Flexible array substrate, manufacturing method thereof, and display device

Abstract

The present application provides a flexible array substrate, a manufacturing method thereof, and a display device, comprising a display area, a bending area, and a wiring area. The display area is connected to the wiring area via the bending area. The display area includes a display side and a back side opposite the display side. The bending area includes a bending inner side corresponding to the back side. The flexible array substrate further includes: a heat dissipation layer disposed on the back side of the display area, extending to a set length of the bending area near one end of the bending area; and a cover tape disposed on a side of the wiring area corresponding to the display side of the display area, adjacent to the bending area. The present application uses the heat dissipation layer and the cover tape to limit the front and rear ends of the bending area, thereby increasing the modulus at these ends so that the modulus at these ends is greater than the modulus of the middle portion of the bending area. This makes bending more likely to occur in the middle portion of the bending area, where the modulus is lower, during bending. This ensures that bending occurs only within the bending area, preventing the risk of fracture caused by bending of metal wiring outside the bending area, and improving the overall product yield.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a flexible array substrate, a manufacturing method thereof, and a display device. Background Art

[0002] With the development of flexible displays, mobile phones, tablets, and other display devices are gradually moving towards full-screen displays with narrow bezels. Currently, pad bending technology has gradually replaced COFBending technology and become the mainstream bending technology, as it can significantly shorten the bezel width of display panels. Pad bending technology requires cutting the display substrate into a special shape, removing the test area of ​​the display substrate, and bending the pad area to the back of the display substrate to achieve the purpose of reducing the bezel width.

[0003] In related technologies, pad bending primarily relies on a backing film (BF) to secure the display panel and ensure bending occurs within the bending zone. However, as requirements for display device weight and thickness increase, the thickness of the backing film (BF) hinders thinning of display devices. However, solutions that remove the backing film (BF) cannot accurately guarantee the location of the bend, increasing the risk of bending and fracture of metal traces outside the bending zone, leading to poor display performance and reduced product yield. Summary of the Invention

[0004] In view of this, the present application proposes a flexible array substrate, a manufacturing method thereof, and a display device to ensure that bending occurs in the bending area, prevent the metal traces outside the bending area from bending and causing the risk of breakage, and improve the overall product yield.

[0005] Based on the above objectives, the present application provides a flexible array substrate, comprising a display area, a bending area, and a routing area, wherein the display area is connected to the routing area via the bending area, the display area comprising a display side and a back side opposite to the display side, and the flexible array substrate further comprising:

[0006] a heat dissipation layer, disposed on the back side of the display area and extending from one end close to the bending area to a set length of the bending area;

[0007] a cover strip, provided on a side of the wiring area corresponding to the display side of the display area, and adjacent to the bending area;

[0008] The heat dissipation layer and the cover tape are configured to control the two ends of the bending position when the flexible array substrate is bent, so that the bending occurs in the bending area between the heat dissipation layer and the cover tape.

[0009] In some embodiments, the bending region includes a bending inner side corresponding to the back side, and the flexible array substrate further includes:

[0010] The curing glue is arranged on the inner side of the bend and is configured to cure the curing glue at the first end of the inner side of the bend close to the display area and the second end close to the routing area before the flexible array substrate is bent, so that when the flexible array substrate is bent, the modulus of the first end and the second end is greater than the modulus of the bending area between the first end and the second end.

[0011] In some embodiments, the curing adhesive is disposed on the first end and the second end inside the bend, and the curing adhesive is not disposed on the bend area.

[0012] In some embodiments, the curing glue covers the inner side of the bend, and the curing glue is configured to cure the curing glue located at the first end and the second end before the flexible array substrate is bent, and to cure the curing glue located in the bending area after the flexible array substrate is bent.

[0013] In some embodiments, the curing adhesive includes a first curing adhesive and a second curing adhesive; wherein the first curing adhesive is disposed at the first end and the second end, and the second curing adhesive is disposed at the bending area.

[0014] In some embodiments, the heat dissipation layer abuts against the curing adhesive at the first end located inside the bend.

