Display substrate, manufacturing method thereof, and display device

Abstract

The present application discloses a display substrate, a manufacturing method thereof, and a display device, which belong to the field of display technology. The display substrate may include: a driving backplane, a first electrode layer, a functional layer, an organic light-emitting layer, and a second electrode layer. Among them, the functional layer has a partition groove, and a plurality of pixel openings corresponding one by one to the first electrodes in the plurality of first electrode layers. The organic material layers between the light-emitting devices are disconnected by the partition groove. When the light-emitting device emits light, the leakage current generated by some organic material layers in the light-emitting device will be separated by the partition groove, so that the light emission of the light-emitting device will not affect the light emission of the adjacent light-emitting device. In this way, the display effect of the display substrate can be ensured to be better. In addition, the pixel opening has an arc-shaped side wall, and the part of the second electrode layer located near the arc-shaped side wall is relatively flat, ensuring that the second electrode layer distributed at this position is not prone to the adverse phenomenon of electrode puncture, so that the display substrate can display the picture normally.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display substrate and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, display devices are being used more and more widely. Among them, organic light emitting diode (OLED) display panels have attracted more and more attention.

[0003] An OLED display panel may include a driving backplane and multiple light-emitting devices located on the driving backplane. Each light-emitting device includes a first electrode, a light-emitting layer, and a second electrode, stacked sequentially away from the driving backplane. The first electrode in each light-emitting device is electrically connected to the driving backplane. When a voltage is applied to the first electrode, an electric field is formed between the first and second electrodes. This electric field causes the light-emitting layer located between the first and second electrodes to generate photons, emitting light outward, thereby enabling the OLED display panel to display images.

[0004] However, the light-emitting layer in the OLED display panel is usually formed by evaporation of the entire layer using an evaporation process, that is, the light-emitting layers in various light-emitting devices are connected together, which will result in poor display effects of the OLED display panel. Summary of the Invention

[0005] The present invention provides a display substrate, a manufacturing method thereof, and a display device. This invention can solve the problem of poor display quality of OLED display panels in the prior art. The technical solution is as follows:

[0006] In one aspect, a display substrate is provided, comprising:

[0007] Driver backplane;

[0008] a first electrode layer located on one side of the driving backplane, the first electrode layer having a plurality of first electrodes, the first electrodes being electrically connected to the driving backplane;

[0009] a functional layer, at least a portion of the functional layer being located on a side of the first electrode layer facing away from the driving backplane, the functional layer having a partition groove and a plurality of pixel openings corresponding one-to-one to the plurality of first electrodes, at least a portion of the first electrodes being located within the corresponding pixel openings, and at least a portion of the sidewalls of the pixel openings being curved sidewalls;

[0010] an organic light-emitting layer located on a side of the functional layer away from the driving backplane, the organic light-emitting layer comprising: a plurality of organic material layers stacked in a direction perpendicular to and away from the driving backplane, wherein at least a portion of the organic material layers located within the partition groove is disconnected from a portion located outside the partition groove;

[0011] and a second electrode layer located on a side of the organic light emitting layer away from the driving backplane.

[0012] Optionally, the orthographic projection of the partition groove on the driving backplane is located between the orthographic projections of two adjacent pixel openings on the driving backplane.

[0013] Optionally, the display substrate further includes: a buffer layer located on a side of the first electrode layer close to the driving backplane, the buffer layer having an auxiliary isolation groove, the orthographic projection of the auxiliary isolation groove on the driving backplane being located between the orthographic projections of two adjacent first electrodes on the driving backplane;

[0014] At least a portion of the functional layer is filled in the auxiliary isolation trench, and a portion of the functional layer located in the auxiliary isolation trench has the partition trench.

[0015] Optionally, the functional layer includes: a first organic layer and a first inorganic layer, at least a portion of the first organic layer is filled in the auxiliary isolation groove, and the first inorganic layer is located on a side of the first organic layer away from the driving backplane;

[0016] In which, the partition groove includes: a first sub-partition groove passing through the first inorganic layer, and a second sub-partition groove passing through the first organic layer, the orthographic projection of the first sub-partition groove on the driving backplane is located within the orthographic projection of the second sub-partition groove on the driving backplane, and the boundary of the orthographic projection of the first sub-partition groove on the driving backplane does not overlap with the boundary of the orthographic projection of the second sub-partition groove on the driving backplane.

[0017] Optionally, a portion of the first organic layer is filled in the auxiliary isolation trench, and another portion is located outside the auxiliary isolation trench and covers an edge portion of the first electrode;

[0018] Among them, the pixel opening includes: a first sub-pixel opening passing through the first inorganic layer, and a second sub-pixel opening passing through the first organic layer, and the orthographic projection of the first sub-pixel opening on the driving backplane is located within the orthographic projection of the second sub-pixel opening on the driving backplane.

[0019] Optionally, the sidewall of the second sub-pixel opening is arc-shaped, and a portion of the first inorganic layer located within the second sub-pixel opening covers the sidewall of the second sub-pixel opening.

[0020] Optionally, the partition groove and the pixel opening belong to the same structure in the functional layer.

[0021] Optionally, the buffer layer includes: a second organic layer and a second inorganic layer, and the second organic layer is closer to the driving backplane than the second inorganic layer;

[0022] In which, the pixel opening includes: a third sub-pixel opening passing through the second inorganic layer, and a fourth sub-pixel opening passing through the second organic layer, the orthographic projection of the third sub-pixel opening on the driving backplane is located within the orthographic projection of the fourth sub-pixel opening on the driving backplane, and the boundary of the orthographic projection of the third sub-pixel opening on the driving backplane does not overlap with the boundary of the orthographic projection of the fourth sub-pixel opening on the driving backplane.

[0023] Optionally, the portion of the second inorganic layer that protrudes relative to the second organic layer is an arc-shaped extension portion.

[0024] Optionally, the display substrate further includes: a buffer layer and a plurality of transfer electrodes, the buffer layer being located on a side of the first electrode layer close to the driving backplane, and the buffer layer having a plurality of transfer holes corresponding one-to-one to the plurality of transfer electrodes, the transfer electrodes being located in the corresponding transfer holes and electrically connected to the driving backplane;

[0025] The plurality of switching electrodes are electrically connected to the plurality of first electrodes in a one-to-one correspondence, and a surface of the switching electrodes facing away from the driving back plate is flush with a surface of the buffer layer facing away from the driving back plate.

[0026] In another aspect, a method for manufacturing a display substrate is provided, the method comprising:

[0027] forming a first electrode layer on one side of the driving backplane, wherein the first electrode layer has a plurality of first electrodes, and the first electrodes are electrically connected to the driving backplane;

[0028] forming a functional layer on a side of the driving backplane on which the first electrode layer is formed, wherein at least a portion of the functional layer is located on a side of the first electrode layer facing away from the driving backplane, the functional layer having a partition groove and a plurality of pixel openings corresponding one-to-one to the plurality of first electrodes, at least a portion of the first electrodes being located within the corresponding pixel openings, and at least a portion of the sidewalls of the pixel openings being curved sidewalls;

[0029] An organic light-emitting layer is formed on a side of the functional layer away from the driving backplane, wherein the organic light-emitting layer comprises: a plurality of organic material layers stacked in a direction perpendicular to and away from the driving backplane, wherein at least a portion of the organic material layers located within the partition groove is disconnected from a portion located outside the partition groove;

[0030] A second electrode layer is formed on a side of the organic light emitting layer away from the driving backplane.

[0031] Optionally, the method further comprises: before forming the first electrode layer on one side of the driving backplane, forming a buffer layer on one side of the driving backplane;

[0032] The forming of the functional layer on one side of the driving backplane having the first electrode layer formed thereon comprises:

[0033] Performing a patterning process on the buffer layer to form an auxiliary isolation trench in the buffer layer, wherein an orthographic projection of the auxiliary isolation trench on the driving backplane is located between orthographic projections of two adjacent first electrodes on the driving backplane;

[0034] forming a functional layer on the buffer layer having the auxiliary isolation trench, and patterning the functional layer to form the partition trench in a portion of the functional layer located within the auxiliary isolation trench, and forming the plurality of pixel openings in other portions of the functional layer;

[0035] The orthographic projection of the partition groove on the driving backplane is located between the orthographic projections of two adjacent pixel openings on the driving backplane.

