Temperature sensing module and manufacturing method thereof

Abstract

The application relates to a temperature sensing module and a manufacturing method thereof, which comprises: a plurality of circuit units are arranged on a conductive sheet, each circuit unit comprises two independent closed circuits, each closed circuit encloses a pad part on the conductive sheet; a first insulating film covers and connects the bottom of the conductive sheet; a second insulating film covers and connects the top of the conductive sheet, and a window unit corresponding to the pad part is arranged on the second insulating film, each window unit comprises a thermistor window and a sampling line window which are respectively projected at two ends of the corresponding pad part. Since the temperature sensing module only comprises the conductive sheet and the insulating structure above and below the conductive sheet, and the circuit unit is once cut and formed, the temperature sensing module can be directly welded with a thermistor, does not need a PCB board, and does not need the operation process of printing a circuit on the PCB board, so that the production manufacturing cost is greatly reduced. In addition, since the limitation of the PCB is eliminated, the temperature sensing module can be attached to any position of a carrier to be detected.

Description

Technical Field

[0001] This application relates to the field of temperature measurement technology, and in particular to a temperature sensing module and its manufacturing method. Background Technology

[0002] Currently, thermistors exhibit the characteristic that their resistance decreases exponentially with increasing temperature, making them commonly used for temperature sampling in electronic or mechanical products. Existing temperature sampling components consist of a thermistor soldered onto two wires or a flexible circuit board, encapsulated with epoxy resin or thermally conductive adhesive, and externally connected to the heating structure via a metal sheet (nickel or aluminum) to conduct heat.

[0003] In the development and manufacturing of electronic products, the printing of printed circuit boards (PCBs) is unavoidable. A PCB uses an insulating substrate, cut to a specific size, on which conductive patterns such as circuits, pads, vias, and solder mask are formed to enable interconnection between electronic components. Generally, the PCB printing process involves coating an insulating substrate with ink, drying the ink, then applying the circuit pattern to be printed onto the ink-coated substrate and exposing it to light. Finally, the exposed substrate undergoes development to complete the circuit printing.

[0004] In some related technologies, when forming a temperature sensing module with a thermistor, the circuit is first printed on a PCB board, and then the thermistor is attached to the PCB board to finally form a temperature sensing module. However, this method has the following problems:

[0005] (1) As can be seen from the above description, the process of printing circuits on PCB is complicated and greatly increases the production cost. Therefore, it is urgent to solve the problem of how to manufacture temperature sensing modules without printing process and to propose a new temperature sensing module structure and change the manufacturing process.

[0006] (2) Since the printed circuits on the PCB are fixed, the position of the thermistor mounted on it is also fixed, which cannot meet the position requirements in actual use. Summary of the Invention

[0007] This application provides a temperature sensing module and its manufacturing method to solve the problem in related technologies where temperature sensing modules with complex structures are formed by printing circuits on a PCB board and then setting thermistors on the printed circuits, and the complex process greatly increases production costs.

[0008] Firstly, a method for manufacturing a temperature-sensing module is provided, specifically including the following steps:

[0009] The entire conductive sheet is cut into circuits to form multiple circuit units;

[0010] After the conductive sheet is cut into circuits, the first insulating film is pressed onto the bottom of the conductive sheet;

[0011] Holes are made in the second insulating film to form a thermistor window and a sampling line window, and after the conductive sheet has been cut into lines, they are pressed onto the top of the conductive sheet.

[0012] The conductive sheet, which is laminated with the first insulating film and the second insulating film, is cut into pieces to form a temperature sensing module.

[0013] In some embodiments, each of the circuit units is provided with a corresponding thermistor;

[0014] After cutting and slicing the conductive sheet with the first and second insulating films pressed together to form a temperature sensing module, the following steps are also included:

[0015] The surfaces of the exposed pads in the thermistor window and sampling line window of the temperature sensing module are treated with anti-oxidation to form a temperature sensing module board that can be reflow soldered.

