A bone conduction headphone based on a digital sound chip

Abstract

This invention discloses a bone conduction headphone based on a digital sound chip, relating to the field of headphone technology, to solve the problem that the sound quality of existing bone conduction headphones depends on the quality of the bone resonator and is prone to sound leakage. The bone conduction headphone includes: a shell, a main board, and a speaker unit; a control unit is disposed on the main board; the speaker unit includes a digital sound chip and a sealing shell, the sealing shell covering the digital sound chip, and the outer edges of the two are fixedly connected, forming a sealed cavity between the sealing shell and the digital sound chip; the control unit processes the received audio signal to obtain multi-channel quantized digital pulse signals and sends them to the digital sound chip; the digital sound chip converts the digital pulse signals into sound waves, and the vibration generated by the superposition of the sound waves changes the air pressure in the sealed cavity, thereby causing the sealing shell to vibrate, and the vibration of the sealing shell drives the skull to vibrate, realizing bone conduction. The bone conduction headphone provided by this invention is used for sound transmission via bone conduction.

Description

Technical Field

[0001] This invention relates to the field of headphone technology, and more particularly to a bone conduction headphone based on a digital sound chip. Background Technology

[0002] Bone conduction is a sound transmission method that converts sound into mechanical vibrations of different frequencies, transmitting sound waves through the skull, bony labyrinth, inner ear fluid, cochlea, and auditory center. Compared to the classic sound conduction method that generates sound waves through a diaphragm, bone conduction eliminates many steps in sound wave transmission, enabling clear sound reproduction in noisy environments, and the sound waves do not affect others due to airborne diffusion.

[0003] Existing miniature bone conduction loudspeakers consist of a magnet, coil, diaphragm, and vibration device. The vibration system is a layered structure composed of balance plates. When the bone conduction loudspeaker is working, the vibration is transmitted through contact with the skin and bones, accompanied by the vibration of the diaphragm. However, the quality of the bone resonator in existing bone conduction loudspeakers essentially determines the sound quality of bone conduction headphones, thus requiring high-quality bone resonators. Moreover, while the bone resonator vibrates, the outer shell of the bone conduction headphones also vibrates the surrounding air, resulting in sound leakage. Summary of the Invention

[0004] The purpose of this invention is to provide a bone conduction headphone based on a digital sound chip, which solves the problem that the sound quality of existing bone conduction headphones depends on the quality of the bone vibrator and is prone to sound leakage.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A bone conduction headphone based on a digital sound chip, the bone conduction headphone comprising at least: a housing, a motherboard, and a speaker unit;

[0007] The motherboard is equipped with a control unit, which is located inside the housing. The housing is fixedly connected to the speaker unit. The speaker unit includes a digital sound chip and a sealing shell. The sealing shell covers the digital sound chip, and the outer edge of the sealing shell is fixedly connected to the outer edge of the digital sound chip. A sealing cavity is formed between the sealing shell and the digital sound chip.

[0008] The control unit is used to receive audio signals input from the audio input terminal, process the audio signals to obtain multi-channel quantized digital pulse signals, and send the multi-channel quantized digital pulse signals to the digital sound chip; the digital sound chip is used to convert the multi-channel quantized digital pulse signals into sound waves, and the vibration generated by the superposition of the sound waves changes the air pressure in the sealed cavity, thereby causing the sealed shell to vibrate, and the vibration of the sealed shell drives the skull to vibrate, realizing bone conduction.

[0009] Optionally, the bone conduction headphones may further include a mounting plate for connecting the motherboard and the speaker unit.

[0010] Optionally, the mounting plate is sealed and assembled with the motherboard and the speaker unit respectively, the motherboard is placed inside the housing and sealed and assembled with the housing, and the mounting plate and the speaker unit are placed outside the housing.

[0011] Optionally, the motherboard, mounting plate, and speaker unit are all disposed inside the housing.

