Laser processing method, device, storage medium and computer equipment

Abstract

The present application provides a laser processing method, device, storage medium and computer equipment. The laser processing method is used to process multiple workpiece units on a workpiece to be processed, including the steps of: using a camera to take pictures of each workpiece unit in turn to obtain the coordinate information of the cutting line marking point of each workpiece unit in the physical coordinate system; according to the marking range of the galvanometer, converting the coordinates of the cutting line marking points of all workpiece units located within the same galvanometer marking range in the physical coordinate system into coordinates in the galvanometer coordinate system, wherein the field of view of the camera is larger than the area of the workpiece unit, and the marking range of the galvanometer is larger than the field of view of the camera; using the galvanometer to process all workpiece units located within the same galvanometer marking range. The laser processing method provided by the present application can effectively improve the laser processing accuracy, and realizes the simultaneous processing of multiple workpiece units, which can effectively improve the processing efficiency.

Description

Technical Field

[0001] The present application belongs to the field of laser processing technology, and more specifically, relates to a laser processing method, device, storage medium and computer equipment. Background Art

[0002] Large-format circuit board cutting methods usually include milling machine processing and laser processing. Compared with milling machine processing, laser processing can improve processing efficiency and cross-sectional quality, and can be used for processing flexible boards. Therefore, it is widely used in the cutting of large-format circuit boards.

[0003] In the related art, the commonly used large-format circuit board laser processing method usually uses a camera to locate several feature points on the product to calculate the position offset and rotation of the product. However, when the product to be processed has no marking points, or the correlation accuracy between the marking points and the actual processing position is poor, it is easy to cause low processing accuracy. For example, in some circuit boards that have been processed by a milling machine in the previous process, due to the low processing accuracy of the milling machine (usually ±0.1mm), it is easy to destroy the feature points of the product. If these feature points are still used as a reference during laser cutting, it will result in the inability to cut along the correct groove during laser cutting. In addition, in the processing of large-format soft boards, since the soft boards are prone to deformation, the feature points on the product will change. If these feature points are used to process the product, it will lead to inaccurate processing. Summary of the Invention

[0004] The purpose of this application is to provide a laser processing method that can improve processing accuracy.

[0005] To achieve the above-mentioned purpose, the technical solution adopted in this application is to provide a laser processing method for processing multiple workpiece units on a workpiece to be processed, comprising the steps of:

[0006] Use a camera to take pictures of each workpiece unit in turn to obtain the coordinate information of the cutting line mark point of each workpiece unit in the physical coordinate system;

[0007] According to the marking range of the galvanometer, the coordinates of the cutting line marking points of all workpiece units within the same galvanometer marking range in the physical coordinate system are converted into coordinates in the galvanometer coordinate system, wherein the field of view of the camera is larger than the area of the workpiece unit, and the marking range of the galvanometer is larger than the field of view of the camera;

[0008] Use the galvanometer to process all workpiece units within the marking range of the same galvanometer.

[0009] Furthermore, the step of “converting the coordinates of the cutting line marking points of all workpiece units within the same galvanometer marking range in the physical coordinate system into coordinates in the galvanometer coordinate system according to the galvanometer marking range” specifically includes:

[0010] According to the positional relationship between each workpiece unit within the marking range of the galvanometer and the marking center of the galvanometer in the X-axis direction, convert the X-axis coordinate of the cutting line marking point of the workpiece units within the same galvanometer marking range in the physical coordinate system into the X-axis coordinate in the galvanometer coordinate system:

[0011] According to the positional relationship between each workpiece unit within the marking range of the galvanometer and the marking center of the galvanometer in the Y-axis direction, convert the Y-axis coordinate of the cutting line marking point of the workpiece units within the same galvanometer marking range in the physical coordinate system into the Y-axis coordinate in the galvanometer coordinate system.

[0012] Further, the step of "According to the positional relationship between each workpiece unit within the marking range of the galvanometer and the marking center of the galvanometer in the X-axis direction, convert the X-axis coordinate of the cutting line marking point of the workpiece units within the same galvanometer marking range in the physical coordinate system into the X-axis coordinate in the galvanometer coordinate system" specifically includes:

[0013] A10. Obtain the number m of workpiece units that the galvanometer can process along the X-axis direction within the galvanometer marking range;

[0014] A20. Judge whether m / 2 is an integer. When m / 2 is not an integer, execute steps A30 - A40. When m / 2 is an integer, execute steps A50 - A60;

[0015] A30. Take the integer m1 of m / 2;

[0016] A40. Judge the magnitude relationship between i and m1,

[0017] When i < m1, the calculation formula for the X-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is: X

