A subsurface multi-parameter nanometer standard sample and a preparation method thereof

Abstract

The present application relates to a kind of subsurface multi-parameter nanometer standard sample plate and its preparation method, including X tracking mark for locating and looking for calibration position, Y tracking mark and alignment mark, Z step calibration area for calibration, one-dimensional grid calibration area and two-dimensional grid calibration area, when using a kind of subsurface multi-parameter nanometer standard sample plate of the present application to carry out instrument calibration, current position can be quickly distinguished and positioned to the region to be measured by tracking mark and alignment mark, it can be used for the calibration and traceability of subsurface measuring instrument such as confocal microscope, white light interference microscope, ultrasonic atomic force microscope, provide guarantee for the accuracy of value in subsurface geometric parameter measurement, help the development of strategic emerging industries such as semiconductor, precision manufacturing, national defense and military industry, with high industrial utilization value.

Description

TECHNICAL FIELD

[0001] The present application relates to a kind of subsurface multi-parameter nano standard sample plate and its preparation method, belong to metrological detection technical field. BACKGROUND

[0002] The development of high-power laser system and large optical system puts forward more stringent requirements on the stability of optical elements, imaging quality, coating quality and laser damage threshold and other performance indicators, and the subsurface damage of element can greatly reduce these performance indicators. Therefore, it is particularly important to detect the subsurface damage of the element. Common subsurface detection methods include destructive detection methods such as cross-section microscopy, angle polishing method, HF chemical etching method, and non-destructive detection methods such as fluorescence microscopy, polarized laser scattering method, confocal laser scanning microscopy. The destructive detection method will cause irreversible damage to the material, and the sample preparation is troublesome, time-consuming and low in precision; non-destructive detection methods use acoustic, optical and other imaging technologies, and have the characteristics of fast, non-destructive, high precision, etc., so they are widely used in subsurface damage measurement.

[0003] However, in the current non-destructive detection method of subsurface, there are problems such as the accuracy of the value cannot be guaranteed, and the value is difficult to trace. Ordinary optical surface topography measuring instrument generally uses conventional standard sample plate for calibration and value traceability. This kind of standard sample plate uses micro-nano processing technology to etch various nano structures, and is calibrated by authoritative metrological institutions, so as to ensure the accuracy and traceability of its value. For subsurface measuring instrument, its measurement principle and method are currently in the research and exploration stage. Due to the difference between subsurface measurement and surface measurement, the accuracy of calibration using conventional standard sample plate cannot be guaranteed. Therefore, the research on standard sample plate for calibration of subsurface measuring instrument is of great significance to ensure the accuracy and traceability of subsurface measurement results. Related research can further promote the research and development of subsurface measuring instrument. SUMMARY

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a subsurface multi-parameter nano standard sample plate and its preparation method, which is convenient for calibrating subsurface optical topography measuring instrument.

[0005] To achieve the above-mentioned purpose, the present application provides a kind of subsurface multi-parameter nano standard sample plate, including base plate, the middle part of base plate is equipped with Z direction step calibration area, Z direction step calibration area includes a plurality of strip-shaped calibration steps arranged in a row along X direction, each strip-shaped calibration step extends along Y direction;

[0006] The base plate is further provided with X-direction tracking marks and Y-direction tracking marks, the X-direction tracking marks pointing to the center of the Z-direction step calibration area along the X direction, and the Y-direction tracking marks pointing to the center of the Z-direction step calibration area along the Y direction; the Z-direction step calibration area is further provided with an alignment mark, which points to the center of the Z-direction step calibration area along the X direction;

[0007] The base plate is further provided with a one-dimensional grid calibration area and a two-dimensional grid calibration area, the one-dimensional grid calibration area is provided with a plurality of strip-shaped grids arranged in a row along the X direction, and the two-dimensional grid calibration area is provided with a grid array arranged in a row along the X direction and in a column along the Y direction.

[0008] Preferably, the X-direction tracking marks, Y-direction tracking marks and alignment mark are all triangular arrow shapes, and the arrows all point to the center of the Z-direction step calibration area.

