Stamping tool holding device, stamping tool positioning device, multi-element transmission device and component array manufacturing method

Abstract

The present invention provides a punching tool holding device that can keep the punching surface of the punching tool clean and hold the punching tool, a punching tool positioning device that can easily position the punching tool relative to a conveying head, a multi-element conveying device for efficiently conveying conveying elements such as components using a punching tool, and a method for manufacturing an element array using them. A punching tool holding device (80) has a setting table (82) on which a punching tool (10) is freely mounted and unmounted. The setting table (82) has a setting surface (84) formed with a storage recess (86) for accommodating a punching layer (12) for accommodating the punching tool (10), and a suction hole (85) is formed on the setting surface (84) for freely and removably adsorbing a portion of the punching tool (10) located around the punching layer (12).

Description

Technical Field

[0001] The present invention relates to a stamp tool holding device, a stamp tool positioning device, a multi-element conveying device and a method for manufacturing a component array. Background Art

[0002] In the transportation of extremely small parts, the use of a stamping-shaped transportation tool (punching tool) having a plurality of convex portions on the surface is studied. An example of such a stamping-shaped transportation tool is disclosed in the following patent document 1. In the past, there has been disclosed a stamping tool for enabling the detachment of the transportation object due to thermal expansion (coefficient of thermal expansion).

[0003] An example of an extremely small component that is assumed to be handled by a punching tool is an LED component called a miniature LED or a micro LED. The so-called miniature LED or micro LED refers to a component that is extremely small, with a width of 1 to 8 μm, a length of 5 to 10 μm, and a height of 0.5 to 3 μm, compared to existing general LED components.

[0004] As is also known in the prior art, components are picked up from a wafer on which a plurality of such LED components are arranged and transported to a substrate corresponding to a display, thereby manufacturing an LED display. However, an apparatus and method for efficiently conveying transport object elements such as components using a stamping tool is required.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: U.S. Patent Publication No. 2017 / 0173852A1 Summary of the invention

[0008] Problems to be solved by the invention

[0009] The present invention has been completed in view of this actual situation, and its purpose is to provide a stamping tool holding device that can keep the stamping surface of the stamping tool clean and hold the stamping tool, a stamping tool positioning device that can easily position the stamping tool relative to a conveying head, a multi-element conveying device for efficiently conveying conveying object elements such as components using a stamping tool, and a manufacturing method for a component array using them.

[0010] Technical means of solving problems

[0011] In order to achieve the above-mentioned object, the punching tool holding device of the present invention is a punching tool holding device having a setting table on which a punching tool having a punching layer is freely installed, and the punching layer has a part to which an element of a conveying object can be freely installed and installed.

[0012] The installation table includes an installation surface having a storage recess for storing the punching layer, and a suction hole for detachably sucking a part of the punching tool located around the punching layer is formed on the installation surface.

[0013] In the punching tool holding device of the present invention, negative pressure is introduced into the suction hole while the punching layer is stored in the storage recess, thereby a part of the punching tool is adsorbed to the setting surface in a detachable manner. As a result, the inside of the storage recess is sealed, and it is difficult for impurities or dust to adhere to the punching surface of the punching layer stored in the storage recess, so that the punching surface can be kept clean in advance and the punching tool can be set.

[0014] Preferably, the setting table is fixed to the base so that it can be freely loaded and unloaded. The stamping tool needs to be replaced in accordance with the customer's requirements or the substrate (the substrate can also be a thin sheet / the same below) on which the components as the elements of the conveying object are made. In order to cooperate with the change of the stamping tool, multiple setting tables are prepared in advance, thereby, only the setting tables are replaced without replacing the base, thereby corresponding to the size change of the stamping tool, etc. In addition, the flatness of each setting table relative to the base is preferably ensured, and there is no need to adjust the flatness even when the stamping tool is replaced.

[0015] Preferably, the setting table is provided with a gas flow hole connected to the space in the storage recess so as to replace the gas in the storage recess. By replacing the gas in the recess, impurities or dust attached to the surface of the stamping layer stored in the storage recess can be discharged together with the gas, thereby improving the cleanliness of the stamping layer.

[0016] A guide mechanism for guiding at least along the first axis is installed on the upper part of the setting table so that the stamping layer of the stamping tool falls into the interior of the storage recess. The guide mechanism is provided on the setting table, thereby making it easy to roughly position the stamping tool at least along the first axis (which may also include the second axis). In addition, when the stamping tool is picked up by the transport head, it is also easy to position the stamping tool relative to the transport head.

[0017] Preferably, the guide mechanism has a plurality of guide members that are detachably mounted on both sides of the setting table along the first axis, and each of the guide members is formed with an inclined surface that can be engaged with the tapered surface of the punching tool. By configuring in this way, it becomes easier to roughly position the punching tool at least along the first axis (which may also include the second axis). In addition, when the punching tool is picked up by the transport head, it becomes easier to position the punching tool relative to the transport head.

[0018] Preferably, at least two guide members are installed on both sides of the setting table along the first axis, and the claws of the chuck mechanism (also referred to as the clamp mechanism / the same below) can be inserted along the gap between the two guide members. By configuring in this way, high-precision positioning of the punching tool at least along the first axis (and also including the second axis) can be performed. In addition, when the punching tool is picked up by the transport head, the positioning of the punching tool relative to the transport head (especially positioning along the first axis) can also be performed with higher precision.

[0019] Preferably, there is also a pair of positioning members arranged on both sides of the setting table along the second axis direction, which can abut against and separate from the edge of the punching tool set on the upper part of the setting table. By configuring in this way, in addition to the first axis, high-precision positioning of the punching tool along the second axis can be performed. In addition, when the punching tool is picked up by the transport head, it is also easier to position the punching tool relative to the transport head.

[0020] A method for manufacturing an element array according to a first aspect of the present invention comprises:

[0021] A step of picking up the punching tool held by any of the punching tool holding devices described above by a handling head; and

[0022] A step of simultaneously taking out and conveying a plurality of conveyance target elements from a substrate using a punching tool attached to the conveyance head.

[0023] In the device array manufacturing method according to the first aspect of the present invention, a device array including a plurality of devices can be manufactured easily, in a short time, and at low cost.

[0024] A method for manufacturing an element array according to a second aspect of the present invention comprises:

[0025] A step of preparing any one of the above-mentioned press tool holding devices in a number equal to or greater than the number of substrates on which the plurality of types of components as the conveying target elements are arranged;

[0026] A process of providing a punching tool for each of the plurality of types of components in each of the punching tool holding devices;

[0027] The process of picking up the punching tools held by the punching tool holding devices corresponding to the respective substrates from the punching tool holding devices by a transport head, and taking out and transporting a plurality of the components at the same time from the substrate corresponding to the picked-up punching tools using the punching tools mounted on the transport head; and

[0028] A step of simultaneously taking out a plurality of components and conveying them, and returning the press tool from which the plurality of components have been taken out to the corresponding press tool holding device.

[0029] In the manufacturing method of the element array of the second aspect of the present invention, an element array in which multiple types of elements are arranged can be manufactured easily, in a short time and at a low cost. Moreover, the punching tools used for each substrate corresponding to the multiple types of elements are placed in a dedicated punching tool holding device for storage, so that errors in the arrangement of the elements can be effectively prevented, and the cleanliness of the punching surface of each punching tool can be easily maintained at a high quality.

[0030] Preferably, the punching tool has:

[0031] The punching layer has a portion to which the element to be transported can be attached and detachably attached;

[0032] a support plate, to which the stamping layer is fixed; and

[0033] The joining plate has a mounting surface on which the support plate is replaceably mounted and on which the transport head is detachably mounted.

[0034] In this stamping tool, only the support plate to which the stamping layer is fixed can be replaced from the joint plate without replacing the entire stamping tool. Therefore, it becomes easy to prepare stamping tools with different types of stamping layers at a low cost. In addition, even if the size of the stamping layer or the size of the support plate is changed, it becomes easy to unify the size of the joint plate, and it becomes easy to share the handling head or the setting table. In addition, the stamping layer is fixed to the support plate, so it is easy to ensure the flatness of the stamping surface of the stamping layer.

[0035] Preferably, the support plate is replaceably mounted on the joining plate via an adhesive layer. By using the adhesive layer, the support plate can be easily replaceably mounted on the joining plate, and the flatness of the support plate, that is, the flatness of the punching surface of the punching layer, can be easily ensured.

[0036] Preferably, the transport object elements are multiple components formed on the surface of the substrate, multiple protrusions corresponding to the components are formed on the stamping layer, and the components are detachably adhered to each protrusion. With this structure, it is easy to simultaneously take out multiple components as multiple transport object elements from the substrate and copy or install them.

[0037] Preferably, the support plate has a glass plate or a ceramic plate with a flat surface. By forming it in this way, it is easy to ensure the flatness of the support plate, that is, the flatness of the stamping surface of the stamping layer. In addition, especially when the support plate is formed by a glass plate, it is easy to form an adsorbable surface around the stamping layer.

[0038] Preferably, a tapered surface whose outer diameter decreases toward the support plate is formed on the side of the joining plate. The claw of the clamp mechanism can be detachably engaged with the tapered surface formed on the side of the joining plate. In addition, the mounting force of the punching tool relative to the conveying head caused by the clamp mechanism can be increased. Furthermore, along the inclined surface of the guide member for the punching tool provided on the upper part of the setting table, the positioning of the punching tool becomes easy.

[0039] Preferably, the maximum width of the joining plate is made larger than the width of the supporting plate. With such a configuration, the inclined surface of the guide member and the tapered surface of the press tool become easily engaged.

[0040] Preferably, the surface of the support plate on the side of the joining plate has an insertable surface opposite to the tapered surface of the joining plate. The existence of the insertable surface on the support plate of the punching tool allows the claw of the clamp mechanism to be easily and detachably engaged with the tapered surface of the side of the joining plate.

[0041] Preferably, an adsorbable surface is formed on the surface of the support plate on the side of the stamping layer around the stamping layer. The support plate of the stamping tool has an adsorbable surface, so that the support plate can be adsorbed to the setting surface of the setting table for the stamping tool, and the stamping layer can be easily sealed and held inside the storage recess. The stamping layer in the storage recess is kept clean.

[0042] A spacer plate for adjusting the parallelism (flatness) of the support plate may be interposed between the punching layer and the joining plate. With such a configuration, the flatness of the support plate is improved, and the flatness of the punching surface is also improved.

[0043] The manufacturing method of the element array of the third aspect of the present invention has a step of using any of the above-mentioned punching tools to simultaneously remove and transport multiple transport object elements from a substrate. In the manufacturing method of the element array of the present invention, an element array having multiple elements can be easily manufactured in a short time and at a low cost.

[0044] In addition, in order to achieve the above-mentioned purpose, the punching tool positioning device of the present invention has:

[0045] A setting table is provided with a punching tool having a punching layer which is detachably provided thereon, wherein the punching layer has a portion to which a transport object element can be detachably adhered;

[0046] a transport head capable of picking up the punching tool disposed on the setting table;

[0047] a first axis positioning mechanism for positioning and adjusting the relative position of the punching tool relative to the handling head along the first axis; and

[0048] The second axis positioning mechanism positions and adjusts the relative position of the press tool with respect to the installation table along a second axis intersecting the first axis.

[0049] If it is assumed that the positioning of the punching tool along the first axis and the second axis is performed relative to all the transport heads, the positioning mechanism relative to the transport head becomes complicated. As a result, the drive control of the transport head becomes complicated, and there is a concern that the transport position accuracy caused by the transport head is reduced. In addition, if it is assumed that the positioning of the punching tool along the first axis and the second axis is performed relative to all the setting tables, the positioning mechanism in the setting table becomes complicated, and the necessary space for the setting table becomes larger, and the mobile control of the setting table also becomes difficult. In addition, the alignment of the setting table and the transport head also becomes complicated.

[0050] In the punch tool positioning device of the present invention, the positioning of the punch tool along the second axis can be performed using the second axis positioning mechanism with the setting table as the reference, and the positioning of the punch tool along the first axis can be performed using the first axis positioning mechanism with the transport head as the reference. Therefore, the positioning mechanism relative to the transport head becomes simple and light. As a result, the drive control of the transport head becomes easy, and the transport position accuracy caused by the transport head is improved.