[0016] The thermistor is soldered onto the temperature sensing module board by reflow soldering;

[0017] After welding is completed, the surface of the thermistor is coated with conformal coating to obtain the final product.

[0018] In some embodiments, the conductive sheet after the circuit is cut is pressed onto the first insulating film, specifically including the following steps:

[0019] A first pressing roller assembly is provided, comprising two first pressing rollers rotating in opposite directions, the two first pressing rollers being arranged opposite to each other;

[0020] The first insulating film is placed below the conductive sheet; then the first insulating film and the conductive sheet are fed together into the first pressing roller group;

[0021] Under the pressure of the two first pressing rollers, the first insulating film is pressed onto the bottom of the conductive sheet.

[0022] In some embodiments, the second insulating film is pressed onto the top of the conductive sheet, including the following steps:

[0023] A second pressing roller assembly is provided, comprising two opposing second pressing rollers, the two second pressing rollers rotating in opposite directions;

[0024] The second insulating film is placed above the conductive sheet; then the second insulating film and the conductive sheet are fed together into the second pressing roller group;

[0025] Under the pressure of the two second pressing rollers, the second insulating film is pressed onto the top of the conductive sheet.

[0026] In some embodiments, the second pressing roller group further includes a film feeding roller, which is close to one of the second pressing rollers and rotates in the opposite direction to that second pressing roller; the film feeding roller is away from the other second pressing roller.

[0027] After creating an opening in the second insulating film, and before pressing the second insulating film to the conductive sheet, the method further includes:

[0028] The waste discharge film and the second insulating film are fed together between the film feeding roller and the second pressing roller that is close to the film feeding roller to perform the waste discharge operation of the insulating film.

[0029] In some embodiments, cutting the conductive sheet with the first insulating film and the second insulating film laminated together to form a temperature sensing module includes the following steps:

[0030] A third pressing roller assembly and a slicing device are provided. The third pressing roller assembly includes two opposing third pressing rollers, which rotate in opposite directions.

[0031] The conductive sheet, which is pressed with the first insulating film and the second insulating film, is fed into the third pressing roller group;

[0032] After the third pressing roller in the third pressing roller group rotates once, the slicer is used to cut and divide the slice once.

[0033] The second aspect provides a temperature sensing module, which is implemented by the above-described manufacturing method for a temperature sensing module, and includes:

[0034] A conductive sheet has multiple circuit units on it, each circuit unit including two independent closed circuits, and each closed circuit surrounds a pad portion on the conductive sheet.

[0035] A first insulating film covers and is attached to the bottom of the conductive sheet;

[0036] A second insulating film covers and is connected to the top of the conductive sheet, and has window units corresponding to the pad portion. Each window unit includes a thermistor window and a sampling line window projected to the two ends of the pad portion respectively.

[0037] In some embodiments, the temperature sensing module further includes: a plurality of thermistors, each corresponding to one of the circuit units;

[0038] The positive terminal of the thermistor passes through the thermistor window of one of the two pads contained in the circuit unit and is connected to the pad.

[0039] The negative terminal of the thermistor passes through the thermistor window of the other pad of the two pads contained in the circuit unit and is connected to the pad.

[0040] Each sampling line window has a sampling line, one end of which passes through the sampling line window and connects to the pad portion.

[0041] In some embodiments, the temperature sensing module further includes a protection component for protecting the temperature sensing module.

[0042] The temperature sensing module also includes a protection component comprising a base plate covering and connected to the bottom of the first insulating film, and a cover plate covering and connected to the top of the second insulating film, the base plate being provided with temperature sensing holes; and / or,

[0043] The protective assembly includes a base plate that covers and is connected to the bottom of the first insulating film, and a cover plate that covers and is connected to the top of the second insulating film, the cover plate having heat dissipation holes.

