A heat sink with high-throughput capillary structure

Abstract

The present invention relates to a heat spreader, and more particularly to a heat spreader with a high-flux capillary structure. The heat spreader comprises an upper cover plate and a lower cover plate; one side of the lower cover plate is provided with a capillary layer; the capillary layer is provided with N circumferential skeletons and P centripetal skeletons, and the N circumferential skeletons are formed into a whole by the P centripetal skeletons; the centripetal skeleton is provided with a flow guide column; the circumferential skeleton is provided with a conical hole; the area enclosed by two adjacent centripetal skeletons and two adjacent circumferential skeletons is a groove; the circumferential skeleton, the centripetal skeleton and the flow guide column are all made of a heat-conducting material with pores; one side of the upper cover plate is provided with an upper cover plate capillary layer, and when assembled, the side of the upper cover plate with the upper cover plate capillary layer faces downward. The effective thermal conductivity of the heat spreader designed by the present invention is higher than 0.5×10 4 W / m·K, heat flux is not less than 50W / cm 2 The temperature difference of the heat sink within the power range is no more than ±10℃.

Description

Technical Field

[0001] The present invention relates to a vapor chamber, and in particular to a vapor chamber with a high-throughput capillary structure. Background Art

[0002] Maximizing heat dissipation power and efficiency within a limited space is a critical thermal management challenge facing the electronics industry, particularly high-power electronic products like 5G. Increased power consumption inevitably leads to heat dissipation challenges within confined spaces. Ultra-thin heat pipes (HP) and vapor chambers (VC), which utilize liquid-solid phase transition to transfer heat and dissipate heat, are currently a hot topic and are widely used in mobile phones, tablets, laptops, LEDs, and other end-user electronic products. As the power consumption of 5G electronic products increases, the requirements for heat dissipation become more stringent, leading to an increasing demand for new high-thermal conductivity heat dissipation materials and their devices, necessitating more efficient thermal management methods. Conventional vapor chamber capillary structures, typically consisting of single planar structures composed of metal powder, metal mesh, metal fiber, grooves, etching, or deposition, offer limited heat dissipation power. To further enhance the heat dissipation power of vapor chambers, a combination of structures is being considered. However, this is limited by the processing methods. Currently, simple combinations of multiple structures, such as powder, mesh, pillars, and grooves, offer improved heat dissipation power, but the process is complex and requires multiple steps. These traditional HP or VC heat dissipation materials are subject to the difficulty of designing, preparing and processing the capillary structure, making it difficult to achieve higher power limits. They are already difficult to meet the requirements in terms of total heat dissipation, volume, quality and many other aspects. As a result, the heat dissipation problem has seriously affected the performance stability and service life of 5G electronic equipment. Summary of the Invention

[0003] The present invention aims to provide a high-throughput capillary structure vapor chamber that can solve at least one of the above-mentioned technical problems. The technical solution disclosed in the present invention is as follows:

[0004] A heat spreader with a high-flux capillary structure; comprising an upper cover plate 1 and a lower cover plate 9; one side of the lower cover plate 9 is provided with a capillary pore layer 15; P centripetal skeletons 7 are provided on the capillary pore layer 15; the centripetal skeletons 7 are made of a thermally conductive material with pores; the upper cover plate 1 is provided with an upper cover plate capillary pore layer 2 on one side.

[0005] The present invention can greatly improve the heat distribution performance by designing a capillary layer on both the upper cover plate 1 and the lower cover plate 9, and cooperating with the centripetal skeleton 7 made of porous material.

[0006] Preferably, a heat spreader with a high-flux capillary structure comprises an upper cover plate 1 and a lower cover plate 9; one side of the lower cover plate 9 is provided with a capillary layer 15; the capillary layer 15 is provided with N circumferential skeletons 8 and P centripetal skeletons 7, the N circumferential skeletons 8 being integrated by the P centripetal skeletons 7; the centripetal skeletons 7 are provided with flow guide columns 4; the circumferential skeletons 8 are provided with conical holes 3; the area enclosed by two adjacent centripetal skeletons 7 and two adjacent rings of circumferential skeletons 8 is a groove 5; the circumferential skeletons 8, the centripetal skeletons 7, and the flow guide columns 4 are all made of a thermally conductive material with pores; one side of the upper cover plate 1 is provided with an upper cover plate capillary layer 2, and during assembly, the side of the upper cover plate 1 with the upper cover plate capillary layer 2 faces downward. N is greater than or equal to 2, preferably greater than or equal to 4, and more preferably 4-12. P is greater than or equal to 3, preferably greater than or equal to 6, and more preferably 10-20.

