Display module and manufacturing method thereof

Abstract

The present application provides a display module and a manufacturing method thereof, wherein a first terminal and a second terminal are connected by a conductive trace, the conductive trace comprises conductive particles and an adhesive, the adhesive can realize the connection between the conductive trace and the first terminal and the second terminal respectively, and the conductive particles can realize conduction between the first terminal and the second terminal. Compared with the high-temperature process greater than 150°C in the prior art, the present application can use a low temperature of less than 100°C to heat the semi-solid conductive adhesive on the first terminal and the second terminal to form a conductive trace connected to the first terminal and the second terminal, thereby avoiding the abnormal quality of the display module caused by the high-temperature process.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a manufacturing method thereof. Background Art

[0002] Today, the display field is developing rapidly. Full screen or ultra-large screen is the current research hotspot. How to achieve ultra-narrow border of display module is the key area of ​​focus.

[0003] Usually, the back side binding technology is used to realize the ultra-narrow frame of the display module. The back side binding is to connect the lead terminals of the display panel with the connection terminals in the chip-on-chip group through anisotropic conductive film or ultrasonic welding. The high temperature process environment of anisotropic conductive film or ultrasonic welding will cause abnormal conditions in the display module. For example, the temperature in the anisotropic conductive film or ultrasonic welding process is greater than 150°C. The high temperature will cause the internal materials of the display module to fail and affect the display of the display module. Therefore, it is necessary to design a display module to solve the problem of abnormal quality of the display module due to process conditions in the existing back side binding technology. Summary of the invention

[0004] The embodiment of the present application provides a display module and a manufacturing method thereof to solve the technical problem of abnormal quality of the display module due to process conditions in the existing back-side binding technology.

[0005] The present application provides a display module, including:

[0006] The display panel comprises a plurality of first terminals arranged at intervals;

[0007] A chip-on-film assembly is located on the backlight side of the display panel, and the chip-on-film assembly includes a plurality of second terminals arranged at intervals; and

[0008] A conductive layer is located between the display panel and the COF assembly, and the conductive layer connects the display panel and the COF assembly;

[0009] The conductive layer includes a plurality of conductive traces arranged at intervals, one end of each conductive trace is connected to the first terminal, and the other end of each conductive trace is connected to the second terminal, and the conductive trace includes conductive particles and an adhesive.

[0010] In the display module provided in the embodiment of the present application, the display panel includes a first surface located on the backlight side, and the first terminal is located on the first surface;

[0011] The COF assembly comprises a second surface away from the display panel, and the second terminal is located on the second surface;

[0012] The conductive layer is located between the first terminal and the second terminal, one end of the conductive layer is connected to the first terminal, and the other end of the conductive layer is connected to the second terminal.

[0013] In the display module provided in the embodiment of the present application, the conductive layer further includes a protective layer, which is disposed on a side of the conductive trace away from the display panel and covers the first terminal, the second terminal and the conductive trace.

[0014] In the display module provided in the embodiment of the present application, the COF component and the first terminal are arranged on the first surface with a spacing, and the display module further comprises a transition filling portion, which is arranged on the first surface and located between the COF component and the first terminal, and in the direction from the COF component to the first terminal, the thickness of the transition filling portion in the direction perpendicular to the display panel gradually decreases;

[0015] The conductive layer is disposed on the transition filling portion, and one end of the conductive layer is connected to the first terminal, and the other end of the conductive layer is connected to the second terminal.

[0016] In the display module provided in the embodiment of the present application, the transition filling portion includes a third surface away from the side of the display panel, the third surface is inclined to the display panel, the third surface connects the first surface and the second surface, and the third surface is a plane or a curved surface.

[0017] In the display module provided in the embodiment of the present application, an angle between the third surface and the bottom surface of the transition filling portion close to the display panel is 30° to 60°.

[0018] In the display module provided in the embodiment of the present application, the material of the conductive particles includes silver, copper, aluminum or carbon-based materials.

[0019] In the display module provided in the embodiment of the present application, the material of the protective layer includes a light-shielding material, and the light-shielding material includes epoxy resin or acrylic resin.

