Bone conduction sensor and smart wearable device

Abstract

The present invention discloses a bone conduction sensor and an intelligent wearable device. The bone conduction sensor includes a biaxial vibration detection module and a signal processing module. The signal processing module is connected to the output end of the biaxial vibration detection module, and the signal processing module has a communication end for accessing an external terminal. The present invention improves the reliability and diversity of the use of the bone conduction sensor.

Description

Technical Field

[0001] The present invention relates to the field of bone conduction sensors, and particularly to a bone conduction sensor and a smart wearable device. Background Art

[0002] A bone conduction sensor is a sensor that uses a microelectromechanical system to pick up vibration signals such as speech propagated through a solid and converts the picked-up vibration signals into electrical signals. A bone conduction sensor generally includes a microelectromechanical system, an application-specific integrated circuit (ASIC) for electrical signals, a PCB, and a housing. The microelectromechanical system is mainly composed of a mass block, a beam structure, and an anchor point, and is used to sense external vibration information. The application-specific integrated circuit is mainly composed of a preamplifier and an interface circuit, and converts the weak electrical signals converted and output by the microelectromechanical system into specific signals for output, so as to express the vibration information.

[0003] Existing bone conduction sensors have single-channel analog output and are only sensitive to signals vibrating in a certain specific direction, which are greatly limited in actual use. Summary of the Invention

[0004] The main purpose of the present invention is to propose a bone conduction sensor, aiming to improve the diversity of the use of the conduction sensor.

[0005] To this end, the present invention proposes a bone conduction sensor, which includes:

[0006] A biaxial vibration detection module, which is used to detect vibrations in two directions of itself and output corresponding first and second vibration detection signals;

[0007] A signal processing module, which is connected to the output end of the biaxial vibration detection module, and the signal processing module has a communication end for accessing an external terminal;

[0008] The signal processing module is used to receive the first vibration detection signal and the second vibration detection signal, and alternately output the first vibration detection signal and the second vibration detection signal after signal processing through the communication end.

[0009] Optionally, the signal processing module includes:

[0010] An analog-to-digital conversion module, the input end of which is connected to the output end of the biaxial vibration detection module, and the analog-to-digital conversion module is used to perform analog-to-digital conversion on the first vibration detection signal and the second vibration detection signal and then output;

[0011] A control module, which is connected to the input end of the analog-to-digital conversion module;

[0012] A signal transceiver module, which is electrically connected to the control module, and the communication end of the signal transceiver module is used to access an external terminal;

[0013] The control module is configured to alternately output the first vibration detection signal and the second vibration detection signal after analog-to-digital conversion through the communication end of the signal transceiver module after signal processing according to the transceiver protocol corresponding to the signal transceiver module.

[0014] Optionally, the signal transceiver module includes an 2 I 2 S bus transceiver module. The communication end of the I

[0015] S bus transceiver module includes a data terminal, a clock terminal, and a channel selection terminal. The clock terminal is used to access the clock signal sent by an external device, the channel selection terminal is used to access the channel selection signal sent by an external device, and the data terminal is used to access an external device; 2 The control module is configured to alternately output the first vibration detection signal and the second vibration detection signal after analog-to-digital conversion to an external device through the data terminal after signal processing according to the transceiver protocol corresponding to the I

[0016] Optionally, the signal processing module further includes:

[0017] An amplification module, which is connected in series on the electrical connection path between the analog-to-digital conversion module and the biaxial vibration detection module;

[0018] The amplification module is configured to amplify the first vibration detection signal and the second vibration detection signal and then output them.

[0019] Optionally, the biaxial vibration detection module includes a biaxial MEMS vibration detection chip.

[0020] Optionally, the signal processing module further has a signal access end for accessing the output selection signal sent by an external terminal;

[0021] The signal processing module is further configured to, according to the output selection signal, perform signal processing on the first vibration detection signal or the second vibration detection signal and then output it through the communication end.

[0022] Optionally, the number of biaxial vibration detection modules is multiple, the number of signal processing modules is multiple, and the number of biaxial vibration detection modules is the same as the number of signal processing modules.