[0012] Optionally, the speaker unit is provided with a housing, and the housing provided outside the speaker unit is fixedly connected to the casing.

[0013] Optionally, the bone conduction headphones are provided with a fastener for fixing them in place, the fastener being used to wear the bone conduction headphones in a set position.

[0014] Optionally, the digital sound chip includes a substrate on which an ASIC chip and basic transducer elements are disposed; the basic transducer elements are cascaded into an array.

[0015] The ASIC chip is used to send the received multi-channel quantized digital pulse signals to each transducer element; each transducer element is used to convert the multi-channel quantized digital pulse signals into pulse sound waves, and the sound waves are superimposed to achieve vibration.

[0016] Optionally, the motherboard may also include a power supply for powering the bone conduction headphones.

[0017] Optionally, the audio input terminal is a Bluetooth antenna.

[0018] Compared with the prior art, the present invention provides a bone conduction headphone based on a digital sound chip, comprising at least: a housing, a main board, and a speaker unit; a control unit is disposed on the main board, the main board is disposed within the housing, the housing is fixedly connected to the speaker unit, the speaker unit includes a digital sound chip and a sealing shell, the sealing shell covers the digital sound chip, and the outer edge of the sealing shell is fixedly connected to the outer edge of the digital sound chip, forming a sealed cavity between the sealing shell and the digital sound chip; the control unit is used to process the audio signal received from the audio input terminal to obtain a multi-channel quantized digital pulse signal, and send the multi-channel quantized digital pulse signal to the digital sound chip; the digital sound chip is used to convert the multi-channel quantized digital pulse signal into a sound wave, the vibration generated by the superposition of the sound waves changes the air pressure in the sealed cavity, thereby causing the sealing shell to vibrate, the vibration of the sealing shell drives the skull to vibrate, thus realizing bone conduction. This bone conduction headphone uses a speaker unit composed of a digital sound chip and a sealed shell to replace the traditional bone conduction speaker. It can guarantee sound quality without the need for a bone vibrator, avoiding the dependence of the sound quality of bone conduction headphones on the quality of the bone vibrator. At the same time, the sealed shell covers the digital sound chip, and the outer edge of the sealed shell is fixedly connected to the outer edge of the digital sound chip. A sealed cavity is formed between the sealed shell and the digital sound chip. The digital sound chip converts digital pulse signals into sound wave vibrations, which change the air pressure in the sealed cavity, thereby causing the sealed shell to vibrate and realize bone conduction. The sealed shell is directly sealed at the sound-emitting point of the digital sound chip, which can reduce sound leakage. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0020] Figure 1 This is a schematic diagram of the bone conduction headphone structure provided in an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the speaker unit structure provided in an embodiment of the present invention;

[0022] Figure 3 A flowchart illustrating the workflow of a bone conduction headphone provided in an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the external structure of a bone conduction headphone according to an embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the main body packaging structure of the bone conduction earphone provided in an embodiment of the present invention;

[0025] Figure 6This is a schematic diagram of another bone conduction headphone body packaging structure provided in an embodiment of the present invention;

[0026] Figure 7 This is a schematic diagram of an ear-hook bone conduction headphone structure provided in this embodiment of the invention.

[0027] Figure label:

[0028] 10-Housing, 11-Speaker unit, 12-Sealed housing, 13-Digital sound chip, 14-Main board, 210-ASIC chip, 211-Substrate, 212-Basic transducer element. Detailed Implementation

[0029] To facilitate a clear description of the technical solutions in the embodiments of the present invention, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. For example, the first threshold and the second threshold are merely used to distinguish different thresholds and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" are not necessarily different.

[0030] It should be noted that in this invention, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0031] In this invention, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.

