Circuit board test equipment

Abstract

The embodiment of the present application provides a circuit board testing device, which relates to the field of server testing technology. The circuit board testing device includes a universal test platform, a sub-clamp module and a connector; the sub-clamp module is detachably arranged in the universal test platform, and the sub-clamp module and the universal test platform are connected through a connector; wherein the sub-clamp module includes an upper sub-clamp module and a lower sub-clamp module, the upper sub-clamp module and the lower sub-clamp module are arranged relative to each other, and the side of the lower sub-clamp module facing the upper sub-clamp module is used to place the circuit board to be tested; the upper sub-clamp module is provided with an interface docking structure, and the interface docking structure is adapted to be connected with the interface on the circuit board to be tested. Therefore, different types of circuit boards can be tested by replacing the sub-clamp module, which is conducive to expanding the scope of application of the circuit board testing equipment and improving the utilization rate of general resources in the circuit board testing equipment.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of server testing technology, and in particular to a circuit board testing device. Background Art

[0002] Before shipping, servers must undergo functional testing (FT) or boundary scan inspection (BSI) on the server motherboard using test equipment. During this process, staff place the server motherboard in the test equipment, which then uses external devices to test the server motherboard.

[0003] As is known to all, the interface structure of the server motherboard is complex and the types and numbers are numerous. Therefore, the types and numbers of external devices installed in the test equipment will be relatively large, the structure of the test equipment will be relatively complex and the cost will be relatively high.

[0004] However, currently one type of testing equipment can only test one type of mainboard, which results in a narrow application scope of the testing equipment and low utilization of general resources in the testing equipment. Summary of the Invention

[0005] An embodiment of the present application provides a circuit board testing device that can test different types of circuit boards by replacing sub-clamp modules, which is beneficial to expanding the scope of application of the circuit board testing device and improving the utilization rate of general resources in the circuit board testing device.

[0006] An embodiment of the present application provides a circuit board testing device, comprising a universal test platform, a sub-clamp module and a connector; the sub-clamp module is detachably arranged in the universal test platform, and the sub-clamp module and the universal test platform are connected via a connector; wherein the sub-clamp module comprises an upper sub-clamp module and a lower sub-clamp module, the upper sub-clamp module and the lower sub-clamp module are arranged relative to each other, and the side of the lower sub-clamp module facing the upper sub-clamp module is used for placing the circuit board to be tested; an interface docking structure is provided on the upper sub-clamp module, and the interface docking structure is adapted to be connected with the interface on the circuit board to be tested.

[0007] The embodiment of the present application provides a circuit board testing device, including a universal test platform, a sub-clamp module and a connector. By setting the sub-clamp module to include a sub-clamp upper module and a sub-clamp lower module, the sub-clamp upper module and the sub-clamp lower module are arranged relative to each other, and the side of the sub-clamp lower module facing the sub-clamp upper module is used to set the circuit board to be tested; at the same time, by detachably setting the sub-clamp module in the universal test platform, and connecting the sub-clamp module and the universal test platform through a connector, on the one hand, the sub-clamp module and the universal test platform are connected, so that the universal resources on the universal test platform can be used to test the circuit board to be tested in the sub-clamp module. On the other hand, by replacing the sub-clamp module, the circuit board testing device can test different types of circuit boards, thereby not only expanding the scope of application of the circuit board testing device and improving the utilization rate of universal resources in the circuit board testing device; but also eliminating the need to manufacture corresponding circuit board testing equipment for each type of circuit board, which is conducive to cost saving.

[0008] In one possible implementation, the sub-clamp upper module includes a sub-clamp upper plate and a floating panel, and the floating panel is movably arranged on the side of the sub-clamp upper plate facing the sub-clamp lower module; the interface docking structure is provided on the side of the floating panel facing the sub-clamp lower module, and the interface docking structure is used to adapt and dock with the interface on the circuit board to be tested placed on the sub-clamp lower module.

[0009] By setting up a sub-clamp upper module including a sub-clamp upper plate and a floating panel, the floating panel is used to dock with the circuit board to be tested placed on the sub-clamp lower module; and by movably setting the floating panel on the side of the sub-clamp upper plate facing the sub-clamp lower module, the tolerance chain of the interface docking structure of the circuit board testing equipment can be fused, so that the interface docking structure can float and adapt to the interface of the circuit board to be tested, which is beneficial to improving the docking accuracy.

[0010] In a possible implementation, the sub-clip upper module further includes a connecting piece, and the floating panel and the sub-clip upper plate are movably connected via the connecting piece.

[0011] The floating panel and the sub-clamp upper plate are movably connected through a connecting piece, thereby facilitating and ensuring the convenience and reliability of the connection.

[0012] In one possible implementation, the connecting member includes a stop portion, an optical axis segment, and a threaded segment that are connected in sequence and whose radial dimensions gradually decrease; one of the sub-clamp upper plate and the floating panel is provided with a through hole, and the other is provided with a threaded hole, the optical axis segment is loosely matched with the through hole, and the axial dimension of the optical axis segment is larger than the axial dimension of the through hole, and the threaded segment is threadedly connected to the threaded hole.

[0013] By setting up a connecting piece including a stop part, an optical axis segment and a threaded segment which are connected in sequence and whose radial dimensions gradually decrease, and by setting a through hole in one of the sub-clamp upper plate and the floating panel and a threaded hole in the other, the optical axis segment and the through hole are loosely matched, and the axial dimension of the optical axis segment is larger than the axial dimension of the through hole, so that the threaded segment and the threaded hole are threadedly connected, the purpose of the floating panel moving in multiple directions relative to the sub-clamp upper plate can be achieved.

[0014] In one possible implementation, the floating panel moves in a direction perpendicular to the sub-clamp upper plate in a range of 0.4 mm to 0.6 mm; and / or the floating panel moves in a direction parallel to the sub-clamp upper plate in a range of 0.4 mm to 0.6 mm.

[0015] By setting the distance range in which the floating panel moves in a direction perpendicular to the sub-clamp upper plate to 0.4mm-0.6mm; and / or setting the distance range in which the floating panel moves in a direction parallel to the sub-clamp upper plate to 0.4mm-0.6mm, it is not only beneficial to ensure that the floating panel can move relative to the sub-clamp upper plate, but also beneficial to ensure that the range of movement is within an appropriate range.

[0016] In a possible implementation, one of the floating panel and the sub-clip lower module is provided with a positioning pin, and the other is provided with a positioning pin hole, and the positioning pin and the positioning pin hole are clearance-fitted.

[0017] By setting one of the floating panel and the sub-clamp lower module with a positioning pin and the other with a positioning pin hole, the positioning pin and the positioning pin hole are clearance-matched, so that the floating panel can float and dock with the sub-clamp lower module, which is conducive to ensuring docking accuracy and docking reliability.

[0018] In a possible implementation, a limiting protrusion is provided on a surface of the floating panel facing the sub-clamp lower module, and the limiting protrusion is used to support between the floating panel and the circuit board to be tested.

[0019] By providing a limiting protrusion on the side of the floating panel facing the sub-clamp lower module, the limiting protrusion is supported between the floating panel and the circuit board to be tested, thereby preventing the interface docking structure on the floating panel and the interface on the circuit board to be tested from being damaged by excessive squeezing.