[0023] Optionally, the bone conduction sensor further includes:

[0024] Housing;

[0025] A circuit board, the housing is disposed over the circuit board to form an accommodation space with the circuit board, and the biaxial vibration detection module and the signal processing module are disposed on the circuit board.

[0026] Optionally, the housing is further provided with ventilation holes.

[0027] Optionally, the area of the ventilation hole is 25um 2 -55um 2 .

[0028] Optionally, the biaxial vibration detection module and the signal processing module are adhesively pasted on the circuit board.

[0029] Optionally, a grounding layer is sandwiched in the circuit board.

[0030] The present invention also provides an intelligent wearable device, including the bone conduction sensor described in any one of the above.

[0031] The bone conduction sensor of the present invention includes a biaxial vibration detection module and a signal processing module. The biaxial vibration detection module is used to detect vibrations in two directions of itself and output corresponding first vibration detection signals and second vibration detection signals. The signal processing module is used to receive the first vibration detection signal and the second vibration detection signal, and alternately output the first vibration detection signal and the second vibration detection signal after signal processing through the communication terminal. In this way, when actually detecting the bone voiceprint signal of the user through the bone conduction sensor, that is, detecting the bone vibration situation of the user, the bone conduction sensor can simultaneously detect the bone vibration situation in two directions of the user, effectively improving the diversity of the use of the bone conduction sensor. In addition, alternately outputting the first vibration detection signal and the second vibration detection signal output by the biaxial vibration detection module through the signal processing module can effectively reduce the number of connection lines between the bone conduction sensor and the external terminal and streamline the structure of the bone conduction sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0033] Figure 1 It is a schematic diagram of functional modules in an embodiment of the bone conduction sensor of the present invention;

[0034] Figure 2 Schematic diagram of functional modules in another embodiment of the bone conduction sensor of the present invention;

[0035] Figure 3 Schematic diagram of functional modules in yet another embodiment of the bone conduction sensor of the present invention;

[0036] Figure 4 Schematic diagram of functional modules in still another embodiment of the bone conduction sensor of the present invention;

[0037] Figure 5 Schematic diagram of functional modules in another embodiment of the bone conduction sensor of the present invention;

[0038] Figure 6 Schematic diagram of functional modules in yet another embodiment of the bone conduction sensor of the present invention;

[0039] Figure 7 Schematic diagram of functional modules in still another embodiment of the bone conduction sensor of the present invention;

[0040] Figure 8 Schematic diagram of the structure in an embodiment of the bone conduction sensor of the present invention;

[0041] Figure 9 For I 2 Schematic diagram of data transmission of the I²C bus communication protocol.

[0042] Explanation of the reference numerals in the drawings:

[0043] Label Name Label Name 10 Biaxial vibration detection module 20 Signal processing module 21 Analog-to-digital conversion module 22 Control module 23 Signal transceiver module 24 Amplification module 100 Housing 200 Circuit board

[0044] The realization of the object, functional features and advantages of the present invention will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0045] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts belong to the scope of protection of the present invention.

[0046] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0047] A bone conduction sensor is a sensor that uses a microelectromechanical system to pick up vibration signals such as speech propagated through a solid and converts the picked-up vibration signals into electrical signals. A bone conduction sensor generally includes a microelectromechanical system, an application-specific integrated circuit (ASIC) for electrical signals, a PCB, and a housing. The microelectromechanical system mainly consists of a mass block, a beam structure, and an anchor point, and is used to sense external vibration information. The application-specific integrated circuit mainly consists of a preamplifier and an interface circuit, and converts the weak electrical signals output by the microelectromechanical system into specific signals for output, so as to express this vibration information.

[0048] Existing bone conduction sensors have single-channel analog output and are only sensitive to signals vibrating in a specific direction, which are greatly limited in actual use.

[0049] Therefore, the present invention proposes a bone conduction sensor. In an embodiment of the present invention, with reference to Figure 1 , the bone conduction sensor includes:

[0050] A biaxial vibration detection module 10, which is used to detect vibrations in two directions of itself and output corresponding first and second vibration detection signals;

[0051] A signal processing module 20, which is connected to the output end of the biaxial vibration detection module 10, and the signal processing module 20 has a communication end for accessing an external terminal;

[0052] The signal processing module 20 is used to receive the first vibration detection signal and the second vibration detection signal, and alternately output the first vibration detection signal and the second vibration detection signal after signal processing through the communication end.

