Injection molding workshop monitoring system and monitoring method

Abstract

The present invention proposes an injection molding workshop monitoring system and a monitoring method, which comprises a temperature monitoring device, an indoor temperature regulating device and a control device which are arranged at a preset distance on a target monitoring component of each injection molding machine, wherein the temperature monitoring device comprises an infrared imaging unit and a temperature sensing unit, and the control device is configured to: periodically collect an infrared image of the target monitoring component and the ambient temperature at a preset distance on the surface of the target monitoring component, determine the surface temperature of the target monitoring component according to the infrared image, judge whether the surface temperature of the target monitoring component and the ambient temperature at the same time meet a preset heat conduction function relationship, and when the judgment is no, calculate the ambient temperature deviation value, and control the indoor temperature regulating device according to the ambient temperature deviation value to compensate for the ambient temperature in the injection molding workshop, so as to effectively monitor the heat source temperature in the injection molding workshop to realize the compensation for the ambient temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial manufacturing, and in particular to an injection molding workshop monitoring system and a monitoring method. Background Art

[0002] Among the manufacturing processes of various products, injection molding is one of the manufacturing processes that is greatly affected by environmental factors such as temperature, humidity and light in the injection molding workshop. Among them, ambient temperature is an important factor affecting the quality of injection molded products. During the injection molding production process, the temperature change in the injection molding workshop often has a great impact on the quality of the products produced. In the prior art, people often monitor the temperature in the injection molding workshop by installing temperature sensors in the injection molding workshop. However, since the injection molding machine needs to heat the injection molding material during the injection molding process, and the injection molding material needs to be cooled after being injected into the mold, it will also have different effects on the ambient temperature during these different injection molding stages, resulting in dynamic changes and uneven distribution of the temperature in the injection molding workshop. There may even be large temperature differences in different areas of the injection molding workshop. It is impossible to effectively monitor the temperature in the injection molding workshop by setting a limited number of temperature sensors with a single function. Summary of the invention

[0003] Based on the above problems, the present invention proposes an injection molding workshop monitoring system and a monitoring method, which can effectively monitor the heat source temperature in the injection molding workshop to compensate for the ambient temperature.

[0004] In view of this, a first aspect of the present invention proposes an injection molding workshop monitoring system, comprising a temperature monitoring device, an indoor temperature regulating device and a control device arranged at a preset distance on a target monitoring component of each injection molding machine, wherein the temperature monitoring device comprises an infrared imaging unit and a temperature sensing unit, and the control device is connected to the temperature monitoring device and the indoor temperature regulating device, and the control device is configured as follows:

[0005] Periodically collect infrared images of the target monitoring component and the ambient temperature T at a preset distance from the surface of the target monitoring component d ;

[0006] Determine the surface temperature T of the target monitoring component according to the infrared image s ;

[0007] Determine the surface temperature T of the target monitoring component at the same time s And the ambient temperature T d Whether it complies with the preset heat conduction function relationship;

[0008] If the judgment is no, calculate the ambient temperature deviation value ΔT d ;

[0009] According to the ambient temperature deviation value ΔT d The temperature regulating equipment in the control room compensates for the ambient temperature in the injection molding workshop.

[0010] Preferably, in the step of determining whether the surface temperature of the target monitoring component and the ambient temperature at the same time meet a preset heat conduction function relationship, the control device is configured as follows:

[0011] Obtaining a preset distance d between a temperature sensing unit and a surface of the target monitoring component;

[0012] Obtain the surface area S of the target monitoring component and the average distance from the center point of the target monitoring component to the surface of the target monitoring component

[0013] Obtain the heat ΔQ released per unit time by the target monitoring component s ;

[0014] Calculate the standard ambient temperature:

[0015]

[0016] Where T l is the real-time temperature at a position with a distance l from the surface of the target monitoring component, λ(T l ) is the air heat transfer coefficient at the corresponding position;

[0017] Calculate the ambient temperature deviation

[0018] Determine ΔT d Is it less than the preset error threshold?

[0019] Preferably, when obtaining the heat ΔQ released per unit time by the target monitoring component s In the step, the control device is configured to:

[0020] Determining the heating type of the target monitoring component;

[0021] When the target monitoring component is a self-heating component, determining whether the target monitoring component is in a constant temperature state;

[0022] When the target monitoring component is in a constant temperature state, the heating power P of the target monitoring component is obtained. s ;

[0023] Calculate the heat ΔQ released per unit time t of the target monitoring component s =P s ·t.

