Tinning device and tinning method

Abstract

The present invention discloses a tinning device and a tinning method, which include: a working platform for placing a PCBA board, a mounting fixture for fixing the PCBA board, and a tinning mechanism; the tinning mechanism includes a fixed block, a first rotating shaft, and a steel mesh component, wherein the steel mesh component is provided with a plurality of tinning holes arranged at intervals, so that the positions of a plurality of soldering pads can be limited on the PCBA board within a limited width, and even if the distance between the positions of each soldering pad is very close, they can be separated by the steel mesh component to ensure that the solder between the soldering pads does not stick together and cause a short circuit; the steel mesh component and the fixed block are rotatably connected by the first rotating shaft, so that the steel mesh component can rotate relative to the working platform, so that the steel mesh component and the working platform can switch between a relatively overlapping state and a relatively separated state; wherein, when the steel mesh component and the working platform are in a relatively overlapping state, the tinning holes are opposite to the soldering pads, and the solder is deposited on the soldering pads through the tinning holes, the structure is simple and tinning is easy, the tinning efficiency is improved, and the mass production of products can be promoted.

Description

Technical Field

[0001] The present invention relates to the field of tinning, and in particular to a tinning device and a tinning method. Background Art

[0002] As optical communication rates increase, the number of lasers designed into modules has grown from a single one to four, and the corresponding number of backlight detectors has also increased to four. Furthermore, since high-frequency signals often require ground pins on both sides to isolate them from interference, existing module packaging formats have not kept pace with the increase in channel count. This necessitates the creation of multiple solder pads within a limited width. The close proximity of each pad creates significant challenges in the pre-tinning process. Tinning one pad at a time is inefficient and can easily cause short circuits due to bonding, making manual operation impractical.

[0003] Therefore, it is necessary to provide a safe and reliable tinning method for a tinning device to solve the above problems and thus meet the needs of market development. Summary of the Invention

[0004] The present invention provides a tinning method for a tinning device, aiming to solve the problem that the closely arranged solder pads of a PCBA board are difficult to tin manually; the efficiency is greatly improved, and the realization of mass production of products is promoted.

[0005] The present invention discloses a tinning device for pre-tinning a soldering pad of a PCBA board, comprising:

[0006] A work platform, which is used to place the PCBA board;

[0007] A mounting fixture is provided on the work platform and is located next to the PCBA board, and is used to fix the PCBA board;

[0008] The tinning mechanism includes a fixed block, a first rotating shaft, and a steel mesh assembly, wherein the steel mesh assembly is provided with a plurality of tinning holes arranged at intervals; the fixed block is fixed to the work platform, and the steel mesh assembly and the fixed block are rotatably connected via the first rotating shaft, so that the steel mesh assembly can rotate relative to the work platform, so that the steel mesh assembly and the work platform can switch between a relatively overlapping state and a relatively separated state;

[0009] Among them, when the steel mesh assembly and the working platform are in a relatively overlapping state, the steel mesh assembly is located above the working platform, the steel mesh assembly is attached to the PCBA board, and the upper tin hole is opposite to the soldering pad.

[0010] In a tinning device according to one embodiment of the present invention, the steel mesh assembly includes a connecting piece, a flip piece, a locking piece and a steel mesh; one end of the connecting piece is connected to the fixed block, the flip piece can be flipped and connected to the connecting piece, the locking piece passes through the connecting piece and is connected to the flip piece, the steel mesh is arranged at one end of the flip piece and flips with the flip piece; a plurality of tinning holes are closely spaced on the steel mesh.

[0011] In the tinning device according to one embodiment of the present invention, arcuate grooves are provided on both the connecting member and the flip member, and a plurality of the arcuate grooves are provided on the peripheral side of the locking member.

[0012] In the tinning device according to one embodiment of the present invention, a convex edge portion is provided on the periphery of the steel mesh, and a micro groove is formed on the edge portion, and the micro groove is aligned with the solder pad of the PCBA board.

[0013] In a tinning device according to one embodiment of the present invention, the mounting fixture includes a first clamping block, a second clamping block, a spring, and a second rotating shaft. The first clamping block and the second clamping block are mounted on the work platform via the second rotating shaft. A plurality of springs are respectively mounted between the first clamping block and the work platform, and between the second clamping block and the work platform, so that the springs lift the first clamping block and the second clamping block so that the PCBA board can be clamped in two directions.