[0020] The present invention provides a method for manufacturing a display module, comprising the following steps:

[0021] A display panel is provided, the display panel comprising a plurality of first terminals arranged at intervals;

[0022] forming a chip-on-film assembly on the backlight side of the display panel, wherein the chip-on-film assembly includes a plurality of second terminals arranged at intervals;

[0023] A conductive layer is formed between the display panel and the COF assembly, the conductive layer comprising a plurality of conductive traces spaced apart, one end of each conductive trace being connected to the first terminal, and the other end of each conductive trace being connected to the second terminal, wherein the conductive trace comprises conductive particles and an adhesive.

[0024] In the method for manufacturing a display module provided in an embodiment of the present application, forming a conductive layer between the display panel and the COF assembly comprises the following steps:

[0025] Providing a conductive film layer, the conductive film layer comprising a protective layer, and a plurality of semi-solid conductive glues arranged at intervals on the protective layer, wherein the conductive glue comprises conductive particles, adhesive and solvent;

[0026] The conductive film layer is attached between the display panel and the COF module, with one end of the semi-solid conductive adhesive being located on the first terminal and the other end being located on the second terminal;

[0027] The conductive adhesive in a semi-solid state is heated and cured to form the conductive trace, so that one end of the conductive trace is overlapped with the first terminal, and the other end of the conductive trace is overlapped with the second terminal to form the conductive layer.

[0028] The beneficial effects of the present application are as follows: the present application provides a display module and a manufacturing method thereof, wherein a first terminal and a second terminal are connected by a conductive trace, the conductive trace comprises conductive particles and an adhesive, the adhesive can realize the connection of the conductive trace with the first terminal and the second terminal respectively, and the conductive particles can realize conduction between the first terminal and the second terminal. Compared with the high-temperature process greater than 150°C in the prior art, the present application can use a low temperature of less than 100°C to heat the semi-solid conductive adhesive on the first terminal and the second terminal to form a conductive trace connected to the first terminal and the second terminal, thereby avoiding the phenomenon of abnormal quality of the display module caused by the high-temperature process. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 A schematic diagram of a top view of the structure of a display module provided in an embodiment of the present application;

[0031] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle;

[0032] Figure 3 Schematic diagrams of two cross-sectional structures of the transition filling part of the embodiment of the present application;

[0033] Figure 4 A schematic diagram of a process for manufacturing a display module provided in an embodiment of the present application;

[0034] Figure 5-Figure 6 A schematic diagram of the structure of a method for manufacturing a display module provided in an embodiment of the present application;

[0035] Figure 7 A schematic flow chart of a method for forming a conductive layer between a display panel and a chip-on-film assembly according to an embodiment of the present application;

[0036] Figure 8 This is a schematic diagram of the top view structure of the conductive film layer provided in an embodiment of the present application.

[0037] Description of the accompanying drawings: 1-display panel, 11-first terminal, 12-display panel body, 2-chip-on-film assembly, 21-second terminal, 22-IC chip, 23-flexible circuit board, 3-conductive layer, 31-conductive trace, 32-protective layer, 30-conductive film layer, 301-conductive adhesive, 41-transition filling part, 51-first supporting layer, 52-buffer layer, 53-second supporting layer, 6-touch layer, 7-polarizing layer, 8-protective cover layer, A-first surface, B-second surface, C-third surface, a-angle between the third surface and the bottom of the transition filling part. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only one group of embodiments of the present application, not the embodiments of the whole group. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0039] The embodiments of the present application provide a display module and a method for manufacturing the same. The following are detailed descriptions. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0040] See also Figure 1-Figure 2 An embodiment of the present application provides a display module, comprising a display panel 1, a COF assembly 2 located on the backlight side of the display panel 1, and a conductive layer 3 located between the display panel 1 and the COF assembly 2; the display panel 1 comprises a plurality of first terminals 11 arranged at intervals; the COF assembly 2 comprises a plurality of second terminals 21 arranged at intervals; the conductive layer 3 connects the display panel 1 and the COF assembly 2; wherein the conductive layer 3 comprises a plurality of conductive traces 31 arranged at intervals, one end of the conductive trace 31 is connected to the first terminal 11, and the other end of the conductive trace 31 is connected to the second terminal 21, and the conductive trace 31 comprises conductive particles and an adhesive.

