Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus can include an upper chamber, a lower chamber coupled to and separated from the upper chamber, and at least one driving part moving the lower chamber upward and downward. The at least one driving part can include a support element supporting the lower chamber, a first driving element moving the lower chamber and the support element upward and downward, a second driving element moving the lower chamber, the support element, and the first driving element upward and downward and disposed adjacent to the first driving element, and a connection element connecting the first driving element and the second driving element. A processing space can be provided between the upper chamber and the lower chamber when the upper chamber is coupled to the lower chamber.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2021-0060817, filed on May 11, 2021, with the Korean Intellectual Property Office. TECHNICAL FIELD

[0002] Exemplary embodiments of the present application relate to a substrate processing apparatus and a substrate processing method. More particularly, exemplary embodiments of the present application relate to a substrate processing apparatus including a process chamber which provides a process space capable of performing a desired process with a substrate as an object when combined, and a substrate processing method using the same. BACKGROUND

[0003] When manufacturing an integrated circuit device including a semiconductor device or a display device including a flat panel display device, a designated process such as a cleaning process can be performed on a substrate in a closed process space having a relatively high pressure in general. Such a closed process space can be provided in a process chamber having a structure in which a lower chamber moves upward to an upper chamber so that the lower chamber is combined with the upper chamber.

[0004] In a conventional substrate processing apparatus, the lower chamber can be moved upward and downward mainly by two driving members arranged in series at a lower portion of the lower chamber. However, since the two driving members are arranged in series at the lower portion of the lower chamber, an increased stroke space of a driving shaft of the driving members can be required in order to move the lower chamber upward and downward. Therefore, the substrate processing apparatus can require a relatively large size and a relatively complex configuration. Also, the conventional substrate processing apparatus can have a structure in which the driving members are arranged at one side lower portion of the lower chamber, and thus the lower chamber can be inclined during movement of the lower chamber by the driving members. Therefore, the lower chamber can not be accurately combined with the upper chamber, and stability of the lower chamber can be greatly decreased. SUMMARY

[0005] TECHNICAL PROBLEM

[0006] According to an aspect of the present application, there is provided a substrate processing apparatus capable of improving stability of a lower chamber during movement of the lower chamber upward and downward by at least one driving member.

[0007] According to another aspect of the present application, there is provided a substrate processing apparatus capable of improving stability of a lower chamber during movement of the lower chamber upward and downward by two driving members arranged symmetrically.

[0008] According to another aspect of the present application, there is provided a substrate processing method using a substrate processing apparatus capable of improving stability of a lower chamber during upward and downward movement of the lower chamber using at least one driving member.

[0009] Technical Solution

[0010] According to an aspect of the present application, there is provided a substrate processing apparatus, which can include an upper chamber, a lower chamber combined with and separated from the upper chamber, and at least one driving member moving the lower chamber upward and downward. The at least one driving member can include a support element supporting the lower chamber, a first driving element moving the lower chamber and the support element upward and downward, a second driving element moving the lower chamber, the support element and the first driving element upward and downward and alignedly disposed adjacent to the first driving element, and a connecting element connecting the first driving element and the second driving element. A processing space can be provided between the upper chamber and the lower chamber when the upper chamber is combined with the lower chamber.

[0011] In an exemplary embodiment, the first driving element can include a first driving shaft and a first body, and the second driving element can include a second driving shaft and a second body. Herein, the first driving element and the second driving element can be disposed in parallel.

[0012] In an exemplary embodiment, the connecting element can include a first portion connected horizontally to a bottom surface of the first body, a second portion connected horizontally to an upper surface of the second driving shaft, and a central portion connecting the first portion and the second portion vertically.

[0013] In an exemplary embodiment, the driving member can be connected to one side of the support element. In this case, the substrate processing apparatus can further include a compensating member connected to the other side of the support element and maintaining balance of the support element and the lower chamber.

[0014] In an exemplary embodiment, the compensating member can include a guide element passing through the other side of the support element. For example, the guide element can include an LM guide.

[0015] In a partial exemplary embodiment, the compensating member can include a spring element connected to the other side of the support element and an inner upper portion of the substrate processing apparatus.

[0016] In another exemplary embodiment, the compensation member can include a bar member coupled to the first driving member and a bottom surface of the substrate processing apparatus. The bar member can be moved to the bottom surface of the substrate processing apparatus after the support member and the lower chamber are moved upwardly.

[0017] In an exemplary embodiment, the substrate processing apparatus can further include a balancing member coupled to a side of the second body of the second driving member and extending toward the coupling member. The balancing member can prevent the first driving member and / or the second driving member from tilting during the upward and downward movement of the support member and the lower chamber.

[0018] In an exemplary embodiment, the substrate processing apparatus can further include an exhaust member passing through the support member and coupled to a central portion of a bottom surface of the lower chamber.

