Display module and display device

Abstract

The application relates to a display module and a display device, wherein the display module comprises a display layer, a touch layer, a first circuit board, a second circuit board and a third circuit board. The touch layer is arranged on the light-emitting side of the display layer in a laminated mode. The first circuit board comprises a first bending area, a first bonding area and a second bonding area connected to the two ends of the first bending area. The first bonding area is electrically connected to the touch layer. The second circuit board comprises a second bending area, a third bonding area and a fourth bonding area connected to the two ends of the second bending area. The third bonding area is electrically connected to the display layer. The third circuit board is electrically connected to the second bonding area and the fourth bonding area. An opening is arranged at the edge of the display layer and used for accommodating the first bending area. The display panel provided by the application can improve the problem of poor bonding of the cover plate glass caused by the warping of the flexible circuit board.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] In existing mobile display devices, touch functionality is typically an essential part of human-computer interaction. To minimize bezels, existing display panels often employ flexible circuit boards for electrical connections, with the flexible circuit board connected to the driver circuit board bent to the back of the display panel. Furthermore, the touch circuit board connecting the touch panel and the driver circuit usually has a larger bending radius than the display circuit board connecting the display panel and the driver circuit, resulting in a larger length. When bonding the cover plate in the display device, both the display circuit board and the touch circuit board are usually kept flat. Due to length limitations, the touch circuit board may warp or bulge upwards, negatively impacting the bonding and fixation of the cover plate.

[0003] Therefore, there is an urgent need for a display module and a corresponding display device that can improve the problem of flexible circuit board warping hindering cover plate bonding. Summary of the Invention

[0004] This application provides a display module and display device that can improve the problem of the flexible circuit board warping in the display panel hindering the bonding of the cover plate.

[0005] In a first aspect, an embodiment of this application provides a display module, comprising: a display layer; a touch layer, stacked on the light-emitting side of the display layer; a first circuit board, including a first bending region, a first bonding region and a second bonding region respectively connected to both ends of the first bending region, the first bonding region being electrically connected to the touch layer; a second circuit board, including a second bending region, a third bonding region and a fourth bonding region respectively connected to both ends of the second bending region, the third bonding region being electrically connected to the display layer; and a third circuit board, respectively electrically connected to the second bonding region and the fourth bonding region; wherein, an opening is provided at the edge of the display layer for accommodating the first bending region.

[0006] According to one aspect of the embodiments of this application, an opening is disposed on one side edge of the display layer near the first bending area and corresponding to the first bending area, and the opening is offset from the orthographic projection of the second circuit board in the thickness direction.

[0007] According to one aspect of the embodiments of this application, the orthographic projection of the first circuit board in the thickness direction of the display module itself is offset from the orthographic projection of the second circuit board in the thickness direction.

[0008] According to one aspect of the embodiments of this application, the farthest end of the first circuit board relative to the center of the first bending region passes through the opening in a first direction.

[0009] According to one aspect of the embodiments of this application, the length of the opening in the second direction is L1, the second direction intersects the first direction, and the length of the area of ​​the first circuit board located in the opening in the first direction is L2, where L1-L2≥0.5mm.

[0010] According to one aspect of the embodiments of this application, the bending radius of the first circuit board is R1, and the bending radius of the second circuit board is R2; in the flattened state, the extension plane where the first circuit board is located intersects with the extension plane where the second circuit board is located and forms an intersection line, the length of the first circuit board between the edge of the touch layer and the intersection line is L3, and the length of the second circuit board between the edge of the touch layer and the intersection line is L4; the extension dimension of the opening in the first direction is L5, and L5≥[(L4-πR2)-(L3-πR1)] / 2-R1+R2.

[0011] According to one aspect of the embodiments of this application, the opening is disposed in the region where two adjacent edges of the display layer intersect and is L-shaped, and one sidewall of the opening is disposed perpendicular to the extension direction of the first bonding area.

[0012] According to one aspect of the embodiments of this application, along a first direction, an opening is recessed into the display layer from one edge of the display layer near the first bending area, and the opening is U-shaped.

[0013] According to one aspect of the embodiments of this application, the display module further includes a cover plate and a polarizer, the cover plate being disposed on the side of the touch layer opposite to the display layer, and the polarizer being disposed between the touch layer and the cover plate.

[0014] Secondly, according to embodiments of this application, a display device is provided, including the display module provided in any embodiment of the first aspect.

