Imaging method using radiation detector

Abstract

A method is disclosed herein, comprising: capturing a first image by exposure using a first radiation detector (100) comprising a first active area (310) and a first virtual area (320), wherein the first virtual area (320) is arranged between application-specific integrated circuit (ASIC) chips (120.1, 120.2) of the first radiation detector (100), and wherein the first image comprises (A) a first regular image element (410) corresponding to the first active area (310) and (B) a first virtual image element (420) corresponding to the first virtual area (320); and determining a value of the first virtual image element (420) based on a value of the first regular image element (410).

Description

Technical field

[0001] The present disclosure relates to imaging methods using radiation detectors. [Background Technology]

[0002] A radiation detector is a device that measures properties of radiation. Examples of properties include the spatial distribution of radiation intensity, phase, and polarization. The radiation may have interacted with an object. For example, the radiation measured by a radiation detector may have penetrated an object. The radiation may be electromagnetic radiation, such as infrared light, visible light, ultraviolet light, X-rays, or gamma rays. Radiation may also be of other types, such as alpha and beta rays. An imaging system may include multiple radiation detectors. [Summary of the invention]

[0003] A method is disclosed herein, comprising: capturing a first image by exposing a first radiation detector comprising a first active area and a first virtual area, wherein the first virtual area is arranged between application-specific integrated circuit (ASIC) chips of the first radiation detector, and wherein the first image comprises (A) a first regular image element corresponding to the first active area and (B) a first virtual image element corresponding to the first virtual area; and determining a value of the first virtual image element based on a value of the first regular image element.

[0004] In one aspect, the method further comprises assigning the determined value to the first virtual image element.

[0005] In one aspect, the first virtual area includes K parallel straight strips, where K is a positive integer.

[0006] In one aspect, the mask blocks (A) any or substantially any particles of exposure radiation not aimed at the first radiation detector or (B) aimed at the slot ring of the first radiation detector.

[0007] In one aspect, the first virtual area includes a plurality of virtual sensing elements, each virtual sensing element including (A) electrical contacts other than a common electrical contact shared by the plurality of virtual sensing elements and (B) not electrically connected to the ASIC chip.

[0008] In one aspect, the first virtual area includes a plurality of virtual sensing elements, each virtual sensing element including no electrical contacts other than a common electrical contact shared by the plurality of virtual sensing elements.

[0009] In one aspect, the step of determining involves interpolation.

[0010] In one aspect, the method further comprises capturing a second image by exposure using a second radiation detector comprising a second active area, wherein a shadow of the entire first virtual area relative to the exposure falls substantially entirely on the second active area and intersects with the second active area through the shadow active area, and wherein the determining step is also based on values ​​of image elements of the second image corresponding to the shadow active area.

[0011] In one aspect, the second radiation detector is coupled to the first radiation detector.

[0012] In one aspect, the second radiation detector further includes a second dummy area disposed between the ASIC chips of the second radiation detector.

[0013] In one aspect, the first virtual area includes K stripes, wherein the second virtual area includes K stripes, wherein the K stripes of the first virtual area and the K stripes of the second virtual area are parallel to each other, and wherein K is a positive integer.

[0014] In one aspect, the thickness of the ASIC chip of the first radiation detector is in the range of 50-100 microns.

[0015] A method is disclosed herein, comprising: for i=1, ..., N, taking local images (1, i) one by one by exposure (i) using the same first radiation detector including a first effective area and a first virtual area, where N is an integer greater than 1; stitching the local images (1, i), i=1, ..., N, to obtain a first combined image, wherein the first combined image comprises (A) a first regular image element corresponding to the first effective area and (B) a first virtual image element corresponding to the first virtual area; and determining the value of the first virtual image element based on the value of the first regular image element.

[0016] In one aspect, the first virtual area includes K vertical stripes parallel to the scanning direction of the exposure (i), i=1, ..., N, where K is a positive integer.

[0017] In one aspect, the first virtual area is disposed between application specific integrated circuit (ASIC) chips of the first radiation detector.

[0018] In one aspect, the first virtual area includes a plurality of virtual sensing elements, each virtual sensing element including (A) electrical contacts other than a common electrical contact shared by the plurality of virtual sensing elements and (B) not electrically connected to the ASIC chip.

[0019] In one aspect, the first virtual area includes a plurality of virtual sensing elements, each virtual sensing element including no electrical contacts other than a common electrical contact shared by the plurality of virtual sensing elements.

[0020] In one aspect, the step of determining involves interpolation.

[0021] On the one hand, the method also includes: for i=1, ..., N, taking local images (2, i) one by one through exposure (i) with the same second radiation detector including the second effective area, wherein the shadow of the entire first virtual area relative to the exposure (1) basically falls completely on the second effective area and intersects with the second effective area through the shadow effective area; and stitching the local images (2, i), i=1, ..., N, to obtain a second combined image, wherein the determining step is also based on the value of the image element of the second combined image corresponding to the shadow effective area.

[0022] In one aspect, the second radiation detector is coupled to the first radiation detector.

[0023] In one aspect, the second radiation detector further includes a second dummy area disposed between the ASIC chips of the second radiation detector.