[0036] Optionally, forming a functional layer on the buffer layer with the auxiliary isolation trench and performing patterning on the functional layer includes:

[0037] forming a first organic layer on the buffer layer having the auxiliary isolation groove, wherein a portion of the first organic layer is located in the auxiliary isolation groove and another portion covers the first electrode layer;

[0038] performing a patterning process on the first organic layer to form a plurality of second sub-pixel openings in the first organic layer corresponding one-to-one to the plurality of first electrodes, wherein orthographic projections of the second sub-pixel openings on the driving backplane are located within orthographic projections of the corresponding first electrodes on the driving backplane, and sidewalls of the second sub-pixel openings are curved;

[0039] forming a first inorganic layer on the first organic layer having the plurality of second sub-pixel openings;

[0040] The first inorganic layer is patterned to form a first sub-partitioning groove and a plurality of first sub-pixel openings corresponding one-to-one to the plurality of second sub-pixel openings in the first inorganic layer, wherein the orthographic projections of the first sub-pixel openings on the driving backplane are located within the orthographic projections of the corresponding second sub-pixel openings on the driving backplane, and sidewalls of the patterned first inorganic layer located within the second sub-pixel openings and covering the second sub-pixel openings;

[0041] Using the patterned first inorganic layer as a mask, the portion of the first organic layer located in the auxiliary isolation groove is etched to form a second sub-partitioning groove connected to the first sub-partitioning groove in the first organic layer, the orthographic projection of the first sub-partitioning groove on the driving backplane is located within the orthographic projection of the second sub-partitioning groove on the driving backplane, and the boundary of the orthographic projection of the first sub-partitioning groove on the driving backplane does not overlap with the boundary of the orthographic projection of the second sub-partitioning groove on the driving backplane.

[0042] Optionally, the partition groove and the pixel opening belong to the same structure in the functional layer; and the forming of the functional layer on a side of the driving backplane on which the first electrode layer is formed includes:

[0043] forming a second organic layer on a side of the first electrode layer facing away from the driving backplane, wherein the second organic layer covers the first electrode and covers an area between two adjacent first electrodes;

[0044] Performing pattern processing on the second organic layer to form a plurality of auxiliary pixel grooves corresponding one-to-one to the plurality of first electrodes on a side of the second organic layer facing away from the driving backplane, wherein the orthographic projections of the auxiliary pixel grooves on the driving backplane are located within the orthographic projections of the corresponding first electrodes on the driving backplane, the depth of the auxiliary pixel grooves is less than the thickness of the second organic layer, and the sidewalls of the auxiliary pixel grooves are curved;

[0045] forming a second inorganic layer on the second organic layer having the plurality of auxiliary pixel grooves;

[0046] performing a patterning process on the second inorganic layer to form a plurality of third sub-pixel openings in the second inorganic layer corresponding one-to-one to the plurality of auxiliary pixel grooves, wherein the orthographic projections of the third sub-pixel openings on the driving backplane are located within the orthographic projections of the corresponding auxiliary pixel grooves on the driving backplane, and the patterned second inorganic layer covers sidewalls of the auxiliary pixel grooves;

[0047] Using the patterned second inorganic layer as a mask, etching the second organic layer to form a plurality of fourth sub-pixel openings in the second organic layer that are in one-to-one communication with the plurality of third sub-pixel openings, wherein the orthographic projections of the third sub-pixel openings on the driving backplane are located within the orthographic projections of the fourth sub-pixel openings on the driving backplane, and boundaries of the orthographic projections of the third sub-pixel openings on the driving backplane do not overlap with boundaries of the orthographic projections of the fourth sub-pixel openings on the driving backplane;

[0048] Wherein, the portion of the second inorganic layer protruding relative to the second organic layer is an arc-shaped extension portion.

[0049] On the other hand, a display device is provided, including: a power supply component, and a display substrate electrically connected to the power supply component, wherein the display substrate is the display substrate described above.

[0050] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0051] A display substrate may include: a driving backplane, a first electrode layer, a functional layer, an organic light-emitting layer, and a second electrode layer. The functional layer has a partitioning groove and a plurality of pixel openings corresponding one-to-one to the first electrodes in the plurality of first electrode layers. Because at least a portion of the organic material layer located within the partitioning groove is disconnected from the portion located outside the partitioning groove, the organic material layer between any two adjacent light-emitting devices is disconnected by the partitioning groove. Consequently, when a voltage is applied to the first electrode, the electric field formed between the first electrode and the second electrode layer blocks leakage current generated by portions of the organic material layer in each light-emitting device. This prevents leakage current generated by the organic material layer in a light-emitting device from being laterally directed into the organic material layer adjacent to the light-emitting device, thereby preventing the light emission of the light-emitting device from affecting the light emission of adjacent light-emitting devices. This ensures a good display quality of the display substrate. Furthermore, because at least a portion of the sidewalls of the pixel openings are curved, the portion of the second electrode layer located near the curved sidewalls can extend along the curved direction. In this way, it can be ensured that the second electrode layer distributed at this position is relatively flat, so that the second electrode layer distributed at this position is less likely to have an adverse phenomenon of electrode puncture, so that the display substrate can display images normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0053] Figure 1 is a top view of a display substrate provided in an embodiment of the present application;

[0054] Figure 2 yes Figure 1 Schematic diagram of the film structure at AA' is shown;

[0055] Figure 3 This is a schematic diagram of the film structure of a light-emitting device provided in an embodiment of the present application;

[0056] Figure 4 Schematic diagram of a film structure of a display substrate provided in an embodiment of the present application;

[0057] Figure 5 Schematic diagram of the film structure of another display substrate provided in an embodiment of the present application;

[0058] Figure 6 This is a schematic structural diagram of a display substrate provided in an embodiment of the present application;

[0059] Figure 7 is a flow chart of a method for manufacturing a display substrate provided in an embodiment of the present application;

[0060] Figure 8 This is a schematic diagram of forming a buffer layer and a plurality of transfer electrodes on one side of a driving backplane provided by an embodiment of the present application;

[0061] Figure 9 is a schematic diagram of forming a first electrode layer provided in an embodiment of the present application;

[0062] Figure 10 is a schematic diagram of forming an auxiliary isolation trench in a buffer layer provided by an embodiment of the present application;

[0063] Figure 11 This is a schematic diagram of forming a first organic layer on a buffer layer with an auxiliary isolation trench provided in an embodiment of the present application;

[0064] Figure 12 This is a schematic diagram of a first organic layer after patterning provided in an embodiment of the present application;

[0065] Figure 13 is a schematic diagram of forming a first inorganic layer provided in an embodiment of the present application;

[0066] Figure 14 This is a schematic diagram of a first inorganic layer after patterning provided in an embodiment of the present application;

[0067] Figure 15 This is a schematic diagram of an embodiment of the present application after etching the first organic layer;

[0068] Figure 16 is a flow chart of another method for manufacturing a display substrate provided in an embodiment of the present application;

[0069] Figure 17 This is a schematic diagram of forming a second organic layer on a side of the buffer layer and the first electrode layer facing away from the driving backplane, provided by an embodiment of the present application;

[0070] Figure 18 1 is a schematic diagram of a second organic layer after patterning provided in an embodiment of the present application;

[0071] Figure 19 This is a schematic diagram of a second inorganic layer after patterning provided in an embodiment of the present application;

[0072] Figure 20 This is a schematic diagram of an embodiment of the present application after etching the second organic layer. DETAILED DESCRIPTION

[0073] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0074] In related art, a silicon-based OLED display panel may include a driver backplane and multiple light-emitting devices located on the driver backplane. Each light-emitting device includes a first electrode, a light-emitting layer, and a second electrode, stacked sequentially away from the driver backplane. The first electrode in each light-emitting device is electrically connected to the driver backplane. When a voltage is applied to the first electrode, an electric field is formed between the first and second electrodes. This electric field causes the light-emitting layer located between the first and second electrodes to generate photons, emitting light outward, thereby enabling the OLED display panel to display images.

[0075] The light-emitting layer can be composed of multiple stacked sub-light-emitting layers, each connected in series by a charge generation layer. In this way, the color of light emitted by the light-emitting layer can be determined by the multiple sub-light-emitting layers. For example, if the light-emitting layer is required to emit white light, a sub-light-emitting layer capable of emitting red light, a sub-light-emitting layer capable of emitting green light, and a sub-light-emitting layer capable of emitting blue light can be stacked to produce white light. Each sub-light-emitting layer can include a stacked hole injection layer, a hole transport layer, a luminescent material layer, an electron transport layer, and an electron injection layer. When a voltage is applied to the first electrode, the electric field formed between the first and second electrodes causes electrons and holes to combine to form high-energy excitons. These high-energy excitons are unstable and easily transition to low-energy excitons, releasing energy. This energy release generates photons, which emit light within a certain wavelength range. The charge generation layer is typically made of a highly conductive material to ensure that each sub-light-emitting layer can emit light, thereby enhancing the luminescence efficiency of the light-emitting layer.