[0024] Preferably, when obtaining the heat ΔQ released per unit time by the target monitoring component s In the step, the control device is configured to:

[0025] Determining the heating type of the target monitoring component;

[0026] When the target monitoring component is a cooling component, obtaining the material specific heat capacity C and mass m of the target monitoring component;

[0027] Get the temperature drop ΔT of the target monitoring component per unit time t s ;

[0028] Calculate the heat ΔQ released per unit time t of the target monitoring component s =C·m·ΔT s .

[0029] Preferably, according to the ambient temperature deviation value ΔT d In the step of controlling the indoor temperature regulating device to compensate the ambient temperature in the injection molding workshop, the control device is configured as follows:

[0030] Obtain the number n of target monitoring components in the injection molding workshop and the ambient temperature deviation value ΔT of each target monitoring component di , where i is a positive integer between 1 and n;

[0031] Calculate the average ambient temperature compensation value

[0032] Control the indoor temperature adjustment device according to the average ambient temperature compensation value Compensate for the ambient temperature in the injection molding workshop.

[0033] A second aspect of the present invention provides a method for monitoring an injection molding workshop, comprising:

[0034] Periodically collect infrared images of the target monitoring component and the ambient temperature T at a preset distance from the surface of the target monitoring component d ;

[0035] Determine the surface temperature T of the target monitoring component according to the infrared image s ;

[0036] Determine the surface temperature T of the target monitoring component at the same time s And the ambient temperature T d Whether it complies with the preset heat conduction function relationship;

[0037] If the judgment is no, calculate the ambient temperature deviation value ΔT d ;

[0038] According to the ambient temperature deviation value ΔT d The temperature regulating equipment in the control room compensates for the ambient temperature in the injection molding workshop.

[0039] Preferably, the step of determining whether the surface temperature of the target monitoring component and the ambient temperature at the same time conform to a preset heat conduction function relationship specifically includes:

[0040] Obtaining a preset distance d between a temperature sensing unit and a surface of the target monitoring component;

[0041] Obtain the surface area S of the target monitoring component and the average distance from the center point of the target monitoring component to the surface of the target monitoring component

[0042] Obtain the heat ΔQ released per unit time by the target monitoring component s ;

[0043] Calculate the standard ambient temperature:

[0044]

[0045] Where T l is the real-time temperature at a position with a distance l from the surface of the target monitoring component, λ(T l ) is the air heat transfer coefficient at the corresponding position;

[0046] Calculate the ambient temperature deviation

[0047] Determine ΔT d Is it less than the preset error threshold?

[0048] Preferably, the heat ΔQ released per unit time by the target monitoring component is obtained s The steps specifically include:

[0049] Determining the heating type of the target monitoring component;

[0050] When the target monitoring component is a self-heating component, determining whether the target monitoring component is in a constant temperature state;

[0051] When the target monitoring component is in a constant temperature state, the heating power P of the target monitoring component is obtained. s ;

[0052] Calculate the heat ΔQ released per unit time t of the target monitoring component s =P s ·t.

[0053] Preferably, the heat ΔQ released per unit time by the target monitoring component is obtaineds The steps specifically include:

[0054] Determining the heating type of the target monitoring component;

[0055] When the target monitoring component is a cooling component, obtaining the material specific heat capacity C and mass m of the target monitoring component;

[0056] Get the temperature drop ΔT of the target monitoring component per unit time t s ;

[0057] Calculate the heat ΔQ released per unit time t of the target monitoring component s =C·m·ΔT s .

[0058] Preferably, according to the ambient temperature deviation value ΔT d The steps of controlling the indoor temperature regulating equipment to compensate the ambient temperature in the injection molding workshop specifically include:

[0059] Obtain the number n of target monitoring components in the injection molding workshop and the ambient temperature deviation value ΔT of each target monitoring component di , where i is a positive integer between 1 and n;

[0060] Calculate the average ambient temperature compensation value

[0061] Control the indoor temperature adjustment device according to the average ambient temperature compensation value Compensate for the ambient temperature in the injection molding workshop.