[0053] In this embodiment, optionally, the biaxial vibration detection module 10 can be implemented by using a biaxial MEMS (Micro-Electro-Mechanical System micro-motor system) vibration detection sensor, such as a biaxial MEMS capacitive accelerometer, a biaxial MEMS piezoresistive accelerometer, a biaxial MEMS piezoelectric accelerometer, etc. The biaxial MEMS vibration detection sensor can detect vibrations in two directions and output first and second vibration detection signals with corresponding voltage values; among them, the vibration directions detected by the biaxial vibration detection module 10 can be determined by the specific selection of the biaxial vibration detection sensor.

[0054] Optionally, the signal processing module 20 can be implemented by a main controller. The main controller can receive the first vibration detection signal and the second vibration detection signal, and output the two signals alternately through the same communication terminal according to a preset alternating output mode. For example, the output signal is switched every 0.05S, the first vibration signal is output for 0.05S first, and then the second vibration signal is output for 0.05S. In this way, the signal processing module 20 can alternately transmit two signals through a single data line, thereby reducing the number of connection lines between the bone conduction sensor and the external terminal.

[0055] The bone conduction sensor of the present invention includes a biaxial vibration detection module 10 and a signal processing module 20. The biaxial vibration detection module 10 is used to detect vibrations in two directions of itself and output corresponding first and second vibration detection signals. The signal processing module 20 is used to receive the first and second vibration detection signals, and alternately output the first and second vibration detection signals after signal processing through the communication terminal. In this way, when actually detecting the bone voiceprint signal of the user through the bone conduction sensor, that is, detecting the bone vibration condition of the user, the vibration conditions in two directions of the user's bones can be detected simultaneously, effectively improving the diversity of the use of the bone conduction sensor. In addition, by alternately outputting the first and second vibration detection signals output by the biaxial vibration detection module 20 through the signal processing module 20, the number of connection lines between the bone conduction sensor and the external terminal can be effectively reduced, and the structure of the bone conduction sensor can be streamlined.

[0056] It should be understood that the first vibration detection signal SC1 and the second vibration detection signal SC2 output by the biaxial vibration detection module 10 are generally analog signals. If the bone conduction sensor directly outputs them to the external terminal, during the transmission process, the first vibration detection signal SC1 and the second vibration detection signal SC2 are very susceptible to interference from external environmental factors, resulting in signal distortion.

[0057] For this reason, optionally, refer to Figure 2 , the signal processing module 20 can be implemented by an analog-to-digital conversion module 21, a control module 22, and a signal transceiver module 23. Among them, the input end of the analog-to-digital conversion module 21 is connected to the output end of the biaxial vibration detection module 10. The analog-to-digital conversion module 21 is used to perform analog-to-digital conversion on the first vibration detection signal SC1 and the second vibration detection signal SC2 and then output them. The control module 22 is connected to the input end of the analog-to-digital conversion module. The signal transceiver module 23 is electrically connected to the control module 22. The communication end of the signal transceiver module 23 is used to access the external terminal. The control module 22 is used to alternately output the first vibration detection signal SC1 and the second vibration detection signal SC2 after analog-to-digital conversion through the communication end of the signal transceiver module 23 after signal processing according to the transceiver protocol corresponding to the signal transceiver module 23.

