Cable connector

Abstract

Provided is a cable connector. Impedance increase suppression and short circuit prevention are both taken into account. A cable connector (100) connects a connector (10) and a shielded cable (20) via a relay substrate (30). The shielded cable (20) includes at least an inner conductor (21), a dielectric (22) covering the inner conductor (21), and a shield member (23) covering the dielectric (22), the inner conductor (21) exposed by removing the shield member (23) and the dielectric (22) is connected to a contact (11) of the connector (10), a GND conductor layer (32) of a surface of the relay substrate (30) is arranged at least directly below the dielectric (22) exposed by removing the shield member (23), and the GND conductor layer (32) of the surface of the relay substrate (30) arranged directly below the portion from which the shield member (23) is removed is covered by an insulating member (31).

Description

Technical Field

[0001] This invention relates to cable connectors. Background Technology

[0002] Cable connectors that connect the connector and the shielded cable via a relay substrate are known in the past. For example, in Patent Document 1 below, such as Figures 27-30 As shown, a conventional example of a high-speed cable connector is disclosed, which connects the contacts (3) of an electrical connector (1) and a coaxial cable (5) via a relay substrate (4). In the high-speed cable connector disclosed in Patent Document 1, the coaxial cable (5) is impedance matched by a core wire (51), an intermediate insulator (52), and a braided shield (53). Furthermore, the relay substrate (4) is impedance matched by a signal pattern (43) on the surface, a surface-side grounding pattern (44), and a back-side grounding pattern (45) sandwiching an insulating portion (42).

[0003] In addition, reference numerals in the drawings related to the descriptions in prior art documents are distinguished from the embodiments of the present invention by using parentheses.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: JP Japanese Patent Application Publication No. 8-167457

[0007] However, the portion of the coaxial cable (5) with the core wire (51) and intermediate insulation (52) exposed after removing the braided shield (53) (see reference) Figure 30 Since the surface-side grounding pattern (44) and the back-side grounding pattern (45) are far apart, the impedance will increase. Here, as a countermeasure to suppress the increase in impedance, it is considered to extend the surface-side grounding pattern (44) to directly below the portion where the core wire (51) and the intermediate insulator (52) are exposed after the braided shield (53) is removed. However, in this countermeasure, since the extended surface-side grounding pattern (44) may short-circuit with the core wire (51) soldered to the adjacent signal pattern (43), it is considered difficult to extend the surface-side grounding pattern (44). That is, in the prior art, represented by the high-speed cable connector disclosed in Patent Document 1, there is a problem that it is not possible to simultaneously suppress the increase in impedance and prevent short circuits in the portion of the coaxial cable (5: shielded cable) where the core wire (51: inner conductor) and the intermediate insulator (52: dielectric) are exposed after the braided shield (53: shielding member) is removed. Summary of the Invention

[0008] Thus, the object of the present application is to provide a cable connector that can achieve both impedance increase suppression and short circuit prevention in a cable connector that connects a connector and a shielded cable via a relay substrate.

[0009] The cable connector of the present application connects a connector and a shielded cable via a relay substrate, and is characterized in that the shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shielding member covering the dielectric, the inner conductor exposed by removing the shielding member and the dielectric is connected to a contact of the connector, a GND conductor layer of a surface of the relay substrate is arranged at least directly below the dielectric exposed by removing the shielding member, and the GND conductor layer of the surface of the relay substrate arranged directly below the portion from which the shielding member is removed is covered by an insulating member.

[0010] That is, in the cable connector of the present application, since the insulating member and the GND conductor layer exist on the surface of the relay substrate directly below the portion from which the shielding member of the shielded cable is removed, the impedance increase is effectively suppressed. Furthermore, in the cable connector of the present application, the contact of the connector and the inner conductor of the shielded cable are directly connected. Therefore, in the present application, there is no need for processing (shaping) to bend the inner conductor to the surface of the substrate, since the GND conductor layer of the wiring substrate surface arranged directly below the portion from which the shielding member is removed and the inner conductor of the shielded cable are not adjacent, but are separated in the up-and-down direction with the insulating member interposed therebetween, short circuiting is difficult.