[0009] Preferably, the X-direction tracking marks, Y-direction tracking marks and alignment mark are all different in size.

[0010] More preferably, the Y-direction tracking marks are larger in size than the X-direction tracking marks, and the X-direction tracking marks are larger in size than the alignment mark.

[0011] Preferably, a plurality of pairs of strip-shaped calibration steps with different widths are symmetrically arranged on both sides of the center line of the Z-direction step calibration area.

[0012] More preferably, the strip-shaped calibration steps close to the center line of the Z-direction step calibration area are larger in width, and the strip-shaped calibration steps away from the center line of the Z-direction step calibration area are smaller in width.

[0013] Preferably, the one-dimensional grid calibration area and the two-dimensional grid calibration area are respectively located on both sides of the Z-direction step calibration area.

[0014] Preferably, the base plate is provided with two one-dimensional grid calibration areas and two two-dimensional grid calibration areas, and each one-dimensional grid calibration area and two-dimensional grid calibration area is located at a corner of the base plate.

[0015] More preferably, the grid sizes in the same one-dimensional grid calibration area or two-dimensional grid calibration area are the same, and the grid sizes in different one-dimensional grid calibration areas or two-dimensional grid calibration areas are different.

[0016] The application further provides a preparation method of a sub-surface multi-parameter nano standard sample plate, which is used for preparing the sub-surface multi-parameter nano standard sample plate according to the above technical solution or any preferred technical solution thereof, and comprises the following steps:

[0017] 1) Oxidation treatment is performed on the front surface of the silicon material substrate plate to generate a silicon dioxide layer;

[0018] 2) A silicon nitride layer is deposited on the silicon dioxide layer;

[0019] 3) A photoresist layer is spin-coated on the silicon nitride layer;

[0020] 4) Photolithography is performed on the photoresist layer using a photoetching machine to etch track marks, steps, and grid patterns;

[0021] 5) The silicon nitride layer and the silicon dioxide layer are etched and peeled off to form track marks, steps, and grid nanostructures;

[0022] 6) The photoresist is removed, and a gold film layer is evaporated on the front surface of the substrate plate after etching;

[0023] 7) A silicon dioxide layer is evaporated on the surface of the gold film layer, and chemical mechanical polishing is performed on the surface of the evaporated silicon dioxide layer to obtain a smooth surface, and the preparation of the sample plate is completed.

[0024] As described above, the sub-surface multi-parameter nano standard sample plate and the preparation method thereof have the following beneficial effects: the sub-surface multi-parameter nano standard sample plate includes X-direction track marks, Y-direction track marks, and alignment marks for positioning and finding a calibration position, a Z-direction step calibration area, a one-dimensional grid calibration area, and a two-dimensional grid calibration area for calibration. When the instrument is calibrated using the sub-surface multi-parameter nano standard sample plate, the current position can be quickly distinguished and positioned to the to-be-measured area with the aid of the track marks and the alignment marks. The standard sample plate contains various geometric parameters, the Z-direction step calibration area can calibrate the longitudinal (Z-direction) characteristics of the instrument, the one-dimensional grid calibration area and the two-dimensional grid calibration area can calibrate the transverse (X, Y plane direction) characteristics of the instrument. In addition, the two-dimensional grid calibration area can also calibrate the orthogonality of the transverse two-dimensional coordinate system of the instrument. The standard sample plate is prepared by using a semiconductor process, the height and width dimensions of the structure can be accurately controlled, batch production is facilitated, and the production cost of a single standard sample plate is significantly reduced. By evaporating a gold film layer on the silicon nitride layer, the reflectivity of the sub-surface of the sample plate is improved, and the light return efficiency of the calibration instrument is improved. By evaporating a silicon dioxide layer on the surface of the gold film layer, the track marks, steps, and grid nanostructures in the standard sample plate are protected, and the actual surface state of the measured object in the sub-surface measurement is truly simulated. Therefore, the sub-surface multi-parameter nano standard sample plate can be quickly and conveniently used for calibration of a sub-surface optical topography measuring instrument, and the calibration accuracy is high. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 The figure shows a topological structure schematic diagram of the sub-surface multi-parameter nano standard sample plate.