[0044] The beneficial effects of the technical solution provided in this application include:

[0045] This application provides a temperature sensing module and its manufacturing method. By forming circuit units on a conductive sheet, each circuit unit includes two independent closed circuits, and each closed circuit surrounds a pad portion on the conductive sheet. Then, a first insulating film and a second insulating film are respectively set at the bottom and top of the conductive sheet. Window units corresponding to the welding portion are opened on the second insulating film. Each window unit includes a thermistor window and a sampling line window projected to both ends of the corresponding pad portion, thereby forming a temperature sensing module with a novel structure. Since it only has a conductive sheet and the insulating structures above and below it, and its circuit units are cut and formed in one step, subsequent processes do not require further cutting. This allows the temperature sensing module to directly weld the thermistors without the need for a PCB board or the PCB board printing process, thus greatly reducing manufacturing costs.

[0046] In addition, the new temperature sensing module, freed from the limitations of PCB, can be mounted at any position on the carrier to be detected, meeting the positional requirements in actual use. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1A schematic diagram showing the distribution of circuit units on a conductive sheet provided in an embodiment of this application;

[0049] Figure 2 This is a schematic diagram of the specific structure of the circuit unit provided in the embodiments of this application;

[0050] Figure 3 A schematic diagram showing the connection between the circuit unit and the window unit corresponding to the embodiment of this application, and the first insulating film and the second insulating film;

[0051] Figure 4 A schematic diagram showing the formation of pads and window units on a conductive sheet according to an embodiment of this application;

[0052] Figure 5 A schematic diagram of the temperature sensing module provided in this embodiment on a carrier plate;

[0053] Figure 6 A schematic diagram of the structure of a temperature sensing module with protective components provided in an embodiment of this application;

[0054] Figure 7 This is a schematic diagram of the process for manufacturing a temperature sensing module provided in an embodiment of this application.

[0055] In the diagram: 1. Conductive sheet; 2. Circuit unit; 3. Pad section; 4. First insulating film; 5. Second insulating film; 6. Thermistor window; 7. Sampling line window; 8. Thermistor; 9. Cover plate; 10. Base plate; 11. Temperature sensing hole; 12. Heat dissipation hole; 13. First mark; 14. Second mark; 15. First pressing roller group; 16. Second pressing roller group; 17. Third pressing roller group; 18. Support plate; 19. Waste discharge membrane. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0057] This application provides a temperature sensing module and its manufacturing method to solve the problem in related technologies where temperature sensing modules with complex structures are formed by printing circuits on a PCB board and then setting thermistors on the printed circuits, and the complex process greatly increases production costs.

[0058] Please see Figures 1-5 A temperature sensing module includes a conductive sheet 1, a first insulating film 4, and a second insulating film 5;

[0059] The conductive sheet 1 is provided with multiple circuit units 2, each circuit unit 2 including two independent closed circuits. The closed circuits surround the conductive sheet 1 to form a pad portion 3. The closed circuits can be rectangular, circular or polygonal, etc. In this embodiment, the specific shape of the closed circuits is not specifically limited, but can be set according to actual needs. The corresponding pad portion 3 is also of the corresponding shape.

[0060] The first insulating film 4 covers and is connected to the bottom of the conductive sheet 1, serving as a support and insulation. The second insulating film 5 covers and is connected to the top of the conductive sheet 1. The second insulating film 5 has window units corresponding to the pad portion 3. Each window unit includes a thermistor window 6 and a sampling line window 7 whose projections are respectively located at both ends of the corresponding pad portion 3.

[0061] Both the first insulating film 4 and the second insulating film 5 can be transparent or opaque. The thermistor window 6 and the sampling line window 7 are used to connect the thermistor 8 and the sampling box, respectively, as shown in the diagram. Figure 2 The first mark 13 and the second mark 14 are shown in the figure.

[0062] With the above structural design, the new temperature sensing module only has a conductive sheet 1 and the insulating structure above and below it. In addition, its circuit unit 2 is cut and formed in one go, and no further cutting is required in the subsequent process. This allows the temperature sensing module to be directly soldered with the thermistor without the need for a PCB board and the operation process of printing circuits on the PCB board, thus greatly reducing the production and manufacturing costs.