[0017] -|(m1 - i)*ΔD|;

[0018] When i = m1, the calculation formula for the X-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is: X n ;

[0019] When i > m1, the calculation formula for the X-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is: X n +|(m1 - i)*ΔD|;

[0020] A50. Take the integer m2 of m / 2;

[0021] A60. Judge the magnitude relationship between i and m2,

[0022] When i < m2, the calculation formula for the X-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is:

[0023] When i=m2, the calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is:

[0024] Among them, i is initialized to 0, and i is defined as the number of the current workpiece unit along the X-axis direction. n is the X-axis coordinate of the cutting line mark point of the i-th workpiece unit in the physical coordinate system, and ΔD is the distance between two adjacent workpiece units along the X-axis direction.

[0025] Furthermore, step A10 specifically includes:

[0026] Get the length M1 of the galvanometer along the X-axis within the galvanometer marking range;

[0027] Obtain the length Ca of a single workpiece unit along the X-axis direction;

[0028] Based on the length M1 of the galvanometer along the X-axis within the galvanometer marking range and the length Ca of a single workpiece unit along the X-axis, calculate the number m of workpiece units that the galvanometer can process along the X-axis within the galvanometer marking range:

[0029] Furthermore, the step of “converting the Y-axis coordinates of the cutting line marking points of the workpiece units within the marking range of the galvanometer into the Y-axis coordinates in the galvanometer coordinate system according to the positional relationship between each workpiece unit within the marking range of the galvanometer and the marking center of the galvanometer in the Y-axis direction” specifically includes:

[0030] B10, obtaining the number n of workpiece units that the galvanometer can process along the Y-axis direction within the galvanometer marking range;

[0031] B20. Determine whether n / 2 is an integer. If n / 2 is not an integer, execute steps B30 to B40. If n / 2 is an integer, jump to steps B50 to B60.

[0032] B30, take the integer n1 which is n / 2;

[0033] B40, judge the size of j and n1,

[0034] When j < n1, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: Y n -|(n1-j)*ΔH|;

[0035] When j=n1, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n ;

[0036] When j>n1, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n +|(n1-j)*ΔH|;

[0037] B50, take the integer n2 of n / 2;

[0038] B60, judge the size of j and n2,

[0039] When j < n2, the calculation formula for the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is:

[0040] When j=n2, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is:

[0041] Among them, initialize j = 0, define j as the number of the current workpiece unit along the Y axis direction, Y n is the Y-axis coordinate of the cutting line mark point of the j-th workpiece unit in the physical coordinate system, and ΔH is the distance between two adjacent workpiece units along the Y-axis direction.

[0042] Furthermore, step B10 specifically includes:

[0043] Get the width M2 of the galvanometer along the Y-axis within the galvanometer marking range;

[0044] Obtain the width Da of a single workpiece unit along the Y-axis direction;

[0045] According to the width M2 of the galvanometer along the Y-axis within the galvanometer marking range and the width Da of a single workpiece unit along the Y-axis, calculate the number n of workpiece units that the galvanometer can process along the Y-axis within the galvanometer marking range:

[0046] Furthermore, the step of “taking photos of each workpiece unit in sequence using a camera to obtain coordinate information of the cutting line marking point of each workpiece unit in the physical coordinate system” specifically includes the following steps:

[0047] Place the workpiece to be processed on the mobile platform;

[0048] Moving the mobile platform so that each workpiece unit of the workpiece to be processed on the mobile platform is sequentially located in the field of view of the camera;

[0049] The camera takes pictures of each workpiece unit in turn to obtain the coordinate information of the marking point of the cutting line of each workpiece unit in the camera coordinate system;

[0050] The coordinate information of the marking point of the cutting line of each workpiece unit in the camera coordinate system is converted into the coordinate information of the marking point of the cutting line of each workpiece unit in the physical coordinate system.

[0051] Furthermore, after the step of "processing all workpiece units within the marking range of the same galvanometer using the galvanometer", the following steps are also included:

[0052] When all workpiece units within the same galvanometer range are processed, the workpiece to be processed is moved so that the workpiece unit to be processed is located within the marking range of the galvanometer.

[0053] The present application also provides a laser processing device, comprising:

[0054] The camera is used to take pictures of each workpiece unit in turn to obtain the coordinate information of the cutting line mark point of each workpiece unit in the physical coordinate system;

[0055] a conversion module, configured to convert the coordinates of the cutting line marking points of all workpiece units within the marking range of the galvanometer into coordinates in the galvanometer coordinate system according to the marking range of the galvanometer, wherein the field of view of the camera is larger than the area of the workpiece unit, and the marking range of the galvanometer is larger than the field of view of the camera; and

[0056] The galvanometer is used to process all workpiece units within the marking range of the same galvanometer.

