Wafer dicing apparatus test device

Abstract

The application relates to a wafer dicing equipment test device which comprises a machining shaft sliding plate, a hammer and a splitting knife, the machining shaft sliding plate is installed on an external machining shaft along the Z-axis direction, the machining shaft sliding plate can be driven to move along the Z-axis direction through the machining shaft, the hammer is arranged at the middle position of the machining shaft sliding plate along the X-axis direction, and the splitting knife is arranged on one side of the hammer fixing part along the negative direction of the Z-axis. Through the structural setting of the wafer dicing equipment test device, multiple parameters in wafer dicing processing can be conveniently tested, the displacement of the splitting knife under different installation positions of the hammer and different compression amounts of the spring is repeatedly tested by studying the hammer knocking performance, the spring coefficient and the comprehensive self-gravity of the splitting knife mounting knife holder, and complete data are formed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, in particular to a test device for wafer dicing equipment. BACKGROUND

[0002] After laser stress-induced cutting, the wafer is cut into small particles by wafer dicing equipment. The key structure of the commonly used wafer dicing equipment mainly includes a cleaver and a support plate. The wafer is placed above the support plate, the cleaver cuts into the wafer, and a hammer is used to strike the cleaver to make the cleaver vibrate and produce a certain displacement in the cutting direction. The cleaver is suspended on the processing shaft by a spring. Under the action of the spring, different striking forces of the hammer make the cleaver produce different displacements. The striking force, cleaver displacement and cleaver penetration depth required for cleaving wafers of different thicknesses are different.

[0003] A device needs to be compatible with multiple sizes of wafers that can be processed. When the product is changed, different processing parameters need to be set, the height of the hammer needs to be adjusted, and the compression amount of the suspension spring (i.e. the suspension force) needs to be adjusted to make the cleaver produce sufficient displacement. Usually, this process is carried out by a debugging personnel to obtain appropriate data. This process is time-consuming and labor-intensive, and it cannot be ensured that the desired displacement effect can be achieved. Therefore, a device is needed to test this process.

[0004] In view of the above-mentioned defects, the present design person actively researches and innovates in order to create a wafer dicing equipment test device, which has more industrial utilization value. SUMMARY

[0005] To solve the above technical problems, the purpose of the present application is to provide a wafer dicing equipment test device.

[0006] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0007] The wafer dicing equipment test device comprises a processing shaft sliding plate, a hammer and a cleaver. The processing shaft sliding plate is installed on the external processing shaft along the Z-axis direction and can be driven to move along the Z-axis direction by the processing shaft. The hammer is arranged at the middle position of the processing shaft sliding plate along the X-axis direction. The hammer is pressed on the hammer fixing part by a plurality of locking screws. The push rod of the hammer faces the side of the Z-axis negative direction. The hammer fixing part is fixedly installed on the processing shaft sliding plate along the Z-axis direction. The cleaver is installed on the cleaver mounting plate along the side of the Z-axis negative direction. Spring fixing blocks are arranged on the processing shaft sliding plates on both sides of the hammer along the X-axis direction. An adapter plate is suspended and installed on the spring fixing blocks along the Z-axis direction. The side of the Z-axis negative direction of the adapter plate is connected with the lower cleaver mounting plate.

[0008] As a further improvement of the present application, the hammer knock column limiting part is arranged on the machining shaft slide plate on the positive side of the Z axis, and is used to limit the rebound of the hammer knock.

[0009] As a further improvement of the present application, the machining shaft slide plate is uniformly provided with a plurality of limiting screw holes along the Z axis direction, and the hammer knock column limiting part is installed on the machining shaft slide plate through the limiting screw holes.

[0010] As a further improvement of the present application, the adapter plate is installed on the spring fixing block through the spring compression bolt.

[0011] As a further improvement of the present application, the spring compression bolt is screwed to the adapter plate after passing through the compression spring, and the spring compression bolt, the compression spring and the adapter plate are jointly suspended and installed on the spring fixing block along the Z axis direction.

[0012] As a further improvement of the present application, the length of the compression spring is 30mm, the outer diameter is 12mm, and the elastic coefficient is 17.25N / mm.

[0013] By the above scheme, the present application has at least the following advantages:

[0014] The test device for wafer dicing equipment can conveniently test a plurality of parameters in wafer dicing processing, and can form complete data by repeatedly testing the displacement of the splitting knife under different installation positions of the hammer and different compression amounts of the spring.

[0015] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, and can be implemented according to the content of the specification, the following will be described in detail with the preferred embodiments of the present application and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments, it should be understood that the following drawings only show some embodiments of the present application, therefore should not be regarded as a limitation, for those skilled in the art, without creative labor, other related drawings can also be obtained according to these drawings.

[0017] Figure 1 is a structural schematic view of a test device for wafer dicing equipment.

[0018] In the drawings, the meanings of various reference signs are as follows.

