Multi-NIC compatible double-layer rack

Abstract

The present invention discloses a multi-network card compatible double-layer rack, belonging to the technical field of double-layer racks. The multi-network card compatible double-layer rack comprises a network card frame, a network card connector assembly, a PCIe card frame and a PCIe adapter card. The network card frame is used to assemble network cards, and comprises a first long guide rail, a second side guide rail assembly and a short guide rail. The first long guide rail is fixed to one side of the network card frame. The second side guide rail assembly comprises a second long guide rail, and the second long guide rail and the short guide rail can be selectively assembled on the other side of the network card frame. The network card connector assembly is arranged in the network card assembly space for electrically connecting the network card. The PCIe card frame is fixed to the network card frame for assembling the PCIe card. The PCIe adapter card is arranged in the PCIe assembly space for electrically connecting the PCIe card. The network card frame selectively assembles the LFFOCP network card, the LFF smart network card or the SFFOCP network card by combining the first long guide rail with the second side guide rail assembly or the short guide rail.

Description

Technical Field

[0001] The invention relates to the technical field of double-layer racks, and in particular to a multi-network card compatible double-layer rack. Background Art

[0002] Data Processing Units (DPU) are auxiliary computing devices used with servers or storage devices. Generally speaking, they can be divided into two types: I / O adapter cards and computing storage devices. The types of I / O adapter cards are mainly in the form of expansion adapter cards, while computing storage devices are mainly 2.5-inch SSDs or PCIe SSD cards, each with different application directions and characteristics.

[0003] As mentioned above, I / O adapter cards can be divided into smart network cards, server offload processors, computing storage controllers and other types. Regardless of the type, it is basically a PCIe adapter card with a built-in embedded computing unit and high-speed network port, and can also be regarded as a network card with accelerated computing function. Therefore, in addition to basic network transmission purposes, it can also provide computing offload services. On the other hand, computing storage controllers are equipped with embedded computing units and SSDs, so they can provide computing offload services and storage functions at the same time.

[0004] In recent years, due to the rapid development of DPU, there are more and more products and related applications due to its excellent effect. Therefore, existing 2U servers usually use DPU to improve computing or storage capabilities. However, since the needs of each user are different, the current DPU products are usually based on FHHL PCIe to match LFF OCP+, LFFSmart NIC1.0 or SFF with Pull Tab and other modules. However, this also leads to the need for actual manufacturing production to respond to different product development and design, and even to open multiple production lines, and it is impossible to flexibly switch different modules according to actual needs.

[0005] Therefore, it is urgent to provide a multi-network card compatible double-layer rack to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide a multi-network card compatible double-layer rack which can be flexibly compatible with a variety of network cards.

[0007] In order to achieve the above objectives, the following technical solutions are provided:

[0008] A multi-NIC compatible double-layer rack for assembling a PCIe card and a NIC, wherein the NIC is an LFF smart NIC, a LFFOCP NIC or an SFF OCP NIC, including:

[0009] A network card framework, used to assemble the network card, the network card framework comprising:

[0010] The network card frame body has a network card assembly space extending along a first assembly direction, wherein the network card assembly space has a first side edge and a second side edge that are oppositely arranged;

[0011] A first long guide rail, fixedly disposed on the first side;

[0012] A second side rail assembly, including a second long rail, for selectively assembling on the second side;

[0013] a short guide rail, for selectively being mounted on the second side;

[0014] A network card connector assembly, disposed in the network card assembly space, for electrically connecting the network card;

[0015] A PCIe card frame is fixedly connected to the network card frame and is stacked with the network card frame in a stacking direction perpendicular to the first assembly direction, and the PCIe card frame is provided with a PCIe assembly space, and the PCIe assembly space is used to assemble the PCIe card;

[0016] A PCIe adapter card, disposed in the PCIe assembly space and used for electrically connecting the PCIe card;

[0017] The multi-NIC compatible double-layer rack is configured such that when the NIC is the LFF OCP NIC, the second side guide rail assembly is fixed to the second side, so that the NIC is guided by the first long guide rail and the second long guide rail, enters the NIC assembly space along the first assembly direction, and is plugged into the NIC connector assembly; when the NIC is the LFF smart NIC or the SFF OCP NIC, the short guide rail is fixed to the second side, so that the NIC is guided by the first long guide rail and the short guide rail, enters the NIC assembly space along the first assembly direction, and is plugged into the NIC connector assembly.