[0007] Preferably, the hole 3 is a tapered hole.

[0008] Preferably, in a heat spreader with a high-flux capillary structure, the capillary layer 2 on the upper cover plate 1 has a porosity of 30-70%, a pore size of no more than 200 μm, and a thickness of 0.05-1 mm.

[0009] Preferably, in a high-flux capillary structure heat sink, the capillary layer 15 has a porosity of 30-70%, a pore size of no more than 200 μm, and a thickness of 0.05-0.5 mm. This porous capillary layer can transport liquid media.

[0010] The average width of the circumferential skeleton 8 is 0.3-3 mm, and the thickness is 0.1-3 mm. The initial center radius of the circumferential skeleton is 2-12 mm, preferably 4-8 mm, and increases in radius outward by 0.6-6 mm, preferably 1-4 mm. This means that the equivalent diameter of the second circle is 0.6-6 mm, preferably 1-4 mm, larger than the equivalent diameter of the first circle. In industrial applications, to ensure that the groove 5 forms a trapezoid, the upper width of the circumferential skeleton 8 is smaller than the lower width, and the distance from the upper surface of the circumferential skeleton 8 to the upper cover plate is smaller than the distance from the lower surface of the circumferential skeleton 8 to the upper cover plate. Preferably, the width of the lower surface of the circumferential skeleton 8 minus the width of the upper surface of the circumferential skeleton 8 is 0.1-3 mm.

[0011] The circumferential skeleton 8 and the central area of ​​the heat source are provided with a tapered hole 3. The intersection of the circumferential skeleton (8) or the P-root centripetal skeletons (7) is provided with a tapered hole (3).

[0012] Preferably, the depth of the tapered hole 3 is 0.1-3 mm, and the hole depth is smaller than the thickness of the circumferential skeleton and the centripetal skeleton; the diameter of the large end is 0.2-2 mm, and the diameter of the small end is 0.1-1 mm.

[0013] As a further preference, the minimum distance between adjacent tapered holes 3 is 0.2-2 mm.

[0014] The average width of the centripetal skeleton 7 is 0.3-3mm; the thickness is 0.1~3mm; P centripetal skeletons are evenly distributed at equal angles in the circumferential direction. The equivalent diameter of the guide column 4 is 0.3-3mm, and is less than or equal to the width of the corresponding surface of the centripetal skeleton 7; the height is 0.1-5mm. In industrial applications, in order to ensure that the groove 5 is trapezoidal; the upper width of the centripetal skeleton is smaller than the lower width; and the distance from the upper side of the centripetal skeleton to the upper cover plate is smaller than the distance from the lower side to the upper cover plate. As a preferred method, the width of the lower side of the centripetal skeleton - the width of the upper side of the centripetal skeleton is 0.1-3mm.

[0015] In particular, a porous guiding column 4 is passed between the upper and lower structures so that the condensed medium in the capillary layer of the upper cover plate can quickly flow back to the lower structure 6 and play a supporting role in the inner cavity.

[0016] As a further preference, the minimum spacing between adjacent guide columns 4 is 0.4-4 mm.

[0017] From the center of the lower cover plate 9 to the edge, the height of the groove 5 remains unchanged, but the areas of the upper surface and the lower surface gradually increase. The area of ​​the upper surface of the groove 5 is larger than the area of ​​the small surface.

[0018] The lower structure 6 consists of a capillary layer 15 , N circumferential skeletons 8 , P centripetal skeletons 7 , guide columns 4 , tapered holes 3 , and grooves 5 .

[0019] The N circumferential skeletons 8, the P centripetal skeletons 7, and the flow-guiding pillars 4 are all constructed from porous materials. Preferably, the N circumferential skeletons 8, the P centripetal skeletons 7, and the flow-guiding pillars 4 are all constructed from materials with a capillary structure. The porosity is 10-70%, and the pore size is no greater than 200 μm. This porous structure provides an excellent channel for transporting liquid media.

