Condensation molding equipment for semiconductor material processing

Abstract

The present invention provides a condensation molding device for semiconductor material processing, which relates to the technical field of semiconductor material processing and includes: a collection box; a groove is formed inside the collection box, and a rectangular groove is formed in the middle of the top of the collection box. The rectangular groove of the collection box communicates with the groove of the collection box. A cooling rack is clamped and fixed in the middle of the rectangular groove of the collection box. Cooling oil is injected into the cooling pipe and the transfer pipe. Next, the transfer oil pump is started, and the transfer oil pump will drive the cooling oil inside the cooling pipe and the transfer pipe to circulate, so that the cooling oil in the transfer pipe will not have a problem of local temperature rise. When the transfer pipe is in contact with the bottom of the placement plate, it can further reduce the temperature of the semiconductor at the upper end of the placement plate and improve the efficiency of semiconductor condensation. When the wind cools the semiconductor material, the air medium will weaken the wind force effect when transmitting the wind force, solving the problem that the wind energy causing the wind force transmission has a hot wind phenomenon and is not convenient for cooling the semiconductor material.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor material processing, and particularly to a condensation forming device for semiconductor material processing. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors have extensive applications in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. Today, the core units in most electronic products, such as computers, mobile phones, or digital recorders, are extremely closely related to semiconductors. During the processing of semiconductor materials, a condensation step is required for semiconductor materials to improve the cooling efficiency of semiconductor materials.

[0003] Similar to the current condensation forming devices for semiconductor material processing, there are still the following deficiencies: Most of the current condensation devices for semiconductor materials are achieved by air cooling. When the air cools the semiconductor material, the air medium will weaken the wind force effect during the transmission of the wind force, resulting in a hot air phenomenon in the wind energy transmitted by the wind force, which is not convenient for the cooling of semiconductor materials.

[0004] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies to provide a condensation forming device for semiconductor material processing, with the expectation of achieving a more practical value. Summary of the Invention

[0005] The present invention provides the purpose and efficacy of a condensation forming device for semiconductor material processing, specifically including: a collection box; a groove is provided inside the collection box, and a rectangular groove is provided in the middle of the top of the collection box. The rectangular groove of the collection box communicates with the groove of the collection box. A cooling rack is clamped and fixed in the middle of the rectangular groove of the collection box. The cooling rack is designed in layers, and cooling pipes are also provided inside the cooling rack. The position at the rear end of the top of the collection box is fixedly connected to the bottom position of a baffle. A fan is fixedly connected to the middle position of the baffle. The positions on both sides of the top of the collection box are fixedly connected to the positions on both sides of the bottom of an extension rack.

[0006] Further, a water supply pump is fixedly connected to the middle position of the top of the extension rack. A spray head is provided at the bottom of the water supply pump. The spray head position of the water supply pump is located directly above the cooling rack.

[0007] Further, the positions on the left and right sides of the baffle are respectively in contact with the positions on both sides of the rear end of the extension rack. The baffle is located directly behind the cooling rack. The fan is located in the middle of the rear of the cooling pipe.

[0008] Further, the left side of the water supply pump is fixedly connected to the upper right position of a U-shaped water supply pipe. The lower right position of the water supply pipe is inserted and fixed inside the left side of the collection box, and the lower right position of the bottom of the water supply pipe is located in the middle of the groove of the collection box.

[0009] Further, the overall cooling pipe is designed in a spiral shape. Joints are respectively arranged at the left and right positions at the bottom of the cooling pipe. The right joint position of the cooling pipe is connected to one end position of the transfer pipe.

[0010] Further, the overall transfer pipe is designed in a spiral shape. The other end position of the transfer pipe is connected to the front right position of the transfer oil pump. The top position of the transfer oil pump is fixedly connected to the upper position inside the groove of the collection box. The left position of the transfer oil pump is connected to the left joint position of the cooling pipe. Cooling oil is injected into the cooling pipe and the transfer pipe. Next, start the transfer oil pump, and the transfer oil pump will drive the cooling oil inside the cooling pipe and the transfer pipe to circulate, so that the cooling oil in the transfer pipe will not have a problem of local position increase.

[0011] Further, a sponge pad is placed at the front end inside the extension frame. The bottom position of the sponge pad fits with the front end position of the top of the collection box. The sponge pad is located directly in front of the cooling frame.