[0041] It is understandable that the display field is developing rapidly today. Full screen or ultra-large screen is the hot topic of current research. How to achieve ultra-narrow border of display module is the key area of ​​focus. Usually, the ultra-narrow border of display module is achieved by back-side binding technology. Back-side binding is to connect the lead terminals of display panel with the connection terminals in chip-on-chip film group through anisotropic conductive film or ultrasonic welding. The high temperature process environment of anisotropic conductive film or ultrasonic welding will cause abnormal conditions of display module. For example, the temperature in anisotropic conductive film or ultrasonic welding process is greater than 150℃. High temperature will cause the internal material of display module to fail and affect the display of display module. Therefore, it is necessary to design a display module to solve the problem of display module quality caused by process conditions in existing back-side binding technology. The phenomenon of abnormal quality; in the embodiment of the present application, the first terminal 11 and the second terminal 21 are electrically connected by the conductive trace 31, and the conductive trace 31 includes conductive particles and an adhesive. The adhesive can realize the connection of the conductive trace 31 with the first terminal 11 and the second terminal 21 respectively, and the conductive particles can realize the conduction between the first terminal 11 and the second terminal 21. Compared with the high-temperature process greater than 150°C in the prior art, the present application can use a low temperature of less than 100°C to heat the semi-solid conductive adhesive on the first terminal 11 and the second terminal 21 to form the conductive trace 31 connected to the first terminal 11 and the second terminal 21, thereby avoiding the phenomenon of abnormal quality of the display module caused by the high-temperature process.

[0042] It should be noted that in the prior art, when anisotropic conductive film is used to connect the lead terminal in the display panel and the connecting terminal in the chip-on-chip film group, a layer of anisotropic conductive film needs to be applied on the lead terminal of the display panel, and then the connecting terminal in the chip-on-chip film group is attached to the anisotropic conductive film, and the lead terminal and the connecting terminal need to be aligned one by one, and then the anisotropic conductive glue is cured at high temperature and high pressure to achieve conduction between the lead terminal and the connecting terminal. The process temperature is 170°C, and ultrasonic welding is used to connect the lead terminal in the display panel and the connecting terminal in the chip-on-chip film group. When connecting, the connecting terminal needs to be set on the lead terminal of the display panel, and the lead terminal and the connecting terminal need to be aligned one by one, and the lead terminal and the connecting terminal are directly connected and conductive by ultrasonic energy, and the process temperature is as high as 180°C. In other words, the anisotropic conductive film or ultrasonic welding method requires the lead terminal and the connecting terminal to be aligned up and down, and the process temperature exceeds 100°C. In the embodiment of the present application, the first terminal 11 and the second terminal 21 do not need to be aligned up and down, and the process temperature is less than 100°C. For details, refer to Figure 2 and Figure 8The conductive trace 31 connected to the first terminal 11 and the second terminal 21 is formed by evaporating the solvent of a semi-solid conductive glue 301 by heating. The semi-solid conductive glue 301 is bendable. One end of the semi-solid conductive glue 301 is located on the first terminal 11, and the other end is located on the second terminal 21. The conductive trace 31 is formed by evaporating the solvent by heating the conductive glue 301 at a low temperature, thereby realizing the conduction between the first terminal 11 and the second terminal 21, avoiding the abnormal quality of the display module caused by the high temperature process environment, and at the same time, there is no need to accurately align the first terminal 11 and the second terminal 21 up and down, thereby simplifying the process.