[0062] The present invention proposes an injection molding workshop monitoring system and a monitoring method, which comprises a temperature monitoring device, an indoor temperature regulating device and a control device which are arranged at a preset distance on a target monitoring component of each injection molding machine, wherein the temperature monitoring device comprises an infrared imaging unit and a temperature sensing unit, and the control device is connected to the temperature monitoring device and the indoor temperature regulating device, and the control device is configured to: periodically collect an infrared image of the target monitoring component and the ambient temperature at a preset distance on the surface of the target monitoring component, determine the surface temperature of the target monitoring component according to the infrared image, judge whether the surface temperature of the target monitoring component and the ambient temperature at the same time meet a preset heat conduction function relationship, and when the judgment is no, calculate the ambient temperature deviation value, and control the indoor temperature regulating device according to the ambient temperature deviation value to compensate for the ambient temperature in the injection molding workshop, so as to effectively monitor the heat source temperature in the injection molding workshop to realize the compensation for the ambient temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1is a schematic block diagram of an injection molding workshop monitoring system provided by one embodiment of the present invention;

[0064] Figure 2 The present invention is a flowchart of a method for monitoring an injection molding workshop provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0065] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0066] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0067] In the description of the present invention, the term "multiple" refers to two or more. Unless otherwise clearly defined, the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation of the present invention. The terms "connection", "installation", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, the meaning of "multiple" is two or more.

[0068] In the description of this specification, the description of the terms "one embodiment", "some implementations", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0069] An injection molding workshop monitoring system and a monitoring method provided by some embodiments of the present invention are described below with reference to the accompanying drawings.

[0070] like Figure 1 As shown, the first aspect of the present invention proposes an injection molding workshop monitoring system, including a temperature monitoring device, an indoor temperature adjustment device and a control device arranged at a preset distance at the target monitoring component of each injection molding machine, wherein the temperature monitoring device includes an infrared imaging unit and a temperature sensing unit, and the control device is connected to the temperature monitoring device and the indoor temperature adjustment device.

[0071] like Figure 2 As shown, the controller includes a processor and a memory, and the processor is configured to execute a computer program stored in the memory to implement the following method:

[0072] Periodically collect infrared images of the target monitoring component and the ambient temperature T at a preset distance from the surface of the target monitoring component d ;

[0073] Determine the surface temperature T of the target monitoring component according to the infrared image s ;

[0074] Determine the surface temperature T of the target monitoring component at the same time s And the ambient temperature T d Whether it complies with the preset heat conduction function relationship;

[0075] If the judgment is no, calculate the ambient temperature deviation value ΔT d ;

[0076] According to the ambient temperature deviation value ΔT d The temperature regulating equipment in the control room compensates for the ambient temperature in the injection molding workshop.

[0077] Specifically, the target monitoring component can be one or more of the positions of the barrel, mold or nozzle of the injection molding machine. The temperature monitoring device is installed at a preset distance from the surface of each target monitoring component. Since the thermal conductivity of air is small under standard atmospheric pressure, the air temperature will drop significantly from the surface of the target monitoring component with increasing distance until it is the same as the ambient temperature. Therefore, the preset distance is a smaller value. Depending on the highest surface temperature of the target monitoring component, the preset distance can be configured to a value between 0.5 cm and 5 cm.

[0078] The infrared imaging unit includes an optical component and an infrared detection component, the optical component includes a lens and a grating, etc., the infrared detection component includes an infrared sensor, the temperature monitoring device also includes an infrared signal processing unit and a processor, the infrared signal processing unit includes a signal amplification circuit and an analog-to-digital conversion circuit, and the temperature monitoring device obtains the infrared image of the surface of the target monitoring component at a close distance to measure the surface temperature of the target monitoring component. Specifically, the total energy of the infrared radiation emitted from the surface of the target monitoring component is proportional to the fourth power of the surface temperature of the target monitoring component. The temperature monitoring device receives the infrared radiation energy from the surface of the target monitoring component through the infrared sensor, converts the intensity of the infrared radiation energy into an infrared image corresponding to the surface of the target monitoring component through the signal amplification circuit, the analog-to-digital conversion circuit and the processor, and calculates the corresponding temperature value according to the numerical value on the infrared image. The temperature monitoring device also includes a temperature sensing unit connected to the processor for measuring the ambient temperature. Exemplarily, the temperature sensing unit can be a temperature sensor such as a thermistor.