[0026] Figure 2 A cross-sectional structural diagram of a subsurface multi-parameter nanometer standard sample plate is shown.

[0027] Figures 3a to 3j A cross-sectional structural diagram of a subsurface multi-parameter nanometer standard sample plate is shown.

[0028] Element number explanation

[0029] 1 substrate plate

[0030] 2 Z-direction step calibration area

[0031] 3 strip-shaped calibration step

[0032] 4 X-direction tracking mark

[0033] 5 Y-direction tracking mark

[0034] 6 alignment mark

[0035] 7a one-dimensional grid calibration area

[0036] 7b one-dimensional grid calibration area

[0037] 8a two-dimensional grid calibration area

[0038] 8b two-dimensional grid calibration area

[0039] 9 silicon dioxide layer

[0040] 10 silicon nitride layer

[0041] 11 photoresist layer

[0042] 12 gold film layer

[0043] 13 evaporated silicon dioxide layer DETAILED DESCRIPTION

[0044] The embodiments of the present application will be described in conjunction with specific examples which set forth the best modes contemplated for carrying out the application. These examples are intended to illustrate the present application and should not be construed as limiting the scope of the present application.

[0045] It is to be understood that the structures, proportions, sizes, etc. shown in the drawings attached to the present specification are merely used to cooperate with the content disclosed in the present specification, to be understood and read by those skilled in the art, and are not used to limit the defined conditions under which the present application can be implemented, and therefore do not have technical significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are merely for the convenience of clear description, and are not used to limit the scope of the present application, and the change or adjustment of the relative relationship, without substantially changing the technical content, is also considered as the scope of the present application.

[0046] As shown in Figure 1 The present application provides a sub-surface multi-parameter nano standard sample plate, comprising a base plate 1, a Z-direction step calibration area 2 is arranged at the middle part of the base plate 1, the Z-direction step calibration area 2 comprises a plurality of strip-shaped calibration steps 3 arranged in a row along the X-direction, and each strip-shaped calibration step 3 extends along the Y-direction.

[0047] The base plate 1 is further provided with an X-direction tracking mark 4 and a Y-direction tracking mark 5, the X-direction tracking mark 4 points to the center of the Z-direction step calibration area 2 along the X-direction, and the Y-direction tracking mark 5 points to the center of the Z-direction step calibration area 2 along the Y-direction; the Z-direction step calibration area 2 is further provided with an alignment mark 6, and the alignment mark 6 points to the center of the Z-direction step calibration area 2 along the X-direction.

[0048] The base plate 1 is further provided with one-dimensional grid calibration areas 7a, 7b and two-dimensional grid calibration areas 8a, 8b, a plurality of strip-shaped grids arranged in a row along the X-direction are arranged in the one-dimensional grid calibration areas 7a, 7b; and a grid array arranged in a row along the X-direction and in a column along the Y-direction is arranged in the two-dimensional grid calibration areas 8a, 8b.

[0049] The sub-surface multi-parameter nano standard sample plate of the present application comprises X-direction tracking marks 4, Y-direction tracking marks 5 and alignment marks 6 for locating and searching for a calibration position, a Z-direction step calibration area 2, one-dimensional grid calibration areas 7a and 7b and two-dimensional grid calibration areas 8a and 8b for calibration. When the instrument is calibrated by using the sub-surface multi-parameter nano standard sample plate of the present application, the current position can be quickly determined and the to-be-measured area can be located by means of the tracking marks and the alignment marks 6. The standard sample plate contains various geometric parameters. The Z-direction step calibration area 2 can be used for calibration of the longitudinal (Z-direction) characteristics of the instrument. The one-dimensional grid calibration areas 7a and 7b and the two-dimensional grid calibration areas 8a and 8b can be used for calibration of the transverse (X and Y plane directions) characteristics of the instrument. In addition, the two-dimensional grid calibration areas 8a and 8b can also be used for calibration of the orthogonality of the transverse two-dimensional coordinate system of the instrument. The standard sample plate is prepared by using a semiconductor process. The height and width dimensions of the structure can be accurately controlled, batch production is facilitated, and the production cost of a single standard sample plate is significantly reduced. By evaporating a gold film layer 12 on the silicon nitride layer 10, the reflectivity of the sub-surface of the sample plate is improved, the light returning efficiency of the calibration instrument is improved, and by evaporating a silicon dioxide layer 13 on the surface of the gold film layer 12, the tracking marks, steps and grid nano structures in the standard sample plate are protected, and the actual surface state of the measured object in the sub-surface measurement is truly simulated. It can be seen that the sub-surface multi-parameter nano standard sample plate of the present application can be quickly and conveniently used for calibration of a sub-surface optical topography measuring instrument, and the calibration accuracy is high.