[0076] However, the light-emitting layer in an OLED display panel is typically formed by full-layer evaporation using an evaporation process. This means that the sub-light-emitting layers and charge generation layers in each light-emitting device are connected together. Because the charge generation layers in each light-emitting device are also connected together and have good conductivity, when a light-emitting device emits light, the charge generation layer within that light-emitting device may generate lateral leakage current. This leakage current may cause adjacent light-emitting devices to also emit light, potentially resulting in poor display quality on the OLED display panel.

[0077] Please refer to Figure 1 and Figure 2 , Figure 1 is a top view of a display substrate provided in an embodiment of the present application, Figure 2 yes Figure 1 The display substrate 000 may include: a driving backplane 100 , a first electrode layer 200 , a functional layer 300 , an organic light emitting layer 400 and a second electrode layer 500 .

[0078] The first electrode layer 200 in the display substrate 000 is located on one side of the driving backplane 100 . The first electrode layer 200 includes a plurality of first electrodes 201 . The first electrodes 201 are electrically connected to the driving backplane 100 .

[0079] The functional layer 300 in the display substrate 000 is located on the side of the first electrode layer 200 facing away from the driving backplane 100. The functional layer 300 has a partition groove U and a plurality of pixel openings K corresponding one-to-one with the plurality of first electrodes 201. At least a portion of the first electrode 201 is located within the corresponding pixel opening K, and at least a portion of the sidewall of the pixel opening K is a curved sidewall C. Here, the portion of the first electrode 201 located within the pixel opening K, the portion of the organic light-emitting layer 400 located within the pixel opening K, and the portion of the second electrode layer 500 located within the pixel opening K can form a light-emitting device. For example, this light-emitting device can be an OLED light-emitting device.

[0080] The organic light-emitting layer 400 in the display substrate 000 is located on the side of the functional layer 300 away from the driving backplane 100. The organic light-emitting layer 400 may include: a plurality of organic material layers 400a stacked in a direction perpendicular to and away from the driving backplane 100, and at least part of the organic material layers 400a located within the partition groove U is disconnected from the part located outside the partition groove U.

[0081] The second electrode layer 500 in the display substrate 000 is located on a side of the organic light emitting layer 400 facing away from the driving backplane 100 .

[0082] In the present application, at least part of the organic material layer 400a located within the partition groove U is disconnected from the part located outside the partition groove U. Therefore, the organic material layer 400a between any two adjacent light-emitting devices is disconnected by the partition groove U. In this way, when a voltage is applied to the first electrode 201, the electric field formed between the first electrode 201 and the second electrode layer 500, and the leakage current generated by the organic material layer 400a in each light-emitting device will be isolated by the partition groove U. In other words, the leakage current generated by the organic material layer 400a in the light-emitting device will not be laterally directed to the organic material layer 400a adjacent to this light-emitting device, and thus the light emission of this light-emitting device will not affect the light emission of the adjacent light-emitting device. In this way, the display effect of the display substrate can be guaranteed to be better.

[0083] Furthermore, since at least a portion of the sidewall of the pixel opening K is an arc-shaped sidewall C, the portion of the second electrode layer 500 located near the arc-shaped sidewall C can extend along the arc. This ensures that the second electrode layer 500 at this location is relatively flat, making it less likely to experience electrode puncture problems, allowing the display substrate 000 to display images normally.

[0084] In summary, the display substrate provided in the embodiments of the present application includes: a driving backplane, a first electrode layer, a functional layer, an organic light-emitting layer, and a second electrode layer. The functional layer includes a partitioning groove and a plurality of pixel openings corresponding one-to-one to the first electrodes in the plurality of first electrode layers. Because at least a portion of the organic material layer located within the partitioning groove is disconnected from the portion located outside the partitioning groove, the organic material layer between any two adjacent light-emitting devices is disconnected by the partitioning groove. Consequently, when a voltage is applied to the first electrode, the electric field formed between the first electrode and the second electrode layer blocks leakage current generated by portions of the organic material layer in each light-emitting device. This prevents leakage current generated by the organic material layer in a light-emitting device from being laterally directed into the organic material layer adjacent to the light-emitting device, thereby preventing the light emission of the light-emitting device from affecting the light emission of adjacent light-emitting devices. This ensures a superior display quality of the display substrate. Furthermore, because at least a portion of the sidewalls of the pixel openings are curved, the portion of the second electrode layer located near the curved sidewalls can extend along the curved direction. In this way, it can be ensured that the second electrode layer distributed at this position is relatively flat, so that the second electrode layer distributed at this position is less likely to have an adverse phenomenon of electrode puncture, so that the display substrate can display images normally.

[0085] In this application, if Figure 3 As shown, Figure 3 Schematic diagram of the film structure of a light-emitting device provided in an embodiment of the present application. Each organic material layer 400a in the organic light-emitting layer 400 can be any one of a hole injection layer HIL, a hole transport layer HTL, a light-emitting material layer EML, an electron transport layer ETL, an electron injection layer EIL and a charge generation layer CGL. Among them, the hole injection layer HIL, the hole transport layer HTL, the light-emitting material layer EML, the electron transport layer ETL and the electron injection layer EIL stacked along the side away from the driving backplane 100 can constitute a sub-light-emitting layer. It should be noted that the organic light-emitting layer 400 in the display substrate provided in the embodiment of the present application includes a plurality of sub-light-emitting layers for schematic illustration. For example, the plurality of sub-light-emitting layers contained in the organic light-emitting layer 400 can be: a red sub-light-emitting layer 400R, a green sub-light-emitting layer 400G and a blue sub-light-emitting layer 400B.

[0086] In this case, any two adjacent sub-light-emitting layers in the organic light-emitting layer 400 can be connected via the charge generation layer CGL. Thus, the display substrate 000 can connect the sub-light-emitting layers in a direction away from the driving backplane 100 in series via the charge generation layer CGL. Thus, when a voltage is applied to the first electrode layer 200, the electric field formed between the first electrode layer 200 and the second electrode layer 500 causes each sub-light-emitting layer in the organic light-emitting layer 400 to emit light, and the light emitted by each sub-light-emitting layer can be mixed to form white light before being emitted. Here, because the charge generation layer CGL is typically made of a highly conductive material, the lateral leakage current generated by the charge generation layer CGL during the light-emitting device's emission process is relatively large, and each organic material layer 400a in the organic light-emitting layer 400 is formed through an evaporation process. Therefore, the charge generation layer CGL needs to be isolated by a isolation groove U in the functional layer 300. For example, the portion of the charge generation layer CGL located within the isolation groove U is disconnected from the portion located outside the isolation groove U. In this way, when a light-emitting device emits light, the lateral leakage current generated by the charge generation layer CGL will not be directed to the light-emitting device adjacent to this light-emitting device, thereby reducing the probability of crosstalk between any two adjacent light-emitting devices, thereby making the display effect of the display substrate 000 better.

[0087] It should also be noted that the isolation trench U can not only isolate the charge generation layer CGL, but also isolate other organic light-emitting layers. For example, the isolation trench U can isolate at least one of the hole injection layer HIL, the hole transport layer HTL, the light-emitting material layer EML, the electron transport layer ETL, and the electron injection layer EIL. In this way, the probability of crosstalk between any two adjacent light-emitting devices can be further reduced.

[0088] In the present application, there are multiple structures of the functional layer 300 in the display substrate 000 , and the embodiments of the present application only use the following two optional implementations as examples for schematic illustration.

[0089] For the first optional implementation, please refer to Figure 4 , Figure 4 Figure 3 is a schematic diagram of the film structure of a display substrate provided in an embodiment of the present application. The orthographic projection of the partition grooves U in the functional layer 300 on the driver backplane 100 is located between two adjacent pixel openings K. In other words, the partition grooves U in the functional layer 300 can be distributed around the periphery of each pixel opening K.

[0090] It should be noted that during the evaporation process to form the organic material layer 400a within the display substrate 000, the portion of the organic material layer 400a deposited within the isolation trench U can be located within the isolation trench U, while the portion of the organic material layer 400a deposited outside the isolation trench U is located on the functional layer 300. Here, the depth of the isolation trench U needs to be slightly greater than or equal to the thickness of the organic light-emitting layer 400. For example, if the thickness of the organic light-emitting layer 400 is 1200 nanometers, the depth of the isolation trench U should be 1200 nanometers. In this way, the organic material layer 400a deposited within the isolation trench U and the organic material layer 400a deposited on the functional layer 300 are disconnected from the sidewalls of the isolation trench U. In other words, the portion of the organic material layer 400a located within the isolation trench U is disconnected from the portion located outside the isolation trench U.

[0091] In the examples of this application, please refer to Figure 4 The display substrate 000 may further include a buffer layer 600 located on a side of the first electrode layer 200 close to the driving backplane 100. The buffer layer 600 has an auxiliary isolation trench 600a. The orthographic projection of the auxiliary isolation trench 600a on the driving backplane 100 is located between the orthographic projections of two adjacent first electrodes 201 in the first electrode layer 200 on the driving backplane 100.