[0019] According to another aspect of the present application, there is provided a substrate processing apparatus including an engineering chamber having an upper chamber and a lower chamber coupled to and separated from the upper chamber; and first and second driving members moving the lower chamber upwardly and downwardly. The first driving member can include a support member supporting the lower chamber, a first driving member coupled to one side of the lower chamber and the support member, a second driving member moving the support member and the first driving member upwardly and downwardly and disposed adjacent to the first driving member, and a first coupling member coupling the first driving member and the second driving member. The second driving member can include a third driving member coupled to the other side of the support member and moving the lower chamber and the support member upwardly and downwardly, a fourth driving member moving the lower chamber, the support member and the third driving member upwardly and downwardly and disposed adjacent to the third driving member, and a second coupling member coupling the third driving member and the fourth driving member.

[0020] In some exemplary embodiments, the first driving member can include a first driving shaft and a first body, the second driving member can include a second driving shaft and a second body, the third driving member can include a third driving shaft and a third body, and the fourth driving member can include a fourth driving shaft and a fourth body.

[0021] In some exemplary embodiments, the first and second driving members can be symmetrically disposed. The first and second driving members can be disposed in parallel, and the third and fourth driving members can be disposed in parallel.

[0022] In some exemplary embodiments, the substrate processing apparatus can further include a first balancing member connected to the first driving member and the second driving member and preventing the first driving member and / or the second driving member from tilting, and a second balancing member connected to the third driving member and the fourth driving member and preventing the third driving member and / or the fourth driving member from tilting.

[0023] In some exemplary embodiments, the substrate processing apparatus can further include an adjusting member connecting the first driving member and the second driving member and preventing the support member and the lower chamber from bending.

[0024] In some exemplary embodiments, the adjusting member can have a plate structure in which a thickness of a central portion is smaller than thicknesses of both side portions, and the central portion can have a through hole through which the exhaust member passes.

[0025] According to another aspect of the present application, there is provided a substrate processing method, which can include a step of arranging a substrate on a support member connected to an upper chamber, a step of coupling the lower chamber to the upper chamber by at least one driving member including a support member supporting a lower chamber, a first driving member moving the lower chamber and the support member upward and downward, a second driving member arranged adjacent to the first driving member and moving the lower chamber, the support member, and the first driving member upward and downward, and a connecting member connecting the first driving member and the second driving member, and a step of performing a designated process on the substrate in a processing space provided between the lower chamber and the upper chamber.

[0026] In some exemplary embodiments, the driving member can be connected to one side of the support member, and balance of the support member and the lower chamber can be maintained by a compensating member connected to the other side of the support member.

[0027] In some exemplary embodiments, the first driving member can include a first driving shaft and a first body, the second driving member can include a second driving shaft and a second body, and the first driving member and the second driving member can be arranged in parallel.

[0028] In some exemplary embodiments, tilting of the first driving member and / or the second driving member during movement of the support member and the lower chamber upward and downward can be prevented by a balancing member connected to a side portion of the second body of the second driving member and extending toward the connecting member.

[0029] In some exemplary embodiments, the designated process can include a cleaning process using a supercritical fluid.

[0030] Technical Effects

[0031] According to an exemplary embodiment of the present invention, the substrate processing apparatus may include a driving member having a first driving element and a second driving element arranged in parallel, wherein one or both of the first driving element and the second driving element are movable to the support element and the lower cavity. Therefore, the stroke of the first driving shaft of the first driving element and / or the second driving shaft of the second driving element can be minimized. As a result, the substrate processing apparatus may have a relatively simple structure and a reduced overall area. Furthermore, the substrate processing apparatus may include a compensation portion connected to the other side of the support element to maintain the balance of the lower cavity and the support element, preventing the support element and the lower cavity from tilting due to forces applied from the first driving element and / or the second driving element to one side of the support element. Therefore, the lower cavity and the support element will not tilt upwards or downwards due to the compensation portion, and can move stably upwards and downwards by the first driving element and / or the second driving element.

[0032] However, the technical effects of the present invention are not limited to the above-mentioned technical effects, and various expansions can be made without exceeding the scope of the ideas and fields of the present invention. Attached Figure Description

[0033] Figure 1 This is a simplified cross-sectional view of a substrate processing apparatus for illustrating an exemplary embodiment of the present invention;

[0034] Figure 2 This is a simplified cross-sectional view of a substrate processing apparatus used to illustrate some exemplary embodiments of the present invention;

[0035] Figure 3 This is a simplified cross-sectional view for illustrating another exemplary embodiment of the present invention;

[0036] Figure 4 This is a simplified cross-sectional view for illustrating another exemplary embodiment of the present invention;

[0037] Figure 5 For illustrative purposes Figure 4 Enlarged cross-sectional view of the adjustment component. Detailed Implementation