[0015] The display module provided in this application includes a touch layer and a display layer stacked together. The two are electrically connected to a first circuit board and a second circuit board, respectively. The display layer has an opening. When the first circuit board and the second circuit board are bent to the back side of the display layer, the longer first circuit board can pass through the opening, so that the longer flexible circuit board has a more inward bending point, thereby reducing the required length of the first circuit board. This avoids the first circuit board from warping due to its excessive length being greater than the second circuit board when flattened, and from interfering with the cover plate, thereby avoiding affecting the adhesion of the cover plate. Attached Figure Description

[0016] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0017] Figure 1 This is a schematic diagram of a display module structure in the prior art;

[0018] Figure 2 yes Figure 1 The diagram shown illustrates another structural design of the display module.

[0019] Figure 3 This is a schematic diagram of the structure of a display module in a bent state according to an embodiment of this application;

[0020] Figure 4 This is a schematic diagram of the display module provided in one embodiment of this application in a flattened state;

[0021] Figure 5 This is a schematic diagram of the structure of a display layer provided in one embodiment of this application;

[0022] Figure 6 This is a top view of a portion of the structure in a flattened state in a display module provided in one embodiment of this application;

[0023] Figure 7 This is a schematic diagram of a portion of the structure in a flattened state in a display module according to an embodiment of this application;

[0024] Figure 8 This is a schematic diagram of a portion of the display module in a bent state according to another embodiment of this application;

[0025] Figure 9 This is a schematic diagram of the structure of a display device provided in one embodiment of this application.

[0026] in:

[0027] 1000 - Display device;

[0028] 100 - Display module; 200 - Display circuit board; 300 - Touch circuit board; 400 - Cover plate;

[0029] 10 - Display layer; 20 - Touch layer; 30 - Cover plate; 40 - First circuit board; 50 - Second circuit board; 60 - Third circuit board; 70 - Polarizing film; 80 - Adhesive layer; 90 - Buffer pad;

[0030] 11-Opening; 41-First Bonding Zone; 42-First Bend Zone; 43-Second Bonding Zone; 51-Third Bonding Zone; 52-Second Bend Zone; 53-Fourth Bonding Zone;

[0031] X - Thickness direction; Y - First direction; Z - Second direction.

[0032] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0033] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0035] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0036] The features and exemplary embodiments of various aspects of this application will now be described in detail. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0037] In existing mobile display devices and wearable display devices, touch control is typically used as the means of human-computer interaction to ensure convenience and sensitivity. In display modules that require touch functionality, the touch layer is usually stacked on the front of the display layer, that is, on the light-emitting side of the display layer. In this case, the touch circuit board bonded to the touch layer and the display circuit board bonded to the display layer are usually connected to the same driver circuit board. In order to narrow the bezel, the display module usually bends both the touch circuit board and the display circuit board to the back of the display layer.

[0038] Based on this, the inventors discovered that due to the different positions of the connected layer structures in the display module, the circuit traces in the touch layer are farther away from the back side of the display layer. Due to the influence of the thickness of the touch layer itself, the touch circuit board usually needs to have a larger bending radius when bent to the back side of the display layer, and therefore also needs to have a longer length. This results in the distance between the drive circuit board and the display layer being limited by the shorter length of the display circuit board when the circuit board is in a flat state. This makes it impossible for the touch circuit board to flatten out. Instead, the excess length warps and bulges upward, interfering with the position where the cover plate needs to be bonded and applying a force to the cover plate in a direction away from the touch layer. This easily causes poor cover plate adhesion and affects the display effect.

[0039] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of a display module structure in the prior art. Figure 2 yes Figure 1 The diagram shows another structural schematic of the display module. In existing display modules, both the display circuit board 200 and the touch circuit board 300 are bent to the back side of the display layer. Because the two flexible circuit boards have a certain height difference in the stacking direction due to the layer structure they are connected to, the touch circuit board 300 has a larger bending radius than the display circuit board 200, which results in the touch circuit board 300 having a longer size than the display circuit board 200.