[0015] In some embodiments, an orthographic projection of the cover tape on the inner side of the bend at least partially overlaps with the curing adhesive at the second end located on the inner side of the bend.

[0016] In some embodiments, the bending region includes a bent outer side corresponding to the display side; and the flexible array substrate further includes:

[0017] The photosensitive adhesive layer covers the outer side of the bend.

[0018] Based on the same concept, the present application also provides a method for manufacturing a flexible array substrate, comprising:

[0019] Extending the heat dissipation layer disposed on the back side of the display area of ​​the flexible array substrate so that one end thereof close to the bending area of ​​the flexible array substrate extends to a set length of the bending area;

[0020] A cover strip is provided on a side of the flexible array substrate corresponding to the display side of the wiring area and the display area, so that the cover strip is adjacent to the bending area; wherein the display side is opposite to the back side;

[0021] The flexible array substrate is bent to limit the bending position by the heat dissipation layer and the cover tape, so that the bending occurs in the bending area.

[0022] In some embodiments, before bending the flexible array substrate, the manufacturing method further includes:

[0023] Disposing the curing glue on the inner side of the bend of the flexible array substrate, wherein the inner side of the bend is the side of the bend area corresponding to the back side;

[0024] The curing glue at the first end of the inner side of the bend close to the display area and the second end close to the wiring area is cured according to the curing rule of the curing glue.

[0025] In some embodiments, after bending the flexible array substrate, the manufacturing method further includes:

[0026] When the curing glue is disposed in the bending region between the first end and the second end, the curing glue in the bending region is cured according to the curing rule of the curing glue.

[0027] In some embodiments, the curing adhesive includes a first curing adhesive and a second curing adhesive; wherein the first curing adhesive is disposed at the first end and the second end, and the second curing adhesive is disposed at the bending area.

[0028] Based on the same concept, the present application also provides a display device, comprising the flexible array substrate as described above; and a display panel arranged in a display area of ​​the flexible array substrate.

[0029] From the above description, it can be seen that the present application provides a flexible array substrate, a manufacturing method thereof, and a display device, including a display area, a bending area, and a routing area. The display area is connected to the routing area through the bending area. The display area includes a display side and a back side opposite to the display side. The bending area includes a bending inner side corresponding to the back side. The flexible array substrate also includes: a heat dissipation layer, which is arranged on the back side of the display area and extends to a set length of the bending area close to one end of the bending area; a covering tape, which is arranged on a side of the routing area corresponding to the display side of the display area and adjacent to the bending area; the heat dissipation layer and the covering tape are configured to control the two ends of the bending position when the flexible array substrate is bent, so that the bending occurs in the bending area between the heat dissipation layer and the covering tape. The present application limits the front and rear ends of the bending zone through a heat dissipation layer and a covering tape, thereby increasing the modulus at these two ends so that the modulus at these two ends is greater than the modulus in the middle part of the bending zone, thereby making bending more likely to occur in the middle part of the bending zone with a lower modulus, thereby ensuring that bending only occurs within the bending zone, preventing the metal traces outside the bending zone from bending and causing the risk of breakage, and improving the overall product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] Figure 1 This is a schematic structural diagram of the first flexible array substrate proposed in an embodiment of the present application before being bent;

[0032] Figure 2 This is a schematic structural diagram of the first flexible array substrate after bending proposed in an embodiment of the present application;

[0033] Figure 3 This is a schematic structural diagram of the second flexible array substrate proposed in an embodiment of the present application before being bent;

[0034] Figure 4 This is a schematic structural diagram of the second flexible array substrate after bending proposed in an embodiment of the present application;

[0035] Figure 5 This is a schematic structural diagram of the third flexible array substrate proposed in an embodiment of the present application before being bent;

[0036] Figure 6 This is a schematic structural diagram of the third flexible array substrate after bending proposed in an embodiment of the present application;