[0057] The present application also provides a computer device, comprising:

[0058] a processor configured to execute computer-executable instructions;

[0059] The memory stores one or more computer executable instructions, and when the computer executable instructions are executed by the processor, the various steps of the laser processing method described above are implemented.

[0060] The present application also provides a computer-readable storage medium on which a computer program is stored. The computer program is executed by a processor to implement the various steps of the laser processing method described above.

[0061] The beneficial effect of the laser processing method provided in the present application is that: by using a camera to obtain the coordinate information of the cutting line marking points of the workpiece unit, the laser processing accuracy can be effectively improved, and according to the marking range of the galvanometer, the coordinates of the cutting line marking points of all workpiece units located within the same galvanometer marking range in the physical coordinate system are converted into coordinates in the galvanometer coordinate system. The galvanometer processes all workpiece units located within the same galvanometer marking range, thereby realizing simultaneous processing of multiple workpiece units, which can effectively improve processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0063] Figure 1 A schematic flow chart of the laser processing method provided in an embodiment of the present application;

[0064] Figure 2 A schematic diagram of the structure of a workpiece to be processed provided in an embodiment of the present application;

[0065] Figure 3 for Figure 2 Schematic diagram of the workpiece unit, camera field of view, and galvanometer range;

[0066] Figure 4 This is a specific flow chart of step S200.

[0067] Among them, the reference numerals in the figures are:

[0068] 10. Workpiece to be processed; 11. Workpiece unit; 20. Marking range of the galvanometer; 30. Field of view of the camera. DETAILED DESCRIPTION

[0069] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0070] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0071] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0072] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0073] See also Figure 1 The laser processing method provided by the present application is now described. The laser processing method provided by the present application is used to process a plurality of workpiece units 11 on a workpiece 10 to be processed. Figure 2 As shown, in one embodiment of the present application, twenty-four workpiece units 11 can be processed on a workpiece 10 to be processed. The workpiece to be processed can be a circuit board to be processed.

[0074] The laser processing method provided in this application includes steps S100, S200, and S300.

[0075] S100: Use a camera to take pictures of each workpiece unit in sequence to obtain coordinate information of the cutting line mark point of each workpiece unit in the physical coordinate system.

[0076] Each workpiece unit has a cutting line. By using a camera to obtain the coordinate information of the cutting line marking point of the workpiece unit, it can effectively improve the laser processing accuracy. The "cutting line marking point" can be a marking point located on the cutting line or a marking point located near the cutting line.

[0077] S200. According to the marking range of the galvanometer, the coordinates of the cutting line marking points of all workpiece units located within the same galvanometer marking range in the physical coordinate system are converted into coordinates in the galvanometer coordinate system, wherein the field of view of the camera is larger than the area of the workpiece unit, and the marking range of the galvanometer is larger than the field of view of the camera.

[0078] In step S200, the coordinates of the cutting line marking points of all workpiece units within the same galvanometer marking range in the physical coordinate system are converted into coordinates in the galvanometer coordinate system, so that the positions of all workpiece units within the galvanometer marking range in the galvanometer coordinate system can be obtained, thereby facilitating subsequent galvanometer processing operations.

[0079] Among them, Figures 2 to 3As shown, because the camera's field of view 30 is larger than the area of the workpiece unit 11, the camera can capture a single workpiece unit at a time, thereby improving image capture accuracy and, in turn, machining accuracy. Because the galvanometer's marking range 20 is larger than the camera's field of view 30, i.e., the galvanometer's marking range is larger than the area of the workpiece unit, multiple workpiece units can be simultaneously located within the same galvanometer's marking range, enabling simultaneous machining of multiple workpiece units and improving machining efficiency.

[0080] S300, using the galvanometer to process all workpiece units within the marking range of the same galvanometer.

[0081] The laser processing method provided in the present application can effectively improve the laser processing accuracy by using a camera to obtain the coordinate information of the cutting line marking points of the workpiece unit, and according to the marking range of the galvanometer, the coordinates of the cutting line marking points of all workpiece units located within the same galvanometer marking range in the physical coordinate system are converted into coordinates in the galvanometer coordinate system. The galvanometer processes all workpiece units located within the same galvanometer marking range, thereby realizing simultaneous processing of multiple workpiece units and effectively improving processing efficiency.

