Laser lift-off device and method for preparing flexible display device

Abstract

The present invention relates to a laser peeling device and a method for preparing a flexible display device. The laser peeling device includes: a laser peeling platform for carrying a workpiece to be peeled; a laser emitting device, including a laser emitting cavity, a laser emitter, a focusing lens and a first driving mechanism, wherein the focusing lens is arranged in the laser emitting cavity, and the laser emitter is used to emit laser light toward the focusing lens to perform laser scanning processing on the workpiece to be peeled on the laser peeling platform; the focusing lens is connected to the first driving mechanism and moves up and down relative to the laser emitting cavity to adjust the focal position of the laser. The laser peeling device drives the focusing lens to move up and down relative to the laser emitting cavity through the first driving mechanism, and can flexibly adjust the position of the focusing lens relative to the laser emitting cavity, so that the focus of the laser adjusted by the focusing lens is just focused on the interface between the flexible display device and the supporting substrate, thereby improving the peeling effect.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a laser lift-off device and a method for preparing a flexible display device. Background Art

[0002] Currently, the manufacturing process for flexible display devices mostly involves coating a carrier substrate with a layer of polyimide (PI) as a flexible substrate, and then fabricating the flexible display device on the flexible substrate. When this flexible substrate is irradiated with a laser of a specific wavelength, its viscosity changes significantly. Laser lift-off (LLO) is then used to separate the flexible display device from the carrier substrate, resulting in the flexible display device.

[0003] See also Figure 1 A laser lift-off device is used to process the flexible display device 103 formed on the carrier substrate 101, thereby peeling the carrier substrate 101 off to produce the flexible display device 103. Specifically, during lift-off, the flexible display device 103 to be peeled off is placed on the laser lift-off platform with the carrier substrate 101 facing upward and the flexible display device 103 facing downward, contacting the laser lift-off platform. The laser 105 is adjusted so that the laser energy passes through the carrier substrate 101, and the laser focus 105 just sweeps across the flexible substrate 102 between the flexible display device 103 and the carrier substrate 101, weakening the adhesion of the flexible substrate 102 and thus separating the flexible display 103 from the carrier substrate 101. To change the adhesion of the PI, sufficient laser energy must be received, so it is generally required that the laser focus 105 hit the flexible substrate 102.

[0004] However, the laser beam is a linear light source, so the entire surface of the flexible substrate is scanned by keeping the beam stationary while the laser peeling platform moves. However, in actual production, it was found that the laser could not be precisely focused on the flexible substrate, resulting in poor peeling results. Summary of the Invention

[0005] Based on this, it is necessary to provide a laser lift-off device and a method for preparing a flexible display device that can improve the lift-off effect.

[0006] The present invention is achieved through the following technical solutions.

[0007] One aspect of the present invention provides a laser lift-off device, comprising:

[0008] A laser lift-off platform, configured to carry a workpiece to be lifted off, wherein the workpiece to be lifted off comprises a supporting substrate and a flexible display device disposed on the supporting substrate;

[0009] A laser emitting device includes a laser emitting cavity, a laser emitter, a focusing lens and a first driving mechanism; the focusing lens is arranged in the laser emitting cavity; the laser emitter is used to emit laser toward the focusing lens to perform laser scanning processing on the workpiece to be peeled on the laser peeling platform; the focusing lens is connected to the first driving mechanism, and the focusing lens is driven by the first driving mechanism to drive the focusing lens to move up and down relative to the laser emitting cavity, so as to adjust the focus of the laser to focus on the interface between the carrying substrate and the flexible display device during the laser scanning process.

[0010] In some embodiments, the first driving mechanism is disposed in the laser emitting cavity; and / or

[0011] There are two first driving mechanisms, which are respectively arranged at two ends of the focusing lens.

[0012] In some embodiments, when performing the laser scanning process, the laser peeling platform drives the workpiece to be peeled to move along a first direction, so that the laser emitted by the laser emitter is along a direction opposite to the first direction, and the laser scanning process is performed on the workpiece to be peeled in turn.

