Dam mold and dam forming method

Abstract

The present application relates to a dam mold and a dam forming method, wherein the glue blocking column can extend into the chip accommodating hole to block the chip accommodating hole and avoid the dam glue from blocking the chip accommodating hole when the first sub-mold and the second sub-mold are combined; the first sub-mold can be combined with the substrate after the second sub-mold is separated, the light emitting chip extends into the chip accommodating hole, the surface of the substrate is attached to the first surface of the first sub-mold, and the dam glue in the dam cavity can be attached to the surface of the substrate to form a dam. The shape of the dam cavity in the dam mold can determine the shape of the dam formed on the substrate, and the shape and height of the dam are predictable and controllable, which facilitates setting the shape and height of the dam according to the requirements in production to meet the requirements and improve the quality of products such as lamp panels and display screens. In addition, the dam mold is suitable for scenarios where the substrate surface has been provided with light emitting chips and scenarios where the substrate surface has not been provided with light emitting chips, and has wide application.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a dam mold and a dam forming method. Background Art

[0002] Liquid crystal display devices are light-transmitting display devices that require a backlight module to provide the brightness required for display. During the information display process, liquid crystal display devices often produce halos around the effective information display area, resulting in reduced contrast of the display device and poor display effect. This halo effect is caused by the floodlight of the light source on the light board. To this end, setting a dam around the light source on the light board and using the dam to limit the lighting range of the light source is a relatively effective solution. At present, the dam is mainly formed by brushing dam glue on the substrate and then curing it. However, due to the fluidity of the dam glue, the shape and height of the dam are uncontrollable, and the light board is difficult to meet the requirements.

[0003] Therefore, how to set up the dam on the light board and improve the quality of the dam is a technical problem that needs to be solved urgently. Summary of the Invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of this application is to provide a dam mold and a dam forming method, aiming to solve the problem that the current dam setting scheme is difficult to set a dam of satisfactory quality on the light board.

[0005] The present application provides a dam mold, comprising a first sub-mold and a second sub-mold that can be separated from each other;

[0006] The first sub-mold has a first surface for mating with the chip-carrying surface of the substrate, and a second surface for mating with the second sub-mold and opposite to the first surface; the first sub-mold is provided with a recessed dam cavity, the opening of the dam cavity is located on the first surface and is recessed toward the second surface; the first sub-mold is also provided with a plurality of chip-receiving holes extending through the first and second surfaces, the chip-receiving holes on the first sub-mold corresponding to the positions of the light-emitting chips on the substrate, and the chip-receiving holes are configured to receive the light-emitting chips;

[0007] The second sub-mold has a main body plate and multiple glue-blocking columns arranged on one side of the main body plate that cooperates with the first sub-mold. The height of the glue-blocking columns is greater than or equal to the axial dimension of the chip accommodating hole, and the glue-blocking columns correspond to the chip accommodating holes one by one; when the first sub-mold and the second sub-mold are combined, the glue-blocking columns extend into the corresponding chip accommodating holes.

[0008] The above-mentioned dam mold includes a first sub-mold and a second sub-mold that can be separated from each other. The first surface of the first sub-mold is provided with a dam cavity recessed toward the second surface, and the first sub-mold is also provided with a chip accommodating hole for the light-emitting chip on the substrate to extend into. The chip accommodating hole corresponds one-to-one to the glue-blocking column provided on the second sub-mold: when the first sub-mold is combined with the second sub-mold, the glue-blocking column can extend from the second surface of the first sub-mold into the chip accommodating hole to block the chip accommodating hole, so that it is convenient to set the dam glue in the dam cavity from the first surface of the first sub-mold by scraping glue without worrying about the dam glue blocking the chip accommodating hole; after the scraping glue is completed, the second sub-mold is separated, and then the first sub-mold is transferred to the substrate. It can be understood that if a light-emitting chip is already provided on the substrate, the light-emitting chip can extend into the chip accommodating hole of the first sub-mold, so that the substrate surface can be fitted with the first surface of the first sub-mold, and the dam glue in the dam cavity can adhere to and combine with the substrate surface. After the dam glue is cured, the first sub-mold is removed to complete the formation of the dam on the substrate. The shape of the dam cavity in the dam mold determines the shape of the dam formed on the substrate. The shape and height of the dam are predictable and controllable, making it easy to set the dam to the desired shape and height during production, thereby improving the quality of products such as light panels and displays. Furthermore, this dam mold is suitable for both substrates with and without light-emitting chips, making it widely applicable. Furthermore, using this dam mold to create a dam on a substrate is simple and easy to operate, helping to reduce the cost of light panels and displays.