[0082] See also Figure 4 Step S200, according to the marking range of the galvanometer, converts the coordinates of the cutting line marking points of all workpiece units located within the same galvanometer marking range in the physical coordinate system into coordinates in the galvanometer coordinate system, which may specifically include steps S210 and S220.

[0083] S210, according to the positional relationship between each workpiece unit within the galvanometer marking range and the marking center Z0 of the galvanometer in the X-axis direction, convert the X-axis coordinates of the cutting line marking points of the workpiece units within the same galvanometer marking range in the physical coordinate system into the X-axis coordinates in the galvanometer coordinate system.

[0084] S220. According to the positional relationship between each workpiece unit within the galvanometer marking range and the marking center Z0 of the galvanometer in the Y-axis direction, convert the Y-axis coordinates of the cutting line marking points of the workpiece units within the same galvanometer marking range in the physical coordinate system into the Y-axis coordinates in the galvanometer coordinate system.

[0085] Through the positional relationship between the workpiece unit and the marking center Z0 of the galvanometer in the X-axis direction and the Y-axis direction, the X-axis coordinate and Y-axis coordinate of the cutting line mark point of the workpiece unit in the physical coordinate system are converted into the X-axis coordinate and Y-axis coordinate in the galvanometer coordinate system, and then the position of the workpiece unit can be determined, which is convenient for subsequent galvanometer processing.

[0086] Step S210: According to the positional relationship between each workpiece unit within the galvanometer marking range and the marking center Z0 of the galvanometer in the X-axis direction, the X-axis coordinates of the cutting line marking points of the workpiece units within the same galvanometer marking range in the physical coordinate system are converted into X-axis coordinates in the galvanometer coordinate system. Specifically, steps S211, S212, S213, S214, S215, and S216 may be included.

[0087] S211 , obtaining the number m of workpiece units that can be processed by the galvanometer along the X-axis direction within the galvanometer marking range.

[0088] Through step S211, the number of workpiece units that can be processed along the X-axis direction within the galvanometer marking range can be obtained. It should be noted that m≥1, that is, there is at least one workpiece unit that can be processed along the X-axis direction within the galvanometer marking range. Figures 2 to 3 As shown, m is 2, indicating that two workpiece units can be processed along the X-axis direction within the galvanometer marking range 20.

[0089] Specifically, in one embodiment of the present application, S211 may specifically include steps S2111, S2112, and S2113.

[0090] S2111 , obtaining the length M1 of the galvanometer mirror along the X-axis direction within the galvanometer mirror marking range.

[0091] S2112. Obtain the length Ca of a single workpiece unit along the X-axis direction.

[0092] S2113. Calculate the number m of workpiece units that can be processed by the galvanometer along the X-axis direction within the galvanometer marking range based on the length M1 of the galvanometer along the X-axis direction and the length Ca of a single workpiece unit along the X-axis direction:

[0093] Through steps S2111, S2112, and S2113, the number of workpiece units that can be processed along the X-axis direction within the galvanometer marking range can be calculated.

[0094] S212. Determine whether m / 2 is an integer. When m / 2 is not an integer, execute steps S213 to S214. When m / 2 is an integer, execute steps S215 to S216.

[0095] In step S212, by judging whether m / 2 is an integer, it can be determined whether the number m of workpiece units that can be processed along the X-axis direction is odd or even. When m is odd, execute steps S213 to S214; when m is even, execute steps S215 to S216.

[0096] S213. Take an integer m1 which is m / 2.

[0097] In step S213, an integer m1 of m / 2 is taken, that is, m1 is an integer of m / 2. For example, when m is 1, the integer m1 is 0; when m is 3, the integer m1 is 1; when m is 5, the integer m1 is 2.

[0098] S214, judge the size of i and m1,

[0099] When i<m1, the calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n -|(m1-i)*ΔD|;

[0100] When i=m1, the calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n ;

[0101] When i>m1, the calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n +|(m1-i)*ΔD|.

[0102] S215. Take an integer m2 which is m / 2.

[0103] In step S215, an integer m2 of m / 2 is taken, that is, m2 is an integer of m / 2. For example, when m is 2, the integer m2 is 1; when m is 4, the integer m2 is 2; when m is 6, the integer m2 is 3.

[0104] S216, judge the size of i and m2,

[0105] When i < m2, the calculation formula for the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is:

[0106] When i=m2, the calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is:

[0107] Among them, i is initialized to 0, and i is defined as the number of the current workpiece unit along the X-axis direction. n is the X-axis coordinate of the cutting line mark point of the i-th workpiece unit in the physical coordinate system, and ΔD is the distance between two adjacent workpiece units along the X-axis direction.