[0020] In one possible implementation, a plurality of supporting feet are provided on a side of the sub-clamp upper plate facing the sub-clamp lower module, and the plurality of supporting feet are arranged at intervals along the circumferential edge of the sub-clamp upper plate; the extended length of the supporting feet is not less than the maximum distance between a side of the floating panel facing away from the sub-clamp upper plate and the sub-clamp upper plate.

[0021] By arranging multiple supporting feet on the side of the sub-clamp upper plate facing the sub-clamp lower module, the multiple supporting feet are arranged at intervals along the circumferential edge of the sub-clamp upper plate, and the extended length of the supporting feet is not less than the maximum distance between the side of the floating panel back ion clamp upper plate and the sub-clamp upper plate, so that when the sub-clamp upper module is placed on the platform, the multiple supporting feet can support the sub-clamp upper module to avoid the interface docking structure on the floating panel from being crushed.

[0022] In one possible implementation, the universal testing platform includes a cabinet and a mother clamp module, the mother clamp module includes a mother clamp upper module and a mother clamp lower module, the mother clamp upper module and the mother clamp lower module are arranged in the cabinet along the height direction of the cabinet, and the mother clamp upper module is located above the mother clamp lower module; the sub-clamp upper module is detachably installed in the cabinet through the mother clamp upper module, and the sub-clamp lower module is detachably installed in the cabinet through the mother clamp lower module.

[0023] By setting a mother clamp upper module and a mother clamp lower module in the cabinet, the sub-clamp upper module can be detachably installed in the cabinet through the mother clamp upper module, and the sub-clamp lower module can be detachably installed in the cabinet through the mother clamp lower module, thereby facilitating the installation of the sub-clamp upper module and the sub-clamp lower module in the cabinet.

[0024] In one possible implementation, the mother clamp upper module includes two guide grooves and fixing members arranged on the guide grooves, the two guide grooves are respectively arranged on the two opposite inner side walls in the width direction of the cabinet and extend along the depth direction of the cabinet; the opposite sides of the sub-clamp upper module are respectively accommodated in the two guide grooves and slide along the guide grooves; the fixing members are used to fix the sub-clamp upper module when the sub-clamp upper module is installed in place.

[0025] By setting the mother clamp upper module to include a guide groove, the sub-clamp upper module is slidably installed or disassembled along the guide groove, thereby making the installation and disassembly of the sub-clamp upper module more convenient and quick; and by setting the mother clamp upper module to include a fixing part, the fixing part fixes the sub-clamp upper module when the sub-clamp upper module is installed in place, thereby making the installation of the sub-clamp upper module more stable and reliable.

[0026] In one possible implementation, the mother clamp lower module includes a bracket, a lifting mechanism and a telescopic plate, the bracket is connected to two opposite inner side walls in the width direction of the cabinet, the lifting mechanism is arranged above the bracket, the telescopic plate is arranged above the lifting mechanism, and the sub-clamp lower module is detachably placed above the telescopic plate; the telescopic plate is slidably connected to the lifting mechanism, and the telescopic plate slides back and forth along the depth direction of the cabinet; the lifting mechanism drives the telescopic plate to move up and down.

[0027] By setting a telescopic plate in sliding connection with the lifting mechanism, and the telescopic plate sliding back and forth along the depth direction of the cabinet, the installation and disassembly of the sub-clamp lower module on the telescopic plate is relatively convenient and quick; and by setting a lifting mechanism to drive the telescopic plate to move up and down, the sub-clamp lower module can be raised and lowered, and the circuit board to be tested on the sub-clamp lower module can be docked or undocked with the sub-clamp upper module.

[0028] In one possible implementation, the universal test platform also includes a programmable logic controller and a control computer, wherein the programmable logic controller is arranged in the cabinet and is used to control the controllable devices in the cabinet; the control computer is arranged outside the cabinet and is used to present the interface of the programmable logic controller; and / or, the universal test platform also includes a switch, a VGA acquisition card, an LED test component and a CPU heat dissipation component arranged in the cabinet, the switch is used to connect the network port, the VGA acquisition card and the LED test component are respectively used to test the corresponding devices on the circuit board to be tested, and the CPU heat dissipation component is used to dissipate heat from the CPU on the circuit board to be tested.

[0029] By setting up a universal test platform to also include a programmable logic controller and a control computer, not only can the programmable logic controller and the control computer assist the universal test platform in better realizing the test function, but it is also conducive to incorporating more equipment or devices into universal resources, improving utilization and saving costs.

[0030] By setting up a universal test platform that also includes a switch, a VGA capture card, an LED test component and a CPU heat dissipation component set in a cabinet, not only can the switch, the VGA capture card, the LED test component and the CPU heat dissipation component assist the universal test platform to better realize the test function, but it is also conducive to incorporating more equipment or device equipment into universal resources, improving utilization and saving costs.

[0031] In one possible implementation, the connector is a heavy-loaded connector, which includes a male head and a female head. The male head is set on one of the universal test platform and the sub-clamp upper module, and the female head is set on the other; when the sub-clamp upper module is installed in the universal test platform, the male head and the female head are plugged into each other.

[0032] By setting a heavy-duty connector including a male head and a female head, one of the universal test platform and the sub-clamp module is set with a male head, and the other is set with a female head; when the sub-clamp module is installed in the universal test platform, the male head and the female head are plugged into each other, thereby facilitating blind plugging and improving the accuracy and reliability of the plugging between the male head and the female head.

[0033] In a possible implementation, the sub-clamp lower module includes a sub-clamp lower plate and a carrier plate, wherein the carrier plate is arranged on a side of the sub-clamp lower plate facing the sub-clamp upper module, and the side of the carrier plate facing the sub-clamp upper module is used to place the circuit board to be tested.

[0034] By arranging the carrier board on the side of the sub-clamp lower plate facing the sub-clamp upper module and using the side of the carrier board facing the sub-clamp upper module for placing the circuit board to be tested, it is beneficial to provide a platform suitable for placing the circuit board to be tested.

[0035] In a possible implementation, a positioning member is provided on a surface of the carrier board facing the sub-clamp upper module, and the positioning member is used to position the circuit board to be tested placed on the carrier board.

[0036] By arranging a positioning piece on the side of the carrier board facing the sub-clip upper module, the positioning piece is used to position the circuit board to be tested placed on the carrier board, thereby ensuring the stability and reliability of the circuit board to be tested placed on the carrier board.

[0037] In a possible implementation, the circuit board to be tested includes a server mainboard.

