Loudspeakers and electronic devices using them

Abstract

This application provides a loudspeaker, including a vibrating component and a magnetic component. The magnetic component and the vibrating component are spaced apart to cooperate in causing the vibrating component to vibrate and produce sound. The vibrating component includes a diaphragm and a semiconductor voice coil, with the semiconductor voice coil disposed on one side of the diaphragm. The magnetic component and the semiconductor voice coil are disposed on the same side of the diaphragm. A magnetic gap is formed within the magnetic component to allow the semiconductor voice coil to be disposed therein, such that the magnetic field lines in the magnetic gap are perpendicular to the direction of the current in the semiconductor voice coil. This application also provides an electronic device using the loudspeaker described above. In the loudspeaker of this application, the semiconductor voice coil is disposed in the magnetic gap, and the magnetic field lines in the magnetic gap are perpendicular to the direction of the current in the semiconductor voice coil. This causes the semiconductor voice coil to drive the connected diaphragm to vibrate up and down to produce sound, thereby maximizing the utilization of the magnetic circuit, improving the vibration balance of the diaphragm, reducing loudspeaker distortion, and increasing sensitivity.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of acoustics, in particular to a loudspeaker and an electronic device using the same. BACKGROUND

[0002] A loudspeaker is an electroacoustic transducer that converts an electrical audio signal into a corresponding sound. Current electronic products have a wide range of applications in society and have diversified functions, among which, telephone function, multimedia playback function, video function, etc. all need to rely on loudspeakers to achieve. In order to adapt to the trend of electronic devices becoming increasingly precise and small, it is necessary to make the loudspeaker have more abundant design to adapt to various installation requirements. How to provide a new type of loudspeaker with high sensitivity and low distortion effect is a problem that needs to be considered by those skilled in the art. SUMMARY

[0003] In order to solve the problems in the prior art, the present application provides a loudspeaker with high sensitivity and low distortion effect.

[0004] The loudspeaker provided by the present application comprises a vibration assembly and a magnetic assembly. The magnetic assembly is arranged in a spaced manner with the vibration assembly to cooperate with the vibration assembly to vibrate and sound. The vibration assembly comprises a diaphragm and a semiconductor voice coil. The semiconductor voice coil is arranged on one side of the diaphragm. The magnetic assembly and the semiconductor voice coil are arranged on the same side of the diaphragm. A magnetic gap is formed in the magnetic assembly. The semiconductor voice coil is arranged in the magnetic gap so that the magnetic induction lines in the magnetic gap are perpendicular to the current direction in the semiconductor voice coil.

[0005] In a possible implementation, the number of semiconductor voice coils is two. The two semiconductor voice coils are arranged in a spaced manner on the same side of the diaphragm. Two spaced magnetic gaps are formed in the magnetic assembly.

[0006] In a possible implementation, the two semiconductor voice coils are arranged in series.

[0007] In a possible implementation, the semiconductor voice coil comprises a first end surface and a first surface connected with the first end surface. The first surface is provided with a sensing circuit. The first end surface is connected with the diaphragm.

[0008] In a possible implementation, the magnetic assembly comprises a magnetic module and a magnetic conductive ring. The magnetic conductive ring is arranged around the outer side of the magnetic module to cooperate with the magnetic module to form the magnetic gap.

[0009] In a possible implementation, the magnetic module comprises a magnetic conductive block and two magnetic pieces. The magnetic conductive block is clamped between the two magnetic pieces.

[0010] In a possible implementation, the magnetic conductive ring is rectangular, and a receiving cavity is formed in the magnetic conductive ring; the magnetic module is a cuboid, and the magnetic module is arranged in the receiving cavity.

[0011] In a possible implementation, the magnetic conductive ring comprises a protrusion arranged towards the magnetic module, the magnetic spacing between the protrusion and the magnetic module is the smallest magnetic spacing in the magnetic gap, and the semiconductor voice coil is arranged between the magnetic module and the protrusion.

[0012] In a possible implementation, the loudspeaker further comprises a connecting seat, and the connecting seat is electrically connected with the semiconductor voice coil.

[0013] The embodiment of the present application further provides an electronic device, which comprises a circuit board and the loudspeaker as described above, and the loudspeaker is electrically connected to the circuit board.