[0051] In addition, in the punch tool positioning device of the present invention, the positioning of the punch tool along the second axis is performed relative to the setting table, but the correct positioning of the punch tool along the first axis is not required. Therefore, the positioning mechanism in the setting table becomes simple, and the necessary space of the setting table can be made the necessary minimum. Therefore, the movement control of the setting table is also easy. Furthermore, the alignment of the setting table and the transport head can be performed only along, for example, the second axis with high precision, and the alignment along the first axis can be rough. This is because the alignment of the punch tool along the first axis uses the transport head as a reference and is performed through the first positioning mechanism.

[0052] Preferably, the first shaft positioning mechanism also serves as a mounting mechanism for detachably mounting the press tool on the transport head. The mounting mechanism also serves as a positioning mechanism, thereby eliminating the need to provide the transport head with a positioning mechanism as a component other than the mounting mechanism.

[0053] The mounting mechanism is not particularly limited, but examples thereof include a chuck mechanism (hereinafter also referred to as a "clamp mechanism"), etc. The chuck mechanism is provided on opposite sides along the first axis of the conveying head and is provided to be movable in contact with and away from the punching tool.

[0054] Preferably, the second axis positioning mechanism has:

[0055] At least one pair of second positioning members are arranged on both sides of the installation table along the second axial direction and can abut against and separate from the press tool installed on the installation table.

[0056] By forming like this, the high-precision positioning of the punching tool along the second axis can be performed relative to the setting platform. In addition, when the punching tool is picked up by the conveying head, the positioning of the punching tool relative to the conveying head also becomes easier.

[0057] Preferably, the installation table has an installation surface having a housing recess for housing the punching layer, and a suction hole for detachably sucking a part of the punching tool located around the punching layer is formed on the installation surface.

[0058] By such a configuration, negative pressure is introduced into the suction hole in a state where the punching layer is stored in the storage recess, thereby a part of the punching tool is adsorbed to the setting surface in a detachable manner. As a result, the inside of the storage recess is sealed, and impurities and dust are difficult to adhere to the punching surface of the punching layer stored in the storage recess, so that the punching tool can be set while the punching surface is kept clean in advance.

[0059] Preferably, the setting table is fixed to the base so that it can be loaded and unloaded. The stamping tool needs to be replaced in accordance with the customer's requirements or the substrate (the substrate can also be a thin sheet / the same below) on which the components as the elements of the conveying object are made. In order to match the change of the stamping tool, multiple setting tables are prepared in advance, thereby, only the setting tables are replaced without replacing the base, so as to cope with the change of the size of the stamping tool. In addition, the flatness of each setting table relative to the base is preferably ensured, and there is no need to adjust the flatness even when the stamping tool is replaced.

[0060] Preferably, the setting table is provided with a gas flow hole connected to the space in the storage recess so as to replace the gas in the storage recess. By replacing the gas in the recess, impurities or dust attached to the surface of the stamping layer stored in the storage recess can be discharged together with the gas, thereby improving the cleanliness of the stamping layer.

[0061] Preferably, a guide mechanism for guiding the punching tool at least along the first axis is installed on the setting table. By providing the guide mechanism on the setting table, it becomes easy to roughly position the punching tool along the first axis. In addition, when the punching tool is picked up by the transport head, it becomes easy to position the punching tool with high precision along the first axis relative to the transport head.

[0062] Preferably, the guide mechanism has a plurality of guide members that are detachably mounted on both sides of the setting table along the first axis. Preferably, each of the guide members is formed with an inclined surface that can be engaged with the tapered surface of the punching tool. By configuring in this way, the rough positioning of the punching tool along the first axis becomes easier.

[0063] Preferably, at least two guide members are installed along the first axis on both sides of the setting table, and the first axis positioning mechanism is inserted along the gap between the two guide members and can abut against the punching tool. By configuring in this way, it is a simple structure, and high-precision positioning of the punching tool relative to the conveying head becomes easy.

[0064] The manufacturing method of the element array of the present invention comprises: a step of causing the punching tool positioned by any of the punching tool positioning devices described above to be transported by a transport head; and

[0065] A step of simultaneously taking out and conveying a plurality of conveyance target elements from a substrate using a punching tool attached to the conveyance head.

[0066] In the method for manufacturing an element array of the present invention, an element array having a plurality of elements positioned and arranged with high precision can be manufactured easily, in a short time, and at low cost.

[0067] Preferably, the punching tool has:

[0068] The punching layer has a portion to which the element to be transported can be attached and detachably attached;

[0069] a support plate, to which the stamping layer is fixed; and

[0070] The joining plate has a mounting surface on which the support plate is replaceably mounted and on which the transport head is detachably mounted.

[0071] In this stamping tool, only the support plate to which the stamping layer is fixed can be replaced from the joint plate without replacing the entire stamping tool. Therefore, it becomes easy to prepare stamping tools with different types of stamping layers at a low cost. In addition, even if the size of the stamping layer or the size of the support plate is changed, it becomes easy to unify the size of the joint plate, and it becomes easy to share the handling head or the setting table. In addition, the stamping layer is fixed to the support plate, so it is easy to ensure the flatness of the stamping surface of the stamping layer.

[0072] Preferably, the support plate is replaceably mounted on the joining plate via an adhesive layer. By using the adhesive layer, the support plate can be easily replaceably mounted on the joining plate, and the flatness of the support plate, that is, the flatness of the punching surface of the punching layer, can be easily ensured.

[0073] Preferably, the transport object elements are multiple components formed on the surface of the substrate, multiple protrusions corresponding to the components are formed on the stamping layer, and the components are detachably adhered to each protrusion. With this structure, it is easy to simultaneously take out multiple components as multiple transport object elements from the substrate and copy or install them.

[0074] Preferably, the support plate has a glass plate or a ceramic plate with a flat surface. By forming it in this way, it is easy to ensure the flatness of the support plate, that is, the flatness of the stamping surface of the stamping layer. In addition, especially when the support plate is formed by a glass plate, it is easy to form an adsorbable surface around the stamping layer.

[0075] Preferably, a tapered surface whose outer diameter decreases toward the support plate is formed on the side of the joining plate. The claw of the clamp mechanism can be detachably engaged with the tapered surface formed on the side of the joining plate. In addition, the mounting force of the punching tool relative to the conveying head caused by the clamp mechanism can be increased. Furthermore, along the inclined surface of the guide member for the punching tool provided on the upper part of the setting table, the positioning of the punching tool becomes easy.

[0076] Preferably, the maximum width of the joining plate is made larger than the width of the supporting plate. With such a configuration, the inclined surface of the guide member and the tapered surface of the press tool can be easily engaged.

[0077] Preferably, the surface of the support plate on the side of the joining plate has an insertable surface opposite to the tapered surface of the joining plate. The existence of the insertable surface on the support plate of the punching tool allows the claw of the clamp mechanism to be easily and detachably engaged with the tapered surface of the side of the joining plate.

[0078] Preferably, an adsorbable surface is formed on the surface of the support plate on the side of the stamping layer around the stamping layer. The support plate of the stamping tool has an adsorbable surface, so that the support plate can be adsorbed to the setting surface of the setting table for the stamping tool, and the stamping layer can be easily sealed and held inside the storage recess. The stamping layer in the storage recess is kept clean.

[0079] A spacer plate for adjusting the parallelism (flatness) of the support plate may be interposed between the punching layer and the joining plate. With such a configuration, the flatness of the support plate is improved, and the flatness of the punching surface is also improved.

[0080] In addition, in order to achieve the above-mentioned object, the multi-element transmission device of the present invention has:

[0081] A punching table, on which at least one punching tool having a punching layer is detachably provided, wherein the punching layer has a portion to which a plurality of transport object elements can be detachably adhered;

[0082] a handling head capable of picking up at least one of the punching tools disposed on the punching table;

[0083] a first table having a first substrate on the surface of which the transport target element is arranged, fixed detachably; and

[0084] a second table on which a second substrate having a surface on which the transport object element arranged on the first substrate is transported and transferred by the punching tool is detachably fixed;

[0085] The punching table and the first table are arranged along a first axis,

[0086] The first table and the second table are arranged along a second axis intersecting the first axis.

[0087] The conveying head is movable relative to at least the punching table along a third axis intersecting both the first axis and the second axis.

[0088] The punching tool has a mounting surface on which the transport head is detachably mounted on the opposite side of the punching layer.

[0089] The punching tool is mounted on the punching table in a manner that the mounting surface faces upward along the third axis.

[0090] The first table and the second table are relatively movable relative to the transport head at least along the second axis.

[0091] The press table is relatively movable with respect to the transport head at least along the first axis.

[0092] In the multi-element conveying device of the present invention, the punching tool is mounted on the punching table with the mounting surface facing upward along the third axis. Relative to the conveying head, the first table and the second table are relatively movable at least along the second axis, and relative to the conveying head, the punching table is relatively movable at least along the first axis.

[0093] Therefore, the conveying head can move relatively on the punching table, the first table, and the second table. In addition, the punching tool held by the conveying head can be used to simultaneously move a plurality of conveying object elements from the surface of the first substrate of the first table to the surface of the second substrate of the second table. In addition, the punching tool after moving the conveying object element from the first substrate to the second substrate returns to the original punching table using the conveying head. In this way, in the multi-element conveying device of the present invention, the conveying object elements such as components can be efficiently conveyed using the punching tool.

[0094] In addition, when transferring multiple types of components or other transfer target elements from the corresponding multiple first substrates to the single second substrate, the transfer target elements can be transferred using a different punching tool for each type. Therefore, it is easy to transfer different types of transfer target elements in a set arrangement to the single second substrate, and it is easy to efficiently manufacture a component array with fewer pixel defects, etc.

[0095] Preferably, the first substrate includes a plurality of element arrangement substrates on which the conveyance target elements of different types are arranged.

[0096] The second substrate is a single mounting substrate or a single replication substrate.

[0097] The press table includes a plurality of installation tables for detachably holding press tools corresponding to the plurality of element arrangement substrates.

[0098] Furthermore, preferably, in the multi-element transmission device,

[0099] The transport head further includes a control mechanism for driving and controlling the positional relationship between the transport head, the first table, the second table, and the punching table in the following manner:

[0100] Pick up the punching tools corresponding to the plurality of element configuration substrates from the corresponding setting table,

[0101] Using the picked-up punching tool, the transport object element is taken out from the corresponding element configuration substrate,

[0102] The taken-out transport element is moved to the second substrate.

[0103] By configuring in this way, when transferring multiple types of conveying target elements such as components from the corresponding multiple component arrangement substrates to the single second substrate, the conveying target elements can be transferred using a different punching tool for each type. Therefore, it is easier to transfer different types of conveying target elements in a set arrangement to the single second substrate, and it is easier to efficiently manufacture a component array with fewer pixel defects, for example.

[0104] Preferably, the multi-element conveying device further comprises a camera mechanism capable of simultaneously taking pictures in two directions, which can enter the space between the surface of the first substrate and the stamping layer of the stamping tool when the conveying head holding the stamping tool is located above the first substrate.

[0105] The imaging unit simultaneously images the pressing surface of the pressing layer and the surface of the first substrate.

[0106] Preferably, the multi-element conveying device further comprises a micro-adjustment mechanism for changing the relative position of the conveying head and the first substrate based on the detection signal captured by the camera mechanism. By adjusting the relative position of the conveying head and the first substrate by the micro-adjustment mechanism, the stamping layer of the stamping tool and the conveying object elements arranged on the surface of the first substrate can be correctly aligned, and a plurality of small-sized conveying object elements can be held with high precision on the stamping surface of the stamping layer.

[0107] The micro-adjustment mechanism can also change the relative rotation angle around the third axis of the transport head based on the detection signal captured by the imaging mechanism. With this configuration, the alignment between the stamping surface of the stamping layer and the transport object element arranged on the surface of the first substrate becomes more accurate.

[0108] Preferably, the multi-element transmission device has:

[0109] a first axis positioning mechanism for positioning and adjusting the relative position of the punching tool relative to the handling head along the first axis; and

[0110] The second axis positioning mechanism positions and adjusts the relative position of the press tool with respect to the press table along a second axis intersecting the first axis.