[0020] The lower structure 6 has a complex centripetal capillary structure connected to the lower cover plate 9, and the centripetal structure is directed toward the center of the heat source (such as Figure 3 In the area shown in FIG4 , the complex capillary structure is a centripetal infusion channel and the infusion capacity has a gradient change. The centripetal skeleton and the circumferential skeleton are denser toward the center of the heat source, and the infusion capacity is stronger toward the center.

[0021] In particular, the lower structure 6 is a gradient high-flux capillary structure, and the gradient high-flux capillary structure can be a structural gradient or a performance gradient. The structural gradient is a gradient change in size, including but not limited to a gradient change in size in at least one structural dimension of the structure in the up-down, left-right, inside-out, front-back, and circumferential directions, that is, including but not limited to gradient changes in the dimensions of tapered holes, trapezoidal grooves, trapezoidal skeletons, trapezoidal centripetal skeletons, and trapezoidal circumferential skeletons; such gradient changes ultimately lead to gradient changes in performance such as the ability to transport liquid or the speed of steam evaporation, including but not limited to gradual changes in performance in the up-down, left-right, inside-out, front-back, and circumferential directions; in particular, the gradient includes at least one of a gradient change in a local area and a gradient change in the entire area;

[0022] As a further preferred embodiment, rough capillary particles 10 are further provided on the surface of the tapered hole 3 and / or the groove 5;

[0023] The rough capillary particles 10 can be prepared by electroplating, chemical deposition, physical vapor deposition or micro-nano powder sintering, and the size of a single capillary particle is no greater than 500 μm.

[0024] Specifically, the centripetal and circumferential frameworks contain evenly distributed tapered holes 3. These tapered holes are wide at the top and narrow at the bottom, forming gradient micro-capillaries. Specifically, the taper of the tapered holes is 10 to 80 degrees. Specifically, the grooves are wide at the top and narrow at the bottom, with the angle of the bevel being 10 to 80 degrees. These tapered holes or trapezoidal grooves, along with the rough capillary surface, allow bubbles formed by the heat source to quickly gather, rise, and be removed on the inclined surface. This reduces the buoyancy of the liquid medium in the pool and the surface tension within the capillaries, thereby increasing the removal rate of the medium bubbles from the capillary structure in the heated area and improving the heat absorption and heat transfer capabilities.

[0025] When used in industry, the phase change medium, the upper and lower cover plates, and various components arranged between the upper and lower cover plates are sealed and connected to form a closed cavity.

[0026] In industrial applications, the vacuum degree of the closed cavity is controlled at 0.01-10 Pa, and the amount of liquid injected into the cavity is 0.7-1.3 times the total amount of capillary liquid, ultimately forming an effective thermal conductivity higher than 0.5×10 4 W / m·K, heat flux is not less than 50W / cm 2 The temperature difference of the heat spreader within the power range is no more than 10°C, and the optimization can achieve a temperature difference of no more than 8°C. In particular, the effective thermal conductivity reaches 1×10 4 W / m·K and above, heat flux ratio can reach 400W / cm 2 Above, the temperature difference within the power range is not greater than 5℃.

[0027] In the present invention, the capillary structure is made of copper, aluminum, stainless steel, titanium, organic matter, ceramics and other materials using existing technology, and is tightly connected to the inner walls of the upper and lower cover plates. This high-throughput capillary structure forms a good medium liquid delivery channel and a steam rapid circulation channel by optimizing the process and designing the volume ratio, shape structure and porosity of the capillary material.

[0028] In particular, the upper and lower cover plates are both made of hydrophilic materials or materials that have been hydrophilically treated, and the contact angle of water is no greater than 90 degrees.

[0029] The selected material is a single material or a mixture of two or more hydrophilic materials such as copper, aluminum, stainless steel, titanium, organic matter, ceramics, etc.

[0030] When necessary, the inner cavity can be passivated.

[0031] A heat spreader with a high-throughput capillary structure, wherein the complex capillary structure can be prepared by processes such as hot pressing, 3D printing or silk screen printing.