[0063] In addition, the new temperature sensing module, freed from the limitations of PCB, can be coated with adhesive on the first insulating film 4 and then mounted at any position on the carrier to be detected, meeting the position requirements in actual use.

[0064] like Figure 5 As shown, in some preferred embodiments, each circuit unit 2 in the above-mentioned temperature sensing module corresponds to a thermistor 8, and the connection method of the thermistor 8 is as follows:

[0065] The positive terminal of the thermistor 8 passes through the thermistor window 6 of one of the two pads 3 included in the corresponding circuit unit 2 and is connected to the pad 3.

[0066] The negative terminal of the thermistor 8 passes through the thermistor window 6 of the other pad 3 of the two pads 3 contained in the corresponding circuit unit 2 and is connected to the pad 3. That is, the thermistor 8 connects the two pads 3 to form a circuit.

[0067] In some preferred embodiments, each sampling line window 7 is provided with a sampling line, one end of which passes through the sampling line window 7 and is connected to the pad portion 3. The sampling line supplies power to the thermistor 8 and transmits the resistance change of the thermistor 8 to the information collection device.

[0068] like Figure 6 As shown, the temperature sensing module with thermistor 8 and sampling line formed above is mostly soft in texture, and during use, it is only covered by the first insulating film 4 and the second insulating film 5, making it susceptible to external damage. In addition, considering that its structure is not stable enough, it is easy to deform and difficult to fix when pasted on the object being measured or the carrier. Therefore, the following settings were made:

[0069] A protective assembly is wrapped around the temperature sensing module. The protective assembly includes a base plate 10 that covers and is attached to the bottom of the first insulating film 4, and / or a cover plate 9 that covers and is attached to the top of the second insulating film 5. For the protection of the temperature sensing module, in one possible embodiment, the base plate 10 and the cover plate 9 are preferably made of a hard, wear-resistant, and lightweight material.

[0070] Furthermore, considering that the temperature sensing module is directly attached to the object being measured, a temperature sensing hole 11 is provided on the base plate 10 to improve the temperature sensing capability of the thermistor 8.

[0071] Furthermore, to further improve the temperature sensing capability of the thermistor 8 and prevent heat from accumulating on the temperature sensing module, heat dissipation holes 12 are provided on the cover plate 9 to improve the accuracy of temperature sensing.

[0072] In some preferred embodiments, the conductive sheet 1 is a flexible conductive sheet or a rigid conductive sheet. The flexible conductive sheet has both conductivity and a certain degree of flexibility, such as bending, stretching, and twisting. For the flexible conductive sheet, the more important performance is the retention of electrical properties when subjected to these deformations. Examples include copper foil and silver.

[0073] In one possible implementation, the conductive sheet 1 is a rigid conductive sheet, comprising a rigid conductive metal or non-metallic material.

[0074] This application also proposes a method for manufacturing a temperature sensing module, which specifically includes the following steps:

[0075] The conductive sheet 1 is cut into circuits using a circular blade cutting device to form multiple circuit units 2 arranged in a rectangular array on the entire conductive sheet 1; for example... Figure 1 As shown.

[0076] After the conductive sheet 1 has been cut into circuits, the first insulating film 4 is pressed onto the bottom of the conductive sheet 1; as shown Figure 2-4 As shown.

[0077] A circular knife cutting device is used to create holes in the second insulating film 5 to form the thermistor window 6 and the sampling line window 7, which are then pressed onto the top of the conductive sheet 1 after the circuit cutting is completed; for example... Figure 2-4 As shown.

[0078] Using a circular blade cutting device, the conductive sheet 1, which is pressed with the first insulating film 4 and the second insulating film 5, is cut into pieces to form a temperature sensing module.