[0111] By forming in this way, the positioning of the punching tool along the second axis can be performed by using the punching table as a reference and the second axis positioning mechanism, and the positioning of the punching tool along the first axis can be performed by using the transport head as a reference and the first axis positioning mechanism. Therefore, the positioning mechanism relative to the transport head becomes simple and light. As a result, the drive control of the transport head becomes easy, and the transport position accuracy caused by the transport head is improved.

[0112] In addition, the positioning of the punching tool along the second axis is performed relative to the punching table, but the correct positioning of the punching tool along the first axis is not required. Therefore, the positioning mechanism of the punching table becomes simple, and the necessary space of the punching table can be made the necessary minimum. Therefore, the movement control of the punching table also becomes easy. Furthermore, the alignment of the punching table and the conveying head can be performed with high precision only along the second axis, for example, and the alignment along the first axis can be rough. This is because the alignment of the punching tool along the first axis uses the conveying head as a reference and is performed through the first positioning mechanism.

[0113] Preferably, the first shaft positioning mechanism also serves as a mounting mechanism for detachably mounting the press tool on the transport head. The mounting mechanism also serves as a positioning mechanism, thereby eliminating the need to provide the transport head with a positioning mechanism as a component other than the mounting mechanism.

[0114] The mounting mechanism is not particularly limited, but examples thereof include a chuck mechanism (clamp mechanism), etc. The chuck mechanism is provided on opposite sides along the first axis of the transport head, and is provided to be movable in contact with and away from the press tool.

[0115] Preferably, the second axis positioning mechanism has:

[0116] At least one pair of second positioning members are arranged on both sides along the second axis direction of a setting table fixed to the pressing table and can abut against and separate from the pressing tool set on the setting table.

[0117] By forming like this, can carry out the high-precision positioning of the punching tool along the 2nd axis with respect to setting table.In addition, when picking up the punching tool by the conveying head, the positioning of the punching tool with respect to the conveying head also becomes easier.

[0118] Preferably, the installation table has an installation surface having a housing recess for housing the punching layer, and a suction hole for detachably sucking a part of the punching tool located around the punching layer is formed on the installation surface.

[0119] By such a configuration, negative pressure is introduced into the suction hole in a state where the punching layer is stored in the storage recess, thereby a part of the punching tool is adsorbed to the setting surface in a detachable manner. As a result, the inside of the storage recess is sealed, and impurities and dust are difficult to adhere to the punching surface of the punching layer stored in the storage recess, so that the punching tool can be set while the punching surface is kept clean in advance.

[0120] Preferably, the setting table is fixed to a base fixed to the punching table so that it can be freely loaded and unloaded. The punching tool needs to be replaced in response to customer requirements or substrates with components as elements of the conveying object. In order to match the change of the punching tool, multiple setting tables are prepared in advance, so that only the setting tables can be replaced without replacing the base, so as to cope with the change of the size of the punching tool. In addition, each setting table is preferably ensured to have flatness relative to the base, so that there is no need to adjust the flatness even when the punching tool is replaced.

[0121] Preferably, the setting table is provided with a gas flow hole connected to the space in the storage recess so as to replace the gas in the storage recess. By replacing the gas in the recess, impurities or dust attached to the surface of the stamping layer stored in the storage recess can be discharged together with the gas, thereby improving the cleanliness of the stamping layer.

[0122] Preferably, a guide mechanism for guiding the punching tool at least along the first axis is installed on the setting table. By providing the guide mechanism to the setting table, it becomes easy to roughly position the punching tool along the first axis. In addition, when the punching tool is picked up by the transport head, it becomes easy to position the punching tool with high precision along the first axis relative to the transport head.

[0123] Preferably, the guide mechanism has a plurality of guide members that are detachably mounted on both sides of the setting table along the first axis. Preferably, each of the guide members is formed with an inclined surface that can be engaged with the tapered surface of the punching tool. By configuring in this way, the rough positioning of the punching tool along the first axis becomes easier.

[0124] Preferably, at least two guide members are installed along the first axis on both sides of the setting table, and the first axis positioning mechanism is inserted along the gap between the two guide members and can abut against the punching tool. By configuring in this way, it is a simple structure, and high-precision positioning of the punching tool relative to the transport head becomes easy.

[0125] The method for manufacturing an element array of the present invention uses any of the multi-element conveying devices described above to simultaneously take out and convey a plurality of conveyance target elements from a substrate, thereby manufacturing an element array.

[0126] In the method for manufacturing an element array of the present invention, an element array having a plurality of elements positioned and arranged with high precision can be manufactured easily, in a short time, and at low cost.

[0127] Preferably, the punching tool has:

[0128] The punching layer has a portion to which the element to be transported can be attached and detachably attached;

[0129] a support plate, to which the stamping layer is fixed; and

[0130] The joining plate has a mounting surface on which the support plate is replaceably mounted and on which the transport head is detachably mounted.

[0131] In this stamping tool, only the support plate to which the stamping layer is fixed can be replaced from the joint plate without replacing the entire stamping tool. Therefore, it becomes easy to prepare stamping tools with different types of stamping layers at a low cost. In addition, even if the size of the stamping layer or the size of the support plate is changed, it becomes easy to unify the size of the joint plate, and it becomes easy to share the handling head or the setting table. In addition, the stamping layer is fixed to the support plate, so it is easy to ensure the flatness of the stamping surface of the stamping layer.

[0132] Preferably, the support plate is replaceably mounted on the joining plate via an adhesive layer. By using the adhesive layer, the support plate can be easily replaceably mounted on the joining plate, and the flatness of the support plate, that is, the flatness of the punching surface of the punching layer, can be easily ensured.

[0133] Preferably, the transport object elements are multiple components formed on the surface of the substrate, multiple protrusions corresponding to the components are formed on the stamping layer, and the components are detachably adhered to each protrusion. With this structure, it is easy to simultaneously take out multiple components as multiple transport object elements from the substrate and copy or install them.

[0134] Preferably, the support plate has a glass plate or a ceramic plate with a flat surface. By forming it in this way, it is easy to ensure the flatness of the support plate, that is, the flatness of the stamping surface of the stamping layer. In addition, especially when the support plate is formed by a glass plate, it is easy to form an adsorbable surface around the stamping layer.

[0135] Preferably, a tapered surface whose outer diameter decreases toward the support plate is formed on the side of the joining plate. The claw of the clamp mechanism (chuck mechanism) can be detachably engaged with the tapered surface formed on the side of the joining plate. In addition, the mounting force of the punching tool relative to the conveying head caused by the clamp mechanism can be increased. Furthermore, along the inclined surface of the guide member for the punching tool provided on the upper part of the setting table, the positioning of the punching tool becomes easy.

[0136] Preferably, the maximum width of the joining plate is made larger than the width of the supporting plate. With such a configuration, the inclined surface of the guide member and the tapered surface of the press tool become easily engaged.

[0137] Preferably, the surface of the support plate on the side of the joining plate has an insertable surface opposite to the tapered surface of the joining plate. The existence of the insertable surface on the support plate of the punching tool allows the claw of the clamp mechanism to be easily and detachably engaged with the tapered surface of the side of the joining plate.

[0138] Preferably, an adsorbable surface is formed on the surface of the support plate on the side of the stamping layer around the stamping layer. The support plate of the stamping tool has an adsorbable surface, so that the support plate can be adsorbed to the setting surface of the setting table for the stamping tool, and the stamping layer can be easily sealed and held inside the storage recess. The stamping layer in the storage recess is kept clean.

[0139] A spacer plate for adjusting the parallelism (flatness) of the support plate may be interposed between the punching layer and the joining plate. With such a configuration, the flatness of the support plate is improved, and the flatness of the punching surface is also improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0140] Figure 1A It is a schematic front view and an enlarged view of a main part of a press tool according to an embodiment of the present invention.

[0141] Figure 1B This is a schematic front view of a press tool according to another embodiment of the present invention.

[0142] Figure 1C yes Figure 1B A schematic top view of a modified example of a punching tool.

[0143] Figure 1D It is along Figure 1C A cross-sectional view of the ID-ID punching tool is shown.

[0144] Figure 1E It is along Figure 1C A cross-sectional view of the IE-IE punching tool is shown.

[0145] Figure 2A It includes easy loading and unloading Figure 1A A schematic diagram of the handling device of the handling head of the punching tool is shown.

[0146] Figure 2B It means Figure 2A A schematic diagram of the handling device is shown in the state where the handling head grabs the punching tool.

[0147] Figure 3A This is a schematic diagram showing the transport device in a state before picking up a component from a semiconductor substrate.

[0148] Figure 3B It means self Figure 3A The schematic diagram of the handling device is shown in a state where a stamping laminate of a stamping tool is attached to a component on a semiconductor substrate.

[0149] Figure 3C This is a schematic diagram showing a transport device in a state after picking up a component from a semiconductor substrate.

[0150] Figure 4A This is a partial schematic diagram showing details of a claw portion of a clamp mechanism used in a transport device according to another embodiment of the present invention.

[0151] Figure 4B This is a partial schematic diagram showing details of a claw portion of a clamp mechanism used in a transport device according to another embodiment of the present invention.

[0152] Figure 5A is a schematic cross-sectional view of an element formed on a semiconductor substrate.

[0153] Figure 5B This is a schematic cross-sectional view showing a state in which a component on a semiconductor substrate is picked up by a punching tool of a transport device.

[0154] Fig.5C1 This is a schematic cross-sectional view showing a state in which a component on a semiconductor substrate is picked up by a punching tool of a transport device and then arranged on a mounting substrate (sheet).

[0155] Fig.5C2This is a schematic cross-sectional view showing a state in which a component on a semiconductor substrate is picked up by a punching tool of a transport device and then arranged on a first transfer substrate (sheet).

[0156] Figure 5D This is a schematic cross-sectional view showing a state in which an element array arranged on a first transfer substrate (sheet) is transferred to a second transfer substrate (sheet).

[0157] Figure 5E This is a schematic cross-sectional view showing a state before the element array arranged on the second transfer substrate (sheet) is transferred to the mounting substrate (sheet).

[0158] Fig. 5F This is a schematic cross-sectional view showing a state in which the element array arranged on the second transfer substrate (sheet) is transferred to the mounting substrate (sheet).

[0159] Fig. 6A Is set with Figure 1A A schematic perspective view of a punching station of a punching tool is shown.

[0160] Figure 6B yes Fig. 6A The punching station is shown in a top view, showing the state in which the positioning member is opened.

[0161] Figure 6C yes Fig. 6A The punching station is shown in a top view, showing the closed state of the positioning member.

[0162] Figure 7 It is along Fig. 6A A schematic cross-sectional view of the punching station along line VII-VII is shown.

[0163] Figure 8 is Fig. 6A The side view of the punching table as viewed from the Y-axis direction is shown with Figure 2A A side view from behind the handling head is shown.

[0164] Fig. 9 It means that the configuration has Fig. 6A The punching table shown in the figure is equipped with a Figure 5A The component table of the component forming substrate shown in the figure is equipped with Fig.5C1 A schematic diagram showing the relationship between the mounting table, mounting substrate, and transport head shown.

[0165] Fig.10 It means self Fig. 9 The state shown is a schematic diagram of the state after the relative position of the transport head and the table is changed.

[0166] Fig.11 It means self Fig.10The state shown is a schematic diagram of the state after the relative position of the transport head and the table is changed. DETAILED DESCRIPTION

[0167] Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

[0168] First Embodiment

[0169] like Figures 9 to 11 As shown, the multi-element conveyor 200 includes a conveying device 20, a pressing table 100, a component table 102 as a first table, and an installation table 104 as a second table. Figure 2A As shown, the transport device 20 includes a transport head 22 for detachably transporting the press tool 10 .

[0170] (Pressing tools)

[0171] First, the punching tool 10 will be mainly described. Figure 1A As shown, the punching tool 10 has a punching layer 12 , a support plate 14 and a joining plate 16 .

[0172] In the stamping layer 12, the convex portions 11 protruding downward in the Z axis are formed in a matrix at predetermined intervals in the X-axis direction and the Y-axis direction. The X-axis width x1 of the convex portion 11 and the X-axis interval x2 of the adjacent convex portions 11 correspond to the width x1 of the convex portion 11 in the X-axis direction. Fig. 5F The mounting substrate (hereinafter, the substrate may also be a sheet) 70 shown is determined by the X-axis direction width x3 of the element (an example of the element to be transported) 32r for red light emission mounted on the surface and the X-axis direction interval x4 thereof.