[0024] In one aspect, the first virtual area includes K straight strips, wherein the second virtual area includes K straight strips, wherein the K straight strips of the first virtual area and the K straight strips of the second virtual area are parallel to each other and parallel to the scanning direction of the exposure (i), i=1,...,N, and wherein K is a positive integer.

[0025] A method is disclosed herein, comprising: for i=1, ..., N, taking local images (1, i) one by one by exposure (i) using the same first radiation detector including a first effective area and a first virtual area, N being an integer greater than 1, wherein the local image (1, i) includes (A) a regular image element (1, i) corresponding to the first effective area and (B) a virtual image element (1, i) corresponding to the first virtual area; for i=1, ..., N, determining the value of the virtual image element (1, i) based on the value of the regular image element (1, i), and assigning the determined value of the virtual image element (1, i) to the virtual image element (1, i) to obtain a modified local image (1, i); and splicing the modified local images (1, i), i=1, ..., N, to obtain a first combined image.

[0026] In one aspect, the first virtual area is disposed between application specific integrated circuit (ASIC) chips of the first radiation detector.

[0027] On the one hand, the method also includes: for i=1, ..., N, taking local images (2, i) one by one through exposure (i) with the same second radiation detector including a second effective area, wherein the shadow of the entire first virtual area relative to the exposure (1) falls basically completely on the second effective area and intersects with the second effective area through the shadow effective area, and, wherein, for i=1, ..., N, the step of determining the value of the virtual image element (1, i) is also based on the value of the image element of the local image (2, i) corresponding to the shadow effective area.

Brief Description of the Drawings

[0028] Figure 1 A radiation detector according to an embodiment is schematically illustrated.

[0029] Figures 2A to 3C Different views of a radiation detector according to different embodiments are schematically shown.

[0030] Figures 4A to 4D A first imaging method according to an embodiment is shown.

[0031] Figures 5A to 6C A second imaging method according to an embodiment is shown.

[0032] 7A to 7I A third imaging method according to an embodiment is shown.

[0033] Figures 8A to 8B A fourth imaging method according to an embodiment is shown.

[0034] Figure 9 A fifth imaging method according to an embodiment is shown.

[0035] FIG. 10A to FIG. 10B An alternative embodiment of a radiation detector is shown. [Specific implementation method]

[0036] As an example, Figure 1 The radiation detector 100 is schematically shown. The radiation detector 100 may include an array of pixels 150 (also referred to as sensing elements 150). The array may be a rectangular array (e.g., Figure 1 as shown), a honeycomb array, a hexagonal array, or any other suitable array. Figure 1 The array of pixels 150 in the example of FIG has 21 pixels 150 arranged in 3 rows and 7 columns. In general, the array of pixels 150 may have any number of pixels 150 arranged in any manner.

[0037] Radiation can include particles such as photons (electromagnetic waves) and subatomic particles (e.g., neutrons, protons, electrons, alpha particles, etc.). Each pixel 150 can be configured to detect radiation incident on it and can be configured to measure characteristics of the incident radiation (e.g., energy, wavelength, and frequency of the particles). The measurements of a pixel 150 of the radiation detector 100 constitute an image of the radiation incident on that pixel. This image can be said to be an image of the object or scene from which the incident radiation originated.

[0038] Each pixel 150 can be configured to count the number of radiation particles incident thereon whose energies fall within a plurality of energy intervals over a period of time. All pixels 150 can be configured to count the number of radiation particles incident thereon within a plurality of energy intervals over the same period of time. When the incident radiation particles have similar energies, the pixels 150 can simply be configured to count the number of radiation particles incident thereon over a period of time without measuring the energies of the individual radiation particles.

[0039] Each pixel 150 can have its own analog-to-digital converter (ADC) configured to digitize an analog signal representing the energy of an incident radiation particle into a digital signal, or to digitize an analog signal representing the total energy of multiple incident radiation particles into a digital signal. The pixels 150 can be configured to operate in parallel. For example, when one pixel 150 measures an incident radiation particle, another pixel 150 may be waiting for the radiation particle to arrive. The pixels 150 do not need to be individually addressable.

[0040] The radiation detector 100 described herein may be used, for example, in X-ray telescopes, X-ray mammography, industrial X-ray defect detection, X-ray microscopy or microradiography, X-ray casting inspection, X-ray nondestructive testing, X-ray weld inspection, X-ray digital subtraction angiography, etc. It may be appropriate to use the radiation detector 100 in place of a photographic plate, photographic film, PSP board, X-ray image intensifier, scintillator, or other semiconductor X-ray detector.

[0041] Figure 2A Schematically shows a Figure 12A-2A. More specifically, radiation detector 100 may include a radiation absorbing layer 110 and an electronics layer 120. Electronics layer 120 may include one or more application-specific integrated circuit (ASIC) chips for processing or analyzing electrical signals generated in radiation absorbing layer 110 by incident radiation. Radiation detector 100 may or may not include a scintillator (not shown). Radiation absorbing layer 110 may include a semiconductor material, such as silicon, germanium, GaAs, CdTe, CdZnTe, or a combination thereof. The semiconductor material may have a high mass attenuation coefficient for the radiation of interest.

