Lens moving device, camera module comprising the device and optical instrument

Abstract

A lens moving apparatus includes a housing, a coil holder arranged in the housing, a first coil arranged on an outer surface of the coil holder, a first magnet arranged on the housing, a first circuit board arranged on a corner portion of the housing, a first position sensor arranged on the first circuit board and electrically connected to first to sixth pads of the first circuit board, an upper elastic member coupled to an upper portion of the housing, each of first to sixth upper springs of the upper elastic member including a portion arranged on the corner portion of the housing and coupled to a corresponding one of the first to sixth pads. A camera module and an optical instrument including the apparatus are also disclosed.

Description

[0001] This application is a divisional application of the invention patent application with the application date of September 26, 2017, the application number of 2017800682182, and the invention name of "Apparatus for driving lens, camera module including the same, and optical instrument". TECHNICAL FIELD

[0002] Embodiments relate to a lens moving device, and a camera module and an optical instrument including the same. BACKGROUND

[0003] It is difficult to apply a voice coil motor (VCM) technology used on a general-purpose camera module to miniaturization and low power consumption, and thus active research has been conducted thereon.

[0004] Electronic products such as smart phones and portable phones including cameras mounted thereon have been gradually consumed and produced. Cameras for portable phones have had high pixels and have been miniaturized according to the current trend, and thus actuators have also been miniaturized, have had a large aperture, and have been multifunctionalized. In order to implement a high-pixel camera for a portable phone, it is necessary to improve the performance of a camera for a portable phone, and additional functions such as an auto focus, a shutter shake correction, and a zoom function are required. SUMMARY

[0005] TECHNICAL PROBLEM

[0006] Embodiments provide a lens moving device for reducing a size, reducing current consumption, and improving driving sensitivity of an optical image stabilizer (OIS), and a camera module and an optical instrument including the same.

[0007] Furthermore, embodiments provide a lens moving device including a Hall device and a driver integrated into each other, a Hall driver integrated circuit (IC), and a conduction arrangement structure for the Hall driver IC, and a camera module and an optical instrument including the same.

[0008] TECHNICAL SOLUTION

[0009] In one embodiment, a lens moving device includes a housing having side portions, a first corner portion, a second corner portion, a third corner portion, and a fourth corner portion, each of the first corner portion, the second corner portion, the third corner portion, and the fourth corner portion being arranged between two adjacent side portions; a coil holder arranged in the housing; a first coil arranged on an outer surface of the coil holder; a first magnet arranged on a side portion of the housing; a first circuit board arranged at the first corner portion and including a first pad, a second pad, a third pad, a fourth pad, a fifth pad, and a sixth pad; a first position sensor arranged on the first circuit board and electrically connected to the first pad, the second pad, the third pad, the fourth pad, the fifth pad, and the sixth pad; first to fourth upper springs arranged to be spaced apart from each other on the housing; and first and second lower springs coupled to a lower portion of the housing, the first and second lower springs being electrically connected to the first coil, and the first and second lower springs being coupled to the fifth and sixth pads, wherein each of the first to fourth upper springs is coupled to a corresponding one of the first to fourth pads at the first corner portion.

[0010] The lens moving device can further include a fifth upper spring arranged at the fourth corner portion, wherein the first and second upper springs can be arranged at the first corner portion and coupled to corresponding ones of the first and second pads, the third upper spring can be arranged at the second corner portion and coupled to the third pad, the fourth upper spring can be arranged at the third corner portion and coupled to the fourth pad, and the fourth corner portion can face the first corner portion on a diagonal line.

[0011] The lens moving device can further include a second circuit board arranged below the first and second lower springs; first and second support members arranged at the first corner portion and configured to connect corresponding ones of the first and second upper springs to the second circuit board; at least one third support member arranged at the second corner portion and configured to connect the third upper spring to the second circuit board; at least one fourth support member arranged at the third corner portion and configured to connect the fourth upper spring to the second circuit board; and at least one fifth support member arranged at the fourth corner portion and configured to connect the fifth upper spring to the second circuit board, wherein each of the third to fifth support members can include two support members spaced apart from each other.

[0012] Each of the first lower spring and the second lower spring can include a second inner frame coupled to the bobbin, a second outer frame coupled to the housing, and a second frame connection part configured to connect the second inner frame to the second outer frame, and each of the fifth pad to the sixth pad can be coupled to a corresponding one of the second outer frame of the first lower spring and the second outer frame of the second lower spring.

[0013] The first upper spring can be disposed at the first corner portion, the second upper spring can be disposed at the second corner portion, the third upper spring can be disposed at the third corner portion, and the fourth upper spring can be disposed at the fourth corner portion, and the fourth corner portion can face the first corner portion on a diagonal line.

[0014] One end of the second upper spring can extend from the second corner portion toward the first corner portion, one end of the third upper spring can extend from the third corner portion toward the first corner portion, one end of the fourth upper spring can extend from the fourth corner portion toward the first corner portion, and one end of each of the first upper spring, the second upper spring, the third upper spring, and the fourth upper spring can be coupled to a corresponding one of the first pad, the second pad, the third pad, and the fourth pad.

[0015] The lens moving apparatus can further include a second circuit board disposed below the first lower spring and the second lower spring, a first support member disposed at the first corner portion and coupled between the first upper spring and the second circuit board, a second support member disposed at the second corner portion and coupled between the second upper spring and the second circuit board, a third support member disposed at the third corner portion and coupled between the third upper spring and the second circuit board, and a fourth support member disposed at the fourth corner portion and coupled between the fourth upper spring and the second circuit board.

[0016] The first position sensor can transmit or receive a signal for data communication to or from the circuit board through the first pad to the fourth pad, and the first position sensor can provide a driving signal to the first coil through the fifth pad and the sixth pad.

[0017] Each of the first to fourth upper springs can include an outer frame coupled to the housing; and the outer frame can include a first coupling portion coupled to a corresponding one of the first to fourth corner portions, a second coupling portion coupled to a corresponding one of the first to fourth support members, and at least one connection portion configured to connect the first coupling portion to the second coupling portion.

[0018] The fourth upper spring can include a 1-1 outer frame coupled to the first corner portion and a 1-2 outer frame coupled to the fourth corner portion, two first inner frames coupled to the bobbin, a first frame connection portion configured to connect the 1-1 outer frame and the 1-2 outer frame to the two first inner frames, and a connection frame configured to connect the two first inner frames to each other.

[0019] Advantageous Effects

[0020] Embodiments provide a lens moving apparatus for reducing a size, reducing current consumption, and improving driving sensitivity of an optical image stabilizer (OIS), and a camera module and an optical instrument including the same.

[0021] Embodiments provide a lens moving apparatus for precise autofocus feedback control via a temperature sensing function of a Hall driver integrated circuit (IC) even if a temperature changes, and a camera module and an optical instrument including the same. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is an exploded perspective view of a lens moving apparatus according to an embodiment.

[0023] Figure 2 is a coupled perspective view of a lens moving apparatus, in which, Figure 1 a cover member of is removed from the lens moving apparatus.

[0024] Figure 3 is Figure 1 is a perspective view of a bobbin and first, second, and third magnets shown in.

[0025] Figure 4 is Figure 1 is an exploded perspective view of a housing and a first magnet shown in.

[0026] Figure 5 is Figure 1 is an exploded perspective view of a housing, a first position sensor, and a first circuit board shown in.

[0027] Figure 6ais Figure 5 An enlarged view of the first circuit board and the first position sensor shown in FIG. 6.

[0028] Figure 6b is a diagram illustrating Figure 6a a configuration of the first position sensor shown in FIG. 6.

[0029] Figure 7 is a cross-sectional view of the lens moving apparatus taken along the direction AB shown in FIG. 6. Figure 2

[0030] Figure 8 is a cross-sectional view of the lens moving apparatus taken along the direction CD shown in FIG. 6. Figure 2

[0031] Figure 9a is a plan view of the upper elastic member shown in FIG. 6. Figure 1

[0032] Figure 9b is an enlarged view of the first outer frame of the sixth spring and the seventh spring shown in FIG. 6. Figure 9a

[0033] Figure 9c is a plan view of the lower elastic member shown in FIG. 6. Figure 1

[0034] Figure 10 is an assembled perspective view of the upper elastic member, the lower elastic member, the base, the support member, the second coil, and the second circuit board shown in FIG. 6. Figure 1

[0035] Figure 11 is an exploded perspective view of the second coil, the second circuit board, the base, and the second position sensor shown in FIG. 6. Figure 1

[0036] Figure 12 is a perspective view of a lens moving apparatus according to another embodiment.

[0037] Figure 13a is an exploded perspective view of a first circuit board for mounting a housing and a first position sensor.

[0038] Figure 13b is an assembled perspective view of a housing, a first position sensor, and a first circuit board.

[0039] Figure 14 is an assembled perspective view of a first circuit board and a first position sensor.

[0040] Figure 15 is a diagram illustrating Figure 12 the upper elastic member shown in FIG. 6.

[0041] ​​​​​​​Figure 16 FIG. 1 is a perspective view of a lens moving apparatus according to an embodiment. Figure 12 FIG. 2 is a perspective view of a lower elastic member according to an embodiment.

[0042] Figure 17 FIG. 3 is a perspective view of a conductive connection of a first lower spring and a second lower spring to pads of a first circuit board.

[0043] Figure 18 FIG. 4 is a perspective view of a lens moving apparatus according to another embodiment.

[0044] Figure 19 FIG. 5 is a cross-sectional view of the lens moving apparatus of Figure 18 FIG. 6 is a cross-sectional view of the lens moving apparatus of

[0045] Figure 20a FIG. 7 is a perspective view of an upper elastic member according to an embodiment. Figure 18

[0046] Figure 20b FIG. 8 is a perspective view of a part of the lens moving apparatus of Figure 20a FIG. 9 is an enlarged view of a part of the lens moving apparatus of

[0047] Figure 21 FIG. 10 is a perspective view of a coupling relationship of an upper elastic member, a first circuit board, and a support member according to an embodiment. Figure 18

[0048] Figure 22 FIG. 11 is an exploded perspective view of a camera module according to an embodiment.

[0049] Figure 23 FIG. 12 is a perspective view of a lens moving apparatus according to another embodiment.

[0050] Figure 24 FIG. 13 is an exploded perspective view of the lens moving apparatus of Figure 23 FIG. 14 is a perspective view of some components of the lens moving apparatus.

[0051] Figure 25 FIG. 15 is a bottom view of some components of the lens moving apparatus. Figure 26 FIG. 16 is an exploded perspective view of some components of the lens moving apparatus.

[0052] Figure 27 FIG. 17 is a conceptual diagram showing a communication structure of a Hall driver IC and a controller of a camera module according to an embodiment.

[0053] Figures 28 to 31 FIG. 18 is a perspective view of a camera module according to another embodiment.

[0054] Figure 32 FIG. 19 is a perspective view of a camera module according to another embodiment.

[0055] Figure 33 FIG. 20 is a perspective view of a camera module according to another embodiment.

[0056] Figure 34 ​​is a perspective view of a portable terminal 200A according to an embodiment.

[0057] Figure 35 is Figure 34 is a diagram of a configuration of a portable terminal shown in FIG. DETAILED DESCRIPTION

[0058] Hereinafter, the embodiments will be understood more clearly from the accompanying drawings and the description associated with the embodiments. In the description of the embodiments, it will be understood that when an element such as a layer (film), a region, a pattern or a structure is referred to as being "on" or "under" another element such as a layer (film), a region, a pad or a pattern, the term "on" or "under" means that the element is directly on or under the other element or an intermediate element can also exist. It will also be understood that "on" or "under" is determined based on the drawings.

[0059] In the drawings, the size of elements can be exaggerated, omitted, or schematically shown for convenience or clarity of description and illustration. In addition, the size of the elements does not mean the actual size of the elements. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

[0060] Hereinafter, a lens moving apparatus according to an embodiment will be described with reference to the accompanying drawings. For convenience of description, the lens moving apparatus according to an embodiment is described based on a Cartesian coordinate system (x, y, z), but the lens moving apparatus can also be described based on other coordinate systems and the embodiment is not limited thereto. In each drawing, the x-axis and the y-axis indicate directions perpendicular to the z-axis direction, the z-axis direction as an optical axis direction can be referred to as a "first direction", the x-axis direction can be referred to as a "second direction", and the y-axis direction can be referred to as a "third direction".

[0061] A "hand-shake correction device" applied to a small-sized camera module of a mobile apparatus such as a smart phone or a personal computer (PC) can refer to a device configured to prevent a profile of a captured image from being blurred due to vibration of a user's hand shaking during capturing of a still image.

[0062] An "autofocus device" refers to a device for automatically forming a focal point of a target image on a surface of an image sensor. The hand-shake correction device and the autofocus device can be configured in various ways, and the lens moving apparatus according to an embodiment can perform an autofocus operation of moving an optical module including at least one lens in a first direction parallel to an optical axis, or can perform a hand-shake correction operation of moving the optical module with respect to a surface formed by a second direction and a third direction perpendicular to the first direction.

[0063] Figure 1 is an exploded perspective view of a lens moving apparatus 100 according to an embodiment. Figure 2is a coupled perspective view of the lens moving apparatus 100, wherein Figure 1 the cover member 300 is removed from the lens moving apparatus 100.

[0064] Referring to Figure 1 and Figure 2 , the lens moving apparatus 100 can include a coil holder 110, a first coil 120, a first magnet 130, a housing 140, an upper elastic member 150, a lower elastic member 160, a first position sensor 170, and a second magnet 180.

[0065] The lens moving apparatus 100 can further include a third magnet 185, a first circuit board 190, a support member 220, a second coil 230, a second position sensor 240, a second circuit board 250, a base 210, and a cover member 300.

[0066] The cover member 300 can accommodate the coil holder 110, the first coil 120, the first magnet 130, the housing 140, the upper elastic member 150, the lower elastic member 160, the first position sensor 170, the second magnet 180, the first circuit board 190, the support member 220, the second coil 230, the second position sensor 240, and the second circuit board 250 in an accommodation space formed by the base 210 together with the cover member 300.

[0067] The cover member 300 can be shaped similarly to a box having an open lower portion and an upper plate and side plates, and the lower portion of the cover member 300 can be coupled to an upper portion of the base 210. An upper end portion of the cover member 300 can be shaped similarly to a polygon, for example, a rectangle or an octagon.

[0068] The cover member 300 can include a hollow portion for exposing a lens (not shown) coupled to the coil holder 110 to external light. In order to prevent impurities such as dust or moisture from penetrating into the camera module, the hollow portion of the cover member 300 can further include a window formed of an optically transparent material.

[0069] A material of the cover member 300 can be a non-magnetic substance such as SUS to prevent attachment with the first magnet 130, or can be a magnetic material to serve as a magnetic yoke for enhancing an electromagnetic force between the first coil 120 and the first magnet 130.

[0070] Hereinafter, the coil holder 110 will be described.

[0071] The coil holder 110 can be disposed inside the housing 140, and the coil holder 110 can be moved along an optical axis OA or a first direction (for example, a Z-axis direction) by electromagnetic interaction between the first coil 120 and the first magnet 130.

[0072] Figure 3 isFigure 1 a perspective view of the coil holder 110 and the first magnet 120, the second magnet 180, and the third magnet 185.

[0073] Referring to Figure 3 The coil holder 110 can have a hollow portion for mounting a lens or a lens barrel. For example, the hollow portion of the coil holder 110 can have a circular shape, an elliptical shape, or a polygonal shape, but embodiments are not limited thereto.

[0074] The lens can be directly mounted in the hollow portion of the coil holder 110, but embodiments are not limited thereto, and according to another embodiment, a lens barrel mounting or coupling at least one lens can be coupled to or mounted in the hollow portion of the coil holder 110. The lens or the lens barrel can be coupled to the inner circumferential surface 110a of the coil holder 110 by using various methods.

[0075] The coil holder 110 can include first side portion parts 110b-1 spaced apart from each other and second side portion parts 110b-2 spaced apart from each other, and each of the second side portion parts 110b-1 can connect two adjacent first side portion parts. For example, each of the first side portion parts 110b-1 of the coil holder 110 can have a length in a horizontal direction or a transverse direction that is greater than a length in the horizontal direction or the transverse direction of each of the second side portion parts 110b-2.

[0076] A guide portion 111 for guiding a mounting position of the upper elastic member 150 can be provided on an upper surface of the coil holder 110. For example, as shown in Figure 3 The guide portion 111 of the coil holder 110 can protrude in a first direction (for example, a Z-axis direction) from the upper surface to guide a path through which the frame connection portion 153 of the upper elastic member 150 passes, as shown in

[0077] The outer surface 110b of the coil holder 110 can include a protruding portion 112 protruding in a second direction or / and a third direction. The inner frame 151 of the upper elastic member 150 can be accommodated on an upper surface 112a of the protruding portion 112 of the coil holder 110.

[0078] The protruding portion 112 of the coil holder 110 can prevent the outer surface of the coil holder 110 from directly colliding with the housing 140, even in the case where the coil holder 110 moves by a prescribed range or more due to external impact or the like when the coil holder 110 moves in the optical axis direction for autofocus.

[0079] The coil holder 110 can include an upper support protrusion 113a coupled and fixed to the upper elastic member 150.

[0080] A coil accommodation groove for accommodating, inserting, or arranging the first coil 120 can be provided on the outer surface of the coil stand 110. The coil accommodation groove can be a groove recessed from the outer surface 110b of the first side portion 110b-1 and the second side portion 110b-2 of the coil stand 110, and the coil accommodation groove can have a shape, for example, a ring shape, corresponding to the shape of the first coil 120.

[0081] The coil stand 110 can have an outer surface including a second magnet accommodation groove 180a for accommodating, inserting, fixing, or arranging the second magnet 180.

[0082] The second magnet accommodation groove 180a of the coil stand 110 can be recessed from the outer surface 110b of the coil stand 110, and can have an opening open above the upper surface of the coil stand 110, but embodiments are not limited thereto.

[0083] The second magnet accommodation groove 180a of the coil stand 110 can be positioned above the coil accommodation groove for arranging the first coil 120 and can be spaced apart from the coil accommodation groove, but embodiments are not limited thereto.

[0084] The coil stand 110 can have an upper surface including a third magnet accommodation groove 185a for accommodating, inserting, fixing, or arranging the third magnet 185.

[0085] The third magnet accommodation groove 185a can be recessed from the outer surface 110b of the coil stand 110, and can have an opening open above the upper surface of the coil stand 110, but embodiments are not limited thereto.

[0086] The third magnet accommodation groove 185a of the coil stand 110 can be positioned above the coil accommodation groove for arranging the first coil 120 and can be spaced apart from the coil accommodation groove, but embodiments are not limited thereto.

[0087] The second magnet accommodation groove 180a can be provided in any one of the second side portions 110b-2 of the coil stand 110, and the third magnet accommodation groove 185a can be provided in any other one of the second side portions 110b-2 of the coil stand 110.

[0088] The third magnet accommodation groove 185a can be provided to face the second magnet accommodation groove 180a. For example, the second magnet accommodation groove 180a and the third magnet accommodation groove 185a can be provided in two facing second side portions of the coil stand 110.

[0089] The second magnet 180 and the third magnet 185 can be arranged or aligned to be balanced with respect to the first position sensor 170 on the coil holder 110, and thus the influence of the magnetic force of the second magnet 180 on the first coil 120 can be canceled by the third magnet 185, thereby improving the precision of an auto focus (AF) drive.

[0090] The first coil 120 can be arranged on the outer surface 110b of the coil holder 110.

[0091] The first coil 120 can be arranged below the second magnet 180 and the third magnet 180, but embodiments are not limited thereto. For example, the first coil 120 can not overlap the second magnet 180 and the third magnet 185 in the second direction or the third direction, but embodiments are not limited thereto.

[0092] For example, the first coil 130 can be arranged in the coil accommodation groove, the second magnet 180 can be inserted or arranged in the second magnet accommodation groove 180a, and the third magnet 185 can be inserted or arranged in the third magnet accommodation groove 185a.

[0093] Each of the second magnet 180 and the third magnet 185 arranged on the coil holder 110 can be spaced apart from the first coil 120 in the optical axis OA direction, but embodiments are not limited thereto, and according to another embodiment, each of the second magnet 180 and the third magnet 185 arranged on the coil holder 110 can contact or can overlap the first coil 120 in the second direction or the third direction.

[0094] The first coil 120 can be shaped like a closed loop that surrounds the outer surface 110b of the coil holder 110 in a rotation direction based on the optical axis OA, and the first coil 120 can be shaped, for example, like a ring.

[0095] The first coil 120 can be directly wound on the outer surface 110b of the coil holder 110, but embodiments are not limited thereto, and according to another embodiment, the first coil 120 can be wound on the coil holder 110 using a coil ring, or the first coil 120 can be provided in the form of a coil block shaped like an angular ring.

[0096] When a driving signal (for example, a driving current) is supplied to the first coil 120, an electromagnetic force can be formed through electromagnetic interaction with the first magnet 130, and the coil holder 110 can be moved in the optical axis OA direction by the formed electromagnetic force.

[0097] At the initial position of the AF moving part, for example, at the initial position of the coil holder 110, the first coil 120 can be disposed to correspond to the first magnet 130 disposed in the housing 140, or to overlap or align with the first magnet 130 in a direction perpendicular to the optical axis OA.

[0098] For example, the AF moving part can include the coil holder 110 and components coupled to the coil holder 110, for example, the first coil 120 and the second magnet 180 and the third magnet 185. The initial position of the AF moving part can be a first position of the AF moving part in a state in which no power is supplied to the first coil 1120, or a position in which the AF moving part is located when the upper elastic member 150 and the lower elastic member 160 are elastically deformed only by the weight of the AF moving part.