[0032] Bone conduction headphones transmit sound into the ear through the skull. Existing bone conduction headphones often achieve bone conduction through the vibration of bone resonators, so the quality requirements for bone resonators are relatively high. Moreover, while the bone resonator vibrates the skull, the shell of the bone conduction headphones also causes the surrounding air to vibrate, resulting in sound leakage. Sound leakage will have a significant impact on the sound quality of bone conduction headphones.

[0033] To address the above problems, this invention provides a bone conduction headphone based on a digital sound chip. The following description, in conjunction with the accompanying drawings, illustrates the solution provided by the embodiments of this invention:

[0034] like Figure 1 As shown, a bone conduction headphone according to a preferred embodiment of the present invention includes: a housing 10, a main board 14, and a speaker unit 11; the main board 14 is disposed in the housing 10, and a control unit is disposed on the main board 14; the housing 10 can be configured as follows: Figure 1 The shape shown conforms to the human ear, allowing the bone conduction headphones to be hung on the ear and fixed relative to the head. The speaker unit 11 is fixedly connected to the housing 10. The speaker unit 11 includes a digital sound chip 13 and a sealing shell 12. The structure of the speaker unit 11 can be combined with... Figure 2 Please provide an explanation, such as Figure 2 As shown, the speaker unit 11 includes a digital sound chip 13 and a sealing shell 12. The sealing shell 12 covers the digital sound chip 13, and the outer edge of the sealing shell 12 is fixedly connected to the outer edge of the digital sound chip 13, so that the sealing shell 12 directly seals the side of the digital sound chip 13 that generates vibration, and a sealing cavity is formed between the sealing shell 12 and the digital sound chip 13.

[0035] The control unit is used to receive the audio signal input from the audio input terminal and process the audio signal. Based on the audio signal and the structure of the basic transducer element of the digital sound chip 13, the DRS algorithm or other algorithms with the same function can be used to perform modulation and decimation operations to obtain multi-channel quantized digital pulse signals, and send the multi-channel quantized digital pulse signals to the digital sound chip 13. The digital sound chip 13 is used to convert the multi-channel quantized digital pulse signals into pulse sound waves. The vibration generated by the superposition of sound waves changes the air pressure in the sealed cavity, thereby causing the sealed shell 12 to vibrate. The vibration of the sealed shell 12 drives the skull to vibrate, realizing bone conduction.

[0036] The principle by which the digital sound chip 13 converts multi-channel quantized digital pulse signals into pulse sound waves can be combined with... Figure 2 Please provide an explanation, such as Figure 2As shown, the digital sound-generating chip 13 includes a substrate 211, an ASIC chip 210, and a basic transducer element 212. The basic transducer element 212 is composed of multiple cascaded arrayed sound-generating pixel units. The ASIC chip 210 distributes the received multi-channel quantized digital pulse signals to each transducer element. After receiving the digital pulse signals, each transducer element applies a potential difference between the electrode and the diaphragm to generate electrostatic force. The diaphragm then adheres to the electrode and has a huge acceleration, thus generating pulsed sound waves. The sound waves generated by the cascaded arrayed sound-generating pixel units superimpose to generate vibration, thereby changing the air pressure in the sealed cavity. The substrate 211 of the digital sound-generating chip 13 may also be provided with contacts. The ASIC chip 210 and the basic transducer element 212 are disposed on the same side of the substrate 211, and the contacts are disposed on the other side of the substrate 211. The digital sound-generating chip 13 receives the multi-channel quantized digital pulse signals sent from the control unit through the contacts and sends them to the ASIC chip 210. The digital sound-generating chip 13 can communicate with external circuits through the contacts.

[0037] The speaker unit 11 is provided with such Figure 1 The outer casing shown is fixedly connected to the housing 10 and is disposed outside the speaker unit 11. The outer casing completely covers the speaker unit 11, which can protect the speaker unit 11 and prevent the speaker unit 11 from being damaged by direct contact and friction with the skin.