[0014] Compared with the prior art, the loudspeaker of the present application has the semiconductor voice coil connected to one side of the diaphragm, the semiconductor voice coil arranged in the magnetic gap, and the magnetic induction lines in the magnetic gap perpendicular to the current direction in the semiconductor voice coil, so that the semiconductor voice coil can vibrate up and down along the axis with the change of the current, and further drive the connected diaphragm to vibrate up and down to generate sound. Further, when two spaced semiconductor voice coils are arranged, the maximum utilization of the magnetic circuit can be realized by the spaced arrangement of the two semiconductor voice coils, and the balance of the diaphragm vibration up and down is ensured, so as to reduce the distortion of the loudspeaker and improve the sensitivity of the loudspeaker. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 The loudspeaker provided by the present application is a perspective view along the top view angle.

[0016] Figure 2 The loudspeaker provided by the present application is a perspective view along the bottom view angle.

[0017] Figure 3 The loudspeaker provided by the present application is a perspective exploded view.

[0018] Figure 4 The loudspeaker provided by the present application is a perspective exploded view. Figure 1 The loudspeaker provided by the present application is a perspective exploded view.

[0019] Figure 5 The loudspeaker provided by the present application is a perspective exploded view. Figure 1 The loudspeaker provided by the present application is a perspective exploded view.

[0020] Figure 6 The loudspeaker provided by the present application is a perspective exploded view.

[0021] Figure 7 The electronic device provided by the present application is a perspective exploded view.

[0022] Explanation of main element symbols

[0023] Speaker 1

[0024] Housing 10

[0025] Upper cover 101

[0026] First sound hole 102

[0027] Lower cover 103

[0028] Second sound hole 104

[0029] Receiving portion 105

[0030] Vibration assembly 11

[0031] Diaphragm 12

[0032] Semiconductor voice coil 13

[0033] First end face 131

[0034] First surface 133

[0035] Induction circuit 135

[0036] First electrode 136

[0037] Second electrode 137

[0038] Composite film 14

[0039] Gasket 15

[0040] Sound cavity 150

[0041] Magnetic assembly 16

[0042] Magnetic module 160

[0043] Magnetic piece 161

[0044] Magnetic guide block 162

[0045] Magnetic guide ring 163

[0046] Lug 164

[0047] Receiving cavity 165

[0048] Magnetic gap 17

[0049] Connection seat 18

[0050] Electronic device 2

[0051] Circuit board 21

[0052] The following detailed description will further describe the present application with reference to the above mentioned figures. DETAILED DESCRIPTION

[0053] The following description will reference the accompanying drawings so as to provide a thorough understanding of the present application. The drawings provided herein are not necessarily to scale and the same or similar reference numerals in different drawings mean the same or similar components.

[0054] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, to the extent that the terms "including", "includes", "having", "has", "a", "an", "one" or "said" and / or the like are used in the detailed description and / or claims, such terms are intended to be inclusive in a manner similar to the term "comprising" as an open transition term without precluding any additional or other elements.

[0055] Unless defined otherwise, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Also, unless defined otherwise, terms such as "including", "comprising", "having" and the like are to be construed in an open-ended fashion that is not limited to the listed items. Also, terms such as "first" and / or "second" are used herein, merely to describe a certain feature, or component, and do not imply an order of importance, unless specifically so defined.

[0056] The following description will describe the example embodiments with reference to the accompanying drawings. It is noted that the components depicted in the accompanying drawings are not necessarily shown to scale; rather, the same or similar components will be given the same or similar reference numerals or similar technical terms.

[0057] The following detailed description of the application will further describe the example embodiments with reference to the accompanying drawings.

[0058] As shown in the following detailed description of the application, the example embodiments provide a loudspeaker 1, which includes a housing 10, a vibrating assembly 11 and a magnetic assembly 16. Figures 1 to 6

[0059] The magnetic assembly 16 is spaced apart from the vibrating assembly 11 to cooperate to vibrate the vibrating assembly 11 to produce sound. The vibrating assembly 11 includes a diaphragm 12 and a semiconductor voice coil 13, which is disposed on one side of the diaphragm 12. The magnetic assembly 16 is disposed on the same side of the diaphragm 12 as the semiconductor voice coil 13. The magnetic assembly 16 has a magnetic gap 17 formed therein for receiving the semiconductor voice coil 13 therein such that the magnetic flux lines in the magnetic gap 17 are perpendicular to the direction of the current in the semiconductor voice coil 13.​

[0060] In an embodiment, the number of semiconductor voice coils 13 is two, and the two semiconductor voice coils 13 are arranged on the same side of the diaphragm 12, and the magnetic assembly 16 has two spaced-apart magnetic gaps 17.

