Heat dissipation structure and electric vehicle

Abstract

This invention discloses a heat dissipation structure and an electric vehicle. The heat dissipation structure includes a housing, a liquid inlet mechanism, and a liquid outlet mechanism. The housing has a heat dissipation cavity on both the inside and outside, which improves the utilization rate of the heat dissipation space. The housing has multiple flow channels. A liquid-cooled circuit pipe structure connects the two sides of the housing and connects to the liquid inlet and outlet at both ends of each flow channel. A lower temperature coolant is introduced into one end of the liquid-cooled circuit pipe structure and flows through multiple flow channels to dissipate heat. The higher temperature coolant after dissipation is discharged through the liquid-cooled circuit pipe structure connected to the outlet on one side. The housing is reinforced with the support strength of the flow channel walls between every two adjacent flow channels. At the same time, the flow channel arrangement can reduce the weight of the housing and increase the effective contact area for heat dissipation, thereby improving the heat dissipation efficiency and solving the technical problems of existing liquid cooling heat dissipation devices being too heavy or having insufficient compressive strength.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and in particular to a heat dissipation structure and an electric vehicle. Background Technology

[0002] Existing on-board chargers typically use liquid cooling devices that are either die-cast or sheet metal formed. Due to process limitations, die-cast cooling channels have thicker walls, resulting in heavier liquid cooling devices with higher thermal resistance and poorer heat dissipation. Sheet metal cooling channels have thinner walls, but lower pressure resistance and are prone to deformation. Summary of the Invention

[0003] The main objective of this invention is to provide a heat dissipation structure and an electric vehicle, aiming to solve the technical problems of existing liquid cooling devices being too heavy or having insufficient compressive strength.

[0004] To achieve the above objectives, the present invention proposes a heat dissipation structure located within the on-board charger, comprising at least one heat dissipation module, the heat dissipation module comprising:

[0005] A housing having a heat dissipation cavity, wherein at least one side wall of the housing has a plurality of spaced-apart flow channels arranged around the heat dissipation cavity, and the inner wall and / or outer wall of the heat dissipation cavity is used to connect a heating element, and each flow channel has an inlet and an outlet at both ends; and

[0006] Liquid inlet mechanism, wherein the liquid inlet mechanism is connected to the liquid inlets of the plurality of flow channels; and

[0007] A liquid outlet mechanism, wherein the liquid outlet mechanism is connected to the liquid outlet of a plurality of the flow channels.

[0008] Optionally, the housing includes:

[0009] A liquid cooling component, wherein the liquid cooling component has multiple spaced-apart flow channels, and a groove is recessed on one surface of the liquid cooling component to form a receiving groove, and the liquid inlet and the liquid outlet are arranged around the opening of the receiving groove; and

[0010] Two partitions are provided, which connect the two sides of the liquid cooling component and enclose the container to form the heat dissipation cavity with an opening on one side. Each partition is provided with a mounting part for connecting external components.

[0011] Optionally, the two mounting portions extend to opposite sides of the opening, the opening being used to mount the first circuit board, the mounting portions being detachably connected to the first circuit board, and the first circuit board covering the opening.

[0012] Optionally, the side of the heat dissipation cavity opposite to the opening is used to mount at least one of the heating elements;

[0013] Alternatively, the surface of the heat dissipation cavity facing away from the opening is used to mount a second circuit board, and the liquid cooling component has a conductive portion on at least one side adjacent to the partition, the conductive portion having multiple through holes to allow the pins of some of the heat-generating elements housed in the heat dissipation cavity to pass through.

[0014] Optionally, the receiving groove is a U-shaped groove;

[0015] Alternatively, the liquid cooling component may have extensions at both ends, with the two extensions extending away from the opening respectively. The liquid inlet and the liquid outlet pass through the extensions, and the outer peripheral wall of the extension is used to mount the heating element.

[0016] Optionally, the partition is an aluminum substrate;

[0017] And / or, the liquid cooling component is a heat spreader;

[0018] And / or, the liquid cooling component is an extruded structure;

[0019] And / or, at least one of the partitions is welded to the liquid cooling component;

[0020] And / or, at least one of the partitions is detachably connected to the liquid cooling component.

[0021] Optionally, the housing further includes at least one baffle, which is disposed within the heat dissipation cavity to divide the heat dissipation cavity into at least a first cavity and a second cavity, the first cavity and the second cavity being used to accommodate the heating element, respectively.