[0038] Exemplary embodiments of the present application will be described below. Various changes can be made to the embodiments, and various modes of carrying out the application can be conceived, and the embodiments are described in detail herein. However, this is not intended to limit the present application to specific disclosed modes, and it should be understood that all modifications, equivalents, and alternatives included in the idea and technical scope of the present application are included. Like reference numerals are used to designate like elements when the drawings are described. The terms first, second, and so on can be used to describe various elements, but the described elements should not be limited to the terms. The terms are used only to distinguish one element from another. The terms used in the present application are used only to describe specific embodiments, and the purpose is not to limit the present application. Singular expressions are used herein to include plural expressions unless otherwise explicitly stated. The terms "comprise", "have", or "include" and the like described in the present application should be understood to mean that the features, numbers, steps, actions, elements, components, or combinations thereof described in the specification are present, and should not be understood to preclude the presence or addition of one or more other features, numbers, steps, actions, elements, components, or combinations thereof.

[0039] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Terms defined in commonly used dictionaries are to be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art, and are not to be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0040] Exemplary embodiments of the present application will be described below with reference to the accompanying drawings. Like reference numerals are used to designate like elements in the drawings, and repeated description of like elements can be omitted.

[0041] Figure 1 A schematic cross-sectional view of a substrate processing apparatus for illustrating an exemplary embodiment of the present application.

[0042] Referring to Figure 1 The substrate processing apparatus of the exemplary embodiments can be used for manufacturing integrated circuit elements such as semiconductor elements. In particular, the substrate processing apparatus can perform a prescribed process on a substrate W in a closed processing space 17 provided by an engineering chamber having a relatively high internal pressure. For example, the substrate processing apparatus can be used for a cleaning process for removing unnecessary substances such as organic solvents and impurities from the substrate W using a supercritical fluid. In this case, the supercritical fluid can include supercritical carbon dioxide.

[0043] In the illustrative embodiment, the substrate processing apparatus can include an engineering chamber 11, wherein the engineering chamber 11 can have an upper chamber 15, a lower chamber 13, and a processing space 17 between the upper chamber 15 and the lower chamber 13. The processing space 17 can be defined by the upper chamber 15 and the lower chamber 13, and can be sealed. The designated engineering, such as the cleaning engineering, can be performed in the processing space 17. Also, the substrate processing apparatus can include at least one driving member 20 capable of moving the lower chamber 13 upward and downward with respect to the upper chamber 15.

[0044] The at least one driving member 20 can move the lower chamber 13 toward the upper chamber 15 so that the sealed processing space 17 can be formed between the upper chamber 15 and the lower chamber 13. Also, the at least one driving member 20 can move the lower chamber 13 downward so as to be away from the upper chamber 15. In this case, a maintenance engineering of the substrate processing apparatus including the upper chamber 15, the lower chamber 13, the at least one driving member 20, and the like can be performed.

[0045] In the illustrative embodiment, the substrate W can be configured to be closer to the upper chamber 15 than the lower chamber 13 in the processing space 17. In other words, the substrate W can be configured to be adjacent to the upper chamber 15. For example, the substrate W can be supported by a support member capable of extending downward from a bottom surface of the upper chamber 15. Such a support member can support a peripheral portion of the substrate W.

[0046] As Figure 1 For example, the at least one driving member 20 can move the lower chamber 13 upward so that the lower chamber 13 can be combined with the upper chamber 15. Also, the driving member 20 can move the lower chamber 13 downward so that the lower chamber 13 can be separated from the upper chamber 15. In the illustrative embodiment, the at least one driving member 20 can include a support element 19, a first driving element 21, a second driving element 27, and a connecting element 33.

[0047] The support element 19 can support the lower chamber 13. For example, the support element 19 can include a plate structure having an upper surface configured to be substantially flat for the lower chamber 13. Also, the support element 19 can have an area substantially wider than a bottom surface of the lower chamber 13. Accordingly, the support element 19 can stably support the lower chamber 13 during the designated engineering, such as the cleaning engineering, performed by the substrate processing apparatus on the substrate W.

[0048] The first driving element 21 can move the lower chamber 13 and the support element 19 upward and downward. The first driving element 21 can be connected to one side of the support element 19. In an exemplary embodiment, the first driving element 21 can include a first driving shaft 23 and a first body 25. The first driving shaft 23 can be connected to one side of the bottom surface of the support element 19, and the first body 25 can be connected to the first driving shaft 23. Although not shown, the first driving element 21 can further include a first motor capable of providing a first driving force to the first driving shaft 23. For example, the first motor can be integrally formed with the first body 25. The first driving shaft 23 can be moved upward and downward by the first driving force applied from such a first motor, and thus the lower chamber 13 and the support element 19 can also be moved upward and downward.