[0013] In some embodiments, the laser lift-off device further comprises:

[0014] A leveling device, wherein the leveling device has a pressing member; one end of the pressing member is connected to the laser emission cavity, and the other end of the pressing member is used to press the workpiece to be peeled off in sequence along a direction opposite to the first direction when performing the laser scanning process, so that the area of ​​the workpiece to be peeled off that has been processed by the laser scanning is in a flat state.

[0015] In some embodiments, the leveling device further comprises:

[0016] The second driving mechanism is used to drive the pressing member to move up and down relative to the laser emitting cavity so that the pressing member presses the workpiece to be peeled.

[0017] In some embodiments, the leveling device further comprises:

[0018] A buffer mechanism is provided between the second driving mechanism and the pressing member.

[0019] In some embodiments, the leveling device further comprises:

[0020] The roller is arranged at the end of the pressing member for pressing, and the outer surface of the roller is wrapped with a buffer layer.

[0021] In some embodiments, the number of the leveling devices is at least two, and the pressing members of at least two of the leveling devices are respectively disposed on both sides of the laser emitting device.

[0022] In some embodiments, the pressing members of at least two of the leveling devices are arranged sequentially in the first direction.

[0023] Another aspect of the present invention provides a method for preparing a flexible display device, using any of the laser lift-off devices described above, comprising the following steps:

[0024] Placing a workpiece to be peeled off on the laser peeling platform, wherein the workpiece to be peeled off includes a carrier substrate and a flexible display device disposed on the carrier substrate;

[0025] The laser emitter emits laser light toward the focusing lens and performs laser scanning on the workpiece to be peeled off on the laser peeling platform; the focusing lens is driven by the first driving mechanism to move up and down relative to the laser emission cavity so that the focus of the laser light is focused on the interface between the carrier substrate and the flexible display device;

[0026] The flexible display device is separated from the carrier substrate.

[0027] The above-mentioned laser lift-off equipment is used to lift the flexible display device to be peeled. The flexible display device to be peeled is placed on the laser lift-off platform with the carrier substrate facing upward and the flexible display device facing downward, in contact with the laser lift-off platform. A first drive mechanism drives the focusing lens to move up and down relative to the laser emission cavity, allowing for flexible adjustment of the position of the focusing lens relative to the laser emission cavity, and thereby adjusting the distance between the focusing lens and the workpiece to be peeled. This allows the focusing lens to adjust the focus of the laser to always focus on the interface between the flexible display device and the carrier substrate for laser scanning, effectively separating the flexible display device from the carrier substrate and improving the lift-off effect.

[0028] The setting of the first driving mechanism improves the adaptability to situations where the thickness of the carrier substrate in the flexible display device to be peeled off is different, and can facilitate more flexible adjustment of the focus position of the laser emitted by the laser emitting device to always be at the required position in this situation, thereby solving the focus focusing problem of the laser emitted by the laser emitting device when the laser peeling operation needs to be performed on the carrier substrate with a larger thickness or the flexible display device on the transport pallet. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1Schematic diagram of the traditional laser lift-off method;

[0030] Figure 2 Schematic diagram of the structure of a laser lift-off device according to one embodiment of the present invention;

[0031] Figure 3 FIG. 1 is a schematic diagram of position adjustment of a focusing lens according to an embodiment of the present invention.

[0032] Description of reference numerals:

[0033] 101: carrier substrate; 102: flexible substrate;

[0034] 103: Flexible display device; 104: Laser;

[0035] 105: focus; 201: laser;

[0036] 20: Laser peeling equipment; 210: Laser peeling platform;

[0037] 202: focus; 221: laser emission cavity;

[0038] 220: laser emitting device; 223: first driving mechanism;

[0039] 222: focusing lens; 231: holding member;

[0040] 230: leveling device; 233: buffer mechanism;

[0041] 232: second driving mechanism; 234: roller. DETAILED DESCRIPTION

[0042] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0044] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0045] In the present invention, unless otherwise expressly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. The terms "vertical," "horizontal," "up," "down," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0047] See also Figure 2 In one embodiment of the present invention, a laser lift-off device 20 is provided, comprising a laser lift-off platform 210 and a laser emitting device 220 .