[0011] Furthermore, in the cable connector of the present application, it can be that the insulating member can be provided as a resist applied to the surface of the GND conductor layer.

[0012] Furthermore, in the cable connector of the present application, it can be that the connection portion of the contact of the connector and the exposed inner conductor of the shielded cable is connected by soldering, the GND conductor layer of the surface of the relay substrate is extended to directly below the contact of the connector and the connection portion, and the GND conductor layer directly below the connection portion is missing.

[0013] Furthermore, in the cable connector of the present application, it can be that the connection portion of the contact of the connector and the exposed inner conductor of the shielded cable is connected by soldering, the surface of the relay substrate directly below the contact of the connector and the exposed inner conductor of the shielded cable is formed to be missing.

[0014] Furthermore, in the cable connector of the present application, it can be that the contact of the connector is held in an insulating connector mold, the connection portion of the contact of the connector and the exposed inner conductor of the shielded cable is connected by soldering, and the connector mold is extended to directly below the contact of the connector and the connection portion.

[0015] That is, in the cable connector of the present application, the connection portion of the contact of the connector and the exposed inner conductor of the shielded cable is locally reduced in impedance due to soldering, but in the present application, since the structure of providing the GND conductor layer just below the connection portion is adopted, the local reduction in impedance can be suppressed, and the advantage of achieving impedance matching more can be obtained.

[0016] Further, in the cable connector of the present application, it can be that the non-shielded cable is connected to the connector, and at least one of the non-shielded cables is connected to the contact of the connector via the conductor of the relay substrate.

[0017] Further, in the cable connector of the present application, it can be that the relay substrate has a GND conductor layer also on the back surface side, and the contact of the connector, the shielded cable, and the GND conductor layer are arranged so as to be mirror-symmetric to the surface side.

[0018] Effects of the Invention

[0019] According to the present application, a cable connector that gives consideration to both the increase suppression of impedance and the short circuit prevention in a cable connector in which a connector and a shielded cable are connected via a relay substrate can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a perspective view of the cable connector of the first embodiment as viewed from the upper left of the back surface.

[0021] Figure 2 is a top view of the cable connector of the first embodiment.

[0022] Figure 3 is a left side view of the cable connector of the first embodiment.

[0023] Figure 4 is a longitudinal sectional view of the A-A line section in Figure 2 . The left upper portion of the paper of the drawing shows an enlarged sectional view of the range of the two arrows indicated by reference numeral B-B in the drawing.

[0024] Figure 5 is an exploded perspective view of the cable connector of the first embodiment as viewed from the upper left of the back surface.

[0025] Figure 6 is a perspective view of the cable connector of the second embodiment as viewed from the upper left of the back surface.

[0026] Figure 7 is a top view of the cable connector of the second embodiment.

[0027] Figure 8 is a longitudinal sectional view of the A-A line section inFigure 7 The longitudinal section view of the DD line section.

[0028] Figure 9 This is a perspective view of the cable connector of the third embodiment as seen from the upper left of the back.

[0029] Figure 10 This is a top view of the cable connector according to the third embodiment.

[0030] Figure 11 It means Figure 10 The longitudinal section view of the FF line section.

[0031] Figure 12 This is a bottom view of the cable connector according to the third embodiment.

[0032] Figure 13 This is a perspective view of the cable connector of the fourth embodiment as seen from the upper left of the back.

[0033] Figure 14 This is a top view of the cable connector according to the fourth embodiment.

[0034] Figure 15 It means Figure 14 The longitudinal section diagram of the GG line section.

[0035] Figure 16 This is a perspective view of the cable connector of the fifth embodiment as seen from the upper left of the back.

[0036] Figure 17 This is a top view of the cable connector according to the fifth embodiment.

[0037] Figure 18 It means Figure 17 The longitudinal section diagram of the HH line section.

[0038] Figure 19 It means Figure 17 The longitudinal section diagram of section II in the diagram.

[0039] Figure 20 It means Figure 17 The longitudinal section diagram of the JJ line section.