[0079] The indoor temperature regulating device can be a device for regulating the indoor air temperature, such as an air conditioner, and the indoor temperature regulating device includes at least one air outlet. Preferably, the air outlet of the indoor temperature regulating device is arranged at a position corresponding to the top of each injection molding machine, so as to independently regulate the temperature at each injection molding machine.

[0080] The control device can be a single chip microcomputer or a computer device such as a dedicated server, a general server, a personal workstation, etc. The control device is connected to the temperature monitoring device and the indoor temperature regulating device, and is used to control the indoor temperature regulating device to regulate the indoor temperature of the injection molding workshop according to the surface temperature of the target monitoring component monitored by the temperature monitoring device and the ambient temperature.

[0081] In the technical solution of the above-mentioned embodiment, the temperature of the surface of the target monitoring component is obtained by the infrared imaging unit of the temperature monitoring device, and the ambient temperature at a preset distance from the surface of the target monitoring component is detected by the temperature sensing unit of the temperature monitoring device. Since the temperature attenuation amplitude from the surface of the target monitoring component to the preset distance will be different under different ambient temperatures, the temperature drop range corresponding to different target monitoring components under different temperature conditions can be pre-configured. The temperature drop range can be calculated by the heat conduction function, so that when the temperature sensing unit detects that the ambient temperature at a preset distance from the surface of the target monitoring component deviates from the temperature range calculated by the heat conduction function, the indoor temperature regulating device is controlled to compensate for the indoor temperature. Using the solution of the above-mentioned embodiment, the temperature monitoring device adopts a non-invasive design method to monitor the ambient temperature of the target monitoring component and the corresponding position in a non-contact manner, and the system deployment plan is simple. At the same time, the influence of the ambient temperature on the temperature of the target monitoring component can be accurately monitored, so that it can be effectively compensated.

[0082] Preferably, in the step of determining whether the surface temperature of the target monitoring component and the ambient temperature at the same time meet a preset heat conduction function relationship, the control device is configured as follows:

[0083] Obtaining a preset distance d between a temperature sensing unit and a surface of the target monitoring component;

[0084] Obtain the surface area S of the target monitoring component and the average distance from the center point of the target monitoring component to the surface of the target monitoring component

[0085] Obtain the heat ΔQ released per unit time by the target monitoring component s ;

[0086] Calculate the standard ambient temperature:

[0087]

[0088] Where T l is the real-time temperature at a position with a distance l from the surface of the target monitoring component, λ(T l ) is the air heat transfer coefficient at the corresponding position;

[0089] Calculate the ambient temperature deviation

[0090] Determine ΔT d Is it less than the preset error threshold?

[0091] Specifically, for different types of injection molding machines and their corresponding different target monitoring components, they are different in shape and size. For their surface area S and the average distance from the center point to the surface It can be measured in advance so that these data can be recorded in advance in the database of the control device. The injection molding workshop monitoring system also includes an air pressure monitoring device, a humidity monitoring device, an indoor air pressure regulating device and an indoor humidity regulating device. The control device is connected to the air pressure monitoring device, the humidity monitoring device, the indoor air pressure regulating device and the indoor humidity regulating device to control the air pressure and humidity in the injection molding workshop to remain within a preset range. For example, the air pressure in the injection molding workshop is maintained at a standard atmospheric pressure by the control device, and the air humidity in the injection molding workshop is maintained below 60%, thereby ensuring that the air heat conductivity coefficient in the injection molding workshop remains within a preset range.

[0092] Preferably, when obtaining the heat ΔQ released per unit time by the target monitoring component s In the step, the control device is configured to:

[0093] Determining the heating type of the target monitoring component;

[0094] When the target monitoring component is a self-heating component, determining whether the target monitoring component is in a constant temperature state;

[0095] When the target monitoring component is in a constant temperature state, the heating power P of the target monitoring component is obtained. s ;

[0096] Calculate the heat ΔQ released per unit time t of the target monitoring component s =P s ·t.

[0097] Specifically, for self-heating components such as barrels, when heating the material, it needs to go through a constant temperature stage, so the heat released per unit time t can be calculated by using its heating power under the constant temperature state. s .