[0043] It is worth noting that the conductive trace 31 is in the shape of a strip, and the projection of the conductive trace 31 on the display panel 1 at least covers the projection of the first terminal 11 on the display panel 1, and the projection of the conductive trace 31 on the COF component 2 at least covers the projection of the second terminal 21 on the COF component 2, that is, the projection of the conductive trace 31 on the display panel 1 covers part of the projection of the first terminal 11 on the display panel 1, or the projection of the conductive trace 31 on the display panel 1 completely covers the projection of the first terminal 11 on the display panel 1, the projection of the conductive trace 31 on the COF component 2 covers part of the projection of the second terminal 21 on the COF component 2, and the projection of the conductive trace 31 on the COF component 2 completely covers the projection of the second terminal 21 on the COF component 2; the backlight side is the non-luminous surface of the display module, that is, the backlight side is the side of the display module away from the display surface;

[0044] In the embodiment of the present application, the display module also includes a first support layer 51, a buffer layer 52, and a second support layer 53 located between the display panel 1 and the chip-on-film assembly 2, the display module also includes a touch layer 6, a polarizing layer 7, and a protective cover layer 8 located on the light-emitting side of the display panel 1, and the display panel 1 also includes a display panel body 12 located on the side of the first terminal 11 away from the chip-on-film assembly 2.

[0045] In some embodiments, see Figure 2 The display panel 1 includes a first surface A located on the backlight side, and the first terminal 11 is located on the first surface A; the flip chip assembly 2 includes a second surface B away from the display panel 1, and the second terminal 21 is located on the second surface B; the conductive layer 3 is located between the first terminal 11 and the second terminal 21, and the other end of the conductive layer 3 is arranged on the second surface B and connected to the second terminal 21.

[0046] It can be understood that the display panel 1 includes metal wiring and metal electrodes, the metal wiring includes scan lines and data lines, the metal electrodes include source, drain, and gate of a thin film transistor, the display panel 1 includes a first surface A located on the backlight side, and a via hole perpendicular to the first surface A, a plurality of first terminals 11 are located on the first surface A and connected to the metal wiring and the metal electrode through the via hole, the chip-on-film component 2 is located on the first surface A, and the chip-on-film component 2 is spaced apart from the first terminal 11, the chip-on-film component 2 includes a second surface B away from the side of the display panel 1, and the chip-on-film component 2 includes an integrated circuit (Integrated IC) located on the second surface B. Circuit, IC) chip 22 and flexible circuit board 23, multiple second terminals 21 are located on the second surface B and connected to the IC chip 22, the conductive layer 3 is located between the first terminal 11 and the second terminal 21, and one end of the conductive layer 3 is connected to the first terminal 11, and the other end of the conductive layer 3 is connected to the second terminal 21, that is, the conductive layer 3 includes multiple conductive traces 31 arranged at intervals, one end of the conductive trace 31 is connected to the first terminal 11, and the other end of the conductive trace 31 is connected to the second terminal 21, so as to realize the connection between the display panel 1 and the flip chip assembly 2 Since the first surface A and the second surface B are both located on the backlight side, and the first terminal 11 and the second terminal 21 are also located on the backlight side, the conductive trace 31 respectively connected to the first terminal 11 and the second terminal 21 is also located on the backlight side, thereby avoiding the conductive trace 31 occupying the space on the side of the display panel 1, thereby realizing the narrow frame of the display module; preferably, the display module includes a display area, and the first terminal 11, the second terminal 21, and the conductive trace 31 can be located in the display area, thereby further reducing the frame of the display module, which is conducive to realizing the full-screen display module.

[0047] In the embodiment of the present application, the spacing between two adjacent first terminals 11 is equal to the spacing between two adjacent conductive traces 31, and the spacing between two adjacent second terminals 21 is equal to the spacing between two adjacent conductive traces 31, that is, the first terminals 11 are arranged at equal intervals, the second terminals 21 are arranged at equal intervals, and the conductive traces 31 are arranged at equal intervals, and in the direction from the flip chip assembly 2 to the first terminal 11, one second terminal 21 is set corresponding to one first terminal 11.

[0048] In some embodiments, see Figure 1-Figure 2The conductive layer 3 further includes a protective layer 32 , which is disposed on a side of the conductive trace 31 away from the display panel 1 and covers the first terminal 11 , the second terminal 21 and the conductive trace 31 .