[0079] Of the above steps, the best approach is to first press the first insulating film 4 onto the bottom of the conductive sheet 1, then make openings in the second insulating film 5 to form the thermistor window 6 and the sampling line window 7, and press them onto the top of the conductive sheet 1.

[0080] Of course, it is also possible that the second insulating film 5 is first opened to form the thermistor window 6 and the sampling line window 7, and then pressed onto the top of the conductive sheet 1; and then the first insulating film 4 is pressed onto the bottom of the conductive sheet 1.

[0081] The steps of forming a thermistor window 6 and a sampling line window 7 by opening holes in the second insulating film 5 and pressing them onto the top of the conductive sheet 1 can be performed simultaneously with the step of pressing the first insulating film 4 onto the bottom of the conductive sheet 1.

[0082] By following the steps above, no PCB board or PCB printing circuitry is required, thus greatly reducing manufacturing costs.

[0083] In addition, the new temperature sensing module, freed from the limitations of PCB, can be mounted at any position on the carrier to be detected, meeting the positional requirements in actual use.

[0084] In some preferred embodiments, after cutting and slicing the conductive sheet 1, which is laminated with the first insulating film 4 and the second insulating film 5, to form a temperature sensing module, the following steps are also included:

[0085] The surfaces of the pads 3 exposed by the thermistor window 6 and sampling line window 7 in the temperature sensing module are subjected to anti-oxidation treatment to form a temperature sensing module board that can be reflow soldered.

[0086] Furthermore, each line unit 2 is provided with a thermistor 8;

[0087] After forming the temperature-sensing module board that can be reflow soldered, the method further includes the following steps:

[0088] Thermistor 8 was soldered by reflow soldering;

[0089] After welding is completed, the surface of thermistor 8 is coated with conformal coating to obtain the final product.

[0090] like Figure 7As shown, in some preferred embodiments, the conductive sheet 1 after the circuit is cut is pressed onto the first insulating film 4, specifically including the following steps:

[0091] A first pressing roller group 15 is provided, which includes two first pressing rollers with opposite rotation directions. The two first pressing rollers are arranged opposite to each other. The opposite arrangement can be understood as the two first pressing rollers being arranged in parallel rows with intervals. It can include not only the vertical arrangement shown in the figure, but also the horizontal tilting arrangement.

[0092] The first insulating film 4 is placed below the conductive sheet 1; then they are fed together into the first pressing roller group 15; under the pressure of the first pressing rollers, the first insulating film 4 is pressed onto the bottom of the conductive sheet 1. The first step of pressing is completed, and then along... Figure 7 The material is fed in the indicated direction to the next processing position.

[0093] like Figure 7 As shown, in some preferred embodiments, the specific operation of pressing the second insulating film 5 onto the top of the conductive sheet 1 is as follows:

[0094] A second pressing roller assembly 16 is provided, which includes two opposing second pressing rollers that rotate in opposite directions.

[0095] The second insulating film 5 is placed above the conductive sheet 1; then it is fed together into the second pressing roller group 16; under the pressure of the second pressing roller, the second insulating film 5 is pressed onto the top of the conductive sheet 1. As described above, the pressing operation of the second insulating film 5 can be performed simultaneously with the pressing operation of the first insulating film 4, or it can be performed after or before the first insulating film 4.

[0096] Furthermore, since some waste material remains inside the thermistor window 6 and sampling line window 7 formed by openings in the second insulating film 5, if the possibility of affecting the welding of the thermistor 8 and sampling line in subsequent steps cannot be ruled out, the following steps are required:

[0097] The second pressing roller group 16 also includes a film feeding roller, which is close to one of the second pressing rollers and rotates in the opposite direction to that second pressing roller; the film feeding roller is away from the other second pressing roller.

[0098] After the second insulating film 5 is perforated, and before the second insulating film 5 is pressed together with the conductive sheet 1, the method further includes: feeding the waste removal film 19 and the second insulating film 5 together between the film feeding roller and the second pressing roller adjacent to the film feeding roller to perform a waste removal operation on the insulating film. The waste removal film 19 has low viscosity and can be referenced. Figure 7 A detailed explanation will be provided.