[0022] Optionally, the heat dissipation structure includes multiple heat dissipation modules, and the liquid inlet and liquid outlet mechanisms of the multiple heat dissipation modules are connected in series to form a liquid cooling circuit.

[0023] The present invention also proposes an electric vehicle, the electric vehicle comprising:

[0024] The vehicle body, wherein an energy storage structure is provided; and

[0025] As described above, the heat dissipation structure is located inside the vehicle body and is electrically connected to the energy storage structure.

[0026] This invention addresses the problems of excessive weight or insufficient compressive strength in existing liquid cooling devices by employing a shell with flow channels to form a heat dissipation cavity, where heating elements can be installed both inside and outside the cavity. The heat dissipation structure includes a shell, a liquid inlet mechanism, and a liquid outlet mechanism. The shell has a heat dissipation cavity where heating elements can be installed both inside and outside, improving the utilization of the heat dissipation space. Multiple flow channels are provided inside the shell. The liquid inlet mechanism connects to the inlets of these channels, and the liquid outlet mechanism connects to the outlets of these channels. Lower-temperature coolant is introduced through the liquid inlet mechanism and flows through the multiple flow channels to dissipate heat. Higher-temperature coolant, after dissipation, is discharged through the outlet and the liquid outlet mechanism. The shell is reinforced with the flow channel walls between adjacent flow channels to enhance its support strength. Simultaneously, the flow channel configuration reduces the weight of the shell and increases the effective contact area for heat dissipation, improving heat dissipation efficiency and solving the problems of excessive weight or insufficient compressive strength in existing liquid cooling devices. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0028] Figure 1 This is an exploded structural diagram of an embodiment of the heat dissipation structure of the present invention;

[0029] Figure 2 A schematic diagram of the housing structure of an embodiment of the heat dissipation structure of the invention is shown.

[0030] Figure 3 This is a schematic diagram of a liquid cooling component structure according to an embodiment of the heat dissipation structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the housing structure of another embodiment of the heat dissipation structure of the present invention;

[0032] Figure 5 This is a schematic diagram of the housing structure of another embodiment of the heat dissipation structure of the present invention;

[0033] Figure 6 This is a schematic diagram of the liquid flow direction structure inside the housing according to another embodiment of the heat dissipation structure of the present invention;

[0034] Figure 7 This is a schematic diagram of the liquid cooling component structure of another embodiment of the heat dissipation structure of the present invention;

[0035] Figure 8 The heat dissipation structure of this invention is combined with Figure 7 A schematic diagram of the shell structure;

[0036] Figure 9 The heat dissipation structure of this invention is combined with Figure 7 An exploded view of the heat dissipation structure assembly of another embodiment;

[0037] Figure 10 The heat dissipation structure of this invention is combined with Figure 7 A schematic diagram of the heat dissipation structure assembly;

[0038] Figure 11 The heat dissipation structure of this invention is combined with Figure 7 An exploded view of the assembly structure of the housing and heating element in one embodiment;

[0039] Figure 12 The heat dissipation structure of this invention is combined with Figure 7 A schematic diagram of the assembly structure of one embodiment;

[0040] Figure 13 This is a schematic diagram of a liquid cooling component structure in another embodiment of the heat dissipation structure of the present invention;

[0041] Figure 14 The heat dissipation structure of this invention is combined with Figure 13 A schematic diagram of the shell structure;

[0042] Figure 15 This is a schematic diagram of a liquid cooling component structure according to another embodiment of the heat dissipation structure of the present invention;

[0043] Figure 16 The heat dissipation structure of this invention is combined with Figure 15 A schematic diagram of the shell structure;

[0044] Figure 17 The heat dissipation structure of this invention is combined with Figure 15 A schematic diagram of the heat dissipation structure assembly;

[0045] Figure 18 To integrate the heat dissipation structure of this invention Figure 17 A schematic diagram showing the disassembled structure of the housing and heating element assembly;

[0046] Figure 19 This is a schematic diagram of a liquid cooling component structure in yet another embodiment of the heat dissipation structure of the present invention;

[0047] Figure 20 The heat dissipation structure of this invention is combined with Figure 19 A schematic diagram of the heat dissipation structure assembly;

[0048] Figure 21 The heat dissipation structure of this invention is combined with Figure 19 A schematic diagram of the heat dissipation structure and the assembly structure of the heat-generating element;

[0049] Figure 22 The heat dissipation structure of this invention is combined with Figure 19 Another heat dissipation structure and heat-generating element assembly structure diagram.