[0012] Further, the front end position of the collection box is fixedly connected to the lower rear position of the protective frame. The upper rear position of the protective frame fits with the front end position of the extension frame. The transfer pipe is located in the middle and lower position inside the protective frame. A chute is fixedly connected to each of the left and right positions inside the protective frame. The two chutes are symmetrically designed. The left and right positions of the placement plate are slidably connected to the inside positions of the two chutes. The placement plate is located in the middle of the protective frame, and the bottom position of the placement plate fits with the top position of the transfer pipe.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] Place the semiconductor material on the top position of the placement plate. Next, push the placement plate backward. Through the cooperation of the placement plate and the two chutes, slide the placement plate to the middle position inside the protective frame. At this time, the bottom position of the placement plate will fit with the upper position of the transfer pipe, completing the storage and placement steps of the semiconductor material.

[0015] Inject cooling oil into the cooling pipe and the transfer pipe. Next, start the transfer oil pump, and the transfer oil pump will drive the cooling oil inside the cooling pipe and the transfer pipe to circulate, so that the cooling oil in the transfer pipe will not have a problem of local position increase. When the transfer pipe fits with the bottom position of the placement plate, it can further reduce the temperature of the semiconductor at the upper end of the placement plate and improve the efficiency of semiconductor condensation.

[0016] Pour water into the groove of the collection box. Next, start the water supply pump. The water supply pump, through the cooperation of the water supply pipe, pumps the water in the groove of the collection box to the internal position of the water supply pump, and then sprays the water source from the bottom nozzle of the water supply pump to the top position of the cooling rack. Combining with the shape structure of the cooling rack, the water sprayed from the bottom nozzle of the water supply pump will cover the cooling pipes in the cooling rack, comprehensively spraying the cooling rack, thereby reducing the overall temperature of the cooling rack. Through the temperature conduction of the cooling rack, the temperature of the cooling oil inside the cooling pipes is reduced, improving the cooling efficiency of the cooling oil circulating inside the cooling pipes and the transfer pipes, and indirectly improving the cooling effect on the placement board.

[0017] When starting the fan, the wind generated by the fan directly cools the cooling rack, indirectly improving the cooling effect of the cooling rack by the water sprayed from the bottom nozzle of the water supply pump. And when the wind of the fan passes through the position between the cooling racks, the wind is indirectly cooled by the cold water sprayed from the bottom nozzle of the water supply pump, reducing the heat energy existing in the wind. At this time, the wind energy passes through the sponge pad to cool and condense the semiconductor material at the upper end of the transfer pipe, achieving the effect of wind-assisted cooling. Brief Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below.

[0019] The drawings in the following description only relate to some embodiments of the present invention and do not limit the present invention.

[0020] In the drawings:

[0021] Figure 1 Shows the left-view state structure schematic diagram of the condensation molding device according to the embodiment of the present invention;

[0022] Figure 2 Shows the side-view state structure schematic diagram of the condensation molding device according to the embodiment of the present invention;

[0023] Figure 3 Shows the front-view assembly structure schematic diagram of the overall collection box, the overall cooling rack and the overall baffle according to the embodiment of the present invention;

[0024] Figure 4 Shows the top-view assembly structure schematic diagram of the overall collection box, the overall cooling rack and the overall baffle according to the embodiment of the present invention;

[0025] Figure 5 Shows the left-view assembly structure schematic diagram of the overall collection box, the overall cooling rack and the overall baffle according to the embodiment of the present invention;

[0026] Figure 6 Shows the side-view assembly structure schematic diagram of the overall collection box, the overall cooling rack and the overall baffle according to the embodiment of the present invention;

[0027] Figure 7 Shows a schematic side view of the overall cooling rack according to an embodiment of the present invention;

[0028] Figure 8 Shows a schematic semi-sectional side view of the condensation molding device according to an embodiment of the present invention.

[0029] List of reference numerals

[0030] 1. Collection box; 101. Extension rack; 102. Water supply pump; 103. Water supply pipe; 2. Cooling rack; 201. Cooling pipe; 202. Conduit; 203. Transfer oil pump; 3. Baffle; 301. Fan; 4. Sponge pad; 5. Protective rack; 501. Slide groove; 502. Storage plate. Detailed implementation manners

[0031] The following further describes in detail the implementation manners of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0032] In the description of the present invention, unless otherwise specified, "a plurality of" means two or more; the orientation or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0033] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0034] Embodiment:

[0035] As shown in the attached Figure 1 to the attached Figure 8 shown:

[0036] The present invention provides a condensation molding device for semiconductor material processing, including: a collection box 1; a groove is provided inside the collection box 1, and a rectangular groove is provided in the middle of the top of the collection box 1. The rectangular groove of the collection box 1 communicates with the groove of the collection box 1. A cooling rack 2 is clamped and fixed in the middle of the rectangular groove of the collection box 1. The cooling rack 2 is designed in layers, and a cooling pipe 201 is also provided inside the cooling rack 2. The rear end position of the top of the collection box 1 is fixedly connected to the bottom position of a baffle 3. A fan 301 is fixedly connected to the middle position of the baffle 3. The two side positions of the top of the collection box 1 are fixedly connected to the two side positions of the bottom of an extension rack 101. The front end position of the collection box 1 is fixedly connected to the lower rear position of the rear end of a protective rack 5. The upper rear position of the protective rack 5 fits with the front end position of the extension rack 101. A transfer pipe 202 is located in the middle and lower position inside the protective rack 5. A chute 501 is fixedly connected to each of the left and right sides inside the protective rack 5. The two chutes 501 are symmetrically designed. The left and right side positions of an object placement board 502 are slidably connected to the inside positions of the two chutes 501. The object placement board 502 is located in the middle position inside the protective rack 5, and the bottom position of the object placement board 502 fits with the top position of the transfer pipe 202. The object placement board 502 is made of copper material as a whole. Place the semiconductor material on the top position of the object placement board 502. Next, push the object placement board 502 backward. Through the cooperation of the object placement board 502 and the two chutes 501, the object placement board 502 is slid to the middle position inside the protective rack 5. At this time, the bottom position of the object placement board 502 will fit with the upper position of the transfer pipe 202, completing the storage and placement of the semiconductor material.

[0037] Among them, a water supply pump 102 is fixedly connected to the middle position of the top of the extension rack 101. A spray head is provided at the bottom position of the water supply pump 102. The spray head position of the water supply pump 102 is located directly above the cooling rack 2. The cooling rack 2 is made of copper material as a whole. The left and right side positions of the baffle 3 are respectively in contact with the two side positions of the rear end of the extension rack 101. The baffle 3 is located directly behind the cooling rack 2. The fan 301 is located in the middle position behind the cooling pipe 201.

[0038] Among them, the left side position of the water supply pump 102 is fixedly connected to the upper right position of a U-shaped water supply pipe 103. The lower right position of the water supply pipe 103 is inserted and fixed inside the left side of the collection box 1, and the lower right position of the bottom of the water supply pipe 103 is located in the middle position inside the groove of the collection box 1.

[0039] Among them, the overall cooling pipe 201 is designed in a spiral shape. Joints are respectively arranged at the left and right positions at the bottom of the cooling pipe 201. The right joint position of the cooling pipe 201 is connected to one end position of the transfer pipe 202. The transfer pipe 202 is integrally designed in a spiral shape. The other end position of the transfer pipe 202 is connected to the right front end position of the transfer oil pump 203. The top position of the transfer oil pump 203 is fixedly connected to the upper position inside the groove of the collection box 1. The left position of the transfer oil pump 203 is connected to the left joint position of the cooling pipe 201. Cooling oil is injected into the cooling pipe 201 and the transfer pipe 202. Next, the transfer oil pump 203 is started, and the transfer oil pump 203 will drive the cooling oil inside the cooling pipe 201 and the transfer pipe 202 to circulate, so that the cooling oil in the transfer pipe 202 will not have a problem of local position increase.

[0040] Among them, a sponge pad 4 is placed at the front end position inside the extension frame 101. The bottom position of the sponge pad 4 is attached to the front end position of the top of the collection box 1. The sponge pad 4 is located directly in front of the cooling frame 2.

[0041] During use: First, assemble the present device relative to the embodiment. Next, place the semiconductor material on the top position of the placement plate 502. Next, push the placement plate 502 backward. Through the cooperation of the placement plate 502 and the two sliding grooves 501, the placement plate 502 is slid to the middle position inside the protective frame 5. At this time, the bottom position of the placement plate 502 will be attached to the upper position of the transfer pipe 202, completing the storage and placement steps of the semiconductor material.

[0042] Cooling oil is injected into the cooling pipe 201 and the transfer pipe 202. Next, the transfer oil pump 203 is started, and the transfer oil pump 203 will drive the cooling oil inside the cooling pipe 201 and the transfer pipe 202 to circulate, so that the cooling oil in the transfer pipe 202 will not have a problem of local position increase. When the transfer pipe 202 is attached to the bottom position of the placement plate 502, it can further reduce the temperature of the semiconductor at the upper end of the placement plate 502 and improve the efficiency of semiconductor condensation.