[0014] In the tinning device according to one embodiment of the present invention, an extension portion is provided on one side of the first clamping block, and the extension portion extends to below the second clamping block.

[0015] In the tinning device of one embodiment of the present invention, the spring is a 6-turn spring, or the spring is an 8-turn spring, so that the clamping force of the first clamping block or the second clamping block can be adjusted.

[0016] In the tinning device according to one embodiment of the present invention, the surfaces of the first clamping block and the second clamping block that are in contact with the PCBA board are provided with a first inclined surface and a second inclined surface.

[0017] In the tinning device according to one embodiment of the present invention, a plurality of screws are installed on the first clamping block and the second clamping block, and the screws are arranged at both ends of the second rotating shaft.

[0018] The present invention also provides a tinning method for a tinning device, which is used for the tinning device as described above, and the tinning method comprises the following steps:

[0019] Place the PCBA board on the workbench;

[0020] The installation fixture clamps and fixes the PCBA board;

[0021] Rotate the steel mesh assembly until the upper tin hole is aligned with the solder pad on the PCBA board;

[0022] Tin is scraped from the upper tin holes of the steel mesh assembly, and the solder is deposited on the pads, completing the tinning on the pads of the PCBA board.

[0023] The technical solution provided by the embodiments of the present application may include the following beneficial effects: The present application designs a tinning device and a tinning method; by placing the PCBA board on the work platform, the PCBA board is fixed by the installation clamp, and after the steel mesh assembly is rotated relative to the work platform, the tinning holes on the steel mesh assembly are opposite to the soldering pads, and the solder is deposited on the soldering pads through the tinning holes. The structure is simple and tinning is easy, which improves the tinning efficiency and can promote product mass production; and the tinning holes are multiple and arranged at intervals, which can realize the limitation of multiple soldering pad positions on the PCBA board within a limited width. Even if the distance between each soldering pad position is very close, they can be separated by the steel mesh assembly to ensure that the solder between the soldering pads does not stick together and cause a short circuit.

[0024] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 This is a structural diagram of a tinning device provided in one embodiment of the present application;

[0027] Figure 2 This is an exploded schematic diagram of a tinning device provided in one embodiment of the present application;

[0028] Figure 3 This is a partial cross-sectional view of a tinning device provided in one embodiment of the present application;

[0029] Figure 4 This is a partial cross-sectional view from another direction of a tinning device provided by one embodiment of the present application;

[0030] Figure 5 This is a partial cross-sectional view from another direction of a tinning device provided by an embodiment of the present application.

[0031] Description of reference numerals:

[0032] 100. Tinning device; 101. Tinning hole; 102. Micro groove; 103. Arc groove; 104. Gap groove; 110. Work platform; 120. Mounting fixture; 121. First clamping block; 122. Second clamping block; 123. Spring; 124. Second rotating shaft; 125. Extension part; 126. First inclined surface; 127. Second inclined surface; 130. Tinning mechanism; 140. Fixed block; 150. First rotating shaft; 160. Steel mesh assembly; 161. Connecting part; 162. Flipping part; 163. Locking part; 164. Steel mesh; 165. Edge; 166. Handle; 167. Screw; 168. Ordinary screw; 200. PCBA board; 201. Solder pad; 300. Scraper. DETAILED DESCRIPTION

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0034] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0035] like Figures 1 to 5 As shown, the present application provides a tinning device 100 for pre-tinning the pads 201 of a PCBA board 200, which includes: a work platform 110, a mounting fixture 120, and a tinning mechanism 130; the work platform 110 is used to place the PCBA board 200 so that the PCBA board 200 can be fixed in a working position, and the pads 201 of the PCBA board 200 can also be prepared for pre-tinning at corresponding positions;

[0036] The mounting fixture 120 is provided on the work platform 110 and is located beside the PCBA board 200 for fixing the PCBA board 200. The mounting fixture 120 may be one or more so as to fix the peripheral side of the PCBA board 200.