[0048] The laser lift-off platform 210 is used to carry the workpiece to be lifted off.

[0049] The laser emitting device 220 includes a laser emitting cavity 221, a laser emitter (not shown), a focusing lens 222 and a first driving mechanism 223. The focusing lens 222 is arranged in the laser emitting cavity 221. The laser emitter is used to emit laser 201 toward the focusing lens 222 to perform laser scanning processing on the workpiece to be peeled on the laser peeling platform 210; the focusing lens 222 is connected to the first driving mechanism 223 so that the focusing lens 222 can be raised and lowered relative to the laser emitting cavity 221 under the drive of the first driving mechanism 223 to adjust the focus of the laser so that the focus of the laser is focused on the interface between the supporting substrate 101 and the flexible display device 103 during laser scanning processing.

[0050] It is understandable that the laser is located on the side of the focusing lens 222 away from the laser stripping platform 210, and the laser source provided by the laser is a line light source. In the process of scanning the entire surface of the flexible substrate, the light beam is generally kept fixed, and the laser stripping platform 210 drives the workpiece to be stripped to move along a certain direction (for example, a first direction); therefore, the scanning direction of the laser emitter is opposite to the moving direction of the laser stripping platform 210, that is, the laser emitted by the laser emitter scans the workpiece to be stripped in sequence in a direction opposite to the first direction. It is understandable that the laser stripping device 20 also includes a driving mechanism (not shown) for driving the laser stripping platform 210 to move. Furthermore, the first direction is parallel to the plane where the laser stripping platform 210 is located.

[0051] Because the focusing lens of conventional laser emitting devices is fixed in position, its focal position cannot be adjusted. For example, in the specific example of a thick carrier substrate 101, one approach is to adjust the focal position by adjusting the height of the laser lift-off platform 210. However, in some cases, even when the laser lift-off platform 210 is raised to its highest position, it is still impossible to focus the laser emitting device 220 on the desired location, such as the flexible substrate. Furthermore, when the laser lift-off platform reaches its highest position, it can collide with the laser emitting device 220, causing interference.

[0052] The present invention drives the focusing lens 222 to move up and down relative to the laser emission cavity 221 through the first driving mechanism 232, which can flexibly adjust the height position of the focusing lens 222 relative to the laser emission cavity 221, and then adjust the distance between the focusing lens 222 and the workpiece to be peeled off, thereby facilitating the adjustment of the focal position of the laser so that the focus 202 of the laser 201 can be focused on the required position of the workpiece to be peeled off, such as the interface between the flexible display device 103 and the supporting substrate 101.

[0053] The present invention further provides a laser lift-off method, which can be performed using the laser lift-off device 20 described above, and includes the following steps S10 to S30:

[0054] S10 : placing the workpiece to be peeled off on the laser peeling platform 210 .

[0055] S20: The laser emitter emits a laser 201 toward the focusing lens 222 and performs laser scanning on the workpiece to be peeled on the laser peeling platform 210. The focusing lens 222 is driven by the first driving mechanism 223 to move up and down relative to the laser emission cavity 221 so that the focus 202 of the laser 201 is focused on the interface between the supporting substrate 101 and the flexible display device 103.

[0056] S30 : separating the flexible display device 103 from the carrier substrate 101 .

[0057] Accordingly, the present invention also provides a method for preparing a flexible display device 103, wherein the workpiece to be peeled includes a carrier substrate 101 and a flexible display device 103 disposed on the carrier substrate 101. The laser lift-off method and the method for preparing the flexible display device 103 will be described in detail below in conjunction with the structure of the laser lift-off apparatus 20.