[0009] Optionally, a plurality of chip accommodating holes are arranged in an array on the first sub-mold, and a plurality of glue-blocking columns are arranged in an array on the surface of the main body plate.

[0010] Optionally, the dam cavity is formed by a plurality of first cavities extending along a first direction and a plurality of second cavities extending along a second direction, the plurality of first cavities and the plurality of second cavities intersect to form a grid, and the chip accommodating holes are distributed in the grid; the depth of the recess at the intersection of the first cavity and the second cavity is consistent with the depth of the recess at the non-intersection portion of the dam cavity.

[0011] In the aforementioned dam mold, the dam cavity is formed by multiple first cavities extending along a first direction and multiple second cavities extending along a second direction. The first and second cavities intersect to form a grid, so the dam formed by this dam mold is a grid dam. Furthermore, because the depth of the depressions at the intersections and non-intersections of the dam cavities is the same, the retaining walls of the grid dam formed by this dam mold are of consistent height, and there are no bulges at the intersections of the grid dam. This helps reduce the height of the light panel, the thickness of the display, and the thinness of the display product.

[0012] Optionally, the cross section of the glue-blocking column has the same specifications as the cross section of the chip accommodating hole.

[0013] In the above dam mold, the cross section of the glue blocking column is the same as that of the chip receiving hole, so the glue blocking column can just extend into the chip receiving hole to block the chip receiving hole and prevent the dam glue from entering the chip receiving hole.

[0014] Optionally, the height of the glue-blocking column is equal to the axial dimension of the chip accommodating hole.

[0015] In the above-mentioned dam mold, the height of the glue-blocking column is equal to the axial dimension of the chip accommodating hole. Therefore, after the glue-blocking column extends into the chip accommodating hole, the free end face of the glue-blocking column is exactly flush with the first surface of the first sub-mold, and the glue-blocking column will not protrude from the first surface, which greatly facilitates the glue scraping process.

[0016] Optionally, the cross section of any cavity in the dam cavity is perpendicular to the extension direction of the cavity, and the width direction of the cross section of the cavity is parallel to the first surface; the width of the cross section of the cavity gradually decreases in the direction away from the first surface.

[0017] In the above-mentioned dam cavity, the width of the cross section of the cavity gradually decreases in the direction away from the first surface. The cross-sectional width of the retaining wall in the dam formed based on the dam mold gradually decreases in the direction away from the chip carrying surface, that is, the cross section of the retaining wall is "small at the top and large at the bottom". This is not only conducive to improving the reflection of light from the light-emitting chip by the retaining wall, reducing glare, and increasing the contrast of the corresponding display screen; it also facilitates demolding, reduces the difficulty of forming the dam, and improves the production efficiency of the light board.

[0018] Optionally, the cross section of the cavity is any one of a trapezoidal shape and a crescent shape.

[0019] Optionally, the recessed depth of the dam cavity is greater than or equal to the height of the light-emitting chip.

[0020] Optionally, the second sub-mold also includes side edges arranged around the circumference of the main body plate, the side edges and the glue retaining columns protrude outward from the surface of the main body plate in the same direction, and the side edges and the main body plate form a groove-shaped accommodating space that is just enough for the first sub-mold to be embedded, and the height of the side edges protruding outward from the main body plate is equal to the thickness of the first sub-mold.

[0021] Based on the same inventive concept, the present application also provides a dam forming method, comprising:

[0022] Providing a substrate and any one of the aforementioned dam molds;

[0023] combining the first sub-mold with the second sub-mold;

[0024] scraping dam glue from the first surface of the first sub-mold into the dam cavity until the dam cavity is filled;

[0025] removing the second sub-mold;

[0026] Laminating the first surface of the first sub-mold to the chip carrying surface of the substrate, and heating to bond the dam glue to the substrate;

[0027] After the dam glue is solidified, the first sub-mold is removed.

