A MEMS probe fixing device and leveling process method

Abstract

The present invention relates to a MEMS probe fixing device, including a posture adjustment mechanism and a probe limiting mechanism arranged on the posture adjustment mechanism, wherein the probe limiting mechanism includes a support seat driving the posture adjustment mechanism, an ultrasonic cavity is arranged on the support seat, and a MEMS probe limiting base is arranged in the ultrasonic cavity; the MEMS probe limiting base is provided with a probe limiting groove for limiting and accommodating the MEMS probe; and a magnetic suction cup is also arranged at the bottom of the MEMS probe limiting base. The present invention provides a MEMS probe fixing device and a flattening process method, which can place the MEMS probe in the probe limiting groove in an orderly manner, facilitate positioning and assist the straightening and flattening of the MEMS probe.

Description

Technical Field

[0001] The invention relates to the field of mechanical processing, and in particular to a MEMS probe fixing device and a leveling process method. Background Art

[0002] In the field of semiconductor testing, probe cards are important tools for chip testing. As the number of chips per unit area on the wafer increases, the chip pin spacing continues to shrink, and the minimum chip pin spacing can reach 40μm. In order to meet the chip testing needs, MEMS probes are needed for testing.

[0003] The size of the MEMS probe is very small (the minimum cross-section is 30μm*30μm). The MEMS probe manufactured using the MEMS process has a mesh structure (MEMS is a micro-electromechanical system). It is necessary to test to determine the good products, mark the bad products, and cut and remove the good probes.

[0004] Since the MEMS probe is in a warped state in a natural pressure-free state after processing, the next step of probe detection, probe cutting, etc. cannot be carried out, and the MEMS probe needs to be positioned and fixed.

[0005] Conventional methods for fixing and leveling MEMS probes include vacuum adsorption and glass cover plate pressing.

[0006] The problem with the vacuum adsorption method is that the probe size is too small, smaller than the adsorption hole size of the vacuum adsorption plate, and adsorption, fixation, and leveling cannot be achieved.

[0007] The problem with flattening the glass cover is that the flatness of the glass cover cannot be guaranteed to be very high precision, so it is impossible to ensure that the probe is fixed and flat when flattening the probe on a large scale. In addition, this contact pressure flattening will cause certain pressure damage to the probe, and it is also impossible to ensure that the probe is flattened and fixed.

[0008] In view of the above problems, combined with the MEMS probe structure and actual use requirements, a MEMS probe fixing device and a leveling process method are invented. The device has the following functions: Summary of the invention

[0009] The present invention overcomes the shortcomings of the prior art and provides a MEMS probe fixing device and a flattening process method, which can place the MEMS probe in an orderly manner in the probe limiting groove, facilitate positioning and assist the alignment and flattening of the MEMS probe.

[0010] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a MEMS probe fixing device, including a posture adjustment mechanism, and a probe limiting mechanism arranged on the posture adjustment mechanism, the probe limiting mechanism includes a support seat driven by the posture adjustment mechanism, an ultrasonic cavity is arranged on the support seat, and a MEMS probe limiting base is arranged in the ultrasonic cavity; the MEMS probe limiting base is provided with a probe limiting groove for limiting and accommodating the MEMS probe; the lower part of the MEMS probe limiting base is also provided with a magnetic suction cup corresponding to the probe limiting groove.

[0011] In a preferred embodiment of the present invention, a limiting column for limiting the MEMS probe is disposed in the probe limiting groove, and the limiting column and the MEMS probe are in a male-female staggered matching structure.

[0012] In a preferred embodiment of the present invention, the limiting column includes a staggered baffle bar 1 and a staggered baffle bar 2; and the baffle bar 2 is a transverse baffle bar, and one end of a plurality of baffle bars 1 are arranged in parallel and spaced apart on the baffle bar 2 in a comb-tooth arrangement.

[0013] In a preferred embodiment of the present invention, the probe limiting mechanism is further provided with a plurality of brushes corresponding to the probe limiting grooves; the brushes can swing and brush relative to the probe limiting grooves.