[0050] Explanation of icon numbers:

[0051] label name label name label name 100 Heat dissipation structure 30 Liquid cooling components 50 partition 10 case 30A flow channel 51 Installation Department 10A Heat dissipation cavity 301A Inlet 51A Mounting holes 10B Opening 302A Liquid outlet 90 Liquid cooling circuit pipe structure 80 baffle 30B sump 91 Inlet tube 70 Heating element 31 main body 911 First liquid inlet passage 71 circuit board 32 Conductor 912 Second liquid inlet passage 72 magnetic core components 32A perforation 92 drain pipe 73 Surface Mount MOSFET 33 extension 921 First liquid outlet passage 74 MOSFET plug-in 90A Liquid inlet interface 922 Second liquid outlet passage 90B Drainage interface

[0052] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0053] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0054] It should be noted that all directional indications in the embodiments of the present invention are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0055] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0056] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; taking "A and / or B" as an example, it includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0057] This invention proposes a heat dissipation structure 100.

[0058] Reference Figures 1 to 22 , Figures 1 to 4 This is a schematic diagram of a heat dissipation structure 100 using a liquid cooling component 30. Figures 7 to 10 This is a schematic diagram of a heat dissipation structure 100 using another liquid cooling component 30. Figures 13 to 14 A schematic diagram of a heat dissipation structure 100 employing another type of liquid cooling component 30 is provided. Figures 15 to 18 A schematic diagram of a heat dissipation structure 100 using another type of liquid cooling component 30;

[0059] Figure 5 and Figure 6 A schematic diagram of a heat dissipation structure 100 with multiple heat dissipation chambers 10A for the above four types of liquid cooling components 30 and the liquid flow direction. Figures 19 to 22 A schematic diagram of a heat dissipation structure 100 using another type of liquid cooling component 30.

[0060] In this embodiment of the invention, the heat dissipation structure 100 is located inside the on-board charger and includes at least one heat dissipation module. The heat dissipation module includes a housing 10, a liquid inlet mechanism, and a liquid outlet mechanism. The housing 10 has a heat dissipation cavity 10A. Figures 1 to 4 As shown, the housing 10 has multiple spaced flow channels 30A arranged around the heat dissipation cavity 10A. The inner wall and / or outer wall of the heat dissipation cavity 10A are used to connect the heating element 70. Each flow channel 30A has an inlet 301A and an outlet 302A at both ends. The inlet mechanism is connected to the inlet 301A of the multiple flow channels 30A. The outlet mechanism is connected to the outlet 302A of the multiple flow channels.

[0061] The technical solution of this invention solves the technical problems of existing liquid cooling devices being too heavy or having insufficient compressive strength by using a housing 10 with flow channels 30A to form a heat dissipation cavity 10A, where heating elements 70 can be installed both inside and outside the heat dissipation cavity 10A. The heat dissipation structure 100 includes a housing 10, a liquid inlet mechanism, and a liquid outlet mechanism. The housing 10 has a heat dissipation cavity 10A where heating elements 70 can be installed both inside and outside, thus improving the utilization rate of the heat dissipation space. Multiple flow channels 30A are provided inside the housing 10. The liquid inlet mechanism connects to the liquid inlets 301A of the multiple flow channels 30A, and the liquid outlet mechanism connects to the liquid outlets 302A of the multiple flow channels 30A, thereby connecting the multiple flow channels 30A for heat dissipation. The heat dissipation structure 100 introduces a lower temperature coolant through the liquid inlet mechanism. The lower temperature coolant flows through multiple liquid inlets 301A and multiple flow channels 30A to dissipate heat. The higher temperature coolant after heat dissipation is discharged through the liquid outlet 302A and the liquid outlet mechanism. The shell 10 is reinforced with the support strength by the flow channel wall between every two adjacent flow channels 30A. At the same time, the setting of the flow channels 30A can reduce the weight of the shell 10, increase the effective contact area for heat dissipation, and improve the heat dissipation efficiency, thus solving the technical problems of existing liquid cooling heat dissipation devices being too heavy or having insufficient compressive strength.