[0040] Figure 21 This is a perspective view of the cable connector of the sixth embodiment as seen from the upper left of the back.

[0041] Figure 22 This is a top view of the cable connector according to the sixth embodiment.

[0042] Figure 23 This is a right-side view of the cable connector according to the sixth embodiment.

[0043] Figure 24 is a longitudinal sectional view of a K-K line section in Figure 22

[0044] Figure 25 are diagrams showing various and specific embodiments that the cable connector of the present application can take.

[0045] Figure 26 are diagrams showing various and specific other embodiments that the cable connector of the present application can take.

[0046] Figure 27 is a perspective view showing an exploded state of the high-speed cable connector to which the invention of Patent Document 1 relates.

[0047] Figure 28 is a perspective view showing a housing and a relay substrate that constitute the high-speed cable connector to which the invention of Patent Document 1 relates.

[0048] Figure 29 is a front view (A) of a substrate unit of the relay substrate that constitutes the high-speed cable connector to which the invention of Patent Document 1 relates, and an arrow direction sectional view of a case where the substrate unit is cut along the III-III line in (A).

[0049] Figure 30 is a perspective view showing the relay substrate and a coaxial cable of the high-speed cable connector to which the invention of Patent Document 1 relates.

[0050] Explanation of Reference Numerals

[0051] 100 cable connector (1st embodiment)

[0052] 200 cable connector (2nd embodiment)

[0053] 300 cable connector (3rd embodiment)

[0054] 400 cable connector (4th embodiment)

[0055] 500 cable connector (5th embodiment)

[0056] 600 cable connector (6th embodiment)

[0057] 10 connector

[0058] 11 contact

[0059] 14 connector module

[0060] 15 connector module extension

[0061] 111 contact for high-speed signal​

[0062] 112 contact for GND

[0063] 113 contact for power supply (or low-speed signal)

[0064] 20 shielded cable

[0065] 21 inner conductor

[0066] 22 dielectric

[0067] 23 shield member

[0068] 25 unshielded cable

[0069] 30 relay substrate

[0070] 31 insulating member

[0071] 32 GND conductor layer

[0072] 321 GND-void region

[0073] 33 substrate layer

[0074] 34 GND conductor layer exposure portion

[0075] 35 substrate-void region

[0076] 36, 37 via (conductor)

[0077] 38 substrate inner conductor (conductor)

[0078] 41 solderDETAILED DESCRIPTION

[0079] A suitable embodiment for carrying out the present application will be described below using the accompanying drawings. In addition, the following embodiment does not limit the application involved in each claim, and furthermore, all of the combinations of features described in the embodiment are not necessarily essential to the solution means of the application.

[0080] [1st Embodiment]

[0081] Using Figures 1-5 , a 1st embodiment that is one embodiment that the cable connector of the present application can take will be described.

[0082] As shown in Figures 1-5 , the cable connector 100 of the 1st embodiment has a connector 10, a shielded cable 20, and a relay substrate 30, and has a structure that connects the connector 10 and the shielded cable 20 via the relay substrate 30.

[0083] The connector 10 has a fitting portion not shown at the front side, and a contact 11 made of a conductive metal as a wiring portion at the rear side. In the connector 10 of the first embodiment, by fitting the fitting portion not shown into the counterpart connector, connection by electric communication or optical communication of the connector 10 and the counterpart connector is possible. In the connector 10 of the first embodiment, four contacts 11 are provided. As shown in Figure 2 the drawing, the four contacts 11 use two contacts 111 disposed at the center as wiring portions for high-speed signals, and use two contacts 112 disposed at both ends as wiring portions for GND (ground).

[0084] The shielded cable 20 has an inner conductor 21, a dielectric 22 covering the inner conductor 21, and a shield member 23 covering the dielectric 22. The inner conductor 21 of the first embodiment serves as a conductor for transmitting high-speed signals. The dielectric 22 of the first embodiment is composed of, for example, an insulating material such as polyethylene, and covers the entire circumference of the inner conductor 21 to protect the inner conductor 21. The shield member 23 of the first embodiment is a member that covers the entire circumference of the dielectric 22 further, and is formed of, for example, a braided wire formed of braided copper wire or the like, or an aluminum sheet. The shield member 23 protects the inner conductor 21 for transmitting high-speed signals from electromagnetic waves and the like coming from the outside by functioning as an electromagnetic shield.