[0014] In a preferred embodiment of the present invention, a concave mounting groove is provided on the upper portion of the support seat, the magnetic suction cup is arranged in the mounting groove and corresponds to the MEMS probe limiting base; or / and, the posture adjustment mechanism includes an X-axis translation table, a Y-axis translation table is driven and arranged on the X-axis translation table, and a probe limiting mechanism is driven and arranged on the Y-axis translation table.

[0015] In a preferred embodiment of the present invention, the MEMS probe comprises a plurality of support beams arranged in parallel at intervals, one end of the plurality of probes are arranged in parallel and at intervals on the support beams in a comb-tooth arrangement; and the plurality of support beams are arranged in parallel and at intervals and connected by a positioning frame.

[0016] In a preferred embodiment of the present invention, a MEMS probe flattening process method comprises the following steps:

[0017] Step S1, initializing or resetting the device;

[0018] Step S2, placing the MEMS probe on the MEMS probe limiting base;

[0019] Step S3, performing ultrasound, micro-displacement vibration, and brushing on the probe to align the probe and lock the probe;

[0020] Step S4, magnetically adsorbing the probe and checking the posture and position of the probe;

[0021] Step S5, repeating steps 1 to 4, the number of repetitions is N times, where N is a natural number;

[0022] Step S6, calibrating and cutting the probe;

[0023] Step S7, releasing the probe.

[0024] In a preferred embodiment of the present invention, in step S1, the initialization or resetting process includes the following steps:

[0025] Step 1.1, move the X-axis translation stage and the Y-axis translation stage to their initial positions;

[0026] Step 1.2, turn off the power of the strong magnetic suction disk to make it have no magnetic force;

[0027] Step 1.3, the ultrasonic cavity is closed to prevent ultrasonic vibration;

[0028] Step 1.4, perform surface cleaning operation on the MEMS probe limit base.

[0029] In a preferred embodiment of the present invention, step S2 includes the following steps:

[0030] Step 2.1, place the MEMS probe on the smooth silicon wafer, which is the intermediate carrier for loading and transferring the MEMS probe;

[0031] Step 2.2, the MEMS probe is placed on the smooth silicon wafer along the groove and the limiting column of the MEMS probe limiting base.

[0032] In a preferred embodiment of the present invention, step S3 includes the following steps:

[0033] Step 3.1, the X-axis translation stage slightly jitters left and right; the Y-axis translation stage slightly jitters front and back;

[0034] Step 3.2, turn on the ultrasound, and vibrate the ultrasound; use the brush to move the probe; and make the MEMS probe fall into the groove of the MEMS probe limit base;

[0035] Or / and, in step S4, the following steps are included;

[0036] Step 4.1, the magnetic chuck is powered on to strongly magnetically adsorb the probe;

[0037] Step 4.2, check if there is any warped probe. If so, use a brush to move the probe so that it falls into the groove;

[0038] Step 4.3, MEMS probe front inspection; after the MEMS probe is leveled, the whole is moved to the next step for front inspection; after the MEMS probe front inspection is completed, it is taken out;

[0039] Step 4.4, MEMS probe back side inspection: repeat steps 1 to 5 to fix and level the back side of the MEMS probe;

[0040] Or / and, in step S6, the following steps are included;

[0041] Step 6.1, after the probe is tested, mark the good and bad probes;

[0042] Step 6.2, according to the marking results, perform probe cutting, cut defective products and retain good products;

[0043] Or / and, in step S7, the following steps are included;

[0044] The magnetic chuck is powered off, the magnetic force disappears, the MEMS probe is removed, and the next process operation is carried out.

[0045] The present invention solves the defects existing in the background technology, and the beneficial effects of the present invention are as follows:

[0046] (1) A MEMS probe limiting base is provided to limit the probe in the probe limiting groove, so that the probes are separated from each other to prevent overlapping of the probes.

[0047] (2) The MEMS probe itself is made of ferromagnetic material. By providing a strong magnetic adsorption plate, the MEMS probe can be strongly adsorbed on the base, thereby fixing and leveling the warped probe.