[0173] Also, in Figure 1A Although not shown in the figure, the Y-axis width of the convex portion 11 and the Y-axis spacing of these adjacent convex portions 11 are also the same. The convex portions 11 are arranged in a matrix on the lower surface of the stamping layer 12, and the number of the arrangements is not particularly limited, but is 10 to several hundred thousand.

[0174] In this embodiment, in the accompanying drawings, the X-axis (1st axis), the Y-axis (2nd axis) and the Z-axis (3rd axis) are approximately perpendicular to each other, the X-axis and the Y-axis are parallel to the planar direction of the stamping layer 12, and the Z-axis is parallel to the protruding direction of the protrusion 11.

[0175] like Figure 1A As shown, the protruding height z1 of the convex portion 11 of the stamping layer 12 is Figure 5BThe thickness z3 of the punching layer 12 in the Z-axis direction is not particularly limited, but is preferably about 0.25 times or more of the protruding height z1 of the convex portion 11. In addition, the width x3 of the element 32r in the X-axis direction (the width in the Y-axis direction is also the same) is, for example, 1 to 150 μm, and its height z2 is, for example, 1 to 150 μm.

[0176] The stamping layer 12 and the convex portion 11 may be made of different materials if they are strongly bonded, but they may also be made of the same material. By making them of the same material, there is less concern that the convex portion 11 will peel off from the stamping layer 12. At least the convex portion 11 is made of a material having adhesiveness, and can be adhered to the stamping layer 12 with a predetermined adhesive force F2. Figure 5B The component 32r is arranged with a predetermined fixing force F1 on the component forming substrate 30 shown in the figure. The material and shape of the protrusion 11 are determined so that when the lower end of the protrusion 11 is pressed against the upper surface of the component 32r with a predetermined force, the adhesion force F2 of the protrusion 11 with respect to the component 32r is greater than the fixing force F1 of the component 32r with respect to the substrate 30.

[0177] The material of the protrusion 11 is not particularly limited, but examples thereof include viscoelastic elastomers such as polydimethylsiloxane (PDMS), organic silicon compounds, and polyether rubber. The stamping layer 12 may also be made of the same material as the protrusion 11, but the surface of the stamping layer 12 other than the protrusion 11 is preferably non-adhesive. It is preferred that the component 32r is not picked up by adhesive force except for the protrusion 11.

[0178] like Figure 1A As shown, the stamping layer 12 is fixed to the support plate 14. The support substrate 14 is made of a material with greater rigidity than the stamping layer 12 and excellent flatness, preferably a glass plate, a metal plate, a ceramic plate, etc. The thickness of the support plate 14 is not particularly limited, but is preferably greater than 0.5 mm.

[0179] The stamping layer 12 can be directly formed on the surface of the support plate 14, or fixed by an adhesive layer. Figure 5B The adhesive force F2 shown is sufficiently high to fix the element 32r to the surface of the support plate 14. The element 32r is peeled off from the protrusion 11 in a subsequent step and is disposed on, for example, Fig.5C1 The mounting substrate 70 is shown, so it is important that the punching layer 12 does not peel off from the supporting plate 14 at this time.

[0180] like Figure 1AAs shown in FIG. 1 , the surface of the support plate 14 on the opposite side of the punching layer 12 is detachably fixed to the bonding surface 16b of the joining plate 16 by the bonding layer 15. The bonding force between the support plate 14 and the joining plate 16 by the bonding layer 15 is relatively Figure 5B The adhesive force F2 shown is a sufficiently high adhesive force. However, when replacing the punching layer 12 after repeated use, the support plate 14 is removed from the adhesive surface 16b of the joint plate 16. The adhesive layer 15 can also be composed of a double-sided tape or the like.

[0181] The width of the support plate 14 in the X-axis direction and the width in the Y-axis direction are larger than those of the stamping layer 12, and are preferably larger than the width of the bonding surface 16b of the joining plate 16 in the X-axis direction and the Y-axis direction. On the surface of the stamping layer side of the support plate 14, around the stamping layer 12, a flat adsorbable surface 14b without the stamping layer 12 is formed. In the present embodiment, the stamping layer 12 is rectangular when viewed from the Z-axis direction, but the support plate 14 may be rectangular or circular. The adsorbable surface 14b can be freely installed on Figure 7 The setting surface 84 of the setting table 82 is shown.

[0182] The upper surface of the joining plate 16 on the opposite side of the bonding surface 16b is formed into a flat mounting surface 16a, and at least the two side surfaces of the joining plate 16 in the X-axis direction are formed into tapered surfaces 16c, so that the area of ​​the mounting surface 16a is larger than the area of ​​the bonding surface 16b. That is, at least the side surface of the joining plate 16 in the X-axis direction is formed with a tapered surface 16c whose outer diameter decreases toward the stamping layer 12.

[0183] In this embodiment, the conical surface 16c is also formed on both sides of the joining plate 16 in the Y-axis direction, and the conical surface 16c is formed along the entire circumference of the side of the joining plate 16. In this embodiment, the joining plate 16 has a rectangular shape when viewed from the Z-axis direction, and preferably, at least the maximum width of the joining plate 16 in the X-axis direction is greater than the width of the support plate 14 in the X-axis direction. Figure 7 As shown, the maximum width of the bonding plate 16 in the Y-axis direction may be substantially equal to the width of the supporting plate 14 in the Y-axis direction, or may be larger or smaller than the maximum width of the bonding plate 16 in the Y-axis direction.

[0184] exist Figure 1A The surface opposite to the adsorbable surface 14b of the support plate 14 shown in the figure has a flat insertable surface 14c opposite to the tapered surface 16c formed around the bonding surface 16b of the bonding plate 16. On the insertable surfaces 14c located on both sides in the X-axis direction, Figure 2B The claws 26a of the chuck mechanism (also called clamp mechanism / first axis positioning mechanism) 26 shown are respectively engaged with the tapered surfaces 16c of the joining plate 16. In addition, the tapered surfaces 16c of the joining plate 16 located on both sides in the X-axis direction, Fig. 6A and Figure 8The inclined surfaces 89 of the guide members 88 of the installation table 82 shown are engaged with each other.

[0185] Figure 1A The thickness of the bonding plate 16 in the Z-axis direction is substantially greater than the thickness of the support plate 14, preferably 1.2 times or more, more preferably about 2 to 6 times the thickness of the support plate 14. In addition, an edge portion 16d consisting of a chamfered portion or an R portion is formed on the outer peripheral edge portion of the mounting surface 16a on the upper surface of the bonding plate 16.

[0186] Figure 6A to Figure 6C and Figure 7 The front end surfaces 92 of the pair of positioning members (second axis positioning mechanism) 90 shown in the figure abut against the edge portions 16d of the joining plates 16 located on both sides in the Y-axis direction, thereby positioning the Y-axis direction position of the punching tool 10 placed on the setting table 82. The X-axis direction position of the punching tool 10 is roughly positioned by Fig. 6A and Figure 8 The inclined surface 89 of the guide member 88 shown in the figure is used for high-precision positioning. Figure 2B and Figure 8 The claw portion 26a of the clamp mechanism 26 of the transport device 20 shown is used for this purpose.

[0187] (Conveying device)

[0188] Next, the transport device will be mainly described. Figure 2A The suction surface 24 of the handling head 22 of the handling device 20 shown can be sucked on the Figure 1A The mounting surface 16a of the upper surface of the joining plate 16 shown in FIG. A vacuum suction hole serving as a main mounting mechanism is formed on the adsorption surface of the transport head 22, and negative pressure is generated in the vacuum suction hole, so that the mounting surface 16a of the joining plate 16 of the punching tool 10 is vacuum adsorbed to the adsorption surface 24. The vacuum adsorption force of the adsorption surface 24 on the mounting surface 16a of the joining plate 16 of the punching tool 10 is temporarily used as the main mounting force F3a.

[0189] In addition, in this embodiment, the chuck mechanism 26 is installed on the conveying head 22 via the opening and closing mechanism 28. A claw portion 26a is formed inside the chuck mechanism 26. The chuck mechanism 26 including the claw portion 26a is moved in the X-axis direction by, for example, the opening and closing mechanism 28. Figure 2A As shown, the claw portion 26a opens the entire lower surface of the suction surface 24, or, as shown in FIG. Figure 2B As shown, the claws 26 a are located below both sides of the suction surface 24 in the X-axis direction.

[0190] A conical engaging surface 26b is formed on each claw portion 26a. The conical surface of the engaging surface 26b matches the shape of the conical surface 16c of the engaging plate 16 of the punching tool 10 and can be engaged with the conical surface 16c. Figure 2A to Figure 2BAs shown, before the mounting surface 16a of the joint plate 16 is adsorbed to the adsorption surface 24 of the transport head 22, the chuck mechanism 26 opens the claw 26a by the opening and closing mechanism 28. After the mounting surface 16a of the joint plate 16 is adsorbed to the adsorption surface 24 of the transport head 22, the chuck mechanism 26 moves in the direction in which the claw 26a is closed by the opening and closing mechanism 28, and the engaging surface 26b engages with the tapered surface 16c.

[0191] As a result, the punching tool 10 is mounted on the conveying head 22 with a mounting force F3 which is a total of a main mounting force F3a caused by the vacuum suction hole as the main mounting mechanism formed in the conveying head 22 and a secondary mounting force F3b caused by the chuck mechanism 26 as the secondary mounting mechanism. With the miniaturization of the conveying head 22, it is difficult to exceed the main mounting force F3 caused by the vacuum suction hole of the conveying head 22 alone. Figure 5B In this embodiment, the auxiliary mounting force F3b caused by the chuck mechanism 26 as the auxiliary mounting mechanism is added to the main mounting force F3a, whereby the total mounting force F3 (= F3a + F3b) is reliably greater than the fixing force F1.

[0192] Furthermore, the press tool 10 is attached to the transport head 22 by the chuck mechanism 26 , whereby the press tool 10 (specifically, the convex portion of the press layer 12 ) is positioned relative to the transport head 22 along the X-axis.

[0193] (Method for manufacturing display element array and device used for manufacturing the same)

[0194] Next, a method for manufacturing a display element array using the conveying device 20 having the press tool 10 of the present embodiment, a setting table that is a part of a press tool positioning device, and other devices will be described.

[0195] first, Figure 2A The transport device 20 shown goes to obtain the Figure 6A to Figure 8 The punching tool 10 is shown on the setting table 82. In the present embodiment, at least three punching tools are preferably prepared for, for example, R, G, and B, which are the three primary colors of light, but each punching tool is preferably set on each setting table 82. Alternatively, the setting table 82 is replaced with respect to the base 81 for each punching tool 10 for R, G, and B.

[0196] The base 81 of the installation table 82 is positioned at Figures 9 to 11 The punching table 100 is positioned and fixed on, for example, an integration table 110. Figures 9 to 11 In the illustrated example, only a single press table is provided on the integration table 110 .

[0197] However, three pressing tables 100 in which bases 81 for three installation tables 82 are respectively fixed to the pressing tools 10 for R, G, and B, for example, may be arranged on the integration table 110 at predetermined intervals in the Y-axis direction.

[0198] In addition to the three punching tables 100, three large punching tables having bases for three setting tables fixed to each punching tool of different sizes for R, G, and B may be arranged in the Y-axis direction at a predetermined interval. The three large punching tables of different sizes are arranged outside the three punching tables 100 of smaller sizes in the X-axis direction.

[0199] In this embodiment, if Figures 9 to 11 As shown, on the integrated table 110, in addition to the punching table 100, the component table 102 and the installation table 104 are positioned and fixed. Figure 5A The table shown has a substrate 30 for forming an element positioned and detachably fixed thereto.

[0200] Also, in Figures 9 to 11 In the figure, it is shown that only a single component table 102 is provided. However, on the integration table 110, three component tables 102 in which three component forming substrates 30 are positioned and fixed so as to be removable for each component 32r, 32g, 32b for R, G and B, for example, may be arranged in a row at a predetermined interval in the Y-axis direction. Alternatively, in the present embodiment, three component forming substrate element configuration substrates 30 may be positioned and fixed so as to be removable for each component on a single component table 102. In addition, the component table 102 and the stamping table 100 are arranged separately in the X-axis direction on the integration table 110.