[0018] As an optional solution for a multi-network card compatible double-layer rack, the second side guide rail assembly also includes a guide rail bracket and a metal guide rail head, the guide rail bracket is fixedly connected to the second side, the second long guide rail is fixedly connected to the guide rail bracket, and the metal guide rail head is fixed to the guide rail bracket and is located at the end of the second long guide rail, so that the network card enters the second long guide rail through the metal guide rail head.

[0019] As an optional solution for a multi-network card compatible double-layer rack, the network card assembly space is provided with a first connector assembly position and a second connector assembly position in sequence along the first assembly direction. When the network card is the LFF smart network card or the SFF OCP network card, the network card connector component is assembled at the first connector assembly position; when the network card is the LFF OCP network card, the network card connector component is assembled at the second connector assembly position.

[0020] As an optional solution for a multi-NIC compatible double-layer rack, the short guide rail extends from the front end of the short guide rail along the first assembly direction to the end of the short guide rail, and the first connector assembly position is arranged corresponding to the end of the short guide rail.

[0021] As an optional solution for a multi-NIC compatible double-layer rack, the first long guide rail extends from the front end of the first long guide rail along the first assembly direction to the end of the first long guide rail, and the second connector assembly position is set corresponding to the end of the first long guide rail.

[0022] As an optional solution for a multi-NIC compatible double-layer rack, the NIC connector assembly includes:

[0023] Three support studs are fixed to the network card assembly space at intervals from each other;

[0024] A 4C connector is clamped between two adjacent support studs;

[0025] A 4C+ connector is clamped between two other adjacent support studs, and the 4C+ connector and the 4C connector are arranged side by side in the first assembly direction;

[0026] The three fixing screws are respectively threaded on the three supporting studs, and the 4C connector and the 4C+ connector can be fixed between the three supporting studs and the three fixing screws.

[0027] As an optional solution for a multi-network card compatible double-layer rack, it also includes an SFF card bracket. When the network card is the SFF OCP network card, the SFF card bracket is used to be detachably connected to the network card assembly space, and the SFF card bracket has a side flange structure and a side guide rail structure that are relatively arranged. The side flange structure extends along the first assembly direction and cooperates with the first long guide rail. The side guide rail structure extends along the first assembly direction so that the SFF OCP network card is guided by the side guide rail structure and the short guide rail, enters the network card assembly space along the first assembly direction, and is plugged into the network card connector assembly.

[0028] As an optional solution for a multi-NIC compatible double-layer rack, the NIC frame body further includes:

[0029] Bottom frame;

[0030] A first side frame connected to one side of the bottom frame, and the first long guide rail is fixed to the first side frame;

[0031] a second side frame connected to the other side of the bottom frame relative to the first side frame, and the second side rail assembly is selectively fixed to the second side frame;

[0032] a rear top frame connected to one end of the first side frame and the second side frame;

[0033] Wherein, the bottom frame, the first side frame, the second side frame and the rear top frame are surrounded to form the network card assembly space.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] The multi-network card compatible double-layer rack provided by the present invention can be used for assembling PCIe cards and LFF smart network cards, LFFOCP network cards or SFF OCP network cards, wherein the network card frame is provided with a network card assembly space extending along a first assembly direction, and the two opposite sides of the network card assembly space are respectively a first side and a second side, a first long guide rail is installed on the first side, and a second side guide rail assembly or a short guide rail can be selectively installed on the second side. The network card frame selectively assembles LFF OCP network cards, LFF smart network cards or SFFOCP network cards through a combination of the first long guide rail and the second side guide rail assembly or the short guide rail, so that the multi-network card compatible double-layer rack is flexibly compatible with a variety of network cards, and there is no need to redevelop and design for different products, or even open multiple production lines. The multi-network card compatible double-layer rack can flexibly switch different modules according to actual needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0037] Figure 1 It is a three-dimensional schematic diagram showing individual components of a multi-NIC compatible double-layer rack according to an embodiment of the present invention;

[0038] Figure 2 A perspective exploded schematic diagram of a multi-NIC compatible double-layer rack selectively assembled with short guide rails provided in a first preferred embodiment of the present invention;