[0040] Based on this, the display module may need to be bonded to the cover plate 400 in subsequent manufacturing processes. In this case, the cover plate 400 is positioned on the side of the touch layer opposite to the display layer. During the bonding process with the cover plate 400, to avoid adverse effects on the drive circuit board and due to limitations imposed by the bonding fixture, the display circuit board 200 and the touch circuit board 300 are typically unfolded outwards in a direction parallel or approximately parallel to the plane of the display layer. The state of the display module after the display circuit board 200 is unfolded to a flat position within the plane of the display layer is referred to as the flattened state. In this state, the display circuit board 200 extends along the plane, while the touch circuit board 300, depending on its length, forms a warp or bulge towards the cover plate 400.

[0041] To address the aforementioned issues, this application provides a display module including a touch layer, a display layer, and a cover plate. The touch layer is bonded to a first circuit board, and the display layer is bonded to a second circuit board, with the length of the first circuit board being greater than the length of the second circuit board. The display layer in the display module has an opening on one edge, allowing the first circuit board to pass through this opening when bent to the back of the display layer. This reduces the overall inward shrinkage of the bent area of ​​the first circuit board, decreasing its length and thus narrowing the length difference between the first and second circuit boards. This reduces the degree of warping of the first circuit board in its flattened state due to its excess length, thereby improving the problem of interference between the warped portion and the cover plate.

[0042] To better understand this application, the following will be combined with... Figures 3 to 9 The touch panel and display device provided in the embodiments of this application will be described in detail.

[0043] Please refer to the following: Figures 3 to 6 , Figure 3 This is a schematic diagram of the structure of a display module in a bent state according to an embodiment of this application. Figure 4 This is a schematic diagram of the display module provided in one embodiment of this application in a flattened state. Figure 5 This is a schematic diagram of the structure of a display layer provided in one embodiment of this application. Figure 6 This is a top view of a portion of the structure in a flattened state in a display module provided in one embodiment of this application.

[0044] In a first aspect, an embodiment of this application provides a display module 100, comprising: a display layer 10, a touch layer 20, a first circuit board 40, a second circuit board 50, and a third circuit board 60, wherein the touch layer 20 is stacked on the light-emitting side of the display layer 10. The first circuit board 40 includes a first bending region 42, a first bonding region 41 and a second bonding region 43 respectively connected to both ends of the first bending region 42, the first bonding region 41 being electrically connected to the touch layer 20; the second circuit board 50 includes a second bending region 52, a third bonding region 51 and a fourth bonding region 53 respectively connected to both ends of the second bending region 52, the third bonding region 51 being electrically connected to the display layer 10; the third circuit board 60 is electrically connected to the second bonding region 43 and the fourth bonding region 53 respectively; wherein, the edge of the display layer 10 is provided with an opening 11 for accommodating the first bending region 42 to form a clearance area.

[0045] This application provides a display module 100, in which a touch layer 20 and a display layer 10 are stacked along the thickness direction X. The touch layer 20 is disposed on the side close to the display surface 12 of the display layer 10 to facilitate touch control. The display module 100 also includes a first circuit board 40 and a second circuit board 50 for electrically connecting the display layer 10 and the touch layer 20 to a driving circuit, and a third circuit board 60 for mounting the driving circuit and electronic components such as chips.

[0046] Along the respective extending directions of the first circuit board 40 and the second circuit board 50, for ease of further explanation, in this application, the end of the first circuit board 40 bonded to the touch layer 20 is referred to as the first bonding area 41, the end of the first circuit board 40 bonded to the third circuit board 60 is referred to as the second bonding area 43, the end of the second circuit board 50 bonded to the display layer 10 is referred to as the third bonding area 51, and the end of the second circuit board 50 bonded to the third circuit board 60 is referred to as the fourth bonding area 53. That is, in this application, the first bonding area 41 is bonded to the touch layer 20, the second bonding area 43 is electrically connected to the third circuit board 60, so that the touch layer 20 can receive control from the chip and provide feedback on touch signals; the third bonding area 51 is bonded to the display layer 10, and the fourth bonding area 53 is electrically connected to the third circuit board 60, so that the chip in the third circuit board 60 controls the display layer 10 to perform corresponding displays.