[0099] First, the waste discharge film 19 is placed above the second insulating film 5, and then fed together between the film feeding roller and the second pressing roller adjacent to the film feeding roller. The waste discharge film 19 passes through the space between the film feeding roller and the second pressing roller adjacent to the film feeding roller and moves upward at an angle. After the film feeding roller and the second pressing roller adjacent to the film feeding roller are pressed together, the waste is stuck to the waste discharge film 19, completing the waste discharge operation. At this time, the conveying direction of the waste discharge film 19 and the second insulating film 5 is opposite to the conveying direction of the conductive sheet 1 in the step of pressing the first insulating film 4 to the bottom of the conductive sheet 1.

[0100] After the waste is discharged, the second insulating film 5 is pressed onto the top of the conductive sheet 1.

[0101] like Figure 7 As shown, in some preferred embodiments, the conductive sheet 1, which is laminated with the first insulating film 4 and the second insulating film 5, is cut into pieces, including the following steps:

[0102] A third pressing roller group 17 and a slicing device are provided. The third pressing roller group 17 includes two opposing third pressing rollers that rotate in opposite directions.

[0103] The conductive sheet 1, which is pressed with the first insulating film 4 and the second insulating film 5, is fed into the third pressing roller group 17; after the third pressing roller in the third pressing roller group 17 rotates once, it is cut into pieces once using a slicing device.

[0104] It should be understood that, following the steps described above, multiple temperature-sensing modules with thermistors 8 and sampling lines are formed on the conductive sheet. Due to actual usage requirements, these modules need to be segmented, and each segment also contains multiple circuit units. The diameter of the third pressing roller can be adjusted to change the circumference and control the size of the segments.

[0105] Furthermore, since most of the temperature sensing modules formed above, which have thermistors 8 and sampling lines, are relatively soft and easily damaged when mounted on the object being tested without the aforementioned protective components, they are also susceptible to damage during subsequent disassembly. Therefore, considering future use, a carrier plate 18 needs to be added. The specific steps are as follows:

[0106] A support plate 18 is provided, and the support plate 18 has through holes; the support plate 18 can be FR4, aluminum plate, copper plate, etc., and can also be broadly understood as any material that has sufficient hardness to stably support the temperature sensing module.

[0107] Apply insulating adhesive to the bottom of the temperature sensing module, and then press or lay the carrier plate 18 on the bottom of the conductive sheet 1.

[0108] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0109] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0110] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A temperature sensing module, characterized in that, It includes: A conductive sheet (1) is provided with multiple circuit units (2), each circuit unit (2) includes two independent closed circuits, and each closed circuit surrounds a pad portion (3) on the conductive sheet (1). A first insulating film (4) covers and is attached to the bottom of the conductive sheet (1); The second insulating film (5) covers and is connected to the top of the conductive sheet (1), and has a window unit corresponding to the pad portion (3) on it. Each window unit includes a thermistor window (6) and a sampling line window (7) with projections located at the two ends of the pad portion (3). The manufacturing method of the temperature sensing module includes the following steps: The entire conductive sheet (1) is cut into circuits to form multiple circuit units (2). After the conductive sheet (1) has completed the circuit cutting, the first insulating film (4) is pressed onto the bottom of the conductive sheet (1); A thermistor window (6) and a sampling line window (7) are formed by opening holes in the second insulating film (5), and are pressed onto the top of the conductive sheet (1) after the line cutting is completed; The conductive sheet (1) with the first insulating film (4) and the second insulating film (5) pressed together is cut into pieces to form a temperature sensing module.