[0085] In addition, in the shielded cable 20 of the first embodiment shown in Figures 1-5 , a structure is exemplified in which the dielectric 22 covers each of two inner conductors 21, and the two inner conductors 21 covered by the dielectric 22 are covered by one shield member 23. However, the form of the shielded cable applicable to the present application is not limited to Figures 1-5 the one shown in the drawing. With respect to the shielded cable of the present application, for example, a coaxial cable in which one inner conductor is covered by a dielectric and a shield member, a fine wire coaxial cable, and further a high-speed signal cable in the form of an STP (shielded twisted pair) cable or an SPP (shielded parallel pair) cable can be adopted. In addition, the shielded cable of the present application includes a structure in which a wire called a drain wire is built in throughout the entire length of the cable, and a structure in which no wire is built in.

[0086] The relay substrate 30 is formed as shown in Figure 4 , in which two substrate layers 33 to which substrates are attached are formed on the bottom surface portion, and a GND conductor layer 32 is formed on the surface of the substrate layer 33. In addition, an insulating member 31 composed of an insulating material is formed on the upper surface of the GND conductor layer 32 formed on the surface of the substrate layer 33.

[0087] The substrate layer 33 of the first embodiment can use all forms of substrate materials known in the art, such as a phenol resin-based resin material, an epoxy resin-based resin material, glass non-woven fabric impregnated with an epoxy resin, a material using an aluminum-based sheet, and the like. Further, the insulating member 31 of the first embodiment employs a barrier agent applied to the surface of the GND conductor layer 32. The insulating member 31, i.e., the barrier agent of the first embodiment is a coating material called a solder resist, which prevents the attachment of solder to unnecessary portions when soldering is performed, and functions as a permanent protective film to protect the relay substrate 30 from dust, heat, humidity, and the like, and maintain the insulating properties.

[0088] The cable connector 100 of the first embodiment is configured by connecting the connector 10, the shielded cable 20, and the relay substrate 30 by the relay substrate 30. Further, in the cable connector 100 of the first embodiment, as shown in FIG. 1, the shielded cable 20 employs a structure in which the shield member 23 and the dielectric 22 are removed to expose the inner conductor 21, and the exposed inner conductor 21 is directly connected to the contact 111 for high-speed signals of the connector 10. In addition, the connection of the inner conductor 21 to the contact 111 for high-speed signals is performed by soldering. By providing direct connection of the inner conductor 21 to the contact 111 for high-speed signals, compared to the connection via a substrate performed in the past, the substrate wiring loss can be eliminated. Figures 1-4

[0089] In addition, with respect to the contact 112 for GND provided in the connector 10, as shown in FIG. 2, a GND conductor layer exposure portion 34 in which the insulating member 31 composed of a barrier agent is not applied is provided in a portion of the GND conductor layer 32 on the surface of the relay substrate 30, and by disposing the contact 112 for GND at the position of the GND conductor layer exposure portion 34 and performing soldering, the contact 112 for GND and the GND conductor layer 32 can be connected. Figure 5

[0090] Further, in the first embodiment, as shown in FIG. 3, the GND conductor layer 32 on the surface of the relay substrate 30 is disposed immediately below the dielectric 22 exposed by the removal of the shield member 23, and the GND conductor layer 32 on the surface of the relay substrate 30 disposed immediately below the portion from which the shield member 23 is removed employs a structure covered by the insulating member 31 composed of a barrier agent. Furthermore, in the first embodiment, as shown in FIG. 4, the GND conductor layer 32 on the surface of the relay substrate 30 is disposed immediately below the contact 112 for GND, and the GND conductor layer 32 on the surface of the relay substrate 30 disposed immediately below the contact 112 for GND employs a structure covered by the insulating member 31 composed of a barrier agent. Figure 4 Figure 4 ​​​As shown, the GND conductor layer 32 of the surface of the relay substrate 30 is extended to a position directly below the high-speed signal contact 111 of the connector 10 and the exposed internal conductor 21 of the shielded cable 20, and the GND conductor layer 32 of the surface of the relay substrate 30 at the position directly below the high-speed signal contact 111 of the connector 10 and the exposed internal conductor 21 of the shielded cable 20 is also covered with the insulating member 31 composed of a barrier agent.