[0050] The sub-surface multi-parameter nano standard sample plate provided by the present application comprises Figure 1 As shown in the figure, the one-dimensional grid calibration areas 7a and 7b and the two-dimensional grid calibration areas 8a and 8b are respectively located on both sides of the Z-direction step calibration area 2. In order to adapt to the calibration requirements of different instruments, two one-dimensional grid calibration areas 7a and 7b and two two-dimensional grid calibration areas 8a and 8b are provided on the base plate 1. Each one-dimensional grid calibration area 7a and 7b and two-dimensional grid calibration area 8a and 8b is located at a corner of the base plate 1. The one-dimensional grid calibration area comprises a large-period one-dimensional grid calibration area 7a with a large grid width and a small-period one-dimensional grid calibration area 7b with a small grid width. The two-dimensional grid calibration area comprises a large-period two-dimensional grid calibration area 8a with a large grid width and a small-period two-dimensional grid calibration area 8b with a small grid width. The grid sizes in the same one-dimensional grid calibration area or two-dimensional grid calibration area are the same, and the grid sizes in different one-dimensional grid calibration areas or two-dimensional grid calibration areas are different. In this way, different periods of grids can be used for calibration of different requirements.

[0051] As shown in the figure, the one-dimensional grid calibration areas 7a and 7b and the two-dimensional grid calibration areas 8a and 8b are respectively located on both sides of the Z-direction step calibration area 2. In order to adapt to the calibration requirements of different instruments, two one-dimensional grid calibration areas 7a and 7b and two two-dimensional grid calibration areas 8a and 8b are provided on the base plate 1. Each one-dimensional grid calibration area 7a and 7b and two-dimensional grid calibration area 8a and 8b is located at a corner of the base plate 1. The one-dimensional grid calibration area comprises a large-period one-dimensional grid calibration area 7a with a large grid width and a small-period one-dimensional grid calibration area 7b with a small grid width. The two-dimensional grid calibration area comprises a large-period two-dimensional grid calibration area 8a with a large grid width and a small-period two-dimensional grid calibration area 8b with a small grid width. The grid sizes in the same one-dimensional grid calibration area or two-dimensional grid calibration area are the same, and the grid sizes in different one-dimensional grid calibration areas or two-dimensional grid calibration areas are different. In this way, different periods of grids can be used for calibration of different requirements. Figure 1As shown, the X-direction tracking marks 4, Y-direction tracking marks 5 and alignment marks 6 are all triangular arrow shapes, and the arrows all point to the center of the Z-direction step calibration area 2, so that when the instrument is calibrated, the current position can be quickly located and the detection area can be found through the tracking marks and alignment marks 6. The X-direction tracking marks 4, Y-direction tracking marks 5 and alignment marks 6 are all different in size, so that different tracking marks and alignment marks 6 can be distinguished by identifying the size of the tracking marks and alignment marks 6 to distinguish different positions and directions. As shown in the figure, Figure 1 As shown, the Y-direction tracking marks 5 are larger in size than the X-direction tracking marks 4, and the X-direction tracking marks are larger in size than the alignment marks 6. The shapes and sizes of the tracking marks and alignment marks 6 can be designed according to the situation.