[0039] Figure 3 A three-dimensional schematic diagram of a multi-network card compatible double-layer rack selectively assembled with short guide rails provided in a first preferred embodiment of the present invention;

[0040] Figure 4 A three-dimensional exploded schematic diagram of a multi-NIC compatible double-layer rack provided in the first preferred embodiment of the present invention for assembling an LFF smart NIC and a PCIe card;

[0041] Figure 5 A three-dimensional exploded schematic diagram of a multi-NIC compatible double-layer rack provided in a first preferred embodiment of the present invention for assembling an SFF OCP NIC and a PCIe card;

[0042] Figure 6 A perspective exploded schematic diagram of a multi-NIC compatible double-layer rack selectively assembled with a second side rail assembly provided in a second preferred embodiment of the present invention;

[0043] Figure 7 A three-dimensional schematic diagram of a multi-NIC compatible double-layer rack selectively assembled with a second side rail assembly provided in a second preferred embodiment of the present invention;

[0044] Figure 8 A three-dimensional exploded schematic diagram of a multi-NIC compatible double-layer rack provided in a second preferred embodiment of the present invention for assembling an LFF OCP NIC and a PCIe card;

[0045] Fig. 9 This is a three-dimensional schematic diagram of a multi-NIC compatible double-layer rack provided in a second preferred embodiment of the present invention using a snap fastener to fix an LFF OCP NIC in a NIC assembly space.

[0046] Reference numerals:

[0047] 100, 100a, 100b, 100c, multi-network card compatible double-layer rack; 200, PCIe card; 300, 400, 500, network card; 501, network card body; 502, buckle;

[0048] 1. Network card frame; 2. Network card connector assembly; 3. PCIe card frame; 4. PCIe adapter card; 5. SFF card bracket; 51. Side flange structure; 52. Side guide structure;

[0049] 11. Network card frame body; 111. Bottom frame; 112. First side frame; 113. Second side frame; 114. Rear top frame; 12. First long guide rail; 13. Second side guide rail assembly; 131. Guide rail bracket; 132. Second long guide rail; 133. Metal guide rail head; 14. Short guide rail; 15. Baffle;

[0050] 21. Support studs; 22. 4C connector; 23. 4C+ connector; 24. Fixing screws;

[0051] S1, network card assembly space; S11, first side; S12, second side;

[0052] S2, PCIe assembly space; P1, first connector assembly position; P2, second connector assembly position; D1, first assembly direction; D2, stacking direction; D3, second assembly direction. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0054] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0056] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or are the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0057] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0059] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0060] Existing DPU products have multiple functional orientations, and therefore their combination types are diverse. As a result, actual production and manufacturing requires development and design for different products, and even the establishment of multiple production lines. This is very inflexible and cannot flexibly adjust the type of DPU products to meet customer needs.

[0061] In order to be flexible and compatible with multiple network cards, this embodiment provides a multi-network card compatible double-layer rack. Figures 1 to 9 The specific contents of this embodiment are described in detail.

[0062] See also Figure 1 , Figure 1 1 is a three-dimensional schematic diagram showing individual components of the multi-network card compatible double-layer rack of the present invention. Figure 1 As shown, the multi-NIC compatible double-layer rack 100 in the present invention includes a NIC frame 1, a NIC connector assembly 2, a PCIe card frame 3, and a PCIe adapter card 4. The first assembly direction D1, the stacking direction D2, and the second assembly direction D3 are perpendicular to each other. The NIC frame 1 includes a NIC frame body 11, a first long guide rail 12, a second side guide rail assembly 13, and a short guide rail 14.

[0063] The network card frame body 11 includes a bottom frame 111, a first side frame 112, a second side frame 113 and a rear top frame 114. The bottom frame 111 extends along the first assembly direction D1. The first side frame 112 is connected to one side of the bottom frame 111, and the second side frame 113 is connected to the other side of the bottom frame 111 relative to the first side frame 112, and the first side frame 112 and the second side frame 113 both extend along the first assembly direction D1. The rear top frame 114 is connected to one end of the first side frame 112 and the second side frame 113.

[0064] Furthermore, the bottom frame 111, the first side frame 112, the second side frame 113 and the rear top frame 114 are arranged to form a network card assembly space S1 extending along the first assembly direction D1, and the network card assembly space S1 has a first side edge S11 and a second side edge S12 which are arranged opposite to each other; wherein, the first side edge S11 is close to the first side frame 112, and the second side edge S12 is close to the second side frame 113.