[0028] The above-mentioned dam forming method is implemented based on the aforementioned dam mold. If a light-emitting chip is already provided on the substrate, the light-emitting chip can be inserted into the chip receiving hole of the first sub-mold, so that the substrate surface can be bonded to the first surface of the first sub-mold. The dam glue in the dam cavity can adhere to and bond to the substrate surface. After the dam glue is cured, the first sub-mold is removed to complete the formation of the dam on the substrate. The shape of the dam cavity in the dam mold can determine the shape of the dam formed on the substrate. The shape and height of the dam are predictable and controllable, making it easy to set a dam with a shape and height that meets the requirements according to needs during production, thereby improving the quality of products such as light panels and display screens. In addition, the dam mold is suitable for both scenarios where a light-emitting chip is already provided on the substrate surface and scenarios where a light-emitting chip is not provided on the substrate surface, and has a wide range of applications. Moreover, setting a dam on a substrate based on the dam mold is simple and easy to operate, which helps reduce the cost of light panels and display screens. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic cross-sectional view of a dam mold provided in an optional embodiment of the present invention;

[0030] Figure 2 for Figure 1 A schematic diagram of the cooperation between the first sub-mold and the substrate;

[0031] Figure 3 A schematic diagram of the first surface of the first sub-mold shown in an optional embodiment of the present invention;

[0032] Figure 4 Another schematic diagram of the first surface of the first sub-mold shown in an optional embodiment of the present invention;

[0033] Figure 5 is another schematic diagram of the first surface of the first sub-mold shown in an optional embodiment of the present invention;

[0034] Figure 6 A schematic diagram of the combination of a first sub-mold and a second sub-mold provided in an optional embodiment of the present invention;

[0035] Figure 7 Another schematic diagram of the combination of the first sub-mold and the second sub-mold provided in an optional embodiment of the present invention;

[0036] Figure 8This is another schematic diagram of the combination of the first sub-mold and the second sub-mold provided in an optional embodiment of the present invention;

[0037] Figure 9 Another schematic diagram of the cooperation between the first sub-mold and the substrate provided in an optional embodiment of the present invention;

[0038] Figure 10 A schematic cross-sectional view of a second sub-mold provided in an optional embodiment of the present invention;

[0039] Figure 11 This is another schematic diagram of the combination of the first sub-mold and the second sub-mold provided in an optional embodiment of the present invention;

[0040] Figure 12 A schematic flow chart of a dam forming method provided in another optional embodiment of the present invention;

[0041] Figure 13 A schematic diagram of a process for forming a dam provided in another optional embodiment of the present invention.

[0042] Description of reference numerals:

[0043] 10-dam mold; 20-first sub-mold; 21-dam cavity; 210-sub-cavity; 211-first cavity; 212-second cavity; 22-chip accommodating hole; 30-second mold; 31-main body plate; 32-glue blocking column; 33-side edge; 40-substrate; 42-light-emitting chip; 50-dam glue; 60-dam; 80-gap. DETAILED DESCRIPTION

[0044] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0046] In order to avoid flooding of the light-emitting chip on the light board, reduce or even eliminate the halo phenomenon, and enhance the display contrast of the display, a dam is usually set on the light board. The dam encloses the area around the light-emitting chip, so that the light emitted by the light-emitting chip only covers this area and does not affect other adjacent light-emitting chips.

[0047] Currently, the relevant technology mainly forms the dam by brushing dam glue on the substrate. However, since the dam glue is fluid, especially in the direction affected by gravity, the dam glue will "collapse" to a certain extent, which will cause the dam height and dam shape to not meet the requirements, affecting the quality of the light board and display screen.

[0048] Based on this, the present application hopes to provide a solution that can solve the above technical problems, the details of which will be explained in the subsequent embodiments.

[0049] An optional embodiment of the present application:

[0050] This embodiment first provides a dam mold, see Figure 1 A cross-sectional schematic diagram of the dam mold 10 is shown (it should be noted that the cross-sectional schematic diagrams of this embodiment are not strictly drawn with hatching):

[0051] The dam mold 10 includes a first sub-mold 20 and a second mold 30 , which can be combined together or separated to be independent of each other.

[0052] The first sub-mold 20 has a first surface for mating with the substrate on which the dam is to be formed, and a second surface opposite the first surface, which is configured to mate with the second mold 30. A recessed dam cavity 21 is provided in the first sub-mold 20. The opening of the dam cavity 21 is located on the first surface and is recessed toward the second surface. It can be understood that the shape of the dam cavity 21 determines the shape of the dam subsequently set on the substrate. In some examples of this embodiment, the projection shape of the dam to be set on the substrate on the chip-bearing surface of the substrate is circular (or annular), then correspondingly, the dam cavity 21 has a circular (or annular) opening on the first surface of the first sub-mold 20; if the projection shape of the dam to be set on the substrate on the chip-bearing surface of the substrate is rectangular, then correspondingly, the dam cavity 21 has a rectangular opening on the first surface of the first sub-mold 20; if the projection shape of the dam to be set on the substrate on the chip-bearing surface of the substrate is grid-shaped, then correspondingly, the dam cavity 21 has a grid-shaped opening on the first surface of the first sub-mold 20.