[0099] In addition, the initial position of the AF moving part can be a position in which the AF moving part is located when gravity is applied in a direction from the coil holder 110 to the base 210, or conversely, the initial position of the AF moving part can be a position in which the AF moving part is located when gravity is applied in a direction from the base 210 to the coil holder 110.

[0100] The second magnet 180 can be disposed in a second magnet receiving groove 180a of the coil holder 110, and a portion of one surface of the second magnet 180 facing the first position sensor 170 can be exposed from the second magnet receiving groove 180a.

[0101] For example, each of the second magnet 180 and the third magnet 185 disposed on the coil holder 110 can have a boundary surface of an N pole and an S pole parallel to a direction perpendicular to the optical axis OA. For example, the surface of each of the second magnet 180 and the third magnet 185 facing the first position sensor 170 can be divided into the N pole and the S pole, but embodiments are not limited thereto.

[0102] For example, according to another embodiment, each of the second magnet 180 and the third magnet 185 disposed on the coil holder 110 can have a boundary surface of an N pole and an S pole parallel to the optical axis OA.

[0103] The second magnet 180 can move together with the coil holder 110 in the optical axis direction, and the first position sensor 170 can detect a magnetic field strength of the second magnet 180 moving in the optical axis direction. The magnetic field strength detected by the first position sensor 170 changes according to displacement of the coil holder 110 in the optical axis direction, and thus displacement of the coil holder 110 in the optical axis direction can be detected based on the magnetic field strength detected by the first position sensor 170.

[0104] The magnetic field of the second magnet 180 can affect the interaction between the first magnet 130 and the first coil 120, and the third magnet 185 can mitigate or eliminate the influence of the magnetic field of the second magnet 180 on the interaction between the first magnet 130 and the first coil 120. In addition, the third magnet 185 can counteract the weight of the second magnet 180, thereby improving the accuracy of AF drive.

[0105] For example, the third magnet 185 can be arranged on the second side portion of the coil frame 110 opposite to the second side portion where the second magnet 180 is arranged, facing the second magnet 180. According to the embodiment, through this arrangement of the second magnet 180 and the third magnet 185, the magnetic field of the third magnet 185 can compensate for the magnetic field of the second magnet 180, which affects the interaction between the first magnet 130 and the first coil 120, and thus can reduce or eliminate the influence of the magnetic field of the second magnet 180 on the AF operation, thereby improving the accuracy of the AF operation.

[0106] The housing 140 will be described below.

[0107] The housing 140 can accommodate the coil holder 110 therein, and the housing 140 can support the first circuit board 190 for arranging the first magnet 130 and the first position sensor 170.

[0108] The housing 140 may have an integrally hollow cylindrical shape. For example, the housing 140 may have a polygonal (e.g., rectangular or octagonal) or circular hollow portion.

[0109] Figure 4 yes Figure 1 An exploded perspective view of the housing 140 and the first magnet 130 shown. Figure 5 yes Figure 1 An exploded perspective view of the housing 140, the first position sensor 170, and the first circuit board 190 shown.

[0110] Reference Figure 4 and Figure 5 The housing 140 may include a plurality of side portions 141 and 142. For example, the housing 140 may include a first side portion 141 spaced apart from each other and a second side portion 142 spaced apart from each other.

[0111] Each first side portion 141 of the housing 140 may be arranged or positioned between two adjacent second side portions 142, each first side portion 141 may connect the second side portions 142 to each other and may include a plane having a predetermined depth.

[0112] For example, the second side portion part 142 can be positioned at a corner or an edge of the housing 140 and can be replaced with the term "corner portion", and the first side portion part 141 can be replaced with the term "side portion part".

[0113] For example, the number of the first side portion parts 141 of the housing 140 can be four, and the number of the second side portion parts 142 can be four, but embodiments are not limited thereto.

[0114] The length of each of the first side portion parts 141 of the housing 140 in a horizontal direction can be greater than the length of each of the second side portion parts 142 in a horizontal direction, but embodiments are not limited thereto.

[0115] The first magnet 130 can be arranged or mounted on the first side portion part 141 of the housing 140. Each of the second side portion parts 142 of the housing 140 can be arranged between two adjacent first side portion parts 141, and the support member 220 can be arranged on the second side portion part 142 of the housing 140.

[0116] In order to prevent interference with the protrusion part 112 of the coil holder 110 when the coil holder 110 moves in the optical axis OA direction, the housing 140 can include a groove 146 provided at a position corresponding to the protrusion part 112 of the coil holder 110.

[0117] The state in which the lower surface of the protrusion part 111 of the coil holder 110 contacts the bottom surface 146a of the groove 146 is set as the initial position of the coil holder 110, and the auto focus function can be controlled in a single direction (for example, the positive z-axis direction from the initial position).

[0118] However, for example, the state in which the lower surface of the protrusion part 111 of the coil holder 110 is spaced apart from the bottom surface 146a of the groove 146 of the housing 140 by a predetermined distance is set as the initial position of the coil holder 110, and the auto focus function can be controlled in two directions (for example, the positive z-axis direction from the initial position and the negative z-axis direction from the initial position).

[0119] The housing 140 can include a first magnet accommodation part 141a for accommodating the first magnet 130, a first mounting groove 141-1 for accommodating the first circuit board 190, and a second mounting groove 141-2 for accommodating the first position sensor 170.

[0120] The first magnet accommodation portions 141a can be provided at inner lower end portions of at least one of the first side portion portions 141 of the housing 140. For example, the first magnet accommodation portions 141a can be provided at inner lower end portions of each of the four first side portion portions 141, and each of the first magnets 130-1 to 130-4 can be inserted into and fixed to a corresponding one of the first magnet accommodation portions 141a.

[0121] The first magnet accommodation portions 141a of the housing 140 can be formed as grooves corresponding in size to the first magnets 130. An opening can be formed on a bottom surface of the first magnet accommodation portions 141a of the housing 140 facing the second coil 230, and a bottom surface of the first magnet 130 fixed to the first magnet accommodation portions 141a can face the second coil 230 in the optical axis direction.

[0122] The first mounting groove 141-1 can be provided at an upper portion or an upper end of any one of the second side portion portions 142 of the housing 140.

[0123] To easily mount the first circuit board 190, the first mounting groove 141-1 can be formed as a groove having an open upper portion, a side surface, and a bottom, and the first mounting groove 141-1 can have an opening open toward the inside of the housing 140. The bottom of the first mounting groove 141-1 can have a shape corresponding to or the same as the shape of the first circuit board 110.

[0124] The second mounting groove 141-2 can be provided on the bottom of the first mounting groove 141-1. The second mounting groove 141-2 can be recessed from the bottom of the first mounting groove 141-1.

[0125] To easily mount the first position sensor 170, the second mounting groove 141-2 can be formed as a groove having an open upper portion, a side surface, and a bottom, and the second mounting groove 141-2 can have an opening open toward the inside of the second side portion portions 142 of the housing 140. The second mounting groove 141-2 can have a shape corresponding to or the same as the shape of the first position sensor 170.

[0126] Each of the first magnets 130 and the first circuit board 190 can be fixed to the first magnet accommodation portions 141a and the first mounting groove 141-1 of the housing 140 by an adhesive member, for example, epoxy or a double-sided tape. The first position sensor 170 can be fixed to the second mounting groove 141-2 by an adhesive member.

[0127] Each first side portion 141 of the housing 140 may be arranged parallel to a corresponding side plate of the cover member 300. For example, the area of ​​the outer surface of each first side portion 141 of the housing 140 may be larger than the area of ​​the outer surface of each second side portion 142 of the second side portion.

[0128] Each of the second side portions 142 of the housing 140 may include a through hole 147 that forms a path through which the support member 220 passes. For example, the housing 140 may include a through hole 147 through the upper portion of the second side portion 142.

[0129] According to another embodiment, a through hole provided in the second side portion of the housing 140 can be recessed from the outer surface of the second side portion 142 of the housing 140, and at least a portion of the through hole can be open to the outer surface of the second side portion 142.

[0130] The number of through holes 147 in the housing 140 can be the same as the number of support members. One end of the support member 220 can pass through the through hole 147 and can be connected or coupled to the upper elastic member 150.

[0131] To prevent Figure 1 The inner surface of the upper end portion of the cover member 300 shown directly impacts the housing 140, and stops 144-1 to 144-4 may be provided on the upper end portion of the housing 140.

[0132] For example, stops 144-1 to 144-4 may be provided on the upper surface of each of the second side portions 142 in the housing 140.

[0133] The housing 140 may include at least one upper support protrusion 143, which is connected to the outer frame 152 of the upper elastic member 150.

[0134] The upper support protrusion 143 of the housing 140 may be formed on the upper surface of at least one of the first side portion 141 or the second side portion 142 of the housing 140. For example, the upper support protrusion 143 of the housing 140 may be provided on the upper surface of the second side portion 142 of the housing 140, but the embodiments are not limited thereto.

[0135] The housing 140 may include a lower support protrusion (not shown) formed on the lower surface of the housing 140, and the lower support protrusion is connected to and fixed to the outer frame 162 of the lower elastic member 160.

[0136] To secure a space filled with a gel-type silicon to function as a damper and form a path for the support member 220 to pass through, the housing 140 can include a groove 142a formed on a lower portion or a lower end of the second side portion 142. That is, to alleviate vibration of the support member 220, the groove 142a of the housing 140 can be filled with a damping member, such as silicon.

[0137] The housing 140 can include at least one stopper 149 protruding from an outer surface of the first side portion 141, and the at least one stopper 149 can prevent collision with the cover member 300 when the housing 140 moves in the second direction and / or the third direction.

[0138] To prevent the lower surface of the housing 140 from colliding with the base 210 and / or the second circuit board 250, the housing 140 can further include a stopper (not shown) protruding from the lower surface.

[0139] At an initial position of the AF moving member, the first magnets 130-1 to 130-4 can be arranged in the housing 140 to at least partially overlap the first coil 120 in a direction perpendicular to the optical axis OA.

[0140] For example, the first magnets 130-1 to 130-4 can be inserted or arranged in one receiving portion 141a of the first side portion 141 of the housing 140.

[0141] According to another embodiment, the first magnets 130-1 to 130-4 can be arranged on an outer surface of the first side portion 141 of the housing 140, or can be arranged on an inner surface or an outer surface of the second side portion 142 of the housing 140.

[0142] Each of the first magnets 130-1 to 130-4 can have a shape, such as a cuboid, corresponding to the first side portion 141 of the housing 140, but embodiments are not limited thereto, and according to another embodiment, one surface of the first magnet facing one surface of the first coil 120 can have a curvature corresponding to one surface of the first coil 120 or the same curvature.

[0143] Each of the first magnets 130 can be configured as one body, and can be configured such that a surface facing the first coil 120 is an S pole and an opposite surface is an N pole. However, embodiments are not limited thereto, and the surface of each of the first magnets 130-1 to 130-4 facing the first coil 120 can be an N pole, and the opposite surface can be an S pole.

[0144] The first magnets 130-1 to 130-4 can be arranged or mounted on the first side portion of the housing 140 in such a manner that at least two of the first magnets face each other.

[0145] For example, two pairs of first magnets 130-1 to 130-4 facing each other can be arranged on the first side portion 141 of the housing 140. In this case, the planar shape of each of the first magnets 130-1 to 130-4 can be generally rectangular, or alternatively triangular or rhomboid.

[0146] According to another embodiment, only one pair of first magnets facing each other can be arranged on the first side portions of the housing 140 facing each other.

[0147] Figure 7 It is along Figure 2 The image shows a cross-sectional view of the lens moving device 100 taken in the direction AB. Figure 8 It is along Figure 2 The image shows a cross-sectional view of the lens moving device 100 taken in the direction CD shown.

[0148] Reference Figure 7 and Figure 8 Each of the second magnet 180 and the third magnet 185 may not overlap with the first coil 120 in a direction 701 perpendicular to the optical axis OA, but the implementation is not limited to this.

[0149] At the initial position of the AF moving part, the second magnet 180 can overlap or align with the third magnets 180 and 185 in a direction perpendicular to the optical axis OA.

[0150] At the initial position of the AF moving component, the first position sensor 170 may overlap with each of the second magnet 180 and the third magnet 185 in a direction perpendicular to the optical axis OA, but the implementation is not limited to this. According to another embodiment, the first position sensor 170 may not overlap with at least one of the second magnet 180 and the third magnet 185 in a direction perpendicular to the optical axis OA.

[0151] The first position sensor 170 and the first circuit board 190 will be described below.

[0152] Figure 6a yes Figure 5 An enlarged view of the first circuit board 190 and the first position sensor 170 shown. Figure 6b It's a diagram. Figure 6a A diagram showing the configuration of the first position sensor 170.

[0153] Reference Figure 6a and Figure 6bThe first position sensor 170 can be mounted on a first circuit board 190 disposed in the housing 140, and can be fixed to the housing 140. For example, the first position sensor 170 can move together with the housing 140 while hand-shake correction is performed.

[0154] The first position sensor 170 can detect a magnetic field intensity of the second magnet 180 mounted on the coil holder 110 as the coil holder 110 moves, and can output an output signal based on a detection result.

[0155] In an embodiment of the disclosure, Figure 1 In an embodiment of the disclosure, the first position sensor 170 can detect a magnetic field intensity of the second magnet 180 to detect displacement of the coil holder 110, but the embodiment is not limited thereto, and according to another embodiment, the second magnet 180 and the third magnet 185 can be omitted, an output signal based on a detection result of a magnetic field intensity of the first magnet of the first position sensor 170 can be generated, and the output signal can be used to detect or control displacement of the coil holder 110.

[0156] The first position sensor 170 can be disposed on the first circuit board 190. For example, the first position sensor 170 can be disposed on a lower surface of the first circuit board 170. Here, the lower surface of the first circuit board 190 can be a surface of the first circuit board 190 that points to an upper surface of the housing 140 when the first circuit board 190 is mounted on the housing 140 or a surface that contacts the first mounting groove 141-1 of the housing 140.

[0157] Referring to Figure 6b The first position sensor 170 can include a Hall sensor 61 and a driver 62.

[0158] For example, the Hall sensor 61 can be formed of a silicon-based material, and an output VH of the Hall sensor 61 can increase as a surrounding temperature increases.

[0159] According to another embodiment, the Hall sensor 61 can be formed of GaAs, and an output VH of the Hall sensor 61 can have a slope of about -0.06% / °C with respect to a surrounding temperature.

[0160] The first position sensor 170 can further include a temperature sensing device 63 for detecting a surrounding temperature. The temperature sensing device 63 can output a temperature detection signal Ts to the driver 62 based on a measurement result of a surrounding temperature of the first position sensor 170.

[0161] For example, the Hall sensor 61 of the first position sensor 190 can generate an output based on a detection result of a magnetic force intensity of the first magnet 130-1 to 130-4.

[0162] The driver 62 can output a drive signal dV for driving the Hall sensor 61 and a drive signal Id1 for driving the first coil 120.

[0163] For example, the driver 62 can receive a clock signal SCL, a data signal SDA, and power signals VCC and GND from the controller 830 through data communication using a protocol, such as I2C communication.

[0164] The driver 62 can generate a drive signal dV for driving the Hall sensor 61 and a drive signal Id1 for driving the first coil 120 by using the clock signal SCL and the power signals VCC and GND.

[0165] The driver 62 can receive an output VH of the Hall sensor 61 and can transmit a clock signal SCL and a data signal SDA regarding the output VH of the Hall sensor 61 to the controller 830 through data communication using a protocol, such as I2C communication.

[0166] The driver 62 can receive a temperature detection signal Ts measured by the temperature sensing device 63 and can transmit the temperature detection signal Ts to the controller 830 through data communication using a protocol, such as I2C communication.

[0167] The controller 830 can compensate for a temperature of an output VH of the Hall sensor 61 based on a change in the ambient temperature measured by the temperature sensing device 63 of the first position sensor 170.

[0168] For example, when a drive signal dV or a bias signal of the Hall sensor 61 of the first position sensor 170 is 1 mA, the output VH of the Hall sensor 61 can be -20 mV to +20 mV.

[0169] In a case where the temperature compensation of the output VH of the Hall sensor 61 has a negative slope with respect to a change in the ambient temperature, the output VH of the Hall sensor 61 of the first position sensor 170 can be 0 mV to +30 mV.

[0170] In a case where the output of the Hall sensor 61 of the first position sensor 170 is indicated on an xy coordinate system, the output range of the Hall sensor 61 of the first position sensor 170 can be a first quadrant (for example, 0 mV to +30 mV) for the following reasons.

[0171] The outputs of the Hall sensors 61 of the first quadrant and the outputs of the Hall sensors 61 of the third quadrant of the xy coordinate system move in opposite directions as the ambient temperature changes, and thus the accuracy and reliability of the Hall sensors can decrease in the case where both the first quadrant and the third quadrant are used as the AF driving control period. To accurately compensate for changes in the ambient temperature, the predetermined range of the first quadrant can be the output range of the Hall sensors 61 of the first position sensor 170.

[0172] The first position sensor 170 can include first to third terminals for a clock signal SCL and two power signals VCC and GND, a fourth terminal for data SDA, and fifth and sixth terminals for providing a driving signal to the first coil 120.

[0173] The first to sixth terminals of the first position sensor 170 can be electrically connected to respective ones of pads 190-1 to 190-6 of the first circuit board 190.

[0174] The first circuit board 190 can include first to sixth pads 190-1 to 190-6, and a circuit pattern or wiring (not shown) disposed on an upper surface of the first circuit board 190.

[0175] Referring to Figure 6a The first circuit board 190 can include a body portion 190-1, a first curved portion 190-2 curved at one end portion of the body portion 190-1, and a second curved portion 190-3 curved at the other end portion of the body portion 190-2.

[0176] For example, the first curved portion 190-2 and the second curved portion 190-3 can be curved in the same direction based on the body portion 190-1.

[0177] For example, the first curved portion 190-2 and the second curved portion 190-3 of the first circuit board 190 disposed on the first mounting groove 141-1 of the housing 140 can be curved in a direction toward an edge of the second side portion 142 of the housing 140 based on the body portion 190-1.

[0178] For example, the first circuit board 190 disposed in the housing 140 can include a first side surface 6a directed in the optical axis OA direction and a second side surface 6b located at an opposite side of the first side surface 6a, the first side surface 6a of the first circuit board 190 can be flat, and the second side surface 6b of the first circuit board 190 can be curved.

[0179] In Figure 6aIn the meantime, in order to easily combine with the upper springs, the first circuit board 190 can have curved opposite end portions, but embodiments are not limited thereto. According to another embodiment, the first circuit board 190 can be formed in a straight line rather than curved.

[0180] The first to sixth pads 190-1 to 190-6 can be spaced apart from the upper surface of the first circuit board 190 in order to facilitate conductive connection with the upper elastic members 150.

[0181] For example, the first pad 190-1 can be disposed at one end portion of the first curved portion 190-2 of the first circuit board 190, the sixth pad 190-6 can be disposed at one end portion of the second curved portion 190-3 of the first circuit board 190, and the second to fifth pads 190-2 to 190-5 can be spaced apart from each other between the first pad 190-1 and the sixth pad 190-6.

[0182] In order to secure a space for combination with the first to sixth upper springs on the upper surface of the first circuit board 190, the first to sixth pads 190-1 to 190-6 can be disposed to contact the second side surface 6b of the first circuit board 190.

[0183] The area of each of the first and sixth pads 190-1 and 190-6 can be greater than the area of each of the second to fifth pads 190-2 to 190-5, but embodiments are not limited thereto.

[0184] The upper springs combined to the first and sixth pads 190-1 and 190-6 are combined to the housing 140 at a longer distance than the upper springs combined to the second to fifth pads 190-2 to 190-5, and thus the area of the pads can be increased to increase the combination force with the upper elastic members.

[0185] The circuit pattern or wiring (not shown) of the first circuit board 190 can electrically connect the first to sixth pads 190-1 to 190-6 to the first to sixth terminals of the first position sensor 170, and the circuit pattern or wiring of the first circuit board 190 can be provided on at least one of the lower surface and the upper surface of the first circuit board 190, but embodiments are not limited thereto.

[0186] For example, the first circuit board 190 can be a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0187] According to another embodiment, the first position sensor 170 can be disposed on the upper surface of the first circuit board 190, and the pads 190-1 to 190-4 can be disposed on the lower surface of the first circuit board 190.

[0188] The first to sixth pads 190-1 to 190-6 of the first circuit board 190 can be electrically connected to the terminals of the second circuit board 250 through the upper elastic member 150 and the support member 220, and thus the first position sensor 170 can be electrically connected to the second circuit board 250.

[0189] Hereinafter, the upper elastic member 150, the lower elastic member 160, and the support member 220 will be described.

[0190] Figure 9a is a plan view of the upper elastic member 150 shown in FIG. 1. Figure 1 is a plan view of the upper elastic member 150 shown in FIG. 1. Figure 9b is an enlarged view of the first outer frame 152a of the sixth spring 150-6 and the seventh spring 150-7 shown in FIG. 1. Figure 9a is an enlarged view of the first outer frame 152a of the sixth spring 150-6 and the seventh spring 150-7 shown in FIG. 1. Figure 9c is a plan view of the lower elastic member 160 shown in FIG. 1. Figure 1 is a plan view of the lower elastic member 160 shown in FIG. 1. Figure 10 is an assembled perspective view of the upper elastic member 150, the lower elastic member 160, the base 210, the support member 220, the second coil 230, and the second circuit board 250 shown in FIG. 1. Figure 1 is an assembled perspective view of the upper elastic member 150, the lower elastic member 160, the base 210, the support member 220, the second coil 230, and the second circuit board 250 shown in FIG. 1. Figure 11 is an exploded perspective view of the second coil 230, the second circuit board 250, the base 210, and the second position sensor 240 shown in FIG. 1. Figure 1 is an exploded perspective view of the second coil 230, the second circuit board 250, the base 210, and the second position sensor 240 shown in FIG. 1.