[0049] The second driving element 27 can move the lower chamber 13, the support element 19, and the first driving element 21 upward and downward. The second driving element 27 can be disposed adjacent to the first driving element 21. The second driving element 27 can include a second driving shaft 29 and a second body 31. Although not shown, the second driving element 27 can further include a second motor capable of providing a second driving force to the second driving shaft 29. For example, the second motor can be integrally formed with the second body 31. The second motor can apply the second driving force to the second driving shaft 29, and thus the second driving shaft 29 can be moved upward and downward.

[0050] As Figure 1 For example, the second driving shaft 29 can be disposed lower than the first driving shaft 23, and the second body 31 can be disposed lower than the first body 25. The first driving element 21 can be spaced apart from the second driving element 27 by a specified distance. In this case, the connecting element 33 can connect the first driving element 21 to the second driving element 27.

[0051] As described above, the first driving element 21 and the second driving element 27 can be disposed in parallel, and thus the first driving element 21 and the second driving element 27 can be moved along different paths, respectively. For example, the first driving element 21 can be moved along a first path indicated by one arrow downward of the support element 19, and the second driving element 27 can be moved along a second path indicated by another arrow adjacent to the first path. Thus, the first path in which the first driving element 21 is moved and the second path in which the second driving element 27 is moved do not overlap.

[0052] The connecting element 33 can include a first portion connected to the first driving element 21, a second portion connected to the second driving element 27, and a central portion connecting the first portion to the second portion. For example, the first portion can be horizontally connected to a bottom surface of the first body 25, and the second portion can be horizontally connected to an upper surface of the second driving shaft 29. The central portion can vertically connect the first portion to the second portion. In other words, the connecting element 33 can include the first and second portions which are substantially horizontally disposed with respect to the support element 19, and the central portion which is substantially vertically disposed with respect to the support element 19.

[0053] In an exemplary embodiment, the second driving element 27 can move the first driving element 21 upward and downward, and the first driving element 21 can move the support element 19 upward and downward. In this case, since the first driving element 21 and the second driving element 27 are connected to each other by the connecting element 33, the first driving element 21 and the second driving element 27 can move together. By the movement of the second driving element 27, the first driving element 21, and the support element 19, the lower chamber 13 can be combined with the upper chamber 15 during the execution of the designated process, and the lower chamber 13 can be separated from the upper chamber 15 before or after the execution of the designated process. When the lower chamber 13 is combined with the upper chamber 15, the processing space 17 for performing the designated process can be formed between the upper chamber 15 and the lower chamber 13. When the lower chamber 13 is separated from the upper chamber 15, the substrate W on which the designated process is performed can be loaded onto or unloaded from the support member connected to the upper chamber 15. Also, when the lower chamber 13 is separated from the upper chamber 15, the maintenance management process can be performed on the upper chamber 15 and / or the lower chamber 13.

[0054] In another exemplary embodiment, either one of the first driving element 21 and the second driving element 27 can be operated so that the lower chamber 13 moves upward and downward. For example, the second driving element 27 can move the first driving element 21 and the support element 19, or the first driving element 21 can move the second driving element 27 and the support element 19. Accordingly, the lower chamber 13 can be combined with or separated from the upper chamber 15 by either one of the first driving element 21 and the second driving element 27.

[0055] As described above, the substrate processing apparatus can include the driving member 20 having the first driving element 21 and the second driving element 27 configured in parallel, one or both of the first driving element 21 and the second driving element 27 can move the support element 19 and the lower chamber 13. The lower chamber 13 can be moved upward and downward by such a driving member 20, and thus the stroke of the first driving shaft 23 of the first driving element 21 and / or the second driving shaft 29 of the second driving element 27 can be minimized. Accordingly, the substrate processing apparatus can have a relatively simplified structure, and can have a reduced overall area.

[0056] Referring again to Figure 1 , the driving member 20 including the first driving element 21 and the second driving element 27 can be connected to one side of the support element 19, and thus can apply a force to move the support element 19 only to one side of the support element 19 by the first driving element 21 and / or the second driving element 27. Accordingly, the driving member 20 can not sufficiently move the lower chamber 13 upward and downward during the movement of the lower chamber 13 and the support element 19 by the driving member 20, and one side or the other side of the support element 19 can be tilted downward. In particular, the support element 19 can have a relatively larger area than the lower chamber 13, the first driving element 21 and the second driving element 27 can be connected to one side of the support element 19, and thus can apply a force to move the support element 19 and the lower chamber 13 only to one side of the support element 19 (i.e., one side of the lower chamber 13) from the first driving element 21 and the second driving element 27. Accordingly, one side of the lower chamber 13 (i.e., one side of the support element 19) can be tilted downward when the driving member 20 moves the lower chamber 13 downward. Also, the other side of the lower chamber 13 (i.e., the other side of the support element 19) can be tilted downward when the driving member 20 moves the lower chamber 13 upward.