[0038] By arranging that the circuit board to be tested includes a server mainboard, the circuit board testing device can be used to test the server mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic diagram of the structure of a circuit board testing device provided in one embodiment of the present application;

[0040] Figure 2 A schematic diagram of the structure of the assembly of the sub-clamping module and the mother-clamping module of the circuit board testing equipment provided in one embodiment of the present application;

[0041] Figure 3 Schematic diagram of the structure of the female clamp module of the circuit board testing equipment provided in one embodiment of the present application Figure 1 ;

[0042] Figure 4 Schematic diagram of the structure of the female clamp module of the circuit board testing equipment provided in one embodiment of the present application Figure 2 ;

[0043] Figure 5 A schematic structural diagram of a female clamp upper module of a circuit board testing device provided in one embodiment of the present application;

[0044] Figure 6 A schematic structural diagram of a female clamp lower module of a circuit board testing device provided in one embodiment of the present application;

[0045] Figure 7 A schematic structural diagram of a sub-clamp module of a circuit board testing device provided in one embodiment of the present application;

[0046] Figure 8 A schematic structural diagram of a sub-clip upper module of a circuit board testing device provided in one embodiment of the present application;

[0047] Figure 9 A partial cross-sectional view of a circuit board testing device provided in one embodiment of the present application, wherein the upper sub-clamp plate and the floating panel mold are connected via a connector;

[0048] Figure 10 A schematic structural diagram of a sub-clip lower module of a circuit board testing device provided in one embodiment of the present application;

[0049] Figure 11 A schematic structural diagram of a female connector of a circuit board testing device provided in one embodiment of the present application;

[0050] Figure 12 A schematic plan view of an interface of a connector of a circuit board testing device provided in one embodiment of the present application.

[0051] Description of reference numerals:

[0052] 110-cabinet; 111-upper cavity; 1111-upper front wall; 1112-lower front wall; 112-castors; 113-foot cups; 114-indicator light;

[0053] 120 - female clamp module; 121 - female clamp upper module; 1211 - guide groove; 1212 - fixing member; 1213 - crossbeam; 1214 - engaging member; 1215 - first connecting lug; 122 - female clamp lower module; 1221 - bracket; 1222 - lifting mechanism; 12221 - lifting motor; 12222 - slide rail; 12223 - sliding guide; 12224 - lifting plate; 1223 - telescopic plate; 12231 - sliding mechanism; 1224 - mating member; 1225 - second connecting lug; 123 - connecting shaft;

[0054] 200 - Sub-clip module; 210 - Sub-clip upper module; 211 - Sub-clip upper plate; 2111 - Support foot; 2112 - Handle; 212 - Floating panel; 2121 - Interface docking structure; 2122 - Positioning pin; 2123 - Positioning protrusion; 213 - Connector; 2131 - Stopper; 2132 - Optical axis segment; 2133 - Threaded segment; 220 - Sub-clip lower module; 221 - Sub-clip lower plate; 2211 - Protrusion; 2212 - Positioning pin hole; 222 - Carrier plate;

[0055] 300-connector; 310-male; 320-female; 321-connector pin. DETAILED DESCRIPTION

[0056] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0057] A server consists of a chassis and the motherboard housed within it. Each motherboard requires functional testing (FT) or boundary scan inspection (BSI) to ensure its quality and functionality. Test equipment includes external devices and an interface docking structure. The interface docking structure connects to the motherboard's ports, while the external device performs the test function of the test equipment.

[0058] Since the interface docking structure of the existing test equipment has a fixed position and structure, on the one hand, the test equipment can only test one type of motherboard, that is, when the interface of the motherboard changes, new test equipment needs to be manufactured, resulting in a small scope of application of the test equipment and low utilization of general resources in the test equipment; on the other hand, the tolerance chain of the interface docking structure of the test equipment is relatively long, affecting the docking accuracy of the interface docking structure and the motherboard interface.

[0059] Based on this, an embodiment of the present application provides a circuit board testing device. The circuit board testing device includes a universal test platform, a sub-clamp module and a connector. By setting the sub-clamp module to include a sub-clamp upper module and a sub-clamp lower module, the sub-clamp upper module and the sub-clamp lower module are arranged relative to each other, and the side of the sub-clamp lower module facing the sub-clamp upper module is used to set the circuit board to be tested; at the same time, by detachably setting the sub-clamp module in the universal test platform, and connecting the sub-clamp module and the universal test platform through a connector, on the one hand, the sub-clamp module and the universal test platform are connected, so that the universal resources on the universal test platform can be used to test the circuit board to be tested in the sub-clamp module. On the other hand, by replacing the sub-clamp module, the circuit board testing device can test different types of circuit boards, thereby not only expanding the scope of application of the circuit board testing device and improving the utilization rate of universal resources in the circuit board testing device; but also eliminating the need to manufacture corresponding circuit board testing equipment for each type of circuit board, which is conducive to cost saving.

[0060] In addition, the sub-clip upper module of the circuit board testing device provided in the embodiments of the present application includes an upper sub-clip plate and a floating panel. The floating panel is used to dock with the circuit board under test, which is placed in the lower sub-clip module. By movably positioning the floating panel on the side of the upper sub-clip plate facing the lower sub-clip module, the tolerance chain of the interface docking structure of the circuit board testing device can be fused, thereby allowing the interface docking structure to float and adapt to the interface of the circuit board under test, thereby improving docking accuracy.

[0061] The specific structure of the circuit board testing equipment is described in detail below with reference to the accompanying drawings.

[0062] Embodiments of the present application provide a circuit board testing device for performing functional testing (FT) or boundary scan inspection (BSI) on circuit boards to ensure their quality and functionality. Circuit boards include, but are not limited to, server motherboards, backplanes, and switch boards. The circuit board testing device provided in embodiments of the present application primarily utilizes a server motherboard as the circuit board to be tested.

[0063] The circuit board testing device provided in the embodiment of the present application includes a universal testing platform, a sub-clamp module and a connector. The sub-clamp module is detachably arranged in the universal testing platform, and the sub-clamp module and the universal testing platform are connected through the connector.

[0064] Reference Figure 1 As shown, the universal test platform of the embodiment of the present application includes a cabinet 110, a sub-clamp module 200 can be detachably arranged in the cabinet 110, and a connector 300 can be arranged between the cabinet 110 and the sub-clamp module 200. In specific applications, the sub-clamp module 200 can be removed from the cabinet 110, or installed in the cabinet 110, and connected to the cabinet 110 through the connector 300. Since the sub-clamp module 200 is used to dock with the circuit board to be tested, the universal test platform can be used to test different circuit boards to be tested by replacing different sub-clamp modules 200, thereby expanding the scope of application of the universal test platform, improving the utilization rate of the universal test platform, and helping to save costs.

[0065] The cabinet 110 may include a frame structure, which may include a quadrilateral bottom frame, a quadrilateral top frame, and four uprights corresponding to the four corners of the bottom frame and the four corners of the top frame. The cabinet 110 may also include a bottom wall, a top wall, a front wall, a rear wall, a left side wall, and a right side wall. The bottom wall and the top wall are respectively arranged on the bottom and top surfaces of the frame structure along the height direction of the cabinet 110, the front wall and the rear wall are respectively arranged on the front and rear of the frame structure along the depth direction of the cabinet 110, and the left side wall and the right side wall are respectively arranged on the left side and the right side of the frame structure along the width direction of the cabinet 110, so that the bottom wall, the top wall, the front wall, the rear wall, the left side wall, and the right side wall together form a cabinet 110 with a closed accommodating cavity.