[0058] In this embodiment, the analog-to-digital conversion module 21 can be implemented using an ADC conversion chip. It can be understood that since the biaxial vibration detection module 10 outputs two vibration detection signals, the corresponding analog-to-digital conversion module may include two ADC conversion chips to convert the first vibration detection signal SC1 and the second vibration detection signal SC2 into digital signals respectively and then output them to the control module 22. The control module 22 can be implemented using a main controller, such as an MCU, a DSP (Digital Signal Process, digital signal processing chip), an FPGA (Field Programmable Gate Array, programmable logic gate array chip), etc. The signal transceiver module 23 can be implemented using an audio signal transceiver module 23. The control module 22 can process the first vibration detection signal SC1 and the second vibration detection signal SC2 according to the protocol of the audio signal transceiver module 23 to use the two signals as the first channel signal and the second channel signal, and alternately output them to the external terminal through the same communication terminal. In this way, in practical applications, the number of electrical connection lines between the bone conduction sensor and the external terminal can be reduced, and the structure of the bone conduction sensor can be streamlined. At the same time, outputting the first vibration detection signal SC1 and the second vibration detection signal SC2 in the form of digital signals can ensure the quality of signal transmission and the accuracy of the results obtained by the external terminal. In addition, using the signal transceiver module 23 to transmit signals can further improve the signal transmission quality and reduce the attenuation and interference of the signal during transmission compared to directly using the GPIO port of the controller.

[0059] It can be understood that the above analog-to-digital conversion module 21, control module 22, and signal transceiver module 23 can all be integrated in the same controller, thereby streamlining the circuit wiring area and reducing the volume of the signal processing module 20.

[0060] Reference Figure 4 , in an embodiment of the present invention, the signal transceiver module 23 includes an I 2 S bus transceiver module. The communication terminal of the I 2 S bus transceiver module includes a data terminal SD, a clock terminal SCK, and a channel selection terminal WS. The clock terminal SCK is used to access the clock signal sent by the external device, the channel selection terminal WS is used to access the channel selection signal sent by the external device, and the data terminal SD is used to access the external device;

[0061] The control module 22 is configured to, according to the clock signal and the channel selection signal, process the first vibration detection signal SC1 and the second vibration detection signal SC2 after analog-to-digital conversion according to the transceiver protocol corresponding to the I 2 S bus transceiver module and alternately output them to the external device through the data terminal.

[0062] In this embodiment, I 2 The I2C bus transceiver module receives the clock signal and channel selection signal provided by the external terminal and outputs them to the control module 22. Among them, the channel selection signal can be a square wave signal with a 50% duty cycle.

[0063] Specifically, referring to Figure 9 , after receiving the first vibration detection signal SC1 and the second vibration detection signal SC2 after analog-to-digital conversion, the control module 22 will perform signal processing according to the communication protocol of the I2C bus transceiver module, and then select the corresponding signal for output according to the clock signal and channel selection signal. Referring to 2 , taking the first vibration detection signal SC1 after the above analog-to-digital conversion as the first channel signal and the second vibration detection signal SC2 as the second channel signal, and Figure 4 the I2C bus transceiver module includes 2 the I2C transceiver chip U2, taking its communication terminal TX connected to the control module 22 as an example for illustration. 2 The I2C transceiver chip U2 outputs the clock signal and channel selection signal output by the external terminal to the control module 22 through the communication terminal TX. When the channel selection signal is at a high level, the control module 22 selects to output the first channel signal, that is, the first vibration detection signal SC1, to the external terminal through the data terminal SD. When the communication selection signal is at a low level, the control module 22 selects to output the second channel signal, that is, the second vibration detection signal SC2, to the external terminal through the data terminal SD. In this way, in practical applications, by using the 2 I2C bus transceiver module as the signal transceiver module 23, it is possible to alternately transmit the signals of two different channels through one data line, effectively streamlining the number of external connection lines of the bone conduction sensor. At the same time, 2 the I2C bus transceiver module also has good versatility, which is conducive to adapting to the external terminals in different types of smart wearable devices, improving the versatility and compatibility of the bone conduction sensor. 2 As can be seen from the above, the first vibration detection signal SC1 and the second vibration detection signal SC2 output by the biaxial vibration detection module 10 are generally analog signals, but the voltages of the analog signals output by the two are very small and difficult to be detected by the input end of the analog-to-digital conversion module 21.

[0064] Therefore, referring to

[0065] , in an embodiment of the present invention, the signal processing module 20 further includes: Figure 3 an amplification module 24, and the amplification module 24 is connected in series on the electrical connection path between the analog-to-digital conversion module 21 and the biaxial vibration detection module 10;

[0066]

[0067] ​The amplification module 24 is configured to amplify the first vibration detection signal and the second vibration detection signal and then output them.