[0062] It is understood that the heating element 70 includes a first heating source and a second heating source. The first heating source is a PCB board, which includes a circuit board 71 and a magnetic core component 72. The magnetic core component 72 can be a transformer, a capacitor, or a power supply board, etc., which are high-heat-generating components. The core of the transformer or capacitor can be housed in the heat dissipation cavity 10A and electrically connected to the circuit board 71 through pins. The circuit board 71 can be set as one or two, namely the first circuit board 71 and the second circuit board 71. The first circuit board 71 and / or the second circuit board 71 are set on one or both sides of the heat dissipation cavity 10A, or can be set as adjacent sides or opposite sides, such as the PCB board. The second heating source can be set on the outer wall of the heat dissipation cavity 10A, including the outer side wall and / or the outer bottom wall. The second heating source can be a surface-mount MOS 73, a through-hole MOS 74, etc.

[0063] Understandably, when installation permits, the second heat source can be placed on the outer wall of the liquid inlet and / or liquid outlet mechanisms, as shown in the reference. Figure 1 As shown, this facilitates heat dissipation.

[0064] Optionally, the housing 10 includes a liquid cooling component 30 and two partitions 50. The liquid cooling component 30 is provided with a plurality of spaced flow channels 30A. A groove 30B is formed by recessing one surface of the liquid cooling component 30. An inlet 301A and an outlet 302A are arranged around the opening of the groove 30B. The two partitions 50 connect the two sides of the liquid cooling component 30 and enclose the groove 30B to form a heat dissipation cavity 10A with an opening 10B on one side. Each partition 50 is provided with a mounting part 51 to connect to an external component.

[0065] In this embodiment, the liquid cooling component 30 has multiple spaced flow channels 30A inside its plate. The two ends of each flow channel 30A penetrate the two ends of the plate to form an inlet 301A and an outlet 302A. The inlet 301A and outlet 302A are located at the ends of the two walls of the container 30B. One end of the inlet pipe is connected to the inlet 301A to input a lower-temperature coolant, and the other end is connected to the outlet 302A to discharge a higher-temperature coolant after heat absorption. The lower-temperature coolant flows inside the flow channels 30A and is discharged from the outlet 302A located opposite the inlet 301A, causing the coolant to circulate throughout the entire plate extension direction of the liquid cooling component 30, greatly increasing the heat dissipation contact area and improving heat dissipation efficiency.

[0066] In another embodiment, each partition 50 has a mounting portion 51 on at least one side, and the mounting portion 51 has a mounting hole 51A for connecting with an external component. When heating elements 70 are provided on both opposite sides of the heat dissipation cavity 10A, each partition 50 has two mounting portions 51 corresponding to the heating elements 70 on both sides, which increases the assembly space utilization and heat dissipation contact area of ​​the liquid cooling component 30 and the heating element 70, reduces the heat dissipation loss of the coolant, and improves the heat dissipation efficiency.

[0067] It is understandable that heating elements 70 located inside and / or outside the heat dissipation cavity 10A can directly contact the liquid cooling component 30; heating elements 70 located inside the heat dissipation cavity 10A that cannot directly contact the liquid cooling component 30 due to structural reasons or space constraints are addressed by potting adhesive inside the heat dissipation cavity 10A to fix the relative position of the heating elements 70 and increase thermal conductivity.

[0068] Optionally, the partition 50 is made of aluminum substrate, which has the characteristics of low cost, light weight and good thermal conductivity, thus reducing the manufacturing cost and weight of the heat dissipation structure 100.

[0069] Optionally, the heat dissipation structure 100 includes multiple heat dissipation modules, and the liquid inlet mechanism and liquid outlet mechanism of the multiple heat dissipation modules are connected in series to form a liquid cooling circuit.