[0048] (3) By brushing the MEMS probe back and forth along the length of the probe using a brush, a few MEMS probes with a large degree of warping can be straightened and flattened.

[0049] (4) Providing a vibration platform formed by combining ultrasound and micro-displacement, which can vibrate the MEMS probe into the probe limit groove by ultrasound and vibration, and arrange it in order in the probe limit groove;

[0050] (5) Since the MEMS probe needs to detect the front and back sides, the designed MEMS probe limit base can meet the probe front and back limit requirements in combination with the probe structure, thereby being compatible with the MEMS probe front and back detection requirements;

[0051] (6) The MEMS probe is fixed and leveled by the leveling process, which can provide a good position accuracy for the subsequent probe cutting and provide a good environment for the subsequent process. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0053] Figure 1 The shaft structure of the preferred embodiment of the present invention is shown in FIG. Figure 1(A MEMS probe limiting base is provided in the ultrasonic cavity);

[0054] Figure 2 The structure of the preferred embodiment of the present invention is shown in FIG. Figure 2 (No MEMS probe limiting base is provided in the ultrasonic cavity);

[0055] Figure 3 is a schematic diagram of the top view of the MEMS probe in a preferred embodiment of the present invention;

[0056] Figure 4 is an axial structural schematic diagram of a MEMS probe in a preferred embodiment of the present invention;

[0057] Figure 5 1 is a schematic diagram of the top view of the structure of the MEMS probe limiting base in the preferred embodiment of the present invention;

[0058] Figure 6 It is a schematic diagram of the axial structure of the MEMS probe limiting base in a preferred embodiment of the present invention;

[0059] Figure 7 It is a schematic diagram of the side view structure of the MEMS probe limiting base in a preferred embodiment of the present invention;

[0060] Figure 8 It is a schematic diagram of a top view of a MEMS probe stored on a MEMS probe limiting base in a preferred embodiment of the present invention;

[0061] Fig. 9 It is a schematic diagram of the axial structure of a MEMS probe stored on a MEMS probe limiting base in a preferred embodiment of the present invention;

[0062] Fig.10 is a schematic structural diagram of a magnetic chuck in a preferred embodiment of the present invention;

[0063] Fig.11 is a schematic diagram of the structure of a brush in a preferred embodiment of the present invention;

[0064] Among them, 1-posture adjustment mechanism, 11-X-axis translation table, 111-linear motor one, 12-Y-axis translation table, 121-linear motor two; 2-probe positioning mechanism, 21-support seat, 211-mounting slot, 22-ultrasonic cavity; 3-MEMS probe limiting base, 31-limiting seat, 32-probe limiting slot, 33-limiting column, 331-blocking bar one, 332-blocking bar two, 34-mounting hole; 4-magnetic suction cup, 5-MEMS probe, 51-support beam, 52-positioning frame, 53-probe, 6-brush. DETAILED DESCRIPTION

[0065] The present invention will now be further described in detail with reference to the accompanying drawings and embodiments. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention. Embodiment 1

[0066] The support beam 51 is a probe support beam, and the probes 53 are fixed together by the support beam 51. The MEMS processed probes 53 are in a mesh structure, and since there is no back support, the probes 53 will bend due to stress. When placed on a plane, the plane formed by all the probes 53 will be uneven.

[0067] like Figure 1 to Figure 11 As shown, a MEMS probe fixing device includes a posture adjustment mechanism 1 and a probe limiting mechanism arranged on the posture adjustment mechanism 1. Further, the MEMS probe 5 positioned in the probe limiting mechanism includes a plurality of support beams 51 arranged in parallel at intervals, one end of a plurality of probes 53 is arranged in parallel and at intervals on the support beams 51 in a comb-tooth arrangement; and the plurality of support beams 51 are arranged in parallel and at intervals and connected by a positioning frame 52.