[0066] The accommodating cavity of the cabinet 110 can be divided into an upper cavity 111 and a lower cavity along the height direction of the cabinet 110, and the sub-clip module 200 can be disposed in the upper cavity 111 of the cabinet 110. A partition plate can be disposed between the upper cavity 111 and the lower cavity. The partition plate can not only support the sub-clip module 200 and the like disposed in the upper cavity 111, but also protect the parts, components, or devices disposed in the lower cavity.

[0067] In one possible implementation, portions of the front, rear, left, and right walls of the upper cavity 111 can be transparent, while other portions can be non-transparent. For example, the entire front wall or the upper portion of the front wall of the upper cavity 111 can be transparent, while the remaining walls of the upper cavity 111 can be non-transparent. This facilitates observation of the test conditions within the upper cavity 111 while the circuit board under test is located within the sub-clamp module 200 of the upper cavity 111. In other possible implementations, the front, rear, left, and right walls of the upper cavity 111 can all be transparent, or non-transparent, as needed. Transparent walls include, but are not limited to, at least one of glass, plastic, and acrylic; non-transparent walls include, but are not limited to, at least one of aluminum alloy, stainless steel, plastic, and carbon fiber.

[0068] In one possible implementation, the front wall of the upper cavity 111 may include an upper front wall 1111 and a lower front wall 1112. The upper front wall 1111 and the lower front wall 1112 are adjacently arranged along the height direction of the cabinet body 110, and the upper front wall 1111 is located above the lower front wall 1112. The lower front wall 1112 may correspond to the area where the shielding sub-clamp module 200 is located, and the upper front wall 1111 may correspond to the area above the shielding sub-clamp module 200. The upper front wall 1111 may be a transparent wall surface, and the lower front wall 1112 may be a non-transparent wall surface. The upper front wall 1111 may be configured as a cabinet door structure that can be opened and closed, for example, a single-door structure that opens from one side, or a double-door structure that opens from the middle. The lower front wall 1112 may be configured as a structure that can be pushed and pulled open along the depth direction of the cabinet body 110.

[0069] In one possible implementation, at least one of the rear, left, and right walls of the upper chamber 111 can be configured as an openable cabinet door. For example, the left or right wall of the upper chamber 111 can be configured as a single-door structure that opens from one side, or as a double-door structure that opens from the center, depending on actual needs. This facilitates the installation, commissioning, and maintenance of parts, components, devices, and the sub-clamp module 200 located within the upper chamber 111.

[0070] In one possible implementation, the front wall, rear wall, left side wall, and right side wall of the lower cavity can all be set as non-transparent wall surfaces, thereby forming a shield for the parts, components, and devices disposed inside the lower cavity, thereby facilitating an improvement in the aesthetic appearance of the cabinet 110. In other possible implementations, the front wall, rear wall, left side wall, and right side wall of the lower cavity can all be set as transparent wall surfaces according to actual needs; or, according to actual needs, a portion of the front wall, rear wall, left side wall, and right side wall of the lower cavity can be set as non-transparent wall surfaces, while another portion of the wall surfaces can be set as transparent wall surfaces. Transparent wall surfaces include, but are not limited to, at least one of glass wall surfaces, plastic wall surfaces, and acrylic wall surfaces; non-transparent wall surfaces include, but are not limited to, at least one of aluminum alloy wall surfaces, stainless steel wall surfaces, plastic wall surfaces, and carbon fiber wall surfaces.

[0071] At least one of the front, rear, left, and right walls of the lower chamber can be configured as an openable door structure. For example, the front wall of the lower chamber can be configured as a single-door structure that opens from one side, or as a double-door structure that opens in opposite directions, depending on actual needs. Alternatively, the left or right wall of the lower chamber can be configured as a single-door structure that opens from one side, or as a double-door structure that opens in opposite directions, depending on actual needs. This facilitates the installation, commissioning, and maintenance of parts, components, and devices located within the lower chamber.

[0072] Casters 112 may be provided at the bottom of the cabinet 110. For example, four casters 112 may be provided, and the four casters 112 may be provided at the four corners of the bottom surface of the cabinet 110, respectively. This not only ensures the structural strength of the connection between the casters 112 and the cabinet 110, but also ensures the stability of the casters 112 supporting the cabinet 110. By providing the casters 112 at the bottom of the cabinet 110, the movement of the cabinet 110 is facilitated, saving manpower.

[0073] The bottom of the cabinet 110 may be provided with foot cups 113. For example, four foot cups 113 may be provided, and the four foot cups 113 may be respectively provided at the four corners of the bottom surface of the cabinet 110. This not only ensures the structural strength of the connection between the foot cups 113 and the cabinet 110, but also ensures the stability of the foot cups 113 in supporting the cabinet 110. By providing the foot cups 113 at the bottom of the cabinet 110, the stability and stability of the cabinet 110 when parked can be ensured.

[0074] An indicator light 114 may be provided on the top surface of the cabinet 110. The indicator light 114 may include multiple colors, each of which may indicate a state of the circuit board test device. For example, the indicator light 114 may include red, yellow, and green. A red light may indicate a fault alarm state of the circuit board test device, a yellow light may indicate a standby state of the circuit board test device, and a green light may indicate an operating state of the circuit board test device.

[0075] Reference Figure 2 As shown, the universal test platform of the embodiment of the present application may also include a mother clamp module 120, which is arranged in the cabinet 110. For example, the mother clamp module 120 can be arranged in the upper cavity 111 of the cabinet 110, and the two sides of the mother clamp module 120 along the width direction of the cabinet 110 can be correspondingly connected to the two opposite inner side walls in the width direction of the cabinet 110. The sub-clamp module 200 is detachably connected to the mother clamp module 120, so that the sub-clamp module 200 can be detachably installed in the cabinet 110 through the mother clamp module 120. The connector 300 can be arranged between the sub-clamp module 200 and the mother clamp module 120, so that the sub-clamp module 200 and the mother clamp module 120 are connected through the connector 300.

[0076] The mother clamp module 120 may include a mother clamp upper module 121 and a mother clamp lower module 122. The mother clamp upper module 121 and the mother clamp lower module 122 are arranged in the cabinet body 110 along the height direction of the cabinet body 110, and the mother clamp upper module 121 is located above the mother clamp lower module 122. The sub-clamp module 200 includes a sub-clamp upper module 210 and a sub-clamp lower module 220. The sub-clamp upper module 210 is detachably connected to the mother clamp upper module 121 so that the sub-clamp upper module 210 can be detachably installed in the cabinet body 110; the sub-clamp lower module 220 is detachably connected to the mother clamp lower module 122 so that the sub-clamp lower module 220 can be detachably installed in the cabinet body 110.

[0077] Reference Figure 3 As shown, the female clamp module 120 also includes a connecting shaft 123, and one end of the female clamp upper module 121 close to the rear wall of the cabinet body 110 is rotatably connected to the end of the female clamp lower module 122 close to the rear wall of the cabinet body 110 through the connecting shaft 123. The connecting shaft 123 extends along the width direction of the cabinet body 110 so that the female clamp upper module 121 can be rotated upward and flipped up or rotated downward and covered relative to the female clamp lower module 122 around the rotating axis, thereby facilitating the installation, debugging or maintenance of the female clamp lower module 122 or the sub-clamp lower module 220 arranged on the female clamp lower module 122.