[0052] As shown in the figure, Figure 1 As shown, two one-dimensional grid calibration areas are located at the upper left corner and the upper right corner of the base plate 1, two two-dimensional grid calibration areas are located at the lower left corner and the lower right corner of the base plate 1, and the Z-direction step calibration area 2 is located at the center of the base plate 1. The Y-direction tracking marks 5 are located between the large-period grid (one-dimensional grid calibration area at the upper left corner of the base plate 1 and two-dimensional grid calibration area at the lower left corner of the base plate 1) and the small-period grid (one-dimensional grid calibration area at the upper right corner of the base plate 1 and two-dimensional grid calibration area at the lower right corner of the base plate 1), used to isolate the large and small period grids, and point to the Z-direction step calibration area 2. The X-direction tracking marks 4 are located between the small-size one-dimensional grid and the small-size two-dimensional grid, used to isolate the one-dimensional and two-dimensional grids, and point to the Z-direction step calibration area 2. When calibrated, due to the limitation of the field of view of the instrument, the overall appearance of the standard sample cannot be seen, and the relative positions of the functional areas can be determined according to the direction of the arrow to quickly locate the to-be-measured feature.

[0053] As shown in the figure, Figure 1 As shown, the Z-direction step calibration area 2 is symmetrically provided with a plurality of pairs of strip-shaped calibration steps 3 of different widths on both sides of the center line of the Z-direction step calibration area 2, the strip-shaped calibration steps 3 close to the center line of the Z-direction step calibration area 2 are larger in size, and the strip-shaped calibration steps 3 away from the center line of the Z-direction step calibration area 2 are smaller in size. The Z-direction step calibration area 2 contains five pairs of strip-shaped calibration steps 3 of different widths to meet the calibration requirements of sub-surface measurement instruments of different resolutions. The Z-direction step calibration area 2 contains a pair of small-size alignment marks 6, and the alignment marks 6 point to the middle position of all step height structures, which are used to indicate the scanning position and direction when calibrated.

[0054] The base plate 1 of the sub-surface multi-parameter nano standard sample of the present application is made of silicon material, and the microstructures such as calibration areas and tracking marks and alignment marks 6 are formed by semiconductor process. As shown in the figure, Figure 2As shown, the standard sample is divided into 5 layers, corresponding to 4 different materials. The 5-layer structure is as follows, from bottom to top: a substrate plate 1 made of silicon material, a silicon dioxide layer 9, a silicon nitride layer 10, a gold film layer 12, and an evaporated silicon dioxide layer 13. The silicon dioxide layer 9 is thin and is generated by oxidizing the substrate plate 1 made of silicon material, facilitating the subsequent deposition of the silicon nitride layer 10; the silicon dioxide layer 13 is thick, generally several microns to tens of microns, and can be accurately controlled according to calibration needs, and mainly functions to cover the nanostructure on the silicon substrate to form a subsurface; the thickness of the silicon nitride layer 10 can be accurately controlled as needed to prepare structures such as steps and grids of different heights; the gold film layer 12 is thin, generally a few hundred nanometers, and mainly functions to improve the surface roughness of the nanostructure and improve the surface reflectivity of the standard sample; the evaporated silicon dioxide layer 13 can protect the microstructure on the substrate plate 1 and truly simulate the actual surface state of the measured object in subsurface measurement. The material of the evaporated silicon dioxide layer 13 is not limited to silicon dioxide, but can be other transparent materials, depending on the use scenario of the standard sample, and the main purpose is to build the subsurface of the standard sample.

[0055] Corresponding to the subsurface multi-parameter nano standard sample of the present application, the present application also provides a preparation method of a subsurface multi-parameter nano standard sample, for preparing the subsurface multi-parameter nano standard sample of the above technical solution or any preferred technical solution thereof, please refer to Figures 3a to 3j , comprising the following steps:

[0056] 1) The front surface (the surface forming the microstructure is the front surface) of the silicon material substrate plate 1 is subjected to oxidation treatment to generate a layer of silicon dioxide layer 9;

[0057] 2) A layer of silicon nitride layer 10 is deposited on the silicon dioxide layer 9;

[0058] 3) A layer of photoresist layer 11 is spin-coated on the silicon nitride layer 10;