[0042] As an example, Figure 2B Schematically shows Figure 1 Detailed cross-sectional view of the radiation detector 100 along line 2A-2A. More specifically, the radiation absorbing layer 110 can include one or more diodes (e.g., pin or pn) formed by one or more discrete regions 114 of a first doping region 111 and a second doping region 113. The second doping region 113 can be separated from the first doping region 111 by an optional intrinsic region 112. The discrete regions 114 are separated from each other by the first doping region 111 or the intrinsic region 112. The first doping region 111 and the second doping region 113 have opposite types of doping (e.g., region 111 is p-type and region 113 is n-type, or, region 111 is n-type and region 113 is p-type). Figure 2B In the example of , each discrete region 114 of the second doped region 113 forms a diode with the first doped region 111 and the optional intrinsic region 112. Figure 2B In the example of FIG. 1 , the radiation absorbing layer 110 has a plurality of diodes (more specifically, Figure 2B Shown is the corresponding Figure 1 For simplicity, the array of 7 pixels in a row has 7 diodes 150. Figure 2B Only two pixels 150 are marked in FIG. 1 . The plurality of diodes have an electrode 119A as a common electrode. The first doped region 111 may also have discrete portions.

[0043] The electronics layer 120 may include an electronics system 121 suitable for processing or interpreting signals generated by radiation incident on the radiation absorbing layer 110. The electronics system 121 may include analog circuits such as filter networks, amplifiers, integrators, and comparators, or digital circuits such as microprocessors and memory. The electronics system 121 may include one or more ADCs. The electronics system 121 may include components shared by the pixels 150 or components dedicated to a single pixel 150. For example, the electronics system 121 may include an amplifier dedicated to each pixel 150 and a microprocessor shared across all pixels 150. The electronics system 121 may be electrically connected to the pixels 150 via vias 131. The spaces between the vias may be filled with a filler material 130, which may increase the mechanical stability of the connection between the electronics layer 120 and the radiation absorbing layer 110. Other bonding techniques may connect the electronics system 121 to the pixels 150 without the use of vias 131.

[0044] When radiation from a radiation source (not shown) strikes the radiation absorbing layer 110, which includes a diode, the radiation particle may be absorbed and generate one or more charge carriers (e.g., electrons, holes) through various mechanisms. The charge carriers may drift to one of the diode's electrodes under an electric field. This field may be an external electric field. Electrical contacts 119B may include discrete portions, each of which is in electrical contact with a discrete region 114. The term "electrical contact" may be used interchangeably with the term "electrode." In embodiments, the charge carriers may drift in various directions such that charge carriers generated by a single radiation particle are substantially not shared by two different discrete regions 114 (where "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different discrete region 114, compared to the remaining charge carriers). Charge carriers generated by radiation particles incident around the footprint of one of these discrete regions 114 are substantially not shared by another of these discrete regions 114. A pixel 150 associated with a discrete region 114 may be the space surrounding the discrete region 114 in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by radiation particles incident thereon flow toward the discrete region 114. That is, less than 2%, less than 1%, less than 0.1%, or less than 0.01% of these charge carriers flow through the pixel 150.

[0045] As another example, Figure 2C Schematically shows Figure 1Detailed cross-sectional view of radiation detector 100 along line 2A-2A. More specifically, radiation absorbing layer 110 may include resistors of semiconductor materials such as silicon, germanium, GaAs, CdTe, CdZnTe, or combinations thereof, but not diodes. The semiconductor materials may have a high mass attenuation coefficient for the radiation of interest. In an embodiment, Figure 2C The electronic device layer 120 may be similar in structure and function to Figure 2B The electronic device layer 120 is provided.

[0046] When radiation strikes radiation-absorbing layer 110, which includes a resistor but not a diode, it can be absorbed and generate one or more charge carriers through various mechanisms. A radiation particle can generate 10 to 100,000 charge carriers. These charge carriers can drift to electrical contacts 119A and 119B under an electric field. This electric field can be an external electric field. Electrical contact 119B includes discrete sections. In embodiments, charge carriers can drift in various directions such that charge carriers generated by a single radiation particle are substantially not shared by two different discrete sections of electrical contact 119B (where "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different discrete section compared to the remaining charge carriers). Charge carriers generated by a radiation particle incident around the footprint of one of these discrete sections of electrical contact 119B are substantially not shared by another of these discrete sections of electrical contact 119B. A pixel 150 associated with a discrete portion of electrical contact 119B can be the space around the discrete portion in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by radiation particles incident thereon flow toward the discrete portion of electrical contact 119B. That is, less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow through a pixel associated with a discrete portion of electrical contact 119B.

[0047] As another example, Figure 3A Schematically shows Figure 1 Detailed cross-sectional view of radiation detector 100 along line 2A-2A. Specifically, electronics layer 120 may include two ASIC chips 120.1 and 120.2 for processing or analyzing electrical signals generated in radiation absorbing layer 110 by incident radiation.