[0092] At least a portion of the functional layer 300 is filled within the auxiliary isolation trench 600a, and the portion of the functional layer 300 located within the auxiliary isolation trench 600a has a partitioning trench U. In this case, by providing the auxiliary isolation trench 600a within the buffer layer 600 and allowing at least a portion of the functional layer 300 to be filled within the auxiliary isolation trench 600a, the thickness of the portion of the buffer layer 600 located between two adjacent first electrodes 201 can be increased, resulting in a deeper partitioning trench U formed in the portion of the buffer layer 600 located within the auxiliary isolation trench 600a, thereby ensuring that the partitioning trench 600a can successfully partition the organic material layer 400a.

[0093] In the examples of this application, please refer to Figure 4 The functional layer 300 in the display substrate 000 may include: a first organic layer 301 and a second inorganic layer 302 , at least part of the first organic layer 301 is filled in the auxiliary isolation groove 600 a , and the first inorganic layer 302 is located on the side of the first organic layer 301 away from the driving backplane 100 .

[0094] Among them, the partition groove U may include: a first sub-partition groove U1 passing through the first inorganic layer 302, and a second sub-partition groove U2 passing through the first organic layer 301, the orthographic projection of the first sub-partition groove U1 on the driving backplane 100 is located within the orthographic projection of the second sub-partition groove U2 on the driving backplane 100, and the boundary of the orthographic projection of the first sub-partition groove U1 on the driving backplane 100 does not coincide with the boundary of the orthographic projection of the second sub-partition groove U2 on the driving backplane 100, that is, the first inorganic layer 302 protrudes relative to the first organic layer 301.

[0095] In this way, the portion of the first inorganic layer 302 that protrudes relative to the first organic layer 301, together with the side surfaces of the first organic layer 301 and the driver backplane 100, forms a first recessed structure O1. This first recessed structure O1 is distributed along the sidewalls of the partitioning trench U. Thus, due to the presence of the first recessed structure O1 on the sidewalls of the partitioning trench U, the organic material layer 400a deposited within the partitioning trench U and the organic material layer 400a deposited on the functional layer 300 are disconnected from the sidewalls of the partitioning trench U, thereby disconnecting the portion of the organic material layer 400a located within the partitioning trench U from the portion located outside the partitioning trench U. Here, the first organic layer 301 is made of an organic material, and the first inorganic layer 302 is made of an inorganic material. During the etching process to form the partitioning trench U, because the etching species has a different etching rate for the inorganic material than for the organic material, the partitioning trench U with the first recessed structure O1 can be formed within the functional layer 300.

[0096] In the embodiment of the present application, the distance between the outer boundary of the orthographic projection of the second sub-partitioning groove U2 on the driver backplane 100 and the outer boundary of the orthographic projection of the first sub-partitioning groove U1 on the driver backplane 100 ranges from 0.5 microns to 1 micron. Thus, after the first sub-partitioning groove U1 and the second sub-partitioning groove U2 are formed through the etching process, the first inorganic layer 302 protrudes less relative to the first organic layer 301, so that the portion of the first inorganic layer 302 near the second sub-partitioning groove U2 does not collapse. This effectively ensures that the structure of the partitioning groove U is relatively stable while also allowing at least a portion of the organic material light-emitting layer 400a in the organic light-emitting layer 400 evaporated on the functional layer 300 to be disconnected by the partitioning groove.

[0097] In the examples of this application, please refer to Figure 4 A portion of the first organic layer 301 in the functional layer 300 is filled in the auxiliary isolation groove 600 a , and another portion is located outside the auxiliary isolation groove 600 a and covers an edge portion of the first electrode 201 .

[0098] Among them, the pixel opening K includes: a first sub-pixel opening K1 passing through the first inorganic layer 302, and a second sub-pixel opening K2 passing through the first organic layer 301, and the orthographic projection of the first sub-pixel opening K1 on the driving backplane 100 is located within the orthographic projection of the second sub-pixel opening K2 on the driving backplane 100.

[0099] Here, due to the process of forming the patterned first electrode layer 200 on the driving backplane 100, the sidewalls of the first electrode 201 usually have burrs or depressions and other undesirable conditions. By covering the edge portion of the first electrode 201 with the functional layer 300, the first electrode 201 close to the side of the partition groove U can be protected. In this way, after the first electrode 201 and the second electrode layer 500 are applied with voltage, the portion of the functional layer 300 covering the edge of the first electrode 201 effectively prevents the occurrence of tip discharge between the first electrode 201 with burrs and the second electrode layer 500, which in turn causes the light-emitting device in the display substrate 000 to be broken down.

[0100] In the embodiments of this application, Figure 4 As shown, the sidewalls of the second sub-pixel K2 opening disposed within the first organic layer 301 are curved, and the portion of the first inorganic layer 302 located within the second sub-pixel opening K2 can cover the sidewalls of the second sub-pixel opening K2. This ensures that the portion of the first inorganic layer 302 located within the second sub-pixel opening K2 can extend along the curved direction, resulting in a curved surface on the surface of the first inorganic layer 302 located within the second sub-pixel opening K2 that faces away from the driver backplane 100. This ensures that the second electrode layer 500 disposed at this curved surface is relatively flat, making it less susceptible to electrode puncture problems.

[0101] For the second optional implementation, please refer to Figure 5 , Figure 5 is a schematic diagram of the film layer structure of another display substrate provided in an embodiment of the present application. The partition groove U and the pixel opening K in the functional layer 300 belong to the same structure within the functional layer 300. That is, the pixel opening K provided in the functional layer 300 can be used to define the pixel area and to isolate at least part of the organic material layer 400a in the organic light-emitting layer 400. It should be noted that the depth of the pixel opening K in this case can be consistent with the depth of the partition groove U in the first optional implementation method described above, so as to ensure that the portion of the organic material layer 400a located within the pixel opening K is disconnected from the portion located outside the pixel opening K.

[0102] In the embodiment of the present application, the functional layer 300 may include a second organic layer 303 and a second inorganic layer 304, with the second organic layer 303 being closer to the driving backplane 100 than the second inorganic layer 304. The pixel opening K may include a third sub-pixel opening K3 extending through the second inorganic layer 304 and a fourth sub-pixel opening K4 extending through the second organic layer 303. The orthographic projection of the third sub-pixel opening K3 on the driving backplane 100 is within the orthographic projection of the fourth sub-pixel opening K4 on the driving backplane 100, and the boundary of the orthographic projection of the third sub-pixel opening K3 on the driving backplane 100 does not overlap with the boundary of the orthographic projection of the fourth sub-pixel opening K4 on the driving backplane 100. Thus, the portion of the second inorganic layer 304 protruding from the second organic layer 303, together with the side surfaces of the second organic layer 303 and the first electrode layer 200, can form a second recessed structure O2, which is distributed on the sidewalls of the pixel opening K. Here, the function of the second recessed structure O2 is the same as that of the first recessed structure O1 , and will not be described in detail herein.

[0103] In the embodiment of the present application, the portion of the second inorganic layer 304 in the functional layer 300 that protrudes relative to the second organic layer 303 is an arc-shaped extension. This ensures that the portion of the second inorganic layer 304 located within the third sub-pixel opening K3 can extend along an arc, resulting in a curved surface on the surface of the second inorganic layer 304 located within the third sub-pixel opening K3 that faces away from the driver backplane 100. This ensures that the second electrode layer 500 located at this curved surface is relatively flat, making it less susceptible to electrode puncture.

[0104] For the above two optional implementations, such as Figure 4 and Figure 5 As shown, the display substrate 000 may further include a buffer layer 600 and a plurality of transfer electrodes 700. The buffer layer 600 is located on a side of the first electrode layer 200 close to the driving backplane 100, and the buffer layer 600 has a plurality of transfer holes V corresponding to the plurality of transfer electrodes 700. Each transfer electrode 700 may be located in a corresponding transfer hole V and electrically connected to the driving backplane 100.

[0105] The plurality of transfer electrodes 700 are electrically connected to the plurality of first electrodes 201 in a one-to-one correspondence, so that each first electrode 201 can be electrically connected to the driving backplane 100 through the corresponding transfer electrode 700 .

[0106] In the present application, the buffer layer 600 can be made of an organic material with a certain flattening effect, and the side of each transfer electrode 700 facing away from the driver backplane 100 can be flush with the side of the buffer layer 600 facing away from the driver backplane. In other words, the side of each transfer electrode 700 facing away from the driver backplane 100 is coplanar with the side of the buffer layer 600 facing away from the driver backplane 100. This ensures that the first electrode layer 200 formed on the side of the buffer layer 600 facing away from the driver backplane 100 has good flatness, further improving the smoothness of the subsequently formed second electrode layer 500, thereby further reducing the probability of electrode puncture in the second electrode layer 500.