2. The temperature sensing module as described in claim 1, characterized in that: Each of the circuit units (2) is provided with a thermistor (8); After cutting and slicing the conductive sheet (1) with the first insulating film (4) and the second insulating film (5) pressed together to form a temperature sensing module, the following steps are also included: Anti-oxidation treatment is applied to the surface of the pad portion (3) exposed by the thermistor window (6) and sampling line window (7) in the temperature sensing module to form a temperature sensing module board that can be reflow soldered. The thermistor (8) is soldered onto the temperature sensing module board by reflow soldering; After welding is completed, the surface of the thermistor (8) is coated with three-proof paint to form the final product.

3. The temperature sensing module as described in claim 1, characterized in that, The conductive sheet (1) after the circuit is cut is pressed onto the first insulating film (4), specifically including the following steps: A first pressing roller assembly (15) is provided, comprising two first pressing rollers rotating in opposite directions, the two first pressing rollers being arranged opposite to each other; The first insulating film (4) is placed below the conductive sheet (1); then the first insulating film (4) and the conductive sheet (1) are fed together into the first pressing roller group (15); Under the pressure of the two first pressing rollers, the first insulating film (4) is pressed onto the bottom of the conductive sheet (1).

4. The temperature sensing module as described in claim 1, characterized in that, The second insulating film (5) is pressed onto the top of the conductive sheet (1) by the following steps: A second pressing roller assembly (16) is provided, comprising two opposing second pressing rollers, the two second pressing rollers rotating in opposite directions; The second insulating film (5) is placed above the conductive sheet (1); then the second insulating film (5) and the conductive sheet (1) are fed together into the second pressing roller group (16); Under the pressure of the two second pressing rollers, the second insulating film (5) is pressed onto the top of the conductive sheet (1).

5. The temperature sensing module as described in claim 4, characterized in that: The second pressing roller group (16) also includes a film feeding roller, which is close to one of the second pressing rollers and rotates in the opposite direction to that second pressing roller; the film feeding roller is away from the other second pressing roller; After making an opening in the second insulating film (5), and before pressing the second insulating film (5) with the conductive sheet (1), the method further includes: The waste discharge film (19) and the second insulating film (5) are fed together between the film feeding roller and the second pressing roller adjacent to the film feeding roller to perform the insulating film waste discharge operation.

6. The temperature sensing module as described in claim 1, characterized in that: The step of cutting and slicing the conductive sheet (1) with the first insulating film (4) and the second insulating film (5) pressed together to form a temperature sensing module includes the following steps: A third pressing roller assembly (17) and a slicing device are provided. The third pressing roller assembly (17) includes two opposing third pressing rollers, which rotate in opposite directions. The conductive sheet (1) with the first insulating film (4) and the second insulating film (5) pressed together is fed into the third pressing roller group (17); After the third pressing roller in the third pressing roller group (17) rotates once, it is cut into pieces once using a slicing device.

7. The temperature sensing module as described in claim 1, characterized in that, Also includes: Multiple thermistors (8), each thermistor (8) corresponds one-to-one with the circuit unit (2); The positive terminal of the thermistor (8) passes through the thermistor window (6) of one of the two pads (3) contained in the circuit unit (2) and is connected to the pad (3). The negative terminal of the thermistor (8) passes through the thermistor window (6) of the other pad (3) of the two pads (3) contained in the circuit unit (2) and is connected to the pad (3). Each sampling line window (7) is provided with a sampling line, one end of which passes through the sampling line window (7) and is connected to the pad portion (3).

8. The temperature sensing module as described in claim 1, characterized in that, Also includes: A protection component is provided to protect the temperature sensing module.

9. The temperature sensing module as described in claim 8, characterized in that: The protective assembly includes a base plate (10) covering and connected to the bottom of the first insulating film (4), and a cover plate (9) covering and connected to the top of the second insulating film (5). The base plate (10) is provided with temperature sensing holes (11); and / or, The protective assembly includes a base plate (10) covering and connected to the bottom of the first insulating film (4), and a cover plate (9) covering and connected to the top of the second insulating film (5), the cover plate (9) having heat dissipation holes (12).

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