[0098] Preferably, when obtaining the heat ΔQ released per unit time by the target monitoring component s In the step, the control device is configured to:

[0099] Determining the heating type of the target monitoring component;

[0100] When the target monitoring component is a cooling component, obtaining the material specific heat capacity C and mass m of the target monitoring component;

[0101] Get the temperature drop ΔT of the target monitoring component per unit time ts ;

[0102] Calculate the heat ΔQ released per unit time t of the target monitoring component s =C·m·ΔT s .

[0103] Specifically, for cooling components such as molds, after the injection molding material is injected, the weight m of the injection molding material can be calculated based on the size of the internal space of the mold and the density of the injection molding material. Combined with the specific heat capacity C of the corresponding injection molding material and the temperature change of the mold surface obtained by the infrared imaging unit, the heat ΔQ released per unit time t can be calculated. s Preferably, when the target monitoring component is a cooling component, the heat ΔQ released per unit time t by the target monitoring component is s The heat released by the target monitoring component during the natural cooling stage. In the non-natural cooling process, more complex environmental factors are involved. For example, in the process of cooling the mold with cryogenic liquid, the air around the target monitoring component may flow rapidly and irregularly due to the drastic temperature change, and a large amount of water vapor may be generated. As a result, the temperature after the heat is transferred from the surface of the target monitoring component to the preset distance d cannot be calculated according to the conventional heat conduction function, so the ambient temperature detected by the temperature sensing unit has no reference value.

[0104] Preferably, according to the ambient temperature deviation value ΔT d In the step of controlling the indoor temperature regulating device to compensate the ambient temperature in the injection molding workshop, the control device is configured as follows:

[0105] Obtain the number n of target monitoring components in the injection molding workshop and the ambient temperature deviation value ΔT of each target monitoring component di , where i is a positive integer between 1 and n;

[0106] Calculate the average ambient temperature compensation value

[0107] Control the indoor temperature adjustment device according to the average ambient temperature compensation value Compensate for the ambient temperature in the injection molding workshop.

[0108] Continue to see Figure 2 The second aspect of the present invention provides a method for monitoring an injection molding workshop, comprising:

[0109] Periodically collect infrared images of the target monitoring component and the ambient temperature T at a preset distance from the surface of the target monitoring component d ;

[0110] Determine the surface temperature T of the target monitoring component according to the infrared image s ;

[0111] Determine the surface temperature T of the target monitoring component at the same time s And the ambient temperature T d Whether it complies with the preset heat conduction function relationship;

[0112] If the judgment is no, calculate the ambient temperature deviation value ΔT d ;

[0113] According to the ambient temperature deviation value ΔT d The temperature regulating equipment in the control room compensates for the ambient temperature in the injection molding workshop.

[0114] Specifically, the target monitoring component can be one or more of the positions of the barrel, mold or nozzle of the injection molding machine. The temperature monitoring device is installed at a preset distance from the surface of each target monitoring component. Since the thermal conductivity of air is small under standard atmospheric pressure, the air temperature will drop significantly from the surface of the target monitoring component with increasing distance until it is the same as the ambient temperature. Therefore, the preset distance is a smaller value. Depending on the highest surface temperature of the target monitoring component, the preset distance can be configured to a value between 0.5 cm and 5 cm.

[0115] The infrared imaging unit includes an optical component and an infrared detection component, the optical component includes a lens and a grating, etc., the infrared detection component includes an infrared sensor, the temperature monitoring device also includes an infrared signal processing unit and a processor, the infrared signal processing unit includes a signal amplification circuit and an analog-to-digital conversion circuit, and the temperature monitoring device obtains the infrared image of the surface of the target monitoring component at a close distance to measure the surface temperature of the target monitoring component. Specifically, the total energy of the infrared radiation emitted from the surface of the target monitoring component is proportional to the fourth power of the surface temperature of the target monitoring component. The temperature monitoring device receives the infrared radiation energy from the surface of the target monitoring component through the infrared sensor, converts the intensity of the infrared radiation energy into an infrared image corresponding to the surface of the target monitoring component through the signal amplification circuit, the analog-to-digital conversion circuit and the processor, and calculates the corresponding temperature value according to the numerical value on the infrared image. The temperature monitoring device also includes a temperature sensing unit connected to the processor for measuring the ambient temperature. Exemplarily, the temperature sensing unit can be a temperature sensor such as a thermistor.