[0065] Furthermore, the first long guide rail 12 is fixed to the first side frame 112 by screwing and is disposed on the first side S11, and the first long guide rail 12 extends from the front end (not shown) to the end (not shown) of the long guide rail along the first assembly direction D1.

[0066] The second side rail assembly 13 includes a rail bracket 131 (indicated at Figure 6 ), the second long guide rail 132 (marked at Figure 6 ) and the metal rail head 133 (indicated at Figure 6 The guide rail bracket 131 is used to be locked and connected to the second side frame 113 and fixed to the second side S12. The second long guide rail 132 is locked and connected to the guide rail bracket 131. The metal guide rail head 133 is locked and connected to the guide rail bracket 131 and is close to the end of the second long guide rail 132. The second side guide rail assembly 13 is used to be selectively assembled on the second side S12.

[0067] The short guide rail 14 extends from a front end (not shown) of the short guide rail to a rear end (not shown) of the short guide rail along the first assembly direction D1 , and the short guide rail 14 is also used for selectively being assembled to the second side S12 .

[0068] Furthermore, in actual use, the second side S12 can only be installed with one of the second side guide rail assembly 13 and the short guide rail 14, but the second side guide rail assembly 13 and the short guide rail 14 cannot be assembled on the second side S12 at the same time.

[0069] In addition, the network card assembly space S1 is sequentially provided with a first connector assembly position P1 and a second connector assembly position P2 along the first assembly direction D1. The first connector assembly position P1 is close to the end of the short guide rail (not shown), and the second connector assembly position P2 is close to the end of the second long guide rail.

[0070] The network card connector assembly 2 includes three support studs 21 (only one is marked in the figure), a 4C connector 22, a 4C+ connector 23 and three fixing screws 24 (only one is marked in the figure). The three support studs 21 are fixed to the first connector assembly position P1 or the second connector assembly position P2 of the network card assembly space S1 at intervals from each other. The 4C connector 22 is fixed between two adjacent ones of the support studs 21, and the 4C+ connector 23 is fixed between two adjacent ones of the support studs 21 relative to the outside of the 4C connector 22. Among them, the 4C+ connector 23 and the 4C connector 22 are arranged side by side in the first assembly direction D1. The three fixing screws 24 are respectively screwed to the three support studs 21 to fix the 4C connector 22 and the 4C+ connector 23 between the support studs 21 and the fixing screws 24. In addition, in this embodiment, the 4C connector 22 and the 4C+ connector 23 refer to connectors with dimensions that meet the SFF-TA-1002 standard.

[0071] The PCIe card frame 3 is fixed to the network card frame 1 and is arranged in a stacking direction D2 (indicated by Figure 3 ) and the network card frame 1 are stacked one above the other, and the PCIe card frame 3 has a PCIe assembly space S2 (marked at Figure 3 ). The PCIe adapter card 4 is disposed in the PCIe assembly space S2.

[0072] Please continue reading Figures 2 to 4 , Figure 2 A perspective exploded schematic diagram of a multi-NIC compatible double-layer rack selectively assembled with short guide rails provided in a first preferred embodiment of the present invention; Figure 3 A three-dimensional schematic diagram showing a multi-NIC compatible double-layer rack provided by a first preferred embodiment of the present invention selectively assembling short guide rails;

[0073] Figure 4 A three-dimensional exploded schematic diagram showing a multi-NIC compatible double-layer rack provided by a first preferred embodiment of the present invention for assembling LFF smart NICs and PCIe cards.

[0074] like Figures 1 to 4 As shown, the multi-NIC compatible double-layer rack 100a in this embodiment is formed by selectively assembling the short guide rail 14 of the multi-NIC compatible double-layer rack 100, so the multi-NIC compatible double-layer rack 100a is substantially the same as the multi-NIC compatible double-layer rack 100, except that the second side guide rail assembly 13 of the multi-NIC compatible double-layer rack 100a is placed separately and is not selected to be assembled on the second side S12.