[0108] In one embodiment of the present application, if the number m of workpiece units that can be processed along the X-axis direction within the galvanometer marking range is 3, since m / 2 is not an integer, steps S213 to S214 are executed as follows:

[0109] First, take an integer m1 which is m / 2, that is, m1=1.

[0110] Next, determine the size of i and m1.

[0111] When i=0, it indicates the first workpiece unit along the X-axis direction. Since i<m1, the workpiece unit is offset from the marking center Z0 of the galvanometer. The calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n -|(m1-i)*ΔD|, the X-axis coordinate of the current workpiece unit in the galvanometer coordinate system can be obtained as: X n -|ΔD|.

[0112] When i=1, it indicates the second workpiece unit along the X-axis direction. Since i=m1, the workpiece unit is located at the marking center Z0 of the galvanometer. The calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n , we can get the X-axis coordinate of the current workpiece unit in the galvanometer coordinate system: X n .

[0113] When i=2, it represents the third workpiece unit along the X-axis direction. Since i>m1, the workpiece unit is offset from the marking center Z0 of the galvanometer. The calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n +|(m1-i)*ΔD|, the X-axis coordinate of the current workpiece unit in the galvanometer coordinate system can be obtained as follows: n +|ΔD|.

[0114] like Figure 3 As shown, in another embodiment of the present application, if the number m of workpiece units that can be processed along the X-axis direction within the galvanometer marking range is 2, since m / 2 is an integer, steps S215 to S216 are executed as shown below:

[0115] First, take the integer part m2 of m / 2, that is, m2=1.

[0116] Next, determine the size of i and m2;

[0117] When i=0, it indicates the first workpiece unit along the X-axis direction. Since i<m2, the workpiece unit is located to the left of the marking center Z0 of the galvanometer. The calculation formula for the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: The X-axis coordinate of the current workpiece unit in the galvanometer coordinate system can be obtained as follows:

[0118] When i=1, it indicates the second workpiece unit along the X-axis direction. At this time, the current workpiece unit is located to the right of the marking center of the galvanometer. Since i=m2, the calculation formula for the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: The X-axis coordinate of the current workpiece unit in the galvanometer coordinate system can be obtained as follows:

[0119] Step S220, according to the positional relationship between each workpiece unit within the galvanometer marking range and the marking center of the galvanometer in the Y-axis direction, converting the Y-axis coordinates of the cutting line marking points of the workpiece units within the same galvanometer marking range in the physical coordinate system into the Y-axis coordinates in the galvanometer coordinate system. Specifically, the steps S221, S222, S223, S224, S225, and S226 may be included.

[0120] S221 , obtaining the number n of workpiece units that can be processed by the galvanometer along the Y-axis direction within the galvanometer marking range.

[0121] Through step S221, the number of workpiece units that can be processed along the Y-axis direction within the galvanometer marking range can be obtained. It should be noted that n ≥ 1, that is, there is at least one workpiece unit that can be processed along the Y-axis direction within the galvanometer marking range. Figures 2 to 3 As shown, n is 2, indicating that two workpiece units can be processed along the Y-axis direction within the galvanometer marking range 20.

[0122] Specifically, in one embodiment of the present application, S221 may specifically include steps S2211, S2212, and S2213.

[0123] S2211. Obtain the width M2 of the galvanometer along the Y-axis within the galvanometer marking range.

[0124] S2212. Obtain the width Da of a single workpiece unit along the Y-axis direction.

[0125] S2213. Calculate the number n of workpiece units that can be processed by the galvanometer along the Y-axis direction within the galvanometer marking range based on the width M2 of the galvanometer along the Y-axis direction and the width Da of a single workpiece unit along the Y-axis direction:

[0126] Through steps S2211, S2212, and S2213, the number of workpiece units that can be processed along the Y-axis direction within the galvanometer marking range can be calculated.

[0127] S222. Determine whether n / 2 is an integer. When n / 2 is not an integer, execute steps S223 to S224. When n / 2 is an integer, jump to steps S225 to S226.

[0128] In step S222, by judging whether n / 2 is an integer, it can be determined whether the number n of workpiece units that can be processed along the Y-axis direction is odd or even. When n is an odd number, execute steps S223 to S224; when n is an even number, execute steps S225 to S226.

[0129] S223. Take an integer n1 which is n / 2.

[0130] In step S223, an integer n1 of n / 2 is taken, that is, n1 is an integer of n / 2. For example, when n is 1, the integer n1 is 0; when n is 3, the integer n1 is 1; when n is 5, the integer n1 is 2.