[0032] Principles and advantages

[0033] The present invention adopts a high-throughput three-dimensional capillary structure with a centripetal gradient capillary effect. The infusion channels and infusion capacity change gradually from the periphery to the center. The infusion capacity and heat dissipation capacity increase as one moves closer to the center, forming a high-throughput medium liquid-gas phase change heat energy transfer and a recyclable rapid channel. The capillary structure of a conventional heat spreader is a conventional linear or planar structure composed of grooves, meshes, wires, powders, etc. The structure around the heat source is the same, resulting in a single capillary function and performance that needs to be further improved. The temperature near the heat source is high, and a large amount of medium is required to participate in phase change heat absorption and heat transfer. Conventional structures are difficult to meet the requirements, resulting in a rapid local temperature rise. The gradient capillary achieves the following: the centripetal gradient capillary allows the medium to quickly gather in the heat source area; the capillaries near the heat source have local cone holes and cone grooves. These trumpet-shaped cone holes and cone grooves help the medium to evaporate quickly and quickly leave the capillary, accelerating the evaporation of the medium to take away heat; the customized capillary quickly collects the condensed medium liquid and converges in the tributary and mainstream channels. The medium liquid finally gathers in the heat source area, forming a circulatory and rapid channel for high-throughput medium liquid-gas phase change heat energy transfer.

[0034] Its basic principle is as follows: the centripetal high-flux complex capillary structure consists of a centripetal skeleton 7, conical holes 3, trapezoidal grooves 5, a circumferential skeleton 8 and related capillary structures; the liquid medium that reaches the vaporization condition under the influence of the heat source temperature can accelerate vaporization through the conical holes 3 on the skeleton and the grooves 5 on the edge of the skeleton, absorb heat, and form a low-liquid or liquid-deficient area; the vaporized medium condenses in the capillary layer 2 of the upper cover plate to form condensed liquid, and the guide force column 4 collects the condensed liquid and flows it to the nearest centripetal skeletons 7. The centripetal skeleton 7 collects the liquid medium in each area and quickly transports it to the nearest low-liquid and liquid-deficient areas. area and vaporizes; the liquid medium with excess liquid accumulation continues to converge to the center of the heat source through the action of capillary force in the centripetal skeleton 7; the heat in the center of the heat source is relatively large, and the liquid medium that needs to participate in the deheating is quickly converged through the centripetal skeleton 7 in all directions, and is accelerated to evaporate and vaporize through the conical holes 3 and the porous capillary structure to absorb heat; the inner cavity 14 is a connected structure, and the vaporized gas medium diffuses into the inner cavity 14, and is capillary condensed in the capillary layer 2 of the upper cover plate at the cold end to form droplets and release heat. Under the action of capillary force, the droplets are transmitted to the lower structure 6 through the guide force column 4.

[0035] The tapered holes 3 and trapezoidal grooves 5, along with the rough capillaries on their surfaces, facilitate the rapid gathering, rising, and removal of bubbles formed by the heat source on the sloped surfaces. This reduces the buoyancy in the liquid medium pool and the surface tension within the capillaries, thereby increasing the removal rate of medium bubbles from the capillary structure in the heated area and significantly improving the heat absorption and heat transfer capabilities, thereby achieving the goal of rapid and efficient heat distribution and heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of a vapor chamber with a high-throughput capillary structure designed for the present invention;

[0037] Figure 2 A schematic diagram of the working process of a high-throughput capillary structure for liquid / gas phase change soaking in a soaking plate designed by the present invention;

[0038] Figure 3 A schematic diagram of the complex capillary structure of a high-throughput capillary structure designed for the present invention.

[0039] In the figure, 1 is the upper cover plate, 2 is the capillary layer of the upper cover plate, 3 is the conical hole, 4 is the guide column, 5 is the groove, 6 is the lower structure, 7 is the centripetal skeleton, 8 is the circumferential skeleton, 9 is the lower cover plate, 10 is the rough capillary, 11 is the heat source, 12 is the liquid flow direction, 13 is the steam flow direction, 14 is the inner cavity, and 15 is the capillary layer of the lower cover plate. DETAILED DESCRIPTION

[0040] Example 1

[0041] A heat spreader with a high-flux capillary structure comprises an upper cover plate 1 and a lower cover plate 9; one side of the lower cover plate 9 is provided with a capillary layer 15; the capillary layer 15 is provided with 6 circles of circumferential skeletons 8 and 16 centripetal skeletons 7, and the 6 circles of circumferential skeletons 8 are formed into a whole by the 16 centripetal skeletons 7; the centripetal skeletons 7 are provided with guide columns 4; the circumferential skeletons 8 are provided with conical holes 3; the area surrounded by two adjacent centripetal skeletons 7 and two adjacent circles of circumferential skeletons 8 is a groove 5; the circumferential skeletons 8, the centripetal skeletons 7 and the guide columns 4 are all made of a thermally conductive material with pores; one side of the upper cover plate 1 is provided with an upper cover plate capillary layer 2, and when assembled, the side of the upper cover plate 1 with the upper cover plate capillary layer 2 faces downward.