[0059] 4) The photoresist layer 11 is subjected to photolithography using a photoetching machine to etch the required patterns such as tracking marks, steps, and grids;

[0060] 5) The silicon nitride layer 10 and the silicon dioxide layer 9 are etched and peeled off to form tracking marks, step, and grid nanostructures;

[0061] 6) The photoresist is removed, and a gold film layer 12 is evaporated on the front surface of the etched substrate plate 1;

[0062] 7) A silicon dioxide layer 13 is evaporated on the surface of the gold film layer 12, and the surface of the evaporated silicon dioxide layer 13 is subjected to chemical mechanical polishing to obtain a smooth surface, and the sample preparation is completed.

[0063] Before the substrate plate 1 is subjected to the oxidation treatment to generate the silicon dioxide layer 9, the following steps are further included:

[0064] a) cleaning the substrate plate 1 and then drying, so as to ensure that the front surface of the substrate plate 1 is clean and conducive to the generation of the silicon dioxide layer 9;

[0065] In the above step 2), the silicon nitride layer 10 is deposited by using low-pressure chemical vapor deposition;

[0066] In the above step 5), the silicon nitride layer 10 is etched and peeled off; the silicon dioxide layer 9 is etched and peeled off to expose the silicon substrate;

[0067] After the step 5) is completed, the photoresist is removed, and then the gold film layer 12 is formed by evaporation.

[0068] Figure 3a Fig. 1 shows a schematic diagram of the state of the substrate plate 1 after cleaning but before oxidation treatment, Figure 3b Fig. 2 shows a schematic diagram of the state of the substrate plate 1 after the oxidation treatment to generate a silicon dioxide layer 9, Figure 3c Fig. 3 shows a schematic diagram of the state of the substrate plate 1 after the deposition of a silicon nitride layer 10 on the silicon dioxide layer 9, Figure 3d Fig. 4 shows a schematic diagram of the state of the substrate plate 1 after the spin coating of a photoresist layer 11 on the silicon nitride layer 10, Figure 3e Fig. 5 shows a schematic diagram of the state of the substrate plate 1 after the photoetching of the photoresist layer 11 by using a photoetching machine to etch and form the required patterns such as tracking marks, steps, and grids, Figure 3f Fig. 6 shows a schematic diagram of the state of the substrate plate 1 after the etching and peeling off of the silicon nitride layer 10, Figure 3g Fig. 7 shows a schematic diagram of the state of the substrate plate 1 after the etching and peeling off of the silicon dioxide layer 9, Figure 3h Fig. 8 shows a schematic diagram of the state of the substrate plate 1 after the removal of the photoresist, Figure 3i Fig. 9 shows a schematic diagram of the state of the substrate plate 1 after the evaporation of the gold film layer 12, Figure 3j Fig. 10 shows a schematic diagram of the state of the substrate plate 1 after the evaporation of the silicon dioxide layer 13 and the chemical mechanical polishing of the surface of the evaporated silicon dioxide layer 13 to obtain a smooth and flat surface, and the completion of the preparation of the sample plate.

[0069] The standard sample plate obtained by using the process flow described in the present application has high dimensional accuracy and stable performance, and can meet the use requirements in atmospheric environment, vacuum, or other special environments. The method can be used to prepare nano steps, one-dimensional grids, two-dimensional grids, and other structures on a silicon substrate, and through precise control of the etching and deposition processes, accurate structure sizes can be obtained to meet the calibration requirements of different types of subsurface measuring instruments.

[0070] The sub-surface multi-parameter nano standard sample prepared by the application can be used for calibration and traceability of sub-surface measuring instruments such as confocal microscopes, white light interference microscopes and ultrasonic atomic force microscopes, and can provide guarantee for value accuracy in sub-surface geometric parameter measurement, and can help the development of strategic emerging industries such as semiconductors, precision manufacturing and national defense and military industry, and has high industrial utilization value.

[0071] In summary, the application effectively overcomes the shortcomings in the prior art and has high industrial utilization value.