[0048] Figure 3B It shows the embodiment Figure 3A A top view of the radiation detector 100 is shown. Figure 3C It shows the embodiment Figure 3BA cross-sectional view of the radiation detector along line 3C-3C.

[0049] Specifically, in an embodiment, the ASIC chip 120.1 may be configured to process or analyze electrical signals generated by incident radiation in the nine pixels 150 above the ASIC chip 120.1. Each of the nine pixels 150 above the ASIC chip 120.1 may be electrically connected to the ASIC chip 120.1. The nine pixels 150 above the ASIC chip 120.1 form an active area 310.1 ( Figure 3C ).

[0050] Similarly, in an embodiment, the ASIC chip 120.2 can be used to process or analyze the electrical signals generated by the incident radiation in the nine pixels 150 above the ASIC chip 120.2. Each of the nine pixels 150 above the ASIC chip 120.2 can be electrically connected to the ASIC chip 120.2. The nine pixels 150 above the ASIC chip 120.2 form an active area 310.2 ( Figure 3C ). The active areas 310 . 1 and 310 . 2 may be collectively referred to as the active area 310 of the radiation detector 100 .

[0051] Set on two ASIC chips 120.1 and 120.2 ( Figure 3B ) may not be electrically connected to ASIC chips 120.1 and 120.2. As a result, the electrical signals generated by the incident radiation in these three pixels 150 are not received by ASIC chips 120.1 and 120.2 and are therefore not processed or analyzed. These three pixels 150 may be referred to as virtual pixels or virtual sensing elements. These three pixels 150 form a virtual area 320 ( Figure 3B and Figure 3C ). Virtual area 320 does not detect incident radiation.

[0052] In the examples, reference Figure 3A and Figure 3B , 3 virtual pixels 150( Figure 3B Each of the ) may have an electrical contact 119B (see Figure 3A In an embodiment, the electrical contact 119B is (A) in addition to the common electrical contact 119A ( Figure 3A ) and (B) is not electrically connected to ASIC chips 120.1 and 120.2 (see Figure 3A ) electrical contacts.

[0053] In an alternative embodiment, reference Figure 3A and Figure 3B, 3 virtual pixels 150( Figure 3B Each of the three virtual pixels 150 may not have the electrical contact 119B (i.e., the electrical contact 119B is not formed for the three virtual pixels 150). In other words, each of the three virtual pixels 150 does not include any electrical contacts other than the common electrical contact 119A ( Figure 3A ) other than electrical contacts.

[0054] Figures 4A to 4C A first method for obtaining an image of a scene 440 (including a hammer 442) with a radiation detector 100 is shown in accordance with an embodiment. Figure 4A In the top view of the radiation detector 100 , only the effective area 310 and the virtual area 320 of the radiation detector 100 are shown.

[0055] In the examples, reference Figure 4A , a first method for obtaining an image of scene 440 can begin with exposure with radiation particles (e.g., X-rays) that propagate in a direction perpendicular to the page and pass through hammer 442 and strike radiation detector 100 (i.e., from the front to the back of the page).

[0056] As a result of the exposure, the radiation detector 100 may capture an image 400i of the scene 440 ( Figure 4B ), which may include (A) regular image elements 410 corresponding to the active area 310 of the radiation detector 100, and (B) virtual image elements 420 corresponding to the virtual area 320 of the radiation detector 100. The values ​​of the regular image elements 410 are related to the scene 440, while the values ​​of the virtual image elements 420 are not related to the scene 440. For example, when the image 400i is generated, the values ​​of the virtual image elements 420 may be arbitrarily set to an initial value of zero.

[0057] Next, in the examples, refer to Figure 3B , the values ​​of the virtual image elements 420 may be determined based on the values ​​of the regular image elements 410. Next, in an embodiment, these determined values ​​may be assigned to the virtual image elements 420 (thereby replacing their initial value of zero), resulting in Figure 4C A modified image 400im of scene 440 is shown.

[0058] In an embodiment, the determination of the value of the virtual image element 420 may involve interpolation. Interpolation in this context involves estimating the value of a particular image element based on the values ​​of image elements surrounding the particular image element.

[0059] Figure 4D A flowchart 490 summarizing and generalizing the first method described above is shown. Specifically, in step 492, referring to Figures 4A to 4C, a radiation detector (100) can be used to detect the exposure ( Figure 4A ) captures an image (400i), the radiation detector (100) includes an effective area (310) and a virtual area (320), wherein the virtual area is provided on an application specific integrated circuit (ASIC) chip ( Figure 3C 1 and 120.2), and wherein the image includes (A) regular image elements (410) corresponding to the active area and (B) virtual image elements (420) corresponding to the virtual area. In step 494, the value of the virtual image element can be determined based on the value of the regular image element.

[0060] Figures 5A to 6C A method for obtaining a scene 440 ( Figure 6A ) is a second method for detecting an image of . In an embodiment, the second method may be an improvement to the first method and may involve the radiation detector 100 and an additional radiation detector 100 '( Figure 5A Specifically, the second method can perform step 494 ( Figure 4D ) for improvement.