[0037] The tinning mechanism 130 includes a fixed block 140, a first rotating shaft 150 and a steel mesh assembly 160. The steel mesh assembly 160 is arranged with multiple tinning holes 101 at intervals. The sizes of the tinning holes 101 are very dense, which can correspond to the positions of multiple soldering pads 201 on the PCBA board 200 within a limited width, so that even if the distance between the positions of each soldering pad 201 is very close, the solder will not stick together and cause a short circuit when poured in; the arrangement and number of the soldering pads 201 and the tinning holes 101 can be selected according to actual use. The number of the soldering pads 201 is specifically 20, and correspondingly, the number of the tinning holes 101 is 20; the fixed block 140 is fixed on the work platform 110, and the steel mesh assembly 160 and the fixed block 140 are rotatably connected by the first rotating shaft 150, so that the steel mesh assembly 160 can rotate relative to the work platform 110, so that the steel mesh assembly 160 and the work platform 110 can switch between a relatively overlapping state and a relatively separated state.

[0038] By rotating the steel mesh assembly 160 and fitting it with the PCBA board 200, solder can be poured in, and the solder flows through the tinning hole 101 to the soldering pad 201 of the PCBA board 200; the tinning device 100 has a simple structure and an easy tinning method, which can promote mass production of products.

[0039] Among them, when the steel mesh assembly 160 and the work platform 110 are in a relatively overlapping state, the steel mesh assembly 160 is located above the work platform 110, the steel mesh assembly 160 is in contact with the PCBA board 200, the upper tin hole 101 is opposite to the soldering pad 201, and the steel mesh assembly 160 is rotated until the upper tin hole 101 is in close contact with the multiple soldering pads 201 on the PCBA board 200; and when the steel mesh assembly 160 and the work platform 110 are in a relatively separated state, the mounting fixture 120 releases the PCBA board 200 to remove the pre-tinned PCBA board 200.

[0040] For example, the present invention also provides a tinning method for a tinning device 100, which is used for the tinning device 100 as described above. The tinning method includes the following steps: first, placing the PCBA board 200 on the working platform 110. When installing the PCBA board 200, the working platform 110 positions the PCBA board 200 to minimize the impact of the tolerance of the PCBA board 200 itself on the solder pad 201; then, installing the mounting fixture 120 on the working platform 110, and clamping and fixing the PCBA board 200 with the mounting fixture 120; then, the fixing block 140, the first rotating shaft 150 and The steel mesh assembly 160 is assembled into a tinning mechanism 130, and the tinning mechanism 130 is installed on the working platform 110; after the installation is completed, the steel mesh assembly 160 is rotated relative to the working platform 110 so that the upper tin holes 101 of the steel mesh assembly 160 are aligned with the solder pads 201 on the PCBA board 200, and at the same time, the steel mesh assembly 160 is adjusted so that the upper tin holes 101 are in close contact with the multiple solder pads 201 on the PCBA board 200; finally, the scraper 300 scrapes tin on the upper tin holes 101 of the steel mesh assembly 160, and the solder is deposited on the solder pads 201, completing the tinning on the solder pads 201 of the PCBA board 200.

[0041] In summary, compared with the prior art, the tinning device 100 and tinning method designed in the present application have at least the following beneficial effects: by placing the PCBA board 200 on the work platform 110, the installation fixture 120 fixes the PCBA board 200, and after the steel mesh 164 component 160 rotates relative to the work platform 110, the tinning holes 101 on the steel mesh 164 component 160 are opposite to the soldering pad 201, and the solder is deposited on the soldering pad 201 through the tinning holes 101. The structure is simple and easy to tin, which improves the tinning efficiency and can promote product mass production; and the tinning holes 101 are multiple and arranged at intervals, which can achieve the limitation of multiple soldering pads 201 positions on the PCBA board 200 within a limited width. Even if the distance between the positions of each soldering pad 201 is very close, they can be separated by the steel mesh 164 component 160 to ensure that the solder between the soldering pads 201 does not stick together and cause a short circuit.