[0053] The first sub-mold 20 is further provided with a through chip accommodating hole 22, which can also be called a chip avoidance hole, which is used for the light-emitting chip 42 on the substrate 40 to extend into the hole. When the light-emitting chip 42 is provided on the substrate, in this embodiment, the light-emitting chip 42 corresponds to the chip accommodating hole 22 in one-to-one position. When the first sub-mold 20 is matched with the substrate, the light-emitting chips 42 can be respectively extended into the corresponding chip accommodating holes 22, so that the first surface of the first sub-mold 20 can be attached to the chip carrying surface of the substrate 40, as shown in FIG. Figure 2It should be understood that the arrangement of the chip accommodating holes 22 on the first sub-mold 20 is substantially consistent with the arrangement of the light-emitting chips 42 on the substrate 40. For example, if the light-emitting chips 42 on the substrate 40 are arranged in an array, with the spacing between adjacent chip rows being d1 and the spacing between adjacent chip columns being d2, then the chip accommodating holes 22 on the first sub-mold 20 are also arranged in an array, with the spacing between adjacent accommodating hole rows being d1 and the spacing between adjacent accommodating hole columns being d2.

[0054] It is undeniable that, because the light-emitting chip 42 can extend into the chip-receiving hole 22, the cross-sectional dimensions of the chip-receiving hole 22 are necessarily larger than the orthographic projection of the light-emitting chip on the chip-carrying surface. The orthographic projection of the light-emitting chip 42 on the chip-carrying surface refers to the projection of the light-emitting chip along a projection line perpendicular to the chip-carrying surface. Hereinafter, the cross-sectional dimensions of the chip-receiving hole 22 will be referred to as the "hole cross-sectional dimensions," and the orthographic projection of the light-emitting chip 42 on the chip-carrying surface will be referred to as the "chip orthographic projection." Therefore, the length dimension of the hole cross-sectional dimensions is larger than the length dimension of the chip orthographic projection, and the width dimension of the hole cross-sectional dimensions is larger than the width dimension of the chip orthographic projection. It should be understood that, when the first sub-mold 20 is bonded to the substrate, the length direction of the hole cross-sectional dimensions is the same as the length direction of the chip orthographic projection, and the width direction of the hole cross-sectional dimensions is the same as the width direction of the chip orthographic projection.

[0055] In some examples of this embodiment, the dam to be provided on the substrate includes a plurality of mutually independent sub-dams. For example, a sub-dam surrounds one or several light-emitting chips, but adjacent sub-dams do not contact each other. Corresponding to this situation, on the first surface of the first sub-mold 20, the dam cavity 21 also has a plurality of mutually independent sub-cavities 210, and the sub-cavities 210 are not connected to each other, and one or several chip accommodating holes 22 are surrounded by a sub-cavity 210. Figure 3 shown.

[0056] In some other examples of this embodiment, the dam to be provided on the substrate is a grid dam, and there are retaining walls connected or shared between the dams of adjacent light-emitting chips. For ease of introduction, the retaining wall extending along the first direction in the grid dam is referred to as the "first retaining wall", and the retaining wall extending along the second direction in the grid dam is referred to as the "second retaining wall". Normally, the first retaining wall and the second retaining wall are perpendicular to each other, but those skilled in the art will understand that it is feasible even if the angle between the first retaining wall and the second retaining wall is not 90°. In order to form such a grid dam using a dam mold, the dam cavity 21 in the first sub-mold 20 should have a first cavity 211 for forming the first retaining wall, and a second cavity 212 for forming the second retaining wall. In some examples of this embodiment, only one light-emitting chip 42 is provided in one grid of the grid dam, and correspondingly, in the grid formed by the first cavity 211 and the second cavity 212, there is only one chip accommodating hole 22, such as Figure 4 However, those skilled in the art will appreciate that if two or more light-emitting chips 42 are disposed within a grid of the grid dam on the substrate 40, two or more chip receiving holes will also be correspondingly disposed within the grid of the dam cavity, such as Figure 5 shown.

[0057] In this embodiment, the depth of the depression at the intersection of the first cavity 211 and the second cavity 212 in the dam cavity 21 is consistent with the depth of the depression at the non-intersecting portion of the dam cavity 21. It should be understood that the depth of the depression of the dam cavity 21 determines the height of the dam formed. If the depression depth at each location in the dam cavity 21 is consistent, then the height of the dam formed based on the dam cavity 21 is also consistent at each location. This can solve the problem of bulging at the intersection of the grid dam when forming a grid dam on the substrate based on brushing glue in the related art. This is conducive to reducing the thickness of the light board and achieving a lighter and thinner product. In some examples of this embodiment, the depression depth of the dam cavity 21 is greater than or equal to the height of the light-emitting chip 42. This ensures that the height of the dam formed based on the dam cavity 21 is greater than or equal to the height of the light-emitting chip 42. Typically, the depression depth of the dam cavity 21 is greater than the height of the light-emitting chip 42, which can increase the dam's restriction on the lighting range of the light-emitting chip 21.