[0191] The upper elastic member 150 and the lower elastic member 160 can support the coil holder 110 via elasticity.

[0192] The upper elastic member 150 can be coupled to the upper portion of the coil holder 110 and the upper portion of the housing 140, and the upper elastic member 150 can support the upper portion of the coil holder 110 and the upper portion of the housing 140. The lower elastic member 160 can be coupled to the lower portion of the coil holder 110 and the lower portion of the housing 140, and the lower elastic member 160 can support the lower portion of the coil holder 110 and the lower portion of the housing 140.

[0193] The support member 220 can support the housing 140 to move in a direction perpendicular to the optical axis with respect to the base 210, and the support member 220 can electrically connect at least one of the upper elastic member 150 or the lower elastic member 160 to the second circuit board 250.

[0194] Referring to Figure 9a , the upper elastic member 150 can include a plurality of upper springs 150-1 to 150-8 that are electrically separated from each other. Figure 9a Eight upper springs that are electrically separated from each other are illustrated, but embodiments are not limited thereto.

[0195] The upper elastic members 150 can include first to sixth upper springs 150-1 to 150-6 directly coupled to and electrically connected to first to sixth pads 191-1 to 191-6 of the first circuit board 190, and seventh and eighth upper springs 150-7 and 150-8 not electrically connected to the first to sixth pads 191-1 to 191-6 of the first circuit board 190.

[0196] The plurality of upper springs can be arranged at the first corner portion of the housing 140 in which the first circuit board 190 is arranged, and at least one upper spring can be arranged at each of a second to fourth corner portion among the remaining corner portions other than the first corner portion.

[0197] Referring to Figure 2 , Figure 5 , Figure 9a and Figure 10 , four upper springs 150-1 to 150-4 separated or spaced apart from each other can be arranged at the first corner portion of the housing 140.

[0198] Two upper springs 150-5 and 150-8 separated or spaced apart from each other can be arranged at the second corner portion of the housing 140.

[0199] In order to easily couple the upper springs 150-1 to 150-6 to the six pads 190-1 to 190-6 of the first circuit board 190, one upper spring 150-6 can be arranged at the third corner portion of the housing 140, and one upper spring can be arranged at the fourth corner portion.

[0200] Any one of the upper springs 150-1, 150-6, 150-7, and 150-8 arranged at the first to fourth corner portions of the housing 140 can be coupled to the upper portion of the housing 140 and the upper portion of the bobbin 110, respectively.

[0201] At least one of the first to fourth upper springs 150-1 to 150-4 and at least one of the fifth to eighth upper springs 150-5 to 150-8 can include a first inner frame 151 coupled to the bobbin 110, a first outer frame 152 coupled to a corresponding one of the first to fourth corner portions of the housing 140a, and a first frame connection portion 153 for connecting the first inner frame 151 and the first outer frame 152.

[0202] For example, any one of the upper springs 150-1, 150-6, 150-7, and 150-8 disposed at the first to fourth corner portions of the housing 140 can include a first inner frame 151 coupled to the yoke 110, a first outer frame 152 coupled to the housing 140, and a first frame connecting portion 153 for connecting the first inner frame 151 and the first outer frame 152, respectively.

[0203] For example, a through-hole h1 for coupling with the upper support protrusion 113a of the yoke 110 can be provided in the first inner frame 151, and a through-hole h2 for coupling with the upper support protrusion 143 of the housing 140 can be provided in the first outer frame 152.

[0204] For example, the first to fourth upper springs 150-1 to 150-4 can be spaced apart from each other at the first corner portion of the housing 140 in which the first circuit board 190 is disposed, and the first to fourth upper springs 150-1 to 150-4 can be coupled to the first corner portion of the housing 140.

[0205] For example, the second and third upper springs 150-2 and 150-3 can be positioned or disposed between the first and fourth upper springs 150-1 and 150-4.

[0206] For example, the fifth and sixth upper springs 150-5 and 150-6 can be disposed at respective ones of the second and third corner portions adjacent to the first corner portion, and the fifth and sixth upper springs 150-5 and 150-6 can be coupled to the respective ones of the second and third corner portions.

[0207] For example, the seventh upper spring 150-7 can be disposed at the fourth corner portion of the housing 140 facing the first corner portion in a diagonal direction, and the seventh upper spring 150-7 can be coupled to the fourth corner portion.

[0208] For example, the eighth upper spring 150-8 can be disposed at any one of the second and third corner portions, and the eighth upper spring 150-8 can be coupled to any one of the second and third corner portions.

[0209] Referring to Figure 9a Each of the first to fourth upper springs 150-1 to 150-4 disposed at the first corner portion of the housing 140 can include first coupling portions 410a to 410d coupled to the first corner portion of the housing 140.

[0210] Each of the first to fourth upper springs 150-1 to 150-4 can include a contact portion P2 to P5 that contacts or connects to a corresponding one of the first to sixth pads 191-1 to 191-6 of the first circuit board 190.

[0211] Each of the contact portions P2 to P5 can extend or protrude from one end of a corresponding one of the first to fourth coupling portions 410a to 410d, and can be bonded to a corresponding one pad of the first circuit board 190 via soldering or a conductive adhesive member.

[0212] The second and third upper springs 150-2 and 150-3 can be disposed between the first and fourth upper springs 150-1 and 150-4. Each of the second and third upper springs 150-2 and 150-3 can include second coupling portions 420a and 420b coupled to the second and third support members 220-2 and 220-3, and connecting portions 430a and 430b for connecting the first and second coupling portions 410b and 410c and the second coupling portions 420a and 420b to each other.

[0213] The first outer frame 152 of each of the fifth to eighth springs 150-5 to 150-8 disposed at the second to fourth corner portions of the housing 140 can include first coupling portions 510, 560, and 570 coupled to the second to fourth corner portions of the housing 140, second coupling portions 520a, 520b, 570a, and 570b coupled to the fifth to eighth support members 220-5 to 220-8, and connecting portions 530a, 530b, 580a, and 580b for connecting the first coupling portions 510, 560, and 570 and the second coupling portions 520a, 520b, 570a, and 570b to each other.

[0214] The fifth to eighth support members 220-5 to 220-8 can be electrically connected to the second coupling portions 520a, 520b, 570a, and 570b via a soldering or conductive adhesive member (e.g., conductive epoxy) 901 (refer to FIG. 9). Figure 10

[0215] ​Each of the first coupling portions 410a to 410d, 510, 560, and 570 of each of the first outer frames 152, 152a, and 152b of the first to fourth upper springs 150-1 to 150-4 and the first outer frames 152, 152a, and 152b of the fifth to eighth upper springs 150-5 to 150-8 can include one or more coupling regions (e.g., S1 to S8) coupled to the housing 140.

[0216] In Figure 9a , the coupling regions S1 to S8 can be configured in the form of a through-hole, and the through-hole can be configured in the second coupling portions 420a, 420b, 520a, 520b, 570a, and 570b and the third coupling portion 590, but the embodiment is not limited thereto, and according to another embodiment, the coupling regions S1 to S8 can be configured in various shapes for sufficient coupling with the housing 140, for example, in the form of a groove.

[0217] The connection portions 430a, 430b, 530a, 530b, 580a, and 580b can be bent at least once, and a width W2 of the connection portions 430a, 430b, 530a, 530b, 580a, and 580b can be smaller than a width W1 of the first frame connection portion 153 of the upper elastic member 150 (W2 < W1).

[0218] Due to W2 < W1, the connection portions 430a, 430b, 530a, 530b, 580a, and 580b can be easily moved in the optical axis direction, and thus stress applied to the upper elastic member 150 and stress applied to the support member 220 can be dispersed.

[0219] According to an embodiment, the width W1 of the first frame connection portion 153 of the upper elastic member 150 can be greater than the width of the second frame connection portions 163-1 and 163-2 of the lower elastic member 160, but the embodiment is not limited thereto.

[0220] For example, the first outer frames 152 of the sixth upper spring 150-6 and the seventh upper spring 150-6 can be symmetrical in the left-right direction based on the reference lines 501 and 502.

[0221] For example, the first outer frames of the fifth upper spring 150-5 and the eighth upper spring 150-8 can be symmetrical in the left-right direction based on the reference line 501.

[0222] The reference line 501 can be a straight line passing through the center point 101 (refer to Figure 9a ) and edges of the second corner portion and the third corner portion of the housing 140 facing each other, and the reference line 502 can be a straight line passing through the center point 101 (refer to Figure 9a) and a straight line of edges of first and fourth corner portions of the housing 140 facing each other. For example, the center point 101 can be a center of the coil holder 110 or a center of the housing 140, and the edges of the housing 140 can be the stoppers 144-1 to 144-4.

[0223] For example, in order to balance and support the housing 140 while preventing the housing 140 from tilting to one side, the coupling regions S1 to S8 of the first to eighth upper springs 150-1 to 150-8 can be symmetrical in the left and right directions based on the reference lines 501 and 502, but embodiments are not limited thereto.

[0224] The fifth upper spring 150-5 disposed at the second corner portion can include a first upper extension frame 154a extending from one end of the first coupling portion 570 of the first outer frame 152a toward the first corner portion. For example, the first upper extension frame 154a can have one end connected to the first outer frame 152a and the other end coupled to a land 190-1 of the first circuit board 190.

[0225] The sixth upper spring 160-6 disposed at the third corner portion can include a second upper extension frame 154b extending from one end of the first coupling portion 510 of the first outer frame 152 toward the first corner portion. For example, the second upper extension frame 154b can have one end connected to the first outer frame 152 and the other end coupled to a land 190-6 of the first circuit board 190.

[0226] The contact portions P1 and P6 contacting or connected to respective ones of the first to sixth lands 191-1 to 191-6 of the first circuit board 190 can be provided on each of the first and second upper extension frames 154a and 154b.

[0227] For example, each of the contact portions P1 and P6 can extend or protrude from one end of the respective one of the first and second upper extension frames 154a and 154b, and can be bonded to the respective one of the first and sixth lands 191-1 and 191-6 of the first circuit board 190 via soldering or a conductive adhesive member. For example, a width of each of the contact portions P1 to P6 can be smaller than a width of the outer frame of the respective upper spring, but embodiments are not limited thereto.

[0228] A through-hole h3 coupled to an upper support protrusion of the housing 140 can be provided in each of the first and second upper extension frames 154a and 154b.

[0229] The first coupling portions 410a to 410d, 510, 560, and 570 can contact the upper surface of the corner portion 142 of the case 140 and can be supported by the corner portion 142 of the case 140. On the other hand, the connection portions 430a, 430b, 530a, 530b, 580a, and 580b can not contact the upper surface of the case 140 and can be spaced apart from the case 140. In order to prevent oscillation due to vibration, a damper (not shown) can be filled in the empty space between the connection portions 430a, 430b, 530a, 530b, 580a, and 580b and the case 140.

[0230] Referring to Figure 9c The lower elastic member 160 can include a plurality of lower springs 160-1 and 160-2.

[0231] For example, each of the first and second lower springs 160-1 and 160-2 can include second inner frames 161-1 and 161-2 coupled or fixed to the lower portion of the coil former 110, second outer frames 162-1 to 162-3 coupled or fixed to the lower portion of the case 140, second frame connection portions 163-1 and 163-2 for connecting the second inner frames 161-1 and 161-2 and the second outer frames 162-1 and 162-2 to each other, and connection frames 164-1 and 164-2 connecting the second outer frames to each other.

[0232] The width of each of the connection frames 164-1 and 164-2 can be smaller than the width of each of the first inner frames, but embodiments are not limited thereto.

[0233] In order to prevent spatial interference with the second coils 230 and the first magnets 130-1 to 130-4, the connection frames 164-1 and 164-2 can be positioned outside the second coils 230-1 to 230-4 and the first magnets 130-1 to 130-4 based on the second coils 230-1 to 230-4 and the first magnets 130-1 to 130-4.

[0234] In this case, the outside of the second coils 230-1 to 230-4 and the first magnets 130-1 to 130-4 can be the side opposite to the region where the center of the coil former 110 or the center of the case 140 is located based on the second coils 230-1 to 230-4 and the first magnets 130-1 to 130-4.

[0235] For example, the connection frames 164-1 and 164-2 can be positioned not to overlap the second coils 230-1 through 230-4 in the optical axis direction, but embodiments are not limited thereto, and according to another embodiment, at least a portion of the connection frames 164-1 and 164-2 can be aligned with or overlap the second coils 230-1 through 230-4 in the optical axis direction.

[0236] A first connection protrusion 165-1 coupled to the other end of the first support member 220-1 can be provided at a portion where the connection frame 164-1 of the first lower spring 160-1 is connected with the second outer frame 162-2.

[0237] A second connection protrusion 165-2 coupled to the other end of the fourth support member 220-4 can be provided at a portion where the connection frame of the second lower spring 160-2 is connected with the second outer frame.

[0238] A through-hole 165a for coupling with the other end of a corresponding one of the first support member 220-1 and the fourth support member 220-4 can be provided in each of the first connection protrusion 165-1 and the second connection protrusion 165-2.

[0239] The upper springs 150-1 through 150-8 and the lower springs 160-1 and 160-2 can each be configured as a leaf spring, but embodiments are not limited thereto, and the upper springs 150-1 through 150-8 and the lower springs 160-1 and 160-2 can each be implemented as a coil spring or the like.

[0240] Hereinafter, the support members 220-1 through 220-8 will be described.

[0241] The support members 220-1 through 220-8 can be provided corresponding to the corner portions 142 of the housing 140, can connect two of the upper springs 150-1 through 150-8 (e.g., 150-1 and 150-4) with the first lower spring 160-1 and the second lower spring 160-2 to each other, and can connect the other four of the upper springs 150-1 through 150-8 (e.g., 150-2, 150-3, 150-5, and 150-6) to the second circuit board 250.

[0242] For example, the support members 220-2 and 220-3 can connect two of the four upper springs 150-1 through 150-4 (e.g., 150-2 and 150-3) positioned at the first corner portion with the second circuit board 250 to each other.

[0243] For example, the support members 220-1 and 220-4 can connect the other two (e.g., 150-1 and 150-4) of the upper springs 150-1 to 150-4 positioned at the first corner portion to the first lower spring 160-1 and the second lower spring 160-2.

[0244] The fifth support member 220-5 can connect the upper spring 150-5 positioned at the second corner portion to the second circuit board 250 to each other.

[0245] The sixth support member 220-6 can connect the upper spring 150-6 positioned at the third corner portion to the second circuit board 250 to each other.

[0246] The seventh support member 220-7 can connect the upper spring 150-7 positioned at the fourth corner portion to the second circuit board 250 to each other.

[0247] The eighth support member 220-8 can connect the upper spring 150-8 positioned at the second corner portion to the second circuit board 250 to each other.

[0248] The support members 220-1 to 220-8 can electrically connect at least one of the upper springs positioned at at least one of the corner portions to the circuit board to each other.

[0249] For example, the support members 220-2, 220-3, 220-5, and 220-6 can electrically connect the upper springs 150-2, 150-3, 150-5, and 150-6 to the second circuit board 250 to each other.

[0250] The support members 220-1 to 220-8 can be spaced apart from the housing 140 and can not be fixed to the housing 140, or instead, one end portion of the support members 220-2, 220-3, and 220-5 to 220-8 can be directly connected or bonded to the second coupling portions 420a, 420b, 520a, 520b, 570a, and 570b of the second upper spring 150-2, the third upper spring 150-3, and the fifth upper spring 150-5 to the eighth upper spring 150-8.

[0251] The other end portion of the second support member 220-2, the third support member 220-3, and the fifth support member 220-5 to the eighth support member 220-8 can be directly connected or bonded to the second circuit board 250.

[0252] One end portion of the first support member 220-1 and the fourth support member 220-4 can be directly connected or bonded to the third coupling portions 590 of the first upper spring 220-1 and the fourth upper spring 220-4.

[0253] The other end of the first and fourth support members 220-1 and 220-4 can be directly connected or bonded to the through hole 165a provided in the first and second connection protrusions 165-1 and 165-2 of the lower spring 160-1.

[0254] A single contact can be formed between the second coupling portions 420a, 420b, 520a, 520b, and 570b and the first coupling portions 410b, 410c, 510, 560, and 570 by the connection portions 430a, 430b, 530a, 530b, 580a, and 580b.

[0255] For example, the second, third, and fifth to eighth support members 220-2, 220-3, and 220-5 to 220-8 can pass through the through holes 147 (see FIG. 2) provided in the corner portions 142 of the housing 140, but the support members 220-1 and 220-4 can be disposed adjacent to the boundary line between the first side portion 141 and the corner portion 142 of the housing 140 and can not pass through the corner portion 142. Figure 4

[0256] Each of the first to fourth support members 220-1 to 220-4 can electrically connect and independently connect the first to fourth upper springs 150-1 to 150-4 to the second circuit board 250.

[0257] In order to balance and support the housing 140 via a symmetrical arrangement, each of the sixth and seventh support members 220-6 and 220-7 can include two support members 220-6a and 220-6b or 220-7a and 220-7b connected or bonded to the sixth or seventh upper elastic member 150-6 or 150-7, and at least one of the two support members 220-6a and 220-6b or 220-7a and 220-7b can be electrically connected to the second circuit board 250.

[0258] The first coil 120 can be directly connected or bonded to a corresponding one of the second inner frames of the first and second lower springs 160-1 and 160-2.

[0259] The four pads 191-1, 191-3, 191-4, and 191-6 of the first circuit board 190 can be electrically connected to the second circuit board 250 by the four upper springs 150-5, 150-2, 150-3, and 150-6 corresponding to the four pads 191-1, 191-3, 191-4, and 191-6 and the support members 220-5, 220-2, 220-3, and 220-6 electrically connected to the four upper springs 150-5, 150-2, 150-3, and 150-6. ​

[0260] The two pads 191-2 and 191-5 of the first circuit board 190 can be electrically connected to the first coil 120 through the two upper springs 150-1 and 150-4 corresponding to the two pads 191-2 and 191-5, the support members 220-1 and 220-4 electrically connected to the two upper springs 150-1 and 150-4, and the first lower spring 160-1 and the second lower spring 160-2.

[0261] The six pads 191-1 to 191-6 of the first circuit board 190 can be electrically connected to the first position sensor 190, and four pads (e.g., 191-1, 191-3, 191-4, and 191-6) among the six pads 191-1 to 191-6 can be electrically connected to the second circuit board 250. A clock signal SCL for data communication, and power signals VCC and GND can be transmitted and received between the first position sensor 170 and the second circuit board 250 through the four pads (e.g., 191-1, 191-3, 191-4, and 191-6) of the first circuit board 190, the upper springs 150-2, 150-3, 150-5, and 150-6 connected to the four pads, and the support members 220-2, 220-3, 220-5, and 220-6.

[0262] The support member 220 can be implemented as a member for elastic support, such as a suspension wire, a plate spring, or a coil spring. According to another embodiment, the support member 220 can be incorporated into the upper elastic member 150.

[0263] In an embodiment of the Figure 10 In an embodiment of the

[0264] According to another embodiment, the first coil 120 can be incorporated into the first inner frame of two upper springs among the upper springs 150-2, 150-5, and 150-6, and the first support member 220-1 and the fourth support member 220-4 can be omitted.

[0265] According to another embodiment, one end of the first coil 120 can be incorporated into the second inner frame of any one of the first lower spring 160-1 and the second lower spring 160-2, the other end of the first coil 120 can be incorporated into the first inner frame of any one of the upper springs 150-2, 150-5, and 150-6, and at least one of the first support member 220-1 and the fourth support member 220-4 can be configured.

[0266] Hereinafter, the base 210, the second circuit board 250, and the second coil 230 will be described.

[0267] Referring to Figure 11 The base 210 can include a hollow portion corresponding to the hollow portion of the coil holder 110 or / and the hollow portion of the housing 140, and the base 210 can have the same shape or a corresponding shape, for example, a rectangular shape, as the cover member 300.

[0268] In the case where the cover member 300 is adhered and fixed, the base 210 can include a stepped portion 211 coated with an adhesive. In this case, the stepped portion 211 can guide the cover member 300 coupled to the upper side portion of the stepped portion 211, and the lower end portion of the side plate of the cover member 300 can contact the stepped portion 211.

[0269] The stepped portion 211 of the base 210 and the lower end portion of the side plate of the cover member 300 can be adhered and fixed by an adhesive or the like.

[0270] A support portion 255 can be provided in a region of the base 210 facing the terminal 251 of the second circuit board 250. The support portion 255 can support the terminal surface 253 of the second circuit board 250 on which the terminal 251 is formed.

[0271] The base 210 can have a recess 212 in a region corresponding to the edge of the cover member 300. In the case where the edge of the cover member 300 protrudes, the protruding portion of the cover member 300 can be coupled to the base 210 in the second recess 212.

[0272] Accommodation grooves 215-1 and 215-2 can be configured on the upper surface of the base 210, and the second position sensors 240 including the image stabilizer (OIS) position sensors 240a and 240b are to be disposed in the accommodation grooves 215-1 and 215-2. An accommodation portion (not shown) of the optical filter 610 in which the camera module 200 is mounted can be formed on the lower surface of the base 210.

[0273] The second coil 230 can be disposed above the second circuit board 250, and the OIS position sensors 240a and 240b can be disposed in the accommodation grooves 215-1 and 215-2 of the base 210 positioned below the second circuit board 250.

[0274] The OIS position sensors 240a and 240b can detect displacement of the OIS moving member in a direction perpendicular to the optical axis. Here, the OIS moving member can include the AF moving member and a member mounted in the housing 140.