[0131] S224, judge the size of j and n1,

[0132] When j < n1, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: Y n -|(n1-j)*ΔH|;

[0133] When j=n1, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n ;

[0134] When j>n1, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n +|(n1-j)*ΔH|.

[0135] S225. Take the integer n2 of n / 2.

[0136] In step S225, an integer n2 of n / 2 is taken, that is, n2 is an integer of n / 2. For example, when n is 2, the integer n2 is 1; when n is 4, the integer n2 is 2; when n is 6, the integer n2 is 3.

[0137] S226, judge the size of j and n2,

[0138] When j < n2, the calculation formula for the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is:

[0139] When j=n2, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is:

[0140] Among them, initialize j = 0, define j as the number of the current workpiece unit along the Y axis direction, Y n is the Y-axis coordinate of the cutting line mark point of the j-th workpiece unit in the physical coordinate system, and ΔH is the distance between two adjacent workpiece units along the Y-axis direction.

[0141] In one embodiment of the present application, if the number n of workpiece units that can be processed along the Y-axis direction within the galvanometer marking range is 3, since n / 2 is not an integer, steps S223 to S224 are executed as follows:

[0142] First, take an integer n1 which is n / 2, that is, n1=1.

[0143] Next, determine the size of j and n1.

[0144] When j=0, it indicates the first workpiece unit along the Y axis. Since j<n1, the workpiece unit is located above the marking center Z0 of the galvanometer. The calculation formula of the Y axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n -|(n1-j)*ΔH|, the Y-axis coordinate of the current workpiece unit in the galvanometer coordinate system can be obtained as: Y n -|ΔH|.

[0145] When j=1, it indicates the second workpiece unit along the Y axis. Since j=n1, the workpiece unit is located at the marking center Z0 of the galvanometer. The calculation formula of the Y axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n , we can get the Y-axis coordinate of the current workpiece unit in the galvanometer coordinate system: Y n .

[0146] When j=2, it represents the third workpiece unit along the Y-axis direction. Since j>n1, the workpiece unit is located below the marking center of the galvanometer. The calculation formula for the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: Y n +|(n1-j)*ΔH|, the Y-axis coordinate of the current workpiece unit in the galvanometer coordinate system can be obtained as: Y n +|-ΔH|.

[0147] like Figure 3 As shown, in another embodiment of the present application, if the number n of workpiece units that can be processed along the Y-axis direction within the galvanometer marking range is 2, since n / 2 is an integer, steps S225 to S226 are executed as shown below:

[0148] First, take the integer part n2 of n / 2, that is, n2=1.

[0149] Next, determine the size of j and n2;

[0150] When j=0, it indicates the first workpiece unit along the Y-axis direction. Since j<n2, the workpiece unit is located above the marking center of the galvanometer. The calculation formula for the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: The Y-axis coordinate of the current workpiece unit in the galvanometer coordinate system can be obtained as follows:

[0151] When j = 1, it indicates the second workpiece unit along the Y-axis direction. At this time, the current workpiece unit is located to the right of the marking center of the galvanometer. Since j = n2, the calculation formula for the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: The Y-axis coordinate of the current workpiece unit in the galvanometer coordinate system can be obtained as follows:

[0152] Step S100 may specifically include steps S110, S120, S130, and S140.

[0153] S110: placing the workpiece to be processed on the mobile platform.

[0154] S120 , moving the mobile platform so that each workpiece unit of the workpiece to be processed on the mobile platform is sequentially located in the field of view of the camera.

[0155] S130 , the camera takes pictures of each workpiece unit in sequence to obtain coordinate information of the marking point of the cutting line of each workpiece unit in the camera coordinate system.

[0156] S140 , converting the coordinate information of the marking point of the cutting line of each workpiece unit in the camera coordinate system into the coordinate information of the marking point of the cutting line of each workpiece unit in the physical coordinate system.

[0157] The workpiece unit is driven to move by the mobile platform, so that the workpiece unit can be moved to the position where the camera is located, making it convenient for the camera to take pictures of the workpiece unit.

[0158] Step S300 , using a galvanometer to process all workpiece units within a marking range of the same galvanometer, may then include step S400 .

[0159] S400: When all workpiece units within the same galvanometer range are processed, the workpiece to be processed is moved so that the workpiece units to be processed are located within the marking range of the galvanometer.

[0160] In step S400, when all workpiece units within the same galvanometer range are processed, the workpieces to be processed are moved so that another group of workpiece units to be processed are within the marking range of the galvanometer, and steps S200-S300 are repeated to complete the processing of all workpiece units.