[0037] Figure 7 A schematic flow chart of a method for manufacturing a flexible array substrate proposed in an embodiment of the present application. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of this specification more clear, this specification is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0039] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should have the usual meanings understood by people with ordinary skills in the field to which this application belongs. The "first", "second" and similar words used in the embodiments of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements, objects or method steps that appear before the word cover the elements, objects or method steps listed after the word and their equivalents, without excluding other elements, objects or method steps. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0040] As mentioned in the background section, with the continuous development of the display industry, technological innovation has always been a direction of continuous exploration. The technological transition from LCD to OLED has achieved a shift from rigidity to flexibility, transcending the limits of full-screen and narrow-frame displays. Module structure also plays a crucial role in flexible displays, such as reducing the thickness of display screens. In currently commercialized module structures, the backing film (BF) not only protects the display panel but also plays a decisive role in the pad bending process, ensuring that bending occurs within the bending zone. The metal wires within the bending zone are specially designed to prevent breakage during the bending process; however, metal wires outside the bending zone are prone to breaking if bent. Therefore, it is necessary to ensure that bending occurs within the bending zone. Furthermore, the support of the backing film can accurately define the starting and ending points of the bend. However, with the increasing requirements for the weight and thickness of display devices, the technical solution of a backing film-free design can not only achieve a thinner display screen module, but also reduce the bending radius. However, the absence of a backing film (BF) and the coating of shadowless adhesive (UV adhesive, also known as photosensitive adhesive or UV-curable adhesive) on the front of the bend area increase the thickness and modulus of the bend area. Therefore, pad bending in the bend area is more difficult than in other uncoated areas. This increases the risk of metal traces outside the bend area breaking during bending, leading to display defects and reduced product yield.

[0041] In view of the above-mentioned actual situation, the embodiment of the present application proposes a flexible array substrate solution. The present application limits the front and rear ends of the bending zone through a heat dissipation layer and a cover tape, thereby increasing the modulus at these two ends, so that the modulus at these two ends is greater than the modulus of the middle part of the bending zone, thereby making it easier for bending to occur in the middle part of the bending zone with a lower modulus, thereby ensuring that bending only occurs within the bending zone, preventing the metal traces outside the bending zone from bending and causing the risk of breakage, and improving the overall product yield.

[0042] like Figure 1 FIG. 1 is a schematic diagram of the structure of the first flexible array substrate before bending according to an embodiment of the present application; FIG. Figure 2 , which is a schematic structural diagram of the first flexible array substrate after bending according to an embodiment of the present application.

[0043] like Figure 1 、 Figure 2 As shown, the flexible array substrate of the embodiment of the present application includes a display area 100, a bending area 200 and a wiring area 300. The display area 100 is connected to the wiring area 300 through the bending area 200. The display area 100 includes a display side 101 and a back side 102 opposite to the display side 101. The flexible array substrate further includes:

[0044] The heat dissipation layer 110 is disposed on the back side 102 of the display area 100 and extends from one end close to the bending area 200 to a predetermined length within the bending area 200;

[0045] a cover tape 310 , disposed on a side of the wiring area 300 corresponding to the display side 101 of the display area 100 , and adjacent to the bending area 200 ;

[0046] The heat dissipation layer 100 and the cover tape 310 are configured to control the two ends of the bending position when the flexible array substrate is bent, so that the bending occurs in the bending area between the heat dissipation layer 110 and the cover tape 310 .

[0047] In this embodiment, the flexible array substrate is generally used in equipment such as display devices, and its main part is used to carry display devices such as display panels, so that the part used to carry the display panel for display can be divided into a display area 100. Then, in order to control other components and transmit signals for display, a wiring area 300 (Pad area) is set next to the display area 100. In the Pad Bending process of the flexible array substrate, in order to further reduce the border width, a bending area 200 is set to bend the wiring area 300 to the bottom of the display area 100, so as to achieve a narrow border or even a borderless design. On the display area 100 of the flexible array substrate, it can generally be divided into a display side 101 and a back side 102 opposite to the display side 101, wherein the display side 101 is generally used to carry a display device, such as a display panel, etc. Then, in the bending area 200, it can be divided into a bending outer side 201 corresponding to the display side 101 and a bending inner side 202 corresponding to the back side 102, wherein, as Figure 1 As shown, corresponding means that the display side 101 and the bent outer side 201 are located on the same plane before bending, and the back side 102 and the bent inner side 202 are located on the same plane before bending.