[0275] For example, the OIS moving part can include the AF moving part and the housing 140, and according to an embodiment, the OIS moving part can further include the magnets 130-1 to 130-4. For example, the AF moving part can include the coil holder 110, and a part mounted on the coil holder 110 and moving together with the coil holder 110. For example, the AF moving part can include the coil holder 110, a lens (not shown) mounted on the coil holder 110, and the first coil 120.

[0276] The second circuit board 250 can be disposed below the coil holder 110, can be disposed on the upper surface of the base 210, and can include a hollow portion corresponding to the hollow portion of the coil holder 110, the hollow portion of the housing 140, and / or the hollow portion of the base 210. The shape of the outer peripheral surface of the second circuit board 250 can have the same or corresponding shape as the upper surface of the base 210, for example, a rectangular shape.

[0277] The second circuit board 250 can include at least one terminal surface 253 bent from the upper surface, and a plurality of terminals 251 or pins for receiving an electrical signal from the outside can be disposed on the terminal surface 253.

[0278] The second coil 230 can be positioned between the coil holder and the second circuit board 250, and the second coil 230 can be disposed above the second circuit board 250 to face the magnets 130-1 to 130-4 fixed to the housing 140 in the optical axis direction.

[0279] The second coil 230 can include four second coils 230-1 to 230-4 mounted at four sides of a circuit member 231 shaped like a rectangle. For example, the second coil 230 can include two second coils 230-1 and 230-3 for the second direction and two second coils 230-2 and 230-4 for the third direction, but embodiments are not limited thereto. According to another embodiment, the second coil 230 can include only one second coil for the second direction and one second coil for the third direction, or can include four or more second coils.

[0280] The housing 140 can be moved in the second direction and / or the third direction, for example, the x-axis and / or the y-axis direction, by the interaction between the magnets 130-1 to 130-4 and the second coils 230-1 to 230-4 disposed to face each other, and thus can perform hand-shake correction.

[0281] In Figure 11In the embodiment, the second coils 230-1 to 230-4 can be configured on a circuit member 231 configured separately from the second circuit board 250, but the embodiment is not limited thereto, and according to another embodiment, the second coils 230-1 to 230-4 can be configured in the form of a coil block shaped like a ring, can be configured in the form of an FP coil, or can be implemented in the form of a circuit pattern formed on the second circuit board 250.

[0282] The second coil 230 can include a through-hole penetrated by the circuit member 231, and the support member can penetrate the through-hole and can be electrically connected to the second circuit board 250.

[0283] Each of the OIS position sensors 240a and 240b can be a Hall sensor, and can be any sensor as long as the sensor is capable of detecting a magnetic field strength. For example, each of the OIS position sensors 240a and 240b can be implemented in the form of a driver including a Hall sensor, or can be implemented as a position detection sensor such as a separate Hall sensor.

[0284] Through a plurality of terminals 251 mounted on a terminal surface 253 of the second circuit board 250, a signal SCL, SDA, VCC, and GND for data communication with the first position sensor 190 can be transmitted and received, a driving signal to be supplied to the OIS position sensors 240a and 240b can be received, and a signal output from the OIS position sensors 240a and 240b can be received and can be output to the outside.

[0285] According to the embodiment, the second circuit board 250 can be provided as a flexible printed circuit board (FPCB), but the embodiment is not limited thereto, and the terminals of the second circuit board 250 can be formed directly on a surface of the base 210 by using a surface electrode method or the like.

[0286] According to the embodiment, the driving signal is directly supplied to the first coil 120 from the first position sensor 170 through the support members 220-1 and 220-4, so the number of support members can be reduced and the electrical connection structure can be simplified compared to a case in which the driving signal is supplied to the first coil 120 through the second circuit board 250.

[0287] The first position sensor 170 is implemented as a driver integrated circuit (IC) for measuring temperature, so the output of the Hall sensor can be compensated to have a minimum change depending on a change in temperature or to have a constant slope depending on a change in temperature, thereby improving the accuracy of AF driving regardless of a change in temperature.

[0288] Figure 12 is a perspective view of a lens moving apparatus 100-1 according to another embodiment.Figure 13a is an exploded perspective view of a first circuit board 190a for mounting of the housing 140a and the first position sensor 170. Figure 13b is a coupled perspective view of the housing 140a, the first position sensor 170, and the first circuit board 190a. Figure 14 is a coupled perspective view of the first circuit board and the first position sensor. As Figures 1 to 11 the same reference numerals are used to designate the same parts, and the description of the same parts will be omitted or simplified.

[0289] Referring to Figures 12 to 14 , the lens moving apparatus 100-1 can include the coil holder 110, the first coil 120, the first magnet 130, the housing 140a, the upper elastic member 150A, the lower elastic member 160A, the first position sensor 170, the second magnet 180, the first circuit board 190a, and the support member 220A.

[0290] The lens moving apparatus 100-1 can further include the third magnet 185, the second coil 230, the second position sensor 240, the second circuit board 250, the base 210, and the cover member 300.

[0291] Referring to Figure 13a , the first circuit board 190a can include the body 3, the first and second protruding portions 4a and 4b, and the first to sixth pads 5a to 5f.

[0292] For example, the body 3 can be disposed in parallel with an inner surface of the first corner portion, and the first and second protruding portions 4a and 4b can be disposed in parallel with an upper surface of the first corner portion.

[0293] The body 3 can include an upper end portion 3a and a lower end portion 3b.

[0294] The upper end portion 3a of the body 3 can include a portion having a width or length in a horizontal direction, which decreases in a downward direction from above. This is because the body 3 needs to be stably accommodated or disposed in the housing 140a to prevent the body 3 coupled to the housing 140a from moving in a downward direction due to gravity.

[0295] The width or length of the lower end portion 3b of the body 3 in the horizontal direction can be constant, and can be equal to or less than the width or length of the upper end portion 3b of the body 3 in the horizontal direction.

[0296] The first position sensor 170 can be disposed on one surface (for example, a front surface) of the body 3.

[0297] In Figure 13a and Figure 13bIn the embodiment, the first position sensor 170 can be disposed on a front surface of the body 3 facing an outer surface of the coil holder 110, but the embodiment is not limited thereto. According to another embodiment, the first position sensor 170 can be disposed on a rear surface of the body 3 facing an inner surface of the housing 140, and in this case, the housing 140 can include a guide groove in which the first position sensor 170 is accommodated or disposed, and the guide groove is configured to move the first position sensor 170 in the optical axis direction as the coil holder 110 moves. In this case, the guide groove provided on the housing 140 can be configured to support or guide the first position sensor 170 to set an initial position of the first position sensor 170.

[0298] The first protrusion 4a can be disposed on one end of the upper end portion 3a of the body 3, and the second protrusion 4a can be disposed on the other end of the upper end portion 3a of the body 3.

[0299] For example, the first protrusion 4a can be connected to, can be bent at, and can protrude in a direction toward the rear surface from the front surface of the body 3 based on the rear surface of the body 3 on one end of the upper surface of the upper end portion 3a of the body 3.

[0300] For example, the second protrusion 4b can be connected to, can be bent at, and can protrude in a direction toward the rear surface from the front surface of the body 3 based on the rear surface of the body 3 on the other end of the upper surface of the body 3.

[0301] The second pad 5b and the third pad 5c can be spaced apart from the upper surface of the upper end portion 3a of the body 3, and each of the first pad 5a and the fourth pad 5d can be disposed on a respective one of the first protrusion 4a and the second protrusion 4b.

[0302] To facilitate the bonding between the first and second upper extension frames 154a and 154b and the first and fourth pads 5a and 5d, one end of each of the first and second protrusions 4a and 4b can be bent toward the first and second upper extension frames 154a and 154b.

[0303] To facilitate direct bonding with the first and second lower springs 160-1 and 160-2, the fifth and sixth pads 5e and 5f can be spaced apart from a lower surface of the lower end portion 3a of the body 3.

[0304] In Figure 5 In the embodiment, the housing 140 has a second mounting groove 141-2 in which the first position sensor 170 is disposed, but in Figure 12In the embodiment shown in FIG. 1, the housing 140a does not have a groove in which the first position sensor 170 is disposed, but embodiments are not limited thereto, and according to another embodiment, the housing can include a groove for disposing the first position sensor 170.

[0305] The accommodation groove in which the first circuit board 190a is accommodated or disposed can be disposed on an upper portion or an upper end of at least one of the corner portions 142 of the housing 140a.

[0306] For example, the accommodation groove of the housing 140a can include a first groove 141-1a and a second groove 141-2a.

[0307] For example, the first groove 141-1a can be provided at the first corner portion of the housing 140a, and the first groove 141-1a can dispose or accommodate the first protruding portion 4a and the second protruding portion 4b of the first circuit board 190a.

[0308] For example, the second groove 141-2a can be provided at the first corner portion of the housing 140a, and the second groove 141-2a can dispose or accommodate the body 3 of the first circuit board 190a.

[0309] The first groove 141-1a can have an open upper portion, a side surface, and a bottom, and can have an opening open toward the inner side of the housing 140.

[0310] The second groove 141-2a can be recessed from the bottom of the first groove 141-1a, and to easily mount the first position sensor 170, the second groove 141-2 can be configured in the form of a recess having an open upper portion, a side surface, and a bottom, and the second groove 141-2 can have an opening open toward the inner surface of the first corner portion 142 of the housing 140a.

[0311] The second groove 141-2 can include a portion having a diameter decreasing from the upper portion to the lower portion, thereby having a shape corresponding to or the same as the body 3 of the first circuit board 190a.

[0312] Figure 13a And Figure 13b The housing 140a shown in FIG. 1 can not include Figure 4 The stoppers 144-1 to 144-4 of the housing 140 shown in FIG. 1, but according to another embodiment, the housing 140a can include Figure 4 The stoppers 144-1 to 144-4 shown in FIG. 1.

[0313] Figure 13a And Figure 13b The through hole 47a of the housing 140a shown in FIG. 1 can be partially open, but embodiments are not limited thereto, and according to another embodiment, the through hole 47a can be configured in the form of Figure 4in the form of a through-hole shown in FIG. 1.

[0314] Figure 15 illustrates Figure 12 the upper elastic member 150A shown in FIG. 1. As Figure 9a the same reference numerals are used to refer to the same parts, and the description of Figure 9a may be applied to the same parts.

[0315] The upper elastic member 150A can include a plurality of upper springs 150-5 to 150-10.

[0316] In Figure 9a and Figure 10 the embodiment, the six pads 191-1 to 191-6 of the first circuit board 190 arranged at the first corner portion of the housing 140 are connected or coupled to the six upper springs, and thus the four upper springs 150-1 to 150-4 spaced apart from each other can be arranged at the first corner portion.

[0317] In Figure 15 , the four pads 5a to 5d of the first circuit board 190a arranged at the first corner portion of the housing 140a are directly connected or coupled to the four upper springs 150-3, 150-5, 150-9, and 150-10, and thus the two upper springs 150-9 and 150-10 spaced apart from each other can be arranged at the first corner portion.

[0318] For example, the upper springs 150-9 and 150-10 can be arranged at the first corner portion of the housing 140a and can be connected to the pads 5b and 5c of the first circuit board 190a.

[0319] The upper spring 150-3 can be arranged at the second corner portion of the housing 140a and can be connected to the pad 4b of the first circuit board 190a.

[0320] The upper spring 150-5 can be arranged at the third corner portion of the housing 140a and can be connected to the pad 4a of the first circuit board 190a.

[0321] The upper spring 150-7 can be arranged at the fourth corner portion of the housing 140a.

[0322] The first lower spring 160-1 and the second lower spring 160-2 can be directly connected, coupled, or coupled to the pads 5e and 5f.

[0323] For example, Figure 15 the upper spring 150-9 of the first upper spring 150-1 of Figure 9a may be configured by connecting the first coupling portion 410a of the first upper spring 150-1 and the first coupling portion 410b of the second upper spring 150-2 to each other, Figure 15The upper spring 150-10 can be configured by connecting the first coupling portion 410c of the first upper spring 150-3 and the first coupling portion 410d of the fourth upper spring 150-4, and the contact portions P2 and P5 can be omitted. Figure 9a The upper spring 150-10 can be configured by connecting the first coupling portion 410c of the first upper spring 150-3 and the first coupling portion 410d of the fourth upper spring 150-4, and the contact portions P2 and P5 can be omitted.

[0324] According to an embodiment of the present disclosure, the support member 220A can include the support members 220-2, 220-3, and 220-5 through 220-8, and the support members 220-1 and 220-4 for connecting the first upper spring 150-1 and the fourth upper spring 150-4 to the first lower spring 160-1 and the second lower spring 160-2 can be omitted. Figure 15 Figure 9a The support members 220-2, 220-3, and 220-5 through 220-8 can be disposed at the first corner to the fourth corner of the housing 140a, and can connect the upper springs 150-5 through 150-10 to the second circuit board 250 to each other, for example. The upper springs 150-5 through 150-10 and the second circuit board 250 can be electrically connected to each other through the support members 220-2, 220-3, and 220-5 through 220-8, for example.

[0325] Two support members 220-2 and 220-3 can be disposed at the first corner portion, and can connect respective ones of the upper springs 150-9 and 150-10 to the second circuit board 250, for example.

[0326] The support member 220-5 can be disposed at the second corner portion, and can connect the upper spring 150-5 to the second circuit board 250.

[0327] The support member 220-6 can be disposed at the third corner portion, and can connect the upper spring 150-6 to the second circuit board 250.

[0328] The support member 220-7 can be disposed at the fourth corner portion, and can connect the upper springs 150-7 and 150-8 to the second circuit board 250. For example, two support members spaced apart from each other can be disposed at each corner portion of the housing 140a.

[0329] The upper spring 150-10 can be coupled only to the first corner portion of the bobbin 110 and the housing 140a, and the upper spring 150-9 can be coupled to each of the first corner portion of the bobbin 110 and the housing 140a, for example, but embodiments are not limited thereto, and according to another embodiment, each of the upper springs 150-9 and 150-10 can be coupled to the bobbin 110 and the housing 140a.

[0330] The upper spring 150-10 can be coupled only to the first corner portion of the bobbin 110 and the housing 140a, and the upper spring 150-9 can be coupled to each of the first corner portion of the bobbin 110 and the housing 140a, for example, but embodiments are not limited thereto, and according to another embodiment, each of the upper springs 150-9 and 150-10 can be coupled to the bobbin 110 and the housing 140a.

[0331] ​At least one of the upper springs 150-5 to 150-10 (e.g., 150-6 to 150-8) can include a first inner frame 151 coupled to the coil holder 110, a first outer frame 152 coupled to a respective one of the first corner portion to the fourth corner portion, and a first frame connecting portion 153 for connecting the first inner frame 151 and the second outer frame 152.

[0332] For example, each of the upper springs 150-5 to 150-10 can include a first outer frame coupled to the housing 140 (e.g., the corner portion).

[0333] The first outer frame of each of the upper springs 150-5 to 150-10 can include a first coupling portion coupled to a respective one of the first corner portion to the fourth corner portion of the housing, a second coupling portion coupled to a respective one of the first support member to the fourth support member, and at least one connecting portion for connecting the first coupling portion and the second coupling portion.

[0334] Each of the first lower spring 160-1 and the second lower spring 160-2 can include a second inner frame 161 coupled to the coil holder 110, a second outer frame 162 coupled to the housing 140a, and a second frame connecting portion 163 for connecting the second inner frame 161 and the second outer frame 162 to each other. Each of the pads 5e and 5f of the first circuit board 190a can be coupled to a respective one of the first lower spring 161 and the second lower spring 162.

[0335] The upper spring 150-5 can include a first upper extension frame 154a having one end connected to the first outer frame of the upper spring 150-5 and the other end coupled to the pad 5a of the first circuit board 190a.

[0336] The upper spring 150-6 can include a second upper extension frame 154b having one end connected to the first outer frame of the upper spring 150-6 and the other end coupled to the pad 5d of the first circuit board 190a.

[0337] Figure 15 Each of the upper springs 150-5 to 150-10 can include a first coupling portion, a second coupling portion, and a connecting portion, and to Figure 9aThe description of the first coupling portions 510, 560, and 570, the second coupling portions 520a, 520b, 570a, and 570b, and the connection portions 530a, 530b, 580a, and 580b shown in FIGS. 1A to 1C can be applied to the first coupling portions, the second coupling portions, and the connection portions.

[0338] Figure 16 FIG. 1A illustrates a first coupling portion 510, a second coupling portion 520a, and a connection portion 530a of a first lower spring 160-1 according to an embodiment of the disclosure. Figure 12 FIG. 1A illustrates a first coupling portion 510, a second coupling portion 520a, and a connection portion 530a of a first lower spring 160-1 according to an embodiment of the disclosure. Figure 17 FIG. 1A illustrates a first coupling portion 510, a second coupling portion 520a, and a connection portion 530a of a first lower spring 160-1 according to an embodiment of the disclosure.

[0339] Referring to FIG. 1A, Figure 16 and Figure 17 , Figure 16 The lower elastic member 160A shown in FIG. 9C can be configured by omitting the first connection protrusion 165-1 and the second connection protrusion 165-2 from the lower elastic member 160 of FIG. 9C, and Figure 9c The description of the first coupling portions 510, 560, and 570, the second coupling portions 520a, 520b, 570a, and 570b, and the connection portions 530a, 530b, 580a, and 580b shown in FIGS. 1A to 1C can be applied to the first coupling portions, the second coupling portions, and the connection portions.

[0340] Each of the fifth pad 4e and the sixth pad 4f of the first circuit board 190a can be connected or bonded to the second outer frame 162-2 of a corresponding one of the first lower spring 160-1 and the second lower spring 160-2.

[0341] For example, each of the fifth pad 5e and the sixth pad 5f of the first circuit board 190a can be bonded to a through-hole h6 provided in the second outer frame 162-2 of a corresponding one of the first lower spring 160-1 and the second lower spring 160-2 via soldering or a conductive adhesive member.

[0342] Each of the fifth pad 4e and the sixth pad 4f of the first circuit board 190a can be electrically connected to a corresponding one of the first lower spring 160-1 and the second lower spring 160-2.

[0343] In an embodiment of the disclosure, Figure 12 In an embodiment of the disclosure, the first position sensor 170 can transmit a signal for data communication to the second circuit board 250 or can receive a signal from the second circuit board 250 through the four upper springs 150-5, 150-6, 150-9, and 150-10 and the four support members 220-2, 220-3, 220-5, and 220-6.

[0344] The first coil 120 can be electrically connected to the first and second lower springs 160-1 and 160-2 and the fifth and sixth pads 5e and 5f of the first circuit board 190a, and the first and second lower springs 160-1 and 160-2 can be directly connected to each other, so the first position sensor 170 and the first coil 120 can be electrically connected to each other, and the first position sensor 170 can directly provide a driving signal to the first coil 120.

[0345] Figure 18 is a perspective view of a lens moving apparatus 100-2 according to another embodiment. Figure 19 is Figure 18 a cross-sectional view of the lens moving apparatus 100-2 in a direction EF. Figure 20a illustrates Figure 18 the upper elastic member 150A shown in Figure 20b is Figure 20a a magnified view of a portion of Figure 21 illustrates Figure 18 the coupling relationship of the upper elastic member, the first circuit board 190a, and the support member shown in

[0346] The lens moving apparatus 100-2 can include a coil holder 110, a first coil 120, a first magnet 130, a housing 140a, an upper elastic member 150B, a lower elastic member 160A, a first position sensor 170, a second magnet 180, a first circuit board 190a, and a support member 220A.

[0347] The lens moving apparatus 100-2 can further include a third magnet 185, a second coil 230, a second position sensor 240, a second circuit board 250, a base 210, and a cover member 300.

[0348] The same description of the embodiment shown in Figure 18 applies to the remaining components of the lens moving apparatus 100-2 in the same manner, except for the upper elastic member 150B and the support member 220A shown in Figure 12

[0349] Referring to Figure 20a , the upper elastic member 150B can include upper springs 150B-1 to 150B-4 that are electrically separated from each other.

[0350] For example, each of the four upper springs 150B-1 to 150B-4 can be disposed at a respective one of four corner portions of the housing 140a, and one end of the upper spring 150B-4 disposed at a fourth corner portion of the housing 140a can be disposed at a first corner portion of the housing 140 and can be coupled to the first corner portion.

[0351] ​The first circuit board 190a can be disposed at the first corner portion of the housing 140a, and the fourth corner portion of the housing 140a can face the first corner portion on a diagonal line.

[0352] Each of the upper springs 150B-1 to 150B-4 can be directly coupled to and electrically connected to a respective one of the first to fourth pads 5a to 5d of the first circuit board 190a disposed at the first corner portion of the housing 140a.

[0353] Each of the first to fourth upper springs 150B-1 to 150B-4 can include an outer frame coupled to the housing 140a (e.g., a corner portion). The outer frame of each of the first to fourth upper springs 150B-1 to 150B-4 can include a first coupling portion coupled to a respective one of the first to fourth corner portions of the housing 140a, a second coupling portion coupled to a respective one of the first to fourth support members 220B-1 to 220B-4, and at least one connection portion for connecting the first and second coupling portions to each other.

[0354] The first upper spring 150B-1 can include a first outer frame 152-3' coupled to the first corner portion of the housing 140a.

[0355] The first outer frame 152-3' of the first upper spring 150B-1 can include a first coupling portion 81 including coupling regions S1' to S3' coupled to the first corner portion of the housing 140a, a second coupling portion 82 coupled to a respective one (e.g., 220B-1) of the first to fourth support members 220B-1 to 220B-4, a first connection portion 83a for connecting any one (e.g., S1') of the coupling regions S1' to S3' of the first coupling portion 81, and a second connection portion 83b for connecting another one (e.g., S3') of the coupling regions S1' to S3' of the first coupling portion 81 to the second coupling portion 82.