[0058] Because the dam cavity 21 essentially determines the shape of the dam, which in turn affects its reflection of light emitted by the light-emitting chip 42, and the shape of the dam cavity 21 also determines the difficulty of separating the dam from the first sub-mold 20, in this embodiment, the first cavity 211, the second cavity 212, and the sub-cavity 210 are collectively referred to as cavities. The dam cavity 21 is composed of multiple cavities, which can be composed of one or more of the first cavity 211, the second cavity 212, and the sub-cavity 210.

[0059] In this embodiment, the cross section of the cavity is defined as a cross section perpendicular to the direction of extension of the cavity, and the width of the cavity cross section is parallel to the first surface or the second surface of the first sub-mold 20. In some examples, the width of the cross section of the cavity gradually decreases in the direction away from the first surface, that is, as the depth of the cavity increases, the width of its cross section decreases. Therefore, the cross section of the dam retaining wall formed based on this cavity is "small at the top and large at the bottom", for example, it can be any of the following shapes: a trapezoid, a trisceles triangle, or a crescent (the so-called crescent in this embodiment refers to a figure whose outline is composed of an arc segment and a straight line segment connected end to end, including a semicircle, etc.). Of course, when the cross section of the dam retaining wall is a trapezoid, a trisceles triangle, or a crescent, the cross section of the corresponding cavity should also be a trapezoid, a trisceles triangle, or a crescent. It is understood that the width of the cavity cross section gradually decreases in the direction away from the first surface. This not only allows the retaining wall to better reflect the light emitted by the light-emitting chip toward the center of the dam, thereby limiting the lighting range of the light-emitting chip, but also facilitates the demolding process of the first sub-mold 20 and the dam. However, those skilled in the art will understand that in other examples of this embodiment, the cross section of the cavity can also be other shapes such as a rectangle.

[0060] The second sub-mold 30 includes a main body plate 31 and a plurality of glue-blocking posts 32 provided on one surface of the main body plate 31. It is understood that the main body plate 31 is a plate-shaped structure, one surface of which is used to cooperate with the second surface of the first sub-mold 20, and the plurality of glue-blocking posts 32 are provided on this surface. The glue-blocking posts 32 protrude from the main body plate 31 and are used to extend from the second surface of the first sub-mold 20 into the chip receiving hole 22 when the first sub-mold 20 and the second sub-mold 30 are mated. Figure 6 As shown. Therefore, those skilled in the art will understand that the arrangement of the glue-blocking posts 32 on the main plate 31 is consistent with the arrangement of the chip-accommodating holes 22 on the first sub-mold 20. When the chip-accommodating holes 22 are arranged in an array on the first sub-mold 20, the glue-blocking posts 32 will also be arranged in an array on the main plate 31. It is worth noting that the light-emitting chip 42 and the glue-blocking posts 32 extend into the chip-accommodating holes 22 at different times and in different directions. Therefore, the light-emitting chip 42 and the glue-blocking posts 32 will not conflict within the chip-accommodating holes 22.

[0061] The function of the glue blocking column 32 is to prevent the dam glue from entering the chip accommodating hole 22 and blocking the chip accommodating hole 22 when the dam glue is set from the first surface to the dam cavity 21, resulting in the subsequent light-emitting chip 42 being unable to extend into the chip accommodating hole 22, thereby making the first surface of the first sub-mold 20 unable to fit with the chip-bearing surface of the substrate 40. In order to achieve this goal, it is required that the glue blocking column 22 can not only extend into the chip accommodating hole 22, but also prevent the dam glue from completely blocking the opening of the chip accommodating hole 22 on the first surface. Therefore, the height of the glue blocking column 22 should be greater than or equal to the axial dimension of the chip accommodating hole 22 (that is, the height of the chip accommodating hole 22). In some examples of this embodiment, the height of the glue blocking column 32 exceeds the axial dimension of the chip accommodating hole 22, such as Figure 7 As shown, when the first sub-mold 20 and the second sub-mold 30 are matched, the glue blocking column 32 will partially protrude from the first surface of the first sub-mold 20. However, considering that when setting the dam glue from the first surface of the first sub-mold 20 to the dam cavity 21, it is usually achieved by scraping the glue on the first surface. In this case, if the glue blocking column 32 protrudes from the first surface, it will form an obstacle to scraping the glue, making it difficult to scrape the glue and affecting the difficulty of forming the dam. Therefore, in some other examples of this embodiment, the height of the glue blocking column 32 is consistent with the axial size of the chip receiving hole 22, such as Figure 6 .

