5, the U3 bare chip conductive glue coating position positioning frame 7, the U4 bare chip conductive glue coating position positioning frame 9 and the U5 bare chip conductive glue coating position positioning frame 11 coated with conductive glue, respectively, so that the four edges of each bare chip are aligned and overlapped with the edge lines of the positioning frame, and then the edges of the bare chip are pressed by using tweezers, so that the conductive glue overflow amount reaches the edge lines of the positioning frame.

[0043] As can be seen, the mounting position frame of the bare chip is marked on the shell bottom by using the laser marking machine, as a mounting position reference mark, so that the mounting position of the bare chip on the shell is determined uniquely, and the consistency of the mounting position is ensured, and the mounting efficiency is improved; the conductive glue coating position positioning frame is marked by laser, so that the conductive glue coating area is clear, as a conductive glue coating position mark, which controls the edge glue overflow amount of the bare chip to a certain extent; the chip mounting position and the conductive glue coating area position are marked by laser, which improves the product mounting quality and consistency, and greatly improves the chip mounting efficiency.

[0044] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0045] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, the present invention will not describe the various possible combinations separately.

[0046] Furthermore, various different embodiments of the present invention can be combined in any way, as long as they do not violate the spirit of the present invention, they should also be regarded as the content disclosed by the present invention.

Claims

1. A process method for improving chip mounting quality, characterized in that, The process includes: Step 1: Laser marking of the bare chip mounting position positioning frame; Step 2: Laser marking of the conductive adhesive coating position positioning frame; Step 3: Apply conductive adhesive to the designated area using a dispensing machine. Step 4: Chip mounting; In step 1, the length and width of the mounting position positioning frame are set to be the same as the length and width of the bare chip according to the length and width of the bare chip. The mounting position positioning frame of the bare chip on the housing is drawn on the laser marking machine. The U1 bare chip mounting position positioning frame (2), U2 bare chip mounting position positioning frame (4), U3 bare chip mounting position positioning frame (6), U4 bare chip mounting position positioning frame (8) and U5 bare chip mounting position positioning frame (10) are marked on the housing (1) using laser. In step 2, based on the length and width dimensions of the bare chip, the length and width dimensions of the conductive adhesive coating position positioning frame are set to be 75%-80% of the length and width dimensions of the bare chip, respectively; the conductive adhesive coating position positioning frame is drawn on the shell on the laser marking machine, and the U1 bare chip conductive adhesive coating position positioning frame (3), U2 bare chip conductive adhesive coating position positioning frame (5), U3 bare chip conductive adhesive coating position positioning frame (7), U4 bare chip conductive adhesive coating position positioning frame (9) and U5 bare chip conductive adhesive coating position positioning frame (11) are marked on the shell (1) using a laser. In step 3, conductive adhesive is uniformly applied to the multiple bare chip conductive adhesive application location positioning frame areas marked on the housing (1) using a dispensing machine; In step 4, the U1 bare chip, U2 bare chip, U3 bare chip, U4 bare chip and U5 bare chip are picked up by the pick-and-place machine and respectively placed in the conductive adhesive coating position positioning frame (3) of U1 bare chip, conductive adhesive coating position positioning frame (5) of U2 bare chip, conductive adhesive coating position positioning frame (7) of U3 bare chip, conductive adhesive coating position positioning frame (9) of U4 bare chip and conductive adhesive coating position positioning frame (11) of U5 bare chip, so that the four sides of each bare chip are aligned and overlapped with the edge line of the positioning frame. Then, the edge of the bare chip is held with tweezers and pressed so that the conductive adhesive overflows to the edge line of the positioning frame.

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