[0019] 1 machining shaft slide plate 2 splitting knife mounting plate

[0020] 3 compression spring 4 spring compression bolt

[0021] 5 hammer 6 splitting knife

[0022] 7 hammer fixing part 8 hammer knock column limiting part

[0023] 9 spring fixing block 10 adapter plate DETAILED DESCRIPTION

[0024] The specific embodiments of the present application will be further described in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but are not intended to limit the scope of the present application.

[0025] In order for those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0026] EMBODIMENT

[0027] As Figure 1 shown,

[0028] A test device for a wafer dicing apparatus includes a machining shaft sliding plate 1, a hammer 5, and a splitting knife 6. The machining shaft sliding plate 1 is installed on an external machining shaft along a Z-axis direction and is driven to move along the Z-axis direction by the machining shaft. The hammer 5 is arranged at a middle position of the machining shaft sliding plate 1 along an X-axis direction. The hammer 5 is pressed on a hammer fixing part 7 by a plurality of set screws. A push rod of the hammer 5 faces a side of the Z-axis negative direction. The hammer fixing part 7 is fixedly installed on the machining shaft sliding plate 1 along the Z-axis direction. The hammer fixing part 7 is arranged at a side of the Z-axis negative direction. The splitting knife 6 is installed on a splitting knife mounting plate 2 along the Z-axis negative direction. Spring fixing blocks 9 are arranged on the machining shaft sliding plate 1 at both sides of the hammer 5 along the X-axis direction. Adapter plates 10 are suspended and installed on the spring fixing blocks 9 along the Z-axis direction. The adapter plates 10 are connected to the splitting knife mounting plate 2 below at a side of the Z-axis negative direction.

[0029] Preferably, a hammer striking post limiting part 8 is also provided on the machining axis slide plate 1 on one side of the hammer 5 along the positive direction of the Z-axis. The hammer striking post limiting part 8 is used to limit the hammer 5 after it rebounds after being struck.

[0030] Preferably, the machining axis slide plate 1 has a number of rows of limit threaded holes evenly arranged along the Z-axis direction, and the hammer striking column limit part 8 is installed on the machining axis slide plate 1 through the limit threaded holes.

[0031] Preferably, the adapter plate 10 is mounted on the spring fixing block 9 by a spring compression bolt 4.

[0032] Preferably, the spring compression bolt 4 passes through the compression spring 3 and is tightened onto the adapter plate 10. The spring compression bolt 4, the compression spring 3, and the adapter plate 10 are together suspended on the spring fixing block 9 along the Z-axis direction.

[0033] Preferably, the compression spring 3 has a length of 30 mm, an outer diameter of 12 mm, and an elastic modulus of 17.25 N / mm.

[0034] Preferred embodiments of the present invention:

[0035] The present invention consists of the following components: a machining shaft slide plate 1, a chopping blade mounting plate 2, a compression spring 3, a spring compression bolt 4, a hammer 5, a chopping blade 6, a hammer fixing part 7, a hammer striking post limiting part 8, and a spring fixing block 9.

[0036] The positional and connection relationships between the various components are as follows: The machining axis slide plate 1 is mounted on the machining axis along the Z-axis direction and is driven by a servo motor and lead screw, allowing the machining axis to move in the Z-axis direction. The spring fixing block 9 is bolted to the machining axis slide plate 1. The spring compression bolt 4 passes through the compression spring 3 and is tightened onto the adapter plate 10. The adapter plate 10, compression spring 3, and spring compression bolt 4 are all suspended on the spring fixing block 9. The hammer 5 is pressed against the hammer fixing part 7 by a set screw. Loosening this set screw allows adjustment of the hammer's vertical position. The hammer striking post limiting part 8 is locked to the machining axis slide plate 1 with screws. This position has three rows of mounting threaded holes, allowing adjustment of the hammer striking post limiting part 8 by tightening it at different positions, thus limiting the hammer's rebound after impact. When a signal is given to the hammer 5, the hammer striking rod extends and strikes the cleaver 6, causing a slight displacement in the cleaver 6, thus splitting the wafer product.

[0037] The working principle and process of a test device for wafer dicing equipment according to the present invention:

[0038] I. Hammer force and installation location test:

[0039] like Figure 1As shown, the distance between the shoulder of hammer 5 and the hammer striking post limiting part 8 is measured and recorded as A. The distance between the head of hammer 5 and the chopping blade 6 is recorded as B. To facilitate the testing of the striking force of hammer 5, the position of chopping blade 6 is a digital display pressure gauge. The hammer 5 push rod strikes the pressure gauge and the pressure gauge reading F is recorded. The pressure gauge position is fixed. Two variables, A and B, are assigned to variable A. The relationship between the reading F and the distance B is measured. The assignment of A is explained as follows: Due to the already designed mechanical structure and considering the external dimensions of hammer 5, the range of variable A is 21≤A≤27mm. When A>27, the hammer spring is completely locked, the push rod is in a natural state, and the rubber block has no contact with the push rod, so A≤27 is taken. When A<21mm, the hammer push rod extends out of the hammer cavity, i.e., B<5mm. According to the following data analysis, the hammer striking force decreases, so the range of A is 21≤A≤27mm.