[0061] In the examples, reference Figure 5A , radiation detector 100′ may be similar to radiation detector 100. Specifically, radiation detector 100′ may include an effective area 310′, a dummy area 320′, and ASIC chips 120.1′ and 120.2′, which are similar to active area 310, dummy area 320, and ASIC chips 120.1 and 120.2 of radiation detector 100, respectively.

[0062] In an embodiment, the dummy area 320' may be provided between the ASIC chips 120.1' and 120.2'. In an embodiment, the dummy areas 320 and 320' of the radiation detectors 100 and 100' have the form of two parallel straight stripes.

[0063] In the examples, reference Figure 5A , the second method can start with the exposure of the first method (ie, Figure 4D 492), its radiation particles propagate in the direction indicated by arrow 510. Reference numeral 510 is used hereinafter to indicate exposure, its radiation particles, and the direction of the radiation particles.

[0064] In an embodiment, during exposure 510, the radiation detector 100′ may be arranged relative to the radiation detector 100 such that a shadow of the entire virtual area 320 of the radiation detector 100 relative to the exposure 510 falls substantially completely on the active area 310′ of the radiation detector 100′ (note: “substantially completely” means completely or nearly completely). In other words, the radiation detector 100′ is arranged relative to the radiation detector 100 such that the active area 310′ of the radiation detector 100′ receives substantially all (i.e., all or nearly all) of the radiation particles of the exposure 510 that have passed through the virtual area 320 of the radiation detector 100.

[0065] In an embodiment, the thickness 122 of the ASIC chips 120.1 and 120.2 of the radiation detector 100 may be such that sufficient exposure radiation reaches the radiation detector 100'. In an embodiment, the thickness 122 may be in the range of 50-100 micrometers.

[0066] Assume that the shadow of the entire virtual area 320 of the radiation detector 100 relative to the exposure 510 passes through the shadow effective area 330' ( Figure 5A ) intersects the active area 310 ′ of the radiation detector 100 ′. Figure 5B Shown Figure 5A A top view of radiation detectors 100 and 100 ′.

[0067] In an embodiment, the second method may begin as follows. During exposure 510, the radiation detector 100 may be operated as in the first method ( Figure 4D 492) as in step 492) of the scene 440 ( Figure 4A ) image 400i( Figure 4B ). Also during exposure 510, radiation detector 100' ( Figure 6A ) can shoot scene 440( Figure 6A ) image 600i( Figure 6B ). Next, in the embodiment, the image 400i ( Figure 4B ) can be calculated as follows: Figure 4D 494) based on the values ​​of the regular image elements 410 of the image 400i, and can be determined based on the shadow active area 330' ( Figure 5A and Figure 6A ) of the corresponding conventional image element 630′ of the image 600i ( Figure 6B ) value to determine.

[0068] In an embodiment, the image 400i ( Figure 4B ) can be converted from the value of the virtual image element 420 of the image 600i to the value of the regular image element 630' ( Figure 6B) is estimated from the value of ). Assume that the image 400i ( Figure 4B ) is the average intensity of the image 600i ( Figure 6B ) is three times the average intensity. Then, image 400i ( Figure 4B ) can be estimated as the value of the virtual image element 420 of the image 600i ( Figure 6B ) three times the value of ).

[0069] Next, in an embodiment, these determined values ​​may be assigned to the image 400i ( Figure 4B ) of the virtual image element 420, and obtain Figure 6C A modified image 600im of scene 440 is shown.

[0070] In the above embodiment, the radiation detector 100' has the virtual area 320'. Alternatively, the radiation detector 100' may not have the virtual area. In an embodiment, the radiation detector 100' may be coupled to the radiation detector 100, such as Figure 5A Alternatively, the radiation detector 100 ′ may not be coupled to the radiation detector 100 .

[0071] 7A to 7H A third method for obtaining an image of a scene 740 (including two swords 742) using a radiation detector 100 according to an embodiment is shown. In an embodiment, the third method may be similar to the first method, except that multiple exposures are taken first and then stitched. Specifically, in an embodiment, the third method may begin with a first exposure in which the radiation detector 100 ( Figure 7A ) can capture a first partial image 700i1 of the scene 740 ( Figure 7B ).

[0072] Next, in an embodiment, the radiation detector 100 may be moved horizontally to the right ( Figure 7C ), then a second exposure may be performed, wherein the radiation detector 100 may capture a second partial image 700i2 ( Figure 7D )) of the scene 740. In an embodiment, the movement of the radiation detector 100 between the first exposure and the second exposure may cause the partial images 700i1 and 700i2 to overlap with each other for subsequent stitching.

[0073] Next, in an embodiment, the radiation detector 100 may be further moved horizontally to the right ( Figure 7E ), a third exposure may then be performed, wherein the radiation detector 100 may capture a third partial image 700i3 of the scene 740 ( Figure 7FIn an embodiment, the movement of the radiation detector 100 between the second and third exposures may cause the partial images 700i2 and 700i3 to overlap with each other for subsequent stitching.