[0058] Taking a workpiece to be peeled, comprising a carrier substrate 101 and a flexible display device 103 disposed on the carrier substrate 101, as an example, the above-described laser lift-off apparatus 20 is employed for lift-off. The workpiece to be peeled is placed on a laser lift-off platform 210. Specifically, the carrier substrate 101 is placed upward on the laser lift-off platform 210, while the flexible display device 103 faces downward and contacts the laser lift-off platform 210. The first drive mechanism 232 drives the focusing lens 222 up and down relative to the laser emission chamber 221, flexibly adjusting the height of the focusing lens 222 relative to the laser emission chamber 221 and thereby adjusting the distance between the focusing lens 222 and the workpiece to be peeled. This ensures that the laser light 201 passes through the carrier substrate 101, and that the laser focus 202 consistently scans the interface between the carrier substrate 101 and the flexible display device 103. This weakens the adhesion of the flexible substrate at the interface with the flexible display device 103, effectively separating the flexible display device 103 from the carrier substrate 101 and improving the lift-off effect.

[0059] It can be understood that the laser emission cavity 221 is provided with a laser emission outlet (not marked in the figure) for emitting the laser outward after passing through the focusing lens 222 .

[0060] See also Figure 3For carrier substrates 101 of varying thickness, the focal position 202 of the laser light 201 emitted by the laser emitting device 220 will also vary after passing through carrier substrates 101 of varying thicknesses. Therefore, when replacing carrier substrates 101 of varying thicknesses, the focal position 202 of the laser light 201 needs to be readjusted. Due to the provision of the first drive mechanism 232, there is no need to move the laser emission chamber 221 or adjust the laser lift-off platform 210 to its highest position. Instead, the first drive mechanism 232 merely drives the focusing lens 222 upward to adjust the focal position 202 of the laser light 201 to a desired location, thereby ensuring that the focal position 202 of the laser light 201 is focused on a desired location, such as the flexible substrate. Specifically, from left to right, the first drive mechanism 232 drives the focusing lens 222 upward to adjust the focal position of the focusing lens 222, ensuring that the focal position of the laser light 201 remains focused on the interface (flexible substrate) between the flexible display device 103 and the carrier substrate 101, even when the carrier substrate 101 has varying thicknesses.

[0061] The setting of the first driving mechanism 232 improves the adaptability to situations where the thickness of the carrier substrate 101 in the flexible display device 103 to be peeled off is different, and can facilitate more flexible adjustment of the focus position of the laser emitting device 220 to always be at the required position in this situation, thereby solving the problem that the focus of the laser emitted by the laser emitting device 220 cannot be focused on the required position such as the flexible substrate when the laser peeling operation needs to be performed on the carrier substrate 101 with a larger thickness or there is a flexible display device 103 on the transport pallet.

[0062] Furthermore, a first drive mechanism 232 is disposed within the laser emission cavity 221. Furthermore, two first drive mechanisms 232 are provided, one at each end of the focusing lens 222. Specifically, the two first drive mechanisms 232 are sequentially arranged in the first direction. By providing a first drive mechanism 232 at both ends of the focusing lens 222, the smooth raising and lowering of the focusing lens 222 can be ensured.

[0063] Furthermore, the first driving mechanism 232 is a lifting motor.

[0064] Furthermore, technicians have discovered in practice that the flexible display device 103 is prone to warping during the peeling process due to stress on the flexible substrate or stress from applying a protective film to the flexible display device 103 before peeling. If the flexible display device 103 warps, the laser focus will not be able to focus on the flexible substrate during the movement of the laser peeling platform. This will result in insufficient laser energy reaching the flexible substrate, causing laser scanning defects and ultimately failing to achieve a satisfactory peeling effect.

[0065] In some embodiments, the laser lift-off apparatus 20 further includes a leveling device 230. The leveling device 230 includes a holding member 231; one end of the holding member 231 is connected to the laser emission cavity 221, and the other end of the holding member 231 is used to sequentially hold the workpiece to be lift-off in a direction opposite to the first direction during the laser scanning process, so that the area of ​​the workpiece to be lift-off that has been subjected to the laser scanning process is in a level state.