[0356] For example, the coupling regions S1' to S3' of the first coupling portion 81 of the first upper spring 150B-1 can be spaced apart from each other and can be configured in the form of a through-hole coupled to the upper support protrusion 143 of the housing 140a.

[0357] The contact portion Q3 connected or coupled to a respective one of the first to fourth pads 5a to 5d of the first circuit board 190a can be disposed on the first coupling portion 81 of the first upper spring 150B-1.

[0358] For example, the contact portion Q3 can be positioned adjacent to any one of the coupling regions S1’ to S3’ (e.g., S2’).

[0359] For example, the contact portion Q3 can extend or protrude from one end of the first outer frame in which the coupling regions are disposed, and can be coupled to the pad 5c of the first circuit board 190a via soldering or a conductive adhesive member.

[0360] Each of the second and third upper springs 150B-2 and 150B-3 can include a first inner frame 151’ coupled to the yoke 110, a first outer frame 152’ coupled to a respective one of the second and third corner portions of the housing 140a, and a first frame connecting portion 153 for connecting the first inner frame 151’ and the first outer frame 152’.

[0361] The first outer frame 152’ of each of the second and third upper springs 150B-2 and 150B-3 can include a first coupling portion 71 including coupling regions S5’ to S8’ coupled to a respective one of the second and third corner portions of the housing 140a, a second coupling portion 72 coupled to a respective one of the first to fourth support members 220B-1 to 220B-4 (e.g., 220B-2 and 220B-3), and connecting portions 73a and 73b for connecting the first coupling portion 71 and the second coupling portion 72.

[0362] For example, the connecting portions 73a and 73b can include a first connecting portion 73a for connecting any one of the coupling regions S5’ to S8’ (e.g., S5’) and the second coupling portion 72, and a second connecting portion 73b for connecting another one of the coupling regions S5’ to S8’ and the second coupling portion 72.

[0363] For example, the coupling regions S5' to S8' of the first coupling portion 71 of each of the second upper spring 150B-2 and the third upper spring 150B-3 can be spaced apart from each other, and can be configured in the form of a through-hole coupled to the upper support protrusion 143 of the housing 140a. The second coupling portions 72 and 82 of each of the first to fourth upper springs can be configured in the form of a through-hole coupled to the support members 220B-1 to 220B-4, but embodiments are not limited thereto.

[0364] Each of the second upper spring 150B-2 and the third upper spring 150B-3 can further include upper extension frames 154a' and 154b' connected to any one (for example, S5' or S8') of the coupling regions S5' to S8' of the first coupling portion 71 of the first outer frame 152', and extending toward the first corner portion of the housing 140a for bonding with the pads 5a and 5d of the first circuit board 190a.

[0365] The upper extension frames 154a' and 154b' are connected to any one (for example, S5' or S8') of the coupling regions S5' to S8' of the first coupling portion 71, thereby enhancing the support force of the housing 140a and preventing the upper extension frames 154a' and 154b' from being cut. A through-hole h3 provided in the upper extension frames 154a' and 154b' shown in FIG. 20 can also be provided to enhance the coupling force and support force with the housing 140a.

[0366] The contact portions Q1 and Q4 connected or bonded to the respective one of the first to fourth pads 5a to 5d of the first circuit board 190a can be provided on one end portion of the upper extension frames 154a' and 154b'.

[0367] The contact portions Q1 and Q4 can extend or protrude from one end portion of the upper extension frames 154a' and 154b', and can be bonded to the pads 5a and 5d of the first circuit board 190a via soldering or a conductive adhesive member.

[0368] The fourth upper spring 150B-4 can include first inner frames 151-1' and 151-2' coupled to the coil former 110, first outer frames 152-1' and 152-2' coupled to the housing 140a, first frame connection portions 153-1' and 153-2' for connecting the first inner frames 151-1' and 151-2' with the first outer frames 152-1' and 152-2', and a connection frame 154' for connecting the first inner frames 151-1' and 151-2' to each other.

[0369] In Figure 20a an example in which the fourth upper spring 150B-4 includes two first inner frames, two first outer frames, and one connection frame is illustrated, but the embodiment is not limited thereto, and according to another embodiment, the number of each of the first inner frames and the first outer frames can be three or more, and the number of the connection frame can be two or more.

[0370] Any one of the two first outer frames (e.g., 152-2') of the fourth upper spring 150B-4 can be disposed at the first corner portion of the housing 140a, and the other first outer frame (e.g., 152-1') can be disposed at the fourth corner portion of the housing 140a, and the two first outer frames can be spaced apart from each other.

[0371] The two first inner frames of the fourth upper spring 150B-4 can be spaced apart from each other, and can be disposed on the two first side portions 110b-1 of the coil holder 110 facing each other.

[0372] For example, the two first inner frames 151-1' and 151-2' of the fourth upper spring 150B-4 can be disposed on the first side portion 110b-1 of the coil holder 110, the two first inner frames 151-1' and 151-2' corresponding to the two facing first side portions 141 of the housing 140a.

[0373] For example, the first inner frame 151-1' can be disposed on the first side portion of the coil holder 110 adjacent to the second corner portion of the housing 140a, and the first inner frame 151-2' can be disposed on the first side portion of the coil holder 110 adjacent to the third corner portion of the housing 140a.

[0374] For example, the first frame connection portion 153-1' can connect the first outer frame 152-1' of the fourth upper spring 150B-4 located at the fourth corner portion to the first inner frame 151-1' adjacent to the second corner portion.

[0375] The first frame connection portion 153-2' can connect the first outer frame 152-2' of the fourth upper spring 150B-4 located at the first corner portion to the first inner frame 151-2' adjacent to the third corner portion.

[0376] One end of the connection frame 154' of the fourth upper spring 150B-4 can be connected to the first inner frame 151-1', and the other end of the connection frame 154' can be connected to the first inner frame 151-2'.

[0377] The connection frame 154' of the fourth upper spring 150B-4 can be configured in the form of a curve that surrounds at least a portion of the outer surface 110b of the coil bobbin 110 to prevent spatial interference with the coil bobbin 110.

[0378] For example, the connection frame 154' of the fourth upper spring 150B-4 can be configured in the form of a curve that surrounds at least a portion of the upper side of the outer surface 110b of the coil bobbin 110.

[0379] For example, the connection frame 154' of the fourth upper spring 150B-4 can be configured in the form of a curve that is convex in a direction toward the fourth corner portion based on the reference line 502', but embodiments are not limited thereto.

[0380] For example, the connection frame 154' of the fourth upper spring 150B-4 can be configured in the form of a curve that extends in a right side direction of the reference line 501'.

[0381] For example, the reference line 501' can be a straight line that passes through the center point 101 and the second connection portion 72 of the second upper spring 150B-2 and the second connection portion 72 of the third upper spring 150B-3, and the reference line 502' can be a straight line that passes through the center point 101 and the second connection portion 82 of the first upper frame 150B-1 and the second connection portion 72 of the fourth upper frame 150B-4, but embodiments are not limited thereto, and the reference lines 501' and 502' can be defined as the reference lines 501 and 502 of Figure 9a .

[0382] The description of the first outer spring 152-1' of the second upper spring 150B-2 and the third upper spring 150B-3 can be applied to the first outer frame 152-1' of the fourth upper spring 150B-4.

[0383] The first outer frame 152-2' of the fourth upper spring 150B-4 can be spaced apart from the first outer frame 152-3' of the first upper spring 150B-1, and the first outer frame 152-2' can include a first coupling portion including a coupling area S4' coupled to the first corner portion of the housing 140a.

[0384] The coupling area S4' of the first outer frame 152-2' of the fourth upper spring 150B-4 can be disposed between the coupling areas S2' and S3' of the first coupling portion 81 of the first upper spring 150B-1, but embodiments are not limited thereto.

[0385] A contact portion Q2 can be provided on one end of the first coupling portion of the first outer frame 152-3' of the fourth upper spring 150B-4, and the contact portion Q2 is connected or bonded to a corresponding one of the first to fourth pads 5a to 5d of the first circuit board 190a.

[0386] The contact portion Q2 can extend or protrude from one end of the first outer frame 152-2' of the fourth upper spring 150B-4, and can be bonded to the pad 5b of the first circuit board 190a via soldering or a conductive adhesive member.

[0387] The first outer frame 152' of the second upper spring 150B-2 and the first outer frame 152-1' of the third upper spring 150B-3 can be symmetrical in the left-right direction based on the reference lines 501' and 502'.

[0388] The first outer frame 152-3' of the first upper spring 150B-1 disposed at the first corner portion of the housing 140a and the first outer frame 152-2' of the fourth upper spring 150B-4 disposed at the first corner portion of the housing 140a can be symmetrical in the left-right direction based on the reference line 502'. Accordingly, the support members 220B-1 to 220B-4 can balance and support the housing 140a without tilting to one side.

[0389] The width of each of the first and second connection portions 83a, 73a and 83b, 73b can decrease in a direction from the first coupling portion 81 and 71 toward the second coupling portion 82 and 72. Accordingly, each of the first and second connection portions 83a, 73a and 83b, 73b can easily move in the optical axis direction, and an effect of dispersing stress applied to the upper elastic member 150B and stress applied to the support member 220B can be improved.

[0390] The support member 220B can include first to fourth support members 220B-1 to 220B-4 disposed at corner portions of the housing 140a.

[0391] As shown in FIG. 1B, each of the first to fourth support members 220B-1 to 220B-4 can be disposed at a corresponding one of the first to fourth corner portions of the housing 140a, and can be bonded to a corresponding one of the first outer frames of the first to fourth upper springs 150B-1 to 150B-4. Figure 21

[0392] ​For example, one end of each of the first to fourth support members 220B-1 to 220B-4 can be coupled to the second coupling portions 82 and 72 of the first outer frames 152' of the respective ones of the first to fourth upper springs 150B-1 to 150B-4, and the other end can be coupled to the second circuit board 250.

[0393] The first to fourth pads 5a to 5d of the first circuit board 190a and four respective ones of the terminals of the second circuit board 250 can be electrically connected through the upper springs 150B-1 to 150B-4 and the support members 220B-1 to 220B-4.

[0394] As described with reference to Figure 17 , the two pads 5e and 5f of the first circuit board 190a can be directly connected to the first and second lower springs 160-1 and 160-2, and can be electrically connected to the first coil 120.

[0395] Figures 12 to 17 The description of the first position sensor 170 can be applied in the same manner to data communication between the first position sensor 170 and the second circuit board 250 and provision of a driving signal from the first position sensor to the first coil 120.

[0396] Compared to the embodiment 100-1 shown in Figure 12 , according to the embodiment 100-2 shown in Figure 18 , the number of support members can be reduced, and the size of the lens moving apparatus can be reduced due to the reduction in the number of support members.

[0397] The number of support members is reduced, so the resistance of the support members can be reduced to thereby reduce the consumed current, and the sensitivity of the OIS driving can be improved.

[0398] Even though the number of support members is reduced, the thickness of the support members can be increased to obtain the same elastic force, and as the thickness of the support members increases, the influence of an external impact on the OIS moving components can be reduced.

[0399] Figure 22 is an exploded perspective view of a camera module 200 according to an embodiment.

[0400] Referring to Figure 22 , the camera module can include a lens barrel 400, a lens moving apparatus 100, an adhesive member 710, a filter 610, a first holder 600, a second holder 800, an image sensor 810, a motion sensor 820, a controller 830, and a connector 840.

[0401] The lens barrel 400 can be mounted on the coil holder 110 of the lens moving apparatus 100.

[0402] The first holder 600 can be disposed under the base 210 of the lens moving apparatus 100. The optical filter 610 can be mounted on the first holder 600, and the first holder 600 can include the protrusion 500 on which the optical filter 610 is accommodated.

[0403] The adhesive member 710 can couple or attach the base 210 of the lens moving apparatus 100 to the first holder 600. The adhesive member 710 can function as the aforementioned adhesive, and can also prevent foreign matter from being introduced into the lens moving apparatus 100.

[0404] For example, the adhesive member 710 can include an epoxy resin, a thermosetting adhesive, an ultraviolet (UV) curing adhesive, or the like.

[0405] The optical filter 610 can prevent light of a specific frequency band among light transmitted through the lens barrel 400 from being incident on the image sensor 810. The optical filter 610 can be an infrared ray blocking filter, but embodiments are not limited thereto. In this case, the optical filter 610 can be disposed parallel to the x-y plane.

[0406] A hollow portion can be formed in a portion of the first holder 600 on which the optical filter 610 is mounted, to allow light transmitted through the optical filter 610 to be incident on the image sensor 810.

[0407] The second holder 800 can be disposed under the first holder 600, and the image sensor 810 can be mounted on the second holder 600. The image sensor 810 can be a portion on which light transmitted through the optical filter 610 is incident to form an image included in the light.

[0408] The second holder 800 can include various circuits, devices, controllers, or the like, to convert an image formed on the image sensor 810 into an electrical signal and transmit the electrical signal to an external apparatus.

[0409] The second holder 800 can be implemented as a circuit board on which an image sensor is to be mounted and on which a circuit pattern is to be formed and various devices are to be coupled.

[0410] The image sensor 810 can receive an image included in light transmitted through the lens moving apparatus 100, and the image sensor 810 can convert the received image into an electrical signal.

[0411] The optical filter 610 and the image sensor 810 can be spaced apart from each other to face each other in a first direction.

[0412] The motion sensor 820 can be mounted on the second holder 800 and can be electrically connected to the controller 830 through a circuit pattern provided on the second holder 800.

[0413] The motion sensor 820 can output rotational angular velocity information based on the motion of the camera module 200. The motion sensor 820 can be implemented as a 2-axis or 3-axis gyro sensor or an angular velocity sensor.

[0414] The controller 820 can be mounted on the second holder 800 and can be electrically connected to the second position sensor 240 and the second coil 230 of the lens moving apparatus 100. For example, the second holder 800 can be electrically connected to the second circuit board 250 of the lens moving apparatus 100, and the controller 820 mounted on the second holder 800 can be electrically connected to the second position sensor 240 and the second coil 230 through the second circuit board 250.

[0415] The controller 830 can output a driving signal for performing hand-shake correction on the OIS moving part of the lens moving apparatus 100 based on an output signal provided from the second position sensor 240 of the lens moving apparatus 100.

[0416] For example, the controller 830 can provide the driving signals IS1 to IS4 or the driving signal DS and the control signals C1 to C4 for driving the first coils 120-1 to 120-4 to the second circuit board 250.

[0417] The controller 840 can be electrically connected to the second holder 800 and can include a port for conduction connection with an external device.

[0418] Figure 23 FIG. 11 is a perspective view of a lens moving apparatus 1100 according to another embodiment. Figure 24 FIG. 11 is a perspective view of a lens moving apparatus 1100 according to another embodiment. Figure 23 FIG. 11 is a perspective view of a lens moving apparatus 1100 according to another embodiment. Figure 25 FIG. 11 is a perspective view of a lens moving apparatus 1100 according to another embodiment. Figure 26 FIG. 11 is a perspective view of a lens moving apparatus 1100 according to another embodiment. Figure 27 FIG. 11 is a perspective view of a lens moving apparatus 1100 according to another embodiment. Figures 28 to 31 FIG. 11 is a perspective view of a lens moving apparatus 1100 according to another embodiment. Figure 32 FIG. 11 is a perspective view of a lens moving apparatus 1100 according to another embodiment.

[0419] The lens moving apparatus 1100 can include a cover member 1100, a first moving part 1200, a second moving part 1300, a stator 1400, a first support member 1500, a second support member 600, a first sensor unit 1700, and a second sensor unit 1800. However, any one or more of the cover member 1100, the first moving part 1200, the second moving part 1300, the stator 1400, the first support member 1500, the second support member 1600, the first sensor unit 1700, and the second sensor unit 1800 can be omitted or modified from the lens moving apparatus 1100. In particular, the first sensor unit 1700 and the second sensor unit 800 can be components for auto focus feedback control and hand-shake correction feedback control, and any one or more of them can be omitted therefrom.

[0420] Referring to Figure 34 Any one of the AF driving coil 1220, the driving magnet 1320, and the OIS driving coil 1422 can be referred to as a “first driver”, another can be referred to as a “second driver”, and the other one can be referred to as a “third driver”. The positions of the AF driving coil 1220, the driving magnet 1320, and the OIS driving coil 1422 can be changed from each other.

[0421] Any one of the AF driving coil 1220 and the OIS driving coil 1422 can be referred to as a “first coil”, and the other can be referred to as a “second coil”.

[0422] Any one of the driving magnet 1320, the sensing magnet 1730, and the compensation magnet 1740 can be referred to as a “first magnet”, the other can be referred to as a “second magnet”, and the other one can be referred to as a “third magnet”.

[0423] The cover member 1100 can form an appearance of the lens moving apparatus 1100. The cover member 1100 can be shaped to resemble a hexahedron having an open lower portion. However, the shape of the cover member 1100 is not limited thereto. The cover member 1100 can be a non-magnetic object.

[0424] When the cover member 1100 is configured as a magnetic object, the magnetic force of the driving magnet 1320, the cover member 1100 can affect any one or more of the sensing magnet 1730 and the compensation magnet 1740.

[0425] The cover member 1100 can be formed of a metal material. In more detail, the cover member 1100 can be formed of a plate-shaped metal material. In this case, the cover member 1100 can shield electromagnetic interference (EMI). Due to this characteristic of the cover member 1100, the cover member 1100 can be referred to as an "EMI shield". The cover member 1100 can prevent waves generated outside the lens moving apparatus 1100 from being introduced into the cover member 1100.

[0426] The cover member 1100 can prevent waves generated inside the cover member 1100 from being discharged from the cover member 1100.

[0427] The cover member 1100 can include an upper plate 1101 and a side plate 1102.

[0428] The cover member 1100 can include an upper plate 1101 and a side plate 1102 extending downward from an outer periphery of the upper plate 1101.

[0429] For example, the cover member 1100 can be coupled to the base 1430. A portion of the side plate 1102 of the cover member 1100 can be coupled to the base 1430.

[0430] A lower end of the side plate 1102 of the cover member 1100 can be disposed on the stepped portion 1435 of the base 1430. An inner surface of the side plate 1102 of the cover member 1100 can directly contact an outer side surface of the base 1430. The inner surface of the side plate 1102 of the cover member 1100 can be coupled to the base 1430 via an adhesive (not shown). As another example, the cover member 1100 can be directly coupled to an upper surface of the printed circuit board 1010.

[0431] The first moving part 1200, the second moving part 1300, the stator 1400, the first support member 1500, and the second support member 1600 can be disposed in an internal space formed by the cover member 1100 and the base 1430. With this configuration, the cover member 1100 can protect internal components from external impact and at the same time can prevent external contaminants from permeating.

[0432] The cover member 1100 can include an opening 1110.

[0433] The opening 1110 can be formed in the upper plate 101 of the cover member 1100. The opening 1110 can expose the lens module upward. The opening 1110 can be formed to correspond to the shape of the lens module. The size of the opening 1110 can be greater than the diameter of the lens module to assemble the lens module through the opening 1110. Light introduced through the opening 1110 can pass through the lens module. In this case, the light passing through the lens module can be converted into an electrical signal by the image sensor to acquire an image.

[0434] The first moving part 1200 can be coupled to a lens module (however, the lens module can be described as a component of a lens moving device), which is one component of a camera module. The first moving part 1200 can accommodate the lens module therein. An outer circumferential surface of the lens module can be coupled to an inner circumferential surface of the first moving part 1200.

[0435] The first moving part 1200 can move by interaction with the second moving part 1300 and / or the stator 1400. In this case, the first moving part 1200 can move integrally with the lens module. The first moving part 1200 can form for an AF function. In this case, the first moving part 1200 can be referred to as an "AF moving part". However, according to the present disclosure, the first moving part 1200 is not limited to a member that moves only for an AF function. The first moving part 1200 can also move for a hand-shake correction function.

[0436] The first moving part 1200 can include a coil holder 1210 and an AF driving coil 1220. However, any one or more of the coil holder 1210 and the AF driving coil 1220 can be omitted or modified from the first moving part 1200.

[0437] The coil holder 1210 can be disposed inside the housing 1310. The coil holder 1210 can be disposed in the through-hole 1311 of the housing 1310. The coil holder 1210 can move based on the housing 1310 in the optical axis direction. The coil holder 1210 can be disposed to move along the optical axis in the through-hole 1311 of the housing 1310.

[0438] The coil holder 1210 can be coupled to the lens module. An outer circumferential surface of the lens module can be coupled to an inner circumferential surface of the coil holder 1210. The AF driving coil 1220 can be coupled to the coil holder 1210. The AF driving coil 1220 can be coupled to an outer surface of the coil holder 1210. A lower portion of the coil holder 1210 can be coupled to the lower support member 1520. An upper portion of the coil holder 1210 can be coupled to the upper support member 1510.

[0439] The coil holder 1210 can include a through-hole 1211, a driver coupling portion 1212, an upper coupling portion 1213, and a lower coupling portion (not shown). However, any one or more of the through-hole 1211, the driver coupling portion 1212, the upper coupling portion 1213, and the lower coupling portion can be omitted from the coil holder 1210.

[0440] The through-hole 1211 can be formed inside the coil holder 1210. The through-hole 1211 can be formed to be open in the up-and-down direction. The lens module can be coupled to the through-hole 1211.

[0441] A screw thread corresponding to a screw thread formed on an outer circumferential surface of the lens module can be formed on an inner circumferential surface of the through-hole 1211. That is, the lens module can be screwed to the through-hole 1211. An adhesive can be disposed between the lens module and the coil holder 1210. In this case, the adhesive can be an epoxy resin cured by any one of ultraviolet (UV), heat, and a laser beam.