[0091] Further, in the first embodiment, as shown in FIG. 1, the GND conductor layer 32 of the surface of the relay substrate 30 is exposed at a position directly below the shield member 23 of the shielded cable 20, and the shield member 23 of the shielded cable 20 and the GND conductor layer 32 of the surface of the relay substrate 30 are fixedly connected by the solder 41. Figure 4

[0092] Here, the detailed configuration of the cable connector 100 of the first embodiment will be described with reference to FIG. 1. By brazing the shield member 23 of the shielded cable 20 to the GND conductor layer 32 of the surface of the relay substrate 30, effects such as a noise countermeasure can be obtained. That is, the GND conductor layer 32 of the surface of the relay substrate 30 is disposed in a state not covered with the insulating member 31 composed of a barrier agent at a position directly below the shield member 23. Figure 4

[0093] On the other hand, at a portion of the shielded cable 20 where the shield member 23 is removed to expose the dielectric 22, the impedance rises because the dielectric 22 is not covered. As a countermeasure, by disposing the GND conductor layer 32 of the surface of the relay substrate 30 in a state covered with the insulating member 31 composed of a barrier agent at a position directly below the exposed dielectric 22, an effect of reducing the impedance can be obtained.

[0094] That is, the GND conductor layer 32 of the surface of the relay substrate 30 is configured as follows: with a position shown by reference numeral C in FIG. 1 as a boundary, the insulating member 31 composed of a barrier agent is applied on the connector 10 disposition side, and the insulating member 31 composed of a barrier agent is not applied on a side where the shield member 23 of the shielded cable 20 is present. By these countermeasures, impedance matching is sought in the cable connector 100 of the first embodiment. Figure 4

[0095] ​​​That is, in the cable connector 100 of the first embodiment, since the insulating member 31 and the GND conductor layer 32 exist on the surface of the relay substrate 30 directly below the portion of the shielded cable 20 from which the shield member 23 is removed, the increase in impedance is effectively suppressed. Further, in the cable connector 100 of the first embodiment, the contact 111 for high-speed signals of the connector 10 and the internal conductor 21 of the shielded cable 20 are directly connected by soldering, so that the processing (molding) of bending the internal conductor 21 to the surface of the substrate is not required, the GND conductor layer 32 on the surface of the relay substrate 30 directly below the portion from which the shield member 23 is removed and the internal conductor 21 of the shielded cable 20 are not adjacent but are separated in the vertical direction, and the insulating member 31 is provided between the two members, so that an effect that short-circuiting does not occur can be obtained. According to the above, according to the cable connector 100 of the first embodiment, a cable connector that takes into account both the suppression of the increase in impedance and the prevention of short-circuiting can be provided.

[0096] The above uses Figures 1-5 The first embodiment of an embodiment that the cable connector of the present application can take is described above. However, the technical scope of the present application is not limited to the range described in the above first embodiment. Various changes or modifications can be made in the above first embodiment. Therefore, various embodiment examples that the cable connector of the present application can take are described below. In each of the embodiments described below, the same reference numerals are assigned to the same or similar members as those of the above first embodiment, and the description thereof is omitted.