[0066] Correspondingly, the above preparation method further includes: pressing the workpiece to be peeled during the laser scanning process, and the pressing member 231 presses the workpiece to be peeled so that the area of ​​the workpiece to be peeled that has been processed by the laser scanning process is in a flat state.

[0067] During the scanning process of the laser emitting device 220, the holding member 231 simultaneously holds the workpiece to be peeled, ensuring that the area of ​​the workpiece to be peeled after the laser scanning process remains flat. Finally, the flexible display device 103 is separated from the carrier substrate 101. This avoids the problem of insufficient laser energy during laser peeling of workpieces to be peeled that are prone to warping, such as the flexible display device 103, causing laser scanning defects. This further promotes the effective separation of the flexible display device 103 from the carrier substrate 101 and improves the peeling effect.

[0068] In some embodiments, the leveling device 230 further includes a second drive mechanism 223. The holding member 231 is connected to the laser emitting cavity 221 via the second drive mechanism 223. The second drive mechanism 223 is used to drive the holding member 231 to move up and down relative to the laser emitting cavity 221 to adjust the position of the holding end of the holding member 231 so that the holding member 231 can press the workpiece to be peeled.

[0069] The second drive mechanism 223 drives the holding member 231 to rise and fall relative to the laser emission cavity 221, thereby increasing the flexibility of the holding member 231. For example, the holding member 231 can be adapted to workpieces of varying thicknesses. The varying thickness of the workpiece will cause the distance between the workpiece and the laser emission cavity 221 to vary, requiring adjustment of the effective length of the holding member 231 to ensure that the holding member 231 can hold the workpiece. The effective length of the holding member 231 refers to the length of the holding member 231 between the laser emission cavity 221 and the workpiece.

[0070] It is understood that the thickness of the workpiece to be peeled varies with the thickness of the various layers within it. For example, the varying thickness of the substrate 101 of the workpiece to be peeled can also contribute to the variation in thickness of the workpiece to be peeled. In other words, the provision of the second drive mechanism 223 enhances the flexibility of the holding member 231 in adapting to varying thicknesses of the substrate 101.

[0071] Furthermore, the second drive mechanism 223 is a lifting motor. In one specific example, the holding member 231 is disposed outside the laser emitting cavity 221. In one specific example, the second drive mechanism 223 is disposed on the outer surface of the laser emitting cavity 221. One end of the holding member 231 is connected to the second drive mechanism 223, and the other end of the holding member 231 is a holding end.

[0072] Furthermore, the leveling device 230 includes a buffer mechanism 233, which is disposed between the second drive mechanism 223 and the holding member 231. The buffer mechanism 233 is used to cushion the impact force of the holding member 231 on the workpiece to be peeled, thereby reducing or preventing damage to the workpiece by the holding member 231. In one specific example, the buffer mechanism 233 is a buffer cylinder.

[0073] Furthermore, the leveling device 230 includes a roller 234, which is located at the end of the pressing member 231 used for pressing, i.e., the pressing end. The placement of the roller 234 at the pressing end of the pressing member 231 facilitates the movement of the laser lift-off platform 210 relative to the laser emission cavity 221 during laser scanning, reduces friction during movement, and helps prevent damage to the workpiece being lift-off by the pressing member 231.

[0074] Furthermore, the outer surface of roller 234 is coated with a buffer layer (not shown). This further reduces damage to the workpiece to be peeled by the holding member 231. In one embodiment, the buffer layer is made of rubber. More specifically, the interior of roller 234 is a stainless steel roller body.

[0075] In some embodiments, there are at least two leveling devices 230, and the pressing members 231 of at least two leveling devices 230 are respectively disposed on both sides of the laser emitting device 220. This can better ensure the flatness of the scanned area, improve the laser scanning effect of the flexible substrate, facilitate the effective separation of the flexible display device 103 from the carrier substrate 101, and enhance the peeling effect.