[0057] In consideration of the above-described problems, the substrate processing apparatus can further include a compensation member 36. The compensation member 36 can prevent the support element 19 and the lower chamber 13 from being tilted due to a force to move the support element 19 applied to one side of the support element 19 from the first driving element 21 and / or the second driving element 27. In other words, the compensation member 36 can maintain the balance of the support element 19 and the lower chamber 13 to prevent the support element 19 and the lower chamber 13 from being tilted upward or downward during the movement of the support element 19 upward and downward by the first driving element 21 and / or the second driving element 27. As Figure 1For example, the compensation member 36 can include a guide element 35 and a bearing 37. The guide element 35 can be connected to the other side of the support element 19. For example, the guide element 35 can include a linear motion guide capable of passing through the other side of the support element 19. In this case, the bearing 37 can connect the guide element 35 and the other side of the support element 19 so that the support element 19 can have a proper degree of freedom.

[0058] According to an exemplary embodiment, the substrate processing apparatus can include the compensation member 36 connected to the other side of the support element 19 in order to maintain the balance of the lower chamber 13 and the support element 19 to prevent the support element 19 and the lower chamber 13 from tilting due to a force applied to one side of the support element 19 by the first driving element 21 and / or the second driving element 27 moving the support element 19. Thus, the lower chamber 13 and the support element 19 can not tilt upward or downward due to the compensation member 36 and can be stably moved upward and downward by the first driving element 21 and / or the second driving element 27.

[0059] In an exemplary embodiment, the first driving element 21 and the second driving element 27 can be arranged side by side at one side of the support element 19, and thus the first driving element 21 can tilt toward the second driving element 27 or the second driving element 27 can tilt toward the first driving element 21 during movement of the lower chamber 13 by the driving member 20. In order to prevent such tilting of the first driving element 21 and / or the second driving element 27, the substrate processing apparatus can further include a balancing member 39 arranged between the first driving element 21 and the second driving element 27. The balancing member 39 can be connected to the side of the second body 31 of the second driving element 27 and can extend toward the connection element 33. Thus, the balancing member 39 can move upward and downward together with the second driving element 27 to prevent the first driving element 21 and / or the second driving element 27 from tilting during movement of the support element 19 upward and downward. For example, the balancing member 39 can have an antenna structure that extends toward the connection element 33 by an amount corresponding to the movement distance of the second driving shaft 29 when the second driving element 27 moves upward and can contract by an amount corresponding to the movement distance of the second driving shaft 29 when the second driving element 27 moves downward.

[0060] In some embodiments, the connecting member 33 can include a through-hole (not shown) through which one side of the balancing member 39 can pass. Thus, the balancing member 39 can be more easily moved upward and downward together with the second driving member 27.

[0061] Referring again to Figure 1 , the substrate processing apparatus can further include an exhaust member 41 for easily exhausting used supercritical fluid from the processing space 17 of the processing chamber 11 after performing the designated process, such as the cleaning process, on the substrate W using the supercritical fluid. The exhaust member 41 can pass through the support member 19 and can be connected to a central portion of the bottom of the lower chamber 13. For example, the exhaust member 41 can include a flexible hose or bellows hose so that the flow of the supercritical fluid is substantially not affected by the movement of the lower chamber 13 and the support member 19.

[0062] Figure 2 A schematic cross-sectional view of a substrate processing apparatus for illustrating some embodiments of the present application. Figure 2 The illustrated substrate processing apparatus can have substantially the same or similar configuration as the substrate processing apparatus described with reference to Figure 1 , except for the compensating member.

[0063] Referring again to Figure 2 , the substrate processing apparatus can include a compensating member 36 disposed between the other side of the support member 19 and the inner upper portion of the substrate processing apparatus above the processing chamber 11. In this case, the compensating member 36 can include a spring member 43 connecting the other side of the support member 19 to the inner upper portion of the substrate processing apparatus in which the processing chamber 11 is disposed.

[0064] In some embodiments, the spring member 43 can prevent the lower chamber 13 and the support member 19 from tilting upward or downward due to a force applied to one side of the support member 19 by the movement of the support member 19 from the movement of the first driving member 21 and / or the second driving member 27 connected to one side of the support member 19. That is, the spring member 43 can maintain the balance of the lower chamber 13 and the support member 19 during the upward and downward movement of the lower chamber 13 and the support member 19 by the first driving member 21 and / or the second driving member 27. Thus, the support member 19 and the lower chamber 13 can be stably moved upward and downward by the spring member 43 and the support member 19 and the lower chamber 13 can not be tilted.