[0201] The installation table 104 is Fig.5C1 The table shown is a table where the mounting substrate 70 is positioned and fixed so as to be detachable. The mounting substrate 70 is arranged on the integration table 110 and is separated from the component table 102 in the Y-axis direction. In the present embodiment, a single mounting substrate 70 is positioned and fixed on the integration table 110. Alternatively, a plurality of mounting substrates 70 may be positioned and fixed on the integration table 110.

[0202] The upper surfaces of the tables 100, 102, and 104 positioned and fixed to the integration table 110 are preferably approximately the same X-Y plane, but they do not necessarily have to be the same plane. By making the upper surfaces of the tables 100, 102, and 104 approximately the same X-Y plane, the movement amount of the conveying head 22 that moves relatively to the top of the tables 100, 102, and 104 along the Z axis can be made approximately the same, and the movement control of the conveying head 22 along the Z axis becomes easy. Above the tables 100, 102, and 104 positioned and fixed to the integration table 110 in the Z axis direction, the conveying head 22 of the conveying device 20 is configured to be movable in the X-axis and Y-axis directions. Relative to the conveying head 22, the integration table 110 can move relatively along the X-Y plane including the X-axis and the Y-axis.

[0203] In order to improve the positioning accuracy, it is preferred that the transport head 22 moves only in the Z-axis direction relative to each table 100, 102 and 104, and each table 100, 102 and 104 moves along the X-Y plane relative to the transport head 22. Alternatively, the transport head may move only in the X-axis or Y-axis and Z-axis directions, and each table 100, 102 and 104 may move along the Y-axis or X-axis relative to the transport head 22. Alternatively, the transport head may move in the X-axis, Y-axis and Z-axis, and each table 100, 102 and 104 may not move but be fixed.

[0204] in addition, Figures 9 to 11 The integration table 110 shown is illustrated as a single component, but it does not necessarily have to be composed of a single component, and may also be composed of multiple components. In addition, the component table 102 and the installation table 104 may also be positioned and fixed to the same base, and move together in the same direction (for example, the Y-axis direction). Furthermore, the integration table 110 may be separated from these tables 102 and 104 in a manner such that the punching table 100 (including punching tables of different sizes) moves in the Y-axis direction, for example. In this case, it is preferred that the conveying head 22 can move in the X-axis direction in addition to the Z-axis direction.

[0205] In the following description, Figure 6A to Figure 8 The one setting table 82 shown in FIG. 1 is shown in FIG. 1 , but the same is true for the other setting tables. Fig. 6A and Figure 7 As shown, the block-shaped installation platform 82 is installed on the base 81, and can be installed and replaced freely using bolts, etc. Figure 7 As shown in FIG. 1 , a storage recess 86 and a setting surface 84 surrounding the storage recess 86 are formed at the upper portion of the setting table 82 in the Z-axis direction. The storage recess 86 is formed by countersinking the center portion of the upper surface of the table 82, which is, for example, a quadrangular prism-shaped. Figure 7 As shown, the punching layer 12 of the punching tool 10 is completely inserted into the receiving recess 86 .

[0206] In addition, suction holes 85 are formed at multiple locations in the circumferential direction on the setting surface 84 formed around the storage recess 86, so that the adsorbable surface 14b of the support plate 14 can be adsorbed and held on the setting surface 84 in a detachable manner. In addition, the storage recess 86 is connected to a plurality of gas flow holes 83 formed on the stage 82. The adsorbable surface 14b of the support plate 14 is adsorbed on the setting surface 84, thereby the storage recess 86 can be sealed except for the gas flow holes 83. Through the gas flow holes 83, the cleaned gas flows into the storage space 86, thereby dust and impurities attached to the punching layer 12 can be discharged to the outside.

[0207] Two guide members 88 are detachably mounted on each side of the stage 82 by bolts etc. on both sides of the stage 82 which are substantially perpendicular to the X axis. An inclined surface 89 is formed on the upper side of the inner side surface of the guide member 88 . Figure 1A The conical surface 16c of the joining plate 16 shown in the figure can contact each inclined surface 89, and slide along each inclined surface 89, and the conical surface 16c opposite to the joining plate 16 in the X-axis direction. Therefore, the joining plate 16 of the punching tool 10 slides on the inclined surface 89 and falls on the table 82, as shown in FIG. Figure 7 As shown, the press layer 12 is accommodated in the accommodation recess 86. In addition, the press tool 10 is roughly aligned with respect to the stage 82 in the X-axis direction.

[0208] like Fig. 6A As shown, the four guide members 88 are mounted on the table 82 so as to be located closer to the inside than the two edges 16d of the Y-axis direction of the joining plate 16 of the punching tool 10. On both sides of the table 82 in the Y-axis direction, Y-axis direction positioning members (second axis positioning mechanism) 90 are respectively arranged to be movable in the Y-axis direction. The positioning members 90 are respectively formed with front end faces 92, which are opposite to each other along the Y-axis, such as Figure 7 As shown, the front end surface 92 can abut against the edge 16d in the Y-axis direction of the joining plate 16. The front end surface 92 abuts against the edge 16d in the Y-axis direction of the joining plate 16, thereby positioning the press tool 10 relative to the stage 82 in the Y-axis direction.

[0209] Next, explain Fig. 6A and Figure 7 The setup station 82 shown is used Figure 2A The handling device 20 shown picks up the punching tool 10.

[0210] First, the press tool 10 is positioned in the Y-axis direction on the stage 82 using the positioning member 90. Fig. 9 As shown, the positional relationship between the punching table 100 and the conveying head 22 on the X-Y axis is changed. Figure 8The stage 82 shown moves together with the base 81 so that the stage 82 is located at Figure 2A The transport head 22 of the transport device 20 shown in the figure is below the transport head 22. In addition, the transport head 22 may be moved without moving the stage 82, or both may be moved. The transport head 22 may also be rotated around the Z axis as needed.

[0211] After the punching tool 10 on the stage 82 is positioned below the Z axis of the transport head 22, the head 22 is moved downward along the Z axis so that the lower end of the transport head 22 contacts the mounting surface 16a of the joining plate 16, and vacuum adsorption by the transport head 22 is started. Figure 2A to Figure 2B As shown, the clamp mechanism 26 is closed, and the engaging surfaces 26b of the claws 26a are respectively engaged with the tapered surfaces 16c on both sides of the X-axis direction of the joining plate 16 to perform positioning in the X-axis direction. In addition, the engaging surfaces 26b of the claws 26a may be provided with stopper surfaces as needed, and the stopper surfaces abut against the edge 16d of the X-axis direction of the joining plate 16, thereby positioning the punching tool 10 in the X-axis direction.

[0212] Afterwards, Figure 7 The pair of positioning members 90 shown in the figure is opened in the Y-axis direction, and the contact between the front end surface 92 and the edge 16d of the bonding plate 16 is released. Before and after this, the suction of the support plate 14 to the installation surface 84 of the stage by the suction hole 85 of the stage 82 is released. After that, if the conveying head 22 is moved upward in the Z-axis, as shown in FIG. Figure 2B As shown, the press tool 10 is positioned in the X-axis and the Y-axis at the lower end of the transfer head 22 , and is held in a state where the horizontality of the press tool 10 is maintained.

[0213] Then, if Figure 2B As shown, when the punching tool 10 is mounted on the conveying head 22, the conveying device 20 is relatively moved in the X-axis and Y-axis directions, as shown in FIG. Fig.10 As shown, it is located on the component table 102. Fig.10 As shown, the multi-element conveying device 200 has a component forming substrate 30 (see Figure 3A ) and the space between the punching layer 12 of the punching tool 10 held by the conveying head 22. The camera device 122 is a camera mechanism that can simultaneously capture images in two directions. In addition, the camera device 122 can move backward from under the conveying head 22. In addition, the same camera device 122 can be inserted between them when the conveying head 22 is moved onto the installation table 104.

[0214] like Figure 3A As shown, the camera device 122 can simultaneously capture the convex portion 11 located on the stamping surface of the stamping layer 12 (refer to Figure 2B) and the surface of the element forming substrate 30. Fig.10 As shown, the imaging device 122 is communicatively connected to a control device 120 as a control mechanism. The control device 120 receives a detection signal from the imaging device 122 and controls a fine adjustment mechanism (not shown) that changes the relative position of the transport head 22 and the device forming substrate 30 .

[0215] The fine-adjustment mechanism may also include a mechanism for fine-adjusting and moving the relative position of the conveying head 22 along the X-axis and the Y-axis relative to the substrate 30, and a mechanism for fine-adjusting and moving the relative angle around the Z-axis of the conveying head 22 itself relative to the substrate 30. In addition, the mechanism for fine-adjusting and moving the relative position of the conveying head 22 along the X-axis and the Y-axis relative to the substrate 30 may also include a main drive device that changes the relative position of the conveying head 22 along the X-axis and the Y-axis relative to the component table 102 (installation table 104 or punching table). The main drive device and the fine-adjustment mechanism are controlled by the control device 120. In addition, the control device 120 also controls the control device 120 including Figure 8 The Z-axis direction movement of the transport device 20 of the transport head 22 and the driving of the chuck mechanism 26 are shown. Fig. 6A The driving of the positioning member 90 shown, etc.

[0216] exist Fig.10 The components shown are placed on table 102, such as Figure 3A As shown, the element forming substrate 30 is positioned and arranged. Figure 5A As shown, for example, a red light emitting element 32r, a green light emitting element 32g, or a blue light emitting element 32b is manufactured. The substrate 30 varies depending on, for example, the type of element (blue light emitting element, red light emitting element, green light emitting element, etc.), but, for example, a sapphire substrate, a glass substrate, a GaAs substrate, a SiC substrate, etc. can be used.

[0217] In this embodiment, the components 32r, 32g, and 32b are, for example, micro LED components. In the following description, only the component 32r is described, but the same operation is performed on the other components 32g and 32b using different punching tools 10. The punching tools 10 are preferably prepared for each type of the different components 32r, 32g, and 32b, but the conveying head 22 can be used in common.

[0218] The press tool 10 in a standby state is set, for example, Fig. 6A and Figure 7 On the table 82 shown, the punching layer 12 is sealed inside the storage recess 86 and is kept in a clean state. The punching tool 10 in the standby state not held by the transport head 22 can also be arranged, for example, Fig. 9 The punching table 100 shown in the figure may be arranged along the Fig. 9 The table 100 shown is a plurality of different press tables arranged adjacent to each other on the Y axis.

[0219] Figure 3A The camera device 122 shown in FIG. 1 simultaneously captures the convex portion 11 on the stamping surface of the stamping layer 12 (see FIG. 1 ). Figure 2B ), and the surface of the element forming substrate 30, Fig.10 The control device 120 receives the detection signal and uses a fine adjustment mechanism to change Figure 3A The relative position of the conveying head 22 and the component forming substrate 30 shown in FIG. As a result, the arrangement of the protrusions 11 on the punching surface of the punching layer 12 and the arrangement of the components 32r formed on the surface of the substrate 30 are accurately aligned. As a result, a plurality of small-sized components 32r can be held on the punching surface of the punching layer 12 with high accuracy.

[0220] Afterwards, if Figure 3A to Figure 3B As shown in FIG. 1 , after the camera device 122 is moved from the lower position of the transport head 22 and retreated, the transport device 20 is moved downward in the Z-axis direction to press the convex portion 11 of the punching tool 10 against the upper surface of the component 32r of the substrate 30. As a result, the component 32r is adhered to the convex portion 11. Then, as shown in FIG. Figure 3C As shown in FIG. 1 , the punching tool 10 and the conveying device 20 are lifted upward in the Z-axis direction. Figure 5B As shown, components 32r are adhered to each convex portion 11, and the components 32r are picked up from the substrate 30 together with the convex portion 11. The components 32r remaining on the substrate 30 are then picked up by the punching layer 10 of the conveying device 20 in the same manner.