[0116] The indoor temperature regulating device can be a device for regulating the indoor air temperature, such as an air conditioner, and the indoor temperature regulating device includes at least one air outlet. Preferably, the air outlet of the indoor temperature regulating device is arranged at a position corresponding to the top of each injection molding machine, so as to independently regulate the temperature at each injection molding machine.

[0117] The control device can be a single chip microcomputer or a computer device such as a dedicated server, a general server, a personal workstation, etc. The control device is connected to the temperature monitoring device and the indoor temperature regulating device, and is used to control the indoor temperature regulating device to regulate the indoor temperature of the injection molding workshop according to the surface temperature of the target monitoring component monitored by the temperature monitoring device and the ambient temperature.

[0118] In the technical solution of the above-mentioned embodiment, the temperature of the surface of the target monitoring component is obtained by the infrared imaging unit of the temperature monitoring device, and the ambient temperature at a preset distance from the surface of the target monitoring component is detected by the temperature sensing unit of the temperature monitoring device. Since the temperature attenuation amplitude from the surface of the target monitoring component to the preset distance will be different under different ambient temperatures, the temperature drop range corresponding to different target monitoring components under different temperature conditions can be pre-configured. The temperature drop range can be calculated by the heat conduction function, so that when the temperature sensing unit detects that the ambient temperature at a preset distance from the surface of the target monitoring component deviates from the temperature range calculated by the heat conduction function, the indoor temperature regulating device is controlled to compensate for the indoor temperature. Using the solution of the above-mentioned embodiment, the temperature monitoring device adopts a non-invasive design method to monitor the ambient temperature of the target monitoring component and the corresponding position in a non-contact manner, and the system deployment plan is simple. At the same time, the influence of the ambient temperature on the temperature of the target monitoring component can be accurately monitored, so that it can be effectively compensated.

[0119] Preferably, the step of determining whether the surface temperature of the target monitoring component and the ambient temperature at the same time conform to a preset heat conduction function relationship specifically includes:

[0120] Obtaining a preset distance d between a temperature sensing unit and a surface of the target monitoring component;

[0121] Obtain the surface area S of the target monitoring component and the average distance from the center point of the target monitoring component to the surface of the target monitoring component

[0122] Obtain the heat ΔQ released per unit time by the target monitoring component s ;

[0123] Calculate the standard ambient temperature:

[0124]

[0125] Where T l is the real-time temperature at a position with a distance l from the surface of the target monitoring component, λ(T l ) is the air heat transfer coefficient at the corresponding position;

[0126] Calculate the ambient temperature deviation

[0127] Determine ΔT d Is it less than the preset error threshold?

[0128] Specifically, for different types of injection molding machines and their corresponding different target monitoring components, they are different in shape and size. For their surface area S and the average distance from the center point to the surface It can be measured in advance so that these data can be recorded in advance in the database of the control device. The injection molding workshop monitoring system also includes an air pressure monitoring device, a humidity monitoring device, an indoor air pressure regulating device and an indoor humidity regulating device. The control device is connected to the air pressure monitoring device, the humidity monitoring device, the indoor air pressure regulating device and the indoor humidity regulating device to control the air pressure and humidity in the injection molding workshop to remain within a preset range. For example, the air pressure in the injection molding workshop is maintained at a standard atmospheric pressure by the control device, and the air humidity in the injection molding workshop is maintained below 60%, thereby ensuring that the air heat conductivity coefficient in the injection molding workshop remains within a preset range.

[0129] Preferably, the heat ΔQ released per unit time by the target monitoring component is obtained s The steps specifically include:

[0130] Determining the heating type of the target monitoring component;

[0131] When the target monitoring component is a self-heating component, determining whether the target monitoring component is in a constant temperature state;

[0132] When the target monitoring component is in a constant temperature state, the heating power P of the target monitoring component is obtained. s ;

[0133] Calculate the heat ΔQ released per unit time t of the target monitoring component s =P s ·t.

[0134] Specifically, for self-heating components such as barrels, when heating the material, it needs to go through a constant temperature stage, so the heat released per unit time t can be calculated by using its heating power under the constant temperature state. s .