[0097] [Second Embodiment]

[0098] The cable connector 200 of the second embodiment is described using Figures 6-8

[0099] In the cable connector 200 of the second embodiment, as in the case of the above first embodiment, the connection portion of the contact 111 for high-speed signals of the connector 10 and the exposed internal conductor 21 of the shielded cable 20 is connected by soldering. Further, in the cable connector 200 of the second embodiment, as shown in more detail in Figure 8 Figure 8 the GND conductor layer 32 on the surface of the relay substrate 30 directly below the connection portion of the contact 111 for high-speed signals and the internal conductor 21 has the following configuration feature: a GND missing region 321 in which the GND conductor layer 32 is missing is formed in a range viewed in the direction of the arrow shown by reference numeral E in

[0100] ​​In this case, the connection portion of the contact 111 for high-speed signals and the internal conductor 21 is connected by soldering, and thus a phenomenon in which the impedance of only this portion decreases occurs. In order to eliminate this phenomenon, in the second embodiment, the GND conductor layer 32 of the surface of the relay substrate 30 is omitted directly below the connection portion of the contact 111 for high-speed signals and the internal conductor 21, a GND omission region 321 in which the GND conductor layer 32 is not present is formed, and the impedance is increased. As a result, in the second embodiment, impedance matching as a whole of the cable connector 200 can be sought. That is, according to the cable connector 200 of the second embodiment, a cable connector in which impedance increase suppression and short circuit prevention are both taken into consideration and more appropriate impedance matching is achieved can be provided.

[0101] [Third Embodiment]

[0102] The cable connector 300 of the third embodiment will be described using Figures 9-12

[0103] In the cable connector 300 of the third embodiment, as in the case of the above-described first embodiment, the connection portion of the contact 111 for high-speed signals of the connector 10 and the exposed internal conductor 21 of the shielded cable 20 is connected by soldering. Further, in the cable connector 300 of the third embodiment, as shown in Figures 9-12

[0104] In this case, the connection portion of the contact 111 for high-speed signals and the internal conductor 21 is connected by soldering, and thus a phenomenon in which the impedance of only this portion decreases occurs. In order to eliminate this phenomenon, in the third embodiment, the relay substrate 30 itself is omitted directly below the connection portion of the contact 111 for high-speed signals and the internal conductor 21, a substrate omission region 35 in which the substrate including the GND conductor layer 32 is not present is formed, and the impedance is increased. As a result, in the third embodiment, impedance matching as a whole of the cable connector 300 can be sought. That is, according to the cable connector 300 of the third embodiment, as in the case of the above-described second embodiment, a cable connector in which impedance increase suppression and short circuit prevention are both taken into consideration and more appropriate impedance matching is achieved can be provided.

[0105] [Fourth Embodiment]

[0106] The cable connector 400 of the fourth embodiment will be described using Figures 13-15

[0107] ​​​In the cable connector 400 of the fourth embodiment, as with the case of the first embodiment described above, the connection portion of the contact 111 for high-speed signals of the connector 10 and the exposed internal conductor 21 of the shielded cable 20 is connected by soldering. Further, in the cable connector 400 of the fourth embodiment, as shown in FIG. 4, the connector mold 14 that constitutes the connector 10 by providing the contact 11 is provided with a connector mold extension 15 that extends to the position directly below the contact 11 and the connection portion of the connector 10. Figures 13-15

[0108] Here, the connection portion of the contact 111 for high-speed signals and the internal conductor 21 is connected by soldering, and thus there is a phenomenon in which the impedance of only this portion decreases. In order to eliminate this phenomenon, in the fourth embodiment, the connector mold extension 15 of a portion of the connector mold 14 is formed to the position directly below the connection portion of the contact 111 for high-speed signals and the internal conductor 21, and a region in which the substrate including the GND conductor layer 32 is not present is formed, so as to increase the impedance. As a result, in the fourth embodiment, impedance matching as a whole of the cable connector 400 can be achieved. That is, according to the cable connector 400 of the fourth embodiment, as with the second and third embodiments described above, a cable connector that achieves more appropriate impedance matching while suppressing an increase in impedance and preventing short circuits can be provided.

[0109] Thus, in the cable connector 200 of the second embodiment, the cable connector 300 of the third embodiment, and the cable connector 400 of the fourth embodiment, the advantages that the decrease in impedance in a local portion can be suppressed and more appropriate impedance matching can be achieved can be obtained.