[0107] The buffer layer 600 , as a planar layer, can improve the planarity of the first electrode layer 200 , thereby reducing the probability of vertical leakage between the second electrode layer 500 and the first electrode 201 .

[0108] Optional, please refer to Figure 6 , Figure 6 Schematic diagram of the structure of a display substrate provided in an embodiment of the present application. The driving backplane 100 in the display substrate 000 includes multiple pixel driving circuits T, all located on a substrate 101. Each pixel driving circuit T may include an active layer t1, a gate t2, a source t3, a drain t4, and a transfer electrode t5. The multiple pixel driving circuits T may be electrically connected to the first electrodes 201 in the light-emitting device in a one-to-one correspondence.

[0109] The active layer t1 and gate t2 can be insulated by a first gate insulating layer 900, and the active layer t1 is electrically connected to the source t3 and drain t4, respectively. Typically, the source t3 and drain t4 are provided on the same layer, that is, they are part of the same conductive pattern. The conductive pattern containing the source t3 and drain t4 can be insulated from the gate t2 by a second insulating layer 1100.

[0110] It should be noted that the active layer t1, gate electrode t2, source electrode t3, and drain electrode t4 can form a thin film transistor, and the present embodiment is schematically described using a thin film transistor as a low-gate thin film transistor. In other optional implementations, the thin film transistor can also be a top-gate thin film transistor, which is not limited in the present embodiment.

[0111] One of the source electrode t3 and the drain electrode t4 in the driving backplane 100 can be electrically connected to the first electrode 201 via a transition electrode t5. For example, the transition electrode t5 and the drain electrode t4 are insulated by a third insulating layer 1100. Here, each pixel driving circuit T can be electrically connected to the first electrode 201 in the corresponding light-emitting device via the transition electrode t5. For example, a first planarization layer 1200 is provided between the transition electrode t5 and the buffer layer 600.

[0112] The encapsulation layer 800 may include a stacked first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The encapsulation layer 800 is used to encapsulate the display substrate 000, protecting the organic light-emitting layer 400 from corrosion by atmospheric elements such as moisture and oxygen, which could damage it. This effectively increases the lifespan of the light-emitting device.

[0113] In summary, the display substrate provided in the embodiments of the present application includes: a driving backplane, a first electrode layer, a functional layer, an organic light-emitting layer, and a second electrode layer. The functional layer includes a partitioning groove and a plurality of pixel openings corresponding one-to-one to the first electrodes in the plurality of first electrode layers. Because at least a portion of the organic material layer located within the partitioning groove is disconnected from the portion located outside the partitioning groove, the organic material layer between any two adjacent light-emitting devices is disconnected by the partitioning groove. Consequently, when a voltage is applied to the first electrode, the electric field formed between the first electrode and the second electrode layer blocks leakage current generated by portions of the organic material layer in each light-emitting device. This prevents leakage current generated by the organic material layer in a light-emitting device from being laterally directed into the organic material layer adjacent to the light-emitting device, thereby preventing the light emission of the light-emitting device from affecting the light emission of adjacent light-emitting devices. This ensures a superior display quality of the display substrate. Furthermore, because at least a portion of the sidewalls of the pixel openings are curved, the portion of the second electrode layer located near the curved sidewalls can extend along the curved direction. In this way, it can be ensured that the second electrode layer distributed at this position is relatively flat, so that the second electrode layer distributed at this position is less likely to have an adverse phenomenon of electrode puncture, so that the display substrate can display images normally.

[0114] The present invention provides a method for manufacturing a display substrate. Figure 1 The display substrate shown. The manufacturing method of the display substrate may include:

[0115] Step S1: forming a first electrode layer on one side of the driving backplane, wherein the first electrode layer comprises a plurality of first electrodes, and the first electrodes are electrically connected to the driving backplane.

[0116] Step S2: forming a functional layer on a side of the driving backplane on which the first electrode layer is formed. Here, at least a portion of the functional layer is located on a side of the first electrode layer facing away from the driving backplane. The functional layer has a partition groove and a plurality of pixel openings corresponding one-to-one to the plurality of first electrodes. At least a portion of the first electrodes is located within the corresponding pixel openings, and at least a portion of the sidewalls of the pixel openings are curved sidewalls.

[0117] Step S3: forming an organic light-emitting layer on the side of the functional layer facing away from the driving backplane. The organic light-emitting layer comprises: a plurality of organic material layers stacked vertically and away from the driving backplane, with at least some of the organic material layers located within the partitioning grooves being disconnected from the portions located outside the partitioning grooves.

[0118] Step S4: forming a second electrode layer on the side of the organic light-emitting layer facing away from the driving backplane.

[0119] In summary, the manufacturing method for a display substrate provided by the embodiments of the present application utilizes a method in which at least a portion of the organic material layer located within the partitioning groove is disconnected from the portion located outside the partitioning groove. Therefore, the organic material layer between any two adjacent light-emitting devices is disconnected by the partitioning groove. Thus, when a voltage is applied to the first electrode, the electric field formed between the first electrode and the second electrode layer separates the leakage current generated by the portion of the organic material layer in each light-emitting device. This prevents leakage current generated by the organic material layer in a light-emitting device from being laterally directed into the organic material layer adjacent to the light-emitting device, thereby preventing the light emission of the light-emitting device from affecting the light emission of adjacent light-emitting devices. This ensures a better display quality for the display substrate. Furthermore, because at least a portion of the sidewalls of the pixel opening are curved, the portion of the second electrode layer located near the curved sidewalls can extend in the direction of the curve. This ensures that the second electrode layer at this location is relatively flat, making it less susceptible to electrode puncture problems, allowing the display substrate to display images normally.

[0120] Please refer to Figure 7 , Figure 7 This is a flow chart of a method for manufacturing a display substrate provided in an embodiment of the present application. The method for manufacturing a display substrate is used to manufacture Figure 4 It should be noted that the orthographic projection of the partition groove U in the functional layer 300 in the display substrate on the driving backplane 100 is located between two adjacent pixel openings K. The manufacturing method of the display substrate may include:

[0121] Step S101: forming a buffer layer and a plurality of transfer electrodes on one side of a driving backplane.

[0122] Optionally, the structure of the driver backplane can refer to Figure 6The structure of the driving backplane in the display substrate is shown, and will not be described in detail here. The buffer layer can be made of organic material, and the transfer electrode can be made of metal materials such as molybdenum, copper, aluminum or alloys.

[0123] For examples, please refer to Figure 8 , Figure 8 The figure is a schematic diagram of forming a buffer layer and multiple transfer electrodes on one side of a driver backplane, provided by an embodiment of the present application. A buffer layer 600 can be formed on one side of the driver backplane 100 by any of a variety of methods, such as deposition, coating, and sputtering. A patterning process is then performed on the buffer layer 600 to form multiple transfer holes V within the buffer layer 600. Subsequently, a first metal layer can be formed on the buffer layer 600 with the multiple transfer holes V by any of a variety of methods, such as deposition, coating, and sputtering. Finally, a patterning process is performed on the first metal layer to form multiple transfer electrodes 700 corresponding one-to-one to the multiple transfer holes V.

[0124] Each transfer electrode 700 may be located in a corresponding transfer hole V, and a surface of each transfer electrode 700 facing away from the driving back plate 100 may be coplanar with a surface of the buffer layer 600 facing away from the driving back plate 100 .

[0125] Step S102 : forming a first electrode layer on a side of the buffer layer facing away from the driving backplane.

[0126] Optionally, the first electrode layer 200 may be made of metal materials such as molybdenum, copper, aluminum, or alloys. The thickness of the first electrode layer 200 may be 50 nm to 100 nm, for example, the thickness of the first electrode layer 200 is 60 nm.

[0127] For examples, please refer to Figure 9 , Figure 9 Schematic diagram of forming a first electrode layer according to an embodiment of the present application. A second metal layer can be formed on the side of the buffer layer 600 facing away from the driver backplane 100 by any of a variety of methods, such as deposition, coating, and sputtering. This second metal layer is then patterned to form the first electrode layer 200.

[0128] The first electrode layer 200 may include multiple first electrodes 201 , and the multiple first electrodes 201 may be electrically connected to the multiple transition electrodes 700 in a one-to-one correspondence. In this way, each first electrode 201 may be electrically connected to the driving backplane 100 through the corresponding transition electrode 700 .

[0129] Step S103 : patterning the buffer layer to form auxiliary isolation trenches in the buffer layer.

[0130] For examples, please refer to Figure 10, Figure 10 This is a schematic diagram of forming an auxiliary isolation trench in a buffer layer according to an embodiment of the present application. After forming the first electrode layer 200 on the side of the buffer layer 600 facing away from the driver backplane 100, the buffer layer 600 can be patterned again to form an auxiliary isolation trench 600a in the buffer layer 600.