[0076] Furthermore, the pressing members 231 of the at least two leveling devices 230 are sequentially arranged in the first direction, so as to better ensure the flatness of the area of ​​the workpiece to be peeled that has been processed by laser scanning (ie, the scanned area).

[0077] Furthermore, the second drive mechanisms 223 in each leveling device 230 can be controlled independently or simultaneously. For example, in some examples, the second drive mechanisms 223 in each leveling device 230 can be controlled independently, so that the descending or ascending height of each holding member 231 can be adjusted according to specific needs, and do not need to be exactly the same. For example, fine-tuning can be performed based on the specific thickness of the location of the holding member 231, thereby greatly improving application adaptability.

[0078] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-described embodiments merely represent several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art may make several modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be based on the appended claims, and the description and drawings may be used to interpret the content of the claims.

Claims

1. A laser lift-off device, characterized in that: include: A laser lift-off platform, configured to carry a workpiece to be lifted off, wherein the workpiece to be lifted off comprises a supporting substrate and a flexible display device disposed on the supporting substrate; A laser emitting device, comprising a laser emitting cavity, a laser emitter, a focusing lens, and a first driving mechanism; the focusing lens is disposed within the laser emitting cavity; the laser emitter is configured to emit laser light toward the focusing lens to perform laser scanning processing on the workpiece to be peeled off on the laser peeling platform; the focusing lens is connected to the first driving mechanism and, driven by the first driving mechanism, moves up and down relative to the laser emitting cavity to adjust the focus of the laser light to the interface between the carrier substrate and the flexible display device during the laser scanning process; When performing the laser scanning process, the laser stripping platform drives the workpiece to be stripped to move along a first direction, so that the laser emitted by the laser emitter is in a direction opposite to the first direction, and sequentially performs the laser scanning process on the workpiece to be stripped; The laser stripping equipment also includes a leveling device; the leveling device has a pressing member, one end of which is connected to the laser emission cavity, and the other end of which is used to press the workpiece to be stripped in sequence along a direction opposite to the first direction during the laser scanning process, so that the area of ​​the workpiece to be stripped that has been processed by the laser scanning is in a flat state.

2. The laser lift-off device according to claim 1, wherein: The first driving mechanism is disposed in the laser emitting cavity; and / or There are two first driving mechanisms, which are respectively arranged at two ends of the focusing lens.

3. The laser lift-off device according to claim 1, wherein: The leveling device also includes: The second driving mechanism is used to drive the pressing member to move up and down relative to the laser emitting cavity so that the pressing member presses the workpiece to be peeled.

4. The laser lift-off device according to claim 3, wherein: The leveling device also includes: A buffer mechanism is provided between the second driving mechanism and the pressing member.

5. The laser lift-off device according to claim 1, wherein: The leveling device also includes: The roller is arranged at the end of the pressing member for pressing, and the outer surface of the roller is wrapped with a buffer layer.

6. The laser lift-off device according to any one of claims 1 to 5, wherein: The number of the leveling devices is at least two, and the pressing parts of the at least two leveling devices are respectively arranged on both sides of the laser emitting cavity.

7. The laser lift-off device according to claim 6, wherein: The pressing members of at least two of the leveling devices are arranged in sequence in the first direction.

8. A method for preparing a flexible display device, using the laser lift-off device according to any one of claims 1 to 7, characterized in that: The steps include: Placing a workpiece to be peeled off on the laser peeling platform, wherein the workpiece to be peeled off includes a carrier substrate and a flexible display device disposed on the carrier substrate; The laser emitter emits laser light toward the focusing lens and performs laser scanning on the workpiece to be peeled off on the laser peeling platform; the focusing lens is driven by the first driving mechanism to move up and down relative to the laser emission cavity so that the focus of the laser light is focused on the interface between the carrier substrate and the flexible display device; The flexible display device is separated from the carrier substrate.

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