[0048] Afterwards, in order to control the starting position of the bend, the heat dissipation layer 110 provided on the back side 102 of the display area 100 can be adjacent to the bend area 200, and one end thereof close to the bend area 200 can be extended to a set length in the bend area 200. The heat dissipation layer 110 can generally be a super clean foam (SCF) composite film, which can buffer the stress acting on the display panel and dissipate the heat generated when the display panel is working, thereby providing a certain protective effect on the display panel. Its size can generally correspond to the display area 100, so that its edge also extends to the edge of the bend area 200 (i.e., the first end of the inner side 202 of the bend), and in this embodiment, one end thereof is extended to a set length in the bend area 200. The set length here can be specifically set according to the specific application scenario, for example, the length extending into the bend area 200 is set to 10 to 500 μm. In this way, the modulus at the starting position of the bend area 200 is increased, making it higher than the modulus in the middle of the bend area 200. Since the greater the modulus, the more difficult it is to bend, the bending is more likely to occur at a location with a lower modulus, thereby increasing the probability of bending occurring in the middle of the bending zone 200 .

[0049] Correspondingly, to control the end position of the bend, a cover tape 310 can be provided on the side of the routing area 300 corresponding to the display side 101 of the display area 100, with the cover tape 310 positioned adjacent to the bend area 200. Cover tape 310, also known as cover tape, generally provides thermal conductivity and electromagnetic shielding, protecting the chip film and chip from electromagnetic interference. In a specific embodiment, it can protect the circuit assembly 320 from electromagnetic interference. Circuit assembly 320 can be a combination of a touchpad chip-on-film (COF) and a flexible printed circuit (FPC). Cover tape 310 then provides support for the routing area 300, preventing bending within the routing area 300. Furthermore, because cover tape 310 is adjacent to the end of the bend area 200, similar to heat dissipation layer 110, it can also increase the modulus of the end of the bend area 200, making it higher than the modulus of the middle portion of the bend area 200. Since a larger modulus makes bending more difficult, bending is more likely to occur at a location with a lower modulus. Thus, the moduli at the front and rear ends of the bending zone 200 are higher than the modulus in the middle of the bending zone 200, making bending more likely in the middle of the bending zone 200.

[0050] As can be seen from the above description, the present application provides a flexible array substrate, including a display area, a bending area and a routing area. The display area is connected to the routing area through the bending area. The display area includes a display side and a back side opposite to the display side. The bending area includes a bending inner side corresponding to the back side. The flexible array substrate also includes: a heat dissipation layer, which is arranged on the back side of the display area and extends to a set length of the bending area close to one end of the bending area; a covering tape, which is arranged on the side of the routing area corresponding to the display side of the display area and adjacent to the bending area; the heat dissipation layer and the covering tape are configured to control the two ends of the bending position when the flexible array substrate is bent, so that the bending occurs in the bending area between the heat dissipation layer and the covering tape. The present application limits the front and rear ends of the bending zone through a heat dissipation layer and a covering tape, thereby increasing the modulus at these two ends so that the modulus at these two ends is greater than the modulus in the middle part of the bending zone, thereby making bending more likely to occur in the middle part of the bending zone with a lower modulus, thereby ensuring that bending only occurs within the bending zone, preventing the metal traces outside the bending zone from bending and causing the risk of breakage, and improving the overall product yield.

[0051] In an optional embodiment, if Figure 3 and Figure 4 The second flexible array substrate is a schematic structural diagram before and after bending, wherein the bending region 200 includes a bending inner side 202 corresponding to the back side 102, and the flexible array substrate further includes:

[0052] The curing glue 210 is disposed on the inner side 202 of the bend and is configured to cure the curing glue 210 at the first end of the inner side 202 of the bend close to the display area 100 and the second end close to the routing area 300 before the flexible array substrate is bent, so that when the flexible array substrate is bent, the modulus of the first end and the second end is greater than the modulus of the bending area 203 between the first end and the second end.