[0068] In this embodiment, optionally, the amplification module 24 can be implemented by an amplifier and its peripheral circuit. R & D personnel can build a peripheral circuit with corresponding parameters according to the amplification factor requirements. Optionally, the amplification module 24 can also be implemented by an amplifier chip, and the amplification factor of the amplifier chip is determined by the model selection. The amplification module 24 includes at least two amplifiers, which amplify the first vibration detection signal SC1 and the second vibration detection signal SC2 by a certain multiple respectively and then output them to the analog-to-digital conversion module 21. In this way, the analog-to-digital conversion module can accurately detect the first vibration detection signal SC1 and the second vibration detection signal SC2, improving the accuracy and reliability of the bone conduction sensor detection.

[0069] Reference Figure 5 , in an embodiment of the present invention, the signal processing module 20 further has a signal access terminal for accessing an output selection signal sent by an external terminal;

[0070] The signal processing module 20 is further configured to, according to the output selection signal, process the first vibration detection signal or the second vibration detection signal and then output it through the communication terminal.

[0071] As can be seen from the above, the biaxial vibration detection module 10 can detect vibration signals in two directions of the user's bone. If the external terminal in the current smart wearable device only needs the vibration detection signal in a certain direction, then the external terminal signal will output an output selection signal to the control module 22, so that the control module 22 processes the corresponding first vibration detection signal or the second vibration detection signal and then outputs it through the communication terminal.

[0072] Specifically, referring to Figure 4 and Figure 5 , in combination with the above embodiment content for explanation, when the control module 22 receives the first channel output signal through the signal input terminal, when the channel selection signal accessed and output by the I 2 S transceiver chip U2 to the control module 22 is at a high level, the control module 22 will output the first channel signal, that is, the first vibration detection signal SC1 after analog-to-digital conversion, to the external device through the data terminal SD. When the channel selection signal is at a low level signal, the control module 22 will stop outputting any signal. In this way, in practical applications, the bone conduction sensor can output only the vibration signal in a certain direction according to the requirements of the external terminal of the smart wearable device, effectively improving the flexibility of the use of the bone conduction sensor.

[0073] In an embodiment of the present invention, the number of the biaxial vibration detection modules 10 is multiple, the number of the signal processing modules 20 is multiple, and the number of the biaxial vibration detection modules 10 is the same as that of the signal processing modules 20.

[0074] Optionally, in an embodiment, refer to Figure 6 , the number of the biaxial vibration detection modules 10 is multiple, and the number of the amplification modules 24 and analog-to-digital conversion modules 21 in the signal processing module 20 can also be multiple correspondingly, while the control module 22 and the signal transceiver module 23 are still one.

[0075] It can be understood that the directions corresponding to different biaxial vibration detection modules 10 can be the same or different.

[0076] Specifically, in combination with the above embodiments, the control module 22 will select signals according to the above outputs, and perform signal processing on the first vibration detection signal and / or the second vibration detection signal of the biaxial vibration detection module 10 corresponding to the output selection signal, and then alternately output them through the communication terminal of the signal transceiver module 23. For example, if the external terminal in the current intelligent wearable device needs the first vibration detection signal output by the biaxial vibration detection module 10A and the second vibration detection signal output by the biaxial vibration detection module 10B, it will output the corresponding output selection signal to the control module 22. The control module 22 will set the first vibration detection signal output by the biaxial vibration detection module 10A as the first channel signal, and set the second vibration detection signal output by the biaxial vibration detection module 10B as the second channel signal, and when the channel selection signal is a high-level signal, output the first channel signal through the data terminal SD, and when the channel selection signal is a low-level signal, output the second channel signal through the data terminal SD. In this way, the bone conduction sensor of the present invention can detect the vibration conditions of the user's bones in at least two directions, and can output the corresponding vibration detection signals according to the needs of the external terminal in the intelligent wearable device, thereby further improving the convenience and flexibility of the use of the bone conduction sensor.