[0042] In the heat spreader with such a high-flux capillary structure, the capillary layer 2 of the upper cover plate 1 has a porosity of 55%, a pore size of no more than 100 μm, and a thickness of 0.2 mm.

[0043] The capillary layer 15 has a porosity of 55%, a pore diameter of not more than 100 μm, and a thickness of 0.2 mm.

[0044] There are 16 centripetal skeletons 7 , and the 16 centripetal skeletons 7 are evenly distributed, that is, the angle between adjacent centripetal skeletons is 22.5 degrees.

[0045] Conical holes 3 are provided on the circumferential skeleton 8 and the central area of ​​the heat source. The depth of the conical holes 3 is 0.4 mm; the diameter of the large end is 0.3 mm, and the diameter of the small end is 0.15 mm; the minimum spacing between adjacent conical holes 3 is 1 mm.

[0046] The width of the upper surface of the circumferential skeleton 8 is 0.5 mm, and the width of the lower surface is 0.8 mm; the thickness is 0.4 mm; the initial value of the center radius of the circumferential skeleton is 6 mm, and the outward increment is 1 mm.

[0047] The width of the upper surface of the centripetal skeleton 7 is 0.5 mm, the width of the lower surface is 0.8 mm, and the thickness is 0.4 mm. There are 16 centripetal skeletons evenly distributed at equal angles in the circumferential direction.

[0048] The equivalent diameter of the guide column 4 is 0.4 mm, and the height is 0.3 mm.

[0049] The minimum spacing between adjacent guide columns 4 is 1 mm.

[0050] From the center of the lower cover plate 9 to the edge, the height of the groove 5 remains unchanged, but the areas of the upper surface and the lower surface gradually increase.

[0051] The lower structure 6 is composed of a capillary layer 15 , six circumferential skeletons 8 , 16 centripetal skeletons 7 , guide columns 4 , tapered holes 3 , and grooves 5 .

[0052] The six circumferential skeletons 8, the sixteen centripetal skeletons 7, and the diversion pillars 4 are all made of porous materials. Preferably, the six circumferential skeletons 8, the sixteen centripetal skeletons 7, and the diversion pillars 4 are all made of copper with a capillary structure. The porosity is 55% and the pore size is no greater than 100 μm.

[0053] The lower structure 6 has a complex centripetal capillary structure connected to the lower cover plate 9, and the centripetal structure is directed toward the center of the heat source (such as Figure 3 In the area shown in FIG4 , the complex capillary structure is a centripetal infusion channel and the infusion capacity has a gradient change. The centripetal skeleton and the circumferential skeleton are denser toward the center of the heat source, and the infusion capacity is stronger toward the center.

[0054] The lower structure 6 is a gradient high-flux capillary structure, which has gradients in structure and liquid absorption performance. The conical holes, trapezoidal grooves, trapezoidal centripetal skeletons and trapezoidal circumferential skeletons all have structural conical gradient changes; these structures are denser towards the center of the heat source, and the liquid infusion capacity is stronger towards the center, and there is a circumferential liquid infusion performance gradient.

[0055] Rough capillary particles 10 are also provided on the surface of the tapered hole 3 and the groove 5;

[0056] The rough capillary particles 10 can be prepared by sintering micro-nano powders, and the size of a single capillary particle is no greater than 100 μm.

[0057] The centripetal and circumferential frameworks are equipped with evenly distributed tapered holes (3). These holes are wide at the top and narrow at the bottom, forming gradient micro-capillaries with a taper of 10°. The grooves are wide at the top and narrow at the bottom. These tapered holes and trapezoidal grooves, along with the rough capillary surface, allow bubbles formed by the heat source to quickly gather, rise, and be removed on the inclined surface. This reduces the buoyancy of the liquid medium in the pool and the surface tension within the capillaries, thereby increasing the removal rate of medium bubbles from the capillary structure in the heated area and improving the heat absorption and heat transfer capabilities.