[0135] Preferably, the heat ΔQ released per unit time by the target monitoring component is obtained s The steps specifically include:

[0136] Determining the heating type of the target monitoring component;

[0137] When the target monitoring component is a cooling component, obtaining the material specific heat capacity C and mass m of the target monitoring component;

[0138] Get the temperature drop ΔT of the target monitoring component per unit time t s ;

[0139] Calculate the heat ΔQ released per unit time t of the target monitoring component s =C·m·ΔT s .

[0140] Specifically, for cooling components such as molds, after the injection molding material is injected, the weight m of the injection molding material can be calculated based on the size of the internal space of the mold and the density of the injection molding material. Combined with the specific heat capacity C of the corresponding injection molding material and the temperature change of the mold surface obtained by the infrared imaging unit, the heat ΔQ released per unit time t can be calculated. s Preferably, when the target monitoring component is a cooling component, the heat ΔQ released per unit time t by the target monitoring component is s The heat released by the target monitoring component during the natural cooling stage. In the non-natural cooling process, more complex environmental factors are involved. For example, in the process of cooling the mold with cryogenic liquid, the air around the target monitoring component may flow rapidly and irregularly due to the drastic temperature change, and a large amount of water vapor may be generated. As a result, the temperature after the heat is transferred from the surface of the target monitoring component to the preset distance d cannot be calculated according to the conventional heat conduction function, so the ambient temperature detected by the temperature sensing unit has no reference value.

[0141] Preferably, according to the ambient temperature deviation value ΔT d The steps of controlling the indoor temperature regulating equipment to compensate the ambient temperature in the injection molding workshop specifically include:

[0142] Obtain the number n of target monitoring components in the injection molding workshop and the ambient temperature deviation value ΔT of each target monitoring component di , where i is a positive integer between 1 and n;

[0143] Calculate the average ambient temperature compensation value

[0144] Control the indoor temperature adjustment device according to the average ambient temperature compensation value Compensate for the ambient temperature in the injection molding workshop.

[0145] The present invention proposes an injection molding workshop monitoring system and a monitoring method, which comprises a temperature monitoring device, an indoor temperature regulating device and a control device which are arranged at a preset distance on a target monitoring component of each injection molding machine, wherein the temperature monitoring device comprises an infrared imaging unit and a temperature sensing unit, and the control device is connected to the temperature monitoring device and the indoor temperature regulating device, and the control device is configured to: periodically collect an infrared image of the target monitoring component and the ambient temperature at a preset distance on the surface of the target monitoring component, determine the surface temperature of the target monitoring component according to the infrared image, judge whether the surface temperature of the target monitoring component and the ambient temperature at the same time meet a preset heat conduction function relationship, and when the judgment is no, calculate the ambient temperature deviation value, and control the indoor temperature regulating device according to the ambient temperature deviation value to compensate for the ambient temperature in the injection molding workshop, so as to effectively monitor the heat source temperature in the injection molding workshop to realize the compensation for the ambient temperature.

[0146] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0147] According to the embodiments of the present invention as described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and the modified use based on the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An injection molding workshop monitoring system, characterized in that: The system comprises a temperature monitoring device, an indoor temperature regulating device and a control device which are arranged at a preset distance on each target monitoring component of the injection molding machine. The temperature monitoring device comprises an infrared imaging unit and a temperature sensing unit. The control device is connected to the temperature monitoring device and the indoor temperature regulating device. The control device is configured as follows: Periodically collect infrared images of the target monitoring component and the ambient temperature at a preset distance from the surface of the target monitoring component , the preset distance is 0.5 cm to 5 cm; Determine the surface temperature of the target monitoring component according to the infrared image ; Determine the surface temperature of the target monitoring component at the same time And the ambient temperature Whether it complies with the preset heat conduction function relationship; If the judgment is no, calculate the ambient temperature deviation value ; According to the ambient temperature deviation value The control room temperature regulating device compensates the ambient temperature in the injection molding workshop; In the step of determining whether the surface temperature of the target monitoring component and the ambient temperature at the same time meet a preset heat conduction function relationship, the control device is configured as follows: Obtaining a preset distance between the temperature sensing unit and the surface of the target monitoring component ; Obtaining the surface area of ​​the target monitoring component and the average distance from the center point of the target monitoring component to the surface of the target monitoring component ; Obtain the heat released per unit time by the target monitoring component ; Calculate the standard ambient temperature: in The distance from the surface of the target monitoring component is The real-time temperature at the location, is the air heat transfer coefficient at the corresponding position; Calculate the ambient temperature deviation ; judge Is it less than the preset error threshold? 2. The injection molding workshop monitoring system according to claim 1, characterized in that: The heat released per unit time by the target monitoring component is obtained. In the step, the control device is configured to: Determining the heating type of the target monitoring component; When the target monitoring component is a self-heating component, determining whether the target monitoring component is in a constant temperature state; When the target monitoring component is in a constant temperature state, the heating power of the target monitoring component is obtained. ; Calculate the target monitoring component unit time Heat released .