[0161] The present application also provides a laser processing device, comprising:

[0162] The camera is used to take pictures of each workpiece unit in turn to obtain the coordinate information of the cutting line mark point of each workpiece unit in the physical coordinate system;

[0163] a conversion module, configured to convert the coordinates of the cutting line marking points of all workpiece units within the marking range of the galvanometer into coordinates in the galvanometer coordinate system according to the marking range of the galvanometer, wherein the field of view of the camera is larger than the area of the workpiece unit, and the marking range of the galvanometer is larger than the field of view of the camera; and

[0164] Galvanometer, used to process all workpiece units within the same galvanometer marking range

[0165] The present application also provides a computer device, comprising:

[0166] a processor configured to execute computer-executable instructions;

[0167] The memory stores one or more computer executable instructions. When the computer executable instructions are executed by the processor, each step of the laser processing method in any of the above embodiments is implemented.

[0168] The memory, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as the program instructions corresponding to the laser processing method in the embodiments of the present application. The processor implements the aforementioned laser processing method by executing the software programs, instructions, and modules stored in the memory.

[0169] The memory may primarily include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function; the data storage area may store data generated based on the use of the terminal. Furthermore, the memory may include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. Examples of the aforementioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0170] The present application also provides a computer-readable storage medium on which a computer program is stored. The computer program is executed by a processor to implement each step of the laser processing method in any of the above embodiments.

[0171] Through the above description of the implementation methods, those skilled in the art can clearly understand that the present invention can be implemented with the help of software and necessary general-purpose hardware, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as a computer floppy disk, read-only memory (ROM), random access memory (RAM), flash memory (FLASH), hard disk or optical disk, etc., including a number of instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute the methods described in each embodiment of the present invention.

[0172] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A laser processing method for processing a plurality of workpiece units on a workpiece to be processed, characterized in that: Including the steps: Using a camera to take pictures of each workpiece unit in sequence to obtain the coordinate information of the cutting line marking points of each workpiece unit in the physical coordinate system; According to the marking range of the galvanometer, convert the coordinates of the cutting line marking points of all workpiece units within the same galvanometer marking range in the physical coordinate system into coordinates in the galvanometer coordinate system, where the viewing range of the camera is larger than the area of the workpiece unit, and the marking range of the galvanometer is larger than the viewing range of the camera; Using the galvanometer to process all workpiece units within the same galvanometer marking range; The step "According to the marking range of the galvanometer, convert the coordinates of the cutting line marking points of all workpiece units within the same galvanometer marking range in the physical coordinate system into coordinates in the galvanometer coordinate system" specifically includes: According to the positional relationship between each workpiece unit within the galvanometer marking range and the marking center of the galvanometer in the X-axis direction, convert the X-axis coordinates of the cutting line marking points of the workpiece units within the same galvanometer marking range in the physical coordinate system into X-axis coordinates in the galvanometer coordinate system: According to the positional relationship between each workpiece unit within the galvanometer marking range and the marking center of the galvanometer in the Y-axis direction, convert the Y-axis coordinates of the cutting line marking points of the workpiece units within the same galvanometer marking range in the physical coordinate system into Y-axis coordinates in the galvanometer coordinate system; The step "According to the positional relationship between each workpiece unit within the galvanometer marking range and the marking center of the galvanometer in the X-axis direction, convert the X-axis coordinates of the cutting line marking points of the workpiece units within the same galvanometer marking range in the physical coordinate system into X-axis coordinates in the galvanometer coordinate system" specifically includes: A10. Obtain the number m of workpiece units that the galvanometer can process along the X-axis direction within the galvanometer marking range; A20. Judge whether m / 2 is an integer. When m / 2 is not an integer, execute steps A30 to A40. When m / 2 is an integer, execute steps A50 to A60; A30. Take the integer m1 of m / 2; A40. Judge the size of i and m1, When i < m1, the calculation formula for the X-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is: X n -|(m1 - i) * ΔD|; When i=m1, the calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n ; When i>m1, the calculation formula of the X-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n +|(m1-i)*ΔD|; A50. Take the integer m2 of m / 2; A60. Judge the size of i and m2, When i < m2, the calculation formula for the X-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is: When i = m2, the calculation formula for the X-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is: Among them, i is initialized to 0, and i is defined as the number of the current workpiece unit along the X-axis direction. n is the X-axis coordinate of the cutting line mark point of the i-th workpiece unit in the physical coordinate system, and ΔD is the distance between two adjacent workpiece units along the X-axis direction.