[0068] Specifically, the posture adjustment mechanism 1 includes an X-axis displacement table 11, on which a Y-axis displacement table 12 is driven, and on which a probe limiting mechanism is driven. The X-axis displacement table 11 includes a displacement frame 1, on which a screw rod 1 is pivotally disposed, and the screw rod 1 is connected by a linear motor 111 disposed at one end of the displacement frame 1, and a slide 1 slidably disposed on the displacement frame 1 is driven on the screw rod 1, and the slide 1 is driven with the Y-axis displacement table 12. The Y-axis displacement table 12 includes a displacement frame 2, on which a screw rod 2 is pivotally disposed, and the screw rod 2 is connected by a linear motor 121 disposed at one end of the displacement frame 2, and a slide 2 slidably disposed on the displacement frame 2 is driven on the screw rod 2, and the slide 2 is driven with the probe 53 positioning mechanism 2.

[0069] Specifically, the probe limiting mechanism includes a support seat 21 that drives the slide seat 2 on the posture adjustment mechanism 1. The support seat 21 is a groove-shaped structure. A magnetic suction cup 4 is arranged in the concave installation groove 211 on the support seat 21, and an ultrasonic cavity 22 corresponding to the magnetic suction cup 4 is also arranged on the support seat 21. A MEMS probe limiting base 3 is arranged in the ultrasonic cavity 22. The MEMS probe limiting base 3 includes a limiting seat 31, and a probe limiting groove 32 of an annular structure and a mounting hole 34 located on the periphery of the probe limiting groove 32 are arranged on the limiting seat 31. The MEMS probe limiting base 3 is provided with mounting holes 34 around it and is fixed to the support seat 1 with bolts. The MEMS probe limiting base 3 is provided with a probe limiting groove 32, and the probe limiting groove 32 is designed as a groove structure, which is convenient for placing the MEMS probe 5. A protruding limiting column 33 for limiting the MEMS probe 5 is arranged in the probe limiting groove 32, and the structure of the limiting column 33 and the MEMS probe 5 is a male-female staggered matching structure. The limiting column 33 includes staggered stop bars 1 331 and stop bars 2 332; the stop bars 2 332 are transverse stop bars, and one end of a plurality of stop bars 1 331 is arranged in parallel and spaced relation on the stop bars 2 332 in a comb-tooth arrangement. The shape of the limiting column 33 meshes with the shape of the MEMS probe 5 to form a male-female structure, so that the MEMS probe 5 is physically separated from the probe 53 to prevent overlap. Embodiment 2

[0070] On the basis of the first embodiment, the probe limiting mechanism is further provided with a plurality of brushes 6 corresponding to the probe limiting groove 32. The brush 6 is driven by the swing mechanism and arranged above the probe limiting groove 32. The brush 6 can swing and brush relative to the probe limiting groove 32. The brush 6 is a soft brush that can reciprocate in one direction along the length direction of the probe 53, so that the probe 53 with a large degree of warping is driven by the brush 6 to be brushed into the MEMS probe limiting base 3, and then sucked by the strong magnetic chuck 4, thereby ensuring the flatness of the probe 53.

[0071] Alternatively, in other embodiments, the brush 6 is driven by a displacement mechanism and disposed above the probe limiting groove 32. The brush 6 can swing and brush relative to the probe limiting groove 32. Embodiment 3

[0072] On the basis of the first or second embodiment, a MEMS probe 5 flattening process method includes the following steps:

[0073] Step S1, initialize or reset the device. Specifically, the initialization or reset process includes the following steps: Step 1.1, the X-axis displacement stage 11 and the Y-axis displacement stage 12 in the posture adjustment mechanism 1 are moved to the initial position; Step 1.2, the strong magnetic suction disk is powered off to make it have no magnetic force; Step 1.3, the ultrasonic cavity 22 is closed to make it have no ultrasonic vibration; Step 1.4, the surface of the MEMS probe limit base 3 is cleaned.

[0074] Step S2, MEMS probe 5 is placed on MEMS probe limiting base 3. Step 2.1, MEMS probe 5 is placed on a smooth silicon wafer, which is an intermediate carrier for loading and transferring MEMS probe; Step 2.2, MEMS probe 5 is placed on the smooth silicon wafer along the groove and limiting column 33 of MEMS probe limiting base 3.