[0038] Optionally, a housing can be provided only at the bottom of the speaker unit 11. This housing is also fixedly connected to the housing 10, while the sealing shell 12 and the portion connected to the digital sound chip 13 are not fitted with a housing. This allows the sealing shell 12 of the speaker unit 11 to directly conform to the human body for bone conduction, further preventing sound leakage. Since the sealing shell 12 is in direct contact with the human body, it must be made of wear-resistant materials such as metal or plastic. In addition to being configured as… Figure 2 In addition to the shape, it can also be set to a circle or other shapes as needed.

[0039] In addition to housing the motherboard 14, the housing 10 also contains a power supply component, wires, etc. The power supply component provides power to the entire bone conduction headphones.

[0040] The control unit can be a controller, MCU chip, etc. The audio input can be a Bluetooth antenna.

[0041] The motherboard 14 contains all the control circuits for implementing the bone conduction headphone function, as well as the substrate or wiring for electrical connections between the components. The motherboard 14 is fixed in the housing 10 by clips, screws, glue, etc. There can be one or more motherboards 14. When there are two motherboards 14, the control unit, antenna, microphone, etc. can be integrated together, and the speaker unit 11 and the wireless receiver can be integrated together, so that the control unit can wirelessly control the speaker unit 11 to perform bone conduction, making the design of bone conduction headphones more flexible.

[0042] The working process of this bone conduction headphone can be combined with Figure 3 Please provide an explanation, such as Figure 3 As shown, the workflow includes the following steps:

[0043] Step 301: The Bluetooth antenna receives the input audio signal and sends it to the control unit.

[0044] The Bluetooth antenna can be mounted on the motherboard, or other wireless receivers can be selected.

[0045] Step 302: The control unit processes the audio signal to obtain multi-channel quantized digital pulse signals and sends the multi-channel quantized pulse signals to the digital sound chip.

[0046] Based on the audio signal and the structure of the basic transducer element of the digital sound chip, the control unit can use the DRS algorithm to calculate the multi-channel quantized digital pulse signal.

[0047] Step 303: The digital sound chip converts the multi-channel quantized digital pulse signals into pulse sound waves.

[0048] Electrostatic force is generated by applying a potential difference between the electrodes and the diaphragm in each sound-emitting pixel unit of the basic transducer element. The diaphragm then adheres to the electrodes and has a huge acceleration, thus generating pulsed sound waves.

[0049] The digital sound chip is controlled by a control unit to produce sound.

[0050] Step 304: The vibration generated by the superposition of sound waves changes the air pressure inside the sealed cavity, causing the sealed shell to vibrate.

[0051] Step 305: The vibration of the sealed shell causes the skull to vibrate, thus achieving bone conduction.

[0052] This bone conduction headphone uses a speaker unit 11 composed of a digital sound chip 13 and a sealing shell 12 to replace the traditional bone conduction speaker. It can guarantee sound quality without the need for a bone vibrator, avoiding the dependence of the sound quality of bone conduction headphones on the quality of the bone vibrator. At the same time, the sealing shell 12 covers the digital sound chip 13, and the outer edge of the sealing shell 12 is fixedly connected to the outer edge of the digital sound chip 13. A sealed cavity is formed between the sealing shell 12 and the digital sound chip 13. The digital sound chip 13 converts digital pulse signals into sound wave vibrations, changing the air pressure in the sealed cavity, thereby causing the sealing shell 12 to vibrate and realize bone conduction. The sealing shell 12 is directly sealed at the sound-emitting point of the digital sound chip 13, which can reduce sound leakage.

[0053] As one possible implementation, the present invention also provides another type of bone conduction headphone, such as... Figure 4 As shown, the mainboard and speaker unit in the bone conduction headphones are independently packaged and each has a locking clip for securing them. These clips can be U-shaped or shaped like clips or pins, positioned at the center of the non-sound-producing side of the headphones. The clips allow the bone conduction headphones to be worn in a designated position, such as anywhere inside a hiking hat, sports headband, or swimming cap. Wearing these accessories allows the headphones to be placed anywhere on the head, enabling flexible wear. When worn, the two headphones are placed symmetrically for better sound transmission and an improved user experience.