[0074] Next, in an embodiment, the partial images 700i1, 700i2, and 700i3 may be stitched together to obtain a combined image 700ic of the scene 740 ( Figure 7G The combined image 700 ic includes (A) regular image elements 710 corresponding to the active area 310 of the radiation detector 100 , and (B) virtual image elements 720 corresponding to the virtual area 320 of the radiation detector 100 .

[0075] Next, in the examples, refer to Figure 7G , the values ​​of the virtual image elements 720 of the combined image 700ic can be determined based on the values ​​of the regular image elements 710. Next, in an embodiment, these determined values ​​can be assigned to the virtual image elements 720, resulting in Figure 7H A modified image 700im of scene 440 is shown.

[0076] In an embodiment, the virtual area 320 of the radiation detector 100 may have a straight bar form ( Figure 7A ). In an embodiment, the virtual area 320 (in the form of a straight strip) may be parallel to the scanning direction of the first, second and third exposures. In other words, the radiation detector 100 is arranged so that its virtual area 320 (in the form of a straight strip) is horizontal during the scanning process.

[0077] Figure 7I 790 is a flowchart summarizing and generalizing the third method described above. Specifically, in step 792, for i=1, ..., N, the effective area ( Figure 7A 310) and virtual area ( Figure 7A The same radiation detector (320) Figure 7A 100) captures a partial image (i) (eg, a first exposure) by exposing (i) (eg, Figure 7B 700i1), N is an integer greater than 1 (for example, 7A to 7F N=3 in ).

[0078] In step 794, the partial images (i), i=1, ..., N, may be stitched together to obtain a combined image ( Figure 7G 700ic), wherein the combined image includes (A) conventional image elements corresponding to the active area ( Figure 7G 710) and (B) correspond to virtual image elements of the virtual area ( Figure 7GIn step 796, the value of the virtual image element may be determined based on the value of the regular image element.

[0079] Figures 8A to 8B A method for obtaining a scene 740 ( Figure 7A In an embodiment, the fourth method may be an improvement to the third method described above and may involve using a method such as Figure 5A Specifically, the fourth method can modify step 796 ( Figure 7I ) for improvement.

[0080] Specifically, in an embodiment, the fourth method may start with steps 792 and 794 of the third method ( Figure 7I That is, the radiation detector 100 can capture partial images 700i1, 700i2, and 700i3 ( Figure 7B 、 Figure 7D and Figure 7F ), and then they can be stitched together to get the combined image 700ic ( Figure 7G ).

[0081] Furthermore, during the first, second and third exposures of the third method, the radiation detector 100'( Figure 5A ) can shoot scene 740( Figure 7A ) of the three partial images (not shown). Next, in an embodiment, the three partial images taken by the radiation detector 100' can be spliced ​​together to obtain a combined image 800ic ( Figure 8A ).

[0082] Next, in an embodiment, the combined image 700ic ( Figure 7G ) can be as follows: Figure 7I 796 in FIG. 1 ), based on the values ​​of the regular image elements 710 of the image 700 ic, and may be based on the shadow active area 330 ′ ( Figure 5A ) of the corresponding conventional image element 830′ of the combined image 800ic ( Figure 8A ) value to determine.

[0083] Next, in an embodiment, these determined values ​​may be assigned to the combined image 700ic ( Figure 7G ) of the virtual image element 720, and obtain a modified image 800im of the scene 740 ( Figure 8B ).

[0084] For obtaining a scene 740 ( Figure 7AThe fifth method of obtaining an image 400i ( ) may be as follows. In an embodiment, the fifth method may be similar to the first method described above. In the first method, during exposure, the radiation detector 100 captures the image 400i ( Figure 4B Then, the value of the virtual image element 420 of the captured image 400i is determined based on the value of the regular image element 410 of the captured image 400i and then assigned, resulting in a modified image 400im of the scene ( Figure 4C ).

[0085] In the fifth method, the first method may be repeated multiple times with multiple exposures during the scanning process. For example, the first method may be repeated three times with three exposures during the scanning process to obtain three modified images of the scene 740 (not shown). This scanning process may be similar to the scanning process of the third method described above ( 7A to 7F The scanning process of the fifth method can make the three modified images overlap with each other to facilitate subsequent splicing. Then, the three modified images can be spliced ​​together to obtain a combined image of the scene 740 (not shown).

[0086] Figure 9 Flowchart 900 summarizing and generalizing the fifth method according to an embodiment is shown. In step 910, for i=1, ..., N (e.g., N=3), the same radiation detector ( Figure 7A 100) captures partial images (i) one by one (eg, Figure 7B 700i1), N is an integer greater than 1, wherein the local image (i) (for example, Figure 7B The image 700i1) includes (A) regular image elements (i) corresponding to the active area and (B) virtual image elements (i) corresponding to the virtual area.

[0087] In step 920, for i=1, ..., N, the values ​​of the virtual image elements (i) can be determined based on the values ​​of the regular image elements (i), and these determined values ​​of the virtual image elements (i) can be assigned to the virtual image elements (i) to obtain a modified partial image (i). In step 930, the obtained modified partial images (i), i=1, ..., N, can be spliced ​​to obtain a combined image of the scene 740.