[0221] Next, the component 32r picked up by the protrusion 11 of the punching layer 10 is transported by the transport device 20 to, for example, Fig.5C1 The device is mounted on a mounting substrate (the substrate may also be a sheet / the same applies hereinafter) 70 shown. Fig.5C1 The mounting substrate 70 shown is positioned at Fig.10 The installation table 104 is shown in FIG. Figure 10-11 As shown, the main driving device is driven by the control device 120 to move the component table 102 and the installation table 104 relative to the conveying head 22 in the Y-axis direction, so that the conveying head 22 is located on the installation table.

[0222] After that, make it sticky Figure 5B The array of elements 32r of the protrusions 11 of the stamping layer 12 shown is replicated in Fig.5C1The mounting substrate 70 shown is placed on top of the mounting substrate 70. Therefore, the component 32r adhered to the protrusion 11 of the stamping layer 12 is pressed against the surface of the mounting substrate 70, and then the stamping layer 12 is lifted together with the conveying device 20. As a result, a plurality of components 32r are simultaneously copied to the surface of the mounting substrate 70. If the above-mentioned actions are repeated according to the size of the mounting substrate 70, a plurality of components 32r are arranged in a matrix on the mounting substrate 70. The used stamping tool 10 is returned to the table 82 of the original stamping tool holding device 80 set on the stamping table 100 through the conveying head 22.

[0223] like Fig.5C1 As shown, different punching tools 10 are used for each type of component 32g, 32b, and the other components 32g, 32b are also conveyed to the substrate 70 in the same manner as described above. The three components 32r, 32g, 32b of R, G and B constitute one pixel unit, and these pixel units are arranged in a matrix, thereby forming a color display screen.

[0224] Anisotropic conductive paste (ACP) is preferably applied on the surface of mounting substrate 70. Alternatively, anisotropic conductive film (ACF) is preferably provided. Fig.5C1 As shown in the figure, after the components 32r, 32g, and 32b are arranged on the substrate 70 via the ACP or ACF, the components 32r, 32g, and 32b can be pressed and heated toward the substrate 70 using a heating and pressing device (not shown). As a result, the terminals of the components 32r, 32g, and 32b can be connected to the circuit pattern of the mounting substrate.

[0225] In the transport device 20 of this embodiment, Figure 2B The mounting force F3 caused by the handling head 22 shown relative to the mounting surface 16a of the joining plate 16 is greater than Figure 5B The fixing force F1 shown is greater than the adhesion force F2 of the protrusion 11 of the punching layer 12 of the element 32r. Therefore, the punching tool 10 does not remain on the substrate 30 side, and the element 32r arranged on the surface of the substrate 30 can be easily picked up and transported from the substrate 30.

[0226] In addition, in this embodiment, Figure 2B The mounting force F3 on the mounting surface 16a of the joining plate 16 caused by the transport head 22 shown in the figure is the sum of the main mounting force F3a corresponding to the suction force of the vacuum suction hole and the auxiliary mounting force F3b caused by the clamp mechanism 26 as the auxiliary mounting mechanism. That is, in this embodiment, the clamp mechanism 26 is provided only on the general transport head 22 having the vacuum suction hole, thereby making the mounting force F3 on the mounting surface 16a of the joining plate 16 caused by the transport head 22 larger than that of the main mounting force F3a. Figure 5BThe fixing force F1 of the illustrated element 32r to the substrate 30 is large and becomes easy.

[0227] Furthermore, in the present embodiment, a tapered surface 16c whose outer diameter decreases toward the stamping layer 12 is formed on both side surfaces of the joining plate 16 in the X-axis direction. In addition, the claw portion 26a of the clamp mechanism 26 can be engaged with the tapered surface 16c. By configuring in this way, the claw portion 26a of the clamp mechanism 26 can be easily and unloadably engaged with the tapered surface 16c on the side of the joining plate 16. In addition, the mounting force F3 of the stamping tool 10 caused by the clamp mechanism 26 relative to the conveying head 22 can be increased. In addition, the claw portion 26a of the clamp mechanism 26 can be easily and unloadably engaged with the tapered surface 16c on the side of the joining plate 16, thereby simultaneously performing positioning of the stamping tool 10 in the X-axis direction relative to the conveying head 22.

[0228] In addition, on both side surfaces of the joining plate 16 in the X-axis direction, a tapered surface 16c is formed whose outer diameter decreases toward the punching layer 12, thereby Fig. 6A The inclined surface 89 of the guide member 88 on the upper portion of the stage 82 shown in the figure makes it easier to roughly position the punching tool 10 in the X-axis direction. Figure 1A As shown, the maximum width of the joining plate 16 in the X-axis direction is larger than the width of the supporting plate 14 , whereby the inclined surface 89 of the guide member 88 and the tapered surface 16 c of the press tool 10 are easily engaged with each other.

[0229] In addition, there is an insertable surface 14c on the support plate 14 of the punching tool 10, whereby the claw 26a of the clamp mechanism 26 can be easily and detachably engaged with the tapered surface 16c on the side of the joining plate 16. This is because the existence of the insertable surface 14c forms a space between the tapered surface 16c, so when positioning the claw 26a of the clamp mechanism 26 to start engaging the tapered surface 16c, the engagement start position can be determined based on the space. Furthermore, there is an adsorbable surface 14b on the support plate 14 of the punching tool 10, whereby, as Figure 7 As shown, the support plate 14 can be adsorbed by the setting surface 84 of the stage 82, and the stamping layer 12 can be easily sealed and held inside the storage recess 86. The adsorbable surface 14b can be easily formed around the stamping layer 12 by making the support plate 14 of a glass plate or the like.

[0230] The punching tool 10 also has a support plate 14 to which the punching layer 12 is fixed and to which the joining plate 16 is freely replaceably mounted. By configuring in this way, only the support plate 14 to which the punching layer 12 is fixed can be replaced from the joining plate 16 without replacing the entire punching tool 10. Therefore, it becomes easy to prepare punching tools 10 having different types of punching layers 12 at a low cost. In addition, by using a shared joining plate 16, different types of conveying heads can be used without matching the punching tool, and the overall structure of the conveying device also becomes simple.

[0231] In this embodiment, a plurality of convex portions 11 corresponding to the elements 32r (32g, 32b) are formed on the stamping layer 12, and the elements 32r (32g, 32b) are detachably attached to each convex portion 11. With this configuration, a plurality of elements 32r (32g, 32b) can be simultaneously taken out from the substrate 30. In the manufacturing method of the element array of this embodiment, an element array having a plurality of elements 32r (32g, 32b) can be easily manufactured.

[0232] In addition, in this embodiment, if Fig. 6A As shown, the setting table 82 is replaceably mounted on the base 81. Therefore, when the table 82 corresponding to the punching tool 10 is prepared in advance, when changing to a different type of punching tool 10, only the table 82 can be replaced. The flatness of the table 82 relative to the base 81 is ensured, so when the punching tool 10 is replaced, it is not necessary to adjust the flatness of the punching tool.

[0233] Therefore, in the present embodiment, there is no suction error caused by the transport head 22 or a gripping error caused by the clamp mechanism 26 , and the transport head 22 can well pick up the press tool 10 from the setting table 82 .

[0234] like Figure 7 As shown, in the punching tool holding device 80 of the present embodiment, negative pressure is introduced into the suction hole 85 in a state where the punching layer 12 is stored inside the storage recess 86, whereby the joining plate 14 of the punching tool 10 is adsorbed on the setting surface 84 in a detachable manner. As a result, the inside of the storage recess 86 is sealed, and it is difficult for impurities or dust to adhere to the punching surface (convex portion 11) of the punching layer 12 stored inside the storage recess 86, so that the punching surface can be kept clean in advance and the punching tool 10 can be set.

[0235] In addition, in the present embodiment, the setting table 82 is fixed to the base 81 so as to be freely loaded and unloaded. The stamping tool 10 needs to be replaced in response to customer requirements or the substrate 30 having components as elements of the conveying object. In order to match the change of the stamping tool 10, a plurality of setting tables 82 are prepared in advance, whereby only the setting tables 82 are replaced without replacing the base 81, thereby responding to the size change of the stamping tool 10, etc. In addition, the flatness of each setting table 82 relative to the base 81 is ensured, and even when the stamping tool 10 is replaced, there is no need to adjust the flatness.

[0236] Furthermore, in the present embodiment, a gas flow hole 83 is formed on the setting table 82 to communicate with the space in the storage recess 86 so as to replace the gas in the storage recess 86. By replacing the gas in the recess 86, impurities or dust attached to the surface of the stamping layer 12 accommodated in the storage recess 86 can be discharged together with the gas, thereby improving the cleanliness of the stamping layer 12.

[0237] like Fig. 6A As shown, in this embodiment, a guide member 88 for guiding at least along the X-axis is installed on the upper part of the setting table 82 so that the stamping layer 12 of the stamping tool 10 falls into the interior of the storage recess 86. By providing the guide member 88 on the setting table 82, it becomes easy to roughly position the stamping tool 10 at least along the X-axis. In addition, when the stamping tool 10 is picked up by the conveying head 22, the positioning of the stamping tool 10 relative to the conveying head 22 also becomes easy.

[0238] In this embodiment, the guide members 88 are detachably mounted on both sides of the setting table 82 along the X-axis, and each guide member 88 is formed with an inclined surface 89 that can be engaged with the tapered surface 16c of the punching tool 10. By configuring in this way, it becomes easier to roughly position the punching tool 10 at least along the X-axis. In addition, when the punching tool 10 is picked up by the conveying head 22, it becomes easier to position the punching tool 10 relative to the conveying head 22.

[0239] In this embodiment, at least two guide members 88 are installed on both sides of the setting table 82 along the X-axis, and along the gap between the two guide members 88, Figure 2A The claw 26a of the chuck mechanism 26 shown can be inserted. By configuring in this way, high-precision positioning of the punching tool 10 at least along the X-axis can be performed. In addition, when the punching tool 10 is picked up by the transport head 22, the positioning of the punching tool 10 relative to the transport head 22 (particularly along the X-axis) also becomes more accurate.

[0240] like Figure 6A to Figure 6C As shown, along the Y-axis direction, on both sides of the setting table 82, a pair of positioning members 90 are arranged that can abut and separate from the edge 16d of the punching tool 10 set on the upper part of the setting table 82. By configuring in this way, in addition to the X-axis, high-precision positioning of the punching tool 10 along the Y-axis can be performed. In addition, when the punching tool 10 is picked up by the conveying head 22, the positioning of the punching tool 10 relative to the conveying head 22 also becomes easier.

[0241] In addition, the punch tool positioning device of this embodiment has Figure 7 The setting table 82 shown, Figure 8 The carrier head 22 shown in the figure, the clamp mechanism 26 as the first axis positioning mechanism, and the positioning member 90 as the second axis positioning mechanism. That is, in this embodiment, the positioning of the punching tool 10 along the Y axis is as follows: Figure 7 As shown, the positioning of the punching tool along the X-axis can be performed by using the setting table 82 as a reference and using the positioning member 90, as shown in FIG. Figure 2BAs shown, the conveying head 22 can be used as a reference and the clamp mechanism 26 can be used. Therefore, the positioning mechanism relative to the conveying head 22 can be simplified and the conveying head can be lightened. As a result, the driving control of the conveying head 22 becomes easy and the conveying position accuracy caused by the conveying head 22 is improved.

[0242] In addition, in the punch tool positioning device of the present embodiment, the positioning of the punch tool 10 along the Y axis is performed relative to the setting table 82, but the correct positioning of the punch tool 10 along the X axis is not required. Therefore, the positioning mechanism in the setting table 82 becomes simple, and the necessary space of the setting table 82 can be made the necessary minimum. Therefore, the movement control of the setting table 82 also becomes easy. In addition, the alignment of the setting table 82 and the conveying head 22 can be performed only along the Y axis with high precision, and the alignment along the X axis can be rough. This is because the alignment of the punch tool 10 along the X axis uses the conveying head 22 as a reference and is performed through the clamp mechanism 26.

[0243] In this embodiment, the clamp mechanism 26 also serves as a mounting mechanism for detachably mounting the press tool 10 on the transport head 22. The clamp mechanism 26 as a mounting mechanism also serves as a positioning mechanism, thereby eliminating the need to provide the transport head 22 with a positioning mechanism as a component other than the mounting mechanism.