[0072] The above examples only exemplarily illustrate the principles and effects of the application, and are not used to limit the application. Any person skilled in the art can modify or change the above examples without departing from the spirit and scope of the application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the application should be covered by the claims of the application.

Claims

1. A subsurface multi-parameter nanometer standard template, characterized in that, The substrate plate comprises a middle part provided with a Z-direction step calibration area, and the Z-direction step calibration area comprises a plurality of strip-shaped calibration steps arranged in a row along the X-direction, and each strip-shaped calibration step extends along the Y-direction. The substrate plate is further provided with X-direction tracking marks and Y-direction tracking marks, the X-direction tracking marks point to the center of the Z-direction step calibration area along the X-direction, and the Y-direction tracking marks point to the center of the Z-direction step calibration area along the Y-direction; the Z-direction step calibration area is further provided with an alignment mark, and the alignment mark points to the center of the Z-direction step calibration area along the X-direction. The substrate plate is further provided with a one-dimensional grid calibration area and a two-dimensional grid calibration area, the one-dimensional grid calibration area is provided with a plurality of strip-shaped grids arranged in a row along the X-direction, and the two-dimensional grid calibration area is provided with a grid array arranged in a row along the X-direction and in a column along the Y-direction. The sub-surface multi-parameter nano standard sample plate is prepared by the following steps: 1) performing oxidation treatment on the front surface of the silicon material substrate plate to generate a silicon dioxide layer; 2) depositing a silicon nitride layer on the silicon dioxide layer; 3) spin-coating a photoresist layer on the silicon nitride layer; 4) performing photoetching on the photoresist layer by using a photoetching machine to etch tracking marks, steps and grid patterns; 5) etching and stripping the silicon nitride layer and the silicon dioxide layer to form tracking marks, steps and grid nano structures; 6) removing the photoresist and evaporating a gold film layer on the front surface of the substrate plate after the etching is completed; 7) evaporating a silicon dioxide layer on the surface of the gold film layer, the thickness of the evaporated silicon dioxide layer is several microns to several tens of microns, which is used to cover the nano structures on the silicon material substrate plate to form a sub-surface, and the surface of the evaporated silicon dioxide layer is subjected to chemical mechanical polishing to obtain a smooth surface, and the preparation of the sample plate is completed.

2. The subsurface multi-parameter nanometrology template according to claim 1, wherein: The X-direction tracking marks, Y-direction tracking marks and alignment mark are all triangular arrow shapes, and the arrows all point to the center of the Z-direction step calibration area.

3. The subsurface multi-parameter nanometrology template according to claim 1, wherein: The X-direction tracking marks, Y-direction tracking marks and alignment mark are all different in size.

4. The subsurface multi-parameter nanometrology template according to claim 3, wherein: The size of the Y-direction tracking marks is larger than that of the X-direction tracking marks, and the size of the X-direction tracking marks is larger than that of the alignment mark.

5. The subsurface multi-parameter nanometrology template of claim 1, wherein: The Z-direction step calibration area is symmetrically provided with a plurality of pairs of strip-shaped calibration steps with different widths on both sides of the center line.

6. The subsurface multi-parameter nanometrology template according to claim 5, wherein: The strip-shaped calibration steps close to the center line of the Z-direction step calibration area have larger width sizes, and the strip-shaped calibration steps away from the center line of the Z-direction step calibration area have smaller width sizes.

7. The subsurface multi-parameter nanometrology template of claim 1, wherein: The one-dimensional grid calibration area and the two-dimensional grid calibration area are respectively located on both sides of the Z-direction step calibration area.

8. The subsurface multi-parameter nanometrology template of claim 1, wherein: The substrate plate is provided with two one-dimensional grid calibration areas and two two-dimensional grid calibration areas, and each one-dimensional grid calibration area and two-dimensional grid calibration area is located at a corner of the substrate plate.

9. The subsurface multi-parameter nanometrology template according to claim 8, wherein: The grid sizes in the same one-dimensional grid calibration area or two-dimensional grid calibration area are the same, and the grid sizes in different one-dimensional grid calibration areas or two-dimensional grid calibration areas are different.

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