[0058] In this embodiment, all porous capillary structure parts (including the upper cover plate capillary layer 2, the guide force column 4, the lower structure 6, the centripetal skeleton 7, the circumferential skeleton 8, the rough capillary 10 and the lower cover plate capillary layer 15) are made of red copper and are tightly connected to the inner walls of the upper and lower cover plates. This high-throughput capillary structure forms a good medium liquid delivery channel and a steam rapid circulation channel by optimizing the process and designing the volume ratio, shape structure and porosity of the capillary material.

[0059] The upper and lower covers are made of 316L stainless steel.

[0060] The stainless steel surface of the inner cavity needs to be passivated so that the contact angle between the inner wall and water is no more than 90 degrees.

[0061] The centripetal complex capillary structure consists of a centripetal skeleton 7 and a circumferential skeleton 8; the guide force column 4 collects the condensed liquid to flow to the nearest centripetal skeletons 7, and the centripetal skeletons 7 collect the liquid medium in each area, providing a channel for the gathered liquid medium to converge to the heat source area, and quickly transport it to the nearest low-liquid area; at the same time, the liquid medium that reaches the vaporization conditions under the influence of the heat source temperature can also be accelerated to vaporize through the conical holes 3 on the skeleton and the grooves 5 on the edge of the skeleton, absorb part of the heat, and form a low-liquid area.

[0062] This high-throughput capillary vapor chamber features a complex capillary structure produced through hot pressing. The capillary layer of the upper cover is sintered at 850°C for 30 minutes. The capillary layer of the lower cover is formed in one step using hot pressing. A hot pressing mold is first machined, then filled with powder and placed in the lower cover. The mold is then hot pressed and sintered to produce a sintered body with the lower cover. The hot pressing process is performed at 850°C for 30 minutes at a pressure of 25 MPa.

[0063] The upper and lower cover plates and the components arranged between the upper and lower cover plates are sealed and connected to form a closed cavity.

[0064] The vacuum degree of the closed cavity is controlled at 3 Pa, and the amount of water injected into the cavity is 1.05 times the total amount of capillary absorption liquid.

[0065] The final effective thermal conductivity is 1.12×10 4 W / m·K, heat flux is 460W / cm 2 The temperature difference of the heat sink within the power range is no more than 7℃.

[0066] Example 2

[0067] Other conditions are consistent with those in Example 1. Except that the heat spreader does not have the circumferential skeleton 8 and the tapered hole 3 (naturally, there is no so-called groove 5), other structures and processing parameters are the same as those in Example 1.

[0068] The final effective thermal conductivity is 0.78×10 4 W / m·K, heat flux is 103W / cm 2 The temperature difference of the heat sink within the power range is no more than 9.6℃.

[0069] Example 3

[0070] Except that the hole (corresponding to the tapered hole 3 in Example 1) and the groove of the heat spreader have no taper angle (the upper and lower ends have the same size), other structures and processing parameters are the same as those in Example 1.

[0071] The final effective thermal conductivity is 1.01×10 4 W / m·K, heat flux is 238W / cm 2 The temperature difference of the heat sink within the power range is no more than 9.2℃.

[0072] Comparative Example 1

[0073] A conventional heat spreader with a capillary structure includes an upper cover plate 1 and a lower cover plate 9; one side of the lower cover plate 9 is provided with a capillary pore layer 15; one side of the upper cover plate 1 is provided with an upper cover plate capillary pore layer 2, and when assembled, the side of the upper cover plate 1 with the upper cover plate capillary pore layer 2 faces downward; a guide force column 4 is provided between the upper and lower cover plates.

[0074] In the heat spreader with such a high-flux capillary structure, the capillary layer 2 of the upper cover plate 1 has a porosity of 55%, a pore size of no more than 100 μm, and a thickness of 0.2 mm.

[0075] The capillary layer 15 has a porosity of 55%, a pore diameter of not more than 100 μm, and a thickness of 0.5 mm.

[0076] The equivalent diameter of the guide column 4 is 0.4 mm, and the height is 0.3 mm.

[0077] The capillary structure is made of red copper and is tightly connected to the inner walls of the upper and lower cover plates.

[0078] The upper and lower covers are made of 316L stainless steel.