[0077] Optionally, in an embodiment, refer to Figure 7 , the number of the biaxial vibration detection modules 10 is multiple, the number of the amplification modules 24 and analog-to-digital conversion modules 21 in the signal processing module 20 can also be multiple correspondingly, and at the same time, the number of the signal transceiver modules 23 is also multiple, and each signal transceiver module 23 corresponds to a biaxial vibration detection module 10 one by one. In this way, in combination with the above embodiments, the control module 22 can output at least three vibration detection signals corresponding to the output selection signal through the communication terminals of the multiple signal transceiver modules 23 respectively.

[0078] Refer to Figure 8 , in an embodiment of the present invention, the bone conduction sensor further includes:

[0079] Housing 100;

[0080] A circuit board 200, with the housing 100 covering the circuit board 200 to form an accommodation space therewith, and the dual-axis vibration detection module 10 and the signal processing module 20 are disposed on the circuit board 200.

[0081] In this embodiment, optionally, the housing 100 can be made of a metal material, such as iron, copper, etc., or the surface of the housing 100 can be nickel-plated or gold-plated. Optionally, the housing 100 can also be made of a non-metallic material, such as a resin polymer material like plastic. Thus, in practical applications, it can achieve the effect of electromagnetic isolation and effectively prevent external electromagnetic signals from interfering with the operation of the bone conduction sensor.

[0082] Optionally, during the actual production process, vent holes can also be provided on the housing 100 by means of etching or laser processing, such as micropores and / or slits, etc. Thus, during the process of reflow soldering the housing 100 and the circuit board 200 for encapsulation, the gas expanded due to heating in the accommodation space can be discharged from the vent holes, thereby preventing the air pressure in the housing of the bone conduction sensor of the present invention from being too high and affecting its own detection accuracy. Preferably, the area of the vent holes can be 25um 2 -55um 2 , the vent holes of the above size can not only prevent the air pressure in the housing of the bone conduction sensor from being too high, but also ensure that external interfering electromagnetic waves cannot enter the interior of the bone conduction sensor along the vent holes, thereby effectively ensuring the accuracy of detection and the stability of operation of the bone conduction sensor.

[0083] Optionally, the circuit board 200 can be implemented using a fiberglass board. Thus, during the following process of reflow soldering by the pick-and-place machine, it can effectively prevent the circuit board 200 from deforming due to heat, ensuring the yield rate of the bone conduction sensor when leaving the factory.

[0084] Optionally, the dual-axis vibration detection module 10 and the signal processing module 20 establish an electrical connection path by wire bonding. It can be understood that the bone conduction sensor will also include at least one pin for electrically connecting to an external device, and the at least one pin is also wire-bonded to the dual-axis vibration detection module 10 and the signal processing module 20 respectively for electrical connection.

[0085] Optionally, the biaxial vibration detection module 10 and the signal processing module 20 are adhesively attached to the circuit board 200. Among them, the adhesive can be realized by using a conductive adhesive. In this way, not only can the biaxial vibration detection module 10 and the signal processing module 20 be firmly fixed on the circuit board 200, but also the biaxial vibration detection module 10 and the signal processing module 20 can be respectively included to form two electromagnetic isolation zones, thereby reducing the electromagnetic interference to the biaxial vibration detection module 10 and the signal processing module 20.

[0086] Optionally, the housing 100 and the circuit board 200 are soldered using solder paste. In this way, the solder paste can not only fill the gap between the housing 100 and the circuit board 200, so that the two can be firmly soldered together after being heated by reflow soldering in a chip mounter, but also, together with the housing 100 made of the above metal material, form an electromagnetic isolation layer, thereby further preventing external electromagnetic signals from interfering with the operation of the biaxial vibration detection module 10 and the signal processing module 20 on the circuit board 200, and improving the reliability and stability of the operation of the bone conduction sensor.

[0087] Optionally, a grounding layer is sandwiched in the circuit board 200. It can be understood that the circuit board 200 can be realized by using a multi-layer board, such as a four-layer board, a six-layer board, etc. A grounding copper clad can be laid in the board layer of the circuit board 200 and electrically connected to the grounding ends of the signal processing module 20 and the biaxial vibration detection module 10 through vias. In this way, combining the content in the above two embodiments, the signal processing module 20 and the biaxial vibration detection module 10 in the bone conduction sensor will be completely electromagnetically isolated from the outside world, thereby further preventing external electromagnetic signals from interfering with the operation of the biaxial vibration detection module 10 and the signal processing module 20 on the circuit board 200.