[0070] In this embodiment, the liquid inlet mechanism and liquid outlet mechanism of the present invention are the liquid cooling circuit pipe structure 90 of the heat dissipation structure 100. The liquid inlet mechanism is set as the liquid inlet pipe 91 and the liquid outlet mechanism is set as the liquid outlet pipe 92. The liquid inlet pipe 91 is located on the side of the housing 10 adjacent to the liquid inlet 301A and has a liquid inlet channel that connects to the liquid inlet 301A. The liquid outlet pipe 92 is located on the side of the housing 10 adjacent to the liquid outlet 302A and has a liquid outlet channel that connects to the liquid outlet 302A. The inlet pipe 91 has an inlet port at the end furthest from the liquid cooler 30. Inside the inlet pipe 91 are a first passage and a first through hole. The first through hole corresponds to the inlet port 301A of the flow path. The two ends of the first passage are connected to the inlet port and the first through hole, respectively, to form an inlet channel. The inlet channel connects to multiple inlets 301A through the first through hole. The outlet pipe 92 has an outlet port 302A at the end furthest from the liquid cooler 30. Inside the outlet pipe 92 are a second passage and a second through hole. The second through hole corresponds to the outlet port 302A of the flow path. The two ends of the second passage are connected to the outlet port 302A and the second through hole, respectively, to form a outlet channel. The outlet channel connects to multiple outlet ports 302A through the second through hole. The arrangement of the inlet pipe 91 and the outlet pipe 92 ensures smooth inflow and outflow of coolant, improving the smoothness of coolant flow.

[0071] When the heat dissipation structure 100 includes a heat dissipation module, the liquid inlet mechanism and the liquid outlet mechanism can be a liquid inlet pipe 91 and a liquid outlet pipe 92, which are separately and independently disposed on both sides of the housing 10, such as Figure 1-2 , Figure 9 and Figure 17As shown, the inlet pipe 91 is connected to the inlet port 301A, and the outlet pipe 92 is connected to the outlet port 302A. The heat dissipation structure 100 delivers a lower temperature coolant into the inlet port 301A through the inlet pipe 91, and the coolant flows through the flow channel 30A until it reaches the outlet port 302A at the end of the flow channel 30A away from the inlet port 301A. The higher temperature coolant that has absorbed the heat of the heat-generating element 70 is discharged through the outlet port 302A, thereby improving the heat dissipation efficiency and the orderly flow of the coolant.

[0072] When the heat dissipation structure 100 includes multiple heat dissipation modules, the multiple housings 10 are respectively formed as multiple heat dissipation cavities 10A. In order to improve the distribution convenience of the liquid cooling circuit pipe structure 90, the liquid inlet pipe 91 of the liquid inlet mechanism can be provided with multiple first liquid passage holes, and the liquid outlet pipe 92 of the liquid outlet mechanism can be provided with multiple second liquid passage holes. At least one first liquid passage hole and / or at least one second liquid passage hole are provided corresponding to one housing 10. Refer to... Figure 11 As shown, the liquid inlet 301A or liquid outlet 302A of a housing 10 is respectively provided with two first liquid passage holes or two second liquid passage holes. The pipe wall portion between the two first liquid passage holes or two second liquid passage holes enhances the structural strength of the liquid inlet pipe 91 or liquid outlet pipe 92, strengthens the orderly and smooth flow of coolant, and improves the heat exchange efficiency of coolant.

[0073] Furthermore, the first liquid passage can be set as one or a small number of strip holes that can simultaneously connect multiple liquid inlets 301A to ensure the structural strength of the liquid inlet pipe 91 and improve the pressure resistance of the liquid inlet pipe 91; or the first liquid passage can be set as multiple through holes that correspond one-to-one with the number of liquid inlets 301A to clearly plan and divert the flow process of the coolant. This can be understood as multiple through holes connected in series to form the liquid inlet channel of the liquid inlet pipe 91, so that the coolant flows in an orderly manner and dissipates heat accurately.

[0074] Understandably, the second liquid passage can be set in the same way.

[0075] It is understandable that the inlet 301A and outlet 302A of the flow channel 30A are two ports that connect the internal space of the flow channel 30A. That is to say, for one of the ports, the coolant flows into the port that is the inlet 301A, and the coolant flows out of the port that is the outlet 302A. The naming is not the only limitation on the port position and the direction of liquid flow, but is based on the actual application.

[0076] It should be noted that when the external liquid inlet 90A and liquid outlet 90B can be set on both sides, the aforementioned housing 10 forms a heat dissipation cavity 10A. The liquid inlet pipe 91 and the liquid outlet pipe 92 are independent pipes, and are located on both sides of the liquid cooling component 30 with the flow channel 30A, adjacent to its liquid inlet 301A and liquid outlet 302A, respectively. The coolant at a lower temperature enters the flow channel 30A from the side of the liquid inlet pipe 91 and flows out of the heat dissipation structure 100 from the side of the liquid outlet pipe 92.