[0053] In this embodiment, if Figure 3 and Figure 4 As shown, the flexible array substrate is provided with curing adhesive 210 on the inner side 202 of the bend. The initial state of the curing adhesive 210 can be fluid. When set conditions are met or the external environment reaches certain conditions, it will solidify, such as light curing, temperature curing, moisture curing, reaction curing, etc. In this embodiment, the curing adhesive 210 can be provided at any position on the inner side 202 of the bend. It can be provided only at the two ends of the inner side 202 of the bend, or it can evenly cover the entire inner side 202 of the bend. The position of the curing adhesive 210 on the inner side 202 of the bend can be adjusted according to the specific application scenario. It only needs to meet the requirement that the curing adhesive 210 at the two ends of the inner side 202 (the first end near the display area 100 and the second end near the wiring area 300) can be cured before bending. That is, the curing adhesive 210 is generally required to be provided near the two ends of the inner side 202 of the bend. Whether the curing adhesive 210 is provided at other positions on the inner side 202 of the bend can be adjusted according to the specific embodiment. Finally, since the curing adhesive 210 at both ends of the inner bend 202 is cured, the modulus at both ends of the inner bend 202 is increased overall. Since a greater modulus makes bending more difficult, bending is more likely to occur at locations with lower modulus. In this embodiment, the modulus at both ends of the inner bend 202 is increased, further increasing the modulus at both ends compared to the modulus of the bending region 203 between the two ends of the inner bend 202 (i.e., between the first and second ends), making bending more likely in the bending region 203.

[0054] In an optional embodiment, if Figure 3 and Figure 4 As shown, the curing adhesive 210 is disposed on the first end and the second end of the bent inner side 202 , and the curing adhesive 210 is not disposed on the bent area 203 .

[0055] In this embodiment, in order to save the use of curing glue 210 and reduce costs, curing glue 210 can be set only at the first end and the second end of the inner bend 202. At the same time, the type of curing glue 210 and the curing method can be any type, as long as the modulus of the first end and the second end of the inner bend 202 after curing is greater than the modulus of the middle part, that is, the bending area 203. The curing glue 210 is not set at the bending area 203 to reduce the modulus at the bending area 203.

[0056] In an optional embodiment, if Figure 5 and Figure 6 The third type of flexible array substrate is shown as a schematic structural diagram before and after bending, wherein the curing glue 210 covers the inner side 202 of the bend, and the curing glue 210 is configured to cure the curing glue 210 located at the first end and the second end before the flexible array substrate is bent, and to cure the curing glue 210 located at the bending area 203 after the flexible array substrate is bent.

[0057] In this embodiment, since the curing glue 210 is covered on the inner side 202 of the bend, the impact resistance of the entire bend area can be improved. Later, in order to meet the modulus requirements during bending, the curing glue 210 at the first end and the second end can generally be cured before bending. The curing glue 210 located in the bend area 203 can still be in a fluid state at this time, so that the modulus at the bend area 203 does not increase or increases slightly. Later, after the bending is completed, the curing glue 210 in the bend area 203 is cured again, thereby achieving the purpose of covering the curing glue 210 on the inner side 202 of the bend and improving the impact resistance of the entire bend area. In a specific embodiment, as Figure 5 As shown, taking the curing adhesive 210 as a photosensitive adhesive (UV adhesive) as an example, before bending, a shielding structure such as a baffle can be used to shield the curing adhesive 210 located in the bending area 203, and ultraviolet light can be used to cure the exposed curing adhesive 210 at the first and second ends. After the curing adhesive 210 at the first and second ends is completely cured, the modulus at the first and second ends of the inner side 202 of the bend increases sharply, thereby controlling the bending area. After the bending is completed, the curing adhesive 210 in the bending area 203 can be cured again to protect the bending area during subsequent use and improve the impact resistance of the bending area.

[0058] In an optional embodiment, if Figure 5 and Figure 6 As shown, the curing adhesive 210 includes a first curing adhesive 2101 and a second curing adhesive 2102 ; wherein the first curing adhesive 2101 is disposed at the first end and the second end, and the second curing adhesive 2102 is disposed at the bending region 203 .