[0049] It can be understood that the conductive layer 3 also includes the protective layer 32 located on the side of the conductive trace 31 away from the display panel 1, and the protective layer 32 covers the first terminal 11, the second terminal 21, and the conductive trace 31. In other words, the projection of the protective layer 32 on the display panel 1 completely covers the projection of the first terminal 11 on the display panel 1, the projection of the protective layer 32 on the display panel 1 completely covers the projection of the second terminal 21 on the display panel 1, and the projection of the protective layer 32 on the display panel 1 completely covers the projection of the conductive trace 31 on the display panel 1. The protective layer 32 can block the invasion of external water and oxygen, thereby preventing the first terminal 11, the second terminal 21 and the conductive trace 31 from being corroded and affecting the transmission of electrical signals.

[0050] In some embodiments, see Figure 2 The COF component 2 and the first terminal 11 are arranged on the first surface A with an interval, and the display module also includes a transition filling portion 41, which is arranged on the first surface A and is located between the COF component 2 and the first terminal 11. In the direction from the COF component 2 to the first terminal 11, the thickness of the transition filling portion 41 gradually decreases along the direction perpendicular to the display panel 1; the conductive portion is arranged on the transition filling portion 41, and one end of the conductive layer 3 is connected to the first terminal 11, and the other end of the conductive layer 3 is connected to the second terminal 21.

[0051] It can be understood that the conductive layer 3 also includes a transition filling portion 41 located between the first surface A and the conductive trace 31, and the transition filling portion 41 is also located between the flip chip film assembly 2 and the first terminal 11, that is, one end of the transition filling portion 41 can be connected to the first surface A, and the other end of the transition filling portion 41 can be connected to the second surface B. In the direction from the flip chip film assembly 2 to the first terminal 11, the thickness of the transition filling portion 41 gradually decreases along the direction perpendicular to the display panel. The conductive layer 3 is located on the transition filling portion 41, one end of the conductive layer 3 is connected to the first terminal 11, and the other end of the conductive layer 3 is connected to the second terminal 21, that is, the conductive trace 31 is located on the transition filling portion 41, and the transition filling portion 41 supports the conductive trace 31 to release the stress of the conductive trace 31, thereby reducing the risk of the conductive trace 31 breaking.

[0052] In some embodiments, see Figure 2-Figure 3 The transition filling portion 41 includes a third surface C away from the display panel 1, the third surface C is inclined to the display panel 1, the third surface C connects the first surface A and the second surface B, and the third surface C is a plane or a curved surface.

[0053] It can be understood that the transition filling portion 41 includes a third surface away from the side of the display panel 1, the third surface C is inclined to the display panel 1, and the third surface C connects the first surface A and the second surface B, that is, the height of the end of the transition filling portion 41 close to the first terminal 11 is equal to the height of the first terminal 11, and the height of the end of the transition filling portion 41 close to the second terminal 21 is equal to the distance between the first surface A and the second terminal 21 away from a top surface of the display panel 1, and the third surface C is a plane or a curved surface. Figure 3 b is the transition filling portion 41 of the third surface C which is a plane. Figure 3 In the middle, c is the transition filling part 41 of the third surface C which is an arc surface; preferably, the third surface C is an arc surface, and the conductive trace 31 is located on the first terminal 11, the second terminal, and the third surface C of the transition filling part 41, that is, the conductive trace 31 extends from the first terminal 11 through the third surface C to the second terminal 21, and the third surface C is convex in an arc shape toward the side away from the display panel 1, which is conducive to the smooth transition of the conductive trace 31 from the first terminal 11 to the second terminal 21 through the third surface C, further relieving the stress of the conductive trace 31, avoiding the situation of disconnection caused by stress concentration of the conductive trace 31, and further improving the reliability of the electrical connection.

[0054] In some embodiments, see Figure 2 The included angle between the third surface C and the bottom surface of the transition filling portion 41 close to the display panel 1 is 30° to 60°.