[0075] Further, in this embodiment, the PCIe card 200 can enter the PCIe assembly space S2 along a second assembly direction D3 perpendicular to the first assembly direction D1, and be plugged into the PCIe adapter card 4, so that the PCIe card 200 is electrically connected to the PCIe adapter card 4. In addition, the PCIe card 200 in this embodiment refers to a FHHL (full height half length) PCIe card.

[0076] On the other hand, the multi-NIC compatible double-layer rack 100a in this embodiment is used to assemble the NIC 300, and the NIC 300 is the LFF smart NIC in this embodiment; wherein, since when the LFF smart NIC (i.e., the NIC 300) enters the NIC assembly space S1 along the first assembly direction D1, the length of the LFF smart NIC will only reach the first connector assembly position P1, so the multi-NIC compatible double-layer rack 100a in this embodiment installs the NIC connector assembly 2 at the first connector assembly position P1, and fixes the short guide rail 14 to the second side S12, so that the short guide rail 14 can extend to the first connector assembly position P1 in the NIC assembly space S1 along the first assembly direction D1, so that when the NIC 300 enters the NIC assembly space S1 along the first assembly direction D1 through the cooperation of the first long guide rail 12 and the short guide rail 14, the 4C connector 22 and the 4C+ connector 23 connected to the NIC connector assembly 2 can be plugged into the first connector assembly position P1.

[0077] In addition, since the height of the network card 300 in the stacking direction D2 is only about half of the network card assembly space S1, the network card frame 1 in this embodiment also includes a baffle 15, which is fixed between the first side frame 112 and the second side frame 113 and connected to the PCIe card frame 3.

[0078] Please continue reading Figure 5 , Figure 5 It is a three-dimensional exploded schematic diagram showing a multi-NIC compatible double-layer rack provided by a first preferred embodiment of the present invention for assembling SFF OCP NICs and PCIe cards.

[0079] like Figures 1 to 5 As shown, in addition to providing a multi-NIC compatible double-layer rack 100a for the installation of the LFF smart NIC 300, this embodiment can also provide a multi-NIC compatible double-layer rack 100b for the assembly of another NIC 400; wherein the multi-NIC compatible double-layer rack 100a and the multi-NIC compatible double-layer rack 100b are similar in structure, and the only difference is that the multi-NIC compatible double-layer rack 100b also includes an SFF card bracket 5, so that the smaller NIC 400 can be installed smoothly.

[0080] Furthermore, the network card 400 is an SFF OCP network card, and the SFF card bracket 5 has a side flange structure 51 and a side guide rail structure 52 that are relatively arranged. The side flange structure 51 cooperates with the first long guide rail 12, and the side flange structure 51 can slide relative to the first long guide rail 12, so that the SFF card bracket 5 can enter the network card assembly space S1 along the first assembly direction D1 and be fixed in the network card assembly space S1. After the SFF card bracket 5 is fixed in the network card assembly space S1, the side guide rail structure 52 can enter the network card assembly space S1 along the first assembly direction D1 through the cooperation of the side guide rail structure 52 and the short guide rail 14, so that the network card 400 can be plugged and connected to the 4C+ connector 23 at the first connector assembly position P1.

[0081] Please continue reading Figures 6 to 8 , Figure 6 is a perspective exploded schematic diagram showing a multi-NIC compatible double-layer rack provided by a second preferred embodiment of the present invention, wherein the second side rail assembly is selectively assembled; Figure 7 is a three-dimensional schematic diagram showing the selective assembly of the second side rail assembly of the multi-NIC compatible double-layer rack provided by the second preferred embodiment of the present invention; Figure 8 It is a three-dimensional exploded schematic diagram showing a multi-NIC compatible double-layer rack provided by a second preferred embodiment of the present invention for assembling an LFF OCP NIC and a PCIe card.

[0082] like Figure 1 , Figure 6 , Figure 7 and Figure 8 As shown, the multi-NIC compatible double-layer rack 100c in this embodiment is formed by selectively assembling the second side rail assembly 13 of the multi-NIC compatible double-layer rack 100. Therefore, the multi-NIC compatible double-layer rack 100c is substantially the same as the multi-NIC compatible double-layer rack 100, except that the short rail 14 of the multi-NIC compatible double-layer rack 100c is placed separately and is not selectively assembled on the second side S12.