[0059] In this embodiment, the curing adhesive 210 disposed at the first and second ends of the inner bend 202 can be two different curing adhesives than the curing adhesive 210 disposed in the bend region 203. First, the first curing adhesive 2101 can be disposed at the first and second ends of the inner bend 202 and cured. Then, the second curing adhesive 2102 can be disposed in the bend region 203 between the first and second ends. Bendment can then be performed. After bending is complete, the second curing adhesive 2102 can be cured according to the curing method of the second curing adhesive 2102. Compared to a solution in which a single curing adhesive 210 is disposed to cover the entire inner bend 202, this embodiment utilizes two curing adhesives, with different application times, increasing the number of curing adhesives and the number of application steps, thereby increasing the number of steps. However, this reduces the requirements for the curing adhesives, allowing users to select a curing adhesive that better meets their respective requirements. The first curing glue 2101 can be any glue as long as it meets the modulus requirement; the second curing glue 2102 can also be other glues other than UV curing, such as temperature curing, moisture curing, reactive glue, etc.

[0060] In an optional embodiment, if Figure 3 As shown, the heat dissipation layer 110 abuts against the curing adhesive 210 located at the first end of the bent inner side 202 .

[0061] In this embodiment, in order to better control the setting position of the curing glue 210 at the first end of the inner bend 202 and further increase the modulus at the starting position of the bending zone (i.e., the first end of the inner bend 202), the curing glue 210 located at this position can be placed against the heat dissipation layer 110. Since the heat dissipation layer 110 is equivalent to marking the first end of the inner bend 202, the setting position of the curing glue 210 at the first end of the inner bend 202 can be found by using the heat dissipation layer 110, thereby improving the setting accuracy and overall efficiency, while further increasing the probability of bending occurring in the bending zone 200 and improving the yield rate. Furthermore, in a specific embodiment, the heat dissipation layer 110 and the curing glue 210 set at the first end can be used to accurately control this end of the bending zone.

[0062] In an optional embodiment, if Figure 3 As shown, the orthographic projection of the cover tape 310 on the inner side 202 of the bend at least partially overlaps with the curing adhesive 210 located at the second end of the inner side 202 of the bend.

[0063] In this embodiment, because its projection on the plane of the inner bend 202 intersects or partially overlaps with the curing adhesive 210 at the second end of the inner bend 202, the curing adhesive 210 and the cover tape 310 there can be used together to control this end of the bend (i.e., the end of the bend). This improves placement accuracy and overall efficiency, while further increasing the probability of bending occurring within the bend 200 and improving yield.

[0064] In an optional embodiment, if Figure 1 As shown, the bending area 200 includes a bending outer side 201 corresponding to the display side 101; the flexible array substrate further includes:

[0065] The photosensitive adhesive layer 220 covers the bent outer side 201 .

[0066] In this embodiment, the outer side 201 of the bend region 200 may be covered with a photosensitive adhesive layer 220. Photosensitive adhesive, also known as shadowless adhesive, UV adhesive, or ultraviolet light-curing adhesive, is a type of adhesive that must be exposed to ultraviolet light to cure. In this embodiment, before bending, the photosensitive adhesive layer 220 may be in a fluid state and may not yet be cured. After bending, the photosensitive adhesive layer 220 may be cured using ultraviolet light, solidifying the bent region 200 and thereby improving the impact resistance of the outer side of the bend region 200.

[0067] Based on the same concept, the present application also provides a method for manufacturing a flexible array substrate, such as Figure 7 Shown, including:

[0068] Step 701 : Extend the heat dissipation layer disposed on the back side of the display area of ​​the flexible array substrate so that one end thereof close to the bending area of ​​the flexible array substrate extends to a set length of the bending area.

[0069] Step 702 : Disposing a cover tape on a side of the flexible array substrate corresponding to the display side of the wiring area and the display area, so that the cover tape is adjacent to the bending area; wherein the display side is opposite to the back side.