[0047] Based on this connection, for Figure 1 and Figure 2 To address the problem shown, this embodiment of the application provides an opening 11 at the edge of the display layer 10. After bending the first circuit board 40 and the second circuit board 50 to the back side of the display layer 10, the first bending area 42 in the first circuit board 40 passes through the opening 11. This allows the first circuit board 40 to begin bending closer to its ends along the first direction Y without changing the layer structure thickness, i.e., without changing the bending radius of the first bending area 42. This results in a smaller distance between the bending point and the ends of the first circuit board 40 in the first direction Y, thereby shortening the length of the first circuit board 40 itself required in the display module 100, reducing the length difference between the first circuit board 40 and the second circuit board 50, and thus reducing the length excess of the first circuit board 40 in the flattened state as described above, thereby reducing the warpage of the first circuit board 40. It is understood that the opening 11 needs to be located at an edge position that does not conflict with the circuit traces in the display layer 10 to avoid affecting the display function of the display layer 10. For example, the opening 11 can be located adjacent to the bonding connection area between the display layer 10 and the second circuit board 50.

[0048] Optionally, the first circuit board 40 and the second circuit board 50 may be disposed on the same side of the display layer 10 and the touch layer 20 and extend in the same direction. That is, the third circuit board 60 may have a certain width and be electrically connected to the parallel first circuit board 40 and the second circuit board 50 respectively. The second bonding area 43 and the fourth bonding area 53 may be located on the same horizontal plane. Alternatively, in embodiments where the first circuit board 40 and the second circuit board 50 have overlapping areas, the second bonding area 43 and the fourth bonding area 53 may also have a certain height difference and partially overlap.

[0049] Optionally, in this embodiment, when the first circuit board 40 and the second circuit board 50 are bent together to the non-display surface 13 of the display layer 10, a buffer pad 90 may also be provided on the non-display surface 13 side of the display layer 10 to provide certain support and protection for the display layer 10, touch layer 20, etc. In this embodiment, the third circuit board 60 may be connected to the surface of the buffer pad 90 away from the display layer 10, and the second bonding area 43 and the fourth bonding area 53 are bent to the back side accordingly.

[0050] Optionally, at least one shim can be provided on the side surface of the bonding area where the second circuit board 50 is bonded to the display layer 10, i.e. the inner side after bending. The shim can provide a certain support between the buffer pad 90 and the second circuit board 50 after the third circuit board 60 is bent and connected to the aforementioned buffer pad 90.

[0051] Meanwhile, in the embodiment of this application, the touch structure in the touch layer 20 can be based on the packaging structure on the display layer 10 as a substrate and disposed on the side surface of the packaging structure away from the display layer 10. The first bonding area 41 of the first circuit board 40 is also electrically connected to the circuit structure on this side surface. Therefore, in order to ensure that the touch layer 20 does not obstruct the bending of the first circuit board 40, the orthographic projection of the touch layer 20 on the display layer 10 does not overlap with the opening 11. That is, the touch layer 20 has a certain inward shrinkage relative to the display layer 10. The opening 11 can be provided on the part of the display layer 10 exposed after the inward shrinkage. In addition, the area can also be provided with bonding pads and other structures that are bonded to the third bonding area 51. This application does not make specific limitations on this.

[0052] In some optional embodiments, the opening 11 is disposed on one side edge of the display layer 10 near the first bending area 42 and is disposed corresponding to the first bending area 42. The opening 11 is offset from the orthographic projection of the second circuit board 50 in the thickness direction X.

[0053] In this embodiment, the display layer 10 has an opening 11. In the thickness direction X, the opening 11 penetrates the display layer 10. In the plane of the display layer 10, the opening 11 extends from the side of the display layer 10 into its interior. The sidewall of the opening 11 can be perpendicular to the display surface and non-display surface opposite to the display layer 10, or it can have a certain angle or curvature. Optionally, the opening 11 in this embodiment can be a circular opening, a square opening, a trapezoidal opening, or other shapes. This application does not impose a specific limitation on this, as long as the opening 11 can accommodate the bent first circuit board 40. The display surface of the display layer 10 is the side surface used for display, i.e., the light-emitting surface.

[0054] It is understandable that in order for the first circuit board 40 to pass smoothly through the opening 11 without obstruction or interference, the width of the opening 11 along the second direction Z should be greater than the maximum width of the part of the first circuit board 40 that passes through the opening 11, i.e., the first bending area 42. At this time, the opening 11 in the second direction Z can start from the edge of the side closer to the first circuit board 40 and extend to accommodate the area covered by the orthographic projection of the first circuit board 40. Alternatively, it can start only from the edge of one side of the display layer 10, be recessed into the display layer 10 along the first direction Y, and not contact other edges to form a U-shaped opening. Specifically, it can be designed according to the orthographic projection position of the first circuit board 40 in the thickness direction X.