[0088] According to an embodiment, for obtaining scene 740 ( Figure 7A The sixth method of obtaining an image of ) may be as follows. In an embodiment, the sixth method may be an improvement to the fifth method and may involve using Figure 5ASpecifically, the sixth method can be used to modify step 920 ( Figure 9 ) for improvement.

[0089] Specifically, the sixth method may start from step 910 ( Figure 9 That is, during the three exposures, the radiation detector 100 can capture three primary partial images (not shown) of the scene 740. Also during these three exposures, the radiation detector 100' can capture three secondary partial images (not shown) of the scene 740.

[0090] Next, for each of the three main partial images captured by the radiation detector 100, the value of the virtual image element of the main partial image can be determined not only based on the value of the regular image element of the main partial image (as in the fifth method), but also based on the value of the virtual image element of the main partial image. Figure 9 920 in step 920), and can be based on the shadow effective area 330' ( Figure 5A ) is determined by assigning the determined value to the virtual image element of the primary partial image to obtain the corresponding modified primary partial image.

[0091] For example, for the first main partial image among the three main partial images captured by the radiation detector 100, the values ​​of the virtual image elements of the first main partial image may be determined not only based on the values ​​of the regular image elements of the first main partial image, but also based on the values ​​of the virtual image elements corresponding to the shadow effective area 330' ( Figure 5A ) is determined by assigning the determined value to the virtual image element of the first main partial image to obtain the first modified main partial image.

[0092] Next, in an embodiment, step 930 of the fifth method may be performed ( Figure 9 That is, the three modified main partial images can be spliced ​​together to obtain a combined image of the scene 740 (not shown). In short, the sixth method is a modification of step 920 ( Figure 9 ) has been improved.

[0093] In the above embodiment, each ASIC chip (e.g., Figure 3C120.1 and 120.2) have a square shape (i.e., 3 pixels x 3 pixels) and a size of 9 pixels 150. In general, each ASIC chip can have any shape and size. For example, each ASIC chip can have a rectangular shape (e.g., 2 pixels x 3 pixels). In general, ASIC chips do not need to have the same shape and size.

[0094] In the above embodiment, the active region 310 of the radiation detector 100 includes two active areas 310.1 and 310.2 ( Figure 3C ). Generally, the active area of ​​the radiation detector 100 can have any number of active areas; and the radiation detector 100 can have the same number of ASIC chips. For example, in Figure 10A In FIG. 1 , the active area of ​​the radiation detector 100 may include three active regions 310 . 1 , 310 . 2 , and 310 . 3 ; and the radiation detector 100 may have three ASIC chips 120 . 1 , 120 . 2 , and 120 . 3 .

[0095] Generally, the virtual area of ​​the radiation detector 100 can have any number of virtual areas. Figure 10A In the embodiment, the virtual area of ​​the radiation detector 100 may have two virtual areas 320.1 and 320.2. In an embodiment, the two virtual areas 320.1 and 320.2 may have the following configurations: Figure 10B ( Figure 10A In an embodiment, the two stripes may be parallel to the scanning directions of the first, second and third exposures in the third, fourth, fifth and sixth methods.

[0096] In the above embodiments (including Figure 10A ), radiation detector 100′ is similar to radiation detector 100. Generally, radiation detector 100′ can be any radiation detector that is physically arranged relative to radiation detector 100 during exposure such that substantially all (i.e., all or nearly all) of the exposure radiation particles that have passed through virtual area 320 of radiation detector 100 strike the active area of ​​radiation detector 100′.

[0097] In an embodiment, during the exposure, a mask (not shown) may be used to block exposure radiation particles not aimed at the radiation detectors 100 and 100'. Consequently, during scanning, in an embodiment, the mask may move with the radiation detectors 100 and 100'.

[0098] In an embodiment, each of radiation detectors 100 and 100' may include a grooved ring around its perimeter that does not detect incident radiation. Therefore, if a mask as described above is used, the mask (in addition to blocking exposure radiation particles that are not aimed at the radiation detector) should also block exposure radiation particles that are aimed at the grooved ring of the radiation detector.

[0099] In an embodiment, the scanning process can be continuous or step-by-step. Step-by-step scanning means that the radiation detector stops to capture an image, then moves to the next station to capture the next image, and so on. Continuous scanning means that the radiation detector captures images while the radiation detector moves (without stopping during the scanning process).

[0100] Although various aspects and embodiments are disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for illustrative purposes only and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.

Claims

1. An imaging method comprising: capturing a first image by exposing the first radiation detector, The first radiation detector includes a radiation absorption layer and an electronic device layer, the radiation absorption layer includes a first effective area and a first dummy area, the electronic device layer includes a plurality of dedicated integrated circuit chips, and the first dummy area is arranged between the dedicated integrated circuit chips of the first radiation detector, and wherein the first image includes a first image element corresponding to the first valid area and a first virtual image element corresponding to the first virtual area; and A value of the first virtual image element is determined based on the value of the first image element. 2 . The method of claim 1 , further comprising assigning a determined value to the first virtual image element.

3. The method according to claim 1, in, The first virtual area includes K parallel straight strips, and Wherein, K is a positive integer.