[0077] When the external liquid inlet and outlet ports 90B are not suitable for dual-sided installation, the liquid inlet pipe 91 and the liquid outlet pipe 92 can be configured as a same-side connection structure, as shown in the reference. Figure 5 and Figure 6 As shown, the inlet pipe 91 and the outlet pipe 92 are at least partially arranged on one side and on the same side to meet the requirements of single-sided inlet and outlet.

[0078] Furthermore, the liquid inlet channel of the liquid inlet pipe 91 can be independently set and not connected to the liquid outlet channel of the liquid outlet pipe 92, or they can be staggered according to the number of heat dissipation chambers 10A. Taking three heat dissipation chambers 10A as an example, the liquid cooling circuits corresponding to the three heat dissipation chambers are connected in series. Specifically, the coolant at a lower temperature enters from the liquid inlet port 90A and passes through the first liquid inlet passage 911, the flow channel 30A of the first chamber, the first liquid outlet passage 921, the flow channel 30A of the second chamber, the second liquid inlet passage 912, the flow channel 30A of the third chamber, and the second liquid outlet passage 922 in sequence before being discharged through the liquid outlet port 90B.

[0079] The first liquid inlet passage 911 is connected to the liquid inlet port 90A. The first liquid inlet passage 911 and the second liquid inlet passage 912 are located on the liquid inlet pipe 91 and are isolated from each other. The first liquid outlet passage 921 and the second liquid outlet passage 922 are located on the liquid outlet pipe 92 and are isolated from each other. The second liquid outlet passage 922 is connected to the liquid outlet port 90B.

[0080] Optionally, the liquid cooling component 30 is a vapor chamber, which is configured as a harmonica tube type. The vapor chamber itself has multiple flow channels 30A, which run through the extended area of ​​the vapor chamber, thereby improving the uniformity of heat dissipation, avoiding local overheating during the heat dissipation process, and improving the effective heat dissipation efficiency. This heat dissipation structure 100 has high heat dissipation reliability.

[0081] Optionally, the liquid cooling component 30 is an extruded structure. The multiple flow channels 30A in the extruded harmonica-tube-shaped vapor chamber increase the convection exchange area and improve the heat dissipation effect. Among them, the baffles between each flow channel 30A of each adjacent chain support the upper and lower surfaces of the plate, thereby enhancing the compressive strength of the vapor chamber and preventing the flow channels 30A from deforming under high pressure, resulting in high stability and high reliability.

[0082] Optionally, at least one partition 50 is welded to the liquid cooling component 30; and / or, at least one partition 50 is detachably connected to the liquid cooling component 30.

[0083] In this embodiment, the arrangement of the partition 50 and the liquid cooling component 30 includes the following situations:

[0084] First, the two partitions 50 and the liquid cooling component 30 can be directly welded together to form a heat dissipation cavity 10A structure with an opening 10B on one side, reducing the installation steps and accommodating the heat-generating element 70 through the opening 10B.

[0085] Secondly, both partitions 50 and liquid cooling components 30 can be detachably connected to facilitate adjustments to the spatial layout within the heat dissipation cavity 10A, thereby improving space utilization. In specific usage scenarios where frequent disassembly is not required, the two partitions 50 and liquid cooling components 30 can be pre-installed. Even if disassembly is required, there is no need to disassemble the heat dissipation structure 100 into individual parts, thus improving assembly, maintenance, or replacement efficiency.

[0086] Third, one partition 50 is welded to the liquid cooling component 30, and the other partition 50 is detachably connected to the liquid cooling component 30. When multiple baffles 80 are also provided in the heat dissipation cavity 10A, the baffles 80 and the liquid cooling component 30 are detachably connected to facilitate adjustment of the installation space, improve space utilization, and also improve the disassembly speed, making it easier to remove the potting compound and reuse the heat dissipation structure 100.

[0087] Optionally, the two mounting portions 51 extend to the sides opposite to the opening 10B, and the opening 10B is used to mount the first circuit board 71. The mounting portions 51 are detachably connected to the first circuit board 71, and the first circuit board 71 covers the opening 10B.

[0088] In this embodiment, the first circuit board 71 is located on the opening 10B side of the heat dissipation cavity 10A, and is assembled and disassembled through the mounting parts 51 on the two side baffles 80. The mounting parts 51 extend away from the opening 10B, which facilitates installation and does not obstruct the placement space of the components on the first circuit board 71, reducing the risk of bumping or damaging the components on the first circuit board 71. This allows the first circuit board 71 to accommodate the high-heat-generating element 70 in the heat dissipation cavity 10A for rapid heat dissipation, avoiding damage to the first circuit board 71 or other electronic components on it.