[0075] Step S3, ultrasonic, micro-displacement vibration, and brushing of the probe 53 are performed to align the probe 53 and lock the probe 53. Step 3.1, the X-axis translation stage 11 is slightly displaced and shaken left and right; the Y-axis translation stage 12 is slightly displaced and shaken forward and backward; Step 3.2, ultrasonic is turned on, ultrasonic vibration; brush 6 brushes the MEMS probe 5; and the MEMS probe 5 falls into the groove of the MEMS probe limit base 3. In step S3, the brush 6 can be brushed manually, so that the brush 6 swings and brushes relative to the probe limit groove 32.

[0076] Alternatively, in other embodiments, the brush 6 may be driven to be set on the probe limiting mechanism by a swing mechanism or a displacement mechanism, and the brush 6 may be driven to swing or displace relative to the probe limiting groove 32 by the swing mechanism or the displacement mechanism.

[0077] Step S4, magnetically adsorb the MEMS probe 5 and check and verify the posture and position of the MEMS probe 5. Step 4.1, the magnetic chuck 4 is powered on to strongly adsorb the MEMS probe 5; Step 4.2, check whether there is a warped probe 53, if so, use the brush 6 to brush the MEMS probe 5 to make it fall into the groove; Step 4.3, MEMS probe 5 front detection; After the MEMS probe 5 is leveled, the whole is moved to the next step for front detection; After the MEMS probe 5 is tested on the front, it is taken out; Step 4.4, MEMS probe 5 back detection; Repeat steps 1 to 5 to fix and level the back of the MEMS probe 5.

[0078] Step S5, repeat steps 1 to 4, the number of repetitions is N times.

[0079] Step S6, calibrate and cut the MEMS probe 5; Step 6.1, after the MEMS probe 5 is inspected, mark the good and bad MEMS probes 5; Step 6.2, cut the probe 53 according to the marking result, cut the bad ones and keep the good ones.

[0080] Step S7, release the MEMS probe 5. The magnetic chuck 4 is powered off, the magnetic force disappears, and the MEMS probe 5 is removed to proceed to the next process operation.

[0081] Working principle:

[0082] A MEMS probe limiting base 3 is provided, which can limit the probe 53 in the probe limiting groove 32, so that the probes 53 are separated from each other to prevent overlapping needles; the MEMS probe 5 itself is made of ferromagnetic material. By providing a strong magnetic adsorption plate, the MEMS probe 5 can be strongly adsorbed on the base, so that the warped probe 53 is fixed and flattened; by using a brush 6, the MEMS probe 5 is brushed in a unidirectional reciprocating brushing manner along the length direction of the probe 53, and a few MEMS probes 5 with a large degree of warping can be straightened and flattened. The vibration platform formed by the combination of ultrasound and micro-displacement can vibrate the MEMS probe 5 into the probe limiting groove 32 by ultrasound and vibration, and arrange it in order in the probe limiting groove 32. Since the MEMS probe 5 needs to detect the front and back sides, combined with the structure of the probe 53, the designed MEMS probe limiting base 3 can meet the front and back limiting requirements of the probe 53, thereby being compatible with the front and back detection requirements of the MEMS probe 5. By using the leveling process method, the MEMS probe 5 is fixed and leveled, which can provide a good position accuracy for the subsequent cutting of the probe 53 and provide a good environment for the subsequent process.

[0083] The above is based on the ideal embodiment of the present invention. Through the above description, relevant personnel can make various changes and modifications without departing from the technical concept of the present invention. The technical scope of the present invention is not limited to the content in the specification, and the technical scope must be determined according to the scope of the claims.