[0061] Compared with the prior art, the loudspeaker 1 of the present application has two semiconductor voice coils 13 arranged on the same side of the diaphragm 12, each semiconductor voice coil 13 is arranged in a magnetic gap 17, and the magnetic induction lines in the magnetic gap 17 are perpendicular to the current direction in the semiconductor voice coil 13, so that the semiconductor voice coil 13 can vibrate up and down along the axis with the change of the current, thereby driving the connected diaphragm 12 to vibrate up and down to produce sound. The two semiconductor voice coils 13 are arranged in a spaced-apart manner to maximize the use of the magnetic circuit and ensure the balance of the diaphragm 12 vibrating up and down, thereby reducing the distortion of the loudspeaker 1 and improving the sensitivity of the loudspeaker 1.

[0062] In an embodiment, the housing 10 includes an upper cover 101 and a lower cover 103, the upper cover 101 can be a semi-enclosed buckle cover, and the lower cover 103 can be a plate, the upper cover 101 and the lower cover 103 are buckled to form a containing portion 105, and the vibration assembly 11 and the magnetic assembly 16 are arranged in the containing portion 105.

[0063] In an embodiment, the upper cover 101 is provided with a first sound hole 102, the first sound hole 102 is in communication with the containing portion 105, the lower cover 103 is provided with a second sound hole 104, the second sound hole 104 is in communication with the containing portion 105, and the first sound hole 102 and the second sound hole 104 are used to communicate the conducting medium (such as air) inside and outside the containing portion 105 to realize sound exchange.

[0064] In the present embodiment, the housing 10 can have a structure similar to a hexagonal body. Further, the upper cover 101 can be a semi-enclosed shell with five faces in a rectangular body, the first sound hole 102 is arranged on the largest face of the upper cover 101, the first sound hole 102 can be an oval, and the area of the oval first sound hole 102 can account for at least 50% of the area of the face on which it is arranged. The lower cover 103 can be a rectangular plate, the lower cover 103 matches the upper cover 101 so as to just cover the opening of the semi-enclosed upper cover 101, and the lower cover 103 can be provided with two spaced-apart second sound holes 104, and the two second sound holes 104 can be arranged corresponding to the positions of the semiconductor voice coils 13.

[0065] In an embodiment, the semiconductor voice coil 13 includes a first end surface 131 and a first surface 133 connected to the first end surface 131, and the first surface 133 is provided with a sensing circuit 135.

[0066] In an embodiment, the semiconductor voice coil 13 can be a sheet-shaped semiconductor voice coil, and the first surface 133 can be a large surface of the sheet-shaped semiconductor voice coil 13. The first surface 133 is provided with a first electrode 136 and a second electrode 137 at intervals, and the first electrode 136 and the second electrode 137 are electrically connected by an inductive circuit 135, which can be a ring-shaped circuit extending from the first electrode 136 to the second electrode 137.

[0067] In an embodiment, the semiconductor voice coil 13 can be a voice coil structure with high integration formed by a light exposure and etching method. The first electrode 136, the second electrode 137, and the inductive circuit 135 on the semiconductor voice coil 13 can be obtained by etching after plating a conductive layer on a substrate.

[0068] Compared with a conventional voice coil of a wound coil type, the semiconductor voice coil 13 has the advantages of smaller size, lighter weight, higher circuit density, and the like, and can be designed to have a more complex circuit structure according to actual needs, so that the loudspeaker 1 is more easily miniaturized.

[0069] In an embodiment, the first end surface 131 is connected to the diaphragm 12.

[0070] In the embodiment, the first end surface 131 is a narrow surface of the sheet-shaped semiconductor voice coil 13, and the semiconductor voice coil 13 is vertically connected and fixed to the diaphragm 12. Specifically, the first end surface 131 is adhered to a surface of the diaphragm 12, and the first surface 133 is perpendicular to the diaphragm 12.