[0055] It can be understood that the third surface C is an inclined surface, and the angle between the third surface C and the ground of the transition filling portion 41 close to the display panel 1 is a, and the size of a represents the degree of inclination of the third surface C. The larger a is, the steeper the third surface C is, and the greater the stress on the conductive trace 31 located on the third surface C is, increasing the risk of segmentation of the conductive trace 31. The smaller a is, the flatter the third surface C is, and the more conducive to alleviating the stress of the conductive trace 31 is. However, since there is a certain height difference between the first terminal 11 and the second terminal 21, a cannot be infinitely small. Therefore, a is 30°~60°, which can effectively prevent the conductive trace 31 from being broken and ensure the reliability of the electrical connection.

[0056] In some embodiments, the conductive particles are made of silver, copper, aluminum or a carbon-based material.

[0057] It can be understood that the conductive trace 31 includes conductive particles, and the conductive particles can realize the electrical connection between the conductive trace 31 and the first terminal 11, and the electrical connection between the conductive trace 31 and the second terminal 21, so as to realize the conduction between the first terminal 11 and the second terminal 21. Specifically, the conductive particles include silver, copper, aluminum or carbon-based materials, and the conductive trace 31 also includes an adhesive so that the conductive trace 31 is overlapped with the first terminal 11 and the second terminal 21 respectively.

[0058] It should be noted that in the embodiment of the present application, the conductive particles adapted to a suitable adhesive can significantly reduce the process temperature. For example, the process temperature of the conductive silver paste system composed of silver and adhesive is significantly lower than the process temperature in the anisotropic conductive film process.

[0059] In some embodiments, the material of the protection layer 32 includes a light-shielding material, and the light-shielding material includes epoxy resin or acrylic resin.

[0060] It can be understood that the protective layer 32 is located on the side of the conductive trace 31 away from the display panel 1, and the protective layer 32 covers the first terminal 11, the second terminal 21, and the conductive trace 31. The protective layer 32 not only blocks the invasion of water and oxygen, but also prevents light leakage to meet the needs of end customers for the product. Specifically, the protective layer 32 includes a shading material, and the shading material includes epoxy resin or acrylate, and the color of the shading material is black.

[0061] In some embodiments, see Figure 4-Figure 6 The manufacturing method of the display module comprises the following steps:

[0062] S10: providing a display panel 1, wherein the display panel 1 comprises a plurality of first terminals 11 arranged at intervals;

[0063] Specifically, the display panel 1 includes a first surface A located on the backlight side, and the first terminal 11 is located on the first surface A.

[0064] S20: forming a chip-on-film assembly 2 on the backlight side of the display panel 1, wherein the chip-on-film assembly 2 includes a plurality of second terminals 21 arranged at intervals;

[0065] For details, see Figure 5 The chip-on-film assembly 2 is located on the first surface A of the display panel 1, and the chip-on-film assembly 2 is spaced apart from the first terminal 11. The chip-on-film assembly 2 includes a second surface B away from the display panel 1. The second terminal 21 is located on the second surface B. The first terminal 11 and the second terminal 21 are both facing the backlight side. In the direction from the chip-on-film assembly 2 to the first terminal 11, a first terminal 11 and a second terminal 21 are correspondingly arranged.

[0066] S30: A conductive layer 3 is formed between the display panel 1 and the COF assembly 2, wherein the conductive layer 3 includes a plurality of conductive traces 31 arranged at intervals, wherein one end of the conductive trace 31 is connected to the first terminal 11, and the other end of the conductive trace 31 is connected to the second terminal 21, wherein the conductive trace 31 includes conductive particles and an adhesive.

[0067] For details, see Figure 6The conductive layer 3 is located between the first terminal 11 and the COF module 2, and the conductive layer 3 includes a plurality of conductive traces 31 arranged at intervals, and the spacing between two adjacent conductive traces 31 is equal to the spacing between the two first terminals 11, and the spacing between two adjacent conductive traces 31 is equal to the spacing between two adjacent second terminals 21, which is conducive to using the conductive traces 31 with the minimum length to respectively connect the first terminal 11 and the second terminal 21, thereby saving costs; the conductive layer 3 also includes a protective layer 32 located on the side of the conductive trace 31 away from the display panel 1, and the protective layer 32 covers the first terminal 11, the second Terminals and the point-to-point wiring, that is, the projection of the protective layer 32 on the display panel 1 covers the projection of the first terminal 11 on the display panel 1, the projection of the protective layer 32 on the display panel 1 covers the projection of the second terminal 21 on the display panel 1, and the projection of the protective layer 32 on the display panel 1 covers the projection of the conductive wiring 31 on the display panel 1. The protective layer 32 can effectively prevent the intrusion of water and oxygen, which may cause corrosion of the first terminal 11, the second terminal and the conductive wiring 31, and the protective layer 32 uses shading material to prevent the display module from leaking light, thereby meeting the needs of end customers for products.