[0062] In some examples of this embodiment, the glue blocking column 32 can tightly seal the chip receiving hole 22, that is, the cross-sectional specifications of the glue blocking column 32 are consistent with the cross-sectional specifications of the chip receiving hole 22, and the consistency of specifications here includes the consistency of the shape and size of the cross section. In this case, the dam glue can no longer enter the chip receiving hole 22. In some examples of this embodiment, in order to facilitate the glue blocking column 32 to extend into the chip receiving hole 22, and to improve the tightness of the glue blocking column 32 to the chip receiving hole 22, in some examples of this embodiment, the glue blocking column 32 can be made of elastic materials such as rubber.

[0063] In some other examples of this embodiment, after the glue blocking pillar 32 extends into the chip receiving hole 22, there is a certain gap 80 between the side wall of the chip receiving hole 22, such as Figure 8 As shown. When the first sub-mold 20 and the second sub-mold 30 are matched, the dam glue can enter the chip receiving hole 22 through the gap 80. However, the space occupied by the glue blocking column 32 will not be entered by the dam glue. Later, when the first sub-mold 20 is matched with the substrate 40, although the inner wall of the chip receiving hole 22 is covered with the dam glue 50, the light emitting chip 42 can still extend into the hole, as shown in FIG. Figure 9As shown. It is understood that, in this case, the shape and size of the cross section of the adhesive stopper 32 determines whether the chip receiving hole 22 can accommodate the light-emitting chip 42. For ease of description, the cross section of the adhesive stopper 32 is referred to as the "column cross section." In some examples of this embodiment, the length of the cross section is greater than the length of the chip's orthographic projection, and the width of the cross section is greater than the width of the chip's orthographic projection.

[0064] Although the dam can be set even when there is a gap between the glue-blocking column 32 and the wall of the chip-accommodating hole 22, this situation places higher demands on the alignment accuracy between the first sub-mold 20 and the second sub-mold 30, and the alignment accuracy between the first sub-mold 20 and the substrate 40. Once the corresponding accuracy is not achieved in one of the two alignment processes, it will easily lead to the light-emitting chip being unable to extend into the chip-accommodating hole 22 whose inner wall has been covered by the dam glue, thereby increasing the difficulty of forming the dam. Therefore, in more examples of this embodiment, the cross-section of the glue-blocking column 32 matches the cross-section of the chip-accommodating hole 22, which can reduce the difficulty of setting the dam and improve the efficiency of light board preparation.

[0065] In some other examples of this embodiment, the second sub-mold 30 may also be provided with a side edge 33, see Figure 10 As shown, the side edge 33 is arranged around the circumference of the main body plate 31, and it protrudes from the main body plate 31 in the same direction as the rubber stop column 32. Therefore, the side edge 33 and the main body plate 31 together form a "groove", and the groove-shaped accommodation space enclosed by the two is just enough for the first sub-mold 20 to be embedded, as shown in FIG. Figure 11As shown. Normally, the side edge 33 is perpendicular to the main plate 31. After the first sub-mold 20 is inserted into the groove-shaped accommodation space, the side edge 33 actually clamps the first sub-mold 20 in the middle, which can improve the tightness of the connection between the first sub-mold 20 and the second sub-mold 30 and avoid the problem of separation between the first sub-mold 20 and the second sub-mold 30 during the scraping process. In some examples of this embodiment, the height of the side edge 33 protruding from the main plate 31 is equal to the thickness of the first sub-mold 20. Therefore, the side of the side edge 33 away from the main plate 31 is flush with the first surface of the first sub-mold 20; in other examples of this embodiment, the height of the side edge 33 protruding from the main plate 31 is less than the thickness of the first sub-mold 20; in some other examples, the height of the side edge 33 protruding from the main plate 31 is greater than the thickness of the first sub-mold 20. It is understood that if the height of the side edge 33 protruding from the main plate 31 is less than or equal to the thickness of the first sub-mold 20, then the side edge 33 will have little impact on the glue scraping process. For example, if excess glue is left over during the glue scraping process on the dam cavity 21, the excess glue can be directly scraped off from the first surface of the first sub-mold 20. However, if the height of the side edge 33 protruding from the main plate 31 is greater than the thickness of the first sub-mold 20, then when the first sub-mold 20 and the second sub-mold 30 are combined, the side edge 33 will also serve as the side edge of the first sub-mold 20. In this scenario, if excess glue is left over, it may be more difficult to remove.