3. The injection molding workshop monitoring system according to claim 1, characterized in that: The heat released per unit time by the target monitoring component is obtained. In the step, the control device is configured to: Determining the heating type of the target monitoring component; When the target monitoring component is a cooling component, obtain the material specific heat capacity of the target monitoring component And quality ; Get the target monitoring component unit time The temperature drop ; Calculate the target monitoring component unit time Heat released .

4. The injection molding workshop monitoring system according to any one of claims 1 to 3, characterized in that: According to the ambient temperature deviation value In the step of controlling the indoor temperature regulating device to compensate the ambient temperature in the injection molding workshop, the control device is configured as follows: Get the number of target monitoring components in the injection molding workshop and the ambient temperature deviation value of each target monitoring component ,in 1 to A positive integer between ; Calculate the average ambient temperature compensation value ; Control the indoor temperature adjustment device according to the average ambient temperature compensation value Compensate for the ambient temperature in the injection molding workshop.

5. A method for monitoring an injection molding workshop, characterized in that: include: Periodically collect infrared images of the target monitoring component and the ambient temperature at a preset distance from the surface of the target monitoring component , the preset distance is 0.5 cm to 5 cm; Determine the surface temperature of the target monitoring component according to the infrared image ; Determine the surface temperature of the target monitoring component at the same time And the ambient temperature Whether it complies with the preset heat conduction function relationship; If the judgment is no, calculate the ambient temperature deviation value ; According to the ambient temperature deviation value The control room temperature regulating device compensates the ambient temperature in the injection molding workshop; The step of determining whether the surface temperature of the target monitoring component and the ambient temperature at the same time meet the preset heat conduction function relationship specifically includes: Obtaining a preset distance between the temperature sensing unit and the surface of the target monitoring component ; Obtaining the surface area of ​​the target monitoring component and the average distance from the center point of the target monitoring component to the surface of the target monitoring component ; Obtain the heat released per unit time by the target monitoring component ; Calculate the standard ambient temperature: in The distance from the surface of the target monitoring component is The real-time temperature at the location, is the air heat transfer coefficient at the corresponding position; Calculate the ambient temperature deviation ; judge Is it less than the preset error threshold? 6. The method for monitoring an injection molding workshop according to claim 5, characterized in that: Obtain the heat released per unit time by the target monitoring component The steps specifically include: Determining the heating type of the target monitoring component; When the target monitoring component is a self-heating component, determining whether the target monitoring component is in a constant temperature state; When the target monitoring component is in a constant temperature state, the heating power of the target monitoring component is obtained. ; Calculate the target monitoring component unit time Heat released .

7. The method for monitoring an injection molding workshop according to claim 5, characterized in that: Obtain the heat released per unit time by the target monitoring component The steps specifically include: Determining the heating type of the target monitoring component; When the target monitoring component is a cooling component, obtain the material specific heat capacity of the target monitoring component And quality ; Get the target monitoring component unit time The temperature drop ; Calculate the target monitoring component unit time Heat released .

8. The method for monitoring an injection molding workshop according to any one of claims 5 to 7, characterized in that: According to the ambient temperature deviation value The steps of controlling the indoor temperature regulating device to compensate the ambient temperature in the injection molding workshop specifically include: Get the number of target monitoring components in the injection molding workshop and the ambient temperature deviation value of each target monitoring component ,in 1 to A positive integer between ; Calculate the average ambient temperature compensation value ; Control the indoor temperature adjustment device according to the average ambient temperature compensation value Compensate for the ambient temperature in the injection molding workshop.

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