2. The laser processing method according to claim 1, wherein: Step A10 specifically includes: Obtain the length M1 of the galvanometer along the X-axis direction within the galvanometer marking range; Obtain the length Ca of a single workpiece unit along the X-axis direction; Based on the length M1 of the galvanometer along the X-axis within the galvanometer marking range and the length Ca of a single workpiece unit along the X-axis, calculate the number m of workpiece units that the galvanometer can process along the X-axis within the galvanometer marking range:

3. The laser processing method according to claim 1, wherein: The step "According to the positional relationship between each workpiece unit within the galvanometer marking range and the marking center of the galvanometer in the Y-axis direction, convert the Y-axis coordinates of the cutting line marking points of the workpiece units within the same galvanometer marking range in the physical coordinate system into Y-axis coordinates in the galvanometer coordinate system" specifically includes: B10. Obtain the number n of workpiece units that the galvanometer can process along the Y-axis direction within the galvanometer marking range; B20. Judge whether n / 2 is an integer. When n / 2 is not an integer, execute steps B30 to B40. When n / 2 is an integer, jump to steps B50 to B60; B30. Take the integer n1 of n / 2; B40. Determine the magnitude relationship between j and n1. When j < n1, the calculation formula for the Y-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is: Y n -|(n1 - j) * ΔH|; When j=n1, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n ; When j>n1, the calculation formula of the Y-axis coordinate of the cutting line mark point of the workpiece unit in the galvanometer coordinate system is: n +|(n1-j)*ΔH|; B50. Obtain the integer n2 of n / 2. B60. Determine the magnitude relationship between j and n2. When j < n2, the calculation formula for the Y-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is: When j = n2, the calculation formula for the Y-axis coordinate of the cutting line marking point of the workpiece unit in the galvanometer coordinate system is: Among them, initialize j = 0, define j as the number of the current workpiece unit along the Y axis direction, Y n is the Y-axis coordinate of the cutting line mark point of the j-th workpiece unit in the physical coordinate system, and ΔH is the distance between two adjacent workpiece units along the Y-axis direction.

4. The laser processing method according to claim 3, wherein: Step B10 specifically includes: Obtain the width M2 of the galvanometer along the Y-axis direction within the galvanometer marking range. Obtain the width Da of a single workpiece unit along the Y-axis direction. According to the width M2 of the galvanometer along the Y-axis within the galvanometer marking range and the width Da of a single workpiece unit along the Y-axis, calculate the number n of workpiece units that the galvanometer can process along the Y-axis within the galvanometer marking range:

5. The laser processing method according to any one of claims 1 to 4, characterized in that: The step "Use the camera to take pictures of each workpiece unit in sequence to obtain the coordinate information of the cutting line marking point of each workpiece unit in the physical coordinate system" specifically includes the steps: Place the workpiece to be processed on the moving platform. Move the moving platform so that each workpiece unit of the workpiece to be processed on the moving platform is sequentially located within the field of view of the camera. The camera takes pictures of each workpiece unit in sequence to obtain the coordinate information of the marking point of the cutting line of each workpiece unit in the camera coordinate system. Convert the coordinate information of the marking point of the cutting line of each workpiece unit in the camera coordinate system into the coordinate information of the cutting line marking point of each workpiece unit in the physical coordinate system.

6. The laser processing method according to any one of claims 1 to 4, characterized in that: After the step "Use the galvanometer to process all workpiece units within the same galvanometer marking range", the following steps are further included: When all workpiece units within the same galvanometer range are processed, move the workpiece to be processed so that the workpiece unit to be processed is located within the marking range of the galvanometer.

7. A laser processing device, characterized in that: The laser processing device applies the laser processing method described in any one of the above 1 to 6. The laser processing device includes: A camera for taking pictures of each workpiece unit in sequence to obtain the coordinate information of the cutting line marking point of each workpiece unit in the physical coordinate system. A conversion module for converting the coordinates of the cutting line marking points of all workpiece units within the same galvanometer marking range in the physical coordinate system into coordinates in the galvanometer coordinate system according to the marking range of the galvanometer. The field of view range of the camera is larger than the area of the workpiece unit, and the marking range of the galvanometer is larger than the field of view range of the camera; and A galvanometer for processing all workpiece units within the same galvanometer marking range.

8. A computer device, characterized in that: Includes: A processor configured to execute computer-executable instructions. A memory storing one or more computer-executable instructions, which when executed by the processor, implement each step of the laser processing method described in any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and the computer program is executed by the processor to implement each step of the laser processing method described in any one of claims 1 to 6.

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