Claims

1. A MEMS probe leveling process method, characterized in that: The MEMS probe fixing device is used for implementation. The MEMS probe fixing device includes a posture adjustment mechanism and a probe limiting mechanism arranged on the posture adjustment mechanism. The probe limiting mechanism includes a support seat driven to be arranged on the posture adjustment mechanism. The support seat is provided with an ultrasonic cavity. A MEMS probe limiting base is provided in the ultrasonic cavity. The MEMS probe limiting base is provided with a probe limiting groove for limiting and accommodating the MEMS probe. The lower part of the MEMS probe limiting base is also provided with a magnetic suction cup corresponding to the probe limiting groove; The probe limiting mechanism is also provided with a plurality of brushes corresponding to the probe limiting groove; the brushes can swing and brush relative to the probe limiting groove; the upper part of the support seat is provided with a concave mounting groove, and the magnetic suction cup is arranged in the mounting groove; Or / and, the posture adjustment mechanism includes an X-axis translation table, a Y-axis translation table is driven and arranged on the X-axis translation table, and a probe limiting mechanism is driven and arranged on the Y-axis translation table; The MEMS probe leveling process method comprises the following steps: Step S1, initializing or resetting the device; Step S2, placing the MEMS probe on the MEMS probe limiting base; Step S3, performing ultrasound, micro-displacement vibration, and brushing on the probe to align the probe and lock the probe; Step S4, magnetically adsorbing the probe and checking the posture and position of the probe; Step S5, repeating steps 1 to 4, the number of repetitions is N times, where N is a natural number; Step S6, calibrating and cutting the probe; Step S7, releasing the probe.

2. The MEMS probe flattening process according to claim 1, characterized in that: A limiting column for limiting the MEMS probe is arranged in the probe limiting groove, and the structure of the limiting column and the MEMS probe is a male-female staggered matching structure.

3. The MEMS probe flattening process according to claim 2, characterized in that: The limiting column comprises a staggered baffle bar 1 and a staggered baffle bar 2; and the baffle bar 2 is a transverse baffle bar, and one end of a plurality of baffle bars 1 are arranged in parallel and at intervals on the baffle bar 2 in a comb-tooth arrangement.

4. The MEMS probe flattening process according to claim 1, characterized in that: The MEMS probe comprises a plurality of support beams arranged in parallel at intervals, one end of a plurality of probes are arranged in parallel and in intervals on the support beams in a comb-tooth arrangement; and the plurality of support beams are arranged in parallel and in intervals and connected via a positioning frame.

5. The MEMS probe flattening process according to claim 1, characterized in that: In step S1, the initialization or resetting process includes the following steps: Step 1.1, the X-axis translation stage and the Y-axis translation stage move to their initial positions; Step 1.2, turn off the power of the strong magnetic suction disk to make it have no magnetic force; Step 1.3, the ultrasonic cavity is closed to prevent ultrasonic vibration; Step 1.4, perform surface cleaning operation on the MEMS probe limit base.

6. The MEMS probe flattening process according to claim 3, characterized in that: In the step S2, The steps include: Step 2.1, place the MEMS probe on the smooth silicon wafer, which is the intermediate carrier for loading and transferring the MEMS probe; Step 2.2, the MEMS probe is placed on the smooth silicon wafer along the groove and the limiting column of the MEMS probe limiting base.

7. The MEMS probe flattening process according to claim 3, characterized in that: The step S3 includes the following steps: Step 3.1, the X-axis translation stage is slightly jittered left and right; the Y-axis translation stage is slightly jittered front and back; Step 3.2, turn on the ultrasound, and vibrate the ultrasound; use the brush to move the probe; and make the MEMS probe fall into the groove of the MEMS probe limit base; Or / and, in step S4, The steps include: Step 4.1, the magnetic chuck is powered on to strongly magnetically adsorb the probe; Step 4.2, check if there is any warped probe. If so, use a brush to move the probe so that it falls into the groove; Step 4.3, MEMS probe front inspection; after the MEMS probe is leveled, the whole is moved to the next step for front inspection; after the MEMS probe front inspection is completed, it is taken out; Step 4.4, MEMS probe back side inspection: repeat steps 1 to 5 to fix and level the back side of the MEMS probe; Or / and, in step S6, The steps include: Step 6.1, after the probe is tested, mark the good and bad probes; Step 6.2, according to the marking results, perform probe cutting, cut defective products and retain good products; Or / and, in step S7, The steps include: The magnetic chuck is powered off, the magnetic force disappears, the MEMS probe is removed, and the next process operation is carried out.

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