[0131] The orthographic projection of the auxiliary isolation trench 600 a on the driving backplate 100 is located between the orthographic projections of two adjacent first electrodes 201 on the driving backplate 100 .

[0132] Step S104 : forming a first organic layer on the buffer layer with the auxiliary isolation trench.

[0133] Optionally, the material of the first organic layer may be a photosensitive organic material, for example, a polyimide organic material.

[0134] For examples, please refer to Figure 11 , Figure 11 Schematic diagram of forming a first organic layer on a buffer layer with auxiliary isolation grooves according to an embodiment of the present application. The first organic layer 301 can be formed on the buffer layer 600 by inkjet printing.

[0135] Part of the first organic layer 301 may be located within the auxiliary isolation trench 600a, and another part may cover the first electrode layer 200. For example, the length of the portion of the first organic layer 301 covering the first electrode layer 200 may be 0.1 micrometer to 0.2 micrometer, for example, the length of the portion of the first organic layer 301 covering the first electrode layer 200 may be 0.1 micrometer.

[0136] Step S105 : performing patterning on the first organic layer to form a plurality of second sub-pixel openings in the first organic layer corresponding one-to-one to the plurality of first electrodes.

[0137] For examples, please refer to Figure 12 , Figure 12 Schematic diagram of a first organic layer after patterning, provided in an embodiment of the present application. The first organic layer 301 can be exposed and developed to achieve patterning. Here, after the first organic layer 301 is exposed and developed, multiple second sub-pixel openings K2 can be formed in the first organic layer 301, corresponding one-to-one to the multiple first electrodes 201, and the sidewalls of the second sub-pixel openings K2 can be ensured to be curved.

[0138] The orthographic projection of each second sub-pixel opening K2 on the driving backplane 100 is located within the orthographic projection of the corresponding first electrode 201 on the driving backplane 100 .

[0139] Step S106 : forming a first inorganic layer on the first organic layer having the plurality of second sub-pixel openings.

[0140] Optionally, the material of the first inorganic layer may be an inorganic material such as silicon nitride or silicon oxide.

[0141] For examples, please refer to Figure 13 , Figure 13 Schematic diagram of forming a first inorganic layer according to an embodiment of the present application. After patterning the first organic layer 301, the first inorganic layer 302 can be formed by any of a variety of methods, such as deposition, coating, and sputtering. The thickness of the first inorganic layer 302 can be less than 60 microns, for example, 50 microns.

[0142] Step S107 : performing patterning on the first inorganic layer to form first sub-partitioning trenches and a plurality of first sub-pixel openings corresponding one-to-one to the plurality of second sub-pixel openings in the first inorganic layer.

[0143] For examples, please refer to Figure 14 , Figure 14 FIG2 is a schematic diagram of a first inorganic layer after patterning according to an embodiment of the present application. A single patterning process can be performed on the first inorganic layer 302 to form a first sub-partitioning trench U1 and a plurality of first sub-pixel openings K1 corresponding one-to-one with a plurality of second sub-pixel openings K2 within the first inorganic layer 302.

[0144] The orthographic projection of each first sub-pixel opening K1 on the driving backplane 100 is located within the orthographic projection of the corresponding second sub-pixel opening K2 on the driving backplane. Here, each first sub-pixel opening K1 and the corresponding second sub-pixel opening K2 can form a pixel opening K.

[0145] In the present application, a portion of the patterned first inorganic layer 302 needs to be located within the second sub-pixel opening K2, and the portion located within the second sub-pixel opening K2 needs to cover the sidewalls of the second sub-pixel opening K2. Because the first inorganic layer 302, made of an inorganic material, has a relatively hard film quality, the portion of the first inorganic layer 302 that covers the sidewalls of the second sub-pixel opening K2 can extend in an arc-shaped direction.

[0146] Step S108 : Using the patterned first inorganic layer as a mask, etching the portion of the first organic layer located in the auxiliary isolation trench to form a second sub-partitioning trench in the first organic layer that is connected to the first sub-partitioning trench.

[0147] For examples, please refer to Figure 15 , Figure 15This is a schematic diagram of an embodiment of the present application showing etching of the first organic layer. After patterning the first inorganic layer 302, the patterned first inorganic layer 302 can be used as a mask to etch the portion of the first organic layer 301 within the auxiliary isolation trench 600a using an etching material, thereby forming a second sub-isolation trench U2 in the first organic layer 301 that communicates with the first sub-isolation trench U1.

[0148] Among them, the orthographic projection of the first sub-partition groove U1 on the driving back plate 100 is located within the orthographic projection of the second sub-partition groove U2 on the driving back plate 100, and the boundary of the orthographic projection of the first sub-partition groove U1 on the driving back plate 100 does not overlap with the boundary of the orthographic projection of the second sub-partition groove U2 on the driving back plate 100.

[0149] Here, the interconnected first sub-partitioning groove U1 and the second sub-partitioning groove U2 are used to form a partitioning groove U, and the orthographic projection of the partitioning groove U on the driving backplane 100 can be located between the orthographic projections of two adjacent pixel openings K on the driving backplane 100 .

[0150] It should be noted that the first inorganic layer 302 patterned in step S107 and the first organic layer 301 etched in step S108 can form the functional layer 300 .

[0151] Step S109 : forming an organic light-emitting layer and a second electrode layer in sequence on the side of the functional layer away from the driving backplane.

[0152] For example, an organic light emitting layer 400 can be formed on the side of the functional layer 300 away from the driving backplane 100 by using an evaporation process. Afterwards, a second electrode layer 500 can be formed on the side of the organic light emitting layer 400 away from the driving backplane 100 by any of a variety of methods such as deposition, coating and sputtering. Figure 4 The display substrate 000 is shown.

[0153] The organic light-emitting layer 300 may include: a plurality of organic material layers 400a stacked in a direction perpendicular to and away from the driving backplane 100 , wherein at least a portion of the organic material layers 400a located within the partition groove U is disconnected from a portion located outside the partition groove U.

[0154] It should be noted that the one-time patterning process in the above embodiment may include: photoresist coating, exposure, development, etching and photoresist stripping.

[0155] It should also be noted that the order of the steps of the manufacturing method of the display substrate provided in the embodiment of the present application can be appropriately adjusted, and the steps can be increased or decreased accordingly according to the situation. Any technician familiar with this technical field can easily think of the changed methods within the technical scope disclosed in this application, and they should be covered by the protection scope of this application, so they will not be repeated here.

[0156] In summary, the manufacturing method for a display substrate provided by the embodiments of the present application utilizes a method in which at least a portion of the organic material layer located within the partitioning groove is disconnected from the portion located outside the partitioning groove. Therefore, the organic material layer between any two adjacent light-emitting devices is disconnected by the partitioning groove. Thus, when a voltage is applied to the first electrode, the electric field formed between the first electrode and the second electrode layer separates the leakage current generated by the portion of the organic material layer in each light-emitting device. This prevents leakage current generated by the organic material layer in a light-emitting device from being laterally directed into the organic material layer adjacent to the light-emitting device, thereby preventing the light emission of the light-emitting device from affecting the light emission of adjacent light-emitting devices. This ensures a better display quality for the display substrate. Furthermore, because at least a portion of the sidewalls of the pixel opening are curved, the portion of the second electrode layer located near the curved sidewalls can extend in the direction of the curve. This ensures that the second electrode layer at this location is relatively flat, making it less susceptible to electrode puncture problems, allowing the display substrate to display images normally.

[0157] Please refer to Figure 16 , Figure 16 This is a flow chart of another method for manufacturing a display substrate provided in an embodiment of the present application. The method for manufacturing a display substrate is used to manufacture Figure 5 It should be noted that the partition grooves U and the pixel openings K in the functional layer 300 of the display substrate 000 are of the same structure in the functional layer 300. The manufacturing method of the display substrate may include:

[0158] Step S201: forming a buffer layer and a plurality of transfer electrodes on one side of a driving backplane.

[0159] The step S201 may refer to the aforementioned step S101, and will not be described in detail in this application.

[0160] Step S202 : forming a first electrode layer on a side of the buffer layer facing away from the driving backplane.

[0161] The step S202 may refer to the aforementioned step S102, and will not be described in detail in this application.

[0162] Step S203 : forming a second organic layer on a side of the buffer layer and the first electrode layer facing away from the driving backplane.

[0163] Optionally, the material of the first organic layer may be a photosensitive organic material, for example, a polyimide organic material.

[0164] For examples, please refer to Figure 17 , Figure 17 This is a schematic diagram of forming a second organic layer on the side of the buffer layer and the first electrode layer facing away from the driving backplane provided by an embodiment of the present application. The second organic layer 303 can be formed on the buffer layer 600 by inkjet printing.