[0043] Pour water into the groove of the collection box 1. Next, start the water supply pump 102. The water supply pump 102 pumps the water in the groove of the collection box 1 to the inside position of the water supply pump 102 through the cooperation of the water supply pipe 103, and then sprays the water source from the bottom nozzle of the water supply pump 102 to the top position of the cooling frame 2. Combining the shape structure of the cooling frame 2, the water sprayed by the bottom nozzle of the water supply pump 102 will cover the cooling pipe 201 inside the cooling frame 2, perform a comprehensive spray on the cooling frame 2, thereby reducing the overall temperature of the cooling frame 2. Through the temperature conduction of the cooling frame 2, the temperature of the cooling oil inside the cooling pipe 201 is reduced, improving the cooling efficiency of the cooling oil circulating inside the cooling pipe 201 and the transfer pipe 202, and indirectly improving the cooling effect on the placement plate 502.

[0044] When the fan 301 is started, the wind generated by the fan 301 directly cools the cooling rack 2 by wind, indirectly improving the cooling effect of the cooling rack 2 by the bottom nozzles of the water supply pump 102 spraying water. And when the wind of the fan 301 passes through the position between the cooling racks 2, the wind is indirectly cooled by the cold water sprayed from the bottom nozzles of the water supply pump 102, reducing the heat energy existing in the wind. At this time, the wind energy passes through the sponge pad 4 to cool and condense the semiconductor material at the upper end of the transfer conduit 202, achieving the effect of wind-assisted cooling.

[0045] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles of the invention and its practical application, and to enable those of ordinary skill in the art to understand the invention and design various embodiments with various modifications suitable for specific purposes.

Claims

1. Condensation molding equipment for semiconductor material processing, characterized in that, it includes: A collection box (1); a groove is provided inside the collection box (1), and a rectangular groove is provided in the middle of the top of the collection box (1). The rectangular groove of the collection box (1) communicates with the groove of the collection box (1). A cooling rack (2) is clamped and fixed in the middle of the rectangular groove of the collection box (1). The cooling rack (2) is designed in layers, and a cooling pipe (201) is also provided inside the cooling rack (2). The rear end position of the top of the collection box (1) is fixedly connected to the bottom position of a baffle (3). A fan (301) is fixedly connected to the middle position of the baffle (3). The two side positions of the top of the collection box (1) are fixedly connected to the two bottom side positions of an extension rack (101); A water supply pump (102) is fixedly connected to the middle position of the top of the extension rack (101). A nozzle is provided at the bottom position of the water supply pump (102). The nozzle position of the water supply pump (102) is located directly above the cooling rack (2); The left and right side positions of the baffle (3) are respectively in contact with the two rear side positions of the extension rack (101). The baffle (3) is located directly behind the cooling rack (2). The fan (301) is located in the middle position behind the cooling pipe (201); The left side position of the water supply pump (102) is fixedly connected to the upper right position of a U-shaped water supply pipe (103). The lower right position of the water supply pipe (103) is inserted and fixed inside the left side of the collection box (1), and the lower right position of the bottom of the water supply pipe (103) is located in the middle of the groove inside the collection box (1); The overall cooling pipe (201) is designed in a spiral shape. Joints are respectively provided at the left and right bottom side positions of the cooling pipe (201). The right joint position of the cooling pipe (201) is connected to one end position of a transfer pipe (202); The overall transfer pipe (202) is designed in a spiral shape. The other end position of the transfer pipe (202) is connected to the front right position of the right side of a transfer oil pump (203). The top position of the transfer oil pump (203) is fixedly connected to the upper position inside the groove of the collection box (1). The left side position of the transfer oil pump (203) is connected to the left joint position of the cooling pipe (201); A sponge pad (4) is placed at the front end position inside the extension rack (101). The bottom position of the sponge pad (4) is in contact with the front end position of the top of the collection box (1). The sponge pad (4) is located directly in front of the cooling rack (2); The front end position of the collection box (1) is fixedly connected to the lower rear position of a protective frame (5). The upper rear position of the protective frame (5) is in contact with the front end position of the extension rack (101). The transfer pipe (202) is located in the middle and lower position inside the protective frame (5). A chute (501) is fixedly connected to each of the left and right side positions inside the protective frame (5). The two chutes (501) are designed symmetrically. The left and right side positions of a storage plate (502) are slidably connected to the inside positions of the two chutes (501). The storage plate (502) is located in the middle position inside the protective frame (5), and the bottom position of the storage plate (502) is in contact with the top position of the transfer pipe (202).

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