[0083] Further, in this embodiment, the network card assembly space S1 can be used for assembling the network card 500, and the network card 500 is a LFFOCP network card. Among them, since the LFF OCP network card (i.e., the network card 500) will reach the second connector assembly position P2 when entering the network card assembly space S1 along the first assembly direction D1, the multi-network card compatible double-layer rack 100c of this embodiment is to install the network card connector assembly 2 at the second connector assembly position P2, and fix the second side rail assembly 13 to the second side S12, so that the second side rail assembly 13 can extend to the second connector assembly position P2 in the network card assembly space S1 along the first assembly direction D1, so that when the network card 500 enters the network card assembly space S1 along the first assembly direction D1 through the cooperation of the first long rail 12 and the second side rail assembly 13, the 4C connector 22 and the 4C+ connector 23 connected to the network card connector assembly 2 can be plugged in the second connector assembly position P2.

[0084] Please continue reading Fig. 9 , Fig. 9 FIG. 1 is a three-dimensional schematic diagram showing that the multi-NIC compatible double-layer rack provided by the second preferred embodiment of the present invention uses a buckle to fix the LFF OCP NIC in the NIC assembly space. Figure 1 as well as Figures 6 to 9 As shown, in the present embodiment, the network card 500 further includes a network card body 501 and a fastener 502. The network card body 501 can enter the network card assembly space S1 along the first assembly direction D1 through the cooperation of the first long guide rail 12 and the second side guide rail assembly 13. After the network card body 501 enters the network card assembly space S1, the fastener 502 can first be clamped against the metal guide rail head 133 of the second side guide rail assembly 13, and then the fastener 502 can be moved toward the network card body 501 with the metal guide rail head 133 as a fulcrum. After that, the other end of the fastener 502 relative to the metal guide rail head 133 is locked on the network card body 501, so that the network card body 501 can be fixed in the network card assembly space S1.

[0085] Furthermore, since the network card 500 is an LFF OCP network card, which is heavy, a metal guide rail head 133 is required to support the stress of the fastener 502 when it is fastened. Compared with the second long guide rail 132 which is generally made of plastic and has limited ability to withstand stress, the use of a metal guide rail head 133 to support the fastener 502 in this embodiment can effectively improve the stability of the network card 500 fixed in the network card assembly space S1.

[0086] In summary, compared with the DPU products of the prior art, which often need to be developed and designed for different products, and even multiple production lines are opened, there is a great lack of flexible adjustment space. The multi-NIC compatible double-layer rack 100 of the present invention mainly provides a combination of a NIC frame 1 and a PCIe card frame 3, so that the PCIe card frame 3 can be assembled with a PCIe card 200, and the NIC frame 1 utilizes the second side guide rail assembly 13 with a second long guide rail 132 and the selective use of the short guide rail 14 to cooperate with the first long guide rail 12, and then when the combination of the second long guide rail 132 and the first long guide rail 12 is used, it can be used to install an LFF OCP NIC, and when the combination of the short guide rail 14 and the first long guide rail 12 is used, it can be used to install an LFF smart NIC or an SFF OCP NIC; therefore, the multi-NIC compatible double-layer rack of the present invention can effectively adjust the configuration of components according to user needs, and then assemble an LFF smart NIC, an LFF OCP NIC or an SFF OCP NIC, effectively increasing the convenience of use.

[0087] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A multi-NIC compatible double-layer rack, used for assembling a PCIe card (200) and a NIC, wherein the NIC is an LFF smart NIC, an LFF OCP NIC or an SFF OCP NIC, characterized in that: include: A network card frame (1), used for assembling the network card, the network card frame (1) comprising: A network card frame body (11) has a network card assembly space (S1) extending along a first assembly direction (D1), wherein the network card assembly space (S1) has a first side edge (S11) and a second side edge (S12) arranged opposite to each other; A first long guide rail (12) fixedly arranged on the first side edge (S11); A second side guide rail assembly (13), comprising a second long guide rail (132), configured to be selectively assembled on the second side (S12); A short guide rail (14) for selectively being installed on the second side (S12); A network card connector assembly (2), arranged in the network card assembly space (S1), and used for electrically connecting the network card; A PCIe card frame (3) is fixedly connected to the network card frame (1) and is stacked with the network card frame (1) in a stacking direction (D2) perpendicular to the first assembly direction (D1), and the PCIe card frame (3) is provided with a PCIe assembly space (S2), and the PCIe assembly space (S2) is used to assemble the PCIe card (200); A PCIe adapter card (4), arranged in the PCIe assembly space (S2) and used for electrically connecting the PCIe card (200); The multi-NIC compatible double-layer rack is configured such that when the NIC is the LFF OCP NIC, the second side guide rail assembly (13) is fixed to the second side (S12), so that the NIC is guided by the first long guide rail (12) and the second long guide rail (132), enters the NIC assembly space (S1) along the first assembly direction (D1), and is plugged into the NIC connector assembly (2); when the NIC is the LFF smart NIC or the SFF OCP NIC, the short guide rail (14) is fixed to the second side (S12), so that the NIC is guided by the first long guide rail (12) and the short guide rail (14), enters the NIC assembly space (S1) along the first assembly direction (D1), and is plugged into the NIC connector assembly (2).