[0068] In some embodiments, see Figure 7 The step of forming a conductive layer between the display panel 1 and the COF module 2 comprises the following steps:

[0069] S301: providing a conductive film layer 30, wherein the conductive film layer comprises a protective layer 32, and a plurality of semi-solid conductive adhesives 301 arranged at intervals on the protective layer 32, wherein the conductive adhesives 301 include conductive particles, adhesives and solvents;

[0070] For details, see Figure 8 Inkjet printing, dispensing technology or aerosol printing technology can be used to produce multiple conductive glues 301 arranged at intervals on the protective layer 32. The conductive glue 301 is in a strip shape. Multiple conductive glues 301 are arranged on the protective layer 32 at equal intervals. The material of the conductive glue 301 includes conductive particles, adhesives and solvents. The solvent is conducive to uniform mixing of the conductive particles and the adhesive. For example, the conductive glue 301 can be conductive silver glue.

[0071] S302: attaching the conductive film layer 30 between the display panel 1 and the COF module 2, with one end of the semi-solid conductive adhesive 301 being located on the first terminal 11 and the other end being located on the second terminal 21;

[0072] For details, see Figure 6 and Figure 8 The conductive film layer 30 is attached between the display panel 1 and the COF module 2. One end of the semi-solid conductive glue 301 is located on the first terminal 11, and the other end is located on the second terminal 21. Since the conductive glue 301 includes an adhesive, it is beneficial to connect the conductive glue 301 to the first terminal 11 and the second terminal 21 respectively.

[0073] S303 : heating and curing the semi-solid conductive adhesive 301 to form the conductive trace 31 , so that one end of the conductive trace 31 is overlapped with the first terminal 11 , and the other end of the conductive trace 31 is overlapped with the second terminal 21 , so as to form the conductive layer 3 .

[0074] Specifically, the conductive film layer 30 is heated to evaporate the solvent of the semi-solid conductive glue 301 to form the solid conductive trace 31, and the heating temperature is lower than the process temperature of the anisotropic conductive film or ultrasonic welding to avoid failure of the internal material of the display module due to excessive temperature; the conductive layer 3 includes the conductive trace 31, and the protective layer 32 located on the side of the conductive trace 31 away from the display panel 1, one end of the conductive trace 31 is overlapped with the first terminal 11, and the other end of the conductive trace 31 is overlapped with the second terminal 21 to form the conductive layer 3, and the protective layer 32 covers the first terminal 11, the second terminal 21 and the conductive trace 31.

[0075] In an embodiment of the present application, the first terminal 11 and the second terminal 21 are electrically connected through the conductive trace 31, and the conductive trace 31 includes conductive particles and an adhesive. The adhesive can realize the connection of the conductive trace 31 with the first terminal 11 and the second terminal 21 respectively, and the conductive particles can realize the conduction between the first terminal 11 and the second terminal 21. Compared with the high-temperature process greater than 150°C in the prior art, the present application can use a low temperature of less than 100°C to heat the semi-solid conductive glue on the first terminal 11 and the second terminal 21 to form the conductive trace 31 connected to the first terminal 11 and the second terminal 21, thereby avoiding the abnormal quality of the display module caused by the high-temperature process.