[0078] For example, a plurality of first connecting tabs 1215 may be spaced apart at the lower edge of the end of the female clamp upper module 121 near the rear wall of the cabinet 110, each of which may have a first axial hole. A plurality of second connecting tabs 1225 may be spaced apart at the upper edge of the end of the female clamp lower module 122 near the rear wall of the cabinet 110, each of which may have a second axial hole. When the female clamp upper module 121 and the female clamp lower module 122 are assembled, the first axial hole and the second axial hole are aligned, and a rotating shaft is inserted through the first and second axial holes to rotatably connect the female clamp upper module 121 and the female clamp lower module 122.

[0079] Reference Figure 4As shown, a locking piece 1214 is provided at one end of the female clamp upper module 121 close to the front wall of the cabinet 110, and a matching piece 1224 is provided at one end of the female clamp lower module 122 close to the front wall of the cabinet 110. When the female clamp upper module 121 rotates downward around the rotating axis relative to the female clamp lower module 122 and covers the female clamp lower module 122, the locking piece 1214 and the matching piece 1224 are engaged with each other, thereby ensuring the stability and reliability of the connection between the female clamp upper module 121 and the female clamp lower module 122, which is beneficial to ensuring the stability and reliability of the sub-clamp upper module 210 and the sub-clamp lower module 220 in clamping the circuit board to be tested.

[0080] For example, the engaging members 1214 may include two, and the two engaging members 1214 are respectively arranged on both sides of one end of the female clip upper module 121 close to the front wall of the cabinet 110. Correspondingly, the mating members 1224 may include two, and the two mating members 1224 are respectively arranged on both sides of one end of the female clip lower module 122 close to the front wall of the cabinet 110. The two engaging members 1214 and the two mating members 1224 are respectively engaged or disengaged. The engaging members 1214 may be hooks, and the mating members 1224 may also be hooks, and the two hooks can be engaged or disengaged with each other.

[0081] Reference Figure 5 As shown, in a possible implementation, the mother clamp upper module 121 may include two guide grooves 1211, and the two guide grooves 1211 are respectively arranged on the two opposite inner walls in the width direction of the cabinet body 110. For example, the two guide grooves 1211 can be respectively installed on the two opposite inner walls in the width direction of the cabinet body 110 by fasteners such as screws, and extend along the depth direction of the cabinet body 110. The opposite sides of the sub-clamp upper module 210 can be respectively accommodated in the two guide grooves 1211 and slide along the guide grooves 1211. When installing the sub-clip upper module 210, the sub-clip upper module 210 can enter the guide groove 1211 from the end of the guide groove 1211 near the front wall of the cabinet 110 and slide toward the rear wall of the cabinet 110 to be installed in place. When removing the sub-clip upper module 210, the sub-clip upper module 210 is slid toward the front wall of the cabinet 110 and exit the guide groove 1211 from the end of the guide groove 1211 near the front wall of the cabinet 110. Optionally, the engaging member 1214 can be provided at the end of the guide groove 1211 near the front wall of the cabinet 110.

[0082] In one possible implementation, the mother clamp upper module 121 may further include a fixing member 1212, which is disposed on the guide groove 1211. The fixing member 1212 is used to fix the sub-clamp upper module 210 when the sub-clamp upper module 210 is installed in place. Optionally, fixing members 1212 may be provided on both guide grooves 1211 to fix the opposite sides of the sub-clamp upper module 210 installed on the mother clamp upper module 121, thereby facilitating the stability and reliability of the sub-clamp upper module installed on the mother clamp upper module 121; alternatively, a fixing member 1212 may be provided on one of the guide grooves 1211 as needed to fix one side of the sub-clamp upper module 210 installed on the mother clamp upper module 121. Optionally, one fixing member 1212 may be provided on one guide groove 1211 ; or, at least two fixing members 1212 may be provided on one guide groove 1211 , and the at least two fixing members 1212 may be arranged at intervals along the extending direction of the guide groove 1211 .

[0083] Exemplarily, the fixing member 1212 can be a fixed latch. The guide slot 1211 has upper and lower slot walls spaced apart along the height direction of the cabinet 110. Relative positions of the upper and lower slot walls are each provided with latch holes. The fixed latch is inserted into the latch holes of the upper and lower slot walls and can move up and down along the height direction of the cabinet 110. The side edges of the sub-clip upper module 210 corresponding to the guide slot 1211 are provided with latch notches. In specific application, first pull the fixed pin upward along the height direction of the cabinet 110, then make the side edge of the sub-clip upper module 210 enter the guide groove 1211 from the end of the guide groove 1211 close to the front wall of the cabinet 110, and slide it into place along the guide groove 1211, and finally press the fixed pin downward along the height direction of the cabinet 110, so that the fixed pin is sequentially passed through the pin hole of the upper groove wall of the guide groove 1211, the pin notch of the side edge of the sub-clip upper module 210 and the pin hole of the lower groove wall of the guide groove 1211, so as to fix the sub-clip upper module 210 in the guide groove 1211.

[0084] In one possible implementation, the mother clamp upper module 121 may also include a crossbeam 1213, which is connected between the two guide grooves 1211 near one end of the rear wall of the cabinet 110, and the connector 300 may be arranged between the crossbeam 1213 and the end of the sub-clamp upper module 210 near the crossbeam 1213, so that when the sub-clamp upper module 210 is slid into place along the guide groove 1211, the connector 300 is also connected.

[0085] For example, the connector 300 may include a male connector 310 and a female connector 320. The female connector 320 may be disposed on the crossbeam 1213, and the male connector 310 may be disposed on the sub-clip upper module 210. Alternatively, the male connector 310 may be disposed on the crossbeam 1213, and the female connector 320 may be disposed on the sub-clip upper module 210. When the sub-clip upper module 210 is slidably installed along the guide groove 1211, the male connector 310 and the female connector 320 are plugged in; when the sub-clip upper module 210 is slidably removed along the guide groove 1211, the male connector 310 and the female connector 320 are disconnected.

[0086] Reference Figure 6 As shown, in a possible implementation, the mother clamp lower module 122 may include a bracket 1221, a lifting mechanism 1222 arranged above the bracket 1221, and a telescopic plate 1223 arranged above the lifting mechanism 1222, and the sub-clamp lower module 220 can be detachably placed above the telescopic plate 1223.

[0087] The bracket 1221 may include a bracket 1221 bottom plate and bracket 1221 side plates connected to opposite sides of the bracket 1221 bottom plate. The two bracket 1221 side plates are respectively disposed on two opposite inner side walls in the width direction of the cabinet 110. For example, the two bracket 1221 side plates may be connected to the two opposite inner side walls in the width direction of the cabinet 110 using fasteners such as screws. Optionally, a mating piece 1224 may be disposed at one end of the bracket 1221 side plate near the front wall of the cabinet 110.