2. The multi-NIC compatible double-layer rack according to claim 1, characterized in that: The second side rail assembly (13) further comprises a rail bracket (131) and a metal rail head (133); the rail bracket (131) is fixedly connected to the second side (S12); the second long rail (132) is fixedly connected to the rail bracket (131); the metal rail head (133) is fixed to the rail bracket (131) and is located at the end of the second long rail (132) so that the network card enters the second long rail (132) via the metal rail head (133).

3. The multi-NIC compatible double-layer rack according to claim 1, characterized in that: The network card assembly space (S1) is provided with a first connector assembly position (P1) and a second connector assembly position (P2) in sequence along the first assembly direction (D1); when the network card is the LFF smart network card or the SFF OCP network card, the network card connector component (2) is assembled at the first connector assembly position (P1); when the network card is the LFF OCP network card, the network card connector component (2) is assembled at the second connector assembly position (P2).

4. The multi-NIC compatible double-layer rack according to claim 3, characterized in that: The short guide rail (14) extends from the front end of the short guide rail (14) along the first assembly direction (D1) to the end of the short guide rail (14), and the first connector assembly position (P1) is arranged corresponding to the end of the short guide rail (14).

5. The multi-NIC compatible double-layer rack according to claim 3, characterized in that: The first long guide rail (12) extends from the front end of the first long guide rail (12) along the first assembly direction (D1) to the end of the first long guide rail (12), and the second connector assembly position (P2) is arranged corresponding to the end of the first long guide rail (12).

6. The multi-NIC compatible double-layer rack according to claim 1, characterized in that: The network card connector component (2) comprises: Three supporting studs (21) are fixed to the network card assembly space (S1) at intervals from each other; A 4C connector (22) is clamped between two adjacent support studs (21); A 4C+ connector (23) is clamped between two other adjacent support studs (21), and the 4C connector (22) and the 4C+ connector (23) are arranged side by side in the first assembly direction (D1); The three fixing screws (24) are respectively screwed on the three supporting studs (21), and the 4C connector (22) and the 4C+ connector (23) can be fixed between the three supporting studs (21) and the three fixing screws (24).

7. The multi-NIC compatible double-layer rack according to claim 1, characterized in that: The invention also comprises an SFF card bracket (5). When the network card is the SFF OCP network card, the SFF card bracket (5) is used to be detachably connected to the network card assembly space (S1), and the SFF card bracket (5) has a side flange structure (51) and a side guide rail structure (52) arranged opposite to each other. The side flange structure (51) extends along the first assembly direction (D1) and cooperates with the first long guide rail (12). The side guide rail structure (52) extends along the first assembly direction (D1), so that the SFF OCP network card is guided by the side guide rail structure (52) and the short guide rail (14), enters the network card assembly space (S1) along the first assembly direction (D1), and is plugged into the network card connector component (2).

8. The multi-NIC compatible double-layer rack according to claim 1, characterized in that: The network card frame (1) body also includes: Bottom frame (111); A first side frame (112) connected to one side of the bottom frame (111), and the first long guide rail (12) is fixed to the first side frame (112); A second side frame (113) connected to the other side of the bottom frame (111) relative to the first side frame (112), and the second side guide rail assembly (13) is selectively fixed to the second side frame (113); A rear top frame (114) connected to one end of the first side frame (112) and the second side frame (113); The bottom frame (111), the first side frame (112), the second side frame (113) and the rear top frame (114) are arranged to form the network card assembly space (S1).

Images