[0071] Further, by connecting the narrow surface of the sheet-shaped semiconductor voice coil 13 to the diaphragm 12, the semiconductor voice coil 13 is fixed to the diaphragm 12 to have a basis for synchronous movement, and the first surface 133 and the inductive circuit 135 provided on the first surface 133 are perpendicular to the magnetic induction lines in the magnetic gap 17. The semiconductor voice coil 13 cuts the magnetic induction lines to drive the diaphragm 12 to vibrate.

[0072] In an embodiment, two semiconductor voice coils 13 are connected in series.

[0073] In the embodiment, the two semiconductor voice coils 13 can be connected by a conductive wire (not shown in the figure), and the conductive wire can be fixed to a surface of the diaphragm 12 to avoid possible negative effects of the conductive wire on the sound production effect of the loudspeaker 1. The two semiconductor voice coils 13 connected in series can be almost simultaneously supplied with or disconnected from current, and the current of the two semiconductor voice coils 13 simultaneously reacts electromagnetically with the magnetic induction lines in the magnetic gap 17 to simultaneously drive the diaphragm 12 to vibrate, that is, the two spaced semiconductor voice coils 13 simultaneously drive the diaphragm 12 to vibrate at the same frequency.

[0074] In an embodiment, the vibration assembly 11 further includes a composite membrane 14 connected to the diaphragm 12 to protect the diaphragm 12 or provide other functional gains.

[0075] In an embodiment, the vibration assembly 11 further comprises a gasket 15 connected to the composite film 14, the gasket 15 and the diaphragm 12 are arranged on the same side of the composite film 14, the gasket 15 can be annular, the annular gasket 15 surrounds the periphery of the composite film 14, and the diaphragm 12 is connected to the middle part of the composite film 14. The vibration assembly 11 abuts against the magnetic assembly 16 through the annular gasket 15, so that the sound cavity 150 is formed between the diaphragm 12 and the magnetic assembly 16, and the sound cavity 150 is used to cooperate with the diaphragm 12 to realize sound generation.

[0076] In an embodiment, the magnetic assembly 16 comprises a magnetic module 160 and a magnetic conductive ring 163, the magnetic conductive ring 163 is arranged on the outer side of the magnetic module 160 to cooperate with the magnetic module 160 to form a magnetic gap 17.

[0077] In an embodiment, the magnetic conductive ring 163 is rectangular, the magnetic conductive ring 163 is provided with a receiving cavity 165, and the magnetic module 160 is a cuboid and is arranged in the receiving cavity 165.

[0078] Further, the magnetic module 160 can be a regular hexagon, the length of the long side of the magnetic module 160 is less than the length of the long side of the magnetic conductive ring 163, and the two opposite ends of the long side of the magnetic conductive ring 163 are arranged in a spaced manner with the two opposite ends of the long side of the magnetic module 160 to form two symmetrical magnetic gaps 17.

[0079] In an embodiment, the magnetic module 160 comprises a magnetic conductive block 162 and a magnetic piece 161, and one magnetic conductive block 162 is clamped between two magnetic pieces 161.

[0080] Further, the magnetic conductive ring 163 and the magnetic conductive block 162 can be metal materials, and further can be low-carbon steel or iron. The two magnetic pieces 161 can be permanent magnets or electromagnets at the same time, or one magnetic piece 161 is a permanent magnet and the other magnetic piece 161 is an electromagnet. One magnetic conductive ring 163 is clamped by the two magnetic pieces 161, the magnetic module 160 is arranged in the receiving cavity 165 in the magnetic conductive ring 163, and the magnetic pieces 161 are in close proximity or contact with the inner wall of the magnetic conductive ring 163.

[0081] In the embodiment, the magnetic pole of the magnetized magnetic conductive block 162 close to the end of the magnetic conductive ring 163 can be N pole, the magnetic pole of the magnetized magnetic conductive ring 163 facing the end of the magnetic conductive block 162 can be S pole, and the magnetic gap 17 between the magnetic module 160 and the magnetic conductive ring 163 exists a magnetic induction line vertically pointing from the magnetic module 160 to the magnetic conductive ring 163. When the semiconductor voice coil 13 is placed in the magnetic gap 17, the magnetic induction line is perpendicular to the direction of the induction circuit 135, so that the semiconductor voice coil 13 can vibrate up and down along the axis with the change of current, and further drive the connected diaphragm 12 to vibrate up and down to generate sound.