[0076] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display module, characterized in that: include: The display panel comprises a plurality of first terminals arranged at intervals; A chip-on-film assembly is located on the backlight side of the display panel, and the chip-on-film assembly includes a plurality of second terminals arranged at intervals; as well as A conductive layer is located between the display panel and the COF assembly, and the conductive layer connects the display panel and the COF assembly; Wherein, the conductive layer comprises a plurality of conductive traces arranged at intervals, one end of each conductive trace is connected to the first terminal, and the other end of each conductive trace is connected to the second terminal, and the conductive trace comprises conductive particles and an adhesive; Wherein, the material of the conductive trace is set to be a semi-solid conductive glue, and the conductive glue contains the conductive particles, the adhesive and the solvent; The display panel includes a first surface located at the backlight side, the first terminal is located on the first surface, the COF module includes a second surface away from the display panel, the second terminal is located on the second surface, the conductive layer is located between the first terminal and the second terminal, one end of the conductive layer is connected to the first terminal, and the other end of the conductive layer is connected to the second terminal; The chip-on-film assembly and the first terminal are arranged on the first surface at intervals, the display module also includes a transition filling portion, the transition filling portion is arranged on the first surface and is located between the chip-on-film assembly and the first terminal, the conductive trace is located on the transition filling portion, the transition filling portion includes a third surface away from the side of the display panel, the third surface is inclined to the display panel, and the angle between the third surface and the bottom surface of the transition filling portion close to the display panel is 30°~60°.

2. The display module according to claim 1, characterized in that: The conductive layer further includes a protective layer, which is disposed on a side of the conductive trace away from the display panel and covers the first terminal, the second terminal and the conductive trace.

3. The display module according to claim 1, characterized in that: In a direction from the COF assembly to the first terminal, the thickness of the transition filling portion gradually decreases in a direction perpendicular to the display panel; The conductive layer is disposed on the transition filling portion, and one end of the conductive layer is connected to the first terminal, and the other end of the conductive layer is connected to the second terminal.

4. The display module according to claim 3, characterized in that: The third surface connects the first surface and the second surface, and the third surface is a plane or a curved surface.

5. The display module according to claim 1, characterized in that: The conductive particles may be made of silver, copper, aluminum or carbon-based materials.

6. The display module according to claim 2, characterized in that: The material of the protective layer includes a light-shielding material, and the light-shielding material includes epoxy resin or acrylic resin.

7. A method for manufacturing a display module, characterized in that: The following steps are involved: A display panel is provided, the display panel comprising a plurality of first terminals arranged at intervals; forming a chip-on-film assembly on the backlight side of the display panel, wherein the chip-on-film assembly includes a plurality of second terminals arranged at intervals; A conductive layer is formed between the display panel and the COF module, wherein the conductive layer comprises a plurality of conductive traces arranged at intervals, one end of each conductive trace is connected to the first terminal, and the other end of each conductive trace is connected to the second terminal, wherein the conductive trace comprises conductive particles and an adhesive; Wherein, forming a conductive layer between the display panel and the chip-on-film assembly comprises the following steps: Providing a conductive film layer, the conductive film layer comprising a protective layer, and a plurality of semi-solid conductive glues arranged at intervals on the protective layer, wherein the conductive glue comprises conductive particles, adhesive and solvent; The conductive film layer is attached between the display panel and the COF module, with one end of the semi-solid conductive adhesive being located on the first terminal and the other end being located on the second terminal; The conductive adhesive in a semi-solid state is heated and cured to form the conductive trace, so that one end of the conductive trace is overlapped with the first terminal, and the other end of the conductive trace is overlapped with the second terminal to form the conductive layer, wherein the display panel includes a first surface located on the backlight side, the first terminal is located on the first surface, the COF module includes a second surface away from the display panel, the second terminal is located on the second surface, the conductive layer is located between the first terminal and the second terminal, and one end of the conductive layer is connected to the first terminal, and the other end of the conductive layer is connected to the second terminal; The COF component and the first terminal are spaced apart on the first surface, a transition filling portion is provided on the first surface and between the COF component and the first terminal, the conductive trace is located on the transition filling portion, the transition filling portion includes a third surface away from the side of the display panel, the third surface is inclined to the display panel, and an angle between the third surface and a bottom surface of the transition filling portion close to the display panel is 30°~60°.

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