[0442] The AF driving coil 1220 can be coupled to the driver coupling portion 1212. The driver coupling portion 1212 can be formed on an outer surface of the coil holder 1210. The driver coupling portion 1212 can be configured in the form of a groove formed by inwardly recessing a portion of the outer surface of the coil holder 1210. In this case, the driver coupling portion 1212 can accommodate at least a portion of the AF driving coil 1220 therein. The driver coupling portion 1212 can be formed to be integrated into the outer surface of the coil holder 1210. For example, the driver coupling portion 1212 can be continuously formed along the outer surface of the coil holder 1210. In this case, the AF driving coil 1220 can be wound around the driver coupling portion 1212.

[0443] As another example, a plurality of driver coupling portions 1212 can be configured to be spaced apart from each other. In this case, a plurality of AF driving coils 1220 can be configured to be coupled to the driver coupling portions 1212, respectively. As another example, the driver coupling portion 1212 can be open upward or downward. In this case, the AF driving coil 1220 can be inserted into and coupled to the driver coupling portion 1212 through the open portion while being pre-wound.

[0444] The upper coupling portion 1213 can be coupled to the upper support member 1510. The upper coupling portion 1213 can be coupled to the inner portion 1512 inside the upper support member 1510. The upper coupling portion 1213 can protrude upward from an upper surface of the coil holder 1210.

[0445] For example, the protruding portion of the upper coupling portion 1213 can be inserted into and coupled to a groove or a hole of the inner portion 1512 of the upper support member 1510. In this case, the protruding portion of the upper coupling portion 1213 can be heat-fused while being inserted into the hole of the inner portion 1512 to fix the upper support member 1510 between the heat-fused protruding portion and the upper surface of the coil holder 1210.

[0446] The lower coupling portion can be coupled to the lower support member 1520. The lower coupling portion can be coupled to the inner portion 1522 of the lower support member 1520. The lower coupling portion can protrude downward from the lower surface of the coil holder 1210. For example, the protruding portion of the lower coupling portion can be inserted into and coupled to the groove or hole of the inner portion 1522 of the lower support member 1520. In this case, the protruding portion of the lower coupling portion can be heat-fused while being inserted into the hole of the inner portion 1522 to fix the lower support member 1520 between the heat-fused protruding portion and the lower surface of the coil holder 1210.

[0447] The AF driving coil 1220 can be disposed on the coil holder 1210. The AF driving coil 1220 can be disposed on the outer surface of the coil holder 1210. The AF driving coil 1220 can be wound around the coil holder 1210. The AF driving coil 1220 can face the driving magnet 1320. In this case, when current is supplied to the AF driving coil 1220 to form a magnetic field around the AF driving coil 1220, the AF driving coil 1220 can move relative to the driving magnet 1320 by electromagnetic interaction between the AF driving coil 1220 and the driving magnet 1320. The AF driving coil 1220 can electromagnetically interact with the driving magnet 1320.

[0448] The AF driving coil 1220 can move the coil holder 1210 relative to the housing 1310 in the optical axis direction by electromagnetic interaction with the driving magnet 1320. For example, the AF driving coil 1220 can be one integrally formed coil. As another example, the AF driving coil 1220 can include a plurality of coils spaced apart from each other. The AF driving coil 1220 can include four coils spaced apart from each other. In this case, the four coils can be disposed on the outer surface of the coil holder 1210 to form an angle of 90° between two adjacent coils.

[0449] The AF driving coil 1220 can include a pair of guide lines for supplying power. In this case, the pair of guide lines of the AF driving coil 1220 can electrically connect the fifth support portion 1505 and the sixth support portion 1506, which are components included in the upper support member 1510.

[0450] That is, the AF driving coil 1220 can receive power through the upper support member 1510. In more detail, the AF driving coil 1220 can sequentially receive power through the driver 1750 of the Hall driver IC 1070, the upper support member 1510, the conduction member 1610, and the lower support member 1520.

[0451] According to the present embodiment, the driver 1750 for controlling the current supplied to the AF driving coil 1220 can be disposed inside the lens moving apparatus 1100. In more detail, the driver 1750 can be formed to be integrated into the first sensor 1710, and can be disposed as a Hall driver IC 1070 in the housing 1310.

[0452] The second moving part 1300 can accommodate at least a portion of the first moving part 1200 therein. The second moving part 1300 can move the first moving part 1200 or can move together with the first moving part 1200. The second moving part 1300 can move via interaction with the stator 1400. The second moving part 1300 can move for a hand-shake correction function. In this case, the second moving part 1300 can be referred to as an "OIS moving part". The second moving part 1300 can move integrally with the first moving part 1200 when moving for the hand-shake correction function.

[0453] The second moving part 1300 can include a housing 1310 and a driving magnet 1320. However, any one or more of the housing 1310 and the driving magnet 1320 can be omitted or modified from the second moving part 1300.

[0454] The housing 1310 can be disposed outside the coil holder 1210. The housing 1310 can accommodate at least a portion of the coil holder 1210 therein. For example, the housing 1310 can include a hexahedral shape. The housing 1310 can include four side surfaces and four corner portions disposed between the four side surfaces.

[0455] The driving magnet 1320 can be disposed in the housing 1310. For example, the driving magnet 1320 can be disposed on each of the four side surfaces of the housing 1310. As another example, the driving magnet 1320 can be disposed at each of the four corner portions of the housing 1310. At least a portion of the outer circumferential surface of the housing 1310 can be formed in a shape corresponding to the inner circumferential surface of the cover member 1100.

[0456] In particular, the outer circumferential surface of the housing 1310 can be formed in a shape corresponding to the inner circumferential surface of the side plate 1102 of the cover member 1100. The housing 1310 can be formed of an insulating material. The housing 1310 can be formed of a different material from the cover member 1100. The housing 1310 can be formed by using a mold in consideration of productivity. The outer side surface of the housing 1310 can be spaced apart from the inner side surface of the side plate 1102 of the cover member 1100. The housing 1310 can move in a space between the housing 1310 and the cover member 1100 for OIS driving. The upper support member 1510 can be coupled to an upper portion of the housing 1310. The lower support member 1520 can be coupled to a lower portion of the housing 1310.

[0457] The housing 1310 can include a through-hole 1311, a driver coupling portion 1312, an upper coupling portion 1313, a lower coupling portion (not shown), and a sensor coupling portion 1315. However, any one or more of the through-hole 1311, the driver coupling portion 1312, the upper coupling portion 1313, the lower coupling portion, and the sensor coupling portion 1315 can be omitted or modified from the housing 1310.

[0458] The through-hole 1311 can be formed in the housing 1310. The through-hole 1311 can be formed in the inside of the housing 1310. The through-hole 1311 can be formed to penetrate the housing 1310 in the up-and-down direction. The coil holder 1210 can be disposed in the through-hole 1311. The coil holder 1210 can be disposed to be movable in the through-hole 1311. At least a portion of the through-hole 1311 can be formed in a shape corresponding to the coil holder 1210. The inner circumferential surface of the housing 1310 in which the through-hole 1311 is formed can be spaced apart from the outer circumferential surface of the coil holder 1210. However, a stopper that protrudes inward and mechanically restricts the movement of the coil holder 1210 in the optical axis direction can be formed on the inner circumferential surface of the housing 1310 in which the through-hole 1311 is formed.

[0459] The driving magnet 1320 can be coupled to the driver coupling portion 1312. The driver coupling portion 1312 can be formed in the housing 1310. The driver coupling portion 1312 can be formed on the inner circumferential surface of the housing 1310. In this case, the driving magnet 1320 disposed on the driver coupling portion 1312 can facilitate electromagnetic interaction with the AF driving coil 1220 located inside the driving magnet 1320.

[0460] The driver coupling portion 1312 can be an open lower portion. In this case, the driving magnets 1320 disposed on the driver coupling portion 1312 can facilitate electromagnetic interaction with the OIS driving coils 1422 located below the driving magnets 1320. The driver coupling portion 1312 can be configured in the form of a groove formed by outwardly recessing the inner circumferential surface of the housing 1310. In this case, a plurality of driver coupling portions 1312 can be configured. Each of the plurality of driver coupling portions 1312 can accommodate a driving magnet 1320.

[0461] For example, the driver coupling portion 1312 can be divided into four portions. The driving magnets 1320 can be disposed on each of the four driver coupling portions 1312. For example, the driver coupling portion 1312 can be formed on the side surface of the housing 1310. As another example, the driver coupling portion 1312 can be formed at the corner portion of the housing 1310.

[0462] The upper coupling portion 1313 can be coupled to the upper support member 1510. The upper coupling portion 1313 can be coupled to the outer portion 1511 of the upper support member 1510. The upper coupling portion 1313 can protrude upward from the upper surface of the housing 1310. For example, the protruding portion of the upper coupling portion 1313 can be inserted into and coupled to the groove or hole of the outer portion 1511 of the upper support member 1510. In this case, the protruding portion of the upper coupling portion 1313 can be heat-fused while being inserted into the hole of the outer portion 1511 to fix the upper support member 1510 between the heat-fused protruding portion and the upper surface of the housing 1310.

[0463] The lower coupling portion can be coupled to the lower support member 1520. The lower coupling portion can be coupled to the outer portion 1521 of the lower support member 1520. The lower coupling portion can protrude downward from the lower surface of the housing 1310. For example, the protruding portion of the lower coupling portion can be inserted into and coupled to the groove or hole of the outer portion 1521 of the lower support member 1520. In this case, the protruding portion of the lower coupling portion can be heat-fused while being inserted into the hole of the outer portion 1521 to fix the lower support member 1520 between the heat-fused protruding portion and the lower surface of the housing 1310.

[0464] At least a portion of the first sensor unit 1700 can be disposed on the sensor coupling portion 1315. For example, the first sensor 1070 can be disposed on the sensor coupling portion 1315. The sensor coupling portion 1315 can be formed in the housing 1310. The sensor coupling portion 1315 can be formed in the form of a groove formed by recessing a portion of the upper surface of the housing 1310 downward. In this case, the sensor coupling portion 1315 can accommodate at least a portion of the first sensor 1710. At least a portion of the sensor coupling portion 1315 can be formed in a shape corresponding to the first sensor 1710.

[0465] The driving magnet 1320 can be disposed in the housing 1310. The driving magnet 1320 can be disposed outside the AF driving coil 1220. The driving magnet 1320 can face the AF driving coil 1220.

[0466] The driving magnet 1320 can electromagnetically interact with the AF driving coil 1220. The driving magnet 1320 can be disposed above the OIS driving coil 1422. The driving magnet 1320 can face the OIS driving coil 1422. The driving magnet 1320 can electromagnetically interact with the OIS driving coil 1422. The driving magnet 1320 can generally be used for an auto focus function and a hand-shake prevention function. However, the driving magnet 1320 can include a plurality of magnets respectively used for the auto focus function and the hand-shake prevention function. For example, the driving magnet 1320 can be disposed on a side surface of the housing 1310. In this case, the driving magnet 1320 can be a flat magnet. The driving magnet 1320 can have a flat plate shape. As another example, the driving magnet 1320 can be disposed at a corner portion of the housing 1310. In this case, the driving magnet 1320 can be a corner magnet. The driving magnet 1320 can be shaped like a hexahedron having an inner side surface wider than an outer side surface.

[0467] The driving magnet 1320 can include a plurality of magnets spaced apart from each other. The driving magnet 1320 can include four magnets spaced apart from each other. In this case, the four magnets can be disposed in the housing 1310 to form an angle of 90° between two adjacent magnets.

[0468] That is, the driving magnet 1320 can be disposed on four side surfaces of the housing 1310 at equidistant intervals. In this case, the internal volume of the housing 1310 can be effectively used. In addition, the driving magnet 1320 can be adhered to the housing 1310 by an adhesive.

[0469] The stator 1400 can be disposed below the housing 1310. The stator 1400 can be disposed below the second moving part 1300. The stator 1400 can face the second moving part 1300. The stator 1400 can movably support the second moving part 1300. The stator 1400 can move the second moving part 1300. In this case, the first moving part 1200 can also move together with the second moving part 1300.

[0470] The stator 1400 can include a plate 1410, a circuit member 1420, and a base 1430. However, any one or more of the plate 1410, the circuit member 1420, and the base 1430 can be omitted or modified from the stator 1400.

[0471] The plate 1410 can supply power to the circuit member 1420. The plate 1410 can be coupled to the circuit member 1420. The plate 1410 can be coupled to the printed circuit board 1010 disposed below the base 1430. The plate 1410 can be disposed on a lower surface of the circuit member 1420. The plate 1410 can be disposed on an upper surface of the base 1430. The plate 1410 can be disposed between the circuit member 1420 and the base 1430.

[0472] The plate 1410 can include a flexible printed circuit board (FPCB). The plate 1410 can be partially bent. The plate 1410 can supply power to the Hall driver IC 1070. For example, the plate 1410 can supply power to the Hall driver IC 1070 through the second support member 1600 and the upper support member 1510. In addition, the power supplied to the Hall driver IC 1070 can be used to drive the first sensor 1710 and the driver 1750.

[0473] The plate 1410 can include an opening 1411 and a stepped portion 1412. However, any one or more of the opening 1411 and the stepped portion 1412 can be omitted or modified from the plate 1410.

[0474] The opening 1411 can be formed on the plate 1410. The opening 1411 can be formed on a central portion of the plate 1410. The opening 1411 can be formed to pass through the plate 1410. The opening 1411 can pass light transmitted through the lens module. The opening 1411 can be formed in a circular shape. However, the shape of the opening 1411 is not limited thereto.

[0475] A stepped portion 1412 can be formed on the plate 1410. The stepped portion 1412 can be formed by bending a portion of the plate 1410 downward. At least a portion of the stepped portion 1412 can be exposed to the outside. The stepped portion 1412 can be coupled to the printed circuit board 1010 disposed below the base 1430 via welding. A lower end of the stepped portion 1412 can directly contact the printed circuit board 1010. The stepped portion 1412 can be disposed on the terminal coupling portion 1434 of the base 1430.

[0476] A circuit member 1420 can be disposed on the base 1430. The circuit member 1420 can be disposed on the plate 1410. The circuit member 1420 can be disposed on an upper surface of the plate 1410. The circuit member 1420 can be disposed below the driving magnet 1320. The circuit member 1420 can be disposed between the driving magnet 1320 and the base 1430. A second support member 1600 can be coupled to the circuit member 1420. The circuit member 1420 can movably support the second moving part 1300.

[0477] The circuit member 1420 can include a plate portion 1421 and an OIS driving coil 1422. However, any one or more of the plate portion 1421 and the OIS driving coil 1422 can be omitted or modified from the circuit member 1420.

[0478] The plate portion 1421 can be a circuit board. The plate portion 1421 can be an FPCB. The OIS driving coil 1422 can be formed to be integrated into the plate portion 1421.

[0479] The second support member 1600 can be coupled to the plate portion 1421. A hole through which the second support member 1600 passes can be formed in the plate portion 1421. A lower surface of the plate portion 1421 and a lower end of the second support member 1600 can be coupled to each other via welding. An opening can be formed on the plate portion 1421. The opening can be formed through the plate portion 1421 on the plate portion 1421. The opening of the plate portion 1421 can be formed to correspond to the opening 1411 of the plate 1410.

[0480] The OIS driving coil 1422 can include at least one coil. The OIS driving coil 1422 can be a fine pattern (FP) coil formed to be integrated into the plate portion 1421. The OIS driving coil 1422 can include a plurality of coils spaced apart from each other. The OIS driving coil 1422 can include four coils spaced apart from each other. In this case, the four coils can be arranged on the plate portion 1421 to form an angle of 90° between two adjacent coils. The four coils can be individually controlled. The OIS driving coil 1422 can sequentially receive power through the printed circuit board 1010, the plate 1410, and the plate portion 1421. The OIS driving coil 1422 can face the driving magnet 1320. In this case, when a current is supplied to the OIS driving coil 1422 for forming a magnetic field around the OIS driving coil 1422, the driving magnet 1320 can be moved with respect to the OIS driving coil 1422 by electromagnetic interaction between the OIS driving coil 1422 and the driving magnet 1320.

[0481] The OIS driving coil 1422 can electromagnetically interact with the driving magnet 1320. The OIS driving coil 1422 can move the housing 1310 and the coil holder 1210 with respect to the base 1430 in a direction perpendicular to the optical axis by electromagnetic interaction with the driving magnet 1320.

[0482] The base 1430 can be arranged on a lower surface of the plate 1410. The plate 1410 can be arranged on an upper surface of the base 1430. The OIS driving coil 1422 can be arranged on the base 1430. The base 1430 can be coupled to the cover member 1100. The base 1430 can be arranged on an upper surface of the printed circuit board 1010. However, a separate holder member 1011 can be arranged between the base 1430 and the printed circuit board 1010. The base 1430 can function as a sensor holder mounted on the printed circuit board 1010.

[0483] The base 1430 can include a through-hole 1431, a foreign matter collector 1432, a sensor coupling portion 1433, a terminal coupling portion 1434, and a stepped portion 1435. However, any one or more of the through-hole 1431, the foreign matter collector 1432, the sensor coupling portion 1433, the terminal coupling portion 1434, and the stepped portion 1435 can be omitted or modified from the base 1430.

[0484] A through-hole 1431 can be formed in the base 1430. The through-hole 1431 can be formed to pass through the base 1430 in the up-and-down direction. An infrared filter can be disposed in the through-hole 1431. However, the infrared filter can be coupled to a separate holder member 1011 disposed below the base 1430. Light passing through the lens module can be incident on the image sensor through the through-hole 1431. That is, light passing through the lens module can be incident on the image sensor through the opening of the circuit member 1420, the opening 1411 of the board 1410, and the through-hole 1431 of the base 1430. The through-hole 1431 can be shaped like a circle. However, the shape of the through-hole 1431 is not limited thereto.

[0485] The impurity collector 1432 can collect impurities introduced into the lens moving apparatus. The impurity collector 1432 can include a groove formed by the upper surface of the base 1430 being recessed downward and an adhesive disposed in the groove. The adhesive can include an adhesive material. Impurities introduced into the lens moving apparatus can be adhered by the adhesive portion.

[0486] The second sensor unit 1800 can be disposed on the sensor coupling portion 1433. The sensor coupling portion 1433 can accommodate at least a portion of the second sensor unit 1800. The sensor coupling portion 1433 can be configured in the form of a groove formed by the upper surface of the base 1430 being recessed downward. The sensor coupling portion 1433 can be spaced apart from the impurity collector 1432. The sensor coupling portion 1433 can be formed as a plurality of grooves. For example, the sensor coupling portion 1433 can be formed as two grooves. In this case, the second sensor unit 1800 can be disposed in each of the two grooves.

[0487] The stepped portion 1412 of the board 1410 can be disposed on the terminal coupling portion 1434. The terminal coupling portion 1434 can be configured in the form of a groove formed by a portion of one side surface of the base 1430 being recessed inward. In this case, the terminal coupling portion 1434 can accommodate at least a portion of the stepped portion 1412 of the board 1410. The width of the terminal coupling portion 1434 can correspond to the width of the stepped portion 1412 of the board 1410. The length of the terminal coupling portion 1434 can correspond to the length of the stepped portion 1412 of the board 1410.

[0488] A stepped portion 1435 can be formed on the side surface of the base 1430. The stepped portion 1435 can be formed to surround the outer peripheral surface of the base 1430. The stepped portion 1435 can be formed by the upper portion of the side surface of the base 1430 being recessed. Alternatively, the stepped portion 1435 can protrude from the lower portion of the side surface of the base 1430. The lower end portion of the side plate 1102 of the cover member 1100 can be disposed on the stepped portion 1435.

[0489] The first support member 1500 can be coupled to the coil holder 1210 and the case 1310. The first support member 1500 can elastically support the coil holder 1210. At least a portion of the first support member 1500 can have elasticity.

[0490] In this case, the first support member 1500 can be referred to as a "first elastic member". The first support member 1500 can support the coil holder 1210 in a movable manner. The first support member 1500 can support the coil holder 1210 in a movable manner in the optical axis direction with respect to the case 1310. That is, the first support member 1500 can support the coil holder 1210 to be driven by the AF. In this case, the first support member 1500 can be referred to as an "AF support member".

[0491] The first support member 1500 can include an upper support member 1510 and a lower support member 1520. However, any one or more of the upper support member 1510 and the lower support member 1520 can be omitted or modified from the first support member 1500.

[0492] The upper support member 1510 can be disposed above the coil holder 1210 and can be coupled to the coil holder 1210 and the case 1310. The upper support member 1510 can be coupled to the coil holder 1210 and the case 1310. The upper support member 1510 can be coupled to an upper portion of the coil holder 1210 and an upper portion of the case 1310. The upper support member 1510 can elastically support the coil holder 1210.

[0493] At least a portion of the upper support member 1510 can have elasticity. In this case, the upper support member 1510 can be referred to as an "upper elastic member". The upper support member 1510 can support the coil holder 1210 in a movable manner. The upper support member 1510 can support the coil holder 1210 in a movable manner in the optical axis direction with respect to the case 1310. The upper support member 1510 can be configured in the form of a leaf spring.

[0494] The upper support member 1510 can include a plurality of partition members. The upper support member 1510 can include eight upper support portions 1501 to 1508 spaced apart from each other.

[0495] The upper support member 1510 can include the first upper support portion 1501, the second upper support portion 1502, the third upper support portion 1503, the fourth upper support portion 1504, the fifth upper support portion 1505, the sixth upper support portion 1506, the seventh upper support portion 1507, and the eighth upper support portion 1508 spaced apart from each other. However, any one or more of the first to eighth upper support portions 1501 to 1508 can be omitted or modified from the upper support member 1510. The upper support portions 1501 to 1508 can have elasticity. In this case, the upper support portions 1501 to 1508 can be referred to as "upper elastic portions."