[0042] In an optional embodiment, if Figure 3As shown, the steel mesh assembly 160 includes a connecting member 161, a flip member 162, a locking member 163 and a steel mesh 164; one end of the connecting member 161 is connected to the fixed block 140 (that is, the connecting member 161 and the fixed block 140 are connected through the first rotating shaft 150); the flip member 162 can be flipped and connected to the connecting member 161, the locking member 163 passes through the connecting member 161 and is connected to the flip member 162, the steel mesh 164 is arranged at one end of the flip member 162 and flips with the flip member 162, the locking member 163 and the connecting member 161 are threaded, and the locking member 163 and the flip member 162 are clearance-fitted; a plurality of upper tin holes 101 are closely spaced on the steel mesh 164; in this embodiment, the connecting member 161 and An arc groove 103 is provided on each flip member 162, and multiple arc grooves 103 are provided on the circumferential side of the locking member 163; the locking member 163 is an adjusting screw, and when the locking member 163 is moved to the right to be locked, the highest point of the arc groove 103 will form a fulcrum for outward rotation; and when the locking member 163 is connected to the connecting member 161 and the flip member 162, a gap groove 104 is provided between the connecting member 161 and the flip member 162; this makes the connection between the connecting member 161 or the flip member 162 have a certain elasticity, which can adjust the fitting gap in the vertical direction; further, the steel mesh assembly 160 can be fine-tuned by fine-tuning the locking member 163, so that the flatness of the contact surface between the steel mesh assembly 160 and the PCBA board 200 can be further adjusted.

[0043] In an optional embodiment, a rim portion 165 is provided on the periphery of the steel mesh 164, so that the solder can be poured directly into the groove between the rim portion 165 and the flip member 162, providing space for solder deposition; the rim portion 165 is provided with a micro-groove 102, which is aligned with the solder pad 201 of the PCBA board 200, so as to facilitate the adjustment of the fitting position of the steel mesh assembly 160 and the PCBA board 200 and the observation of the alignment position of the upper tin hole 101 and the solder pad 201.

[0044] Specifically, such as Figure 4 As shown, the steel mesh 164 adopts an ultra-thin sheet size A, and the specific thickness of A is 0.06 mm; and the opened tin hole 101 has approached the manufacturing process limit of the processing, which is very convenient for the scraper 300 to scrape the solder on the steel mesh 164, and the solder is deposited on the pad 201 on the PCBA board 200 in a specific amount.

[0045] Among them, a handle 166 is also installed on the flip piece 162. The flip piece 162 can be flipped by grasping the handle 166, which makes it convenient to move the PCBA board 200 slightly after tinning to remove the PCBA board 200, and also facilitates the assembly of the next PCBA board 200; the handle 166 can be a screw, which is screwed and installed on the flip piece 162; in this embodiment, a wave screw 167 and an ordinary screw 168 are installed on the fixed block 140, and the wave screw 167 can eliminate the influence of the thread gap and ensure consistency to the greatest extent; and the ordinary screw 168 is multiple, specifically two, and the design of the two ordinary screws 168 can prevent the fixed block 140 from being displaced or rotated when the steel mesh assembly 160 is flipped, and the two screws pass through the fixed block 140 and are clearance-matched with the work platform 110. The clearance fit can facilitate the adjustment of the position of the tinning mechanism 130, and further adjust the position of the steel mesh assembly 160 so that the tinning hole 101 on the steel mesh 164 is aligned with the solder pad 201.

[0046] In an optional embodiment, the mounting fixture 120 includes a first clamping block 121, a second clamping block 122, a spring 123 and a second rotating shaft 124, and the first clamping block 121 and the second clamping block 122 are mounted on the working platform 110 via the second rotating shaft 124; a plurality of springs 123 are respectively installed between the first clamping block 121 and the working platform 110, and the second clamping block 122 and the working platform 110, so that the springs 123 push up the first clamping block 121 and the second clamping block 122, so that the first clamping block 121 and the second clamping block 122 have a downward pressing force when they contact the PCBA board 200, forming a lever effect, and the first clamping block 121 and the second clamping block 122 respectively press the PCBA board 200 under the action of the two springs 123; in this embodiment, the first clamping block 121 is arranged at one end of the PCBA board 200, and the second clamping block 122 is arranged on one side of the PCBA board 200, so that the PCBA board 200 can be clamped in two directions.

[0047] In an optional embodiment, an extension portion 125 is provided on one side of the first clamping block 121, and the extension portion 125 extends to the bottom of the second clamping block 122; therefore, the first clamping block 121 and the second clamping block 122 do not need to be pressed downward. It is only necessary to press the first clamping block 121 downward, and the second clamping block 122 can be flipped along with the extension portion 125 to achieve a linkage effect, which is convenient for the operator to take out or place the PCBA board 200. In this embodiment, the extension portion 125 is extended from the first clamping block 121 and is located at one end of the PCBA board 200; or the extension portion 125 is extended from the second clamping block 122 and is located on one side of the PCBA board 200.