[0089] Optionally, the trough 30B is a U-shaped trough.

[0090] In this embodiment, the liquid cooling component 30 is set as a heat spreader plate, which is bent to form a U-shaped groove. Two partition plates 50 are respectively set on both sides of the U-shaped groove to form a heat dissipation cavity 10A with the heat spreader plate. The structure is simple, stable and reliable, and has low manufacturing cost.

[0091] Optionally, the liquid cooling component 30 has extensions 33 at both ends, with the two extensions 33 extending away from the opening 10B respectively. The liquid inlet 301A and the liquid outlet 302A pass through the extensions 33, and the outer peripheral wall of the extensions 33 is used to install the heating element 70.

[0092] In another embodiment, the liquid cooling component 30 is provided with extensions 33 on both sides of the flow channel 30A. Both extensions 33 are positioned away from the opening 10B of the heat dissipation cavity 10A, making the liquid cooling component 30 π-shaped. The liquid inlet 301A and liquid outlet 302A of the flow channel 30A pass through the extensions 33 and face the surface of the liquid cooling circuit pipe structure 90. The extensions 33 do not contact the outer surface of the liquid cooling circuit pipe structure 90 and can also be provided with plug-in MOS 74 to increase heat dissipation elements, improve the utilization rate of the low temperature difference of the coolant for heat dissipation, and reduce energy loss.

[0093] Combined with reference Figure 10 , Figure 12 as well as Figure 17 As shown, optionally, the side of the heat dissipation cavity 10A opposite to the outlet 10B is used to mount at least one heating element 70.

[0094] In this embodiment, the side of the heat dissipation cavity 10A away from the outlet 10B is used to mount at least one surface-mount MOS 73, saving installation space. This allows the heat dissipation structure 100 to dissipate heat from the first heat source inside the heat dissipation cavity 10A and also to dissipate heat from the second heat source located outside the heat dissipation cavity 10A.

[0095] Combined with reference Figures 7 to 10 , Figures 15 to 18 As shown, optionally, the side surface of the heat dissipation cavity 10A facing away from the opening 10B is used to mount the second circuit board 71. The liquid cooling component 30 is provided with a conductive portion 32 on at least one side adjacent to the partition 50. The conductive portion 32 has a plurality of through holes 32A so that the pins of some of the heat-generating elements 70 housed in the heat dissipation cavity 10A can pass through.

[0096] In this embodiment, circuit boards 71 ​​are provided both inside the heat dissipation cavity 10A and on the side of the heat dissipation cavity 10A facing away from the opening 10B. The heating element 70 on the side of the heat dissipation cavity 10A facing away from the opening 10B is designated as the second circuit board 71. A mounting part 51 is also provided on the side of the partition 50 corresponding to the second circuit board 71. The mounting part 51 is used for detachable assembly with the second circuit board 71. The extension 33 of the liquid cooling component 30 has multiple through holes 32A. The heat dissipation cavity 10A contains at least two sets of first heat sources. Taking two sets as an example, the pins of one set of first heat sources extend towards the first circuit board 71 for electrical soldering. The other set of first heat sources is stationary and spaced apart from the first set of first heat sources by potting glue. The pins of the other set of first heat sources pass through the multiple through holes 32A on the extension 33 and are electrically soldered to the second power component located on the back side of the opening 10B, thereby improving heat dissipation efficiency and installation space utilization.

[0097] Combined with reference Figures 19 to 22 As shown, optionally, the housing 10 further includes at least one baffle 80, which is disposed in the heat dissipation cavity 10A to divide the heat dissipation cavity 10A into at least a first cavity and a second cavity, the first cavity and the second cavity being used to accommodate the heating element 70, respectively.

[0098] In this embodiment, both the baffle 80 and the partition 50 can be made of aluminum substrate. The baffle 80 divides the heat dissipation cavity 10A into multiple small chambers, such as the first chamber, the second chamber, the third chamber, etc. The small chambers are used to install multiple centrally arranged heat-generating elements 70 to improve heat dissipation efficiency.