[0165] Step 204 : performing pattern processing on the second organic layer to form a plurality of auxiliary pixel grooves corresponding to the plurality of first electrodes on a side of the second organic layer facing away from the driving backplane.

[0166] For examples, please refer to Figure 18 , Figure 18 : This is a schematic diagram of a second organic layer after patterning provided by an embodiment of the present application. The second organic layer 303 can be exposed and developed to achieve patterning of the second organic layer 303. Here, after the second organic layer 303 is patterned, a plurality of auxiliary pixel grooves D corresponding to the plurality of first electrodes 201 can be formed on the side of the second organic layer 303 facing away from the drive backplane 100. The orthographic projection of the auxiliary pixel groove D on the drive backplane 100 is located within the orthographic projection of the corresponding first electrode 201 on the drive backplane 100. The depth of the auxiliary pixel groove D is less than the thickness of the second organic layer 303, and the sidewalls of the auxiliary pixel groove D are curved. Here, the thickness of the second organic layer 303 can be greater than the thickness of the first electrode layer 200 in the drive cover plate 100. For example, the thickness of the first electrode layer 200 is 300 nanometers, the thickness of the second organic layer 303 is 1200 nanometers, and the depth of the auxiliary pixel groove D is 500 nanometers.

[0167] Step S205 , forming a second inorganic layer on the second organic layer having the plurality of auxiliary pixel grooves.

[0168] The step S205 may refer to the aforementioned step S106, which will not be described in detail in this application.

[0169] Step S206 : performing patterning on the second inorganic layer to form third sub-pixel openings in the second inorganic layer corresponding to the plurality of auxiliary pixel grooves.

[0170] For examples, please refer to Figure 19 , Figure 19FIG. 1 is a schematic diagram of a second inorganic layer after patterning, provided in an embodiment of the present application. A single patterning process can be performed on the second inorganic layer 304 to form a plurality of third sub-pixel openings K3 in the second inorganic layer 304, corresponding one-to-one with the plurality of auxiliary pixel recesses D. The orthographic projections of the third sub-pixel openings K3 on the driver backplane 100 are located within the orthographic projections of the corresponding auxiliary pixel recesses D on the driver backplane 100, and the patterned second inorganic layer covers the sidewalls of the auxiliary pixel recesses D.

[0171] Step S207 : Using the patterned second inorganic layer as a mask, etching the second organic layer to form a plurality of fourth sub-pixel openings in the second organic layer that are in one-to-one communication with the plurality of third sub-pixel openings.

[0172] For examples, please refer to Figure 20 , Figure 20 Schematic diagram of an embodiment of the present application showing etching of the second organic layer. After patterning the second inorganic layer 304, the patterned second inorganic layer 304 can be used as a mask, and the second organic layer 303 can be etched using an etching material to form a fourth sub-pixel opening K4 in the second organic layer 303 that is connected to the third sub-pixel opening K3. The orthographic projection of the third sub-pixel opening K3 on the driver backplane 100 is located within the orthographic projection of the fourth sub-pixel opening K4 on the driver backplane 100, and the boundary of the orthographic projection of the third sub-pixel opening K3 on the driver backplane 100 does not overlap with the boundary of the orthographic projection of the fourth sub-pixel opening K4 on the driver backplane 100. The portion of the second inorganic layer 304 that protrudes relative to the second organic layer 303 is an arc-shaped extension.

[0173] It should be noted that the second inorganic layer 304 after the patterning process in step S206 and the first organic layer 303 after the etching process in step S107 can form the functional layer 300 .

[0174] Step S208 : forming an organic light-emitting layer and a second electrode layer in sequence on the side of the functional layer away from the driving backplane.

[0175] The step S208 can refer to the above step S109, which will not be described in detail in this application. Figure 5 The display substrate 000 is shown.

[0176] It should be noted that the one-time patterning process in the above embodiment may include: photoresist coating, exposure, development, etching and photoresist stripping.

[0177] It should also be noted that the order of the steps of the manufacturing method of the display substrate provided in the embodiment of the present application can be appropriately adjusted, and the steps can be increased or decreased accordingly according to the situation. Any technician familiar with this technical field can easily think of the changed methods within the technical scope disclosed in this application, and they should be covered by the protection scope of this application, so they will not be repeated here.

[0178] In summary, the manufacturing method for a display substrate provided by the embodiments of the present application utilizes a method in which at least a portion of the organic material layer located within the partitioning groove is disconnected from the portion located outside the partitioning groove. Therefore, the organic material layer between any two adjacent light-emitting devices is disconnected by the partitioning groove. Thus, when a voltage is applied to the first electrode, the electric field formed between the first electrode and the second electrode layer separates the leakage current generated by the portion of the organic material layer in each light-emitting device. This prevents leakage current generated by the organic material layer in a light-emitting device from being laterally directed into the organic material layer adjacent to the light-emitting device, thereby preventing the light emission of the light-emitting device from affecting the light emission of adjacent light-emitting devices. This ensures a better display quality for the display substrate. Furthermore, because at least a portion of the sidewalls of the pixel opening are curved, the portion of the second electrode layer located near the curved sidewalls can extend in the direction of the curve. This ensures that the second electrode layer at this location is relatively flat, making it less susceptible to electrode puncture problems, allowing the display substrate to display images normally.

[0179] The present application also provides a display device. This display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. The display device can include a power supply assembly and a display substrate 000 electrically connected to the power supply assembly. Display substrate 000 can be an OLED (Organic Light Emitting Diode) display substrate or an Active Matrix-Organic Light Emitting Diode (AM-OLED) display substrate.

[0180] The display substrate 000 is the display substrate described in the above embodiment. For example, it can be Figure 2 、 Figure 4 、 Figure 5 、 Figure 6 or Figure 15 The display substrate 000 is shown. The power supply component is connected to the display substrate 000 and is used to provide an electrical signal to the display substrate 000 so that the display substrate 000 can display an image.

[0181] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0182] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0183] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display substrate, characterized in that: include: Driver backplane; a first electrode layer located on one side of the driving backplane, the first electrode layer having a plurality of first electrodes, the first electrodes being electrically connected to the driving backplane; a functional layer, at least a portion of the functional layer being located on a side of the first electrode layer facing away from the driving backplane, the functional layer having a partition groove and a plurality of pixel openings corresponding one-to-one to the plurality of first electrodes, at least a portion of the first electrodes being located within the corresponding pixel openings, and at least a portion of the sidewalls of the pixel openings being curved sidewalls; an organic light-emitting layer located on a side of the functional layer away from the driving backplane, the organic light-emitting layer comprising: a plurality of organic material layers stacked in a direction perpendicular to and away from the driving backplane, wherein at least a portion of the organic material layers located within the partition groove is disconnected from a portion located outside the partition groove; and a second electrode layer located on a side of the organic light-emitting layer facing away from the driving backplane; The orthographic projection of the partition groove on the driving backplane is located between the orthographic projections of two adjacent pixel openings on the driving backplane; The display substrate further includes: a buffer layer located on a side of the first electrode layer close to the driving backplane, the buffer layer having an auxiliary isolation groove, the orthographic projection of the auxiliary isolation groove on the driving backplane being located between the orthographic projections of two adjacent first electrodes on the driving backplane; At least a portion of the functional layer is filled in the auxiliary isolation trench, and a portion of the functional layer located in the auxiliary isolation trench has the partition trench; The functional layer includes: a first organic layer and a first inorganic layer, at least a portion of the first organic layer is filled in the auxiliary isolation groove, and the first inorganic layer is located on a side of the first organic layer away from the driving backplane; In which, the partition groove includes: a first sub-partition groove passing through the first inorganic layer, and a second sub-partition groove passing through the first organic layer, the orthographic projection of the first sub-partition groove on the driving backplane is located within the orthographic projection of the second sub-partition groove on the driving backplane, and the boundary of the orthographic projection of the first sub-partition groove on the driving backplane does not overlap with the boundary of the orthographic projection of the second sub-partition groove on the driving backplane.

2. The display substrate according to claim 1, wherein: A portion of the first organic layer is filled in the auxiliary isolation groove, and another portion is located outside the auxiliary isolation groove and covers an edge portion of the first electrode; Among them, the pixel opening includes: a first sub-pixel opening passing through the first inorganic layer, and a second sub-pixel opening passing through the first organic layer, and the orthographic projection of the first sub-pixel opening on the driving backplane is located within the orthographic projection of the second sub-pixel opening on the driving backplane.

3. The display substrate according to claim 2, wherein: The sidewall of the second sub-pixel opening is arc-shaped, and a portion of the first inorganic layer located in the second sub-pixel opening covers the sidewall of the second sub-pixel opening.