[0110] [5th Embodiment]

[0111] The cable connector 500 of the fifth embodiment will be described using FIG. 5. Figures 16-20

[0112] In the cable connector 500 of the fifth embodiment, a structure example in which the types of the contacts 11 of the connector 10 are diversified and the diversified contacts 11 are mixed is shown with respect to the case of the first embodiment described above.

[0113] That is, in the connector 10 of the fifth embodiment, five contacts 11 are provided. As shown in FIG. 5, the five contacts 11 are arranged in order from the left end to the right end as one contact 112 for GND (ground), two contacts 111 for high-speed signals, one contact 112 for GND (ground), and one contact 113 for power supply (or low-speed signals). Figure 17

[0114] ​​​On the other hand, regarding the placement of the shielded cable 20, the same configuration structure as in the first to third embodiments described above can be adopted to achieve suitable impedance matching. In the cable connector 500 of the fifth embodiment, there are unshielded cables 25 such as power cables and low-speed signal cables; therefore, it is necessary to connect the unshielded cables 25 to the power (or low-speed signal) contacts 113. Depending on the specifications and usage conditions of the cable connector 500, such as... Figure 17 As shown, there are cases where the unshielded cable 25 and the power supply (or low-speed signal) contact 113 are located in a remote position.

[0115] As a countermeasure to this situation, in the cable connector 500 of the fifth embodiment, two vias 36 and 37 are formed in the relay substrate 30, and an internal substrate conductor 38 connecting these two vias 36 and 37 is provided inside the relay substrate 30. With this structure, the unshielded cable 25 can be connected to the power (or low-speed signal) contact 113 of the connector 10 via the internal substrate conductor 38 located inside the relay substrate 30. That is, according to the cable connector 500 of the fifth embodiment, the unshielded cable 25 can be connected to the power (or low-speed signal) contact 113 of the connector 10 without hindering the impedance matching connection between the high-speed signal contact 111 and the exposed internal conductor 21 of the shielded cable 20. Therefore, according to the fifth embodiment, a cable connector 500 that facilitates cable arrangement can be provided.

[0116] Furthermore, the vias 36 and 37 and the substrate internal conductor 38 of the fifth embodiment constitute the conductor of the present invention disposed inside the relay substrate 30. Moreover, regarding the vias 36 and 37 that serve as conductors of the present invention, any structure that connects different circuit layers, such as through holes, blind holes, and buried holes, is included within the scope of the present invention.

[0117] [Sixth Implementation]

[0118] use Figures 21-24 The cable connector 600 of the sixth embodiment will be described below.

[0119] about Figures 21-24 The cable connector 600 of the sixth embodiment shown is prepared by preparing two cable connectors 100 of the first embodiment described above, and attaching the bottom surfaces of the relay substrate 30 of the two cable connectors 100 to each other. The cable connectors 600 are configured such that the cable connector 100 disposed on the back side and the cable connector 100 disposed on the surface side are mirror symmetrical.

[0120] That is, in the cable connector 600 of the 6th embodiment, the relay substrate 30 becomes a structure having the GND conductor layer 32 also on the back surface side, and the contact 11 of the connector 10, the shielded cable 20, and the GND conductor layer 32 are configured to be mirror-symmetrical on the back surface side and the surface side. According to the cable connector 600 of the 6th embodiment having such a configuration structure, a cable connector that takes into account both the increase suppression of impedance and the short-circuit prevention can be provided.

[0121] The above, using Figures 1-24 The cable connectors 100, 200, 300, 400, 500, 600 of the 1st to 6th embodiments, which are various mode examples that can be taken by the present application, were explained. Regarding these embodiments, the application range of the cable connector of the present application can be expanded by making various combinations. As such specific examples, the Figure 25 and Figure 26 are shown. Also, there are cases where various electronic components are mounted on the relay substrate of the present application, and in this case, the non-shielded cable and the contact can be connected via the various electronic components.