[0496] The first to eighth upper support portions 1501 to 1508 can be spaced apart from each other. As such, the first to eighth upper support portions 1501 to 1508 can serve as a guide wire inside the lens moving apparatus 1100.

[0497] The first to sixth upper support portions 1501 to 1506 can form pairs with and can be electrically connected to the first to sixth terminals 1721 to 1726 of the board 1720 of the first sensor unit 1700. As such, the first to sixth upper support portions 1501 to 1506 can be electrically connected to the Hall driver IC 1070.

[0498] The first to fourth upper support portions 1501 to 1504 can be electrically connected to the board 1410 through the second support member 1600. The fifth and sixth upper support portions 1505 and 1506 can be electrically connected to the AF driving coil 1220 through the conductive member 1610 and the lower support member 1520.

[0499] The upper support member 1510 can include an outer portion 1511, an inner portion 1512, a connection portion 1513, and a coupling portion 1514. However, any one or more of the outer portion 1511, the inner portion 1512, the connection portion 1513, and the coupling portion 1514 can be omitted or modified from the upper support member 1510.

[0500] The outer portion 1511 can be coupled to the housing 1310. The outer portion 1511 can be coupled to an upper portion of the housing 1310. The outer portion 1511 can be coupled to the upper coupling portion 1313 of the housing 1310. The outer portion 1511 can include a hole or a groove coupled to the upper coupling portion 1313 of the housing 1310.

[0501] The inner portion 1512 can be coupled to the coil holder 1210. The inner portion 1512 can be coupled to an upper portion of the coil holder 1210. The inner portion 1512 can be coupled to the upper coupling portion 1213 of the coil holder 1210. The inner portion 1512 can include a hole or a groove coupled to the upper coupling portion 1213 of the coil holder 1210.

[0502] The connection portion 1513 can connect the outer portion 1511 and the inner portion 1512 to each other. The connection portion 1513 can elastically connect the outer portion 1511 and the inner portion 1512 to each other. The connection portion 1513 can have elasticity. In this case, the connection portion 1513 can be referred to as an "elastic portion". The connection portion 1513 can be bent twice or more. The outer portion 1511 can be replaced with the term "outer frame", and the inner portion 1512 can be replaced with the term "inner frame".

[0503] The coupling portion 1514 can be coupled to the second support member 1600. The coupling portion 1514 can be coupled to the second support member 1600 via welding. For example, the coupling portion 1514 can include a hole through which the second support member 1600 passes.

[0504] As another example, the coupling portion 1514 can include a groove for the second support member 1600 to be coupled. The coupling portion 1514 can extend from the outer portion 1511. The coupling portion 1514 can extend outward from the outer portion 1511. The coupling portion 1514 can include a curved portion formed via bending. The coupling portion 1514 can be coupled to the conductive member 1610. The coupling portion 1514 can be coupled to the conductive member 1610 via welding.

[0505] Some of the first to eighth upper support portions 1501 to 1508 can include the outer portion 1511, the inner portion 1512, the connection portion 1513, and the coupling portion 1514, but the other remaining portions can not include any one or more of the outer portion 1511, the inner portion 1512, the connection portion 1513, and the coupling portion 1514.

[0506] The lower support member 1520 can be disposed below the coil holder 1210, and can be coupled to the coil holder 1210 and the case 1310. The lower support member 1520 can be coupled to a lower portion of the coil holder 1210 and a lower portion of the case 1310. The lower support member 1520 can elastically support the coil holder 1210. At least a portion of the lower support member 1520 can have elasticity. In this case, the lower support member 1520 can be referred to as a "lower elastic member". The lower support member 1520 can support the coil holder 1210 in a movable manner. The lower support member 1520 can support the coil holder 1210 in a movable manner in the direction of the optical axis with respect to the case 1310. The lower support member 1520 can be configured in the form of a leaf spring.

[0507] The lower support member 1520 can include two lower support portions 1520a and 1520b spaced apart from each other. The lower support member 1520 can include a first lower support portion 1520a and a second lower support portion 1520b spaced apart from each other.

[0508] The two lower support portions 1520a and 1520b can form a pair with a pair of wires of the AF driving coil 1220 and can be electrically connected to the pair of wires. That is, the two lower support portions 1520a and 1520b can function as wires for supplying a current to the AF driving coil 1220.

[0509] The two lower support portions 1520a and 1520b can be electrically connected to the upper support member 1510 through the conduction member 1610. The lower support portions 1520a and 1520b can have elasticity. In this case, the lower support portions 1520a and 1520b can be referred to as "lower elastic portions".

[0510] The lower support member 1520 can include an outer portion 1521, an inner portion 1522, a connection portion 1523, and a coupling portion 1524. However, any one or more of the outer portion 1521, the inner portion 1522, the connection portion 1523, and the coupling portion 1524 can be omitted or modified from the lower support member 1520.

[0511] The outer portion 1521 can be coupled to the case 1310. The outer portion 1521 can be coupled to a lower portion of the case 1310. The outer portion 1521 can be coupled to a lower coupling portion of the case 1310. The outer portion 1521 can include a hole or a groove coupled to the lower coupling portion of the case 1310.

[0512] The inner portion 1512 can be coupled to the coil holder 1210. The inner portion 1512 can be coupled to an upper portion of the coil holder 1210. The inner portion 1512 can be coupled to a lower coupling portion of the coil holder 1210. The inner portion 1512 can include a hole or a groove coupled to the lower coupling portion of the coil holder 1210.

[0513] The connection portion 1523 can connect the outer portion 1521 and the inner portion 1522 to each other. The connection portion 1523 can elastically connect the outer portion 1521 and the inner portion 1522 to each other. The connection portion 1523 can have elasticity. In this case, the connection portion 1523 can be referred to as an "elastic portion". The connection portion 1523 can be bent twice or more.

[0514] The coupling portion 1524 can be coupled to the conductive member 1610. The coupling portion 1524 can be coupled to the conductive member 1610 via welding. For example, the coupling portion 1524 can include a hole through which the conductive member 1610 passes. As another example, the coupling portion 1524 can include a groove in which the conductive member 1610 is coupled. The coupling portion 1524 can extend from the outer portion 1511. The coupling portion 1524 can extend outward from the outer portion 1511. The coupling portion 1524 can include a bent portion formed via bending.

[0515] The second support member 1600 can support the housing 1310 in a movable manner. The second support member 1600 can elastically support the housing 1310. At least a portion of the second support member 1600 can have elasticity. In this case, the second support member 1600 can be referred to as a "second elastic member".

[0516] For example, the second support member 1600 can support the housing 1310 in a movable manner in a direction perpendicular to the optical axis with respect to the stator 1400. In this case, the coil holder 1210 can be integrally moved with the housing 1310. As another example, the second support member 1600 can support the housing 1310 in a tiltable manner with respect to the stator 1400. That is, the second support member 1600 can support the housing 1310 and the coil holder 1210 to be driven by OIS. In this case, the second support member 1600 can be referred to as an "OIS support member". For example, the second support member 1600 can be configured in the form of a wire. As another example, the second support member 1600 can be configured in the form of a leaf spring.

[0517] The second support member 1600 can be coupled to the upper support member 1510 and the stator 1400. A lower end of the second support member 1600 can be coupled to the plate portion 1421 of the circuit member 1420. The second support member 1600 can pass through the plate portion 1421 of the circuit member 1420.

[0518] In this structure, the lower end of the second support member 1600 can be coupled to the lower surface of the plate portion 1421 of the circuit member 1420 via welding. The upper end of the second support member 1600 can be coupled to the coupling portion 1514 of the upper support member 1510.

[0519] The upper end of the second support member 1600 can pass through the coupling portion 1514 of the upper support member 1510. In this structure, the upper end of the second support member 1600 can be coupled to the upper surface of the coupling portion 1514 of the upper support member 1510 via welding. As a modification example, the lower end of the second support member 1600 can be coupled to the plate 1410.

[0520] The lower end of the second support member 1600 can be coupled to the base 1430. The upper end of the second support member 1600 can be coupled to the housing 1310. The structure of the second support member 1600 is not limited thereto, and the second support member 1600 can be provided with any structure for supporting the second moving part 1300 in a movable manner with respect to the stator 1400.

[0521] The second support member 1600 can include a plurality of partition members. The second support member 1600 can include eight support portions 1601 to 1608 spaced apart from each other.

[0522] The second support member 1600 can include first to eighth support portions 1601 to 1608 spaced apart from each other. However, any one or more of the first to eighth support portions 1601 to 1608 can be omitted or modified from the second support member 1600.

[0523] The first to eighth support portions 1601 to 1608 can be spaced apart from each other. As such, the first to eighth support portions 1601 to 1608 can serve as a wire inside the lens moving apparatus. The first to eighth support portions 1601 to 1608 can be coupled to the plate portion 1421 of the circuit member 1420.

[0524] The first to eighth support portions 1601 to 1608 can be coupled to the upper support member 1510. That is, the first to eighth support portions 1601 to 1608 can electrically connect the plate portion 1421 of the circuit member 1420 to the upper support member 1510.

[0525] Four of the first to eighth support portions 1601 to 1608 can be coupled to the upper support portions that are partition members of the upper support member 1510, and the remaining four support portions can form two pairs with each other and can be coupled to other upper support portions of the upper support member 1510.

[0526] For example, as shown in FIG. 16A, the first support portion 1601 and the eighth support portion 1608 can be coupled to the first upper support portion 1501. The second support portion 1602 can be coupled to the second upper support portion 1502. The third support portion 1603 can be coupled to the third upper support portion 1503. Figure 31

[0527] The fourth support portion 1604 can be coupled to the fourth upper support portion 1504. The fifth support portion 1605 can be coupled to the eighth upper support portion 1508. The sixth support portion 1606 and the seventh support portion 1607 can be coupled to the seventh upper support portion 1507.

[0528] The first support portion 1601 to the eighth support portion 1608 can each be a wire. Two of the first support portion 1601 to the eighth support portion 1608 can be disposed at each of the four corner portions of the housing 1310.

[0529] The conductive member 1610 can be coupled to the upper support member 1510 and the lower support member 1520. An upper end of the conductive member 1610 can be coupled to the upper support member 1510. A lower end of the conductive member 1610 can be coupled to the lower support member 1520. The conductive member 1610 can electrically connect the upper support member 1510 to the lower support member 1520. A length of the conductive member 1610 in a length direction can be less than a length of the second support member 1600 in the length direction. The conductive member 1610 can be disposed at one side corner of the housing 1310. The conductive member 1610 can be spaced apart from the second support member 1600. The conductive member 1610 can be disposed at an outer side portion compared to the second support member 1600. The conductive member 1610 can be disposed at an inner side portion compared to the second support member 1600. The conductive member 1610 can be disposed adjacent to the second support member 1600. Two support portions 1602 and 1603 and two conductive portions 1611 and 1612 can be disposed at one side corner of the housing 1310.

[0530] The conductive member 1610 can include two conductive portions 1611 and 1612 spaced apart from each other. The conductive member 1610 can include a first conductive portion 1611 and a second conductive portion 1612 spaced apart from each other. The first conductive portion 1611 and the second conductive portion 1612 can be spaced apart from each other.

[0531] ​The first conductive portion 1611 can be coupled to the fifth upper support portion 1505 and the first lower support portion 1520a. The first conductive portion 1611 can electrically connect the fifth upper support portion 1505 and the first lower support portion 1520a to each other. The second conductive portion 1612 can be coupled to the sixth upper support portion 1506 and the second lower support portion 1520b. The second conductive portion 1612 can electrically connect the sixth upper support portion 1506 and the second lower support portion 1520b to each other.

[0532] A damper (not shown) can be disposed on the second support member 1600. The damper can be disposed on the second support member 1600 and the housing 1310. The damper can be disposed on the first support member 1500. The damper can be disposed on the first support member 1500 and / or the second support member 1600 to prevent a resonance phenomenon from occurring in the first support member 1500 and / or the second support member 1600. An impact absorbing portion (not shown) can be provided on any one or more of the first support member 1500 and the second support member 1600. The impact absorbing portion can be formed by changing a shape of a portion of the first support member 1500 and / or the second support member 1600.

[0533] The first sensor unit 1700 can be provided for autofocus feedback. The first sensor unit 1700 can detect movement of the coil holder 1210 in the optical axis direction. The first sensor unit 1700 can detect an amount of movement of the coil holder 1210 in the optical axis direction and can provide the detected amount of movement of the controller in real time.

[0534] The first sensor unit 1700 can include a first sensor 1710, a plate 1720, and a sensing magnet 1730. However, any one or more of the first sensor 1710, the plate 1720, and the sensing magnet 1730 can be omitted or modified from the first sensor unit 1700. The first sensor unit 1700 can further include a compensation magnet 1740. However, the compensation magnet 1740 is hardly related to sensing of a position of the coil holder 1210, and thus can be described as a component separated from the first sensor unit 1700.

[0535] The first sensor 1710 can be disposed for autofocus feedback. In this case, the first sensor 1710 can be referred to as an "AF feedback sensor". The first sensor 1710 can detect the sensing magnet 1730. The first sensor 1710 can detect the sensing magnet 1730 disposed on the coil holder 1210. The first sensor 1710 can detect the position of the coil holder 1210. The first sensor 1710 can detect the amount of movement of the coil holder 1210 in the optical axis direction. The first sensor 1710 can be disposed in the housing 1310. The first sensor 1710 can be disposed on the board 1720. The first sensor 1710 can be electrically connected to the board 1720. The first sensor 1710 can be a Hall sensor. The first sensor 1710 can be a Hall integrated circuit (IC). The first sensor 1710 can detect the magnetic force of the sensing magnet 1730. That is, when the coil holder 1210 moves, the first sensor 1710 can detect the change in the magnetic force changed due to the movement of the sensing magnet 1730, and the first sensor 1710 can detect the amount of displacement of the coil holder 1210. According to the present embodiment, the first sensor 1710 can be integrated into the driver 1750. Alternatively, the first sensor 1710 can include the driver 1750 configured in the first sensor 1710. In this case, the integrated structure of the first sensor 1710 and the driver 1750 can be referred to as a Hall driver IC 1070.

[0536] The board 1720 can be disposed in the housing 1310. The board 1720 can be coupled to the first sensor 1710. The board 1720 can be electrically connected to the first sensor 1710. The board 1720 can be coupled to the upper support member 1510. The board 1720 can be electrically connected to the first to sixth upper support portions 1501 to 1506 of the upper support member 1510. The board 1720 and the upper support member 1510 can be coupled to each other via welding.

[0537] The Hall driver IC 1070 can be disposed on the board 1720. The first sensor 1710 and the driver 1750 can be disposed on the lower surface of the board 1720. Six terminals 1721 to 1726 spaced apart from each other can be formed on the upper surface of the board 1720. In this case, the six terminals 1721 to 1726 can form pairs with the six upper support portions 1501 to 1506 and can be electrically connected to the six upper support portions 1501 to 1506.

[0538] Four of the six terminals 1721 to 1726, 1721, 1722, 1723, and 1724, can be connected to the plate 1410 through the upper support member 1510, the second support member 1600, and the plate portion 1421. The remaining two of the six terminals 1721 to 1726, 1725, and 1726, can be connected to the AF driving coil 1220 through the upper support member 1510, the conductive member 1610, and the lower support member 1520.

[0539] The sensing magnet 1730 can be disposed on the coil holder 1210. The sensing magnet 1730 can be detected by the first sensor 1710. The sensing magnet 1730 can face the first sensor 1710. The sensing magnet 1730 can be shaped like a hexahedron. However, the shape of the sensing magnet 1730 can not be limited thereto. The sensing magnet 1730 can be disposed at one side portion of the coil holder 1210. The sensing magnet 1730 can be disposed at a corner portion of the coil holder 1210. That is, the sensing magnet 1730 can be disposed to face a corner portion of the housing 1310.

[0540] The compensation magnet 1740 can be disposed on the coil holder 1210. The compensation magnet 1740 can be disposed to balance the magnetic force of the sensing magnet 1730. The compensation magnet 1740 can be symmetrical with the sensing magnet 1730 based on the optical axis. The compensation magnet 1740 can be disposed at a position corresponding to the sensing magnet 1730 based on the optical axis.

[0541] The compensation magnet 1740 can have a size and / or shape corresponding to the sensing magnet 1730 based on the optical axis. The compensation magnet 1740 can be disposed at the other side portion (one side portion opposite to the one side portion) of the coil holder 1210. That is, the sensing magnet 1730 can be disposed at one side portion of the coil holder 1210, and the compensation magnet 1740 can be disposed at the other side portion of the coil holder 1210. The compensation magnet 1740 can be disposed at a corner portion of the coil holder 1210. That is, the compensation magnet 1740 can be disposed to face a corner portion of the housing 1310. The compensation magnet 1740 can be configured to balance with the sensing magnet 1730. In this case, the compensation magnet 1740 can be referred to as a "balancing magnet".

[0542] The second sensor unit 1800 can be provided for hand-shake correction feedback. In this case, the second sensor unit 1800 can be referred to as an "OIS feedback sensor". The second sensor unit 1800 can detect the movement of the housing 1310. The second sensor unit 1800 can move or tilt the housing 1310 and / or the coil holder 1210 in a direction perpendicular to the optical axis. The second sensor unit 1800 can detect the driving magnet 1320.

[0543] The second sensor unit 1800 can detect the driving magnet 1320 disposed in the housing 1310. The second sensor unit 1800 can detect the position of the housing 1310. The second sensor unit 1800 can detect the amount of movement of the housing 1310 in a direction perpendicular to the optical axis. In this case, the amount of movement of the housing 1310 in the direction perpendicular to the optical axis can correspond to the amount of movement of the coil holder 1210 and the lens module coupled to the coil holder 1210.

[0544] The second sensor unit 1800 can be disposed on the stator 1400. The second sensor unit 1800 can be disposed on the lower surface of the plate 1410. The second sensor unit 1800 can be electrically connected to the plate 1410. The second sensor unit 1800 can be disposed on the base 1430.

[0545] The second sensor unit 1800 can be accommodated in a sensor coupling portion 1433 formed on the upper surface of the base 1430. The second sensor unit 1800 can be a Hall sensor. The second sensor unit 1800 can be a Hall integrated circuit (IC). The second sensor unit 1800 can detect the magnetic force of the driving magnet 1320.

[0546] That is, when the housing 1310 moves, the second sensor unit 1800 can detect a change in the magnetic force changed due to the movement of the driving magnet 1320, and the second sensor unit 1800 can detect the amount of displacement of the housing 1310. A plurality of second sensor units 1800 can be provided. For example, two second sensor units 1800 can be provided to detect the movement of the housing 1310 in the x-axis and the y-axis (here, the optical axis is the z-axis).

[0547] The Hall driver IC 1070 can be disposed in the plate 1720. The Hall driver IC 1070 can be understood as a component formed by integrally constructing the first sensor 1710 with the driver 1750. The Hall driver IC 1070 can have a temperature detection function. According to the present embodiment, even if a temperature change occurs, the auto focus feedback can be precisely controlled by the temperature detection function of the Hall driver IC 1070.

[0548] The first sensor 1710 can be formed of a silicon-based material. In this case, as the surrounding temperature increases, the output of the first sensor 1710 can increase. According to another embodiment, the first sensor 1710 can be formed of GaAs. In this case, the output of the first sensor 1710 with respect to the surrounding temperature can have a slope of about -0.06% / °C.

[0549] The Hall driver IC1070 may also include a temperature sensing device (not shown) for detecting ambient temperature. The temperature sensing device may output a temperature detection signal to the driver 1750 based on the ambient temperature measurement result of the Hall driver IC1070.

[0550] The first sensor 1710 can generate an output based on the detection result of the magnetic force intensity of the sensing magnet 1730. The driver 1750 can output a drive signal for driving the first sensor 1710 and a drive signal for driving the AF drive coil 1220. The driver 1750 can receive a clock signal SCL, a data signal SDA, and power signals VCC and GND from the controller 80 using a data communication protocol, such as I2C communication. The driver 1750 can use the clock signal SCL and the power signals VCC and GND to generate the drive signals for driving the first sensor 1710 and the AF drive coil 1220.

[0551] Driver 1750 can receive the output of the first sensor 1710. Driver 1750 can transmit the clock signal SCL and data signal SDA regarding the output of the first sensor 1710 to controller 1080 using data communication protocols such as I2C communication. Driver 1750 can receive temperature detection signals measured by a temperature sensing device. Driver 1750 can transmit the temperature detection signals to controller 1080 using data communication protocols such as I2C communication.

[0552] like Figure 32 As shown, the Hall driver IC 1070 may include six required pins. More specifically, the six required pins may include SCL, SDA, VCC, GND, VCM+, and VCM-. SCL may be a component for clock (time) information. SDA may be a component for data information. VCC and GND may be components for power supply. VCM+ and VCM- may be components for supplying current to the AF drive coil 1220.

[0553] The six required pins of the Hall driver IC 1070 can be paired with and electrically connected to the six terminals 1721 to 1726 of the board 1720. More specifically, the SCL, SDA, VCC, and GND pins of the Hall driver IC 1070 can be paired with and electrically connected to the first terminals 1721 to the fourth terminals 1724 of the board 1720.

[0554] The VCM+ and VCM- of the Hall driver IC 1070 can form a pair with the fifth terminal 1725 and the sixth terminal 1726 of the board 1720 and can be electrically connected to the fifth terminal 1725 and the sixth terminal 1726. For reference, the fifth terminal 1725 can be coupled to one end of the AF driving coil 1220 through the fifth upper support portion 1505, the first conductive portion 1611, and the first lower support portion 1520a. The sixth terminal 1726 can be coupled to the other end of the AF driving coil 1220 through the sixth upper support portion 1506, the second conductive portion 1612, and the second lower support portion 1520b.