[0088] The lifting mechanism 1222 may include a lifting motor 12221, a slide rail 12222, a sliding guide 12223, and a lifting plate 12224. The lifting motor 12221 and the slide rail 12222 may both be mounted on the bottom plate of the bracket 1221. The slide rail 12222 may extend along the depth direction of the cabinet 110. The sliding guide 12223 connects the slide rail 12222 and the output shaft of the lifting motor 12221. The sliding guide 12223 is driven by the lifting motor 12221 to reciprocate along the slide rail 12222. The sliding guide 12223 is provided with a guide slope extending obliquely along the depth direction of the cabinet 110. The bottom surface of the lifting plate 12224 is provided with rollers supported on the guide slope and capable of rolling along the guide slope.

[0089] For example, the end of the guide slope near the front wall of the cabinet 110 can be set higher than the end of the guide slope near the rear wall of the cabinet 110. When the sliding guide 12223 moves along the slide rail 12222 toward the front wall of the cabinet 110 under the drive of the lifting motor 12221, the roller moves downward along the guide slope and drives the lifting plate 12224 to descend; when the sliding guide 12223 moves along the slide rail 12222 toward the rear wall of the cabinet 110 under the drive of the lifting motor 12221, the roller moves upward along the guide slope and drives the lifting plate 12224 to ascend.

[0090] The telescopic plate 1223 is disposed above the lifting plate 12224, and a sliding mechanism 12231 may be disposed between the telescopic plate 1223 and the lifting plate 12224 to allow the telescopic plate 1223 to slide back and forth along the depth direction of the cabinet 110. Exemplarily, the sliding mechanism 12231 may include a slideway and a slider that cooperate with each other. The slider may be disposed on a side of the telescopic plate 1223 facing the lifting plate 12224, and the slideway may be disposed on a side of the lifting plate 12224 facing the telescopic plate 1223. The slideway extends along the depth direction of the cabinet 110, and the slider is accommodated in the slideway and can slide back and forth along the slideway, thereby allowing the telescopic plate 1223 to slide back into the cabinet 110 along the depth direction of the cabinet 110, or to slide out from the side where the front wall of the cabinet 110 is located. Optionally, the lower front wall 1112 may be connected to one end of the telescopic plate 1223 close to the front wall of the cabinet 110 , so as to open as the telescopic plate 1223 is extended and close as the telescopic plate 1223 is retracted.

[0091] In one possible implementation, the extension and retraction of the telescopic plate 1223 can be driven by a telescopic motor, and a button can be set on the lower front wall 1112. The button can be electrically connected to the telescopic motor, and the button is configured to control the extension and retraction of the telescopic plate 1223.

[0092] In practice, the sub-clamp module 200 is installed in place within the mother clamp module 120. To begin testing, a button is pressed, causing the retractable plate 1223 to extend from the side of the cabinet 110, carrying the sub-clamp lower module 220, and placing the circuit board to be tested on the sub-clamp lower module 220. Pressing the button again causes the retractable plate 1223, carrying the sub-clamp lower module 220 and the circuit board to be tested on the sub-clamp lower module 220, to retract into the cabinet 110. At this point, the lifting mechanism 1222 drives the retractable plate 1223, supporting the sub-clamp lower module 220 and the circuit board to be tested on the sub-clamp lower module 220, to ascend, allowing the circuit board to dock with the sub-clamp upper module 210 for testing. After the test is completed, the lifting mechanism 1222 can drive the telescopic plate 1223 to support the sub-clamp lower module 220 and the circuit board located on the sub-clamp lower module 220 to descend, so as to press the button to make the telescopic plate 1223 with the sub-clamp lower module 220 and the circuit board located on the sub-clamp lower module 220 extend from the side where the front wall of the cabinet 110 is located, so as to take out the circuit board.

[0093] Reference Figure 7 As shown, the sub-clamp module 200 includes an upper sub-clamp module 210 and a lower sub-clamp module 220. The upper sub-clamp module 210 and the lower sub-clamp module 220 are arranged opposite to each other, and the side of the lower sub-clamp module 220 facing the upper sub-clamp module 210 is used to place the circuit board to be tested.

[0094] Reference Figure 8 As shown, the sub-clip upper module 210 includes a sub-clip upper plate 211 and a floating panel 212. The sub-clip upper plate 211 is detachably connected to the mother clamp upper module 121. For example, the opposite edges of the sub-clip upper plate 211 are configured to be received in two guide slots 1211 of the mother clamp upper module 121, and latch notches can be provided on opposite edges of the sub-clip upper plate 211. The floating panel 212 is movably disposed on the side of the sub-clip upper plate 211 facing the sub-clip lower module 220. The side of the floating panel 212 facing the sub-clip lower module 220 is provided with an interface docking structure 2121, which is configured to dock with a circuit board under test placed in the sub-clip lower module 220. Various testing devices can be mounted on the side of the sub-clip upper plate 211 facing away from the floating panel 212. The area on the side of the sub-clip upper plate 211 facing the floating panel 212 that is not covered by the floating panel 212 can also be provided with various testing devices. Optionally, the male connector 310 or the female connector 320 of the connector 300 is disposed at one end of the sub-clip upper plate 211 close to the rear wall of the cabinet 110 .

[0095] Continue to refer to Figure 8As shown, in one possible implementation, a locating pin 2122 is provided on the side of the floating panel 212 facing the sub-clamp lower module 220, and a locating pin hole 2212 is provided on the side of the sub-clamp lower module 220 facing the floating panel 212 to cooperate with the locating pin 2122. In another possible implementation, a locating pin hole 2212 is provided on the side of the floating panel 212 facing the sub-clamp lower module 220, and a locating pin 2122 is provided on the side of the sub-clamp lower module 220 facing the floating panel 212 to cooperate with the locating pin hole 2212. The clearance fit between the locating pin 2122 and the locating pin hole 2212 not only facilitates the smooth docking of the sub-clamp lower module 220 and the floating panel 212, thereby ensuring the stability and reliability of the docking between the panel to be tested on the sub-clamp lower module 220 and the floating panel 212, but also facilitates the smooth docking of the locating pin 2122 and the locating pin hole 2212 even when the floating panel 212 floats.

[0096] Continue to refer to Figure 8 As shown, in one possible implementation, a limiting protrusion 2123 is provided on a side of the floating panel 212 facing the sub-clamp lower module 220. The limiting protrusion 2123 is used to support between the floating panel 212 and the sub-clamp lower module 220. For example, the limiting protrusion 2123 may include multiple limiting protrusions 2123, and the multiple limiting protrusions 2123 may be spaced apart and arranged circumferentially of the floating panel 212; the limiting protrusion 2123 may be cylindrical. In a specific application, when the circuit board to be tested on the sub-clamp lower module 220 is docked with the floating panel 212, the limiting protrusion 2123 is supported between the floating panel 212 and the sub-clamp lower module 220, thereby protecting the interface on the circuit board to be tested and the interface docking structure 2121 on the floating panel 212, thereby preventing the interface on the circuit board to be tested and the interface docking structure 2121 on the floating panel 212 from being squeezed and damaged by each other.