[0099] Furthermore, when facing the heat dissipation needs of more centrally located heat-generating elements 70, multiple heat spreaders can be connected, and multiple baffles 80 and partitions 50 can divide the larger heat dissipation cavity 10A into multiple smaller heat dissipation cavities 10A for distributing heat-generating elements 70. At the same time, the baffles 80 and / or partitions 50 can also shield the mutual interference between heat-generating elements 70.

[0100] This invention also proposes an electric vehicle, which includes a vehicle body and a heat dissipation structure as described above. The specific structure of this heat dissipation structure is as described in the above embodiments. Since this electric vehicle adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here. Specifically, an on-board charger is installed inside the vehicle body, and the on-board charger is equipped with the aforementioned heat dissipation structure. An energy storage structure is also installed inside the vehicle body, and the on-board charger is electrically connected to the energy storage structure. The heat dissipation structure improves the heat dissipation efficiency of the on-board charger and enhances the charging safety of the electric vehicle.

[0101] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural transformations made using the contents of the specification and drawings of the present invention under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of patent protection of the present invention.

Claims

1. A heat dissipation structure applied to an on-board charger, characterized in that, The heat dissipation structure is located inside the on-board charger and includes at least one heat dissipation module, the heat dissipation module comprising: The housing has a heat dissipation cavity. At least one side wall of the housing has a plurality of spaced flow channels arranged inside. The plurality of flow channels surround the heat dissipation cavity. The inner wall and / or the outer wall of the heat dissipation cavity are used to connect a heating element. Each flow channel has an inlet and an outlet at both ends. Liquid inlet mechanism, wherein the liquid inlet mechanism is connected to the liquid inlets of the plurality of flow channels; and A liquid outlet mechanism, wherein the liquid outlet mechanism is connected to the liquid outlets of the plurality of flow channels; The housing includes: A liquid cooling component includes a first side plate, a bottom plate, and a second side plate connected in sequence. The liquid cooling component has multiple spaced flow channels that pass through the first side plate, the bottom plate, and the second side plate. The first side plate, the bottom plate, and the second side plate form a container. The liquid inlet and the liquid outlet are arranged around the opening of the container.

2. The heat dissipation structure as described in claim 1, characterized in that, The housing also includes two partitions, which connect the two sides of the liquid cooling component and enclose the trough to form the heat dissipation cavity with an opening on one side. Each partition is provided with a mounting part for connecting external components.

3. The heat dissipation structure as described in claim 2, characterized in that, The two mounting portions extend to opposite sides of the opening, the opening being used to mount the first circuit board, the mounting portions being detachably connected to the first circuit board, and the first circuit board covering the opening.

4. The heat dissipation structure as described in claim 3, characterized in that, The side of the heat dissipation cavity opposite to the opening is used to install at least one of the heating elements; Alternatively, the surface of the heat dissipation cavity facing away from the opening is used to mount a second circuit board, and the liquid cooling component has a conductive portion on at least one side adjacent to the partition, the conductive portion having multiple through holes to allow the pins of a portion of the heat-generating element housed in the heat dissipation cavity to pass through.

5. The heat dissipation structure as described in claim 2, characterized in that, The receiving groove is a U-shaped groove; Alternatively, the liquid cooling component may have extensions at both ends, with the two extensions extending away from the opening respectively. The liquid inlet and the liquid outlet pass through the extensions, and the outer peripheral wall of the extension is used to mount the heating element.

6. The heat dissipation structure as described in claim 2, characterized in that, The partition is made of an aluminum substrate; And / or, the liquid cooling component is a heat spreader; And / or, the liquid cooling component is an extruded structure; And / or, at least one of the partitions is welded to the liquid cooling component; And / or, at least one of the partitions is detachably connected to the liquid cooling component.

7. The heat dissipation structure as described in claim 1, characterized in that, The housing further includes at least one baffle, which is disposed in the heat dissipation cavity to divide the heat dissipation cavity into at least a first cavity and a second cavity, the first cavity and the second cavity being used to accommodate the heating element, respectively.

8. The heat dissipation structure as described in claim 1, characterized in that, The heat dissipation structure includes multiple heat dissipation modules, and the liquid inlet and liquid outlet mechanisms of the multiple heat dissipation modules are connected in series to form a liquid cooling circuit.

9. An electric vehicle, characterized in that, The electric vehicle includes: The vehicle body, wherein an energy storage structure is provided; and The heat dissipation structure as described in any one of claims 1 to 8 is disposed within the vehicle body and electrically connected to the energy storage structure.

Images