[0048] In an optional embodiment, the spring 123 uses a 6-turn spring 123, or the spring 123 uses an 8-turn spring 123, so that the clamping force of the first clamping block 121 or the second clamping block 122 can be adjusted, so that the PCBA board 200 can obtain the required compression effect. In this embodiment, the spring 123 uses a 6-turn spring 123.

[0049] In an optional embodiment, the surfaces of the first clamping block 121 and the second clamping block 122 that are in contact with the PCBA board 200 are provided with a first inclined surface 126 and a second inclined surface 127. The first inclined surface 126 and the second inclined surface 127 can tightly press the PCBA board 200 and can partially occupy the width or length of the PCBA board 200, while avoiding the impact of manufacturing errors of the first clamping block 121 and the second clamping block 122 on the pressed PCBA board 200, so as to ensure that the first clamping block 121 and the second clamping block 122 always maintain a good pressing force on the PCBA board 200.

[0050] In an optional embodiment, a plurality of screws 167 are installed on the first clamping block 121 and the second clamping block 122. The screws 167 are arranged at both ends of the second rotating shaft 124, so that the installation of the first clamping block 121 and the second clamping block 122 is reliable and the second rotating shaft 124 is prevented from falling off.

[0051] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A tinning device for pre-tinning the solder pads of a PCBA board, characterized in that: include: A work platform, which is used to place the PCBA board; A mounting fixture is provided on the work platform and is located next to the PCBA board, and is used to fix the PCBA board; The tinning mechanism includes a fixed block, a first rotating shaft, and a steel mesh assembly; the fixed block is fixed to the work platform, and the steel mesh assembly and the fixed block are rotatably connected via the first rotating shaft, so that the steel mesh assembly can rotate relative to the work platform, so that the steel mesh assembly and the work platform can switch between a relatively overlapping state and a relatively separated state; The steel mesh assembly includes a connecting piece, a flip piece, a locking piece, and a steel mesh; one end of the connecting piece is connected to the fixed block, the flip piece is flippably connected to the connecting piece, the locking piece passes through the connecting piece and is connected to the flip piece, the steel mesh is arranged at one end of the flip piece and flips with the flip piece; a plurality of tin holes are closely spaced on the steel mesh; Among them, when the steel mesh assembly and the working platform are in a relatively overlapping state, the steel mesh assembly is located above the working platform, the steel mesh assembly is attached to the PCBA board, and the upper tin hole is opposite to the soldering pad.

2. The tinning device according to claim 1, characterized in that: The connecting member and the flip member are both provided with arc grooves, and a plurality of the arc grooves are provided on the peripheral side of the locking member.

3. The tinning device according to claim 1, characterized in that: The steel mesh is provided with a convex edge portion at its periphery, and the edge portion is provided with a micro groove, and the micro groove is aligned with the solder pad of the PCBA board.

4. The tinning device according to any one of claims 1 to 3, characterized in that: The mounting fixture includes a first clamping block, a second clamping block, a spring and a second rotating shaft. The first clamping block and the second clamping block are mounted on the work platform via the second rotating shaft. The plurality of springs are respectively installed between the first clamping block and the work platform, and the second clamping block and the work platform, so that the springs lift the first clamping block and the second clamping block so that the PCBA board can be clamped in two directions.

5. The tinning device according to claim 4, characterized in that: An extension portion is provided on one side of the first clamping block, and the extension portion extends to below the second clamping block.

6. The tinning device according to claim 4, characterized in that: The spring is a 6-turn spring, or an 8-turn spring, so that the clamping force of the first clamping block or the second clamping block can be adjusted.

7. The tinning device according to claim 4, characterized in that: The surfaces of the first clamping block and the second clamping block that are in contact with the PCBA board are provided with a first inclined surface and a second inclined surface.

8. The tinning device according to claim 4, characterized in that: A plurality of screws are installed on the first clamping block and the second clamping block, and the screws are arranged at both ends of the second rotating shaft.

9. A tinning method for a tinning device, used for the tinning device according to any one of claims 1 to 8, characterized in that: The tinning method comprises the following steps: Place the PCBA board on the workbench; The installation fixture clamps and fixes the PCBA board; Rotate the steel mesh assembly until the upper tin hole is aligned with the solder pad on the PCBA board; Tin is scraped on the upper tin holes of the steel mesh assembly, and the solder is deposited on the pads, completing the tinning of the pads on the PCBA board.

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