[0097] Continue to refer to Figure 8 As shown, in a possible implementation, a plurality of support legs 2111 are provided on the side of the sub-clip upper plate 211 facing the sub-clip lower module 220. For example, the support legs 2111 may be a columnar structure. The plurality of support legs 2111 are spaced apart along the circumferential edge of the sub-clip upper plate 211, and the length of the support legs 2111 extending is not less than the maximum distance between the side of the floating panel 212 facing the ion clamp upper plate 211 and the sub-clip upper plate 211. Thus, when the sub-clip upper module 210 is placed on a table, the support legs 2111 can support the sub-clip upper plate 211 to avoid crushing the components on the side of the sub-clip upper plate 211 facing the floating panel 212 and the interface docking structure 2121 on the floating panel 212.

[0098] Continue to refer to Figure 8As shown, in one possible implementation, a handle 2112 is provided at one end of the sub-clamp upper plate 211 facing the front wall of the cabinet 110, so that the operator can grasp the handle 2112 to pull the sub-clamp upper module 210 out of the mother clamp upper module 121, or push the sub-clamp upper module 210 into the mother clamp upper module 121.

[0099] Reference Figure 9 As shown, the sub-clamp upper module 210 may further include a connector 213, and the floating panel 212 and the sub-clamp upper plate 211 are movably connected via the connector 213. In one possible implementation, the connector 213 includes a stopper 2131, an optical axis segment 2132, and a threaded segment 2133, which are sequentially connected and have gradually decreasing radial dimensions. One of the sub-clamp upper plate 211 and the floating panel 212 is provided with a through hole, and the other is provided with a threaded hole. The optical axis segment 2132 is clearance-matched with the through hole, and the axial dimension of the optical axis segment 2132 is greater than the axial dimension of the through hole. The threaded segment 2133 is threadedly connected to the threaded hole, thereby allowing the floating panel 212 to move not only in a direction perpendicular to the sub-clamp upper plate 211, but also in a direction parallel to the sub-clamp panel, thereby allowing the interface docking structure 2121 on the floating panel 212 to float and adapt to the interface of the circuit board to be tested, thereby improving docking accuracy.

[0100] For example, a through hole can be provided on the sub-clip upper plate 211, extending through the sub-clip upper plate 211, and a threaded hole can be provided on the floating panel 212. The connector 213 is inserted into the through hole and the threaded hole, so that the threaded segment 2133 is threadedly connected to the threaded hole, the optical axis segment 2132 is loosely fitted into the through hole, and the stopper 2131 overlaps the side of the sub-clip upper plate 211 facing away from the floating panel 212. In this case, the axial dimension of the optical axis segment 2132 is greater than the thickness of the sub-clip upper plate 211, and the radial dimension of the optical axis segment 2132 is smaller than the radial dimension of the through hole.

[0101] In one possible implementation, the distance that the floating panel 212 moves in a direction perpendicular to the sub-clip upper plate 211 ranges from 0.4 mm to 0.6 mm. For example, the distance that the floating panel 212 moves in a direction perpendicular to the sub-clip upper plate 211 can be set to 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, or any value between 0.4 mm and 0.6 mm, depending on actual needs. In other possible implementations, the distance that the floating panel 212 moves in a direction perpendicular to the sub-clip upper plate 211 can range from less than 0.4 mm, such as 0.3 mm or 0.35 mm; or can range from greater than 0.6 mm, such as 0.65 mm or 0.7 mm.

[0102] In one possible implementation, the distance that the floating panel 212 moves in a direction parallel to the sub-clip upper plate 211 ranges from 0.4 mm to 0.6 mm. Exemplarily, the distance that the floating panel 212 moves in a direction parallel to the sub-clip upper plate 211 can be set to 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, or any value between 0.4 mm and 0.6 mm according to actual needs. In other possible implementations, the distance that the floating panel 212 moves in a direction parallel to the sub-clip upper plate 211 can range from less than 0.4 mm, for example, 0.3 mm or 0.35 mm; or can range from greater than 0.6 mm, for example, 0.65 mm or 0.7 mm. It will be understood that the direction parallel to the sub-clip upper plate 211 includes, but is not limited to, the width direction of the cabinet 110 and the depth direction of the cabinet 110.

[0103] Reference Figure 10 As shown, the sub-clip lower module 220 includes a sub-clip lower plate 221 and a carrier plate 222. The carrier plate 222 is disposed on a side of the sub-clip lower plate 221 facing the sub-clip upper module 210. For example, a protrusion 2211 may be provided on an edge of the side of the sub-clip lower plate 221 facing the carrier plate 222, and an escape notch may be provided on an edge of the carrier plate 222. When the carrier plate 222 is mounted on the sub-clip lower plate 221, the protrusion 2211 is received in the escape notch to position the carrier plate 222. Alternatively, when the floating panel 212 is provided with a positioning pin 2122, the positioning pin hole 2212 that cooperates with the positioning pin 2122 may be provided on the sub-clip lower plate 221, for example, on the protrusion 2211 of the sub-clip lower plate 221. Alternatively, when the floating panel 212 is provided with a positioning pin hole 2212, the positioning pin 2122 that cooperates with the positioning pin hole 2212 may be provided on the sub-clip lower plate 221, for example, on the protrusion 2211 of the sub-clip lower plate 221. The carrier plate 222 may be fixed to the sub-clip lower plate 221 by pins.

[0104] The side of the carrier plate 222 facing the sub-clip upper module 210 is used to place the circuit board under test. Optionally, a positioning member can be provided on the side of the carrier plate 222 facing the sub-clip upper module 210 to position the circuit board under test placed on the carrier plate 222. For example, the positioning member can be a positioning stud, and the circuit board under test is provided with a positioning notch. When the circuit board under test is placed on the carrier plate 222, the positioning stud is accommodated in the positioning notch.

[0105] Reference Figure 11As shown, connector 300 can be a heavy-duty connector, comprising a male connector (not shown) and a female connector 320. The male connector is provided on one of the universal test platform and the sub-clip module, while the female connector is provided on the other. When the sub-clip module is installed in the universal test platform, the male and female connectors plug into each other. The heavy-duty connector can provide real-time communication between the sub-clip module and the universal test platform.

[0106] Exemplarily, the female head 320 can be movably set on the female clamp upper module so that the female head 320 can float along the height direction and the width direction of the cabinet, and the gap range of the female head 320 floating along the height direction and the width direction of the cabinet can be set to 0.4mm to 0.6mm, for example, 0.4mm, 0.5mm, 0.6mm or any value between 0.4mm and 0.6mm. The male head can be fixedly set on the sub-clamp upper module. When the sub-clamp upper module is installed in place in the female clamp upper module, the male head and the female head are plugged into each other. Optionally, one of the female head and the male head can be provided with a plug pin 321, and the other can be provided with a plug pin hole, and the male head and the female head are positioned and plugged in by the cooperation of the plug pin 321 and the plug pin hole.

[0107] Reference Figure 12 As shown, in one possible implementation, the connector 300 is a heavy-duty connector. The interfaces of the heavy-duty connector can be divided into 6 groups (A, B, C, D, E, F). Each group has a fixed definition and can be left empty, but cannot be interchanged to ensure design normalization. For example, the definitions of the 6 groups of interfaces of the heavy-duty connector are as follows:

[0108]

[0109] In one possible implementation, the universal test platform may further include a programmable logic controller (PLC) and a control computer. The PLC is disposed in a cabinet and is used to control controllable components in the cabinet. The control computer is disposed outside the cabinet. For example, the control computer may be connected to the outer surface of the cabinet, or the control computer may be disposed at a position with a preset distance from the cabinet and be communicatively connected to the cabinet. The control computer is used to present an interface of the PLC. The control computer includes, but is not limited to, an industrial control computer. As universal resources on the universal test platform, the PLC and the control computer may be used when replacing any sub-clamp module in the circuit board test equipment and performing circuit board testing, thereby improving the utilization rate of universal resources and reducing costs.