[0079] The stainless steel surface of the inner cavity needs to be passivated.

[0080] When used in industry, the phase change medium, the upper and lower cover plates, and various components arranged between the upper and lower cover plates are sealed and connected to form a closed cavity.

[0081] The vacuum degree of the closed cavity is controlled at 3 Pa, and the amount of liquid injected into the cavity is 1.05 times the total amount of liquid absorbed by capillary absorption.

[0082] The performance of the uniform plate prepared by this method is: the effective thermal conductivity is 0.46×10 4 W / m·K, heat flux is 45W / cm 2 , the temperature difference within the power range is about 13.6℃.

[0083] Comparative Example 2

[0084] The other structures are the same as those in Example 2; the difference is that there is no capillary layer 2 and capillary layer 15 on the upper cover plate; the performance of the uniform plate prepared by this method is: the effective thermal conductivity is 0.48×10 4 W / m·K, heat flux is 52W / cm 2 , the temperature difference within the power range is about 12.1℃.

Claims

1. A high-throughput capillary structure heat sink; characterized by: The heat spreader comprises an upper cover plate (1) and a lower cover plate (9); one side of the upper cover plate (1) is provided with an upper cover plate capillary pore layer (2), and one side of the lower cover plate (9) is provided with a lower cover plate capillary pore layer (15); The capillary layer (15) of the lower cover plate is provided with N circumferential skeletons (8) and P centripetal skeletons (7), and the N circumferential skeletons (8) form a whole through the P centripetal skeletons (7); the centripetal skeleton (7) is provided with a guide column (4); the circumferential skeleton (8) is provided with a tapered hole (3); the area surrounded by two adjacent centripetal skeletons (7) and two adjacent circumferential skeletons (8) is a groove (5); when assembled, the side of the upper cover plate (1) with the capillary layer (2) of the upper cover plate faces downward; the N is greater than or equal to 2; the P is greater than or equal to 3; the porosity of the capillary layer (2) of the upper cover plate is 30-70%, the pore diameter is not greater than 200 μm, and the thickness is 0.05-1 mm; The capillary layer (15) of the lower cover plate has a porosity of 30-70%, a pore size of no more than 200 μm, and a thickness of 0.05-0.5 mm; The N-ring circumferential skeleton (8), the P-root centripetal skeleton (7), and the guide column (4) are all made of porous heat-conducting material; the porosity of the porous material is 10-70%; the pore size is not greater than 200 μm; and rough capillary particles (10) are also provided on the surface of the tapered hole (3) and / or the groove (5); The diameter of a single rough capillary particle (10) is no greater than 500 μm.

2. A high-throughput capillary structure vapor chamber according to claim 1, characterized in that: There are evenly distributed conical holes (3) on the circumferential skeleton (8) and the P-root centripetal skeleton (7); The depth of the tapered hole (3) is 0.1-3 mm, and the hole depth is less than the thickness of the circumferential skeleton and the centripetal skeleton; the diameter of the large end is 0.2-2 mm, and the diameter of the small end is 0.1-1 mm.

3. The high-throughput capillary structure vapor chamber according to claim 2, characterized in that: The minimum spacing between adjacent tapered holes (3) is 0.2-2 mm.

4. The high-throughput capillary structure vapor chamber according to claim 2, characterized in that: The average width of the circumferential skeleton (8) is 0.3-3 mm; the thickness is 0.1-3 mm; the initial value of the center radius of the circumferential skeleton is 2-12 mm, that is, the equivalent diameter of the second circle is 0.6-6 mm larger than the equivalent diameter of the first circle; the width below the circumferential skeleton (8) minus the width above the circumferential skeleton (8) is 0.1-3 mm.

5. The high-throughput capillary structure vapor chamber according to claim 2, characterized in that: The average width of the centripetal skeleton (7) is 0.3-3 mm; the thickness is 0.1-3 mm; P centripetal skeletons are evenly distributed at equal angles in the circumferential direction; the equivalent diameter of the guide column (4) is 0.3-3 mm and is less than or equal to the width of the corresponding surface of the centripetal skeleton (7); and the height is 0.1-5 mm.

6. The high-throughput capillary structure vapor chamber according to claim 1, characterized in that: The minimum spacing between adjacent guide columns (4) is 0.4-4 mm.

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