[0066] The dam mold provided in this embodiment has a first sub-mold and a second sub-mold that can be separated from each other. When the first sub-mold and the second sub-mold are combined, the glue blocking column can extend from the second surface of the first sub-mold into the chip receiving hole to block the chip receiving hole. This makes it easy to set the dam glue from the first surface of the first sub-mold into the dam cavity by scraping glue without having to worry about the dam glue blocking the chip receiving hole. After the scraping glue is completed, the second sub-mold is separated, and then the first sub-mold is transferred to the substrate. The light-emitting chip can be extended into the chip receiving hole of the first sub-mold, so that the substrate surface can be fitted with the first surface of the first sub-mold. The dam glue in the dam cavity can adhere to and combine with the substrate surface. After the dam glue is cured, the first sub-mold is removed to complete the formation of the dam on the substrate. The dam mold is suitable for both scenarios where a light-emitting chip is already set on the substrate surface and scenarios where a light-emitting chip is not set on the substrate surface. It has a wide range of applications.

[0067] Another optional embodiment of the present application:

[0068] This embodiment will provide a dam forming method based on the above-mentioned dam mold, see Figure 12 and Figure 13 ,in Figure 12 is a flow chart of the dam forming method, and Figure 13This is a schematic diagram of the process of dam formation:

[0069] S1202: Provide a substrate and a dam mold.

[0070] See Figure 13 In (a), in this embodiment, the substrate 40 provided has a light-emitting chip 42 already disposed thereon. However, those skilled in the art will appreciate that, if the dam can be provided first and then die bonded, a substrate 40 without the light-emitting chip 42 can also be provided. In this embodiment, the dam mold 10 includes a first sub-mold 20 and a second sub-mold 30 that are separable from each other. In some examples of this embodiment, the dam mold 10 may further include a third sub-mold, which is used to absorb the substrate 40. In these examples, the third sub-mold can be used as a female mold to absorb and fix the substrate 40, and the first sub-mold 20 and the second sub-mold 30 can be used together as a male mold.

[0071] S1204: Combine the first sub-mold and the second sub-mold.

[0072] After obtaining the first sub-mold 20 and the second sub-mold 30, the first sub-mold and the second sub-mold can be combined so that the second surface of the first sub-mold 20 is in contact with the main plate 31 of the second sub-mold 30, and the glue blocking column 32 is extended into the chip receiving hole 22. Figure 13 In the dam mold used in this embodiment, the height of the glue blocking column 32 is equal to the axial dimension of the chip receiving hole 22 , so the free end of the glue blocking column 32 is flush with the first surface of the first sub-mold 20 .

[0073] S1206: scraping dam glue from the first surface of the first sub-mold into the dam cavity until the dam cavity is filled.

[0074] Subsequently, the dam glue 50 can be scraped from the first surface of the first sub-mold 20 into the dam cavity 21, so that the dam glue 50 fills the dam cavity 21 until the dam cavity 21 is filled with the dam glue 21. Figure 13 As shown in (c) of FIG. 1 , in this embodiment, the cross-section of the cavity 21 of the dam mold is trapezoidal. Furthermore, the cross-section of the adhesive retaining column 32 in the dam mold 10 matches the cross-section of the chip receiving hole 22. Therefore, during the process of scraping and applying the adhesive 50 of the dam, the adhesive 50 of the dam will not enter the chip receiving hole 22.

[0075] In addition, it should be noted that when the dam glue 50 is disposed in the dam cavity 21 , the dam glue 50 may be slightly protruded from the dam cavity 22 , so as to facilitate the subsequent combination of the dam glue 50 and the substrate 40 .

[0076] S1208: Remove the second sub-mold.

[0077] After the filling of the dam glue 50 is completed, the second sub-mold 30 can be removed. Figure 13 (d) in.

[0078] S1210: Laminating the first surface of the first sub-mold to the chip carrying surface of the substrate, and heating to bond the dam glue to the substrate.

[0079] Next, the first sub-mold 20 is combined with the substrate 40 so that the first surface of the first sub-mold 20 is aligned with the chip carrying surface of the substrate 40, and the light emitting chip 42 is inserted into the chip receiving hole 22. Figure 13 As shown in (e) in FIG. It should be understood that when the first surface of the first sub-mold 20 is in contact with the chip-carrying surface of the substrate 40, the dam glue 50 in the dam cavity 21 will contact the chip-carrying surface of the substrate 40 and adhere to the substrate 40. In this embodiment, the dam glue 50 is heated so that it cures and bonds to the chip-carrying surface of the substrate 40.