[0070] Step 703 : bend the flexible array substrate to define a bending position by the heat dissipation layer and the cover tape so that the bending occurs in the bending area.

[0071] The method of the above embodiment is applied to the manufacture of the corresponding flexible array substrate in the above embodiment. The specific contents and corresponding beneficial effects of the above steps have been described in the above embodiment of the flexible array substrate, so they will not be repeated in this embodiment.

[0072] In an optional embodiment, before bending the flexible array substrate, the manufacturing method further includes:

[0073] Disposing the curing glue on the inner side of the bend of the flexible array substrate, wherein the inner side of the bend is the side of the bend area corresponding to the back side;

[0074] The curing glue at the first end of the inner side of the bend close to the display area and the second end close to the wiring area is cured according to the curing rule of the curing glue.

[0075] In this embodiment, different curing glues have different corresponding curing rules. The curing rules of curing glue can be divided into light curing, temperature curing, moisture curing, reaction curing, etc. according to different conditions. After the curing glue is selected, the curing rule can be determined according to the type of curing glue. Afterwards, the curing glue at the first end and the second end inside the bend is cured according to the curing rule, so that the modulus of the first end and the second end can exceed the modulus of the bending area between the two ends after the curing glue is cured. Therefore, when bending is performed in the subsequent steps, it is easier to make the bending occur in the bending area with a relatively low modulus. In this way, while accurately controlling the bending area, the bending radius of the bending area can also be reduced, and after eliminating the backplane structure, the thickness of the overall device can be further reduced.

[0076] Afterwards, if Figure 3 and Figure 4 As shown, the flexible array substrate is bent, and the bending position is more likely to occur in the bending area with relatively low modulus due to the adjustment of the modulus. Figure 4 As shown, the wiring area is bent to the back side of the display area.

[0077] In an optional embodiment, after bending the flexible array substrate, the manufacturing method further includes:

[0078] When the curing glue is disposed in the bending region between the first end and the second end, the curing glue in the bending region is cured according to the curing rule of the curing glue.

[0079] In this embodiment, since curing adhesive can be applied anywhere on the inside of the bend, curing adhesive can also be applied within the bend region between the first and second ends, for example, covering the entire inside of the bend with curing adhesive. In this case, to avoid affecting the bend, the curing adhesive within the bend region is not applied during the curing of the curing adhesive at the first and second ends (after curing is complete, curing adhesive is applied to the bend region), or the applied curing adhesive does not participate in this curing process. Subsequently, after the bend is completed, the curing adhesive within the bend region is cured, with the curing rules determined by the type of curing adhesive within the bend region.

[0080] In an optional embodiment, the curing adhesive includes a first curing adhesive and a second curing adhesive; wherein the first curing adhesive is disposed at the first end and the second end, and the second curing adhesive is disposed at the bending area.

[0081] In this embodiment, similar to the previous embodiment, the curing adhesive applied to the first and second ends of the inner side of the bend can be different from the curing adhesive applied to the bend region. The first curing adhesive can be applied to the first and second ends of the inner side of the bend and cured. After the first curing adhesive is cured, the second curing adhesive can be applied to the bend region between the first and second ends before the bend is bent. After the bend is completed, the second curing adhesive can be cured according to the curing method of the second curing adhesive.

[0082] Based on the same concept, the present application also provides a display device, comprising the flexible array substrate as described in any of the aforementioned embodiments; and a display panel arranged in a display area of ​​the flexible array substrate.

[0083] The display device of the above embodiment is used to apply the corresponding flexible array substrate in the above embodiment, and has the beneficial effects of the embodiment of the corresponding flexible array substrate, which will not be described in detail here.

[0084] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. Within the scope of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0085] In addition, for simplicity of description and discussion, and in order not to make the embodiment of the application difficult to understand, the known power supply / ground connection with integrated circuit (IC) chip and other components may or may not be shown in the accompanying drawings provided. In addition, the device can be shown in the form of a block diagram to avoid making the embodiment of the application difficult to understand, and this also takes into account the following fact, that is, the details of the embodiment of these block diagram devices are highly dependent on the platform to be implemented in the embodiment of the application (that is, these details should be fully within the scope of understanding of those skilled in the art). When specific details (for example, circuit) are set forth to describe exemplary embodiments of the application, it will be apparent to those skilled in the art that the embodiment of the application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0086] Although the present invention has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those skilled in the art based on the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may utilize the embodiments discussed.