4. A display substrate, characterized in that: include: Driver backplane; a first electrode layer located on one side of the driving backplane, the first electrode layer having a plurality of first electrodes, the first electrodes being electrically connected to the driving backplane; a functional layer, at least a portion of the functional layer being located on a side of the first electrode layer facing away from the driving backplane, the functional layer having a partition groove and a plurality of pixel openings corresponding one-to-one to the plurality of first electrodes, at least a portion of the first electrodes being located within the corresponding pixel openings, and at least a portion of the sidewalls of the pixel openings being curved sidewalls; an organic light-emitting layer located on a side of the functional layer away from the driving backplane, the organic light-emitting layer comprising: a plurality of organic material layers stacked in a direction perpendicular to and away from the driving backplane, wherein at least a portion of the organic material layers located within the partition groove is disconnected from a portion located outside the partition groove; and a second electrode layer located on a side of the organic light-emitting layer facing away from the driving backplane; The partition groove and the pixel opening belong to the same structure in the functional layer; The functional layer includes: a second organic layer and a second inorganic layer, wherein the second organic layer is closer to the driving backplane than the second inorganic layer; In which, the pixel opening includes: a third sub-pixel opening passing through the second inorganic layer, and a fourth sub-pixel opening passing through the second organic layer, the orthographic projection of the third sub-pixel opening on the driving backplane is located within the orthographic projection of the fourth sub-pixel opening on the driving backplane, and the boundary of the orthographic projection of the third sub-pixel opening on the driving backplane does not overlap with the boundary of the orthographic projection of the fourth sub-pixel opening on the driving backplane.

5. The display substrate according to claim 4, wherein: The portion of the second inorganic layer protruding relative to the second organic layer is an arc-shaped extending portion.

6. The display substrate according to any one of claims 1 to 5, characterized in that: The display substrate further includes: a buffer layer and a plurality of transfer electrodes, wherein the buffer layer is located on a side of the first electrode layer close to the driving backplane, and the buffer layer has a plurality of transfer holes corresponding one-to-one to the plurality of transfer electrodes, and the transfer electrodes are located in the corresponding transfer holes and are electrically connected to the driving backplane; The plurality of switching electrodes are electrically connected to the plurality of first electrodes in a one-to-one correspondence, and a surface of the switching electrodes facing away from the driving back plate is flush with a surface of the buffer layer facing away from the driving back plate.

7. A method for manufacturing a display substrate, characterized in that: The method comprises: forming a first electrode layer on one side of the driving backplane, wherein the first electrode layer has a plurality of first electrodes, and the first electrodes are electrically connected to the driving backplane; forming a functional layer on a side of the driving backplane on which the first electrode layer is formed, wherein at least a portion of the functional layer is located on a side of the first electrode layer facing away from the driving backplane, the functional layer having a partition groove and a plurality of pixel openings corresponding one-to-one to the plurality of first electrodes, at least a portion of the first electrodes being located within the corresponding pixel openings, and at least a portion of the sidewalls of the pixel openings being curved sidewalls; An organic light-emitting layer is formed on a side of the functional layer away from the driving backplane, wherein the organic light-emitting layer comprises: a plurality of organic material layers stacked in a direction perpendicular to and away from the driving backplane, wherein at least a portion of the organic material layers located within the partition groove is disconnected from a portion located outside the partition groove; forming a second electrode layer on a side of the organic light-emitting layer facing away from the driving backplane; The method further includes: before forming the first electrode layer on one side of the driving backplane, forming a buffer layer on one side of the driving backplane; The forming of the functional layer on one side of the driving backplane having the first electrode layer formed thereon comprises: Performing a patterning process on the buffer layer to form an auxiliary isolation trench in the buffer layer, wherein an orthographic projection of the auxiliary isolation trench on the driving backplane is located between orthographic projections of two adjacent first electrodes on the driving backplane; forming a functional layer on the buffer layer having the auxiliary isolation trench, and patterning the functional layer to form the partition trench in a portion of the functional layer located within the auxiliary isolation trench, and forming the plurality of pixel openings in other portions of the functional layer; Wherein, the orthographic projection of the partition groove on the driving backplane is located between the orthographic projections of two adjacent pixel openings on the driving backplane; Forming a functional layer on the buffer layer with the auxiliary isolation trench and patterning the functional layer includes: forming a first organic layer on the buffer layer having the auxiliary isolation groove, wherein a portion of the first organic layer is located in the auxiliary isolation groove and another portion covers the first electrode layer; performing a patterning process on the first organic layer to form a plurality of second sub-pixel openings in the first organic layer corresponding one-to-one to the plurality of first electrodes, wherein orthographic projections of the second sub-pixel openings on the driving backplane are located within orthographic projections of the corresponding first electrodes on the driving backplane, and sidewalls of the second sub-pixel openings are curved; forming a first inorganic layer on the first organic layer having the plurality of second sub-pixel openings; The first inorganic layer is patterned to form a first sub-partitioning groove and a plurality of first sub-pixel openings corresponding one-to-one to the plurality of second sub-pixel openings in the first inorganic layer, wherein the orthographic projections of the first sub-pixel openings on the driving backplane are located within the orthographic projections of the corresponding second sub-pixel openings on the driving backplane, and sidewalls of the patterned first inorganic layer located within the second sub-pixel openings and covering the second sub-pixel openings; Using the patterned first inorganic layer as a mask, the portion of the first organic layer located in the auxiliary isolation groove is etched to form a second sub-partitioning groove connected to the first sub-partitioning groove in the first organic layer, the orthographic projection of the first sub-partitioning groove on the driving backplane is located within the orthographic projection of the second sub-partitioning groove on the driving backplane, and the boundary of the orthographic projection of the first sub-partitioning groove on the driving backplane does not overlap with the boundary of the orthographic projection of the second sub-partitioning groove on the driving backplane.

8. A method for manufacturing a display substrate, characterized in that: The method comprises: forming a first electrode layer on one side of the driving backplane, wherein the first electrode layer has a plurality of first electrodes, and the first electrodes are electrically connected to the driving backplane; forming a functional layer on a side of the driving backplane on which the first electrode layer is formed, wherein at least a portion of the functional layer is located on a side of the first electrode layer facing away from the driving backplane, the functional layer having a partition groove and a plurality of pixel openings corresponding one-to-one to the plurality of first electrodes, at least a portion of the first electrodes being located within the corresponding pixel openings, and at least a portion of the sidewalls of the pixel openings being curved sidewalls; An organic light-emitting layer is formed on a side of the functional layer away from the driving backplane, wherein the organic light-emitting layer comprises: a plurality of organic material layers stacked in a direction perpendicular to and away from the driving backplane, wherein at least a portion of the organic material layers located within the partition groove is disconnected from a portion located outside the partition groove; forming a second electrode layer on a side of the organic light-emitting layer facing away from the driving backplane; The partition groove and the pixel opening belong to the same structure in the functional layer; the functional layer is formed on one side of the driving backplane where the first electrode layer is formed, including: forming a second organic layer on a side of the first electrode layer facing away from the driving backplane, wherein the second organic layer covers the first electrode and covers an area between two adjacent first electrodes; Performing pattern processing on the second organic layer to form a plurality of auxiliary pixel grooves corresponding one-to-one to the plurality of first electrodes on a side of the second organic layer facing away from the driving backplane, wherein the orthographic projections of the auxiliary pixel grooves on the driving backplane are located within the orthographic projections of the corresponding first electrodes on the driving backplane, the depth of the auxiliary pixel grooves is less than the thickness of the second organic layer, and the sidewalls of the auxiliary pixel grooves are curved; forming a second inorganic layer on the second organic layer having the plurality of auxiliary pixel grooves; performing a patterning process on the second inorganic layer to form a plurality of third sub-pixel openings in the second inorganic layer corresponding one-to-one to the plurality of auxiliary pixel grooves, wherein the orthographic projections of the third sub-pixel openings on the driving backplane are located within the orthographic projections of the corresponding auxiliary pixel grooves on the driving backplane, and the patterned second inorganic layer covers sidewalls of the auxiliary pixel grooves; Using the patterned second inorganic layer as a mask, etching the second organic layer to form a plurality of fourth sub-pixel openings in the second organic layer that are in one-to-one communication with the plurality of third sub-pixel openings, wherein the orthographic projections of the third sub-pixel openings on the driving backplane are located within the orthographic projections of the fourth sub-pixel openings on the driving backplane, and boundaries of the orthographic projections of the third sub-pixel openings on the driving backplane do not overlap with boundaries of the orthographic projections of the fourth sub-pixel openings on the driving backplane; Wherein, the portion of the second inorganic layer protruding relative to the second organic layer is an arc-shaped extension portion.

9. A display device, characterized in that: include: A power supply component, and a display substrate electrically connected to the power supply component, wherein the display substrate is the display substrate according to any one of claims 1 to 6.

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