[0110] In one possible implementation, the universal test platform may further include a switch, a video graphics array (VGA) capture card, a light-emitting diode (LED) test assembly, and a central processing unit (CPU) heat dissipation assembly disposed in a cabinet, wherein the switch is used to connect to a network port, the VGA capture card and the LED test assembly are respectively used to test corresponding devices on a circuit board to be tested, and the CPU heat dissipation assembly is used to dissipate heat from the CPU on the circuit board to be tested. The switch, VGA capture card, LED test assembly, and CPU heat dissipation assembly serve as universal resources on the universal test platform and can be selectively called upon when the circuit board test equipment replaces any sub-clamp module 200 and performs circuit board testing, thereby facilitating improved utilization of universal resources and reducing costs.

[0111] The vertical values, numerical values and numerical ranges involved in the embodiments of the present application are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors. Those skilled in the art may consider this part of the error to be negligible.

[0112] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0113] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0114] Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they may modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, such modifications or replacements do not deviate from the essence of the corresponding technical solutions within the scope of the various embodiments of this application.

Claims

1. A circuit board testing device, characterized in that: Includes universal test platform, sub-clip module and connector; The sub-clamping module is detachably arranged in the universal test platform, and the sub-clamping module and the universal test platform are connected via a connector; Wherein, the sub-clamp module includes an upper sub-clamp module and a lower sub-clamp module, the upper sub-clamp module and the lower sub-clamp module are arranged opposite to each other, and the side of the lower sub-clamp module facing the upper sub-clamp module is used to place the circuit board to be tested; the upper sub-clamp module is provided with an interface docking structure, and the interface docking structure is adapted to be connected with the interface on the circuit board to be tested; the upper sub-clamp module includes an upper sub-clamp plate and a floating panel, and the floating panel is movably arranged on a side of the upper sub-clamp plate facing the lower sub-clamp module; the upper sub-clamp module also includes a connecting piece, and the floating panel and the upper sub-clamp plate are movably connected through the connecting piece; The connecting member comprises a stopper portion, an optical axis segment and a threaded segment which are sequentially connected and have gradually decreasing radial dimensions; One of the sub-clamp upper plate and the floating panel is provided with a through hole, and the other is provided with a threaded hole, the optical axis segment is loosely matched with the through hole, and the axial dimension of the optical axis segment is larger than the axial dimension of the through hole, and the threaded segment is threadedly connected to the threaded hole; The universal testing platform includes a cabinet and a mother clamp module, the mother clamp module includes a mother clamp upper module and a mother clamp lower module, the mother clamp upper module and the mother clamp lower module are arranged in the cabinet along the height direction of the cabinet, and the mother clamp upper module is located above the mother clamp lower module; The sub-clip upper module is detachably mounted in the cabinet through the mother-clip upper module, and the sub-clip lower module is detachably mounted in the cabinet through the mother-clip lower module; The female clamp module further includes a connecting shaft, and one end of the female clamp upper module close to the rear wall of the cabinet is rotatably connected to the end of the female clamp lower module close to the rear wall of the cabinet through the connecting shaft, and the connecting shaft extends along the width direction of the cabinet; The interface docking structure is provided on a side of the floating panel facing the sub-clip lower module, and the interface docking structure is used for adapting and docking with an interface on a circuit board to be tested placed on the sub-clip lower module.

2. The circuit board testing device according to claim 1, wherein: One of the floating panel and the sub-clip lower module is provided with a positioning pin, and the other is provided with a positioning pin hole, and the positioning pin and the positioning pin hole are clearance-matched.

3. The circuit board testing device according to claim 1, wherein: A limiting protrusion is provided on a side of the floating panel facing the sub-clamp lower module, and the limiting protrusion is used to support between the floating panel and the circuit board to be tested.

4. The circuit board testing device according to claim 1, wherein: A plurality of supporting legs are provided on a side of the sub-clamp upper plate facing the sub-clamp lower module, and the plurality of supporting legs are arranged at intervals along the circumferential edge of the sub-clamp upper plate; The extended length of the supporting legs is not less than the maximum distance between a surface of the floating panel facing away from the sub-clamp upper plate and the sub-clamp upper plate.

5. The circuit board testing device according to claim 1, wherein: The female clamp upper module includes two guide grooves and fixing members arranged on the guide grooves, wherein the two guide grooves are respectively arranged on two opposite inner side walls in the width direction of the cabinet and extend along the depth direction of the cabinet; The opposite sides of the sub-clip upper module are respectively accommodated in the two guide grooves and slide along the guide grooves; The fixing member is used to fix the sub-clip upper module when the sub-clip upper module is installed in place.

6. The circuit board testing device according to claim 1, wherein: The mother clamp lower module includes a bracket, a lifting mechanism and a telescopic plate, the bracket is connected to two opposite inner side walls in the width direction of the cabinet, the lifting mechanism is arranged above the bracket, the telescopic plate is arranged above the lifting mechanism, and the sub-clamp lower module is detachably placed above the telescopic plate; The telescopic plate is slidably connected to the lifting mechanism, and the telescopic plate slides back and forth along the depth direction of the cabinet; The lifting mechanism drives the telescopic plate to move up and down.

7. The circuit board testing device according to claim 1, wherein: The universal test platform further includes a programmable logic controller and a control computer. The programmable logic controller is disposed in the cabinet and is used to control the controllable components in the cabinet. The control computer is disposed outside the cabinet and is used to present an interface of the programmable logic controller. and / or, The universal test platform also includes a switch, a VGA acquisition card, an LED test component and a CPU heat dissipation component arranged in the cabinet. The switch is used to connect the network port, the VGA acquisition card and the LED test component are respectively used to test the corresponding devices on the circuit board to be tested, and the CPU heat dissipation component is used to dissipate heat from the CPU on the circuit board to be tested.

8. The circuit board testing device according to any one of claims 1 to 4, characterized in that: The connector is a heavy-duty connector, comprising a male connector and a female connector. One of the universal test platform and the sub-clip upper module is provided with the male connector, and the other is provided with the female connector. When the sub-clip upper module is installed in the universal test platform, the male connector and the female connector are plugged into each other.

9. The circuit board testing device according to any one of claims 1 to 4, characterized in that: The sub-clamp lower module includes a sub-clamp lower plate and a carrier plate. The carrier plate is arranged on a side of the sub-clamp lower plate facing the sub-clamp upper module. The side of the carrier plate facing the sub-clamp upper module is used to place the circuit board to be tested.

10. The circuit board testing device according to claim 9, characterized in that: A positioning piece is provided on a side of the carrier board facing the sub-clamp upper module, and the positioning piece is used to position the circuit board to be tested placed on the carrier board.

Images