[0054] The motherboard and speaker unit in bone conduction headphones can also be packaged in a single housing, such as... Figure 5 As shown, the bone conduction headphone housing contains a main board and a speaker. The speaker unit is located on the side of the housing that fits against the human head and is used to transmit sound. The main board and the speaker are connected by a mounting plate. The mounting plate is sealed to the main board and the speaker unit respectively. The main board and the housing, as well as the speaker unit and the housing, are also sealed to each other.

[0055] To avoid the outer casing affecting sound conduction, in the structure consisting of the motherboard, mounting plate, and speaker units, the motherboard is placed inside the casing and sealed therewith, while the mounting plate and speaker units are placed outside the casing. The specific structure is as follows: Figure 6 As shown, the speaker unit and mounting plate are not encapsulated in the housing. In this case, the mounting plate, speaker unit and main board also need to be sealed and assembled separately.

[0056] As one possible implementation, the present invention also provides an ear-hook bone conduction headphone, combined with Figure 7 Please provide an explanation, such as Figure 7As shown, the speaker unit is separate from the housing and connected by wires, which can be flat to conform to the human body. The housing houses components such as the motherboard, and the speaker unit consists of a digital sound chip and a sealed shell. The speaker unit conforms to the human head to transmit sound. During operation, the speaker unit is powered and communicates with the motherboard via wires. Wireless communication between the speaker unit and the motherboard is also possible, with the wires only providing power.

[0057] Although the invention has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed invention. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.

[0058] Although the invention has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made therein without departing from the spirit and scope of the invention. Accordingly, this specification and drawings are merely exemplary descriptions of the invention as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. Clearly, those skilled in the art can make various alterations and modifications to the invention without departing from its spirit and scope. Thus, if such modifications and modifications of the invention fall within the scope of the claims and their equivalents, the invention is also intended to include such modifications and modifications.

Claims

1. A bone conduction headphone based on a digital sound chip, characterized in that, The bone conduction headphones include at least: a housing, a main board, a speaker unit, and a mounting plate; The motherboard is equipped with a control unit and is housed within the housing. The housing is fixedly connected to the speaker unit. The speaker unit includes a digital sound chip and a sealing shell. The sealing shell covers the digital sound chip, and its outer edge is fixedly connected to the outer edge of the digital sound chip, forming a sealed cavity between the sealing shell and the digital sound chip. The mounting plate connects the motherboard and the speaker unit. The mounting plate is sealed and assembled with both the motherboard and the speaker unit. The motherboard is placed inside the housing and sealed and assembled with the housing. The mounting plate and the speaker unit are placed outside the housing. A shell is provided outside the speaker unit and is fixedly connected to the housing. A buckle is provided on the outside of the bone conduction headphones for fixing them in a designated position. A power supply is also provided inside the housing to power the bone conduction headphones. The control unit receives audio signals from the audio input terminal, processes the audio signals to obtain multi-channel quantized digital pulse signals, and sends the multi-channel quantized digital pulse signals to the digital sound chip. The digital sound chip converts the multi-channel quantized digital pulse signals into sound waves. The vibration generated by the superposition of the sound waves changes the air pressure in the sealed cavity, thereby causing the sealed shell to vibrate. The vibration of the sealed shell drives the skull to vibrate, realizing bone conduction. The audio input terminal is a Bluetooth antenna. The digital sound chip includes a substrate, on which an ASIC chip and basic transducer elements are disposed. The basic transducer elements are cascaded into an array. The ASIC chip sends the received multi-channel quantized digital pulse signals to each transducer element. Each transducer element converts the multi-channel quantized digital pulse signals into pulse sound waves, and the sound waves superimpose to achieve vibration.

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