[0065] Figure 3A schematic cross-sectional view of a substrate processing apparatus for illustrating another exemplary embodiment of the present application. Figure 3 The illustrated substrate processing apparatus can have substantially the same or similar configuration as the substrate processing apparatus described with reference to Figure 1 The illustrated substrate processing apparatus can have substantially the same or similar configuration as the substrate processing apparatus described with reference to

[0066] The illustrated substrate processing apparatus can have substantially the same or similar configuration as the substrate processing apparatus described with reference to Figure 3 The illustrated substrate processing apparatus can include a compensation member 36 disposed between the first drive member 21 and a bottom surface of the substrate processing apparatus. The compensation member 36 can include a rod member 45 extending from the bottom surface of the substrate processing apparatus to a connecting member 33 connected to the first body 25 of the first drive member 21. For example, the rod member 45 can move to the bottom surface of the substrate processing apparatus after the first drive member 21 and / or the second drive member 27 move the support member 19 and the lower cavity 13 upward.

[0067] In another exemplary embodiment, the rod member 45 can prevent the lower cavity 13 and the support member 19 from tilting upward or downward due to a force applied to one side of the support member 19 by the first drive member 21 and / or the second drive member 27 connected to the one side of the support member 19. Thus, the support member 19 and the lower cavity 13 can be stably moved upward and downward by the rod member 45, and the support member 19 and the lower cavity 13 can not be tilted.

[0068] Figure 4 A schematic cross-sectional view of a substrate processing apparatus for illustrating another exemplary embodiment of the present application. Figure 4 The illustrated substrate processing apparatus can have substantially the same or similar configuration as the substrate processing apparatus described with reference to Figure 1 The illustrated substrate processing apparatus can have substantially the same or similar configuration as the substrate processing apparatus described with reference to

[0069] The illustrated substrate processing apparatus can have substantially the same or similar configuration as the substrate processing apparatus described with reference to Figure 4 The illustrated substrate processing apparatus can include a first drive member 50, a second drive member 70, a first balancing member 65, and a second balancing member 85. However, in Figure 4 The compensation member can be omitted in the illustrated substrate processing apparatus.

[0070] Similarly, the substrate processing apparatus can have the engineering chamber 11 including the upper chamber 15 and the lower chamber 13. The lower chamber 13 can be moved upward and downward by the first driving part 50 and the second driving part 70, so the lower chamber 13 can be combined with the upper chamber 15, can be separated from the upper chamber 15. The processing space 17 can be formed between the lower chamber 13 and the upper chamber 15 when the upper chamber 15 is combined with the lower chamber 13.

[0071] In another exemplary embodiment, the first driving part 50 can be connected to one side of the support member 19, and the second driving part 70 can be connected to the other side of the support member 19. Accordingly, the support member 19 and the lower chamber 13 can be kept balanced by the first driving part 50 and the second driving part 70 without the compensating part.

[0072] The first driving part 50 can include a first driving member 51 connected to the lower side of one side of the support member 19, a second driving member 57 disposed to the lower side adjacent to the first driving member 51, and a first connecting member 63 connecting the first driving member 51 and the second driving member 57. The first driving member 51 can include a first driving shaft 53 and a first body 55. The second driving member 57 can include a second driving shaft 59 and a second body 61. The first connecting member 63 can have a first portion connected to the first driving member 51, a second portion connected to the second driving member 57, and a central portion connecting the first portion and the second portion. The first balancing part 65 can be located between the first driving member 51 and the second driving member 57.

[0073] The second driving part 70 can include a third driving member 71 connected to the lower side of the other side of the support member 19, a fourth driving member 77 disposed to the lower side adjacent to the third driving member 71, and a second connecting member 83 connecting the third driving member 71 and the fourth driving member 77. The third driving member 71 can include a third driving shaft 73 and a third body 75, and the fourth driving member 77 can include a fourth driving shaft 79 and a fourth body 81. The second connecting member 83 can have a first portion connected to the third driving member 71, a second portion connected to the fourth driving member 77, and a central portion connecting the first portion and the second portion. The second balancing part 85 can be located between the third driving member 71 and the fourth driving member 77.

[0074] According to another exemplary embodiment, the substrate processing apparatus may have the first driving member 50 and the second driving member 70 arranged substantially symmetrically on one side and the other side of the support element 19, respectively. Therefore, the support element 19 and the lower cavity 13 can be kept balanced by the symmetrically arranged first driving member 50 and second driving member 70 without any counteracting components. That is, during the upward and downward movement of the support element 19 and the lower cavity 13 by the first driving member 50 and the second driving member 70, the support element 19 and the lower cavity 13 will not tilt due to the first driving member 50 and the second driving member 70.

[0075] In another exemplary embodiment, the first driving member 50 and the second driving member 70 are symmetrically connected to one side and the other side of the support element 19, respectively. Therefore, the central portion of the support element 19 (i.e., the central portion of the lower cavity 13) may bend due to the first driving member 50 and the second driving member 70. To prevent bending of the support element 19, the substrate processing apparatus may further include an adjustment member 87 connecting the first driving member 50 and the second driving member 70. For example, the adjustment member 87 may extend from a first connecting element 63 of the first driving member 50 to a second connecting element 83 of the second driving member 70. With this adjustment member 87, the first driving member 50 and the second driving member 70 can maintain a certain distance, thus preventing bending of the support element 19 and the lower cavity 13. For example, the adjustment member 87 may have a plate structure.