[0555] The Hall driver IC 1070 can include two options (test pins). In more detail, the two options can be a test part and a Hall output part. The test part can be a part for testing the operation of the Hall driver IC 1070. The Hall output part can be a part for processing a Hall value detected by the first sensor 1710 and transmitting the value to the controller 1080. For reference, even without the Hall output part, a detection value detected by the first sensor 1710 can be transmitted to the controller 1080 through the SCL and the SDA. However, a difference between the two can correspond to a difference in format of data for transmitting a detection value detected by the first sensor 1710. For example, in the case where a detection value of the first sensor 1710 is transmitted to the controller 1080 through the SCL and the SDA, an analog signal can be transmitted. In the case where a detection value of the first sensor 1710 is transmitted to the controller 1080 through the Hall output part, a digital signal can be transmitted. However, the above description is merely exemplary, and on the other hand, a digital signal can be transmitted through the SCL and the SDA and an analog signal can be transmitted through the Hall output part.

[0556] The Hall driver IC 1070 can be electrically connected to the controller 1080. The Hall driver IC 1070 can be connected to the controller 1080 through the upper support member 1510, the second support member 1600, the circuit member 1420, the board 1410, and the printed circuit board 1010. The Hall driver IC 1070 can transmit information to and receive information from the controller 1080 via I2C communication.

[0557] The Hall driver IC 1070 can include the first sensor 1710 and the driver 1750. However, any one or more of the first sensor 1710 and the driver 1750 can be omitted or modified from the Hall driver IC 1070.

[0558] The driver 1750 can be disposed on the board 1720. The driver 1750 can supply a current to the AF driving coil 1220. The driver 1750 can be electrically connected to the AF driving coil 1220 through the upper support member 1510, the conductive member 1610, and the lower support member 1520. The driver 1750 can have a temperature sensing function. The driver 1750 can be electrically connected to the first sensor 1710. The driver 1750 can be formed to be integrated into the first sensor 1710.

[0559] According to the present embodiment, the lens module and the Hall device of the first sensor 1710 can change with a change in temperature. In this case, the temperature change can be caused by a sensor temperature, a surrounding circuit temperature, a portable phone chip temperature, etc. The Hall device of the first sensor 1710 can be formed of GaAs. In this case, the Hall device can have a slope of about -0.06% / °C with respect to temperature. According to the present embodiment, the Hall driver IC 1070, which is a driving integrated product having a temperature sensing function and a Hall device function, can be applied to measure a temperature and set a Hall slope to 0 or to an opposite direction to a slope of a lens. According to the present embodiment, the conductive connection of the Hall driver IC 1070 can require six or more wires. This is different from a conventional Hall sensor requiring four wires.

[0560] As an example, a structure in which VCC- and VCC+ of the Hall driver IC 1070 are connected to the AF driving coil 1220 through the fifth terminal 1725 and the sixth terminal 1726 of the board 1720, the fifth upper support portion 1605 and the sixth upper support portion 1606, the first conductive portion 1611 and the second conductive portion 1612, and the first lower support portion 1520a and the second lower support portion 1520b has been described.

[0561] However, according to a modified example, any one of VCC- and VCC+ of the Hall driver IC 1070 can be coupled to the AF driving coil 1220 through the sixth upper support portion 1606. That is, the sixth upper support portion 1606 can be directly coupled to a wire of the AF driving coil 1220. In this case, the other of VCC- and VCC+ of the Hall driver IC 1070 can be electrically connected to the AF driving coil 1220 through the upper support member 1510, the conductive member 1610, and the lower support member 1520. In this case, the lower support member 1520 can inevitably include two partition members. That is, the lower support member 1520 can be integrally formed. According to the modified example, the number of wires included in the second support member 1600 and the conductive member 1610 can also be reduced.

[0562] Thus far, examples in which the upper support member 1510, the lower support member 1520, the second support member 1600, and the conductive member 1610 are formed as separate members have been described. However, according to a modified example, the second support member 1600 and the conductive member 1610 can be integrally formed with the upper support member 1510 or the lower support member 1520. For example, the second support member 1600 and / or the conductive member 1610 can be formed by bending a portion of the lower support member 1520 upward. Alternatively, the second support member 1600 and / or the conductive member 1610 can be formed by bending a portion of the upper support member 1510 downward.

[0563] Thus far, examples in which both the second support member 1600 and the conductive member 1610 are formed as wire members have been described. However, according to a modified example, any one or more of the second support member 1600 and the conductive member 1610 can be configured in the form of a spring or a sheet of iron. Alternatively, the second support member 1600 and the conductive member 1610 can be omitted, a through-hole (not shown) can be formed in the housing 1310 in the direction of the optical axis, and a conductive material can be inserted into the through-hole to replace the functions of the second support member 1600 and the conductive member 1610. Alternatively, a spring, a sheet of iron, or a conductive wire member can be inserted into the housing 1310.

[0564] Figure 33 is a perspective view of a camera module according to another embodiment.

[0565] Referring to Figure 33 , the camera module can include the lens moving device 1100, a lens module (not shown), an infrared blocking filter (not shown), the printed circuit board 1010, an image sensor (not shown), and the controller 1080. However, any one or more of the lens moving device, the lens module, the infrared blocking filter, the printed circuit board 1010, the image sensor, and the controller 1080 can be omitted or modified from the camera module.

[0566] The controller 1080 can be disposed on the printed circuit board 1010. For example, the controller 1080 can be disposed inside the lens moving device. As another example, the controller 1080 can be located outside the lens moving device.

[0567] The controller 1080 can individually control the direction, intensity, amplitude, etc. of the current applied to the AF driving coil 1220 and the OIS driving coil 1422 of the lens moving device 1100. However, the intensity of the current supplied to the AF driving coil 1220 can be controlled by the driver 1750 of the Hall driver IC 1070.

[0568] The controller 1080 can control the lens moving device 1100 to perform any one or more of the auto focus function and the hand-shake correction function of the camera module.

[0569] That is, the controller 1080 can control the lens moving device 1100 to move the lens module in the optical axis direction or to move or tilt the lens module in a direction perpendicular to the optical axis direction. The controller 1080 can perform any one or more of feedback control of the auto focus function and feedback control of the hand-shake correction function.

[0570] For example, the controller 1080 can receive position information of the coil holder 1210 or the housing 1310 detected by the first sensor unit 1700, the controller 1080 can control the current supplied to the AF driving coil 1220, and the controller 1080 can perform auto focus feedback control.

[0571] The controller 1080 can receive position information of the coil holder 1210 or the housing 1310 detected by the second sensor unit 1800, the controller 1080 can control the current supplied to the OIS driving coil 1422, and the controller 1080 can perform hand-shake correction feedback control.

[0572] The feedback control by the controller 1080 can be performed in real time, and thus the auto focus function and the hand-shake correction function can be performed more accurately. As Figure 31 The controller 1080 can be electrically connected to the Hall driver IC 1070 as shown in FIG. 1B. Figure 32 The controller 1080 can perform I2C communication with the Hall driver IC 1070 as shown in FIG. 1B.

[0573] Hereinafter, a description will be made on the operation of the camera module according to the present embodiment.

[0574] First, the auto focus function of the camera module according to the present embodiment will be described.

[0575] When power is supplied to the AF driving coil 1220, the AF driving coil 1220 can move with respect to the driving magnet 1320 through electromagnetic interaction between the AF driving coil 1220 and the driving magnet 1320. In this case, the coil holder 1210 to which the AF driving coil 1220 is coupled can move integrally with the AF driving coil 1220. That is, the coil holder 1210 to which the lens module is coupled can move in the optical axis direction with respect to the housing 1310. Such movement of the coil holder 1210 can cause movement of the lens module to approach or move away from the image sensor, and according to the present embodiment, power can be supplied to the AF driving coil 1220 to adjust the focus of the object. The aforementioned focus adjustment can be automatically performed according to the distance of the object.

[0576] In the camera module according to the present embodiment, autofocus feedback control can be performed to more accurately perform the autofocus function. The first sensor 1710 disposed in the housing 1310 can detect a magnetic field of the sensing magnet 1730 disposed on the coil holder 1210. Accordingly, as the coil holder 1210 moves relative to the housing 1310, the amount of the magnetic field detected by the first sensor 1710 can change. The first sensor 1710 can detect the amount of movement of the coil holder 1210 or the position of the coil holder 1210 using this method, and can transmit the detected value to the controller. The controller can determine whether the coil holder 1210 is additionally moved through the received detected value. This process is performed in real time, and thus the autofocus function of the camera module according to the present embodiment can be more accurately performed through the autofocus feedback control. According to the present embodiment, the first sensor 1710 is mounted in the Hall driver IC 1070 having a temperature detection function, and thus accurate autofocus feedback control can be achieved even if a temperature change occurs.

[0577] A hand-shake correction function of the camera module according to the present embodiment will be described. When power is supplied to the OIS driving coil 1422, the driving magnet 1320 can move relative to the OIS driving coil 1422 through electromagnetic interaction between the OIS driving coil 1422 and the driving magnet 1320. In this case, the housing 1310 to which the driving magnet 1320 is coupled can move integrally with the driving magnet 1320.

[0578] That is, the housing 1310 can move in a horizontal direction (i.e., a direction perpendicular to the optical axis) relative to the base 1430. However, in this case, tilting of the housing 1310 relative to the base 1430 can be guided. The coil holder 1210 can move integrally with the housing 1310 relative to the housing 1310 in the horizontal direction. Accordingly, such movement of the housing 1310 can cause the lens module coupled to the coil holder 1210 to move relative to the image sensor in a direction parallel to the direction in which the image sensor is placed. That is, according to the present embodiment, power can be supplied to the OIS driving coil 1422 to perform the hand-shake correction function.

[0579] The hand-shake correction feedback control can be performed for more accurate hand-shake correction function of the camera module according to the present embodiment. The second sensor unit 1800 disposed on the base 1430 can detect a magnetic field of the driving magnet 1320 disposed in the housing 1310. Accordingly, the amount of the magnetic field detected by the second sensor unit 1800 can change when the housing 1310 is relatively moved with respect to the base 1430. The pair of second sensor units 1800 can detect the amount of movement or position of the housing 1310 in the horizontal direction (x-axis and y-axis directions) using this method, and can transmit the detected value to the controller. The controller can determine whether the housing 1310 is additionally moved through the received detected value. This process can be performed in real time, and thus the hand-shake correction function of the camera module according to the present embodiment can be more accurately performed through the hand-shake correction feedback control.

[0580] The lens moving apparatus 100 according to the embodiment can be included in an optical instrument that forms an image of an object in a space by using optical characteristics including reflection, refraction, absorption, interference, diffraction, etc. to enhance visual acuity of an eye, record or reproduce an image via a lens, perform optical measurement, or propagate or transmit an image. For example, the optical instrument according to the embodiment can include a smart phone and a portable terminal installed with a camera.

[0581] Figure 34 FIG. 1 is a perspective view of a portable terminal 200A according to an embodiment. Figure 35 FIG. 2 is a diagram illustrating a configuration of the portable terminal shown in FIG. 1. Figure 34

[0582] Referring to FIGS. 1 and 2, Figure 34 and Figure 35 the portable terminal 200A (hereinafter, referred to as a "terminal") can include a body 850, a wireless communication unit 710, an audio / video (A / V) input unit 720, a sensing unit 740, an input / output unit 750, a storage unit 760, an interface unit 770, a controller 780, and a power supply 790.

[0583] Figure 34 The body 850 shown in FIG. 1 can be configured in the form of a bar, but embodiments are not limited thereto, and two or more sub-bodies can be coupled to relatively move and can be configured in various structures such as a sliding type, a folding type, a swing type, or a swirl type.

[0584] The body 850 can include a case (e.g., a housing, a cover, or a cover) forming an appearance. For example, the body 850 can be divided into a front case 851 and a rear case 852. Various electronic components of the terminal can be mounted in a space formed between the front case 851 and the rear case 852.

[0585] ​The wireless communication unit 710 can include one or more modules for enabling wireless communication between the terminal 200A and a wireless communication system or between the terminal 200A and a network to which the terminal 200A belongs. For example, the wireless communication unit 710 can include a broadcast receiving module 711, a mobile communication module 712, a wireless Internet module 713, a near field communication module 714, and a location information module 715.

[0586] The A / V input unit 720 can be used to input audio signals or video signals, and can include a camera 721, a microphone 722, etc.

[0587] The camera 721 can be a camera module including a camera 200 according to the embodiments shown in FIGS. 1 to 6. Figure 22 or Figure 33 The camera 721 can be a camera module including a camera 200 according to the embodiments shown in FIGS. 1 to 6.

[0588] The sensing unit 740 can detect a current state of the terminal 200A, such as a power-on or power-off state of the terminal 200A, a location of the terminal 200A, a presence or absence of user contact, orientation or acceleration / deceleration of the terminal 200A, and the like, and can generate a sensing signal for controlling the operation of the terminal 200A. For example, when the terminal 200A is configured as a slide phone, the sensing unit 740 can sense whether a slide phone is opened or closed. In addition, the sensing unit 740 can perform a sensing function associated with whether a power source unit 790 supplies power, whether an interface unit 770 is coupled with an external device, and the like.

[0589] The input / output unit 750 can generate input or output associated with a visual, an auditory, a tactile, etc. The input / output unit 750 can generate input data for controlling the operation of the terminal 200A, and can display information processed by the terminal 200A.

[0590] The input / output unit 750 can include a keypad portion 730, a display panel 751, a sound output module 752, and a touch screen panel 753. The keypad portion 730 can generate input data in response to a keypad input.

[0591] The display panel 751 can include a plurality of pixels, a color of the display panel 751 being changed according to an electrical signal. For example, the display panel 751 can include at least one of a liquid crystal display, a thin film transistor-liquid crystal display, an organic light emitting diode, a flexible display, and a 3D display.

[0592] The sound output module 752 can output audio data received from the wireless communication unit 710 in a call signal reception mode, a phone call mode, a recording mode, a voice recognition mode, a broadcast reception mode, etc., or can output audio data stored in the storage unit 760.

[0593] The touch screen panel 753 can convert a change in capacitance generated by a user touching a specific area of the touch screen into an electrical input signal.

[0594] The storage unit 760 can store programs for processing and controlling the controller 780, and can temporarily store input / output data (for example, a phonebook, information, audio, a still image, a picture, or a video image). For example, the storage unit 760 can store an image, for example, a picture or a video image, captured by the camera 721.

[0595] The interface unit 770 can function as a path for connecting with an external device connected to the terminal 200A. The interface unit 770 can receive data from the external device, can receive power, and can transmit power to each of the components inside the terminal 200A, or can transmit data inside the terminal 200A to the external device. For example, the interface unit 770 can include a wired / wireless headset port, an external charger port, a wired / wireless data port, a storage card port, a port for connecting a device including an identification module, an audio input / output (I / O) port, a video I / O port, an earphone port, and the like.

[0596] The controller 780 can control overall operations of the terminal 200A. For example, the controller 780 can perform a related control and processing for a voice call, data communication, a video call, and the like.

[0597] The controller 780 can include a multimedia module 781 for multimedia reproduction. The multimedia module 781 can be implemented in the controller 180, or can be implemented separately from the controller 780.

[0598] The controller 780 can perform a pattern recognition process for recognizing a writing input or a drawing input performed on the touch screen as a character and an image.

[0599] The power supply 790 can receive external power or internal power, and can supply power required for operations of each component under control of the controller 780.

[0600] Features, structures, and effects associated with the above-described embodiments are incorporated into at least one embodiment of the present disclosure, but are not limited to only one embodiment. Also, features, structures, and effects associated with examples of each embodiment can be implemented in other embodiments by being combined or modified by those skilled in the art. Accordingly, what is related to these combinations and modifications should be interpreted to fall within the scope of the present disclosure.

[0601] Industrial applicability

[0602] Embodiments can be used in lens moving apparatuses and camera modules and optical instruments including the same for reducing size, reducing current consumption, and improving driving sensitivity of an optical image stabilizer (OIS).

Claims

1. A lens moving apparatus comprising: a housing; a coil holder disposed in the housing; a first coil disposed on an outer surface of the coil holder; a first magnet disposed on the housing and configured to move the coil holder in an optical axis direction by interaction with the first coil; a first circuit board disposed on a corner portion of the housing, and including a first pad, a second pad, a third pad, a fourth pad, a fifth pad, and a sixth pad; a first position sensor disposed on the first circuit board and electrically connected to the first pad, the second pad, the third pad, the fourth pad, the fifth pad, and the sixth pad; and an upper elastic member coupled to an upper portion of the housing, and including a first upper spring, a second upper spring, a third upper spring, a fourth upper spring, a fifth upper spring, and a sixth upper spring, wherein the first pad to the sixth pad of the first circuit board are spaced apart from the coil holder, wherein each of the first upper spring to the sixth upper spring includes a portion disposed on the corner portion of the housing, and wherein the portion of each of the first upper spring to the sixth upper spring is coupled to a corresponding one of the first pad to the sixth pad. The portion of each of the first upper spring to the sixth upper spring is coupled to the corresponding one of the first pad to the sixth pad by welding.

2. The lens moving apparatus according to claim 1, wherein The magnet is disposed on a side portion of the housing.

3. The lens moving apparatus according to claim 1, wherein 4.The lens moving apparatus of claim 1, comprising a second magnet disposed on the coil holder to face the first magnet. The lens moving apparatus comprises a third magnet disposed on the coil holder to be opposite to the second magnet.

5. The lens moving apparatus according to claim 4, wherein The coil holder includes a first groove for accommodating the second magnet and a second groove for accommodating the third magnet.

6. The lens moving apparatus according to claim 5, wherein 7.The lens moving apparatus of claim 1, comprising: a second circuit board disposed below the housing; and a support member connecting the upper elastic member and the second circuit board. The support member is disposed at the corner portion of the housing. The support member is a suspension wire.

8. The lens moving apparatus according to claim 7, wherein 10.The lens moving apparatus of claim 7, comprising a second coil opposite to the first magnet, and 9. The lens moving apparatus according to claim 8, wherein The second coil is configured to move the housing in a direction perpendicular to an optical axis by interaction with the first magnet. 11.The lens moving apparatus of claim 7, comprising: wherein a base disposed below the second circuit board; and a second position sensor including a first image stabilizer position sensor and a second image stabilizer position sensor, and configured to detect displacement of the housing in a direction perpendicular to an optical axis. ​ ​ ​ 12. The lens moving apparatus according to claim 11, wherein The first and second image stabilizer position sensors are disposed between the base and the second circuit board and are electrically connected to the second circuit board.

13. The lens moving apparatus according to claim 7, wherein The second circuit board includes a terminal surface bent from an upper surface of the second circuit board and a plurality of terminals formed on the terminal surface.

14. The lens moving apparatus according to claim 7, wherein The upper elastic member includes an outer frame coupled to the upper portion of the housing, an inner frame coupled to an upper portion of the coil holder, and a frame connection portion connecting the outer frame and the inner frame.

15. The lens moving apparatus according to claim 14, wherein The outer frame includes: a first coupling portion coupled to the corner portion of the housing; a second coupling portion coupled to the support member; a first connection portion connecting a first area of the first coupling portion and the second coupling portion; and a second connection portion connecting a second area of the first coupling portion and the second coupling portion.

16. The lens moving apparatus according to claim 10, wherein The first magnet includes first to fourth magnet units, and the housing includes four side portions, and wherein each of the first to fourth magnet units is disposed on a respective one of the four side portions of the housing.

17. The lens moving apparatus according to claim 1, wherein The first coil surrounds an outer surface of the coil holder in a rotation direction based on an optical axis.

18. The lens moving apparatus according to claim 4, wherein, The second magnet is disposed above the first coil and is spaced apart from the first coil.

19. The lens moving apparatus according to claim 14, wherein The outer frame includes a first hole, and the inner frame includes a second hole, and wherein the housing includes a first support protrusion coupled to the first hole, and the coil holder includes a second support protrusion coupled to the second hole.

20. The lens moving apparatus of claim 1, comprising a lower elastic member coupled to a lower portion of the housing and a lower portion of the coil holder.

21. The lens moving apparatus according to claim 7, wherein The support member includes first to fourth support members corresponding to the first to fourth upper springs, and wherein each of the first to fourth upper springs is connected to a respective one of the first to fourth support members.

22. The lens moving apparatus according to claim 21, wherein The first position sensor includes first to sixth terminals, and wherein each of the first to sixth terminals of the first position sensor is electrically connected to a respective one of the first to sixth pads of the first circuit board.

23. The lens moving apparatus according to claim 22, wherein, The first coil is electrically connected to the fifth and sixth upper springs.

24. The lens moving apparatus according to claim 23, wherein, The first position sensor is configured to provide a driving signal to the first coil.

25. The lens moving apparatus according to claim 22, wherein, The first terminal of the first position sensor is a terminal for a clock signal, the second terminal of the first position sensor is a terminal for data, the third and fourth terminals of the first position sensor are terminals for two power signals, and the fifth and sixth terminals of the first position sensor are terminals for providing a driving signal to the first coil.

26. The lens shifting device of claim 1, wherein, The first position sensor includes a driver and a Hall sensor.

27. The lens moving apparatus according to claim 11, wherein, Each of the first and second image stabilizer position sensors is a Hall sensor.

28. The lens shifting device of claim 16, wherein, The second coil includes first to fourth coil units corresponding to the first to fourth magnet units.

29. A camera module comprising: a lens; a lens movement device according to any one of claims 1 to 28; and an image sensor.

30. An optical instrument comprising the camera module according to claim 29.

Images