[0055] In some alternative embodiments, the orthographic projection of the first circuit board 40 in the thickness direction X of the display module is offset from the orthographic projection of the second circuit board 50 in the thickness direction X.

[0056] In this embodiment, the first circuit board 40 and the second circuit board 50 can be staggered, and the orthographic projections of the two circuit boards in the thickness direction X do not overlap. This avoids mutual interference between the two circuit boards in the bending state, and ensures that the bending area of ​​the first circuit board 40 can be reduced within the area of ​​the opening 11 without being affected.

[0057] In some alternative embodiments, the farthest end of the first circuit board 40 relative to the center of the first bend region 42 in the first direction Y passes through the opening 11.

[0058] In this embodiment of the application, the first circuit board 40 passes through the opening 11 after being bent. At this time, the end of the first circuit board 40 that is furthest from the opening 11 in the first direction Y, that is, the part of the first bending area 42 that is furthest from the center of the arc shape formed by bending, is accommodated by the opening 11. Thus, the first circuit board 40 can be fully retracted, thereby ensuring the effect of shortening the length of the circuit board.

[0059] It is understandable that the first circuit board 40 can be positioned directly opposite the opening 11, so that the first circuit board 40 is completely contained in the opening 11 in the first direction Y. The first direction Y can be the width direction of the first circuit board 40, that is, the direction perpendicular to the extension direction of the first circuit board 40 itself. This ensures that there is no interference between the sidewall of the opening 11 and the first circuit board 40, and ensures that the first circuit board 40 will not warp on one side in the first direction Y after being flattened.

[0060] In some alternative embodiments, the length of the opening 11 in the second direction Z is L1, the maximum width of the area of ​​the first circuit board 40 located in the opening in the second direction Z is L2, the second direction Z intersects the first direction Y, and L1-L2≥0.5mm.

[0061] As mentioned above, in this embodiment, the opening 11 can be positioned directly opposite the first circuit board 40 in the thickness direction X, and the length of the opening 11 in the second direction Z, i.e., the width L1 of the opening 11 itself, should be greater than the maximum width L2 of the portion of the first circuit board 40 passing through the opening 11, so that the first circuit board 40 will not collide with the sidewalls on both sides of the opening 11 when passing through it. Simultaneously, to allow the first circuit board 40 a certain amount of room to move, the difference between L1 and L2 can be greater than or equal to 0.5 mm. Optionally, in this embodiment, the thickness direction X, the first direction Y, and the second direction Z can form a three-coordinate system that is perpendicular to each other.

[0062] Optionally, the difference between L1 and L2 can be equally distributed on both sides of the first circuit board 40 in the second direction Z, so that the orthographic projection of the first circuit board 40 in the thickness direction X is located in the center of the opening 11, thereby achieving a better anti-collision and anti-scratch effect.

[0063] It is understood that in this embodiment, the second circuit board 50 can be offset from the opening 11 in the thickness direction X. In this case, the second circuit board 50 and the first circuit board 40 are offset from each other, and the distance between them is greater than or equal to the minimum distance between the sidewall of the opening 11 and the edge of the first circuit board 40, which can avoid interference between the two circuit boards. Alternatively, in this embodiment, the orthographic projection of the second circuit board 50 on the display layer 10 can also be at least partially overlapping with the opening 11. In this case, a certain distance should also be maintained between the second circuit board 50 and the first circuit board 40.

[0064] In this embodiment, the display layer 10 is provided with an opening 11 for avoiding the first circuit board 40. The extension dimension of the opening 11 in the first direction Y needs to be designed according to the length data of the first circuit board 40 and the second circuit board 50.

[0065] Please refer to the following: Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of a portion of the structure of a display module provided in one embodiment of this application in a flattened state. Figure 8 This is a schematic diagram of a portion of the display module in a bent state, provided in another embodiment of this application.

[0066] In some optional embodiments, the bending radius of the first circuit board 40 is R1, and the bending radius of the second circuit board 50 is R2; in the flattened state, the extension plane where the first circuit board 40 is located intersects with the extension plane where the second circuit board 50 is located and forms an intersection line. The length between the edge of the first circuit board 40 on the surface of the touch layer 20 away from the display layer 10 and the intersection line is L3, and the length between the edge of the second circuit board 50 on the surface of the touch layer 20 near the display layer 10 and the intersection line is L4; the extension dimension of the opening 11 in the first direction Y, that is, the depth of the extension from the edge of the display layer 10 to the center, is L5, and L5≥[(L4-πR2)-(L3-πR1)] / 2-R1+R2.