[0076] Figure 5 For illustrative purposes Figure 4 Enlarged cross-sectional view of adjustment component 87.

[0077] See Figure 4 and Figure 5 The adjusting member 87 may have a plate structure in which the thickness of the central portion is less than the thickness of the two side portions. Although not shown, the central portion of the adjusting member 87 may have a through hole through which the discharge member 89 can pass.

[0078] The following describes a substrate processing method using a substrate processing apparatus according to an exemplary embodiment. This substrate processing method can be found in [reference needed]. Figure 1 The substrate processing apparatus described herein is used. However, those skilled in the art will understand that the substrate processing method can utilize the method described in the previous section. Figures 2 to 4 Performed by any one of the substrate processing devices described.

[0079] See also Figure 1The substrate W can be arranged on the support member 15 connected to the upper chamber 15. The support member 19 and the lower chamber 13 can be moved upward by the driving member 20 including the first driving element 21 and the second driving element 27, and the lower chamber 13 can be combined with the upper chamber 15, so that the processing space 17 can be provided between the lower chamber 13 and the upper chamber 15.

[0080] The specified process, such as a cleaning process using a supercritical fluid, can be performed on the substrate W located in the processing space 17. After the cleaning process is performed on the substrate W, the lower chamber 13 and the support member 19 can be moved downward by the driving member 20. The supercritical fluid used can be discharged from the process chamber 11 by the discharge member 41.

[0081] As described above, the support member 19 and the lower chamber 13 can be kept balanced by the compensation member 36 during the upward and downward movement of the support member 19 and the lower chamber 13 by the driving member 20 including the first driving element 21 and the second driving element 27, so that the support member 19 and the lower chamber 13 can be prevented from being tilted.

[0082] The above illustrates exemplary embodiments of the present application, but it will be understood by those skilled in the art that the present application can be modified and changed in various ways without departing from the spirit and scope of the present application as recited in the appended claims.

Claims

1. A substrate processing apparatus characterized by comprising: The substrate processing apparatus includes: an upper chamber; a lower chamber combined with the upper chamber and separated from the upper chamber; and at least one driving member moving the lower chamber upward and downward; wherein the at least one driving member includes: a support element supporting the lower chamber; a first driving element moving the lower chamber and the support element upward and downward; a second driving element moving the lower chamber, the support element, and the first driving element upward and downward, disposed adjacent to the first driving element; and a connecting element connecting the first driving element and the second driving element, a processing space provided between the upper chamber and the lower chamber when the upper chamber is combined with the lower chamber, wherein the support element is a flat plate structure, the first driving element includes a first driving shaft and a first body, and the second driving element includes a second driving shaft and a second body, the first driving element and the second driving element are disposed in parallel in a horizontal direction parallel to the support element, and the second driving element is disposed below the first driving element in a vertical direction perpendicular to the support element, the first driving shaft of the first driving element is connected to one side of a bottom surface of the support element, the connecting element includes a first portion connected horizontally to a bottom surface of the first body, a second portion connected horizontally to an upper surface of the second driving shaft, and a central portion connected vertically to the first portion and the second portion to connect the first driving element and the second driving element, such that the first portion and the second portion of the connecting element are disposed horizontally with respect to the support element, and the central portion of the connecting element is disposed vertically with respect to the support element. 2.The substrate processing apparatus of claim 1, further comprising a compensation member connected to the other side of the support element to maintain balance of the support element and the lower chamber. 3.The substrate processing apparatus of claim 2, wherein: the compensation member includes a guide element passing through the other side of the support element, and the guide element includes a linear motion guide. 4.The substrate processing apparatus of claim 2, wherein: the compensation member includes a spring element connected to the other side of the support element and an inner upper portion of the substrate processing apparatus. 5.The substrate processing apparatus of claim 2, wherein: the compensation member includes a rod element connected to the first driving element and a bottom surface of the substrate processing apparatus, and the rod element moves to the bottom surface of the substrate processing apparatus after the support element and the lower chamber move upward. further comprising: a balance member connected to a side of the second body of the second driving element and extending toward the connecting element; 6. The substrate processing apparatus according to claim 1, wherein the balance member prevents the first driving element and / or the second driving element from tilting during movement of the support element and the lower chamber upward and downward. further comprising: ​ 7. The substrate processing apparatus according to claim 1, wherein ​ an ejection member passing through the support element and connected to a central portion of a bottom surface of the lower cavity.