[0244] exist Fig.10 In the multi-element transmission device 200 of the present embodiment shown in FIG. Figure 8 As shown, the punching tool 10 is mounted on the table 82 of the punching table 100 so that the mounting surface 16 faces upward along the Z axis. Fig.10 As shown, the component table 102 and the mounting table 104 are relatively movable at least along the Y-axis relative to the transport head 22, and the punching table 100 is relatively movable at least along the X-axis relative to the transport head 22.

[0245] Therefore, the conveying head 22 can be relatively moved on the punching table 100, the component table 102, and the mounting table 104. In addition, using the punching tool 10 held by the conveying head 22, a plurality of components 32r (32g, 32b) can be simultaneously moved from the surface of the component forming substrate 30 of the component table 102 to the surface of the mounting substrate 70 of the mounting table 104. In addition, after the punching tool 10 has moved the component 32r from the component forming substrate 32r to the mounting substrate 70, the conveying head 22 is used to return the punching tool 10 to the original setting table 82 of the punching table 100. In this way, in the multi-element conveying device 200 of the present embodiment, a plurality of components 32r (32g, 32b) can be efficiently conveyed using the punching tool 10.

[0246] Furthermore, when transferring multiple types of components 32r, 32g, 32b from the corresponding multiple component forming substrates 30 to the single mounting substrate 70, each component 32r, 32g, 32b can be transferred using a different punching tool 10 for each type. Therefore, it is easy to transfer different types of components 32r, 32g, 32b to the single mounting substrate 70 in a set arrangement, and it is easy to efficiently manufacture a component array with fewer pixel defects, etc.

[0247] The manufacturing method of the element array of this embodiment includes: a process of transporting the stamping tool 10 positioned by the stamping tool positioning device by the transport head 22; and a process of using the stamping tool 10 installed on the transport head 22 to simultaneously take out and transport the elements 32r (32g, 32b) as multiple transport object elements from the substrate 30.

[0248] In the device array manufacturing method of the present embodiment, a device array having a plurality of devices positioned and arranged with high accuracy can be manufactured easily, in a short time, and at low cost.

[0249] A method for manufacturing an element array according to another embodiment includes:

[0250] A step of preparing the press tool holding devices 80 in a number equal to or greater than the number of substrates 30 on which the plurality of types of components as the elements to be conveyed are arranged;

[0251] In each punching tool holding device 80, a process of setting a punching tool 10 prepared for each of the plurality of types of components is provided;

[0252] A process of picking up the punching tools 10 held in the punching tool holding devices 80 corresponding to the respective substrates 30 from the punching tool holding devices 80 by the conveying head 22, and simultaneously taking out and conveying a plurality of components 32r (or 32g, 32b) from the substrates 30 corresponding to the picked-up punching tools 10 using the punching tools 10 mounted on the conveying head 22; and

[0253] A process of returning the press tool 10 from which the plurality of components 32r (or 32g, 32b) have been taken out to the corresponding empty press tool holding device 80 after the plurality of components 32r (or 32g, 32b) have been taken out at the same time and conveyed.

[0254] In the manufacturing method of the element array of the present embodiment, the element array in which the elements 32r, 32g, and 32b of various types are arranged can be manufactured easily, in a short time, and at a low cost. Moreover, the punching tool 10 used for each substrate 30 corresponding to the various types of elements 32r, 32g, and 32b is set and stored in a dedicated punching tool holding device 80, so it is easy to effectively prevent the arrangement errors of the elements 32r, 32g, and 32b and to maintain the cleanliness of the punching surface of each punching tool 10 with high quality.

[0255] Second Embodiment

[0256] like Figure 1B As shown, in the punching tool 10a used in the conveying device of this embodiment, a shim plate 18 for adjusting the parallelism of the support plate 14 is interposed between the punching layer 12 and the joining plate 16. An inclined surface 14a is formed on a part of the side surface of the support plate, and the shim plate 18 is engaged with the inclined surface 14a to adjust the parallelism of the support plate 14. By using a method of providing the shim plate 18 between the support plate 14 and the joining plate 16 via the adhesive layer 15, the parallelism of the support plate 14 can be adjusted.

[0257] The purpose of setting the shim plate 18 is to adjust the parallelism, so the position of setting the shim plate 18 is not limited to this. The shim plate 18 can be set across the entire periphery of the joining plate 16, or can be set intermittently. Figure 1C , Figure 1D and Figure 1E As shown, the bonding layer 15 may be provided at the four corners of the joining plate 16, and the spacer plate 18 may be provided between the bonding surface 16b and the support plate 14 via the bonding layer 15 at only two locations on one side in the Y-axis direction. By such a configuration, when the joining plate 16 (or the support plate 14) is rectangular, slight parallelism adjustment can be achieved.

[0258] That is, Figure 1C As shown, when the joining plate 16 (or the supporting plate 14) is rectangular, a spacer plate 18 is arranged on any of the opposite sides, thereby adjusting the parallelism. In addition, if the joining plate 16 (or the supporting plate 14) is circular, a spacer plate 18 is arranged on any of the arc areas at a point-symmetrical position, thereby adjusting the parallelism.

[0259] More specifically, for example Figure 1E As shown, when the thickness of the stamping layer 12 varies along the Y-axis direction, a spacer plate 18 can be arranged in the gap on one side of the Y-axis direction between the support plate 14 and the bonding plate 16. As a result, the mounting surface 16a and the stamping surface of the stamping layer 12 become parallel, and the parallelism can be adjusted. Figure 1EIn order to facilitate the understanding of the description, the thickness and inclination of the punching layer 12, the gasket plate 18 and the adhesive layer 15 are shown to be larger than the actual ones.

[0260] The other structures and effects of the transport device and the press tool of this embodiment are the same as those of the first embodiment, and the detailed description thereof will be omitted.

[0261] Third Embodiment

[0262] like Figure 4A As shown, in the handling device of this embodiment, an elastically deformable engaging protrusion 26c is installed on the engaging surface 26b of the claw portion 26a of the clamp mechanism 26, and the engaging protrusion 26c can be engaged with the tapered surface 16c of the joint plate 16. The engaging protrusion 26c can also be made of, for example, a spring material and protrude from the engaging surface 26b in an arc shape. Figure 4B As shown, the engagement surface 26b does not necessarily need to be a flat surface, but may be a convex curved surface that can be engaged with the tapered surface 16c of the joining plate 16. The other structures and effects of the transport device and the press tool of this embodiment are the same as those of the first or second embodiment, and their detailed description is omitted.

[0263] Fourth Embodiment

[0264] In this embodiment, a method of mounting components by a replication method using the apparatus of the first to third embodiments described above is described. In the following description, descriptions of parts overlapping with the first to third embodiments described above are omitted.

[0265] In the method of this embodiment, if Figure 5B As shown, the component 32r picked up by the protrusion 11 of the stamping layer 10 is transported to the Fig.5C2 The first transfer substrate (second substrate) 50 is shown and is arranged on the adhesive layer 52.

[0266] Make it sticky Figure 5B The array of elements 32r of the protrusions 11 of the stamped layer 12 shown is replicated by Fig.5C2 The adhesive layer 52 of the substrate 50 is formed of an adhesive sheet or the like shown in the figure. Therefore, the component 32r adhered to the protrusion 11 of the stamping layer 12 is pressed onto the surface of the adhesive layer 52, and then the stamping layer 12 is lifted together with the conveying device 20. As a result, a plurality of components 32r are simultaneously copied to the surface of the adhesive layer 52. In addition, before this, Figure 3C The transport device 20 shown is moved to the Fig.5C2 On the substrate 50 shown.

[0267] The adhesive force of the adhesive layer 52 is adjusted so that the adhesive force of the adhesive layer 52 of the adhesive sheet formed by the substrate 50 is greater than the adhesive force of the protrusion 11. The adhesive layer 52 is made of an adhesive resin such as natural rubber, synthetic rubber, acrylic resin, silicone rubber, etc., and its thickness z4 is preferably equal to the height z2 of the element 32r (see Figure 5B ) is about 0.5 to 2.0 times of the original thickness. In order to smoothly move the element 32r from the protrusion 11 to the adhesive layer 52, an operation (such as heating) may be added to facilitate the element 32r to be peeled off from the protrusion 11.

[0268] The other elements 32g and 32b are also copied on the adhesive layer 52 of the substrate 50 in the same manner as described above. The three elements 32r, 32g, and 32b of R, G, and B constitute one pixel unit, and these pixel units are arranged in a matrix, thereby forming a color display screen.

[0269] Then, if Figure 5D As shown, the entire arrangement of the three components 32r, 32g, and 32b arranged on the surface of the first copy substrate 50 is copied to the adhesive layer 62 of the second copy substrate 60, and the terminals of the components 32r, 32g, and 32b are arranged to face the outside of the substrate 60. When performing this copy, a method such as a laser lift method may be used, or a copy using a difference in adhesive force, a copy accompanied by heat peeling, etc. It is also possible to form a tin-plated film on each terminal by a non-electrolytic plating method or the like in a state where each terminal of the components 32r, 32g, and 32b faces the outside of the substrate 60.

[0270] Then, if Figure 5E and Fig. 5F As shown, the arrangement of the three elements 32r, 32g, and 32b is copied from the adhesive layer 62 of the substrate 60 to the mounting substrate 70. When performing this copying, a method such as a laser lift method, a copying method using a difference in adhesive force, a copying method accompanied by heat peeling, etc. may be used.

[0271] Furthermore, in order to connect the terminals of the components 32r, 32g, and 32b to the circuit pattern of the mounting substrate after the replication, it is preferable to apply an anisotropic conductive paste (ACP) or arrange an anisotropic conductive film on the surface of the mounting substrate 70 in advance. Fig. 5F As shown, after the components 32r, 32g, and 32b are arranged on the substrate 70 via the ACP or ACF, the components 32r, 32g, and 32b can be pressed and heated toward the substrate 70 using a heating and pressing device (not shown). As a result, the terminals of the components 32r, 32g, and 32b can be connected to the circuit pattern of the mounting substrate.

[0272] In addition, the present invention is not limited to the above-mentioned embodiment, and various changes can be made within the scope of the present invention.

[0273] For example, as a punching tool, it is not limited to the punching tool 10 of the above-mentioned embodiment, and other punching tools can also be used. In the conveying head 22, as a secondary mounting mechanism other than the clamping mechanism 26, at least one of an electrostatic adsorption mechanism, a fitting mechanism, and a screwing mechanism can also be provided. In addition, in the conveying head 22, as a first axis positioning mechanism other than the clamping mechanism 26, an electrostatic adsorption mechanism, a fitting mechanism, or a screwing mechanism can also be used. By providing these mechanisms in the conveying head, it is also possible to easily position the punching tool 10 relative to the conveying head 22.

[0274] In addition, in the above-mentioned embodiment, vacuum adsorption by the vacuum suction hole is used as the main mounting mechanism of the transport head 22. However, in the present invention, it is not necessary to use vacuum adsorption, and the punching tool 10 can be detachably mounted to the transport head 22 only by the first axis positioning mechanism such as the clamp mechanism 26. In addition, in the above-mentioned embodiment, positioning can be performed without using the clamp mechanism 26. If the punching tool 10 can be detachably held relative to the transport head 22 with sufficient holding force, a vacuum adsorption mechanism or an electrostatic adsorption mechanism can also be installed on the transport head. Alternatively, as a main mounting mechanism other than the clamp mechanism 26, an electrostatic adsorption mechanism, a fitting mechanism, a screw mechanism, or other loading and unloading devices can be installed on the transport head 22.

[0275] It should be noted that the press tool held by the press tool holding device of the above-mentioned embodiment is not limited to the above-mentioned press tool 10, and may be another press tool.

[0276] Furthermore, in the above-mentioned embodiment, if Figure 8 As shown in FIG. 1 , a single press table 100 is prepared for each single setting table 82. However, since these multiple press tables 100 are driven along the X-axis and / or the Y-axis in the same manner, they can be regarded as a single press table 100. Of course, three or more setting tables 82 may be arranged on a single press table 100. In addition, similarly, Figure 3A As shown, a single component table 102 is prepared for each single component forming substrate 30, but these multiple component tables 102 are driven along the X-axis and / or Y-axis in the same manner, so they can be regarded as a single component table 102. Of course, three or more component forming substrates 30 can be arranged on a single component table 100.