[0080] S1212: After the dam glue is cured, the first sub-mold is removed.

[0081] After the dam glue 50 is cured, the first sub-mold 20 can be removed. Figure 13 As shown in (f), since the cross section of the cavity in the dam cavity 21 is trapezoidal, the cross section of the retaining wall in the formed dam 60 is also trapezoidal.

[0082] In some examples of this embodiment, in order to facilitate demoulding, before scraping the dam glue 50 into the dam cavity 21, a degumming agent can be first provided on the inner wall of the dam cavity 21 to make the inner wall of the dam cavity 21 "glue-free".

[0083] The dam formation solution provided in this embodiment, based on the aforementioned dam mold, provides predictable and controllable dam shape and height, facilitating the production of dams with the desired shape and height, thereby improving the quality of products such as light panels and display screens. Furthermore, this dam mold is suitable for both substrates with and without light-emitting chips, making it widely applicable. Furthermore, using this dam mold to create a dam on a substrate is simple and easy to operate, helping to reduce the cost of light panels and display screens.

[0084] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A dam mould, characterized in that: comprising a first sub-mold and a second sub-mold separated from each other; The first sub-mold has a first surface for mating with the chip-carrying surface of the substrate, and a second surface for mating with the second sub-mold and opposite to the first surface; the first sub-mold is provided with a recessed dam cavity, the opening of the dam cavity is located on the first surface, and is recessed toward the second surface; the first sub-mold is also provided with a plurality of chip-accommodating holes extending through the first and second surfaces, the chip-accommodating holes on the first sub-mold corresponding to the positions of the light-emitting chips on the substrate, and the chip-accommodating holes are configured to accommodate the light-emitting chips; The second sub-mold comprises a main body plate and a plurality of glue-blocking posts provided on a side of the main body plate that cooperates with the first sub-mold, wherein the height of the glue-blocking posts is greater than or equal to the axial dimension of the chip-accommodating hole, and the glue-blocking posts correspond one-to-one with the chip-accommodating holes; when the first sub-mold and the second sub-mold are combined, the glue-blocking posts extend into the corresponding chip-accommodating holes; Wherein, the plurality of chip accommodating holes are arranged in an array on the first sub-mold, and the plurality of glue blocking columns are arranged in an array on the surface of the main body plate; The dam cavity is formed by a plurality of first cavities extending along a first direction and a plurality of second cavities extending along a second direction. The plurality of first cavities and the plurality of second cavities intersect to form a grid, and the chip accommodating holes are distributed in the grid. The depth of the depression at the intersection of the first cavity and the second cavity is consistent with the depth of the depression at the non-intersection portion of the dam cavity.

2. The dam mold according to claim 1, characterized in that: The cross section of the glue blocking column has the same specifications as the cross section of the chip accommodating hole.

3. The dam mold according to claim 1, characterized in that: The height of the glue-blocking column is equal to the axial dimension of the chip accommodating hole.

4. The dam mold according to claim 1, characterized in that: The cross section of any cavity in the dam cavity is perpendicular to the extension direction of the cavity, and the width direction of the cross section of the cavity is parallel to the first surface; the width of the cross section of the cavity gradually decreases in the direction away from the first surface.

5. The dam mold according to claim 1, characterized in that: The cross section of the cavity is any one of a trapezoidal shape and a crescent shape.

6. The dam mold according to claim 1, characterized in that: The recessed depth of the dam cavity is greater than or equal to the height of the light-emitting chip.

7. The dam mold according to claim 1, characterized in that: The second sub-mold also includes a side edge arranged around the circumference of the main body plate, the side edge and the glue blocking column protrude outward from the surface of the main body plate in the same direction, and the side edge and the main body plate form a groove-shaped accommodating space just for the first sub-mold to be embedded, and the height of the side edge protruding from the main body plate is equal to the thickness of the first sub-mold.

8. A method for forming a dam, characterized in that: include: Providing a substrate and a dam mold according to any one of claims 1 to 7; combining the first sub-mold and the second sub-mold; scraping dam glue from the first surface of the first sub-mold into the dam cavity until the dam cavity is filled; removing the second sub-mold; Laminating the first surface of the first sub-mold to the chip carrying surface of the substrate, and heating to bond the dam glue to the substrate; After the dam glue is solidified, the first sub-mold is removed.

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