[0067] Will Figure 7 and Figure 8 As can be seen from the comparison, the result calculated using the formula [(L4-πR2)-(L3-πR1)] / 2-R1+R2 is the correct answer. Figure 8 The length of region D. In this application, the depth of opening 11 can be set to be greater than or equal to the length of region D, thereby eliminating the influence of the difference between the bending allowances of the two circuit boards, effectively reducing the bulging degree of the first circuit board 40 in the flattened state, and ensuring that there is no interference problem between the first circuit board 40 and the second circuit board 50, or between the first circuit board 40 and the display layer 10 after bending.

[0068] Specifically, in this embodiment, the first circuit board 40 and the second circuit board 50 can be staggered in the thickness direction X. Therefore, the two circuit boards can be set on the same layer at the position where they are connected to the third circuit board 60. That is, the second bonding area 43 and the fourth bonding area 53 can be set on the same layer. At this time, the minimum distance between the second bonding area 43 and the fourth bonding area 53 and the side 14 of the display layer 10 can be the same, that is, the two are set side by side.

[0069] In some alternative embodiments, the opening 11 is located in the region where two adjacent edges of the display layer 10 intersect and is L-shaped, and one sidewall of the opening 11 is perpendicular to the extension direction of the first bonding area 41.

[0070] The first circuit board 40 in this embodiment includes a first bonding area 41, a first bending area 42, and a second bonding area 43. Based on this, the opening 11 can be a rectangular opening to facilitate processing. At the same time, the side wall of the opening 11 extending along the second direction Z, that is, the side wall closest to the center of the display layer 10, can be set perpendicular to the extension direction of the first bonding area 41, so that the first circuit board 40 can form a regular and uniform bending area shape after bending. At the same time, it can make the extension direction of the first bonding area 41 the same as the extension direction of the second bonding area 43, avoiding the tilt of the first bending part 42, which would cause a certain area of ​​the first circuit board 40 to form a unilateral bulge and warp. This ensures that the display module 100 in this embodiment can provide the effect of preventing interference between the circuit board and the cover plate 30.

[0071] Optionally, after the first circuit board 40 and the second circuit board 50 are bent, the orthographic projection of the first circuit board 40 on the cover plate 30 and the orthographic projection of the second circuit board 50 on the cover plate 30 are both located within the outline of the cover plate. In this embodiment, both the first circuit board 40 and the second circuit board 50 are bent to the back side of the display layer 10. In the bent state, the bending areas of these two circuit boards are both within the coverage area of ​​the cover plate 30. Thus, the cover plate 30 can provide protection for the two circuit boards in the thickness direction X and the lateral direction, avoiding damage to the circuit boards caused by external impacts or other accidents, and improving the overall reliability of the display module 100.

[0072] In some alternative embodiments, along the first direction Y, the opening is recessed into the display layer 10 from one edge of the display layer 10 near the first bending area 42, and the opening 11 is U-shaped.

[0073] In this embodiment, the opening 11 is located at the edge of the display layer 10 and starts from the edge of the display layer 10 near the first bending area 42, and is recessed into the display layer 10 along the first direction Y. At this time, the opening 11 can be a U-shaped opening, that is, there is a certain distance between the opening 11 and the edge of the display layer 10 extending along the first direction Y, so that there are sidewalls on both sides of the opening 11 in the second direction Z, thereby further defining the position of the first bending area 42, and reducing the probability of the first bending area 42 being hit or bumped, thus improving the overall reliability of the display module 100.

[0074] It is understood that the U-shaped opening 11 has three sidewalls connected in sequence. The two opposite sidewalls can be perpendicular to the second direction Z, and the sidewall sandwiched in the middle can be perpendicular to the first direction Y. The opening 11 formed at this time is a rectangular opening, which is more regular in shape and can ensure that the extension direction of the first bonding area 41 is the same as the extension direction of the second bonding area 43, so as to prevent the first circuit board 40 passing through the opening 11 from tilting.