[0277] In addition, the conveying device 20 having the stamping tool positioning device of this embodiment is used to pick up the component 32r (32g, 32b) from the substrate 30 for component formation, but it is not limited to this use, and can also be used to pick up the component 32r (32g, 32b) from a substrate (sheet) with an adhesive layer copied from the substrate 30 by a laser lifting method or the like.

[0278] In addition, the conveying device 20 having the punching tool positioning device of this embodiment can also be used to pick up components other than the components 32r, 32g, and 32b for red, green, and blue light emission. As other display components, fluorescent components are exemplified. In addition, as other components, it is not limited to display components, and electronic components such as light receiving components, ceramic capacitors, and chip inductors, or semiconductor components can also be used.

[0279] Explanation of symbols

[0280] 10…Pressing tools

[0281] 11…convex part

[0282] 12…Stamping layer

[0283] 14…Support plate

[0284] 14a… Inclined surface

[0285] 14b…Adsorbable surface

[0286] 14c…insertable surface

[0287] 15…Bonding layer

[0288] 16...Joint plate

[0289] 16a…Mounting surface

[0290] 16b…bonding surface

[0291] 16c...conical surface

[0292] 16d…Edge

[0293] 18…Shim plate

[0294] 20…Handling device

[0295] 22…Transporting head

[0296] 24…Adsorption surface

[0297] 26…Chuck mechanism (1st axis positioning mechanism)

[0298] 26a…claw

[0299] 26b…Engagement surface

[0300] 26c…engagement convex portion

[0301] 28…Opening and closing mechanism

[0302] 30…Element formation substrate (first substrate / element placement substrate)

[0303] 32r, 32g, 32b…components

[0304] 50…1st replication substrate (2nd substrate / sheet)

[0305] 52…Adhesive layer

[0306] 60 ... second replication substrate (sheet)

[0307] 62…Adhesive layer

[0308] 70…Mounting substrate (second substrate / sheet)

[0309] 80…Press tool holding device

[0310] 81…Base

[0311] 82…

[0312] 83…Gas flow hole

[0313] 84…Setting surface

[0314] 85…Suction hole

[0315] 86…Storage recess

[0316] 88…Guide member

[0317] 89… Inclined surface

[0318] 90...Positioning member (second axis positioning mechanism)

[0319] 92…Front end

[0320] 100…Pressing table

[0321] 102…Component table (Table 1)

[0322] 104…Installation table (second table)

[0323] 110…Integrated table

[0324] 120…Control device (control mechanism)

[0325] 122…Camera device (camera mechanism)

[0326] 200…Multi-element transport device.

Claims

1. A punching tool holding device, characterized in that: A punching tool holding device having a setting table on which a punching tool having a punching layer is detachably set, wherein the punching layer has a portion to which a conveying object element can be detachably adhered, The installation table includes an installation surface having a housing recess for housing the punching layer, and a suction hole capable of detachably sucking a part of the punching tool located around the punching layer is formed on the installation surface.

2. The punching tool holding device according to claim 1, characterized in that: The installation table is detachably fixed to the base.

3. The punching tool holding device according to claim 1 or 2, characterized in that: The installation table is formed with a gas flow hole that communicates with the space in the storage recess and replaces the gas in the storage recess.

4. The punching tool holding device according to claim 1 or 2, characterized in that: A guide mechanism for guiding along at least a first axis is installed on an upper portion of the installation table so that the punching layer of the punching tool falls into the interior of the housing recess.

5. The punching tool holding device according to claim 4, characterized in that: The guide mechanism includes a plurality of guide members detachably mounted on both sides of the installation table along the first axis. Each of the guide members is formed with an inclined surface that can engage with the tapered surface of the press tool.

6. The punching tool holding device according to claim 5, characterized in that: At least two guide members are installed along the first axis on both sides of the installation table. The claw portion of the chuck mechanism can be inserted along the gap between the two guide members.

7. The punching tool holding device according to claim 1 or 2, characterized in that: The device further comprises a pair of positioning members which are arranged on both sides of the installation table along the second axis direction and can abut against and move away from the edge of a press tool installed on the upper part of the installation table.

8. A method for manufacturing an element array, characterized in that: have: A step of picking up the punching tool held by the punching tool holding device according to any one of claims 1 to 7 by a transport head; and A step of simultaneously taking out and conveying a plurality of conveyance target elements from a substrate using a punching tool attached to the conveyance head.

9. A method for manufacturing an element array, characterized in that: have: A step of preparing the press tool holding device according to any one of claims 1 to 7 in a number equal to or greater than the number of substrates on which the plurality of types of components as the conveying target elements are arranged; A process of providing a punching tool for each of the plurality of types of components in each of the punching tool holding devices; The process of picking up the punching tools held in the respective punching tool holding devices corresponding to the respective substrates by a transport head from the punching tool holding device, and simultaneously taking out and transporting a plurality of the components from the substrates corresponding to the picked-up punching tools using the punching tools mounted on the transport head; and A step of returning the press tool from which the plurality of components have been taken out to the corresponding press tool holding device after the plurality of components have been taken out simultaneously and transferred.

10. A punching tool positioning device, characterized in that: have: A setting table on which a punching tool having a punching layer is detachably provided, wherein the punching layer has a portion to which a transport object element can be detachably adhered; a handling head capable of picking up the punching tool disposed on the setting table; a first axis positioning mechanism for positioning and adjusting the relative position of the punching tool relative to the handling head along the first axis; and A second axis positioning mechanism positions and adjusts the relative position of the press tool with respect to the installation table along a second axis intersecting the first axis.

11. The punching tool positioning device according to claim 10, characterized in that: The first shaft positioning mechanism also serves as a mounting mechanism for detachably mounting the press tool on the transport head.

12. The punching tool positioning device according to claim 11, characterized in that: The mounting mechanism includes a chuck mechanism which is provided on opposite sides to each other along the first axis of the transport head and is provided to be movable in contact with and away from the press tool.

13. The punching tool positioning device according to any one of claims 10 to 12, characterized in that: The second axis positioning mechanism includes at least a pair of second positioning members which are arranged on both sides of the installation table along the second axis direction and are capable of coming into contact with and moving away from a press tool installed on the installation table.

14. The punching tool positioning device according to any one of claims 10 to 12, characterized in that: The installation table includes an installation surface having a housing recess for housing the punching layer, and a suction hole capable of detachably sucking a part of the punching tool located around the punching layer is formed on the installation surface.

15. The punching tool positioning device according to any one of claims 10 to 12, characterized in that: The installation table is detachably fixed to the base.

16. The punching tool positioning device according to claim 14, characterized in that: The installation table is formed with a gas flow hole that communicates with the space in the storage recess and replaces the gas in the storage recess.

17. The punching tool positioning device according to any one of claims 10 to 12, characterized in that: A guide mechanism for guiding the press tool at least along a first axis is mounted on the installation table.

18. The punching tool positioning device according to claim 17, characterized in that: The guide mechanism includes a plurality of guide members detachably mounted on both sides of the installation table along the first axis.

19. The punching tool positioning device according to claim 18, characterized in that: At least two guide members are installed along the first axis on both sides of the installation table. The first shaft positioning mechanism is inserted along the gap between the two guide members and can come into contact with the press tool.

20. A method for manufacturing an element array, characterized in that: have: A step of transporting the punching tool positioned by the punching tool positioning device according to any one of claims 10 to 19 by a transport head; and A step of simultaneously taking out and conveying a plurality of conveyance target elements from a substrate using a punching tool attached to the conveyance head.

21. A multi-element transmission device, characterized in that: have: A punching table, on which at least one punching tool having a punching layer is detachably provided, wherein the punching layer has a portion to which a plurality of transport object elements can be detachably adhered; a handling head capable of picking up at least one of the punching tools disposed on the punching table; a first table having a first base plate on which the transport target element is arranged in a detachable manner; and a second table on which a second substrate having a surface on which the transport object element arranged on the first substrate is transported and transferred by the punching tool is detachably fixed; The punching table and the first table are arranged along a first axis, The first table and the second table are arranged along a second axis intersecting the first axis. The conveying head is capable of relative movement at least relative to the press table along a third axis intersecting both the first axis and the second axis. The punching tool has a mounting surface on which the transport head is detachably mounted on the opposite side of the punching layer. The punching tool is mounted on the punching table in a manner that the mounting surface faces upward along the third axis. The first table and the second table are relatively movable relative to the transport head at least along the second axis. The press table is relatively movable with respect to the transport head at least along the first axis.

22. The multi-element transmission device according to claim 21, characterized in that: The first substrate includes a plurality of element arrangement substrates on which the conveyance target elements of different types are arranged, respectively. The second substrate is a single mounting substrate or a single replication substrate. The punching table includes a plurality of setting tables for detachably holding punching tools corresponding to the plurality of element configuration substrates, The transport head further includes a control mechanism for driving and controlling the positional relationship between the transport head, the first table, the second table, and the punching table in the following manner: Pick up the punching tools respectively corresponding to the plurality of element arrangement substrates from the corresponding setting table; Using the picked-up punching tool, taking out the transport object element from the corresponding element configuration substrate; The taken-out transport element is moved to the second substrate.

23. The multi-element transmission device according to claim 21 or 22, characterized in that: It also has a camera mechanism capable of simultaneously photographing in two directions and capable of entering into the space between the surface of the first substrate and the stamping layer of the stamping tool while keeping the conveying head of the stamping tool above the first substrate. The imaging means simultaneously images the pressing surface of the pressing layer and the surface of the first substrate.

24. The multi-element transmission device according to claim 23, characterized in that: The present invention further comprises a fine adjustment mechanism for changing the relative position between the transport head and the first substrate based on a detection signal picked up by the imaging mechanism.

25. The multi-element transmission device according to claim 24, characterized in that: The fine adjustment mechanism changes a relative rotation angle of the transport head around the third axis based on a detection signal captured by the imaging mechanism.

26. The multi-element transmission device according to claim 21 or 22, characterized in that: Also features: a first axis positioning mechanism for positioning and adjusting the relative position of the punching tool with respect to the handling head along the first axis; and A second axis positioning mechanism positions and adjusts the relative position of the press tool with respect to the press table along the second axis.

27. The multi-element transmission device according to claim 26, characterized in that: The first shaft positioning mechanism also serves as a mounting mechanism for detachably mounting the press tool on the transport head.

28. The multi-element transmission device according to claim 27, characterized in that: The mounting mechanism includes a chuck mechanism which is provided on opposite sides to each other along the first axis of the transport head and is provided to be movable in contact with and away from the press tool.

29. The multi-element transmission device according to claim 26, characterized in that: The second axis positioning mechanism includes at least a pair of second positioning members arranged on both sides along the second axis direction of a setting table fixed to the press table and capable of contacting and separating from a press tool set on the setting table.

30. The multi-element transmission device according to claim 29, characterized in that: The installation table includes an installation surface having a housing recess for housing the punching layer, and a suction hole capable of detachably sucking a part of the punching tool located around the punching layer is formed on the installation surface.

31. The multi-element transmission device according to claim 29, characterized in that: A guide mechanism for guiding the press tool at least along a first axis is mounted on the installation table.

32. A method for manufacturing an element array, characterized in that: Using the multi-element conveying device according to any one of claims 21 to 31, a plurality of conveyance target elements are simultaneously taken out from a substrate and conveyed, thereby manufacturing a device array.

33. A method for manufacturing an element array, characterized in that: have: A step of preparing a setting table on which a press tool is detachably held, the number of which is equal to or greater than the number of element arrangement substrates on which respective components of a plurality of types are arranged; A step of setting a punching tool prepared for each of the plurality of types of components at each of the setting stations; The process of picking up the punching tools held on the respective setting tables corresponding to the respective element configuration substrates by the transport head from the setting table, and simultaneously taking out and transporting a plurality of the components from the element configuration substrates corresponding to the picked-up punching tools using the punching tools mounted on the transport head; as well as A step of returning the press tool from which the plurality of components have been taken out to the corresponding empty installation table after the plurality of components have been taken out simultaneously and transferred.

Images