8. A substrate processing apparatus, characterized by comprising: comprises: an engineering cavity comprising an upper cavity and a lower cavity combined with the upper cavity and separated from the upper cavity; and a first driving member and a second driving member moving the lower cavity upward and downward, wherein the first driving member comprises: a support element supporting the lower cavity; a first driving element connected to one side of the lower cavity and the support element; a second driving element moving the support element and the first driving element upward and downward, disposed adjacent to the first driving element; and a first connecting element connecting the first driving element and the second driving element, the second driving member comprises: a third driving element connected to the other side of the support element, moving the lower cavity and the support element upward and downward; a fourth driving element moving the lower cavity, the support element, and the third driving element upward and downward, disposed adjacent to the third driving element; and a second connecting element connecting the third driving element and the fourth driving element, wherein the support element is a flat plate structure, the first driving element comprises a first driving shaft and a first body, the second driving element comprises a second driving shaft and a second body, the third driving element comprises a third driving shaft and a third body, the fourth driving element comprises a fourth driving shaft and a fourth body, the first driving element and the second driving element are parallelly disposed in a horizontal direction parallel to the support element, and the second driving element is disposed below the first driving element in a vertical direction perpendicular to the support element, the third driving element and the fourth driving element are parallelly disposed in a horizontal direction parallel to the support element, and the fourth driving element is disposed below the third driving element in a vertical direction perpendicular to the support element, the first driving shaft of the first driving element is connected to one side of a bottom surface of the support element, and the third driving shaft of the third driving element is connected to the other side of the bottom surface of the support element. The first connecting element includes a first portion horizontally connected to a bottom surface of the first body, a second portion horizontally connected to an upper surface of the second drive shaft, and a central portion vertically connecting the first portion and the second portion to connect the first drive element and the second drive element such that the first portion and the second portion of the connecting element are horizontally arranged with respect to the support element and the central portion of the connecting element is vertically arranged with respect to the support element, and the second connecting element includes a first portion horizontally connected to a bottom surface of the third body, a second portion horizontally connected to an upper surface of the fourth drive shaft, and a central portion vertically connecting the first portion and the second portion to connect the third drive element and the fourth drive element such that the first portion and the second portion of the connecting element are horizontally arranged with respect to the support element and the central portion of the connecting element is vertically arranged with respect to the support element.

9. The substrate processing apparatus according to claim 8, wherein: the first drive member and the second drive member are symmetrically arranged, the first drive element and the second drive element are arranged in parallel, and the third drive element and the fourth drive element are arranged in parallel.

10. The substrate processing apparatus according to claim 8, characterized in that, Further comprising: a first balancing member connected to the first drive element and the second drive element to prevent the first drive element and / or the second drive element from tilting; and a second balancing member connected to the third drive element and the fourth drive element to prevent the third drive element and / or the fourth drive element from tilting.

11. The substrate processing apparatus according to claim 8, wherein Further comprising: an adjusting member connecting the first drive member and the second drive member to prevent the support element and the lower chamber from bending.

12. The substrate processing apparatus according to claim 11, wherein: the adjusting member has a plate structure in which a thickness of a central portion is smaller than thicknesses of both side portions, and the central portion has a through-hole through which the discharge member passes.

13. A substrate processing method, characterized by, including: a step of arranging a substrate on a support member connected to an upper chamber; a step of combining the lower chamber and the upper chamber with at least one drive member including a support element supporting the lower chamber, a first drive element moving the lower chamber and the support element upward and downward, a second drive element moving the lower chamber, the support element, and the first drive element upward and downward and arranged adjacent to the first drive element, and a connecting element connecting the first drive element and the second drive element; and a step of performing a prescribed process on the substrate in a processing space provided between the lower chamber and the upper chamber, wherein the support element is a flat plate structure, The first driving element includes a first driving shaft and a first body, the second driving element includes a second driving shaft and a second body, the first driving element and the second driving element are arranged in parallel in a horizontal direction parallel to the support element, and the second driving element is arranged below the first driving element in a vertical direction perpendicular to the support element, The first driving shaft of the first driving element is connected to one side of a bottom surface of the support element; The connecting element includes a first portion connected horizontally to a bottom surface of the first body, a second portion connected horizontally to an upper surface of the second driving shaft, and a central portion connecting the first portion and the second portion vertically, so as to connect the first driving element and the second driving element, such that the first portion and the second portion of the connecting element are arranged horizontally relative to the support element, and the central portion of the connecting element is arranged vertically relative to the support element.

14. The substrate processing method according to claim 13, wherein: Balance of the support element and the lower chamber is maintained by a compensating member connected to the other side of the support element.

15. The substrate processing method according to claim 13, wherein: Tilting of the first driving element and / or the second driving element during movement of the support element and the lower chamber upward and downward is prevented by a balancing member connected to a side of the second body of the second driving element and extending toward the connecting element.

16. The substrate processing method according to claim 13, wherein: The specified process includes a cleaning process using a supercritical fluid.

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