[0075] In some optional embodiments, the display module 100 further includes a cover plate 30 and a polarizer 70, the cover plate 30 being disposed on the side of the touch layer 20 away from the display layer 10, and the polarizer 70 being disposed between the touch layer 20 and the cover plate 30.

[0076] The display module 100 in this embodiment may also include a cover plate 30 and a polarizer 70, both disposed on one side of the display surface of the display layer 10. Specifically, the cover plate 30 may be disposed on the side of the touch layer 20 opposite to the display layer 10, and the polarizer 70 may be disposed between the touch layer 20 and the cover plate 30. The placement of the cover plate 30 is the same as that after bonding in the flattened state, and will not be repeated here. In this embodiment, a corresponding adhesive may also be provided between the polarizer 70 and the cover plate 30. Commonly used transparent adhesives in the display technology field, such as OCA (Optically Clear Adhesive) and OCR (Optical Clear Resin), may be used. The polarizer 70 can reduce the reflection of ambient light, thereby improving the display effect of the display layer 10 in environments with strong ambient light. In addition, the polarizer 70 placed between the touch layer 20 and the cover plate 30 can increase the distance between the cover plate 30 and the touch layer 20 in the thickness direction X, thereby providing a larger space to accommodate the possible warping and bulging of the first circuit board 40. Under the premise that the length of the second circuit board 50 and the thickness of each film layer remain unchanged, the minimum depth required for the opening 11 can be reduced to a certain extent, avoiding the conflict between the opening 11 and the original circuit structure in the display layer 10, which would lead to an increase in the required bezel width.

[0077] Please see Figure 9 , Figure 9 This is a schematic diagram of the structure of a display device provided in one embodiment of this application. Secondly, according to an embodiment of this application, a display device 1000 is provided, including the display module 100 provided in any embodiment of the first aspect. The display device 1000 provided in this application has all the beneficial effects of the display module 100 provided in the embodiments of this application. For details, please refer to the specific descriptions of the display module 100 in the above embodiments; these descriptions will not be repeated here.

[0078] It is understood that the above description and details are merely exemplary and explanatory, and do not constitute a limitation on this application. Those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Thus, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A display module, characterized in that, include: Display layer; A touch layer is stacked on the light-emitting side of the display layer; The first circuit board includes a first bending area, a first bonding area and a second bonding area respectively connected to both ends of the first bending area, and the first bonding area is electrically connected to the touch layer. The second circuit board includes a second bending area, a third bonding area and a fourth bonding area respectively connected to both ends of the second bending area, and the third bonding area is electrically connected to the display layer; The third circuit board is electrically connected to the second bonding area and the fourth bonding area, respectively. The display layer has an opening at its edge to accommodate the first bending area. The opening is located on the edge of the display layer near the first bending area and is corresponding to the first bending area. The opening is offset from the orthographic projection of the second circuit board in the thickness direction. The orthographic projection of the first circuit board in the thickness direction of the display module is offset from the orthographic projection of the second circuit board in the thickness direction; The farthest end of the first circuit board relative to the center of the first bend area passes through the opening in a first direction.

2. The display module according to claim 1, characterized in that, The length of the opening in the second direction is L1, the second direction intersects the first direction, and the maximum length of the area of ​​the first circuit board located in the opening in the second direction is L2, where L1-L2≥0.5mm.

3. The display module according to claim 1, characterized in that, The bending radius of the first circuit board is R1, and the bending radius of the second circuit board is R2; In the flattened state, the extended plane where the first circuit board is located intersects with the extended plane where the second circuit board is located and forms an intersection line. The length of the first circuit board between the edge of the touch layer and the intersection line is L3, and the length of the second circuit board between the edge of the touch layer and the intersection line is L4. The extension dimension of the opening in the first direction is L5, where L5 ≥ [(L4-πR2)-(L3-πR1)] / 2-R1+R2.

4. The display module according to claim 1, characterized in that, The opening is located at the intersection of two adjacent edges of the display layer and is L-shaped. One sidewall of the opening is perpendicular to the extension direction of the first bonding area.

5. The display module according to claim 1, characterized in that, Along the first direction, the opening is recessed into the display layer from one edge of the display layer near the first bending area, and the opening is U-shaped.

6. The display module according to claim 1, characterized in that, The display module further includes a cover plate and a polarizer. The cover plate is disposed on the side of the touch layer opposite to the display layer, and the polarizer is disposed between the touch layer and the cover plate.

7. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 6.

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