[0082] In an embodiment, the magnetic conductive ring 163 comprises a protrusion 164 arranged towards the magnetic module 160, the magnetic gap between the protrusion 164 and the magnetic module 160 is the area with the smallest magnetic gap in the magnetic gap 17. The semiconductor voice coil 13 is arranged between the magnetic module 160 and the protrusion 164, and two semiconductor voice coils 13 are symmetrically arranged at the area with the smallest magnetic gap in the magnetic gap 17, which can maximize the utilization of the magnetic circuit, and ensure the balance of the up and down vibration of the diaphragm 12, thereby reducing the distortion of the loudspeaker 1 and improving the sensitivity of the loudspeaker 1.

[0083] In an embodiment, the loudspeaker 1 further comprises a connecting seat 18, which is electrically connected with the semiconductor voice coil 13.

[0084] The connecting seat 18 can be connected to the outer side of the magnetic conductive ring 163 away from the magnetic module 160, and the connecting seat 18 can be integrated with a connecting circuit (not shown in the figure) inside, which can be electrically connected with the semiconductor voice coil 13 through a conventional wire structure such as a circuit board or a metal wire.

[0085] As shown in Figure 7 The embodiment of the present application further provides an electronic device 2, which comprises a circuit board 21 and a loudspeaker 1, and the loudspeaker 1 is electrically connected to the circuit board 21. In the embodiment, the electronic device is exemplified by a mobile phone, and in other embodiments, the electronic device can also be a notebook computer or other electrical appliances with sound playing function, and the circuit board 21 can be the mainboard of the mobile phone.

[0086] In the foregoing, the specific embodiments of the present application are described with reference to the accompanying drawings. However, those skilled in the art can understand that various changes and replacements can be made to the specific embodiments of the present application without departing from the scope of the present application. These changes and replacements are within the scope defined by the present application.

Claims

1. A loudspeaker comprising a vibration assembly and a magnetic assembly, the magnetic assembly being spaced apart from the vibration assembly to cooperate to vibrate the vibration assembly to produce sound, characterized in that: the magnetic assembly comprises a magnetic module and a magnetic conductive ring, the magnetic conductive ring being arranged around the outside of the magnetic module, the magnetic module comprising a magnetic conductive block and two magnetic pieces, one magnetic conductive block being clamped between the two magnetic pieces; the magnetic conductive ring is rectangular, the magnetic conductive ring is provided with a receiving cavity, the magnetic module is a cuboid, the magnetic module is arranged in the receiving cavity, and the two short sides of the magnetic module and the magnetic conductive ring form a magnetic gap therebetween; the vibration assembly comprises a diaphragm and two semiconductor voice coils, the two semiconductor voice coils being arranged on the same side of the diaphragm; the magnetic assembly and the semiconductor voice coils are arranged on the same side of the diaphragm, and the magnetic gap is used to accommodate the semiconductor voice coils therein, so that the magnetic induction lines in the magnetic gap are perpendicular to the current direction in the semiconductor voice coil.

2. The loudspeaker of claim 1, wherein The two semiconductor voice coils are arranged in series.

3. The loudspeaker of claim 1, wherein The semiconductor voice coil comprises a first end surface and a first surface connected to the first end surface, the first surface is provided with a sensing circuit, and the first end surface is connected to the diaphragm.

4. The loudspeaker of claim 1, wherein The magnetic conductive ring comprises a protrusion arranged towards the magnetic module, the magnetic spacing between the protrusion and the magnetic module is the minimum magnetic spacing in the magnetic gap, and the semiconductor voice coil is arranged between the magnetic module and the protrusion.

5. The loudspeaker of claim 1, wherein, Further comprising a connecting seat, the connecting seat is electrically connected to the semiconductor voice coil.

6. An electronic device, comprising: The electronic device comprises a circuit board and the loudspeaker according to any one of claims 1 to 5, and the loudspeaker is electrically connected to the circuit board.

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