[0040] Analyzing the data above, the striking force F of hammer 5 is positively correlated with the distance B between the hammer tail and the cutting edge 6; that is, the larger B is, the greater the striking force, and F is not affected by A. Therefore, to ensure the maximum striking force of the hammer, the optimal installation position is A = 21mm and B = 14mm.

[0041] II. Test on the relationship between the displacement of the cleaver and the compression of the spring:

[0042] like Figure 1 As shown, the distance compressed by the compression spring 3 is measured and recorded as C, and the distance between the head of the hammer 5 and the chopping blade 6 is recorded as B. The dial indicator is placed below the chopping blade 6, and the hammer 5 push rod strikes the chopping blade 6. The maximum displacement S of the dial indicator is recorded. The dial indicator is placed below the chopping blade 6, and the two variables B and C are assigned to the variable C. The relationship between the reading S and the distance B is measured.

[0043] To avoid measurement deviations caused by vibration, five sets of data were tested at each position. The extreme values ​​at both ends were removed and the average value was calculated. S1-S5 are the displacement data of the chopping blade after five sets of strikes. When the spring is compressed more than 6.5mm, the displacement of the chopping blade 6 still exists, but the vibration generated by the hammer 5 disappears immediately. At this time, the state is approximately the impact caused by the hammer 5 striking, and it is not considered as the displacement of the chopping blade 6.

[0044] Analyzing the above data, the displacement S of the chopping blade 6 is directly proportional to the distance B between the hammer 5 and the chopping blade 6, and inversely proportional to the compression distance A of the spring 3. Therefore, a complete set of comparative data on the relationship between spring compression and chopping blade displacement is obtained. The compression C of the spring 3 is controlled between 3-5.5mm. After product redesign, the vertical position of the hammer is adjusted according to the required chopping blade displacement based on the product thickness to obtain a suitable chopping blade displacement.

[0045] The present application effectively verifies the relationship between the blade displacement and the position of the hammer under the condition of different suspension spring compression amounts when the effective and maximum striking forces of the hammer are tested, thereby providing certain reference data for the wafer splitting equipment in the compatible setting of different performance and size process parameters. In particular, during the product changeover process, the spring compression amount and the hammer position can be quickly adjusted according to the required blade displacement of the product thickness, so as to obtain the required displacement of the blade, thereby completing the wafer product splitting, saving the changeover debugging time, and improving the changeover efficiency.

[0046] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only for the purpose of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0047] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0048] The above is only the preferred embodiment of the present application, and is not used to limit the present application, and it should be pointed out that for those skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should be considered as the protection scope of the present application.

Claims

1. Test device for wafer dicing apparatus, comprising a processing shaft slide (1), a hammer (5) and a cleaver (6), characterized in that, The machining shaft slide plate (1) is installed on the external machining shaft along the Z-axis direction, and the machining shaft slide plate (1) is driven to move along the Z-axis direction by the machining shaft, the middle position of the machining shaft slide plate (1) along the X-axis direction is provided with a hammer (5), the hammer (5) is pressed on the hammer fixing part (7) by a plurality of tightening screws, the push rod of the hammer (5) is towards the side of the negative direction of the Z-axis, the hammer fixing part (7) is fixedly installed on the machining shaft slide plate (1) along the Z-axis direction, the hammer fixing part (7) is provided with a wedge (6) on the side of the negative direction of the Z-axis, the wedge (6) is installed on the wedge mounting plate (2) along the side of the negative direction of the Z-axis, the machining shaft slide plate (1) on both sides of the hammer (5) along the X-axis direction is provided with a spring fixing block (9), the spring fixing block (9) is suspendedly installed with an adapter plate (10) along the Z-axis direction, and the side of the negative direction of the Z-axis of the adapter plate (10) is connected with the lower wedge mounting plate (2).

2. The wafer dicing apparatus test device of claim 1, wherein The machining shaft slide plate (2) is also provided with a hammer striking column limiting part (8) on the side of the positive direction of the Z-axis of the machining shaft slide plate (2), and the hammer striking column limiting part (8) is used to limit the rebound of the hammer (5) after striking.

3. The wafer dicing apparatus test device of claim 2, wherein The machining shaft slide plate (2) is uniformly provided with a plurality of row limiting threaded holes along the Z-axis direction, and the hammer striking column limiting part (8) is installed on the machining shaft slide plate (2) through the limiting threaded hole.

4. The wafer dicing apparatus test device of claim 1, wherein The adapter plate (10) is installed on the spring fixing block (9) through a spring compression bolt (4).

5. The wafer dicing apparatus test device of claim 4, wherein the wafer dicing apparatus test device is configured to be removably coupled to the wafer dicing apparatus. The spring compression bolt (4) is screwed onto the adapter plate (10) after passing through the compression spring (3), and the spring compression bolt (4), the compression spring (3) and the adapter plate (10) are jointly suspendedly installed on the spring fixing block (9) along the Z-axis direction.

6. The wafer dicing apparatus test device of claim 5, wherein, The length of the compression spring (3) is 30mm, the outer diameter is 12mm, and the elastic coefficient is 17.25N / mm.

Images