4. The method according to claim 1, wherein The mask blocks any exposure radiation particles that are not aimed at the first radiation detector or at the slot ring of the first radiation detector.

5. The method according to claim 1, wherein The first dummy area includes a plurality of dummy sensing elements, each dummy sensing element including an electrical contact other than a common electrical contact shared by the plurality of dummy sensing elements and not electrically connected to the ASIC chip.

6. The method according to claim 1, wherein The first virtual area includes a plurality of virtual sensing elements, each virtual sensing element including no electrical contacts other than a common electrical contact shared by the plurality of virtual sensing elements.

7. The method according to claim 1, wherein The step of determining involves interpolation.

8. The method according to claim 1 , further comprising capturing a second image by exposing a second radiation detector including a second active area. in, The shadow of the entire first virtual area relative to the exposure falls substantially entirely on the second effective area and intersects with the second effective area through the shadow effective area corresponding to the shadow on the second radiation detector, and The determining step is further based on values ​​of image elements of the second image corresponding to the shadow effective area.

9. The method according to claim 8, wherein The second radiation detector is coupled to the first radiation detector.

10. The method according to claim 8, wherein The second radiation detector further includes a second dummy region disposed between ASIC chips of the second radiation detector.

11. The method according to claim 10, in, The first virtual area includes K vertical stripes. The second virtual area includes K vertical stripes. The K straight stripes of the first virtual area and the K straight stripes of the second virtual area are parallel to each other, and Wherein, K is a positive integer.

12. The method according to claim 8, wherein The thickness of the ASIC chip of the first radiation detector is in the range of 50-100 microns.

13. An imaging method comprising: Using a same first radiation detector, taking a plurality of first partial images one by one by performing multiple exposures, wherein the first radiation detector includes a radiation absorbing layer and an electronic device layer, the radiation absorbing layer includes a first effective area and a first dummy area, the electronic device layer includes a plurality of application-specific integrated circuit chips, and the first dummy area is disposed between the application-specific integrated circuit chips of the first radiation detector; splicing the plurality of first partial images to obtain a first combined image, wherein the first combined image includes a first image element corresponding to the first valid area and a first virtual image element corresponding to the first virtual area; and A value of the first virtual image element is determined based on the value of the first image element.

14. The method according to claim 13, in, The first virtual area includes K stripes parallel to the exposure scanning direction, and Wherein, K is a positive integer.

15. The method according to claim 13, wherein The first dummy area includes a plurality of dummy sensing elements, each dummy sensing element including an electrical contact other than a common electrical contact shared by the plurality of dummy sensing elements and not electrically connected to the ASIC chip.

16. The method according to claim 13, wherein: The first virtual area includes a plurality of virtual sensing elements, each virtual sensing element including no electrical contacts other than a common electrical contact shared by the plurality of virtual sensing elements.

17. The method according to claim 13, wherein: The step of determining involves interpolation.

18. The method according to claim 13, further comprising: capturing a plurality of second partial images one by one by performing a plurality of exposures using the same second radiation detector including the second active area, wherein a shadow of the entire first virtual area relative to the exposures substantially entirely falls on the second active area and intersects the second active area through a shadow active area on the second radiation detector corresponding to the shadow; and The plurality of second partial images are stitched together to obtain a second combined image, wherein the determining step is further based on a value of an image element of the second combined image corresponding to the shadow effective area.

19. The method according to claim 18, wherein The second radiation detector is coupled to the first radiation detector.

20. The method according to claim 18, wherein The second radiation detector further includes a second dummy region disposed between ASIC chips of the second radiation detector.

21. The method according to claim 20, wherein The first virtual area includes K vertical stripes. The second virtual area includes K vertical stripes. The K vertical stripes of the first virtual area and the K vertical stripes of the second virtual area are parallel to each other and parallel to the exposure scanning direction, and Wherein, K is a positive integer.

22. An imaging method comprising: Using a same first radiation detector including a first active area and a first virtual area, a plurality of first partial images are captured one by one by performing multiple exposures, wherein the first radiation detector includes a radiation absorption layer and an electronic device layer, the radiation absorption layer includes the first active area and the first virtual area, the electronic device layer includes a plurality of application-specific integrated circuit chips, the first virtual area is disposed between the application-specific integrated circuit chips of the first radiation detector, and the first partial images include image elements corresponding to the first active area and virtual image elements corresponding to the first virtual area; For each of the plurality of first partial images, determining a value of the virtual image element based on a value of the image element, and assigning the determined value of the virtual image element to the virtual image element to obtain a modified first partial image; and A plurality of the modified first partial images are spliced ​​together to obtain a first combined image.

23. The method according to claim 22, further comprising: using the same second radiation detector including the second active area, taking second partial images one by one by performing a plurality of exposures, wherein the shadow of the entire first virtual area relative to the exposure falls substantially entirely on the second effective area and intersects with the second effective area through a shadow effective area corresponding to the shadow on the second radiation detector, and The step of determining the value of the virtual image element is further based on the value of the image element of the second partial image corresponding to the shadow effective area.

Images