[0122] [Embodiment 1]

[0123] Regarding the embodiment shown in Figure 25 , it is an embodiment that combines the cable connector 200 of the 2nd embodiment and the cable connector 500 of the 5th embodiment. According to the cable connector of this embodiment, even if the types of the contacts 11 of the connector 10 are various and the various types of contacts 11 exist mixed, the cable arrangement is easy. Therefore, a cable connector with high expandability can be realized. Furthermore, since the internal conductor 21 of the shielded cable 20 is directly connected to the contact 111 for high-speed signals of the connector 10, the transmission loss in the relay substrate 30 can be reduced, and the relay substrate 30 can be made smaller in the depth direction, so that an effect of expanding the application range and an effect of reducing the cost can be obtained.

[0124] [Embodiment 2]

[0125] Regarding the embodiment shown in Figure 26 , it is an embodiment that combines the cable connector 300 of the 3rd embodiment and the cable connector 500 of the 5th embodiment. According to the cable connector of this embodiment, in addition to being able to obtain the same effects as those of the embodiment shown in Figure 25 , for example, even if the contacts 11 of the connector 10 are offset in the up-down direction, since the substrate missing region 35 is present, the position correction of the contact 111 for high-speed signals and the internal conductor 21 is easy, and the degree of freedom of connection is high. Furthermore, by the shape adjustment of the contact 111 for high-speed signals and the substrate missing region 35, the matching adjustment of impedance can be performed.

[0126] The present invention relates to a cable connector connecting a connector and a shielded cable via a relay substrate, and is particularly suitable for a cable connector transmitting a high-speed signal.

Claims

1. A cable connector connecting a connector and a shielded cable via a relay substrate, the cable connector characterized by, the shielded cable including at least an inner conductor, a dielectric covering the inner conductor, and a shield member covering the dielectric, the inner conductor exposed by removing the shield member and the dielectric being directly connected to a contact of the connector, a GND conductor layer of a surface of the relay substrate being arranged at least directly under the dielectric exposed by removing the shield member, the GND conductor layer of the surface of the relay substrate arranged directly under a portion from which the shield member is removed being covered by an insulating member, a connection portion of the contact of the connector and the inner conductor of the shielded cable exposed being connected by soldering, the GND conductor layer of the surface of the relay substrate extending to directly under the contact of the connector and the connection portion, the GND conductor layer directly under the connection portion being absent.

2. A cable connector connecting a connector and a shielded cable via a relay substrate, the cable connector characterized by, the shielded cable including at least an inner conductor, a dielectric covering the inner conductor, and a shield member covering the dielectric, the inner conductor exposed by removing the shield member and the dielectric being directly connected to a contact of the connector, a GND conductor layer of a surface of the relay substrate being arranged at least directly under the dielectric exposed by removing the shield member, the GND conductor layer of the surface of the relay substrate arranged directly under a portion from which the shield member is removed being covered by an insulating member, a connection portion of the contact of the connector and the inner conductor of the shielded cable exposed being connected by soldering, the relay substrate directly under the contact of the connector and the inner conductor of the shielded cable exposed being absent.

3. A cable connector connecting a connector and a shielded cable via a relay substrate, the cable connector characterized by, the shielded cable including at least an inner conductor, a dielectric covering the inner conductor, and a shield member covering the dielectric, the inner conductor exposed by removing the shield member and the dielectric being directly connected to a contact of the connector, a GND conductor layer of a surface of the relay substrate being arranged at least directly under the dielectric exposed by removing the shield member, the GND conductor layer of the surface of the relay substrate arranged directly under a portion from which the shield member is removed being covered by an insulating member, the contact of the connector being held in an insulating connector mold, a connection portion of the contact of the connector and the inner conductor of the shielded cable exposed being connected by soldering, the connector mold extending to directly under the contact of the connector and the connection portion.

4. The cable connector according to any one of claims 1 to 3, characterized in that, the insulating member is a barrier agent applied to a surface of the GND conductor layer.

5. The cable connector according to any one of claims 1 to 3, characterized in that, a non-shielded cable is connected to the connector, At least one of the non-shielded cables is connected to a contact of the connector via a conductor of the relay substrate.

6. The cable connector according to any one of claims 1 to 3, wherein the relay substrate also has a GND conductor layer on the back surface side, the contact of the connector, the shielded cable, and the GND conductor layer are configured so as to be mirror-symmetric with the surface side.

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