[0087] The embodiments of the present application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of this application.

Claims

1. A flexible array substrate, characterized in that: The flexible array substrate includes a display area, a bending area, and a wiring area, wherein the display area is connected to the wiring area through the bending area, the display area includes a display side and a back side opposite to the display side, and the flexible array substrate further includes: a heat dissipation layer, disposed on the back side of the display area and extending from one end close to the bending area to a set length of the bending area; a cover strip, provided on a side of the wiring area corresponding to the display side of the display area, and adjacent to the bending area; The heat dissipation layer and the cover tape are configured to control the two ends of the bending position when the flexible array substrate is bent, so that the bending occurs in the bending area between the heat dissipation layer and the cover tape; The bending region includes a bending inner side corresponding to the back side, and the flexible array substrate further includes: a curing adhesive disposed on the inner side of the bend and configured to cure the curing adhesive at a first end of the inner side of the bend near the display area and a second end near the routing area before the flexible array substrate is bent, so that when the flexible array substrate is bent, the modulus of the first end and the second end is greater than the modulus of the bend region between the first end and the second end; The curing glue covers the inner side of the bend, and the curing glue is configured to cure the curing glue located at the first end and the second end before the flexible array substrate is bent, and to cure the curing glue located in the bending area after the flexible array substrate is bent.

2. The flexible array substrate according to claim 1, wherein: The curing adhesive is disposed on the first end and the second end inside the bend, and the curing adhesive is not disposed on the bend area.

3. The flexible array substrate according to claim 1, wherein: The curing adhesive includes a first curing adhesive and a second curing adhesive; wherein the first curing adhesive is arranged at the first end and the second end, and the second curing adhesive is arranged at the bending area.

4. The flexible array substrate according to claim 1, wherein: The heat dissipation layer abuts against the curing adhesive at the first end located inside the bend.

5. The flexible array substrate according to claim 1, wherein: The orthographic projection of the cover tape on the inner side of the bend at least partially overlaps with the curing adhesive at the second end located on the inner side of the bend.

6. The flexible array substrate according to claim 1, wherein: The bending area includes a bending outer side corresponding to the display side; the flexible array substrate further includes: The photosensitive adhesive layer covers the outer side of the bend.

7. A method for manufacturing a flexible array substrate, characterized in that: include: Extending the heat dissipation layer disposed on the back side of the display area of ​​the flexible array substrate so that one end thereof close to the bending area of ​​the flexible array substrate extends to a set length of the bending area; A cover strip is provided on a side of the flexible array substrate corresponding to the display side of the wiring area and the display area, so that the cover strip is adjacent to the bending area; wherein the display side is opposite to the back side; Bending the flexible array substrate to define a bending position by the heat dissipation layer and the cover tape so that the bending occurs in the bending area; Before bending the flexible array substrate, the manufacturing method further includes: Disposing the curing glue on the inner side of the bend of the flexible array substrate, wherein the inner side of the bend is the side of the bend area corresponding to the back side; Curing the curing glue at the first end of the inner side of the bend close to the display area and the second end close to the wiring area according to the curing rules of the curing glue; After bending the flexible array substrate, the manufacturing method further includes: When the curing glue is provided in the bending region between the first end and the second end, the curing glue in the bending region is cured according to the curing rule of the curing glue.

8. The manufacturing method according to claim 7, characterized in that The curing adhesive includes a first curing adhesive and a second curing adhesive; wherein the first curing adhesive is arranged at the first end and the second end, and the second curing adhesive is arranged at the bending area.

9. A display device, characterized in that: include: The flexible array substrate according to any one of claims 1 to 6; and a display panel arranged in the display area of ​​the flexible array substrate.

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