[0088] The present invention also proposes an intelligent wearable device, including the bone conduction sensor as described above.

[0089] It should be noted that since the intelligent wearable device of the present invention includes all the embodiments of the above bone conduction sensor, the intelligent wearable device of the present invention has all the beneficial effects of the above bone conduction sensor, which will not be elaborated here.

[0090] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. All equivalent structural transformations made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A bone conduction sensor, characterized in that, The bone conduction sensor includes: A biaxial vibration detection module for detecting vibrations in two directions of itself and outputting corresponding first and second vibration detection signals; A signal processing module connected to the output end of the biaxial vibration detection module. The signal processing module has a communication end for accessing an external terminal, and is used to access a clock signal and a channel selection signal sent by the external terminal; The signal processing module is configured to receive the first vibration detection signal and the second vibration detection signal, and alternately output the first vibration detection signal and the second vibration detection signal after signal processing according to the clock signal and the channel selection signal through the communication end.

2. The bone conduction sensor according to claim 1, wherein The signal processing module includes: An analog-to-digital conversion module, the input end of which is connected to the output end of the biaxial vibration detection module, and is used to perform analog-to-digital conversion on the first vibration detection signal and the second vibration detection signal and then output; A control module connected to the input end of the analog-to-digital conversion module; A signal transceiver module electrically connected to the control module, and the communication end of the signal transceiver module is used to access an external terminal; The control module is configured to alternately output the first vibration detection signal and the second vibration detection signal after analog-to-digital conversion through the communication end of the signal transceiver module after signal processing according to the transceiver protocol corresponding to the signal transceiver module.

3. The bone conduction sensor according to claim 2, wherein, The signal transceiver module includes an 2 I²S bus transceiver module. The communication end of the 2 I²S bus transceiver module includes a data terminal, a clock terminal, and a channel selection terminal. The clock terminal is used to access the clock signal sent by an external terminal, the channel selection terminal is used to access the channel selection signal sent by the external terminal, and the data terminal is used to access the external terminal; The control module is configured to, according to the clock signal and the channel selection signal, process the first vibration detection signal and the second vibration detection signal after analog-to-digital conversion according to the transceiver protocol corresponding to the 2 I²S bus transceiver module, and then alternately output the processed signals to an external terminal through the data terminal.

4. The bone conduction sensor according to claim 2, wherein, The signal processing module further includes: An amplification module connected in series on the electrical connection path between the analog-to-digital conversion module and the biaxial vibration detection module; The amplification module is used to amplify the first vibration detection signal and the second vibration detection signal and then output.

5. The bone conduction sensor according to claim 1, wherein, The biaxial vibration detection module includes a biaxial MEMS vibration detection chip.

6. The bone conduction sensor according to any one of claims 1-5, characterized in that, The signal processing module further has a signal access end for accessing an output selection signal sent by an external terminal; The signal processing module is further configured to alternately output the first vibration detection signal or the second vibration detection signal after signal processing according to the output selection signal through the communication end.

7. The bone conduction sensor according to any one of claims 1-5, characterized in that The number of the biaxial vibration detection modules is multiple, the number of the signal processing modules is multiple, and the number of the biaxial vibration detection modules is the same as that of the signal processing modules.

8. The bone conduction sensor according to any one of claims 1-5, characterized in that The bone conduction sensor further includes: A housing; A circuit board, the housing covers the circuit board to form an accommodation space with the circuit board, and the biaxial vibration detection module and the signal processing module are arranged on the circuit board.

9. The bone conduction sensor according to claim 8, characterized in that, Vent holes are further provided on the housing.

10. The bone conduction sensor according to claim 9, wherein, The area of the ventilation holes is 25um 2 -55um 2 .

11. The bone conduction sensor according to claim 8, wherein, The biaxial vibration detection module and the signal processing module are adhesively pasted on the circuit board.

12. The bone conduction sensor according to claim 8, wherein, A grounding layer is sandwiched in the circuit board.

13. An intelligent wearable device, characterized in that, Including the bone conduction sensor according to any one of claims 1-12.

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